KR20120056905A - Substrate for photomask blank, photomask blank and method for manufacturing thereof - Google Patents

Substrate for photomask blank, photomask blank and method for manufacturing thereof Download PDF

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Publication number
KR20120056905A
KR20120056905A KR1020100074501A KR20100074501A KR20120056905A KR 20120056905 A KR20120056905 A KR 20120056905A KR 1020100074501 A KR1020100074501 A KR 1020100074501A KR 20100074501 A KR20100074501 A KR 20100074501A KR 20120056905 A KR20120056905 A KR 20120056905A
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KR
South Korea
Prior art keywords
transparent substrate
main surface
notch
photomask blank
back surface
Prior art date
Application number
KR1020100074501A
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Korean (ko)
Inventor
남기수
안성용
Original Assignee
주식회사 에스앤에스텍
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Priority to KR1020100074501A priority Critical patent/KR20120056905A/en
Publication of KR20120056905A publication Critical patent/KR20120056905A/en

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/60—Substrates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment

Abstract

PURPOSE: A substrate for a photo mask blank, a photo mask blank, and a manufacturing method thereof are provided to separate and use a main surface and a rear surface by differently forming the number of notch marks on the main surfaces and the number of notch marks on the rear surface. CONSTITUTION: A transparent substrate(10) has a main surface(11), a rear surface(12), and four sides(13). A notch mark(15) is formed by cutting one or more corner portions of four corner portions, which are contiguous to the rear surface, into an oblique cross section. A chamber surface is formed by cutting an edge, where the rear side and the sides meet, into the oblique cross section. The number of notch marks formed on the corner portion contiguous to the main surface is different from the number of notch marks formed on the corner portion contiguous to the rear side. One or more metal layers are formed on the main surface or the rear surface of the transparent substrate.

Description

Transparent substrate for photomask blank, photomask blank and manufacturing method thereof {SUBSTRATE FOR PHOTOMASK BLANK, PHOTOMASK BLANK AND METHOD FOR MANUFACTURING THEREOF}

The present invention relates to a transparent substrate for a photomask blank, a photomask blank and a method for manufacturing the same, in particular from a transparent substrate for a photomask blank and a transparent substrate prepared by regrinding a transparent substrate used as a photomask blank or a photomask. It relates to a photomask blank produced.

In general, photomask blanks are raw materials for photomasks used in the manufacture of flat panel display (FPD) devices, such as various semiconductors and liquid crystal displays (LCDs), in which one or more thin metal films or the like are laminated on a transparent substrate. A photomask is manufactured by patterning a metal film from this photomask blank.

In general, photomasks are divided into semiconductor manufacturing and FPD manufacturing, and transparent substrates are similarly classified. Transparent substrates used for manufacturing photomasks for semiconductor manufacturing, so-called small transparent substrates, are now mostly made of square substrates having a width of 152 mm by 152 mm and a thickness of 6.35 mm. On the other hand, a transparent substrate used for manufacturing a photomask for manufacturing an FPD, a so-called large transparent substrate, is a substrate of various standards of rectangular shape having one side of 300 mm or more and a thickness of 5 mm or more.

The transparent substrate may include at least one notch mark formed by cutting a corner portion of at least one of four corner portions where two adjacent sides and a main surface meet or four corner portions where two adjacent sides and a back surface meet in an oblique cross section. Mark). The notch mark is for distinguishing the type of the transparent substrate or for distinguishing the main surface and the back surface of the transparent substrate.

Since the large transparent substrate is very expensive compared to the small transparent substrate, it is necessary to reuse the transparent substrate by re-polishing from an already used photomask for cost reduction, and the transparent substrate is often reused as such.

The thickness of the regrind transparent substrate is reduced by several micrometers. In the lithography process using a photomask, since the process conditions are set in accordance with the thickness of the transparent substrate, a transparent substrate having a thickness outside the allowable thickness range is used. In order to manufacture the photomask, it is necessary to reset the lithography process conditions in accordance with the reduced thickness of the transparent substrate.

