KR20120070872A - Organic electro-luminescent device - Google Patents

Abstract

PURPOSE: An OLED(Organic Electroluminescent Device) is provided to prevent damage to an OLED panel by an impact from the outside by including a noise absorber on the side of a cover bottom. CONSTITUTION: An OLED(Organic Electroluminescent Device) panel(110) is composed of a first substrate(101) and a second substrate(102). The OLED panel is mounted on a cover bottom(120) and modulated. The cover bottom consists of a horizontal plane(121) and a side(123) adhering closely to a rear side of the OLED panel. A through hole(125) is formed on the side of the cover bottom. A noise absorber(130) surrounds inside and outside the side of the cover bottom.

Description

Organic electroluminescent device

The present invention relates to organic electroluminescent devices, and more particularly to the modularization of organic electroluminescent devices.

Until recently, cathode ray tubes (CRTs) were mainly used as display devices. However, in recent years, flat panel displays such as plasma display panels (PDPs), liquid crystal display devices (LCDs), and organic light emitting diodes (OLEDs), which can replace CRTs, have been widely used. The trend is being studied and used.

Among the flat panel display devices as described above, the organic light emitting display device (hereinafter referred to as OLED) is a self-light emitting device, and since the backlight used in the liquid crystal display device which is a non-light emitting device is not necessary, a light weight can be achieved.

In addition, the viewing angle and contrast ratio are superior to the liquid crystal display device, and it is advantageous in terms of power consumption. It is also possible to drive DC low voltage, has a fast response speed, and the internal components are solid, so it is strong against external shock and has a wide temperature range. It has advantages

On the other hand, the OLED panel of the OLED is composed of a substrate on which the light emitting element is formed and a container or a substrate for sealing the light emitting element. At this time, since the substrate of the OLED panel is mostly made of glass, there is a weak disadvantage to the impact.

In particular, as the size and thickness of a small portable device such as a mobile phone is gradually reduced in recent years, the thickness of the substrate of the OLED panel is also thin, and there is a problem in that the OLED panel is easily broken even with a small impact.

Therefore, the development of a module member that can effectively protect the OLED panel is required.

The present invention is to solve the above problems, it is an object to effectively protect the OLED panel from impact.

In order to achieve the above object, the present invention provides an OLED panel comprising a display surface for displaying an image and a rear surface opposite to the display surface; A cover bottom consisting of a horizontal surface in close contact with a rear surface of the OLED panel and a side surface covering an edge of the OLED panel; It provides an organic light emitting device comprising a shock absorbing member surrounding the inner and outer sides of the side of the cover bottom.

At this time, the shock absorbing member is a first member surrounding the inner side of the side and the second member surrounding the outer side of the side and the third member connecting the first member and the second member and surrounding the upper side of the side The side surface has a through hole formed therein, and the first member and the second member are connected to each other through the through hole.

The first member may be interposed between the edge of the OLED panel and the side surface of the cover bottom, and the shock absorbing member may include ABS (acrylonitrile butadiene styrene), PCABS (polycarbonate acrylonitrile butadiene styrene), PC (polycarbonate), and PP ( Polypropylene (PE), polyethylene (PE) and polystyrene (PS), poly-di methyl siloxane (PDMS), silicon rubber (silicon rubber), and one of the selected (polyurethane).

In addition, the shock absorbing member is provided with a plurality in the longitudinal direction of the side, the shock absorbing member is located close to the edge of the side of the cover bottom, the side without the shock absorbing member is the side Is hemmed and composed in duplicate.

The case is provided outside of the cover bottom, and the first member is interposed between the side of the case and the outer side of the cover bottom, and the OLED panel includes a driving and switching thin film transistor and an organic light emitting diode. And a first substrate and a second substrate facing the first substrate for encapsulation, wherein the first and second substrates are encapsulated and bonded through a sealing member.

As described above, according to the present invention, by further comprising a shock absorbing member on the side of the cover bottom of the OLED, there is an effect that can prevent the breakage of the OLED panel even if the impact is applied from the outside.

In addition, by forming a thin thickness of the side of the cover bottom and hemming the side without the shock absorbing member, the overall thickness of the cover bottom is prevented from being thickened and the rigidity of the cover bottom is prevented from being lowered. It can work.

