KR20120064306A - Apparatus and method for joining tapes used in semiconductor packaging process - Google Patents

Abstract

PURPOSE: An apparatus and a method for joining tapes used in a semiconductor packaging process are provided to prevent defects by enhancing the accuracy of a process of matching transfer holes. CONSTITUTION: A first junction member is attached to one end of a first tape(410). A second junction member is attached to one end of a second tape(420). The second junction member is bonded with the first junction member at one end of the second tape by magnetic force. The second tape is connected to the first tape. At least one of the first junction member and the second junction member is made out of a magnet.

Description

Bonding apparatus and joining method for joining tapes used in semiconductor chip packaging process {Apparatus and Method for joining Tapes used in Semiconductor Packaging Process}

The present invention relates to a bonding apparatus and a bonding method for joining the tapes used in the semiconductor chip packaging process, and more particularly, to continuously supply the carrier tape by bonding the other tape to its end when the tape wound on the reel is exhausted. The present invention relates to a tape bonding apparatus and a bonding method for enabling this.

Semiconductor chips fabricated on wafers are mass-produced as individual chip products through separate packaging processes. The packaging process is through Dicing (wafer cutting)-ILB (heat bonding of inner lead to chip)-POT (resin sealing of chip)-Marking (process of writing serial number on chip) The fabricated chip is inspected through a final test (FT) process and a visual inspection (VI) process. In this packaging process, the chip cut by the dicing process is mounted on a carrier tape serving as a substrate, and from the ILB process, the chip is transferred while the chip is continuously mounted on the tape.

In order to perform such a packaging process, it is necessary to continuously supply the tape to a packaging facility while being wound on a reel. However, since the tape wound on the reel has a finite length, when all the tape wound on one reel (hereinafter referred to as 'first tape') is used, the tape wound on another reel (hereinafter referred to as 'second tape') Should be additionally supplied. At this time, the end portion of the first tape and the tip portion of the second tape are joined to the continuity of the process so that the tape is continuously supplied to the packaging equipment without any interruption.

By the way, the current method of bonding between tapes simply uses a method of adhesion using an adhesive, which causes many disadvantages in the work. That is, as shown in FIG. 1, the present invention relies on the manual work of bonding by adhering the adhesive adhesive tape 30 between the distal end of the first tape 10 and the distal end of the second tape 20. There is a disadvantage in that a lot of time is required for the connection between the tapes 10 and 20.

In addition, the connection method using the adhesive tape 30 by manual operation has a disadvantage in that there is a risk of malfunction in the packaging process when the joint position between the two tapes 10 and 20 is not precisely adjusted. That is, the packaging tapes 10 and 20 are formed with transfer holes 11 and 21 for transferring the tapes 10 and 20 to transfer the tapes 10 and 20 using sprockets having toothed projections. In order to prevent malfunctions in the operation and to ensure smooth transfer, and in order to align the transferred semiconductor chips, the transfer hole 11 of the first tape 10 and the transfer hole 21 of the second tape 20 are They must be joined to match exactly. However, in the conventional method of joining by hand and by adhesive tape, the exact match between the transfer holes 11 and 21 may depend on the skill of the operator, and thus may not correspond to the required match.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to improve productivity by enabling fast and accurate bonding between tapes used as carriers in a semiconductor chip packaging process, and to improve the productivity between tapes. It is to increase the accuracy of the operation to match the transfer holes formed in the tape during bonding to prevent malfunction and defects in the packaging process.

According to one aspect of the invention, there is provided a tape to be used as a carrier in the semiconductor chip packaging process, characterized in that a magnet for adhering to the other tape is mounted on at least one of both ends.

According to another aspect of the invention, the first tape is attached to the first bonding member at one end; And a second tape attached to one end of the first joining member and a second joining member joined to the first tape by a magnetic force, wherein the second joining member is connected to the first tape. At least one of the first joining member and the second joining member includes: A tape is provided, characterized in that one consists of a magnet.

