KR20120081956A - Polishing pad for chemical mechanical polishing, preparation method of the same, and apparatus for cmp - Google Patents

Abstract

PURPOSE: A CMP polishing pad is provided to minimize phenomenon degrading transparence or forming protrusions, and to easily a detect polishing-finish point. CONSTITUTION: A CMP polishing pad comprises: a pad main body comprising a polymer resin; a transparent window comprising thermosetting or photocurable resin comprising one or more kinds from a group consisting of phenol resin, urea resin, melamine resin, epoxy resin, and polyester resin. A CMP apparatus comprises the CMP polishing pad, a rotatable platen, a supply part supplying polishing slurry to the polishing pad; and a head part accepting a wafer supposed to be polished on the pad.

Description

CPM polishing pad, manufacturing method thereof, and CPM device including the same {POLISHING PAD FOR CHEMICAL MECHANICAL POLISHING, PREPARATION METHOD OF THE SAME, AND APPARATUS FOR CMP}

The present invention relates to a CMP polishing pad, a method for manufacturing the same, and a CMP apparatus including the same, and more particularly, to reduce the transparency of the transparent window or to form protrusions during the polishing process, and to facilitate the polishing termination point. A CMP polishing pad detectable, a method of manufacturing the same, and a CMP apparatus including the same.

The Chemical Mechanical Polishing (CMP) method contacts a semiconductor pad with a polishing pad and provides a slurry composition comprising abrasive particles and various chemical components between the polishing pad of the polishing apparatus and the semiconductor substrate, thereby bringing the semiconductor pad into contact with the polishing pad. A method of chemically polishing the polishing target film by the action of the chemical component or the like while mechanically polishing the polishing target film on the substrate with the abrasive particles or the like.

In a typical CMP process, the wafer surface is polished while the wafer is mounted upside down on the carrier in the CMP machine and pushed down towards the polishing pad. The carrier and wafer are then rotated on a rotating polishing pad placed on a polishing table of the CMP apparatus. In the polishing of the wafer surface, a polishing pad having a transparent window is used to monitor the polishing state of the wafer surface.

Polyurethane has been mainly used as a material for the transparent window, and the solid polyurethane window not only has a high transparency but also is prone to scratches during the CMP process, and the light transmittance continues to decrease. In addition, since the solid polyurethane window has a slower wear rate than the rest of the polishing pad, there is a problem that can generate a polishing defect by forming a protrusion on the polishing pad.

In addition, the polyurethane transparent window is not only easy to install on the polishing pad, but may also cause many problems after installation. Previously, in order to install a polyurethane transparent window, a method of drilling a portion of the polishing pad body and inserting a transparent window into the area has been used, but according to this method, a slurry flows into a gap between the pad body and the transparent window, and the laser The removal rate was not easy because it prevented the clean transfer.

In addition, a method of manufacturing a polishing pad by placing a polyurethane transparent window in a mold and then cutting a resin mass obtained by injecting a resin for pad body manufacturing into the mold has been proposed. The problem of limit of transparency improvement could not be sufficiently solved.

Accordingly, there is a need for development of a transparent window material that can realize higher transparency, reduce transparency in the polishing process or minimize protrusion formation, and can be easily installed on the polishing pad.

The present invention is to provide a CMP polishing pad which can minimize the phenomenon that the transparency of the transparent window or the protrusion is formed during the polishing process, and can easily detect the polishing end point.

In addition, the present invention is to provide a method for producing the CMP polishing pad.

The present invention also provides a CMP apparatus comprising the CMP polishing pad.

The present invention provides a pad body comprising a polymer resin; And a thermosetting resin or a photocurable resin comprising at least one selected from the group consisting of phenol resins, urea resins, melamine resins, epoxy resins, and polyester resins, wherein the transparent window is formed on the pad body. Provide pads.

In addition, the present invention is a transparent window comprising a thermosetting resin or photocurable resin containing at least one selected from the group consisting of phenol resin, urea resin, melamine resin, epoxy resin and polyester resin in the pad body containing a polymer resin It provides a method for producing a CMP polishing pad comprising the step of installing.

The invention also, the CMP polishing pad; Rotatable platen; A supply unit supplying a polishing slurry on the polishing pad; And a polishing head portion for introducing a wafer to be polished on the pad.

Hereinafter, a CMP polishing pad, a manufacturing method of a CMP polishing pad, and a CMP apparatus according to a specific example of the present invention will be described in detail.