However, although the thickness of the conventional regrind transparent substrate was reduced, there was no method of distinguishing the unused transparent substrate from the naked eye. If a photomask manufactured from a transparent substrate having a reduced thickness is used as it is without resetting the exposure process conditions, process defects may occur due to a setting error such as a shift in focus position.

Accordingly, an object of the present invention is to provide a transparent substrate for reused photomask blanks that can facilitate differentiation from unused transparent substrates.

Another object of the present invention is to provide a method for manufacturing a reused transparent substrate for a photomask blank, and to provide a method for manufacturing a photomask blank and a photomask blank manufactured from the transparent substrate.

MEANS TO SOLVE THE PROBLEM In order to solve the said subject, this invention has the following structures.

[Configuration 1]

A transparent substrate for a photomask blank having a main surface, a back surface, and four side surfaces, the notch mark formed by cutting one or more corner portions of four corner portions adjacent to the main surface and four corner portions adjacent to the rear surface in an inclined cross section ( And a number of the notch marks formed in the corner portion adjacent to the main surface and the number of the notch marks formed in the corner portion adjacent to the back surface are different from each other.

[Configuration 2]

In the configuration 1, the notch mark formed in the corner portion adjacent to the main surface and the notch mark formed in the corner portion adjacent to the rear surface are formed at positions facing each other.

[Configuration 3]

The transparent substrate for a photomask blank according to the first aspect of the present invention, further comprising: an edge where the main surface and the side face each other, and a chamfered surface formed by cutting the edge where the rear face and the side face meet in an oblique cross section.

[Configuration 4]

A transparent substrate for a photomask blank having a main surface, a back surface, and four sides, the chamfered surface formed by cutting a corner where the main surface and the side meet in an inclined cross section, and a corner where the rear face and the side meet in a slanted cross section It has a chamfered surface formed, the width of the chamfered surface adjacent to the main surface is larger than the width of the chamfered surface adjacent to the back surface, formed by cutting any one or more corners of the four corners adjacent to the back surface in an inclined cross section It has a notch mark, The transparent substrate for photomask blanks characterized by the above-mentioned.

[Configuration 5]

The transparent substrate for reused photomask blank according to any one of Configurations 1 to 4, wherein the transparent substrate for the photomask blank is removed after the formation of one or more layers of metal films on the main surface or the rear surface thereof and the surface thereof is polished. .

[Configuration 6]

At least one metal film is formed on the main surface or the back surface of the transparent substrate for a photomask blank according to any one of Configurations 1 to 4, wherein the photomask blank is used.

[Configuration 7]

A method for manufacturing a transparent substrate for a photomask blank having a main surface, a back surface, and four side surfaces, the method comprising: forming at least one corner portion among four corner portions adjacent to the main surface and four corner portions adjacent to the rear surface in an oblique cross section. Preparing a photomask blank or photomask in which at least one metal film is formed on the main surface or the back surface of the transparent substrate having a notch mark, removing the metal film and polishing the surface of the transparent substrate; A step of forming a notch mark by cutting at least one of the corner portion of the main surface or the corner portion adjacent to the back surface in an inclined cross section, wherein the step of forming the notch mark, the notch formed in the corner portion adjacent to the main surface The number of marks and the number of notch marks formed in the corner portion adjacent to the back surface are A method for producing a transparent substrate for a photomask blank, which is formed to be different from each other.

[Configuration 8]

In the structure 7, the process of forming the said notch mark is formed so that the said notch mark formed in the corner part adjacent to the said main surface, and the said notch mark formed in the corner part adjacent to the said back surface may mutually face each other. The manufacturing method of the transparent substrate for photomask blanks.

[Configuration 9]

A method for manufacturing a transparent substrate for a photomask blank having a main surface, a back surface, and four sides, the method comprising: an edge where the main surface and the side meet, and a chamfered surface formed by cutting the edge where the back and the side meet in an inclined cross section; Preparing a photomask blank or photomask in which at least one metal film is formed on the main surface or the back surface of the transparent substrate having a width of the chamfered surface adjacent to the main surface larger than the width of the chamfered surface adjacent to the back surface; Removing and polishing a surface of the transparent substrate; and cutting at least one corner portion of four corner portions adjacent to the rear surface in an inclined cross section to form a notch mark. Method of manufacturing a substrate.