According to another aspect of the present invention, a tape bonding apparatus for bonding tapes used as carriers of the semiconductor chip in a semiconductor chip packaging process, the first bonding member to be attached to the first tape is placed, the first bonding member is A lower plate on which one end of the first tape is placed on the first position and one end of the second tape is placed on the first tape; And an upper plate having a second bonding member to be attached to the second tape, the upper plate being movable between a position spaced apart from the lower plate and a position on the lower plate; And moving means for joining the first tape and the second tape by moving the second joining member provided on the upper plate downward to join the first joining member. At least one of the second joining members is composed of a magnet, and the first joining member and the second joining member are provided with a tape bonding apparatus, characterized in that the mutual joining by magnetic force.

Here, the moving means is disposed on the side of the receiving hole formed to penetrate the upper plate in the vertical direction, the engaging portion for preventing the second joining member accommodated in the receiving hole is separated from the lower portion of the receiving hole; And a pressurizing member configured to press the second joining member disposed to be caught by the catching part in the receiving hole to downwardly move downward against the catching part.

The locking portion may include a locking protrusion having an inclined surface to be introduced into the side surface of the accommodation hole by the downward movement force of the second bonding member when the second bonding member moves downward by the pressing member; And a spring that exerts an outward elastic force on the engaging protrusion at the inner side of the receiving hole.

A plurality of fixing pins are formed on the lower plate, and a fixing groove is formed on the upper plate to engage the fixing pins. In this case, the fixing pin has a size and spacing corresponding to the size and spacing of the transport hole so that the transport hole formed in the first tape and the second tape can be inserted into the fixing pin.

According to a preferred embodiment of the present invention, the lower plate is fixed, so that the upper plate is hinged to one side end of the upper plate to be moved between the position placed on the lower plate and the position spaced apart by the rotational movement from the lower plate Is provided.

According to another aspect of the invention, in the tape bonding method for bonding the tapes used as carriers of the semiconductor chip in the semiconductor chip packaging process, the first tape on the lower plate on which the first bonding member to be attached to the first tape is placed Placing one end of the; Disposing a second tape on the lower plate on which the first tape is placed; Moving an upper plate provided with a second joining member on the lower plate on which the first tape and the second tape are disposed; And joining the first joining member and the second joining member by pressing the second joining member to move downward to press the second joining member, wherein at least one of the first joining member and the second joining member is a magnet. The tape joining method is provided, wherein the first joining member and the second joining member are joined to each other by magnetic force.

According to the present invention, it is possible to improve the productivity by fast and accurate bonding between tapes used as carriers in semiconductor chip packaging process, and also to improve the accuracy of the operation of matching the transfer holes formed in the tape during the bonding between the tapes. It is possible to prevent malfunctions and defects in the packaging process.

1 is a view showing a bonding state between conventional tapes.
Figure 2 is a perspective view of the tape bonding apparatus according to the present invention.
3 is a side cross-sectional view of FIG. 2;
4 and 5 are diagrams for explaining the operating state of FIG.
FIG. 6 is a view showing a state in which the tape bonding apparatus shown in FIGS. 2 and 3 is mounted on a frame.
7 to 10 are views sequentially showing the process of bonding the tape by the tape bonding apparatus shown in FIG.
11 is a view showing an example of a method of mounting a magnet in the tape bonding apparatus of FIG.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

2 is a perspective view of the tape bonding apparatus according to the present invention, Figure 3 is a side cross-sectional view of FIG. Tape bonding apparatus according to the present invention is largely composed of the lower plate 100 and the upper plate (200).

