KR20120047799A - Display device, method of manufacturing display device, and electronic apparatus - Google Patents

Abstract

PURPOSE: A display device and a manufacturing method thereof and an electronic device are provided to secure good color purity by controlling color mixture of colored light at each pixel. CONSTITUTION: Pixels(10R, 10G, 10B) of 3 kinds which are arranged into a matrix shape are formed on a driving substrate(10). The pixel comprises a bottom electrode(11), organic lamination films(12R, 12G, 12B), and a top electrode(16). The bottom electrode functions as an anode electrode which injects a hole into each organic light-emitting layer. The top electrode functions as a cathode electrode which injects an electron into each organic light-emitting layer. A bonding layer(18) is formed between a seal substrate(19) and a protective film(17).

Description

DISPLAY DEVICE, METHOD OF MANUFACTURING DISPLAY DEVICE, AND ELECTRONIC APPARATUS}

The present invention relates to a display device using an organic EL element that performs color display.

In an organic EL display device using eletroluminescence of an organic material (hereinafter, abbreviated as EL), an organic EL element having an organic layer including a hole transporting layer and a light emitting layer between a pair of electrodes is used as a display pixel. have. The organic EL element is attracting attention as a light emitting element capable of high luminance light emission (luminescence) by low voltage DC (direct current) driving.

Since such an organic EL element has a response speed of 1 microsecond or less, in the organic EL display device, duty driving by a simple matrix method is possible. However, in the case where the high duty is progressed with an increase in the number of pixels, it is necessary to supply a large current instantaneously to the organic EL element in order to secure sufficient luminance, so that the element is liable to be damaged in this simple matrix method.

On the other hand, in the active matrix driving method, a signal voltage can be stored by forming a storage capacitor together with a thin film transistor (TFT) for each subpixel. Therefore, during the desired period in one frame, the drive current corresponding to the signal voltage can always be supplied to the organic EL element. Therefore, in the active matrix driving method, it is not necessary to supply a large current to the organic EL device instantaneously, as in the simple matrix method, and damage to the device can be reduced. In addition, one pixel is composed of three types of sub-pixels, for example, red (R), green (G), and blue (B), whereby full-color video display can be realized. .

By the way, in order to manufacture such a full color organic EL display device, patterning of the light emitting layer of each color is necessary for every subpixel, and various methods are tried (for example, Japanese Patent No. 3369615, hereinafter, It is called patent document 1). In Patent Literature 1, the projections are patterned on the substrate and vacuum evaporation (hereinafter referred to as " oblique deposition ") is performed from the oblique direction to form each color light emitting layer in a patterning manner. Specifically, the projections are disposed in selective regions between the pixels, and the projections are used as masks for forming a film in each pattern by subjecting the organic materials to be deposited to varying angles (angle directions) to perform gradient deposition. At this time, a red light emitting layer for red subpixels and a green light emitting layer for green subpixels are selectively formed by oblique deposition, respectively, and then a blue light emitting layer is formed over all the subpixels. In addition, there is also a method of patterning a light emitting layer by temporarily aligning a deposition mask made of metal, or by printing or an inkjet method. Alternatively, there are also methods used in combination of a white light emitting organic EL element and a color filter, and various methods have been used to realize full-color video display.

However, in the method described in the patent document 1, when depositing a red light emitting material using the projection as a mask, it is difficult not to attach the red light emitting material to another subpixel, for example, a blue subpixel at all. In other words, red light emitting molecules actually adhere to the blue subpixel due to a change in the direction of movement of the molecules in the vacuum, reflection on the wall surface of the vapor deposition apparatus, or the like. Here, since the energy of the red light emission is lower than that of blue, when the red light emitting molecules are attached to the blue subpixels, the excitation energy of the blue light emitting molecules is rapidly moved, even if the amount of adhesion is small, so that the red light is emitted from the blue subpixels. This happens. The mixed color of the light emitted in this manner lowers the color purity and causes a drop in display quality. In addition, in recent years, the application range of the display device is applied to various fields, and the demand for miniaturization of the pixels is also increasing, and it is a situation that there is a need to suppress the color purity as described above and to prevent the decrease in color purity. .

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object thereof is to provide a display device, a manufacturing method of a display device, and an electronic device capable of ensuring good color purity in color display.

The display device of the present invention has a plurality of types of pixels emitting different color light on a substrate, and each pixel includes at least one organic light emitting layer and another organic layer other than the organic light emitting layer, and the layer structure of the other organic layer It is provided with the organic laminated film which differs for every kind of pixel, and the 1st electrode and the 2nd electrode which interposed the organic laminated film.

The manufacturing method of the display device of this invention is a process of forming a 1st electrode on a board | substrate in each pixel area, when forming the several kind of pixel which emits a different color light on a board | substrate, one or more organic light emitting layers, An organic layer other than the organic light emitting layer is included, and the layer structure of an organic layer includes the process of forming an organic laminated film which differs for every kind of pixel, and the process of forming a 2nd electrode after forming an organic laminated film.

In the manufacturing method of the display apparatus of this invention, an organic laminated film is provided between a 1st electrode and a 2nd electrode, and this organic laminated film contains one or more organic light emitting layers and other organic layers other than this, and is a layer in another organic layer. The structure (that is, the number, type, thickness, etc. of other organic layers) is different for each kind of pixel. For example, a carrier block layer made of an organic material is arranged for the optional pixel. Thereby, in the film-forming process, even if the organic luminescent material of any color adheres to pixels other than a desired pixel, the mixed color of the color light by the adhesion is suppressed. In other words, by using such a carrier block layer, the order of film formation and the location of film formation of the organic light emitting material of each color can be set appropriately, and the desired color light can be easily taken out from each pixel.

In the display device of the present invention, the organic laminated film provided between the first electrode and the second electrode includes one or more organic light emitting layers and other organic layers, and has a layer structure in other organic layers (that is, the number and types of layers of other organic layers). , Thickness, etc.) differ for each pixel type. For example, in optional pixels, a carrier block layer made of an organic material is disposed. Thereby, even when the organic light emitting material of a color different from its own color light is affixed to each pixel, mixed color of the color light by the adhesion is suppressed.

The electronic device of the present invention includes the display device of the present invention.

According to the display device and the method for manufacturing the display device of the present invention, the organic laminated film provided between the first electrode and the second electrode includes one or more organic light emitting layers and other organic layers, and the layer structure in the other organic layer , Different for each pixel type. For example, in optional pixels, a carrier block layer made of an organic material is disposed. Thereby, in each pixel, the color mixture of color light can be suppressed. Therefore, in the color display using a plurality of colors, it is possible to ensure good color purity.

1 is a diagram showing a cross-sectional structure of a display device according to a first embodiment of the present invention.
A to C cross-sectional views showing a schematic configuration of each organic laminated film in three types of organic EL elements of R, G, and B shown in FIG. 1.
3A and 3B show a manufacturing method of the display device shown in FIG. 1 in the order of process.
4A and 4B illustrate a process following B in FIG. 3.
5A and 5B illustrate a process following B in FIG. 4.
6A and 6B illustrate a process following B in FIG. 5.
FIG. 7 is a view showing a process following FIG. 6B. FIG.
8 is a cross-sectional view illustrating a structure and a manufacturing method of a display device according to a comparative example.
9 is a characteristic diagram showing the light emission intensity of each color light in the display device related to the comparative example.
10 is a characteristic diagram showing the light emission intensity of each color light in the display device shown in FIG. 1;
11 is a diagram illustrating a cross-sectional structure of a display device according to Modification Example 1. FIG.
12: A to C are sectional drawing which shows schematic structure of each organic laminated film in three types of organic electroluminescent element of R, G, and B shown in FIG.
13A and 13B illustrate a method of manufacturing the display device illustrated in FIG. 11.
14A and 14B illustrate a process following B in FIG. 13.
FIG. 15 shows a process following FIG. 14B; FIG.
FIG. 16 is a characteristic diagram showing the light emission intensity of each color light in the display device shown in FIG.
17 is a diagram showing a cross-sectional structure of a display device according to a second embodiment of the present invention.
18A to 18C are cross-sectional views showing the schematic configuration of each organic laminated film in three types of organic EL devices of R, G, and B shown in FIG. 17.
19A and 19B illustrate a manufacturing method of the display device shown in FIG. 17 in the order of process.
20A and 20B illustrate a process following B in FIG. 19.
21A and 21B show a process following FIG. 20B.
22A and 22B illustrate a process following B in FIG. 21.
FIG. 23 is a view showing a process following FIG. 22B. FIG.
FIG. 24 is a characteristic diagram showing the light emission intensity of each color light in the display device shown in FIG. 17; FIG.
25 is a diagram showing a cross-sectional structure of a display device according to Modification Example 2. FIG.
26A to 26C are cross-sectional views showing schematic configurations of respective organic laminated films in three types of organic EL elements R, G, and B shown in FIG. 25.
FIG. 27 is a characteristic diagram showing the light emission intensity of each color light in the display device shown in FIG. 25;
FIG. 28 is a diagram showing a cross-sectional structure of a display device according to a third embodiment of the present invention. FIG.
29A to 29C are cross-sectional views showing a schematic configuration of each organic laminated film in three types of organic EL elements of R, G, and B shown in FIG.
30A and 30B illustrate a method of manufacturing the display device shown in FIG. 28 in the order of process.
31 A and B illustrate a process following B in FIG. 30.
32A and 32 illustrate a process following B in FIG. 31;
33 is a cross-sectional view showing a structure of a display device (substrate structure before inclined deposition) according to a fourth embodiment of the present invention.
34A and 34B are cross-sectional views illustrating a substrate structure according to a comparative example.
35A and 35 are views for explaining the effect in the substrate structure shown in FIG.
36 is a cross-sectional view illustrating a substrate structure according to Modification Example 3. FIG.
37A and 37 are views for explaining the effect on the substrate structure shown in FIG. 36;
38 is a cross-sectional view illustrating a substrate structure according to Modification Example 4. FIG.
39 is a cross-sectional view illustrating a substrate structure according to another modification.
40 is a diagram showing an overall configuration including a peripheral circuit of the display device according to each embodiment.
41 is a diagram showing the circuit configuration of a pixel shown in FIG. 40;
42 is a plan view showing a schematic configuration of a module including the display device shown in FIG. 40;
43 is a perspective view showing an appearance of red use example 1. FIG.
FIG. 44: A is a perspective view which shows the external appearance seen from the front side of red use example 2, FIG. 44B is a perspective view which shows the external appearance seen from the side.
45 is a perspective view showing an appearance of red example 3. FIG.
46 is a perspective view showing an appearance of a red example 4. FIG.
FIG. 47A is a front view of the open state of Red Example 5, FIG. 47B is a side view thereof, FIG. 47C is a closed front view, FIG. 47D is a left side view, FIG. 47E is a right side view, FIG. 47F is a top view, and FIG. 47G is a bottom view.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described in detail with reference to drawings. The description will be made in the following order.