[Configuration 10]

At least one layer of a metal film is formed on the main surface or the back surface of the transparent substrate for the photomask blank manufactured by the method for manufacturing the transparent substrate for the photomask blank according to any one of Configurations 7 to 9. Manufacturing method.

Since the notch mark formed on the main surface and the notch mark formed on the back surface of the photomask blank transparent substrate of the present invention face each other, it can be easily distinguished from the unused transparent substrate. Therefore, the process defect which arises because the exposure process conditions are not met can be greatly reduced.

In addition, the transparent substrate of the present invention can be used by distinguishing the main surface and the back surface by differently forming the number of notch marks formed on the main surface and the number of notch marks formed on the back surface.

1 is a cross-sectional view of a transparent substrate for a photomask blank according to the present invention.
2 is a plan view of a transparent substrate for a photomask blank of the present invention.
Figure 3 shows a part of the corner portion of the transparent substrate according to the present invention.
4 is a cross-sectional view of a photomask blank in which a metal film is formed on a transparent substrate according to the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail with respect to the present invention.

[First Embodiment]

1 is a cross-sectional view of a transparent substrate for a photomask blank according to the present invention, and FIG. 1 (a) shows a cross-sectional view of a transparent substrate for a photomask blank according to the first embodiment of the present invention. The transparent substrate 10 of the first embodiment has a main surface 11, a back surface 12, and a side surface 13, an edge where the main surface 11 and a side surface 13 meet, and a back surface 12 and a side surface 13. Has a chamfered surface 14 that chamfers the edge where). The width c of the chamfer 14 is approximately 0.3 mm to 1.3 mm, and the width c on the plane and the width c on the side surface are preferably the same, but are not necessarily the same. Further, the width c of the chamfered surface 14 adjacent to the main surface 11 and the width c of the chamfered surface 14 adjacent to the back surface 12 are also preferably the same, but need not necessarily be the same.

FIG. 2: is a top view of the transparent substrate 10 for photomask blanks which concerns on 1st Embodiment of this invention, FIG. 2 (a) shows a back surface and FIG. 2 (b) shows a main surface. 1st Embodiment of this invention is the transparent substrate 10 for photomask blanks which has the main surface 11, the back surface 12, and the four side surfaces 13, The four corner parts adjacent to the main surface 11, and the back surface ( Notch mark 15 formed by cutting any one or more corner portions of four corner portions adjacent to 12) in an oblique cross section, and a notch formed in the corner portion adjacent to the main surface 11. The number of marks 15 and the number of notch marks 15 formed in the corner portion adjacent to the back surface 12 are different from each other.

Photomask blanks and photomasks made from the transparent substrate 10 of the present invention can be used to manufacture flat panel displays, in particular photomask blanks for manufacturing thin film transistors and It can be used for a photomask.

The transparent substrate 10 of the present invention can be applied to all the transparent substrates 10 having a side of 150 mm or more and a thickness of 5 mm or more, but is particularly suitable for the so-called large transparent substrate 10 having one side of 300 mm or more. The transparent substrate 10 may be made of synthetic quartz glass, soda lime glass, or the like. The transparent substrate 10 of the present invention is formed of a photomask blank or photomask by forming one or more layers of metal films on the main surface 11 and / or the back surface 12 and then removing the metal film to reuse the transparent substrate 10. to be. The method of removing the metal film in the present invention refers to various known methods.

In the present invention, the main surface 11 and the rear surface 12 of the transparent substrate 10 are separated, respectively, but this is not divided into the surface on which the metal film is formed. The metal film may be formed on either of the main surface 11 or the rear surface 12, or may be formed on both surfaces. Those skilled in the art can appropriately select which side of the main surface 11 and the rear surface 12 of the transparent substrate 10 to form a metal film. For example, a metal film may be formed by selecting a surface having less defects or selecting a surface having better flatness among the main surface 11 and the rear surface 12.