The lower plate 100 has a receiving groove 120 formed at a central portion thereof, and the receiving groove 120 is accommodated with a thin plate-shaped first magnet 110. The first inlet groove 180 is formed in the upper side region of the accommodating groove 120, and the first catching protrusion 130 is accommodated in the first inlet groove 180. The first retracting groove 180 is provided with a first spring (not shown) that exerts an outward elastic force toward the inner space of the receiving groove 120 with respect to the first locking projection 130, and by this first spring The first catching protrusion 130 maintains a protruding state toward the inner space of the receiving groove 120. In this case, a separate stopping structure is provided in the first inlet groove 180 so that the first catching protrusion 130 is not separated. The first catching protrusion 130 is formed on an inclined surface thereof, and when the first magnet 110 accommodated in the accommodating groove 120 is moved upward, the first catching protrusion 130 is an internal space of the first inlet groove 180. Is moved so that the first magnet 110 can be separated upward. A fixing pin 140 is formed on an upper surface of the lower plate 100, and the fixing pin 140 is disposed at a size and an interval corresponding to the transfer hole of the first tape as described below.

The upper plate 200 basically has a structure similar to the lower plate 100. That is, the upper plate 200 has a receiving hole 220 is formed in the center portion, the receiving hole 220 is accommodated in the thin plate-like second magnet 210. At this time, unlike the lower plate 100, the receiving hole 220 of the upper plate 200 is formed to penetrate the upper plate 200 in the vertical direction. The second inlet groove 280 is formed in the lower side region of the receiving hole 220, and the second locking protrusion 230 is accommodated in the second inlet groove 280. A second spring (not shown) is provided in the twelfth recess 280 to apply an outward elastic force toward the inner space of the accommodation hole 220 with respect to the second engaging protrusion 230. The two catching protrusions 230 maintain the protruding state toward the inner space of the receiving hole 220. In this case, a separate stopping structure is provided in the second inlet groove 280 so that the second catching protrusion 230 is not separated. The second catching protrusion 230 is formed on an inclined surface thereof, and when the second magnet 210 accommodated in the receiving hole 220 is moved downward, the second catching protrusion 230 is applied to the elastic force of the spring by the downward movement force. The resistance is moved to the inner space of the second inlet groove 280, so that the second magnet 210 can be separated downward. A fixing groove 240 corresponding to the fixing pin 140 of the lower plate 100 is formed on the lower surface of the upper plate 200. The fixing groove 240 is disposed at a size and an interval corresponding to the transfer hole of the second tape as will be described later.

The upper plate 200 is provided with a moving means for moving the second magnet 210 accommodated in the receiving hole 220 downward. The moving means applies an outward elastic force to the second catching protrusion 230 and the second catching protrusion 230 to prevent the pressing member 250 and the spring 260, and the separation of the second magnet 210 as described above. And a spring (not shown).

The pressing member 250 is disposed on the upper portion of the second magnet 210, and when a downward external force is applied by a worker's manual work, the pressing member 250 applies a downward force to the second magnet 210. The spring 260 applies an elastic force that resists the downward force of the pressing member 250, thereby restoring the position of the pressing member 250 to a state in which the pressure member 250 is moved upward when the operator releases the external force on the pressing member 250. do.

As such, when the second magnet 210 moves downward by the pressing member 250, the second locking protrusion 230 is formed on the inclined surface, so the second locking protrusion 230 is the second inlet groove 280. Resistant to the elastic force of the spring installed in the inner side is drawn into the second inlet groove (280). Accordingly, in the normal state, as shown in FIG. 4, the second magnet 210 is caught by the second locking protrusion 230, thereby preventing it from being separated below the receiving hole 220, and at the same time, the pressing member 250. Only when pressing the second magnet 210 as shown in Figure 5 is to be separated below the receiving hole 220.

The first magnets 110 and the second magnets 210 are arranged in a polarity in a direction in which mutual attraction acts. Accordingly, in the state in which the second magnet 210 is moved downward as shown in FIG. 5, the first magnet 110 is moved upward by the magnetic force, and the first locking protrusion 130 is first moved by the upwardly moving force. Resistant to the elastic force of the spring (not shown) disposed in the inlet groove 180 is moved into the first inlet groove 180. As a result, the first magnet 110 is movable upward and is separated from the receiving groove 120 to be joined to the second magnet 210.