(1) First Embodiment (Example Using Green Electron Block Layer and Blue Electron Block Layer)

(2) Modification Example 1 (Example in which the green light emitting layer in (1) was used as the R, G, and B common layers)

(3) Second Embodiment (Example Using Green Film Thickness Adjustment Layer and Blue Film Thickness Adjustment Layer)

(4) Modification Example 2 (Example in which the green light-emitting layer in (3) was used as the R, G, and B common layers)

(5) Third Embodiment (Example in which the red light emitting layer and the green light emitting layer are thinned)

(6) Fourth Embodiment (Example in which the "vignetting" suppressing structure is added at the time of inclination vapor deposition)

(7) Modification Example 3 (Example in which the leak prevention insulating film in (6) was provided)

(8) Modification 4 (another example of the "vignetting" suppression structure in (6))

(9) Example of red (example of electronic equipment)

<1st embodiment>

[Overall Configuration of Display Device 1]

1 shows a cross-sectional structure of the display device 1 according to the first embodiment of the present invention. The display device 1 is, for example, an active matrix organic EL display device, and is a top emission type in which light is extracted from the side of the upper electrode 16 described later. The display device 1 has three kinds of pixels 10R, 10G, and 10B arranged in a matrix on the drive substrate 10. These pixels 10R, 10G, and 10B correspond to the subpixels of R, G, and B, and each consists of an organic EL element. That is, the pixel 10R consists of a red organic EL element emitting red light, the pixel 10G consists of a green organic EL element emitting green light, and the pixel 10B consists of a blue organic EL element emitting blue light, respectively.

These pixels 10R, 10G, and 10B are connected to the lower electrode 11, the organic layered films 12R, 12G, and 12B and the upper electrode 16 in order from the side of the driving substrate 10, for example. In order.

The drive board 10 is a board including a drive circuit of the pixels 10R, 10G, and 10B, and a TFT is provided for each pixel. The surface of the drive substrate 10 is covered with a planarization film, and each TFT and the lower electrode 11 are electrically connected through an opening provided in the planarization film.

The lower electrode 11 functions as an anode electrode which injects holes into each organic light emitting layer, for example. Since the lower electrode 11 also functions as a reflective electrode in the top emission type display device as in the present embodiment, it is preferable to have a reflectance as high as possible in order to increase luminous efficiency. For example, the constituent material of the lower electrode 11 may be a single element or an alloy of metal elements such as silver (Ag), aluminum, molybdenum (Mo), and chromium (Cr). The lower electrode 11 may be a single layer structure using such a metal material, or may be a laminated structure of a plurality of layers. In addition, a structure in which a transparent conductive film, such as an oxide of indium and tin (ITO) or an oxide of indium and zinc (IZO), is provided on the lower electrode surface made of the above material. However, when Al alloy is used as the lower electrode 11, high reflectance can be ensured, but an oxide film is easily formed on the surface, and a hole injection barrier is likely to occur due to the small work function. Therefore, in this case, it is preferable to separately provide a hole injection layer made of a suitable material.

The lower electrode 11 is provided for each pixel on the driving substrate 10. Preferably, as in the present embodiment, the step is not formed with the surface of the driving substrate 10 (surface such as a flattening film). It is preferable that it is provided so that each surface of the lower electrode 11 and the drive board | substrate 10 may be the same surface. This suppresses the occurrence of "vignetting" (or "shading") when depositing the organic material by gradient deposition, and enables the organic material to be deposited almost uniformly in the desired region. Therefore, it is easy to suppress the occurrence of current concentration or to obtain a desired emission color.

In addition, in this embodiment, illustration of the TFT and planarization film mentioned above is abbreviate | omitted for simplicity. In addition, on the lower electrode 11, an inter-pixel insulating film having an opening facing the lower electrode 11 may be formed over the entire surface of the pixels 10R, 10G, and 10B (details will be described later). In this case, organic laminated films 12R, 12G, and 12B are formed in the opening portions of the inter-pixel insulating film.

The organic laminated films 12R, 12G, and 12B are each one or more organic light emitting layers in the red light emitting layer 14R, the green light emitting layer 14G, and the blue light emitting layer 14B, and other organic layers other than such organic light emitting layers (for example, For example, a hole transport layer or an electron block layer to be described later) is laminated. Although details are mentioned later, in these organic laminated films 12R, 12G, and 12B, the structure of organic layers other than an organic light emitting layer differs from each other.

The upper electrode 16 is an electrode common to the pixels 10R, 10G, and 10B, and functions as a cathode electrode for injecting electrons into each organic light emitting layer, for example. The upper electrode 16 is made of a transparent conductive material in the top emission type display device as in the present embodiment. For example, the monolayer film of transparent conductive films, such as ITO and IZO, and a magnesium-silver (Mg-Ag) co-deposition film, or these laminated films is mentioned. In addition, an Mg-Ag co-deposition film is used as the upper electrode 16, and the total film thickness (total optical path length) of the organic layer laminated films 12R, 12G, and 12B and the distance between each organic light emitting layer and the electrode are appropriately set. By doing so, an optical resonator structure can be formed in each pixel, and the luminous efficiency and color purity can be improved (the details will be described later in the second embodiment).

Ribs 110 are disposed in the selective regions between these pixels 10R, 10G, and 10B. Here, each region is provided between the pixels 10R and 10G and between the pixels 10B and 10R. Although the rib 110 is mentioned later in detail, it functions as a shadow mask used when patterning each color light emitting layer, an electron blocking layer, etc. in a film-forming process. The rib 110 is made of a photosensitive resin material such as a photoresist, for example, and is formed in an appropriate shape (width and height) in consideration of various conditions such as pitch between pixels and deposition angle.

On the upper electrode 16 side of the pixels 10R, 10G, and 10B as described above, the protective layer 17 is provided to cover all the pixels. In addition, the sealing substrate 19 is bonded by the adhesive layer 18 on the protective film 17. The protective film 17 consists of a silicon nitride film, a silicon oxide film, etc., for example, and the contact bonding layer 18 consists of UV curable resin, for example. The sealing substrate 19 may be provided with a color filter, a black matrix (all of which are not shown), or the like.

(Configuration of Organic Lamination Films 12R, 12G, 12B)

2A to 2C show cross-sectional structures of the organic laminated films 12G, 12B, and 12R. As described above, the organic laminated films 12R, 12G, and 12B all have the hole transporting layer 13 and the red light emitting layer 14R as the common layer for each pixel in order from the lower electrode 11 side. However, in the organic laminated film 12G, as shown in FIG. 2A, on the red light emitting layer 14R, the green electron blocking layer 15G, the green light emitting layer 14G, and the blue light emitting layer 14B. ) Are stacked in that order. In the organic laminated film 12B, as shown in FIG. 2B, the blue electron blocking layer 15B and the blue light emitting layer 14B are laminated in this order on the red light emitting layer 14R. In the organic laminated film 12R, as shown in FIG. 2C, the blue light emitting layer 14B is laminated | stacked on the red light emitting layer 14R.

Thus, although the light emitting layer of a different color light is laminated | stacked on each of the organic laminated films 12G, 12B, and 12R, the recombination position Dg of the organic laminated film 12G is in the green light emitting layer 14G, and the organic laminated film ( The recombination position Db of 12B is formed in the blue light emitting layer 14B, and the recombination position Dr of the organic laminated film 12R is formed in the red light emitting layer 14R, respectively. This reason will be described later.

That is, the organic laminated film 12G in the pixel 10G has a red light emitting layer 14R, a green light emitting layer 14G, and a blue light emitting layer 14B as light emitting layers, and as organic layers other than these light emitting layers, It has the hole transport layer 13 and the green electron block layer 15G. The organic laminated film 12B in the pixel 10B has a red light emitting layer 14R and a blue light emitting layer 14B as light emitting layers, and as the organic layers other than these light emitting layers, the hole transport layer 13 and blue electrons are used. It has a block layer 15G. The organic laminated film 12R in the pixel 10R has a light emitting layer 14R for red and a light emitting layer 14B for blue as a light emitting layer, and a hole transport layer 13 as an organic layer other than these light emitting layers.

In this way, the layer structure of the organic laminated films 12G, 12B, and 12R, and the layer structure of organic layers other than the organic light emitting layer are different for each kind of pixel. That is, the number, type, thickness, etc. of organic layers other than an organic light emitting layer differ for every pixel 10R, 10G, and 10B.

As the display device 1 as a whole, the hole transport layer 13 and the red light emitting layer 14R are provided in this order over the entire surface of the pixels 10R, 10G, and 10B on the driving substrate 10. On the red light emitting layer 14R, the green electron blocking layer 15G and the green light emitting layer 14G are provided in this order in the pixel 10G, and the blue electron blocking layer 15B and blue in the pixel 10B. The light emitting layer 14B is provided in this order. And blue light emitting layer 14B is provided over the whole surface of pixel 10R, 10G, and 10B so that these may be covered.