The transparent substrate 10 of the present invention is formed at a position where the notch mark 15 formed at the corner portion adjacent to the main surface 11 and the notch mark 15 formed at the corner portion adjacent to the rear surface 12 face each other. It is. For example, as shown in Fig. 2A, when the notch mark 15 formed on the back surface 12 is formed at the corner portion near the 'F' rule and the corner portion at the diagonal direction thereof, As shown in FIG. 2 (b), the notch mark 15 is formed on the main surface 11 at a corner near the 'F' rule. Since the number of notch marks 15 formed on the main surface 11 and the number of notch marks 15 formed on the back surface 12 are different from each other, the main surface 11 and the back surface 12 are also formed after the transparent substrate 10 is repolished. ) Can be distinguished. In addition, since the notch marks 15 formed on the main surface 11 and the rear surface 12 are formed at positions facing each other, when viewed from the upper side of the transparent substrate 10, the transparent substrate 10 is regrinded. I can easily recognize that. FIG. 2 shows a transparent substrate 10 having two notch marks 15 on the back surface 12 and one notch mark 15 on the main surface 11, but this is merely an example and is a notch mark. The number of 15 is not limited.

If the notch marks 15 formed on the main surface 11 and the notch marks 15 formed on the rear surface 12 are not formed at positions facing each other, the four corner portions of the main surface 11 and the four corners of the rear surface 12 are provided. There is an inconvenience to check all the wealth. Therefore, it is preferable that the notch mark 15 is formed in the position where the main surface 11 and the back surface 12 oppose each other.

3 shows a notch mark 15 formed at one corner of the back surface 12 of the transparent substrate 10. The notch mark 15 is formed by cutting the corner portion where the two side surfaces 13 and the main surface 11 or the rear surface 12 of the transparent substrate 10 meet in an inclined cross section. The size, shape, angle, etc. of cutting the notch mark 15 into the inclined cross section can use various conventionally known methods. The notch mark 15 may be formed by combining several inclined cross sections. The shape of the notch mark 15 may be formed differently according to the characteristics of the transparent substrate 10.

The transparent substrate 10 of the present invention has four side surfaces 13, and the corner where the two side surfaces 13 meet is rounded. The transparent substrate 10 of the present invention further has a chamfered surface 14 formed by cutting a corner where the main surface 11 and the side surface 13 meet and a corner where the rear surface 12 and the side surface 13 meet in an oblique cross section. . The chamfered surface 14 may also be formed by a round treatment rather than a cross section.

The transparent substrate 10 of the present invention is a transparent substrate 10 that is reused by removing the metal film from the photomask on which one or more metal films are formed on the main surface 11 and / or the back surface 12 and regrinding the surface. In the unused transparent substrate 10 in the present embodiment, the notch mark 15 is formed only on either of the main surface 11 or the rear surface 12. Therefore, in the present invention, when the metal film is removed from the photomask and the surface is regrinded, the notch mark 15 is formed on the surface where the notch mark 15 is not formed, thereby transparently regrinding the unused transparent substrate 10. Substrate 10 is divided. At this time, the number of the notch marks 15 formed on the main surface 11 and the number of the notch marks 15 formed on the rear surface 12 may be different so that the main surface 11 and the rear surface 12 may be distinguished from each other. If the notch mark 15 additionally formed on one side is formed at a position facing the notch mark 15 formed on the other side, it can be easily confirmed whether it is the re-polished transparent substrate 10. Here, since the number of the notch mark 15 of the main surface 11 and the notch mark 15 of the back surface 12 differs, some of the notch mark 15 of the larger number is notch mark in the position facing the other side. (15) is not formed.

4 shows a photomask blank 100 in which a metal film 40 is formed on a regrind transparent substrate 10 of the present invention. The metal film 40 may be formed by a sputtering method using a target including one or more metals, and may be formed in one or more layers. A resist film (not shown) may be further formed on the metal film 40. When the metal film 40 is patterned from the photomask blank 100, it becomes a photomask.