1 is a perspective view schematically showing an OLED according to an embodiment of the present invention.
2 is a cross-sectional view schematically showing the OLED panel of FIG.
3 is a schematic cross-sectional view of a portion of FIG. 1 modularized;
4 is a schematic cross-sectional view of a portion of an OLED housed in a case;
5 is a perspective view schematically showing a cover bottom and a shock absorbing member according to another embodiment of the present invention.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings.

1 is a perspective view schematically showing an OLED according to an embodiment of the present invention, Figure 2 is a cross-sectional view schematically showing an OLED panel of FIG.

As shown, the OLED 100 is composed of an OLED panel 110 and a cover bottom 120 and the shock absorbing member 130.

First, referring to FIG. 2, which is a cross-sectional view of the OLED panel 110, the OLED panel 110 is formed of a driving and switching thin film transistor DTr (not shown) and an organic light emitting diode (E). A first substrate 101 and a second substrate 102 for encapsulation facing the first substrate 101, the first and second substrates 101 and 102 being spaced apart from each other, and an edge thereof The part is encapsulated and sealed through a sealing member 220.

In this case, a switching thin film transistor (not shown) and a driving thin film transistor DTr are formed in each pixel region P on the first substrate 101, and each driving thin film transistor DTr is formed. ) And an organic light emitting layer 113 positioned above the first electrode 111 and the first electrode 111 to emit light of a specific color, and a second electrode 115 positioned above the organic light emitting layer 113. An organic light emitting diode (E) consisting of) is formed.

The driving thin film transistor DTr includes a gate electrode 107, a semiconductor layer 103, and source and drain electrodes 119a and 119b. In this case, the driving thin film transistor DTr may be a top gate type including a polysilicon semiconductor layer, or may be formed as a bottom gate type made of pure silicon and impurities amorphous silicon.

Here, referring to the top gate type driving thin film transistor DTr as an example, the semiconductor layer 103 is made of polysilicon, and a central portion thereof has high concentrations on both sides of the active region 103a and the active region 103a. Source and drain regions 103b and 103c doped with impurities are formed, and a gate insulating film 105 is formed on the semiconductor layer 103.

The gate electrode 107 is formed on the gate insulating film 105 to correspond to the active region 103b of the semiconductor layer 103.

A first interlayer insulating film 109a is formed on the entire upper surface of the gate electrode 107, wherein the first interlayer insulating film 109a and the lower gate insulating film 105 are located on both sides of the active region 103a. And a semiconductor layer contact hole 116 exposing the drain regions 103b and 103c, respectively.

Next, the first interlayer insulating layer 109a including the semiconductor layer contact hole 116 is spaced apart from each other and contacts the source and drain regions 103b and 103c exposed through the semiconductor layer contact hole 116, respectively. Source and drain electrodes 119a and 119b are formed.

The second interlayer insulating film 109b is formed on the first interlayer insulating film 109a exposed between the source and drain electrodes 119a and 119b and the two electrodes 119a and 119b. A drain contact hole 117 exposing the drain electrode 119b is provided.

Although not shown in the drawing, the switching thin film transistor (not shown) has the same structure as the driving thin film transistor DTr and is connected to the driving thin film transistor DTr.

In addition, the first electrode 111 constituting the organic light emitting diode E, the organic light emitting layer 113, and the second electrode 115 are sequentially disposed in an area that substantially displays an image on the second interlayer insulating film 109b. It is formed.

The first and second electrodes 111 and 115 and the organic light emitting layer 113 formed therebetween form an organic light emitting diode (E).

Here, the first electrode 111 is formed for each pixel P, and a bank 118 is positioned in a non-pixel region (not shown) between the first electrodes 111 formed for each pixel P. .

That is, the bank 118 is formed in a matrix type with a lattice structure as a whole, so that the first electrode 111 is separated for each pixel region P using the bank 118 as a boundary for each pixel region P. FIG. It is formed into a structure.

The first electrode 111 is connected to the drain electrode 119b of the driving thin film transistor DTr through the drain contact hole 117 of the second interlayer insulating layer 109b.

Meanwhile, the OLED panel 110 is divided into a top emission type and a bottom emission type according to the transmission direction of the emitted light, wherein the light emitted from the organic light emitting layer 113 is formed. 1 In the case of a bottom emission type that transmits an image through the substrate 101, the first electrode 111 is indium-tin-oxide, which is a material that is transparent, has excellent conductivity, and has a relatively high work function value. (ITO), indium-zinc-oxide (IZO), and in the case of a top emission type for transmitting an image through the second substrate 102, the first electrode 111 has a reflectance. It can be formed of a metal material such as aluminum (Al) or aluminum alloy (AlNd), magnesium (Mg), gold (Au), silver (Ag) having a high, excellent conductivity, and a high work function.