According to one embodiment of the invention, the pad body including a polymer resin; And a thermosetting resin or a photocurable resin comprising at least one selected from the group consisting of phenol resins, urea resins, melamine resins, epoxy resins, and polyester resins, wherein the transparent window is formed on the pad body. Pads may be provided.

The inventors of the present invention can realize a greatly improved light transmittance when using a photocurable resin or a specific thermosetting resin as a material of a transparent window applied to a CMP polishing pad, thereby easily detecting a polishing end point. In the polishing process, the transparency of the transparent window may be reduced or a phenomenon in which protrusions may be formed may be minimized through experiments, and the present invention was completed.

In particular, due to the material properties of the photocurable resin or the specific thermosetting resin on the transparent window, the light transmittance can be greatly improved, the detection of the polishing end point is easier, and the grinding window is higher than the pad body, so that the transparent window protrudes during polishing. It is possible to prevent development or excessive scratches on the transparent window surface. In addition, in the case of using the photocurable resin can be cured within a short time, when using the thermosetting resin can be easily cured even at low temperature conditions, when using the photocurable resin and / or thermosetting resin The transparent window can be easily inserted into the pad body or easily positioned inside the pad body.

Specifically, the transparent window may have a light transmittance of 90% or more, preferably 93% or more at one wavelength in the range of 200 to 1,000 nm, as the polymer resin includes the photocurable resin or the thermosetting resin. .

In addition, the polymer resin including the photocurable resin or the thermosetting resin included in the transparent window may have a higher hardness than the polymer resin included in the pad body, so that the transparent window exhibits higher grinding properties than the pad body. In the actual polishing process, the phenomenon in which the transparent window protrudes, the phenomenon in which excessive scratches occur on the surface of the transparent window, or the phenomenon in which the polishing target film is damaged due to the protruding transparent window may be prevented.

As shown in FIG. 1, the CMP polishing pad may include a pad body and a transparent window provided on the pad body.

The pad body may include a polymer resin known to be applicable to a CMP polishing pad without particular limitation, and specific examples thereof include polyurethane, polyacryl, polymethacryl, polycarbonate, nylon resin, polyester, and polyimide. , Poly aramid, polystyrene, polyvinyl alcohol, polyacrylamide, polyethylene oxide, maleic acid copolymer, methylcellulose, carboxymethyl cellulose, copolymers thereof, or mixtures thereof.

The pad body may be manufactured using the above-described polymer resins, and synthetic methods well known in the art may be used without any limitation in this manufacturing process. For example, when the pad body is made from a polyurethane-based compound, a prepolymer method or a one shot method may be used. According to the prepolymer method, a polyurethane-based resin is formed by reacting a polyol component and an isocyanate component to form a urethane pre-polymer, followed by curing by mixing the urethane pre-polymer, diamine or diol, a blowing agent, a catalyst, and the like. Can be formed. In the case of the one-shot method, a polyurethane-based resin can be formed by mixing a polyol component, an isocyanate component, a diamine or a diol, a blowing agent, a catalyst, and the like, followed by curing.

There is no particular limitation on the size and thickness of the pad body, and may be appropriately adjusted according to the size of the wafer to be polished, the polishing speed, the polishing conditions, and the like, and preferably a radius of 10 cm to 100 cm and a thickness of 0.1 to 5 mm. Can have

On the other hand, the transparent window may include a photocurable resin or a thermosetting resin.

Specific examples of the photocurable resins include epoxy acrylate resins, polyester acrylate resins, urethane acrylate resins, urethane methacrylate resins, silicone acrylate resins, alkyl acrylate resins, and mixtures thereof. Preferably urethane acrylate resin or urethane methacrylate resin is mentioned.

In addition, specific examples of the thermosetting resin may include a phenol resin, urea resin (urea resin), melamine resin, epoxy resin, polyester resin, or a mixture thereof, preferably an epoxy resin.

The photocurable resin and the thermosetting resin described above have transparent characteristics, and thus can provide a transparent window that can more effectively detect the polishing end point on the polishing pad. In addition, the transparent window manufactured using a polymer resin including a photocurable resin or a thermosetting resin may have excellent grindingability to prevent a phenomenon that the transparent window protrudes during polishing or excessive scratches on the surface of the transparent window.