In the method for manufacturing a transparent substrate for a photomask blank according to the present invention, first, a photomask blank or photomask in which at least one metal film is formed on the main surface 11 or the rear surface 12 of the transparent substrate 10 is prepared. The transparent substrate 10 has four corner portions adjacent to the main surface 11 and notch marks 15 formed by cutting one or more corner portions of four corner portions adjacent to the rear surface 12 in an oblique cross section. The transparent substrate 10 may have a notch mark 15 formed only at a corner portion of one of the main surface 11 and the rear surface 12, and according to the present invention, may be formed on both the main surface 11 and the rear surface 12. Notch mark 15 may be formed. In the case of the photomask blank, the metal film is not patterned, and in the case of the photomask, the metal film is patterned.

Then, the photomask blank or the metal film of the photomask is removed, and the surface of the transparent substrate 10 is polished. And the notch mark 15 is formed by cut | disconnecting one or more corner | corners of the corner part adjacent to the main surface 11 or the back surface 12 in inclined cross section. At this time, the notch mark 15 is formed so that the number of the notch marks 15 formed in the corner portion of the main surface 11 and the number of the notch marks 15 formed in the corner portion of the rear surface 12 are different from each other. The notch mark 15 is formed so that the notch mark 15 of (11) and the notch mark 15 of the back surface 12 may be in a position facing each other. Here, since the number of the notch mark 15 of the main surface 11 and the notch mark 15 of the back surface 12 differs, some of the notch mark 15 of the larger number is notch mark in the position facing the other side. (15) is not formed.

In the present invention, the method of polishing the surface of the transparent substrate 10 and forming the notch marks 15 follows a variety of methods known in the art.

One or more layers of the metal film 40 are formed on the main surface 11 or the rear surface 12 of the transparent substrate 10 to be reused so as to be manufactured as the photomask blank 100. When the metal film 40 is patterned from the photomask blank 100, it becomes a photomask.

[Second Embodiment]

FIG.1 (b) shows sectional drawing of the transparent substrate for photomask blanks which concerns on 2nd Embodiment of this invention. The transparent substrate 10 of the second embodiment has a main surface 11, a back surface 12, and a side surface 13, an edge where the main surface 11 and a side surface 13 meet, a back surface 12, and a side surface 13. Has a chamfered surface 14 that chamfers the edge where). The width of the chamfered surface 14 adjacent to the main surface 11 is greater than the width of the chamfered surface 14 adjacent to the back surface 12. The width of the chamfered surface 14 adjacent to the back surface 12 is approximately 0.3 mm to 1.3 mm, similar to the width of the chamfered surface 14 formed on the transparent substrate 10 of the first embodiment. The chamfered surface 14 adjacent to the main surface 11 has a width A of approximately 2.2 mm to 5.5 mm on the side, and a width B of approximately 3.0 mm to 7.3 mm on the plane. The chamfered surface 14 adjacent to the main surface 11 has a larger width B on the plane than the width A on the side.

In the transparent substrate 10 according to the second embodiment, the notch mark is not formed at the four corner portions adjacent to the main surface 11, and the notch mark is provided only at one or more corner portions among the four corner portions adjacent to the rear surface 12. Is formed.

Similar to the transparent substrate 10 of the first embodiment, the transparent substrate 10 of the second embodiment is formed by forming one or more layers of metal films containing one or more metals on the main surface 11 or the rear surface 12 to form a photomask blank. Is manufactured. When the metal film 40 is patterned from the photomask blank 100, it becomes a photomask.

The transparent substrate 10 for photomask blanks according to the second embodiment can be used for a photomask and a photomask blank for manufacturing a color filter.