The hole transport layer 13 is for increasing the hole injection efficiency, for example, hexaazatriphenylene derivative (Formula 1) and 4,4'-bis (N-1-naphthyl-N-phenylamino) biphenyl (α-NPD).

[Formula 1]

The red light emitting layer 14R, the green light emitting layer 14G, and the blue light emitting layer 14B each have a portion of holes injected from the lower electrode 11 side and an upper electrode 16 side by applying an electric field. Some of the injected electrons recombine to generate red, green, and blue colored light, respectively. Each of these color light emitting layers is composed of organic materials such as styrylamine derivatives, aromatic amine derivatives, perylene derivatives, coumarin derivatives, pyran pigments, and triphenylamine derivatives, for example.

The red light emitting layer 14R includes at least one of, for example, a red light emitting material, a hole transporting material, and an electron transporting material. The red light emitting material may be fluorescent or phosphorescent. This red light emitting layer 18R is, for example, 2,6-bis [(4'-methoxydiphenylamino) styryl] to 4,4-bis (2,2-diphenylbinin) biphenyl (DPVBi). It consists of a mixture of -1,5-dicyanonaphthalene (BSN).

The green light emitting layer 14G includes at least one of, for example, a green light emitting material, a hole transporting material, and an electron transporting material. The green light emitting material may be fluorescent or phosphorescent. This green light emitting layer 18G is comprised by mixing coumarin 6 with ADN and DPVBi, for example.

The blue light emitting layer 14B includes at least one of, for example, a blue light emitting material, a hole transporting material, and an electron transporting material. The blue light emitting material may be fluorescent or phosphorescent. This blue light emitting layer 18B is composed of, for example, 4,4'-bis [2- {4- (N, N-diphenylamino) phenyl} vinyl] biphenyl (DPAVBi) mixed with DPVBi. It is.

The green electron blocking layer 15G and the blue electron blocking layer 15B have a function of shielding the movement of electrons in a predetermined direction between, for example, light emitting layers of different colors stacked above and below. These green electron block layers 15G and blue electron block layers 15B are made of a hole transport material such as the hole transport layer 13, for example.

For example, in the present embodiment, the green electron blocking layer 15G is disposed between the green light emitting layer 14G and the red light emitting layer 14R, whereby electrons injected from the upper electrode 16 side. The red light emitting layer 14R disposed below the green light emitting layer 14G cannot be reached. In other words, in the pixel 10G, the recombination position is changed by the green electron blocking layer 15G so that recombination by the electron-hole pair occurs in the red light emitting layer 14R and the green light emitting layer 14G. It is supposed to be. In addition, although the blue light emitting layer 14B is further provided on the green light emitting layer 14G, green light emission becomes more dominant than blue light emission in terms of energy.

Similarly, the blue electron blocking layer 15B is disposed between the blue light emitting layer 14B and the red light emitting layer 14R, so that electrons injected from the upper electrode 16 side can be transferred to the blue light emitting layer 14B. Rather, the red emitting layer 14R disposed below the layer cannot be reached. In other words, in the pixel 10B, the recombination position is changed by the blue electron blocking layer 15B so that recombination by an electron-hole pair occurs in the red light emitting layer 14R and the blue light emitting layer 14B. It is supposed to be.

The organic laminated films 12G, 12B, and 12R include, in addition to the hole transport layer 13 and the color light emitting layers as described above, for example, a hole injection layer and an electron transport layer (all of which are not shown), etc., as necessary. It may be laminated. As the hole injection layer, for example, 4,4 ', 4 "-tris (3-methylphenylphenylamino) triphenylamine (m-MTDATA) or 4,4', 4" -tris (2-naphthyl phenylamino) Triphenylamine (2-TNATA) can be used. The electron transporting layer is for enhancing the electron injection efficiency into each color light emitting layer, and is composed of, for example, 8-hydroxyquinoline aluminum (Alq ₃ ) or BCP. In addition, an electron injection layer may be further provided on the organic laminated films 12G, 12B, and 12R. As the constituent material of the electron injection layer includes, for example, _{Li 2 O, Cs 2 O,} LiF and CaF _2, such as the alkali metal oxides, alkali metal fluorides, alkaline earth metal oxides, alkaline earth fluorides and the like.

[Manufacturing Method of Display Device 1]

The display device 1 as described above can be manufactured, for example, as follows. 3A to 3 are cross-sectional views showing the manufacturing method of the display device 1 in the order of steps. In addition, in each figure, although the code | symbol of (R), (G), (B) is added below the drive board | substrate 10, these represent each pixel area | region (pixel formation plan area), and (R) Are pixels 10R, G are pixels 10G, and B are pixel regions of the pixel 10B, respectively.

First, as shown in FIG. 3A, the lower electrode 11 made of, for example, the above-described material is patterned in each pixel region on the drive substrate 10 by, for example, sputtering and photolithography. do. At this time, an opening is formed in the planarization film (not shown) covering the driving circuit (including TFT) provided in the driving substrate 10, and the TFT provided in the lower electrode 11 and the lower layer of the planarization film is formed through the opening. To be electrically connected. Thereafter, an inter-pixel insulating film (not shown) is formed over the entire pixel regions R, G, and B on the formed lower electrode 11, and the region opposite the lower electrode 11 is formed. An opening is formed in the formation region of the organic laminated film 12R, 12G, 12B.

Subsequently, as shown in FIG. 3B, ribs 110 made of the above-described material are pattern-formed in the selective region between the pixels. Here, the ribs 110 are formed by, for example, photolithography between the pixel regions R and G and between the pixel regions R and B. FIG.

Subsequently, as shown in FIG. 4A, the vacuum deposition in a direction substantially perpendicular to the driving substrate 10 is performed on the entire surface of the pixel regions R, G, and B with the above-described materials. The hole transport layer 13 formed is formed.

Subsequently, as shown in FIG. 4B, the vacuum deposition in a direction substantially perpendicular to the driving substrate 10 causes the above-described surface of the pixel regions R, G, and B to be described above. A red light emitting layer 14R formed of a material is formed. As a result, the hole transport layer 13 and the red light emitting layer 14R are formed on the driving substrate 10 as a common layer in each pixel region. As a result of this, the hole transport layer 13 and the red light emitting layer 14R are also deposited on the upper surface of each rib 110.

Subsequently, as shown in FIG. 5A, the green electron block layer 15G made of the above-described material is formed by gradient deposition using the formed ribs 110. At this time, the pixel region G is exposed to the deposition source, and the pixel regions R and B are deposited from the angular direction D1 which becomes the shade of the rib 110. In this way, the green electronic block layer 15G is selectively formed in the pixel region G serving as the pixel 10G. As a result, the green electronic block layer 15G is also formed on the side surface of the rib region 110 provided between the pixel regions R and (B) on the side of the pixel region R. As shown in FIG.

Subsequently, as shown in FIG. 5B, the green light emitting layer 14G made of the above-described material is formed by gradient deposition using the rib 110. At this time, vapor deposition is performed from the same angular direction D1 as in the case of the green electron blocking layer 15G. That is, the green light emitting layer 14G is formed into a film on the formed green electronic block layer 15G. In this way, the green light emitting layer 14G is selectively formed in the pixel region G serving as the pixel 10G. As a result, the green light emitting layer 14G is also formed on the side surface of the rib 110 provided between the pixel regions R and B on the side of the pixel region R. As shown in FIG.

Subsequently, as shown in FIG. 6A, the blue electron block layer 15B made of the above-described material is formed by gradient deposition using the rib 110. At this time, the pixel region B is exposed to the vapor deposition source, and the pixel regions R and G are deposited along the angular direction D2 which becomes the shade of the rib 110. In this manner, the blue electron block layer 15B is selectively formed in the pixel region B serving as the pixel 10B. As a result, the blue electron block layer 15B is also formed on the side surface of the rib region 110 provided between the pixel regions R and G on the side of the pixel region R side.

Subsequently, as illustrated in FIG. 6B, the vacuum deposition in a direction substantially perpendicular to the driving substrate 10 causes the above-described entire surface of the pixel regions R, G, and B to be described above. A blue light emitting layer 14B formed of a material is formed. Thereby, the blue light emitting layer 14B is formed as a layer common to each pixel area on the drive substrate 10. As a result, the blue light emitting layer 14B is also deposited on each rib 110. In this way, organic laminated films 12R, 12G, and 12B are formed in the pixel regions R, G, and B, respectively.

Subsequently, as shown in FIG. 7, the upper electrode 16 made of the above-described material is, for example, vacuum-deposited or sputtered over the entire surface of the pixel regions R, G, and B. FIG. We form. As a result, the pixels 10R, 10G, and 10B are formed on the driving substrate 10.

Finally, after the protective layer 17 is formed to cover the entire surface of the formed pixels 10R, 10G, and 10B, the sealing substrate 19 is bonded to the upper surface of the protective layer 17 through the adhesive layer 18. By doing so, the display device 1 shown in FIG. 1 is completed.

[Operation and Effects of the Display Device 1]

In the display device 1 according to the present embodiment, when a driving current corresponding to an image signal of each color is applied to each of the pixels 10R, 10G, and 10B, the lower electrode 11 and the upper electrode 16 are provided. Electrons and holes are injected into the organic laminated films 12R, 12G, and 12B. These electrons and holes are recombined in the red light emitting layer 14R, the green light emitting layer 14G, and the blue light emitting layer 14B in the pixels 10R, 10G, and 10B, respectively, to generate light. In this manner, in the display device 1, full-color video display of R, G, and B is performed.

Here, in the display device 1, in order to realize full-color video display as described above, it is necessary to form three types of pixels of R, G, and B on the driving substrate 10. Therefore, in the present embodiment, in the manufacturing process, the ribs 110 are disposed in the selective region between the pixels as a shadow mask, and the ribs 110 are used to obliquely deposit the respective color light emitting materials, Patterning is performed. The operation and effect in the case of using the film forming process using such ribs 110 will be described below.