On the other hand, as shown in Figure 2, the CMP polishing pad may further include a cushion layer bonded to the pad body by an adhesive portion. The cushion layer may include various polymer resins, but may preferably include polyurethane-based resins, polyethylene-based resins, natural rubber or synthetic rubber. In addition, the adhesive component known to be capable of adhering a polymer resin to the adhesive portion may be used without particular limitation. For example, the pad body and the cushioning layer may be a method such as adhesive, double-sided tape, heat fusion, or pressure-sensitive adhesive. Can be combined through.

On the other hand, according to another embodiment of the invention, the thermosetting resin or photocurable resin comprising at least one selected from the group consisting of phenol resin, urea resin, melamine resin, epoxy resin and polyester resin in the pad body containing a polymer resin CMP polishing pad manufacturing method comprising the step of installing a transparent window comprising a may be provided.

By using the photocurable resin or the thermosetting resin as a material of the transparent window, it is possible to form a transparent window on the pad body in various ways, it is possible to solve the problem caused by the installation of the transparent window of the polyurethane-based polymer. In addition, the CMP polishing pad manufactured by the manufacturing method may include a transparent window having an improved transmittance to easily detect an end point of polishing, and may minimize a phenomenon that the transparency of the transparent window is reduced or a protrusion is formed during the polishing process. Can be.

The step of installing a transparent window comprising the specific thermosetting resin or photocurable resin on the pad body comprising the polymer resin can be performed without any limitation on methods and apparatus known to be commonly used to install the transparent window on the polishing pad. Can be used.

For example, the step of installing the transparent window containing the specific thermosetting resin or the photocurable resin on the pad body containing the polymer resin may form a place ('transparent window mounting portion') in which the transparent window is installed on the pad body. And injecting and curing the specific thermosetting resin or photocurable resin therein, or the transparent window mounting part formed on the pad body with a transparent window obtained by curing the specific thermosetting resin or photocurable resin. It may include the step of fixing to, or comprising the step of injecting and curing the polymer resin for forming the pad body after fixing the transparent window obtained by curing the specific thermosetting resin or photocurable resin in a predetermined mold Can also be.

Specifically, the step of installing the transparent window on the pad body, forming a transparent window mounting portion on the pad body; Injecting a thermosetting resin containing at least one selected from the group consisting of a phenol resin, a urea resin, a melamine resin, an epoxy resin and a polyester resin or a polymer resin including a photocurable resin to the transparent window installation unit; And curing the injected polymer resin.

As the photocurable resin or the thermosetting resin is applied to the transparent window, in the method of manufacturing the CMP polishing pad, the liquid polymer composition is injected and cured in a specific area (transparent window installation) for installing the transparent window on the pad body. By using a simple process, the transparent window having the above-described characteristics can be easily positioned inside the pad body.

The pad body may be manufactured using the above-described polymer resins, and synthetic methods well known in the art may be used without any limitation in this manufacturing process. Preparing the pad body from the polyurethane-based compound, the content of the size and thickness of the pad body is as described above.

The forming of the transparent window mounting portion on the pad body may use any method and apparatus known to be commonly used to install the transparent window on the pad body without great limitation. Injecting and curing a polymer resin for forming a pad body into a mold having a shape capable of forming a window mounting portion, or a structure (eg, a hexahedron shaped block, etc.) capable of forming a transparent window mounting portion. Injecting and curing the polymer resin to form in the mold for producing the pad body and to form the pad body.

In the curing of the injected polymer resin, the wavelength and intensity of light applied according to the photocurable resin used may be appropriately adjusted, and the heating temperature and time applied according to the thermosetting resin used may be appropriately adjusted. The photocurable resin or thermosetting resin may include additives such as curing agents, crosslinking agents and the like which are commonly used.

In addition, the step of installing the transparent window on the pad body, as well as the step of injecting and curing the liquid polymer composition in the transparent window installation, as well as other limitations to the method used to form or install the previous polyurethane-based transparent window Can be used without

Accordingly, the step of installing the transparent window on the pad body, forming a transparent window mounting portion on the pad body; And fixing the cured transparent window to the transparent window installation unit. The above-mentioned CMP polishing pad can be manufactured by fixing the transparent window obtained by curing the specific thermosetting resin or photocurable resin to the transparent window mounting part formed in the pad body.

In the fixing of the cured transparent window, an adhesive or an adhesive tape or the like, which is commonly used to bond a photocurable resin or a thermosetting resin, may be used without particular limitation, and it may have high adhesion to the pad body. desirable.