6 is a view showing a state in which a tape bonding apparatus having such a configuration is mounted on a frame.

The frame 300 is a device to which the lower plate 100 and the upper plate 200 are attached. The lower plate 100 is fixed to one side lower side of the frame 300, and the upper plate is one side above the frame 300. The end is hinged to be rotatable. Accordingly, the upper plate 200 may be moved between a position placed on the lower plate 100 and a position (position shown by dashed lines) spaced apart from the lower plate 100 by rotating. In FIG. 6, the top plate 200 is spaced apart from the bottom plate 100 at a position where the top plate 200 is placed on the bottom plate 100 for convenience of illustration, but the top plate 200 is actually rotated to the left side so that the top plate 200 is lowered. In the state placed on the (100), the lower plate 100 and the upper plate 200 is configured to be in surface contact with each other.)

Hereinafter, a tape bonding process by the tape bonding apparatus according to the present invention having the configuration as described above with reference to FIGS. 7 to 10 will be described.

First, in a state in which the first magnet 110 is mounted on the lower plate 100 and the second magnet 210 is mounted on the upper plate 200, as shown in FIG. 7, the distal end of the first tape 410 is lower plated. It is disposed on the (100) and the distal end of the second tape 420 is disposed on the first tape (410). At this time, the transfer holes 411 and 421 of the first tape 410 is disposed so that the transfer hole 421 is inserted into the fixing pin 140 so that the positions of the transfer holes 411 and 421 are naturally formed. Matches.

Then, as illustrated in FIG. 8, the upper plate 200 is rotated about the frame 300 so that the upper plate 200 is disposed on the lower plate 100 on which the first tape 410 and the second tape 420 are disposed. 200). Accordingly, the upper plate 200 and the lower plate 100 is in a state as shown in FIG. 4. At this time, the fixing groove 240 of the upper plate 200 is inserted into the fixing pin 140 of the lower plate 100 are coupled to each other.

In this state, when the pressing member 250 is pressed downward as shown in FIG. 9, the second magnet 210 moves downward to be in a state as shown in FIG. 5, and accordingly, the first magnet 110 as described above. By moving upward by this magnetic force, the first magnet 110 and the second magnet 210 are bonded to each other with the first tape 410 and the second tape 420 interposed therebetween. As a result, the first tape 410 and the second tape 420 are in a state as shown in FIG. Referring to FIG. 10, it can be seen that the final result is that the first tape 410 and the second tape 420 are bonded to each other by the first magnet 110 and the second magnet 210. At this time, the positions of the transfer holes 411 and 421 are also aligned by the fixing pin 140 and the fixing groove 240 so as to exactly match the position.

On the other hand, Figure 11 is a view showing an example of a method for mounting a magnet in the tape bonding apparatus of FIG. Before the tape bonding operation, the first magnet 110 and the second magnet 210 should be installed in the receiving groove 120 and the receiving hole 220, respectively. It can be installed in a way. In order to enable such side entry, the lower plate 100 and the upper plate 200 should be formed with a passage allowing side entry into the accommodation groove 120 and the accommodation hole 220, respectively.

Meanwhile, in the description of the above-described embodiment, an example in which both the first magnet 110 and the second magnet 210 are formed of magnets has been described. However, in order to bond to each other by magnetic force, only one may be composed of a magnet, and the other may be composed of a metal member joined by a magnetic force of the magnet. Therefore, any one of the components designated as the first magnet 110 and the second magnet 210 in the above embodiment may be composed of a metal plate. In the claims of the present invention, in consideration of this point, the first magnet 110 and the second magnet 210 have been described as names of the first bonding member and the second bonding member, respectively.

Meanwhile, in the above-described embodiment, the structure in which the locking protrusion 130 is formed in the lower plate 100 is illustrated, but the locking protrusion 130 of the lower plate 100 may be omitted.