(Comparative Example)

8 is a cross-sectional view for illustrating a schematic configuration and a manufacturing process of the display device 100 according to the comparative example of the present embodiment. In addition, the illustration of a protective layer, an adhesive layer, and a sealing substrate is abbreviate | omitted for the sake of simplicity. In the display device 100, pixels 100R, 100G, and 100B are disposed on the driving substrate 101, and in each pixel, a light emitting layer is provided between the lower electrode 102 and the upper electrode 105. An organic laminated film is formed. In the selective region between the pixels, ribs 1010 for patterning each color light emitting layer are provided. As the organic laminated film, for example, in the pixel 100R emitting red light, the hole transporting layer 103, the red emitting layer 104R and the blue emitting layer 10B are laminated in order from the side of the lower electrode 102. have. In the pixel 100G that emits green light, the hole transport layer 103, the green light emitting layer 104G and the blue light emitting layer 10B are stacked in order from the side of the lower electrode 102. In the pixel 100B which emits blue light, the hole transport layer 103 and the blue light emitting layer 10B are stacked in order from the side of the lower electrode 102.

That is, in the pixel 100R, the red light emitting layer 104R and the blue light emitting layer 10B are included as the light emitting layer, and the hole transporting layer 103 is included as the organic layers other than the organic light emitting layer. In the pixel 100G, the light emitting layer includes the green light emitting layer 104G and the blue light emitting layer 10B, and the organic layers other than the organic light emitting layer include the hole transport layer 103. In the pixel 100B, the blue light emitting layer 10B is included as a light emitting layer, and the hole transport layer 103 is included as an organic layer other than the organic light emitting layer. That is, in the comparative example, in each pixel, there is no difference in the layer structure of the organic layers other than the light emitting layer, and all have the structure which has only the hole-transporting layer 103 common to each pixel.

Here, although two types of light emitting layers are laminated on the pixels 100R and 100G, in this case, light emission of color light having a low light emission energy becomes dominant. In detail, since the light emission energy increases in the order of red light, green light, and blue light, charge recombination positions are formed in the order of the red light emitting layer 104R, the green light emitting layer 104G, and the blue light emitting layer 104B. easy. That is, light emission from the red light emitting layer 104R is more dominant than the blue light emitting layer 104B and the green light emitting layer 104G and the green light emitting layer 104G. Therefore, in the structure of the comparative example, red light is emitted from the pixel 100R, green light is emitted from the pixel 100G, and blue light is emitted from the pixel 100B, so that full-color video display is possible.

In the display device 100 as described above, patterning of each color light emitting layer is performed by gradient deposition using the ribs 1010 in the manufacturing process as described above, but film formation is performed in the following order, for example. That is, after forming the hole transport layer 103 on the lower electrode 102, first, the red light emitting layer 104R is formed by gradient deposition using the rib 1010. Specifically, the pixel 100R is exposed to the deposition source, and the pixels 100R are exposed to the pixel 100R by depositing from the angular direction D101 that becomes the shade of the rib 1010 with respect to the pixels 100G and 100B. Optionally, the red light emitting layer 104R is formed. Subsequently, the light emitting layer 104G for green is formed by gradient deposition using the rib 1010. Specifically, the green light emitting layer 104G is selectively formed in the pixel 100G by performing vapor deposition while the pixel 100G is exposed to the vapor deposition source. Thereafter, the blue light emitting layer 104B is formed over the entire surface of the pixels 100R, 100G, and 100B in a direction substantially perpendicular to the driving substrate 101. Finally, the upper electrode 105 is formed on the blue light emitting layer 104B, thereby completing the display device 100 having the laminated structure as described above.

By the way, in the technique of the comparative example described above, when the red light emitting layer 104R is deposited using the rib 1010 as a mask, a part of the red light emitting material is a pixel 100G other than the target pixel 100R. , 100B) may be attached. This is due to a change in the direction of movement of molecules in the vacuum or reflection on the wall surface of the vapor deposition apparatus. In particular, since the energy of the red light emission is lower than that of blue, when the red light emitting molecules adhere to the blue subpixel, even if the amount of adhesion is small, the excitation energy of the blue light emitting molecules is rapidly moved to the red light emitting molecules, and thus the red light is red. Light emission occurs. In other words, not only blue light but also red light are mixed and generated from the pixel 100B. Such color mixing of color light may lower the color purity and cause a decrease in display quality.

As a numerical example of this comparative example, the following samples were produced and the emission intensity of each color light of R, G, and B was measured. At this time, the width (pitch) of each pixel 100R, 100G, 100B was 26 micrometers, and the lower electrode 102 was made into the aluminum film of width 8micrometer and thickness 50nm. The rib 1010 was formed by the photoresist of 6 micrometers in height, and 6 micrometers in width between pixels 100B and 100G and between pixels 100B and 100R. As the hole transporting layer 103, a layer of 10 nm thick hexaazatriphenylene derivative (Formula 1) and 18 nm thick α-NPD was used. In the film-forming process of the red light emitting layer 104R, the angular direction D101 was made into the 73 degree direction, and the film thickness was 50 nm using what mixed BSN with DPVBi as a red light emitting material. In the film-forming process of the green light emitting layer 104G, the angular direction D102 was made into the -73 degree direction, and the film thickness was 25 nm using what mixed coumarin 6 with ADN as a green light emitting material. As a blue light emitting layer 104B, the film thickness was 15 nm using what mixed DPAVBi with DPVBi. On the blue light emitting layer 104B, an electron transport layer made of BCP having a thickness of 30 nm and an electron injection layer made of lithium fluoride having a thickness of 0.3 nm (both not shown) are formed, and the upper electrode 105 is formed thereon. As a result, a 15 nm Mg-Ag (10: 1) co-deposition film was formed. In addition, after forming the silicon nitride film into thickness of 1 micrometer as a protective layer which is not shown in figure, sealing glass was bonded using UV curable resin. Thus, the said measurement result in the display apparatus 100 of the comparative example produced is shown in FIG.

As shown in FIG. 9, red light is emitted from the pixel 100R and green light is emitted from the pixel 100G, but yellow light emission of red and green light is obtained from the pixel 100B, and blue light is obtained. No light emission was obtained. Further, by setting as described above, in each pixel, an optical resonator structure is formed between the lower electrode 102 and the upper electrode 105, but the order of resonacne is zero order, Green 0th and blue 0th order.

On the other hand, in the present embodiment, as described above, the organic laminated films 12R, 12G, and 12B include one or more organic light emitting layers and other organic layers, and the layer structure of other organic layers (that is, another organic layer). Layer number, type, thickness, etc.) differ for each pixel type. For example, as the organic layer other than the organic light emitting layer, the organic laminated film 12G includes the hole transport layer 13 and the green electron blocking layer 15G, and the organic laminated film 12B includes the hole transport layer 13. And a blue electron blocking layer 15B, and the organic laminated film 12R includes a hole transport layer 13.

With such a layer structure, in the pixel 10R, the red light emitting layer 14R and the blue light emitting layer 14B in the organic laminated film 12R are recombined to the red light emitting layer 14R for the reasons described above. (Dr) is formed, and light emission of red light is obtained.

On the other hand, in the pixel 10G, three organic light emitting layers of the red light emitting layer 14R, the green light emitting layer 14G, and the blue light emitting layer 14B are stacked in the organic laminated film 12G. For this reason, in view of the above-mentioned light emission energy, the recombination position is formed in the red light emitting layer 14R. However, in the present embodiment, as shown in FIG. The green electron blocking layer 15G is sandwiched between the light emitting layers 14G. For this reason, the electrons injected from the upper electrode 16 side do not reach the red light emitting layer 14R and remain above the green electron block layer 15G. On the green electron block layer 15G, the green light emitting layer 14G and the blue light emitting layer 14B are laminated, but in these two color light emitting layers, green light emission is dominant in view of the above-described light emission energy. (The recombination position Dg is formed in the green light emitting layer 14G). Therefore, in the pixel 10G, green light emission by the green light emitting layer 14G is obtained.

On the other hand, in the pixel 10B, two organic light emitting layers of the red light emitting layer 14R and the blue light emitting layer 14B are stacked in the organic laminated film 12B. For this reason, in view of the above-described light emission energy, the recombination position is formed in the red light emitting layer 14R. However, in the present embodiment, as shown in B of FIG. 2, the red light emitting layer 14R and the blue light are shown. The blue electron block layer 15B is sandwiched between the light emitting layers 14B. For this reason, the electron injected from the upper electrode 16 side does not reach the red light emitting layer 14R, but stays higher than the blue electron blocking layer 15B. That is, the recombination position Db is formed in the blue light emitting layer 14B stacked on the blue electron block layer 15B. Therefore, light emission of blue light by the blue light emitting layer 14B is obtained in the pixel 10B.

As described above, the layer structure of the organic layers other than the light emitting layer is different for each of the pixels 10R, 10G, and 10B. Specifically, in the present embodiment, the green electronic block layer 15G and the pixel are arranged in the pixel 10G. The blue electron block layer 15B is provided at a predetermined position at 10B. Thereby, even when the luminescent material which forms into a film only in the pixel selectively selected by oblique deposition in the film-forming process adheres to pixels other than a desired pixel, the mixing of the color light by the adhesion is suppressed.

For example, in the film forming process of the green light emitting layer 14G, when the green light emitting material is attached to the pixels 10R and 10B other than the pixel 10G, in the pixel 10R, the emission of the red light is dominant. There is no problem. On the other hand, in the pixel 10B, since the blue electron blocking layer 15B is formed after the film forming process of the green light emitting layer 14G, electrons are added to the green light emitting molecules attached in the film forming process of the green light emitting layer 14G. Is prevented from moving.

Further, the red light emitting layer 14R is provided at the lowermost layer among the three light emitting layers (the first film is formed among the three light emitting layers), and the pixels 10 and 10b are used as green electrons on the red light emitting layer 14R. By stacking the block layer 15G and the blue electron block layer 15B, the movement of electrons to the red light emitting layer 14R in the pixels 10G and 10B is prevented.