Specifically, in order not to have a gap between the pad body and the transparent window, it is preferable to use a foam-type adhesive tape based on a foam sheet and having an adhesive layer on both sides. Specific examples of such foam sheet EPT # 120, EPT # 140, EPT # 310, EPT # 320 or EPT # 450 of Daiwa Spinning Co., etc.A specific example of the adhesive tape for forming the double-sided adhesive layer is an acrylic foam structural adhesive tape of Sumitomo 3M Corporation. Y-4950, Y-4930, Y-4630F, Y-4620, Y-4608, etc. are mentioned.

In addition, the step of installing the transparent window on the pad body, the step of placing the cured transparent window in the mold and injecting a polymer resin for the pad body into the mold to form a resin molding; And manufacturing a polishing pad in sheet form from the resin molding.

In the step of placing the cured transparent window in the mold and injecting the polymer resin for the pad body into the mold to form a resin molding, the method of manufacturing the resin molding for manufacturing the polishing pad, which has been used previously, may be used without any particular limitation. The transparent window may be manufactured from a polymer resin including a photocurable resin or a thermosetting resin, and may be appropriately adjusted in size or thickness in consideration of polishing conditions or light transmittance. The mold may be appropriately adjusted depending on the type of polishing pad to be produced.

In the manufacturing of the polishing pad in the form of a sheet from the resin molding, the resin molding separated from the mold may be sliced or cut to prepare a polishing pad having a desired size and thickness.

On the other hand, the manufacturing method of the CMP polishing pad may further comprise the step of forming a cushion layer on the pad body. The pad body on which the transparent window mounting portion is formed may further include a cushion layer for more firmly coupling the pad body and the transparent window, and the cushion layer may be coupled through the transparent window mounting pad and the adhesive portion. The cushion layer may include various polymer resins, but may preferably include polyurethane-based resins, polyethylene-based resins, natural rubber or synthetic rubber. In addition, the adhesive component known to be capable of adhering a polymer resin to the adhesive portion may be used without particular limitation. For example, the pad body and the cushioning layer may be a method such as adhesive, double-sided tape, heat fusion, or pressure-sensitive adhesive. Can be combined through.

On the other hand, according to another embodiment of the invention, the CMP polishing pad; Rotatable platen; A supply unit supplying a polishing slurry on the polishing pad; And a polishing head portion for introducing a wafer to be polished on the pad.

Such a CMP apparatus has a CMP polishing pad including a transparent window comprising a photocurable resin and / or a thermosetting resin, so that the end point of polishing can be easily detected. It is possible to minimize the phenomenon formed.

Accordingly, such a CMP device may further include a polishing endpoint detection device. The polishing endpoint detection device refers to a device capable of inspecting or monitoring a polishing process by analyzing light or other radiation reflected from the surface of the abrasive.

In addition, the CMP apparatus may further include a pad conditioner to remove residues generated by polishing the wafer and to maintain a constant state of the polishing pad.

According to the present invention, it is possible to minimize the phenomenon in which the transparency of the transparent window or the protrusion is formed during the polishing process, and the CMP polishing pad, a manufacturing method thereof, and a CMP apparatus including the same, which can easily detect the polishing end point. do.

1 is a simplified plan view of a polishing pad of one embodiment of the invention.
2 is a simplified side view of the polishing pad of one embodiment of the invention.

The invention is explained in more detail in the following examples. However, the following examples are illustrative of the present invention, and the present invention is not limited by the following examples.

< Example  And Comparative example : CMP  Manufacturing of Polishing Pads>

Example 1

(1) manufacture of transparent window

50 g of epoxy resin (YD-128: epoxy resin derived from bisphenol A, Kukdo Chemical Co., Ltd.) and 60.8 g of a curing agent (D-230: polyehtheramine, Kukdo Chemical) were mixed. * Height 10cm) and left for 2 hours at 80 ℃ to prepare a thermosetting resin block for the transparent window.

(2) Production of Resin Composition for Pad Body Production and CMP Polishing Pad

3297 g of a polyether urethane prepolymer (Adiprene L-325, Chemtura Co., Ltd.) and 749 g of a curing agent (MOCA: 3,3'-dichloro-4,4'-diaminodiphenylmethane) were mixed to prepare a resin composition for preparing a pad body.

Then, a thermosetting resin block for the transparent window obtained was placed in a cylindrical mold having a diameter of 60 cm and a height of 10 cm, and the resin composition for preparing the pad body was injected into the mold at all times. The mold was left at 65 ° C. for 15 minutes, and the resultant was cut to a thickness of 2 mm to prepare a CMP polishing pad.