On the other hand, the present invention has proposed a concept of bonding the two tapes to be bonded by using a magnet, for this purpose from the time of manufacturing the tape itself to make the magnet is bonded to at least one of both ends of the tape is manufactured It is also possible. In this case, it is also possible to mount magnets at both ends, or to mount magnets at one end and metal pieces at the other end.

According to the present invention as described above, there is an advantage that the bonding operation can be faster than the method of bonding both by using a gluing tape when bonding between the tapes. In addition, since the alignment of the transfer hole is made to be purified during the bonding between the tapes, there is an advantage that can prevent malfunction and defects in the subsequent packaging process.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

Claims (9)

In the tape used as a carrier of the semiconductor chip in the semiconductor chip packaging process,
At least one of the two ends of the tape, characterized in that the magnet for bonding with the other tape.
In the tape used as a carrier of the semiconductor chip in the semiconductor chip packaging process,
A first tape having a first joining member attached to one end thereof; And
And a second tape attached to one end thereof, the second bonding member being attached to the first bonding member by a magnetic force and connected to the first tape.
At least one of the first joining member and the second joining member is a tape, characterized in that composed of a magnet.
A tape bonding apparatus for bonding tapes used as carriers of a semiconductor chip in a semiconductor chip packaging process.
A lower plate on which a first joining member to be attached to the first tape is placed, one end of the first tape being placed on the position where the first joining member is placed, and one end of the second tape on the first tape; And
A top plate having a second joining member to be attached to the second tape, the top plate being movable between a position spaced from the bottom plate and a position placed on the bottom plate; And
And moving means for joining the first tape and the second tape by moving the second joining member provided on the upper plate downward and joining the first joining member.
At least one of the first joining member and the second joining member is formed of a magnet, wherein the first joining member and the second joining member are joined to each other by magnetic force.
The method of claim 3, wherein
Wherein,
It is disposed on the side of the receiving hole formed to penetrate the upper plate in the vertical direction, the engaging portion for preventing the second joining member accommodated in the receiving hole is separated from the lower portion of the receiving hole; And
A pressurizing member configured to press the second joining member arranged to be caught by the catching part in the receiving hole to downwardly move downward against the catching part;
Tape bonding apparatus comprising a.
The method of claim 3, wherein
The locking portion may include a locking protrusion having an inclined surface to be introduced into the side surface of the receiving hole by the downward movement force of the second bonding member when the second bonding member moves downward by the pressing member; And
A spring that exerts an outward elastic force on the engaging projection inside the side surface of the receiving hole;
Tape bonding apparatus comprising a.
6. The method according to any one of claims 3 to 5,
The lower plate is formed with a plurality of fixing pins, the upper plate is a tape bonding apparatus characterized in that the fixing groove is formed to engage the fixing pins.
The method according to claim 6,
The fixing pin, the tape bonding apparatus characterized in that it has a size and spacing corresponding to the size and spacing of the transport hole so that the transport hole formed in the first tape and the second tape can be inserted into the fixing pin.
6. The method according to any one of claims 3 to 5,
The lower plate is fixed, the frame is hinged to one end of the upper plate so that the upper plate is moved between the position placed on the lower plate and the position spaced apart by the rotational movement from the lower plate; Tape Splicer.
In the tape bonding method for bonding the tapes used as carriers of the semiconductor chip in the semiconductor chip packaging process,
Disposing one end of the first tape on a lower plate on which the first joining member to be attached to the first tape is placed;
Disposing a second tape on the lower plate on which the first tape is placed;
Moving an upper plate provided with a second joining member on the lower plate on which the first tape and the second tape are disposed; And
And bonding the first joining member and the second joining member by pressing the second joining member to move downward.
At least one of the first joining member and the second joining member is composed of a magnet, wherein the first joining member and the second joining member are bonded to each other by magnetic force.

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