In addition, on the red light emitting layer 14R, the material (for example, hole transport material) used for the electron blocking layer in each of the film forming steps of the green electron blocking layer 15G and the blue electron blocking layer 15B. In addition, although it may adhere, since a small amount of adhesion moves most excitation energy to a red luminescent material, it does not become an obstacle of light emission of red light.

Thus, by using the electron block layer, the order of film formation and the location of film formation of the organic light emitting materials of each color can be appropriately set so that the influence of adhesion of the deposition material is minimized. As a result, the desired color light from each pixel is desired. It is easy to take out.

As a numerical example of this embodiment, the following samples were produced and the light emission intensity of each color light of R, G, and B was measured. At this time, the width (pitch) of each pixel 10R, 10G, and 10B was 26 micrometers, and the lower electrode 11 was made into the ITO film | membrane of width 8 micrometers, and thickness 50nm. In the lower layer of the lower electrode 11, an aluminum mirror having a thickness of 100 nm was provided. The ribs 110 were formed by photoresist having a height of 6 μm and a width of 6 μm between the pixels 10R and 10G and between the pixels 10B and 10R. As the hole transport layer 13, a layer of 10 nm thick hexaazatriphenylene derivative (formula 1) and 18 nm thick α-NPD was used. As the red light-emitting layer 14R, a film obtained by mixing BSN with DPVBi was used to have a film thickness of 10 nm. In the film-forming process of 15 G of green electron block layers, the angular direction D1 of diagonal vapor deposition was set to 73 degrees, and as an electron block material, alpha-NPD was used and the film thickness was 100 nm. Also in the film-forming process of the green light emitting layer 14G, the angular direction D1 was 73 degrees, and as a green light-emitting material, the thing in which coumarin 6 was mixed with ADN was made into 10 nm. In addition, in the film-forming process of the blue electron block layer 15B, the angular direction D2 of oblique deposition was set to -73 degrees, and as an electron block material, alpha-NPD was used and the film thickness was 70 nm. . As a blue light emitting layer 14B, the film thickness was 15 nm using what mixed DPAVBi with DPVBi. Further, on the blue light emitting layer 14B, an electron transport layer made of BCP having a thickness of 30 nm and an electron injection layer made of lithium fluoride having a thickness of 0.3 nm (both not shown) are formed, and the upper electrode 16 is formed thereon. As a result, a 15 nm Mg-Ag (10: 1) co-deposition film was formed. As the protective layer 17, a silicon nitride film having a thickness of 1 μm was used, and the sealing substrate 19 was bonded thereto using the adhesive layer 18 made of a UV curable resin. The measurement result in the display device 1 thus produced is shown in FIG. 10.

As shown in FIG. 10, each light emission of red light from the pixel 10R, green light from the pixel 10G, and blue light from the pixel 10B was obtained. Further, by setting as described above, in each pixel, an optical resonator structure is formed between the Al mirror under the lower electrode 11 and the upper electrode 16, and the order of resonance is red 0 order, green 1 It was tea, blue first.

As described above, in the present embodiment, the organic laminated films 12R, 12G, and 12B provided between the lower electrode 11 and the upper electrode 16 include two or more color light emitting layers and other organic layers other than the above, The layer structure in another organic layer differs for every pixel 10R, 10G, and 10B. For example, the green electronic block layer 15G is disposed at a predetermined position of the pixel 10G, and the blue electronic block layer 15B is disposed at a predetermined position of the pixel 10B. Thereby, even when the organic light emitting material of a color different from its own color adheres to each pixel, the mixed color of the color light by the adhesion can be suppressed. Therefore, in the color display using a plurality of colors, it is possible to ensure good color purity.

(Variation 1)

[Configuration of Display Device 1A]

Here, the display apparatus (display apparatus 1A) which concerns on the modification (modification 1) of the said 1st Embodiment is demonstrated. Hereinafter, about the component similar to the said 1st Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted suitably. 11 illustrates a cross-sectional structure of the display device 1A. The display device 1A is an organic EL display device of an active matrix type or a top emission type, for example, similarly to the display device 1 of the first embodiment, and each of the display devices 1A is organic on the driving substrate 10. It has three types of pixels 10R1, 10G1, and 10B1 made of EL elements. These pixels 10R1, 10G1, and 10B1 have the lower electrode 11, the organic laminated films 12R1, 12G1, 12B1, and the upper electrode sequentially from the side of the driving substrate 10 as in the first embodiment. (16) is in this order. The organic laminated films 12R1, 12G1, and 12B1 each include one or more light emitting layers of the red light emitting layer 14R, the green light emitting layer 14G1, and the blue light emitting layer 14B, similarly to the first embodiment. It is an organic laminated film and differs in layer structure other than a light emitting layer. In addition, the ribs 110 are disposed between the pixels, and the protective layer 17, the adhesive layer 18, and the sealing substrate 19 are provided on the upper electrode 16.

However, in this modification, the green light emitting layer 14G1 is provided as a layer common to each pixel 10R1, 10G1, and 10B1. In other words, in this modification, the organic laminated films 12R1, 12G1, and 12B1 have all the light emitting layers of the red light emitting layer 14R, the green light emitting layer 14G1, and the blue light emitting layer 14B. Hereinafter, the laminated structure of such organic laminated film 12R1, 12G1, 12B1 is demonstrated concretely.

12A to 12C show cross-sectional structures of the organic laminated films 12R1, 12G1, and 12B1. In the organic laminated film 12G1, as shown in A of FIG. 12, on the hole transport layer 13, a red light emitting layer 14R, a green electron blocking layer 15G, a green light emitting layer 14G1, and a blue color. The light emitting layer 14B is laminated in this order. In the organic laminated film 12B1, as shown in B of FIG. 12, on the hole transport layer 13, a red light emitting layer 14R, a green light emitting layer 14G1, a blue electron blocking layer 15B and a blue color. The light emitting layer 14B is laminated in this order. In the organic laminated film 12R1, as shown in FIG. 12C, a red light emitting layer 14R, a green light emitting layer 14G1, and a blue light emitting layer 14B are stacked on the hole transport layer 13. . The green light emitting layer 14G1 is made of a material equivalent to the green light emitting layer 14G of the first embodiment.

Thus, even when the green light emitting layer 14G1 is provided in each pixel (the organic light emitting layer of every color is provided in each pixel), the recombination position Dg of the organic laminated film 12G1 is the green light emitting layer 14G1. The recombination position Db of the organic laminated film 12B1 is formed in the blue light emitting layer 14B, and the recombination position Dr of the organic laminated film 12R1 is formed in the red light emitting layer 14R, respectively.

That is, the organic laminated film 12G1 in the pixel 10G1 has all the light emitting layers of three colors of the red light emitting layer 14R, the green light emitting layer 14G1, and the blue light emitting layer 14B as light emitting layers, and these light emitting layers As other organic layers, it has the hole transport layer 13 and the green electron block layer 15G. The organic laminated film 12B1 in the pixel 10B1 has all three light emitting layers as a light emitting layer, and has the hole transport layer 13 and the blue electron block layer 15G as organic layers other than these light emitting layers. The organic laminated film 12R1 in the pixel 10R1 has all three light emitting layers as a light emitting layer, and has the hole transport layer 13 as organic layers other than these light emitting layers.

As the entire display device 1A, the hole transport layer 13 is provided on the driving substrate 10 over the entire surface of the pixels 10R1, 10G1, and 10B1, and on the hole transport layer 13, the red hole is transported over the entire substrate. The light emitting layer 14R is formed. On the red light emitting layer 14R, a green electron blocking layer 15G is provided in an optional region corresponding to the pixel 10G1, and on this green electron blocking layer 15G, the green light emitting layer over the entire substrate. 14G1 is provided. The blue electron blocking layer 15B is provided in a selective region corresponding to the pixel 10B1 on the green light emitting layer 14G1, and the blue light emitting layer over the entire surface of the substrate is provided on the blue electron blocking layer 15B. 14B is provided.

[Manufacturing Method of Display Device 1A]

The display device 1A as described above can be manufactured, for example, as follows. 13A to 13 are cross-sectional views for explaining a method for manufacturing the display device 1A.

First, in the same manner as in the first embodiment, the lower electrode 11, the rib 110, the hole transport layer 13, the red light emitting layer 14R, and the green electron blocking layer (on the driving substrate 10) 15G) (A in FIG. 13). Subsequently, as shown in FIG. 13B, the green color is applied to the entire surface of the pixel regions R, G, and B by vacuum deposition in a direction substantially perpendicular to the driving substrate 10. The light emitting layer 14G1 is formed. Thereby, the green light emitting layer 14G1 is formed as a layer common to each pixel area on the drive substrate 10. As a result, the green light emitting layer 14G1 is also deposited on each rib 110.

Subsequently, as shown in FIG. 14A, in the same manner as in the first embodiment, the blue electron block layer 15B is selectively added to the pixel region B by gradient deposition using the ribs 110. To form. Subsequently, as shown in FIG. 14B, the pixel regions R and G are formed by vacuum deposition in a direction substantially perpendicular to the driving substrate 10 in the same manner as in the first embodiment. The blue light emitting layer 14B is formed over the entire surface of (B). Thereby, the blue light emitting layer 14B is formed as a layer common to each pixel area on the drive substrate 10. In this way, organic laminated films 12R1, 12G1, and 12B1 are formed in the pixel regions R, G, and B, respectively.

After that, as shown in FIG. 15, the upper electrode 16 is, for example, over the entire surface of the pixel regions R, G, and B, similarly to the first embodiment. The film is formed by vacuum deposition or sputtering. As a result, the pixels 10R1, 10G1, and 10B1 are formed on the driving substrate 10. Finally, the protective layer 17 is formed to cover the entire surface of each of the pixels 10R1, 10G1, and 10B1 in the same manner as in the first embodiment, and then the adhesive layer 18 is formed on the upper surface of the protective layer 17. By bonding the encapsulation substrate 19 through Fig. 1), the display device 1A shown in Fig. 11 is completed.