Example 2

(1) Production of resin composition for pad body manufacture and CMP pad body

3297 g of a polyether urethane prepolymer (Adiprene L-325, Chemtura Co., Ltd.) and 749 g of a curing agent (MOCA: 3,3'-dichloro-4,4'-diaminodiphenylmethane) were mixed to prepare a resin composition for preparing a pad body.

In order to secure a space in which the transparent window is introduced, a block made of SUS (width 1.5 cm * length 4 cm * height 10 cm) is placed in a cylindrical mold (diameter 60 cm and height 10 cm), and the resin composition for preparing the pad body obtained above. After the injection into the mold, the mold was left at 65 ℃ for 15 minutes to prepare a body pad.

After removing the main body pad from the mold, the SUS block is removed from the main body pad, the main body pad is cut to a thickness of 2 mm, and then bonded and laminated with a cushioning layer using a transparent thin film double-sided adhesive tape to deposit the main body pad. Was prepared.

(2) introduction of transparent window

Inject 100 g of urethane acrylate resin (M-8F1: Aekyung Chemical) to form a transparent window so that the grooves are filled in the size of the transparent window in the polishing pad body, and then irradiate ultraviolet rays for 30 seconds in an amount of 1000 mJ / cm 2 using a UV lamp. After curing by curing, the transparent window was introduced onto the CMP polishing pad by removing the cushion layer and the double-sided adhesive tape of the transparent window mounting portion.

Comparative Example 1

(1) manufacture of transparent window

50 g of polyether urethane prepolymer (Adiprene L-325, Chemtura) and 60.8 g of curing agent (D-230: polyehtheramine, Kukdo Chemical) are mixed, and the mixture is injected into a mold (1.5 cm x 4 cm x 10 cm in height). And left at 80 ℃ 2 hours to prepare a thermosetting resin block for the transparent window.

(2) Production of Resin Composition for Pad Body Production and CMP Polishing Pad

3297 g of a polyether urethane prepolymer (Adiprene L-325, Chemtura Co., Ltd.) and 749 g of a curing agent (MOCA: 3,3'-dichloro-4,4'-diaminodiphenylmethane) were mixed to prepare a resin composition for preparing a pad body.

Then, a thermosetting resin block for the transparent window obtained was placed in a cylindrical mold having a diameter of 60 cm and a height of 10 cm, and the resin composition for preparing the pad body was injected into the mold at all times. The mold was left at 65 ° C. for 15 minutes, and the resultant was cut to a thickness of 2 mm to prepare a CMP polishing pad.

Reference Example

3297 g of a polyether urethane prepolymer (Adiprene L-325, Chemtura) and 749 g of a curing agent (MOCA: 3,3'-dichloro-4,4'-diaminodiphenylmethane) were mixed and injected into a cylindrical mold (60 cm in diameter and 10 cm in height). The mold was left at 65 ° C. for 15 minutes, and the resultant was cut to a thickness of 2 mm to prepare a CMP polishing pad.

< Experimental Example : CMP  Measurement of Properties of Polishing Pads>

Experimental Example 1 : Light transmittance  Measure

Transmittance was measured by passing a laser beam of 650 nm wavelength through the CMP pads of Examples and Comparative Examples using N & K (transmittance measuring instrument).

Experimental Example 2 : Save Modulus  And Tan  δ value measurement

Storage elastic modulus and Tan δ values of CMP pads of Examples and Comparative Examples were measured using a DMA (dynamic mechanical analyzer) of TA.

Experimental Example 3 : Hardness measurement

The hardness of the CMP pads of Examples and Comparative Examples was measured using a Shore D-type Shore D hardness meter (analog durometer, Zwick 3100) based on ASTM 2240. Specifically, the hardness value was recorded after 15 seconds and the initial hardness value obtained by lowering the weight using the hardness tester.

Experimental Example 4 : Wear index measurement

The hardness of the CMP pads of Examples and Comparative Examples was measured by using a TABER industry abrasion tester (Taber type abrasion tester). Specifically, the wear index was measured by measuring the weight lost by rotating the CMP pads of Examples and Comparative Examples under a given load (both weight 1 kg) by means of abrasion wheel H-18. It calculated | required by following General formula (1).

[General Formula]

Wear Index = (Wear Loss Weight (mg) / Test Rotation) * 1000

The results of Experimental Examples 1 to 4 are shown in Table 1 below.