In order to serve as a cathode, the second electrode 115 is formed by thickly depositing a transparent conductive material on a semi-transparent metal film in which a thin metal material having a relatively low work function is deposited.

That is, the second electrode 115 includes aluminum (Al), magnesium (Mg), lithium (Li), calcium (Ca), aluminum-lithium (Al-Li), magnesium-indium (Mg-In), magnesium-silver (Mg-Ag), aluminum-silver (Al-Ag), etc. can be used.

In addition, the organic light emitting layer 113 may be formed of a single layer made of a light emitting material, and in order to increase light emission efficiency, a hole injection layer, a hole transporting layer, and an emitting material layer It may be composed of multiple layers of an electron transporting layer and an electron injection layer.

Therefore, when a predetermined voltage is applied to the first electrode 111 and the second electrode 115 in accordance with the selected color signal, the OLED panel 110 injects electrons and second electrodes 115 injected from the first electrode 111. The applied hole is transferred to the organic light emitting layer 113 to form an exciton, and when the exciton transitions from the excited state to the ground state, light is generated and emitted in the form of visible light.

At this time, since the emitted light goes out, the OLED panel 110 implements an arbitrary image.

The second substrate 102 is positioned above the first substrate 101, and the edge portions of the first substrate 101 and the second substrate 102 are sealed and bonded to each other through the sealing member 220.

Through this, the OLED panel 110 is encapsulated.

The OLED panel 110 is mounted on the cover bottom 120 and modularized.

The cover bottom 120 is based on the assembly of the entire apparatus of the OLED 100. The cover bottom 120 has a horizontal surface 121 in close contact with the rear surface of the OLED panel 110 and a side of which the edge is vertically bent upwardly. It consists of 123.

Accordingly, the cover bottom 120 forms an accommodation space of the OLED panel 110 through the horizontal surface 121 and the side surface 123, and the rear surface of the OLED panel 110 corresponds to the horizontal surface 121 and the side surface 123. OLED panel 110 is accommodated so that the edge of the OLED panel 110 corresponds to.

In this case, the OLED panel 110 is attached to the horizontal surface 121 by an adhesive tape (not shown) or an adhesive (not shown) and modularized.

In particular, the OLED 100 of the present invention further includes a shock absorbing member 130 that absorbs the impact of the OLED panel 110, the shock absorbing member 130 is the inside of the side 123 of the cover bottom 120 It is configured to completely surround the outside.

The shock absorbing member 130 is composed of a plurality of spaced apart a predetermined interval along the side 123 of the cover bottom 120, the through hole 125 for assembling the shock absorbing member 130 on the side of the cover bottom 120 , See FIG. 3).

Therefore, the OLED panel 110 may prevent the breakage of the OLED panel 110 even when an impact is applied from the outside through the shock absorbing member 130. We will discuss this in more detail later.

Here, the cover bottom 120 may be referred to as a bottom cover or a bottom cover.

In addition, the OLED 100 of the present invention includes a fan or a heat pipe for dissipating high temperature heat generated from the OLED panel 110 to the outside of the cover bottom 120. The same heat dissipation member (not shown) may be configured.

Therefore, it is possible to solve the problem that the lifespan of the OLED panel 110 is abruptly reduced by the high temperature heat generated during the driving of the OLED panel 110 and the deterioration of the driving thin film transistor DTr.

As described above, the OLED 100 of the present invention further comprises a shock absorbing member 130 on the side surface 123 of the cover bottom 120 in the process of modularizing the OLED panel 110, the impact from the outside Even if applied, breakage of the OLED panel 110 can be prevented.

3 is a schematic cross-sectional view of a portion of FIG. 1 that is modularized.

As illustrated, the first substrate 101 and the second substrate 102 facing the first substrate 101 are disposed, and the first and second substrates 101 and 102 are spaced apart from each other to form an edge thereof. Encapsulated through the sealing member 220 of FIG. 2 and bonded to form the OLED panel 110.

At this time, the polarizing plate 140 is attached to the upper surface of the OLED panel 110, where the polarizing plate 140 has a disadvantage that the contrast is greatly reduced according to the intensity of the external light of the OLED panel 110, due to the external light It is provided in order to prevent the fall of contrast.