As in this modification, not only the red light emitting layer 14R and the blue light emitting layer 14B but also the green light emitting layer 14G1 can be formed as a layer common to each pixel. In other words, the green light emitting layer 14G1 may be formed by inclined deposition using the ribs 110 as described in the first embodiment. It is also possible to form a film by vapor deposition in the direction. In this way, even when all three color light emitting layers are formed on each pixel, the pixel 10G1 has a green electron block layer 15G and the pixel 10B1 has a blue electron block layer 15B, respectively. As described above, in each pixel, recombination of charges occurs in an appropriate layer, and it is easy to extract desired color light. Therefore, the effect equivalent to the said 1st Embodiment can be acquired.

Here, as the numerical example of this modification, the following samples were produced and the light emission intensity of each color light of R, G, and B was measured. At this time, the width (pitch) of each pixel 10R1, 10G1, 10B1, the scale and constituent material of the lower electrode 11, the installation of the reflection mirror, the rib 110 scale, and the constituent material are the above-mentioned first embodiment. It carried out similarly to the numerical example in the form. Further, the constituent materials of the hole transport layer 13, the red light emitting layer 14R, the green light emitting layer 14G1, the blue light emitting layer 14B, the green electron blocking layer 15G, and the blue electron blocking layer 15B. Was similarly to the said 1st Embodiment, and set the film thickness of each layer as follows. That is, 68 nm for the hole transport layer 13, 7 nm for the red light emitting layer 14R, 10 nm for the green light emitting layer 14G1, 15 nm for the blue light emitting layer 14B, and 15 G of the green electron blocking layer. 30 nm and the blue electron block layer 15B were set to 30 nm, respectively. In addition, in the film-forming process of 15 G of green electron block layers, the angle direction D1 of diagonal deposition is 73 degree direction, and the angular direction D2 of diagonal evaporation is formed in the film formation process of blue electron block layer 15B. The direction was -73 degrees. Further, on the blue light emitting layer 14B, the electron transporting layer having a film thickness of 35 nm made of BCP, the electron injection layer having a thickness of 0.3 nm made of LIF, and the upper electrode 16 having a film thickness of 12 nm made of an Mg-Ag co-deposited film. ) Were formed in this order. The measurement result of the display device 1A thus produced is shown in FIG. 16.

As shown in FIG. 16, each light emission of red light from the pixel 10R1, green light from the pixel 10G1, and blue light from the pixel 10B1 was obtained. Further, by setting as described above, in each pixel, an optical resonator structure is formed between the Al mirror under the lower electrode 11 and the upper electrode 16, and the order of resonance is red 0 order, green 1 It became tea, blue first.

<2nd embodiment>

[Configuration of Display Device 2]

17 illustrates a cross-sectional structure of the display device 2 according to the second embodiment of the present invention. The display device 2 is an organic EL display device of an active matrix type or a top emission type, for example, similarly to the display device 1 of the first embodiment, and each of the display devices 2 is organic on the driving substrate 10. It has three types of pixels 20R, 20G, and 20B made of an EL element. Hereinafter, about the component similar to the said 1st Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted suitably.

These pixels 20R, 20G, and 20B are connected to the lower electrode 11, the organic layered films 22R, 22G, 22B, and the upper electrode 16 in order from the side of the driving substrate 10, for example. In order. Similarly to the first embodiment, the ribs 110 are disposed between the pixels 20R and 20B and between the pixels 20R and 20G, and the protective layer 17 and the adhesive layer (on the upper electrode 16). 18) and a sealing substrate 19 are provided. Although the upper electrode 16 can use the various electrode materials demonstrated by said 1st Embodiment, in this embodiment, Mg-Ag co-deposited thin film is used among the materials mentioned above. This makes it possible to form a desired optical resonator structure in each pixel by optimizing the total film thickness of the organic laminated films 22R, 22G, and 22B and the distance between each color light emitting layer and the electrode.

(Configuration of Organic Lamination Films 22R, 22G, 22B)

Each of the organic laminated films 22R, 22G, and 22B is one or more organic light emitting layers in the red light emitting layer 14R, the green light emitting layer 14G, and the blue light emitting layer 14B, as in the first embodiment, Another organic layer other than such an organic light emitting layer is laminated. Moreover, in these organic laminated films 22R, 22G, and 22B, the layer structure (number of layers, types, thickness, etc. of organic layers) of organic layers other than the said light emitting layer differs mutually.

18A to 18C show cross-sectional structures of the organic laminated films 22R, 22G, and 22B. In the organic laminated film 22G, as shown in A of FIG. 18, on the hole transport layer 13, the green film thickness adjusting layer 21G, the red light emitting layer 14R, and the green electron blocking layer 15G. ), The green light emitting layer 14G and the blue light emitting layer 14B are stacked in this order. In the organic laminated film 22B, as shown in B of FIG. 18, on the hole transport layer 13, the blue film thickness adjustment layer 21B, the red light emitting layer 14R, and the blue electron block layer 15B. ) And the blue light emitting layer 14B are stacked in this order. The green film thickness adjusting layer 21G and the blue film thickness adjusting layer 21B are made of, for example, the same material (hole transport material) as the hole transport layer 13 described above. In the organic laminated film 22R, as shown in FIG. 18C, the red light emitting layer 14R and the blue light emitting layer 14B are stacked on the hole transport layer 13.

Thus, also in this embodiment, although the light emitting layer of a different color light is laminated | stacked on each of the organic laminated films 22R, 22G, and 22B, the recombination position Dg of the organic laminated film 22G is 14 G of green light emitting layers 14G. ), The recombination position Db of the organic laminated film 22B is formed in the blue light emitting layer 14B, and the recombination position Dr of the organic laminated film 22R is formed in the red light emitting layer 14R, respectively.

That is, the organic laminated film 22G in the pixel 20G has a red light emitting layer 14R, a green light emitting layer 14G, and a blue light emitting layer 14B as light emitting layers, and as organic layers other than these light emitting layers, The hole transport layer 13, the green film thickness adjustment layer 21G, and the green electron block layer 15G are included. The organic laminated film 22B in the pixel 20B has a red light emitting layer 14R and a blue light emitting layer 14B as a light emitting layer, and as the organic layers other than these light emitting layers, the hole transport layer 13 and the blue film. It has the thickness adjusting layer 21B and the blue electron blocking layer 15G. The organic laminated film 22R in the pixel 20R has a light emitting layer 14R for red and a light emitting layer 14B for blue as a light emitting layer, and has a hole transport layer 13 as an organic layer other than these light emitting layers.

As the entire display device 2, the hole transport layer 13 is provided on the driving substrate 10 over the entire surface of the pixels 20R, 20G, and 20B. On the hole transport layer 13, in the pixel 20G, In the green film thickness adjusting layer 21G and the pixel 20B, the blue film thickness adjusting layer 21B is provided, respectively. The red light emitting layer 14R is formed over the entire surface of the pixels 20R, 20G, and 20B so as to cover the green film thickness adjusting layer 21G and the blue film thickness adjusting layer 21B. On the red light emitting layer 14R, the green electron blocking layer 15G and the green light emitting layer 14G in the pixel 20G are provided in this order as in the first embodiment, and the pixel 20B is provided. The blue electron block layer 15B and the blue light emitting layer 14B in this order are provided in this order. And blue light emitting layer 14B is provided over the whole surface of pixel 20R, 20G, and 20B so that these may be covered.

[Manufacturing Method of Display Device 2]

The display device 2 as described above can be manufactured, for example, as follows. 19-23 is sectional drawing which shows the manufacturing method of the display apparatus 2 in process order.

First, in the same manner as in the first embodiment, after forming the lower electrode 11 on the drive substrate 10, the rib 110 is formed. Subsequently, as shown in FIG. 19A, the hole transport layer is disposed over the entire surface of the pixel regions R, G, and B by vacuum deposition in a direction substantially perpendicular to the driving substrate 10. We form (13).

Thereafter, as shown in FIG. 19B, the green film thickness adjustment layer 21G made of the above-described material is formed by gradient deposition using the ribs 110. At this time, the pixel region G is exposed to the vapor deposition source, and the pixel regions R and B are vapor-deposited from the angular direction D1 which becomes the shade of the rib 110. In this manner, the green film thickness adjustment layer 21G is selectively formed in the pixel region G serving as the pixel 20G. As a result, the green film thickness adjustment layer 21G is also formed on the side surface of the rib 110 provided between the pixel regions R and B on the side of the pixel region R side. Further, the thickness of the green film thickness adjustment layer 21G is set to an appropriate value so as to have a desired resonance length in the optical resonator structure of the pixel 20G.

Subsequently, as shown in FIG. 20A, the blue film thickness adjustment layer 21B made of the above-described material is formed by gradient deposition using the rib 110. At this time, the pixel region B is exposed to the deposition source, and the pixel regions R and G are deposited from the angular direction D2 which becomes the shade of the rib 110. In this manner, the blue film thickness adjustment layer 21B is selectively formed in the pixel region B serving as the pixel 20B. As a result, the blue film thickness adjustment layer 21B is also formed on the side surface of the rib 110 provided between the pixel regions R and G on the side of the pixel region R side. Further, the thickness of the blue film thickness adjustment layer 21B is set to an appropriate value so as to have a desired resonance length in the optical resonator structure of the pixel 20B.

After that, as shown in FIG. 20B, the pixel regions R, G, and (by vacuum deposition in a direction substantially perpendicular to the driving substrate 10 as in the first embodiment. The red emitting layer 14R is formed over the entire surface of B). Thereby, the red light emitting layer 14R is formed as a layer common to each pixel area on the drive substrate 10. As a result of this, the red light emitting layer 14R is also deposited on the upper surface of each rib 110.

Subsequently, as shown in FIG. 21A, similarly to the first embodiment, the green electron block layer 15G is selectively formed in the pixel region G by the gradient deposition using the ribs 110. do. As a result, the green electron block layer 15G is also formed on the side surface of the rib region 110 provided between the pixel regions R and B on the side of the pixel region R. As shown in FIG.