Light transmittance (%) DMA data Hardness
Shore d Wear index Storage modulus
(40 ℃)
(Mpa) Tan δ
(40 ℃) Example 1 97 393 0.08 39 104 Example 2 94 430 0.073 41 111 Comparative Example 1 85 473 0.096 51 79 Reference Example - 451 0.11 49 83

As shown in Table 1, the CMP polishing pad of the embodiment includes a transparent window manufactured using a photocurable resin or a thermosetting resin, and thus may exhibit a transmittance of 93% or more and more easily detect the polishing end point. have.

In addition, since the CMP polishing pad of the example not only exhibits a low storage modulus and a low Tan δ value compared to the polishing pads of Reference Example and Comparative Example 1, but also has a low hardness and a high wear index, the transparent window has a higher grinding performance than the pad body. It is possible to prevent the phenomenon that the transparent window protrudes or excessive scratches on the surface of the transparent window during the actual polishing process.

On the contrary, the CMP polishing pad of Comparative Example 1 exhibits a light transmittance of only 85%, and thus, it is relatively difficult to confirm the polishing end point compared to the polishing pad of the example. In addition, the transparent window of Comparative Example 1 exhibits a higher hardness and a lower wear index than the pad body (reference example), so that the transparent window protrudes during the actual polishing process, excessive scratches occur on the surface of the transparent window, or because of the transparent window protruded. Problems such as damaging the membrane may occur.

Claims (13)

A pad body comprising a polymer resin; And
CMP polishing pad comprising a transparent window formed on the pad body, including a thermosetting resin or a photocurable resin comprising at least one selected from the group consisting of phenol resin, urea resin, melamine resin, epoxy resin and polyester resin .
The method of claim 1,
The transparent window is a CMP polishing pad having a transmittance of 90% or more at one wavelength in the range of 200 to 1,000nm.
The method of claim 1,
The CMP polishing pad having the above-mentioned photocurable resin or thermosetting resin having a higher hardness than the polymer resin contained in the pad body.
The method of claim 1,
The polymer resin included in the pad body is polyurethane, polyacryl, polymethacryl, polycarbonate, nylon resin, polyester, polyimide, poly aramid, polystyrene, polyvinyl alcohol, polyacrylamide, polyethylene oxide, male CMP polishing pad comprising at least one selected from the group consisting of acid copolymers, methyl cellulose, carboxymethyl cellulose and copolymers thereof.
The method of claim 1,
The photocurable resin is a CMP polishing pad including at least one selected from the group consisting of epoxy acrylate resin, polyester acrylate resin, urethane acrylate resin, urethane methacrylate resin, silicone acrylate resin and alkyl acrylate resin .
The method of claim 1,
CMP polishing pad further comprising a cushion layer bonded to the pad body by an adhesive portion.
Installing a transparent window comprising a thermosetting resin or a photocurable resin comprising at least one selected from the group consisting of a phenol resin, a urea resin, a melamine resin, an epoxy resin and a polyester resin on a pad body containing a polymer resin; CMP polishing pad manufacturing method comprising a.
The method of claim 7, wherein
Installing the transparent window on the pad body,
Forming a transparent window mounting portion on the pad body;
Injecting a thermosetting resin containing at least one selected from the group consisting of a phenol resin, a urea resin, a melamine resin, an epoxy resin and a polyester resin or a polymer resin including a photocurable resin to the transparent window installation unit; And
CMP polishing pad manufacturing method comprising the step of curing the injected polymer resin.
The method of claim 7, wherein
Installing the transparent window on the pad body,
Forming a transparent window mounting portion on the pad body; And
Method of manufacturing a CMP polishing pad comprising the step of fixing the cured transparent window to the transparent window installation.
The method of claim 7, wherein
Installing the transparent window on the pad body,
Placing a cured transparent window on a mold and injecting a polymer resin for a pad body into the mold to form a resin molding; And
Method of producing a CMP polishing pad comprising the step of manufacturing a polishing pad in the form of a sheet from the resin molding.
The method of claim 7, wherein
Method for producing a CMP polishing pad further comprising the step of forming a cushion layer on the pad body.
A CMP polishing pad of claim 1;
Rotatable platen;
A supply unit supplying a polishing slurry on the polishing pad; And
And a polishing head portion for introducing a wafer to be polished on the pad.
The method of claim 12,
And a polishing endpoint detection device.

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