That is, the OLED panel 110 forms a polarizing plate 140 that blocks external light incident from the outside in the transmission direction of light emitted through the organic light emitting layer (113 of FIG. 2), thereby improving contrast.

The OLED panel 110 has a rear surface, and a cover bottom 120 formed of a horizontal surface 121 and a side surface 123 is positioned to be modularized by enclosing the rear surface and the edge of the OLED panel 110.

Here, the rear surface of the OLED panel 110 and the horizontal surface 121 of the cover bottom 120 are attached through an adhesive material 150 such as an adhesive tape or an adhesive.

In particular, the OLED 100 of the present invention is further provided with a shock absorbing member 130 surrounding the inner and outer sides of the side 123 of the cover bottom 120, the shock absorbing member 130 is a cover bottom 120 side ( The first member 130a surrounding the inner side of the 123 and the second member 130b surrounding the outer side of the side surface 123 of the cover bottom 120 are formed, and connect the first and second members 130a and 130b. The cover member 120 includes a third member 130c surrounding an upper portion of the side surface 123.

That is, the first member 130a of the shock absorbing member 130 is positioned between the side surface 123 of the cover bottom 120 and the edge of the OLED panel 110 by the shock absorbing member 130.

In addition, a through hole 125 for fixing the position of the shock absorbing member 130 is formed at the side surface 123 of the cover bottom 120. The shock absorbing member 130 includes the first member 130a and the second member. The member 130b has a structure connected to each other through the through hole 125.

The shock absorbing member 130 is a cushion capable of absorbing external shocks to protect the OLED panel 110. The shock absorbing member 130 is a plastic having high shock absorption, ABS (acrylonitrile butadiene styrene), and PCABS (polycarbonate acrylonitrile butadiene styrene). , PC (polycarbonate), PP (polypropylene), PE (polyethylene) and PS (polystyrene), PDMS (poly-di methyl siloxane), silicone rubber (silicon rubber), polyurethane (pol yurethane), etc. .

The shock absorbing member 130 may be formed by applying the above materials to the side surface 123 of the cover bottom 120 and curing the same, or the hardened shock absorbing member 130 may be formed with the first member 130a. After the second member 130b is bent to cover the inside and the outside of the cover bottom 120 side surface 123, the first member 130a and the second member 130b are formed through the through hole 125 of the cover bottom 120. It may also be formed to be connected to each other through).

The shock absorbing member 130 absorbs the shock even when an impact is applied from the outside to the OLED 100 by the shock absorbing member 130, thereby preventing the shock from being transmitted to the OLED panel 110.

Therefore, since the substrates 101 and 102 are made of glass, breakage of the OLED panel 110 which is weak to impact is prevented from occurring.

And, since the shock absorbing member 130 of the present invention is formed to surround the outer side of the side 123 of the cover bottom 120, the OLED 100 is used in a small portable device such as a mobile phone, Shock transmitted from the case 160 may also be mitigated.

That is, as shown in FIG. 4, the OLED panel 110 and the cover bottom 120 and the modular OLED 100 are accommodated in the case 160 of the portable device. The second member 130b of the shock absorbing member 130 surrounding the outer side of the cover bottom 120 side 123 between the inner side and the edge of the OLED 100, that is, the outer side 123 of the cover bottom 120. ) Will be intervened.

Therefore, even when an impact is applied from the outside of the case 160 of the portable device, the shock can be prevented from being absorbed by the shock absorbing member 130 and transmitted to the OLED 100, thereby to the OLED panel 110. Shock transmission is also prevented.

Therefore, the breakage of the OLED panel 110 is prevented from occurring.

In addition, the rear surface of the OLED panel 110 and the horizontal surface 121 of the cover bottom 120 are formed by forming an adhesive material such as an adhesive tape or an adhesive 150 as a cushioning material, thereby forming the OLED panel 110. The back of can also be protected by an impact from the outside.

On the other hand, the modular OLED 100 of the present invention is thickened by the shock absorbing member 130, so that the size and thickness of a small portable device such as a mobile phone is not satisfied to meet the demand that is gradually reduced.

5 is a perspective view schematically showing a cover bottom and a shock absorbing member according to another embodiment of the present invention.

As shown, the cover bottom 120 is composed of a horizontal surface 121 on which the OLED panel (110 in FIG. 4) is seated and a side surface 123 in which four edges of the horizontal surface 121 are vertically bent to a predetermined height. The shock absorbing member 130 is formed to surround the inside and the outside of the side surface 123 near the edge of the cover bottom 120.