Subsequently, as shown in B of FIG. 21, in the pixel region G, on the green electron block layer 15G in the pixel region G by gradient deposition using the ribs 110 as in the first embodiment. Overlapping the green light emitting layer 14G is formed. As a result, the green light emitting layer 14G is also formed on the side surface of the rib 110 provided between the pixel regions R and B on the side of the pixel region R. As shown in FIG.

Subsequently, as shown in FIG. 22A, the blue electron block layer 15B is selectively formed in the pixel region B by gradient deposition using the ribs 110 as in the first embodiment. do. As a result, the blue electron block layer 15B is also formed on the side surface of the rib region 110 provided between the pixel regions R and G on the side of the pixel region R side.

Subsequently, as shown in FIG. 22B, the pixel regions R, G, and (by vacuum deposition in a direction substantially perpendicular to the drive substrate 10 as in the first embodiment. A blue light emitting layer 14B is formed over the entire surface of B). Thereby, the blue light emitting layer 14B is formed as a layer common to each pixel area on the drive substrate 10. As a result, the blue light emitting layer 14B is also deposited on each rib 110. In this way, organic laminated films 22R, 22G, and 22B are formed in the pixel regions R, G, and B, respectively.

After that, as shown in FIG. 23, the upper electrode 16 is vacuum-deposited, for example, over the entire surface of the pixel regions R, G, and B similarly to the first embodiment. Or it forms into a film by sputter | spatter. As a result, the pixels 20R, 20G, and 20B are formed on the driving substrate 10.

Finally, the protective layer 17 is formed to cover the entire surface of the formed pixels 20R, 20G, and 20B in the same manner as in the first embodiment, and then, on the upper surface of the protective layer 17, an adhesive layer ( By bonding the sealing substrate 19 through 18, the display device 2 shown in FIG. 17 is completed.

[Operations and Effects of the Display Device 2]

In the display device 2 of the present embodiment, when a driving current corresponding to an image signal of each color is applied to each of the pixels 20R, 20G, and 20B, the lower electrode 11 and the upper electrode 16 are applied. Electrons and holes are injected into the organic laminated films 22R, 22G, and 22B. These electrons and holes are recombined in the red light emitting layer 14R, the green light emitting layer 14G, and the blue light emitting layer 14B in the pixels 20R, 20G, and 20B, respectively, to generate light of respective colors. . In this manner, in the display device 1, full-color video display of R, G, and B is performed.

Here, also in the display device 2, in order to realize full-color video display similarly to the display device 1 of the first embodiment, patterning of each color light emitting layer in the manufacturing process is performed by the rib 110. FIG. To use. Also in the present embodiment, the organic laminated films 22R, 22G, and 22B include one or more organic light emitting layers and other organic layers other than those, and the layer structure of the other organic layers is different for each type of pixel. For example, as an organic layer other than an organic light emitting layer, the organic laminated film 22G contains the hole transport layer 13, the green film thickness adjustment layer 21G, and the green electron block layer 15G, and the organic laminated film 22B includes a hole transport layer 13, a blue film thickness adjustment layer 21B, and a blue electron block layer 15B, and the organic laminated film 22R includes a hole transport layer 13. .

With this layer structure, in the pixel 20R, the recombination position Dr is formed in the red light emitting layer 14R in the same manner as the pixel 10R in the first embodiment, and light emission of red light is obtained. Further, in the pixel 20G, the red light emitting layer 14R, the green light emitting layer 14G, and the blue light emitting layer 14B are stacked in the organic laminated film 22G, and the green electron blocking layer 15G is provided. Therefore, for the same reason as in the first embodiment, recombination occurs in the green light emitting layer 14G. Therefore, in the pixel 10G, green light emission by the green light emitting layer 14G is obtained. Similarly in the pixel 20B, the red light emitting layer 14R and the blue light emitting layer 14B are laminated on the organic laminated film 22B. Since the blue light emitting layer 14B is provided, the blue light emitting layer 14B is provided. Recombination occurs at. Therefore, in the pixel 20B, blue light emission by the blue light emitting layer 14B is obtained.

As described above, also in the present embodiment, the layer structure of the organic layers other than the light emitting layer is different for each of the pixels 20R, 20G, and 20B. The blue electron block layer 15B is provided at a predetermined position at 20B. Thereby, even when the luminescent material which forms into a film only in the pixel selectively selected by oblique deposition in the film-forming process adheres to pixels other than a desired pixel, the mixing of the color light by the adhesion is suppressed. That is, by using the electron block layer, the deposition order and the deposition location of the organic light emitting materials of each color can be appropriately set so that the influence of adhesion of the deposition material is minimized. As a result, the desired color light from each pixel can be obtained. It is easy to take out.

In the present embodiment, the green film thickness adjusting layer 21G is provided in the pixel 20G, and the blue film thickness adjusting layer 21B is provided in the pixel 20B, respectively. In the optical resonator structure of 20B), each resonance length can be adjusted to a desired value. This improves the luminous efficiency and color purity in each pixel.

As a numerical example of this embodiment, the following samples were produced and the light emission intensity of each color light of R, G, and B was measured. At this time, the width (pitch) of each pixel 20R, 20G, and 20B, the scale and constituent material of the lower electrode 11, the installation of the reflection mirror, the rib 110 scale and the constituent material, and the thickness of the hole transport layer 13 And the film forming material were the same as in the numerical example in the first embodiment. In the film-forming process of 21G of green film thickness adjustment layers, the angular direction D1 of diagonal deposition was set to 73 degree direction, and alpha-NPD was used as film forming material, and the film thickness was 80 nm. In addition, in the film-forming process of the blue film thickness adjustment layer 21B, the angular direction D2 of diagonal deposition was -73 degrees, and as a film-forming material, alpha-NPD was used and the film thickness was 40 nm. The film-forming material and the film thickness of the red light-emitting layer 14R were the same as in the numerical example in the first embodiment. In the film-forming process of 15 G of green electron block layers, the angular direction D1 of diagonal vapor deposition was set to 73 degrees, and as an electron block material, alpha-NPD was used and the film thickness was 20 nm. The green light emitting layer 14G was the same as in the first embodiment. In addition, in the film-forming process of the blue electron block layer 15B, the angular direction D2 of diagonal deposition was -73 degrees, and as an electron block material, alpha-NPD was used and the film thickness was 30 nm. . About the blue light emitting layer 14B, it carried out similarly to the said 1st Embodiment. Further, the electron transporting layer, the electron injection layer, and the upper electrode 16 made of the same film formation material and film thickness as those of the first embodiment are formed in this order, and further, through the protective layer 17 and the adhesive layer 18. The sealing substrate 19 was bonded. The measurement result in the display device 2 thus produced is shown in FIG. 24.

As shown in FIG. 24, each light emission of red light from the pixel 20R, green light from the pixel 20G, and blue light from the pixel 20B was obtained. Further, by setting as described above, in each pixel, an optical resonator structure is formed between the Al mirror under the lower electrode 11 and the upper electrode 16, and the order of resonance is red 0 order, green 1 It was tea, blue first. Further, by providing the green film thickness adjusting layer 21G and the blue film thickness adjusting layer 21B separately, the film thicknesses of the green electron block layer 15G and the blue electron block layer 15B are obtained. It can be formed thinner than 1. For this reason, the adhesion amount of the electronic block material on the red light emitting layer 14 decreased, and as a result, the light emission amount of the red light in the pixel 20R increased compared with Example 1. As shown in FIG.

As described above, in the present embodiment, the organic laminated films 22R, 22G, and 22B provided between the lower electrode 11 and the upper electrode 16 include two or more light emitting layers and other organic layers other than the above, The layer structure in another organic layer differs for each pixel 20R, 20G, and 20B. For example, the green film thickness adjusting layer 21G and the green electron blocking layer 15G at a predetermined position of the pixel 20G, and the blue film thickness adjusting layer 21B at a predetermined position of the pixel 20B. And the blue electronic block layer 15B are disposed, respectively. Thereby, even when the organic light emitting material of a color different from its own color adheres to each pixel, the mixed color of the color light by the adhesion can be suppressed. Therefore, in the color display using a plurality of colors, it is possible to ensure good color purity. In addition, an optical resonator structure having a desired resonance field in each pixel can be realized, and light emission efficiency and color purity can be improved.

(Variation 2)

[Configuration of Display Device 2A]

Here, a display device (display device 2A) according to a modification (modification example 2) of the second embodiment will be described. Hereinafter, about the component similar to the said 1st, 2nd embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted suitably. 25 illustrates a cross-sectional structure of the display device 2A. The display device 2A is an organic EL display device of, for example, an active matrix type or a top emission type, similarly to the display device 2 of the second embodiment, and each of the display devices 2 is organic on the driving substrate 10. It has three types of pixels 20R1, 20G1, and 20B1 made of EL elements. These pixels 20R1, 20G1, and 20B1 have the lower electrode 11, the organic laminated films 22R1, 22G1, 22B1, and the upper electrode sequentially from the side of the driving substrate 10, similarly to the second embodiment. (16) is in this order. The organic laminated films 22R1, 22G1, and 22B1 each include one or more light emitting layers of the red light emitting layer 14R, the green light emitting layer 14G1, and the blue light emitting layer 14B, as in the second embodiment. It is an organic laminated film and differs in layer structure other than a light emitting layer. In addition, the ribs 110 are disposed between the pixels, and the protective layer 17, the adhesive layer 18, and the sealing substrate 19 are provided on the upper electrode 16. In addition, the green film thickness adjusting layer 21G is provided in the organic laminated film 22G1, and the blue film thickness adjusting layer 21B is provided in the organic laminated film 22B1, respectively.