10: transparent substrate
11: main plane
12: back side
13: side
14: Chamfer Surface
15: notch mark
40: metal film
100: photomask blank

Claims (10)

A transparent substrate for a photomask blank having a main surface, a back surface and four sides,
A notch mark formed by cutting a corner portion of at least one of four corner portions adjacent to the main surface and four corner portions adjacent to the back surface in an inclined cross section,
The number of the notch marks formed in the corner portion adjacent to the main surface and the number of the notch marks formed in the corner portion adjacent to the back surface are different from each other.
The method of claim 1,
The notched mark formed in the corner portion adjacent to the main surface and the notch mark formed in the corner portion adjacent to the back surface are formed at positions facing each other.
The method of claim 1,
And a chamfered surface formed by cutting an edge where the main surface and the side surface meet and an edge where the rear surface and the side surface meet in an inclined cross section.
A transparent substrate for a photomask blank having a main surface, a back surface and four sides,
A chamfered surface formed by cutting an edge where the main surface and the side meet in an inclined cross section, and a chamfered surface formed by cutting an edge where the rear face and the side meet in an inclined cross section,
The width of the chamfered surface adjacent to the main surface is greater than the width of the chamfered surface adjacent to the back surface,
And a notch mark formed by cutting one or more corner portions of four corner portions adjacent to the rear surface in an inclined cross section.
5. The method according to any one of claims 1 to 4,
The transparent substrate for the photomask blank is a transparent substrate for the reused photomask blank, characterized in that the surface is polished by removing one or more layers of metal film formed on the main surface or the back surface.
At least one layer of a metal film is formed in the main surface or the back surface of the transparent substrate for photomask blanks of any one of Claims 1-4, The photomask blank characterized by the above-mentioned.
As a manufacturing method of the transparent substrate for photomask blanks which has a main surface, a back surface, and four sides,
One or more layers of metal films are formed on the main surface or the back surface of the transparent substrate having four corner portions adjacent to the main surface and a notch mark formed by cutting at least one corner portion of four corner portions adjacent to the back surface in an oblique cross section. Preparing a photomask blank or photomask,
Removing the metal film and polishing the surface of the transparent substrate;
Comprising a step of forming a notch mark by cutting at least one corner portion of the corner portion adjacent to the main surface or the rear surface in an inclined cross section,
The step of forming the notch mark is formed such that the number of the notch marks formed in the corner portion adjacent to the main surface and the number of the notch marks formed in the corner portion adjacent to the back surface are different from each other. The manufacturing method of the transparent substrate for mask blanks.
The method of claim 7, wherein
In the step of forming the notch mark, the notch mark formed in the corner portion adjacent to the main surface and the notch mark formed in the corner portion adjacent to the rear surface face each other so as to face each other. Method of manufacturing a substrate.
As a manufacturing method of the transparent substrate for photomask blanks which has a main surface, a back surface, and four sides,
A chamfered surface formed by cutting an inclined cross-section of an edge where the main surface and the side meet and an edge where the rear face and the side meet, wherein a width of the chamfered surface adjacent to the main surface is greater than a width of the chamfered surface adjacent to the rear surface. Preparing a photomask blank or photomask in which at least one metal film is formed on the main surface or the back surface of the large transparent substrate,
Removing the metal film and polishing the surface of the transparent substrate;
A method of manufacturing a transparent substrate for a photomask blank, comprising the step of cutting at least one corner portion of four corner portions adjacent to the back surface in an inclined cross section to form a notch mark.
At least one metal film is formed on the main surface or the back surface of the transparent substrate for a photomask blank manufactured by the method for manufacturing the transparent substrate for a photomask blank according to any one of claims 7 to 9. Method of making a mask blank.
KR1020100074501A 2010-08-02 2010-08-02 Substrate for photomask blank, photomask blank and method for manufacturing thereof KR20120056905A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180073451A (en) 2016-12-22 2018-07-02 호야 가부시키가이샤 Mask blank substrate for manufacturing display device, mask blank and mask, and manufacturing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180073451A (en) 2016-12-22 2018-07-02 호야 가부시키가이샤 Mask blank substrate for manufacturing display device, mask blank and mask, and manufacturing method thereof
JP2018106147A (en) * 2016-12-22 2018-07-05 Hoya株式会社 Mask blank substrate for display device production, mask blank and mask, and production method thereof

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