That is, the shock absorbing member 130 is located close to the edge of the cover bottom 120 and the edge of the OLED panel (110 in FIG. 4), and the area close to the four corners of the OLED panel (110 in FIG. 4) from the impact. Protect it.

At this time, the thickness of the side 123 of the cover bottom 120 is formed to be thinner to have a thickness of about 1/2 or less than the thickness of the side 123 of the conventional cover bottom 120, the shock absorbing member 130 To prevent the thickness of the side 123 of the cover bottom 120 including a thick.

This prevents the overall thickness of the modular OLED (100 in FIG. 4) from becoming thick, corresponding to the size and thickness of a small portable device such as a mobile phone, which is recently required.

Here, the thickness of the side surface 123 of the cover bottom 120 may be reduced, so that the rigidity of the cover bottom 120 may be lowered. In this case, the cover bottom 120 of the present invention may include a shock absorbing member 130. The side surface 123, which is not formed, is bent to be completely folded to the outer surface, and is characterized in that the hemming process.

Hemming is the process of folding a sheet's ends and stacking it, which increases the product's stiffness, enhances its appearance, and eliminates sharp edges.

Therefore, the side surface 123 of the cover bottom 120 without the shock absorbing member 130 is configured to have a double sidewall through a hemming process, thereby improving the rigidity of the cover bottom 120.

That is, the cover bottom 120 of the present invention can prevent the overall thickness of the cover bottom 120 from being thick even though the shock absorbing member 130 is formed, and at the same time, the rigidity of the cover bottom 120 is also lowered. It can be prevented.

As described above, the OLED (100 of FIG. 4) of the present invention further includes an impact absorbing member 130 on the side surface 123 of the cover bottom 120, so that the OLED panel (FIG. 4 of FIG. The breakage of 110 can be prevented from occurring.

In addition, by forming a thin thickness of the side 123 of the cover bottom 120, and hemming the side surface 123 is not provided with the shock absorbing member 130, the overall thickness of the cover bottom 120 is thickened At the same time, it is possible to prevent the rigidity of the cover bottom 120 from being lowered.

The present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention.

100: OLED, 110: OLED panel (101: first substrate, 101: second substrate)
120: cover bottom (121: horizontal plane, 123: side, 125: through hole)
130: shock absorbing member (130a: first member, 130b: second member, 130c: third member)
140: polarizing plate, 150: adhesive material

Claims (10)

An OLED panel including a display surface for displaying an image and a rear surface opposite to the display surface;
A cover bottom consisting of a horizontal surface in close contact with a rear surface of the OLED panel and a side surface covering an edge of the OLED panel;
Shock absorbing member surrounding the inner and outer sides of the side of the cover bottom
Organic electroluminescent device comprising a.
The method of claim 1,
The shock absorbing member includes a first member surrounding the inner side of the side surface, a second member surrounding the outer side of the side surface, and a third member connecting the first member and the second member and surrounding the upper side of the side surface. Electroluminescent element.
The method of claim 2,
A through hole is formed at the side surface, and the first member and the second member are connected to each other through the through hole.
The method of claim 2,
The organic light emitting device of claim 1, wherein the first member is interposed between an edge of the OLED panel and a side surface of the cover bottom.
The method of claim 1,
The shock absorbing member is ABS (acrylonitrile butadiene styrene), PCABS (polycarbonate acrylonitrile butadiene styrene), PC (polycarbonate), PP (polypropylene), PE (polyethylene) and PS (polystyrene), PDMS (poly-di methyl siloxane), silicone An organic electroluminescent device comprising one selected from rubber (silicon rubber) and polyurethane (pol yurethane).
The method of claim 1,
The shock absorbing member is provided with a plurality of organic light emitting device along the longitudinal direction of the side.
The method of claim 1,
The shock absorbing member is an organic light emitting device positioned close to the edge of the side of the cover bottom.
The method of claim 7, wherein
The side surface of which the shock absorbing member is not formed is hemmed, and the organic light emitting device is configured as a double.
The method of claim 2,
The case is provided to the outside of the cover bottom, the organic light emitting device is the first member is interposed between the side of the case and the outer side of the cover bottom.
The method of claim 1,
The OLED panel includes a first substrate on which a driving and switching thin film transistor and an organic light emitting diode are formed, and a second substrate facing the first substrate for encapsulation, wherein the first and second substrates include a sealing member. The organic light emitting device is encapsulated and bonded through.

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