In the present modification, however, similarly to the modification 1 of the first embodiment, the green light emitting layer 14G1 is provided as a common layer in each of the pixels 20R1, 20G1, and 20B1. In other words, in this modification, the organic laminated films 22R1, 22G1, and 22B1 have all the light emitting layers of the red light emitting layer 14R, the green light emitting layer 14G1, and the blue light emitting layer 14B. Hereinafter, the laminated structure of such organic laminated film 22R1, 22G1, 22B1 is demonstrated concretely.

26A to 26C show cross-sectional structures of the organic laminated films 22R1, 22G1, and 22B1. In the organic laminated film 22G1, as shown to A of FIG. 26, on the hole transport layer 13, the green film thickness adjustment layer 21G, the red light emitting layer 14R, and the green electron block layer 15G. ), The green light emitting layer 14G1 and the blue light emitting layer 14B are stacked in this order. In the organic laminated film 22B1, as shown in B of FIG. 26, on the hole transport layer 13, the blue film thickness adjustment layer 21B, the red light emitting layer 14R, the green light emitting layer 14G1, The blue electron blocking layer 15B and the blue light emitting layer 14B are stacked in this order. In the organic laminated film 22R1, as shown in FIG. 26C, the red light emitting layer 14R, the green light emitting layer 14G1, and the blue light emitting layer 14B are laminated on the hole transport layer 13. .

Thus, even when the green light emitting layer 14G1 is provided in each pixel (the organic light emitting layer of each color is provided in each pixel), the recombination position Dg of the organic laminated film 22G1 is set to the green light emitting layer 14G1, The recombination position Db of the organic laminated film 22B1 is formed in the blue light emitting layer 14B, and the recombination position Dr of the organic laminated film 22R1 is formed in the red light emitting layer 14R, respectively.

That is, the organic laminated film 22G1 in the pixel 20G1 has all the light emitting layers of three colors of the red light emitting layer 14R, the green light emitting layer 14G1, and the blue light emitting layer 14B as light emitting layers, and these light emitting layers As other organic layers, it has the hole transport layer 13, the green film thickness adjustment layer 21G, and the green electron block layer 15G. The organic laminated film 12B1 in the pixel 20B1 has all three light emitting layers as the light emitting layer, and as the organic layers other than these light emitting layers, the hole transport layer 13, the blue film thickness adjusting layer 21B, and the blue electrons It has a block layer 15G. The organic laminated film 12R1 in the pixel 20R1 has all three light emitting layers as a light emitting layer, and has the hole transport layer 13 as organic layers other than these light emitting layers.

As the entire display device 2A, the hole transport layer 13 is provided on the driving substrate 10 over the entire surface of the pixels 20R1, 20G1, and 20B1, and corresponds to the pixel 20G1 on the hole transport layer 13. The green film thickness adjustment layer 21G and the blue film thickness adjustment layer 21B are provided in the selective region corresponding to the pixel 20B1, respectively. On these green film thickness adjustment layers 21G and blue film thickness adjustment layers 21B, a red light emitting layer 14R is formed over the entire substrate. On the red light emitting layer 14R, a green electron blocking layer 15G is provided in an optional region corresponding to the pixel 10G1, and on this green electron blocking layer 15G, the green light emitting layer over the entire substrate. 14G1 is provided. The blue electron blocking layer 15B is provided in a selective region corresponding to the pixel 10B1 on the green light emitting layer 14G1, and the blue light emitting layer over the entire surface of the substrate is provided on the blue electron blocking layer 15B. 14B is provided.

In addition, such a display device 2A can be manufactured as follows, for example. That is, although not shown, the lower electrode 11, the rib 110, the hole transport layer 13, and the green color are used on the driving substrate 10 in the same manner as the display device 2 of the second embodiment. The film thickness adjusting layer 21G, the blue film thickness adjusting layer 21B, the red light emitting layer 14R, and the green electron blocking layer 15G are formed in this order. Thereafter, the green light emitting layer 14G1, the blue electron blocking layer 15B, and the blue light emitting layer 14B are formed in the same manner as in the display device 1A of the first modification. After forming the upper electrode 16 and the protective layer 17 in order on the organic laminated films 22R1, 22G1, and 22B1 formed in this way, it seals on the upper surface of the protective layer 17 via the adhesive layer 18. FIG. The substrate 19 is bonded. This completes the display device 2A shown in FIG. 25.

As in the present modification, even when the organic laminated film 22G1 has a green film thickness adjusting layer 21G and the organic laminated film 22B1 has a green film thickness adjusting layer 21B, respectively, the red light emitting layer 14R ) And the blue light emitting layer 14B as well as the green light emitting layer 14G1 can be formed as a layer common to each pixel. In other words, the green light emitting layer 14G1 may be formed by inclined deposition using the ribs 110, as described in the second embodiment. It is also possible to form a film by vapor deposition in the direction. In this way, even when all three color light emitting layers are formed on each pixel, the pixel 20G1 has the green electron block layer 15G and the pixel 20B1 has the blue electron block layer 15B, respectively. As described above, in each pixel, recombination of charges occurs in an appropriate layer, and it is easy to extract desired color light. Therefore, the effect equivalent to the said 1st, 2nd embodiment can be acquired.

As a numerical example of this modification, the following samples were produced and the light emission intensity of each color light of R, G, and B was measured. At this time, the width (pitch) of each pixel 10R1, 10G1, 10B1, the scale and constituent material of the lower electrode 11, the installation of the reflection mirror, the rib 110 scale, and the constituent material are the above-mentioned first embodiment. It carried out similarly to the numerical example in the form. Further, the constituent materials of the hole transport layer 13, the red light emitting layer 14R, the green light emitting layer 14G1, the blue light emitting layer 14B, the green electron blocking layer 15G, and the blue electron blocking layer 15B. , Film thickness, and film formation conditions were the same as in the numerical example in the first modification. In addition, in the film-forming process of 21G of green film thickness adjustment layers, the angular direction D1 of diagonal deposition was set to 73 degrees, and as a film-forming material, alpha-NPD was used and the film thickness was 84 nm. In addition, in the film-forming process of the blue film thickness adjustment layer 21B, the angular direction D2 of diagonal deposition was -73 degrees, and as a film-forming material, alpha-NPD was used and the film thickness was 35 nm. Further, on the blue light emitting layer 14B, the electron transporting layer having a film thickness of 35 nm made of BCP, the electron injection layer having a thickness of 0.3 nm made of LIF, and the upper electrode 16 having a film thickness of 12 nm made of an Mg-Ag co-deposited film. ) Were formed in this order. The measurement result of the display device 2A thus produced is shown in FIG. 27.

As shown in FIG. 27, each light emission of red light from the pixel 20R1, green light from the pixel 20G1, and blue light from the pixel 20B1 is obtained. Further, by setting as described above, an optical resonator structure is formed in each pixel between the Al mirror under the lower electrode 11 and the upper electrode 16, and the order of resonance is zero order, green. First, blue first.

<Third embodiment>

[Configuration of Display Device 3]

FIG. 28 shows a cross-sectional structure of the display device 3 according to the third embodiment of the present invention. The display device 3 is an organic EL display device of an active matrix type or a top emission type, for example, similarly to the display device 1 of the first embodiment, and each of the display devices 3 is organic on the driving substrate 10. It has three types of pixels 30R, 30G, and 30B made of EL elements. Hereinafter, about the component similar to the said 1st Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted suitably.

These pixels 30R, 30G, and 30B are connected to the lower electrode 11, the organic laminated films 32R, 32G, and 32B, and the upper electrode 16 in order from the side of the driving substrate 10, for example. In order. Similarly to the first embodiment, the ribs 110 are disposed between the pixels 30R and 30B and between the pixels 30R and 30G, and the protective layer 17 and the adhesive layer (on the upper electrode 16). 18) and a sealing substrate 19 are provided.

(Configuration of Organic Lamination Films 32R, 32G, 32B)

Each of the organic laminated films 32R, 32G, and 32B is one or more organic light emitting layers in the red light emitting layer 33R, the green light emitting layer 33G, and the blue light emitting layer 33B, as in the first embodiment. Another organic layer other than such an organic light emitting layer is laminated. Moreover, in these organic laminated films 32R, 32G, and 32B, the layer structure (number of layers, types, thickness, etc. of organic layers) of organic layers other than the said light emitting layer differs from each other.

29A to 29C show cross-sectional structures of the organic laminated films 32R, 32G, and 32B. In the organic laminated film 32R, as shown in FIG. 29A, on the hole transport layer 13, the red hole transport layer 31R, the red light emitting layer 33R, and the blue light emitting layer 33B are in this order. It is laminated as it is. As for the organic laminated film 32G, as shown in B of FIG. 29, on the hole transport layer 13, the green hole transport layer 31G, the green light emitting layer 33G, and the blue light emitting layer 33B are in this order. It is laminated as it is. The green hole transport layer 31G and the red hole transport layer 31R are made of, for example, the same material (hole transport material) as the hole transport layer 13 described above. In the organic laminated film 32B, as shown in FIG. 29C, the blue light emitting layer 14B is laminated on the hole transport layer 13.

As described above, in the present embodiment, the light emitting layer of one or more color lights is laminated on each of the organic laminated films 32R, 32G, and 32B. However, the recombination position Dg of the organic laminated film 32G is a green light emitting layer ( 33G), the recombination position Dr of the organic laminated film 32R is formed in the red light emitting layer 33R, and the recombination position Db of the organic laminated film 32B is formed in the blue light emitting layer 33B, respectively.

That is, the organic laminated film 32R in the pixel 30R has, as the light emitting layer, a red light emitting layer 33R and a blue light emitting layer 33B, and as the organic layers other than these light emitting layers, the hole transporting layer 13 and the red It has a 31-hole hole transport layer. The organic laminated film 32G in the pixel 30G has a green light emitting layer 33G and a blue light emitting layer 33B as a light emitting layer, and as an organic layer other than these light emitting layers, the hole transport layer 13 and the green hole It has a transport layer 31G. The organic laminated film 32B in the pixel 30B has the blue light emitting layer 33B as a light emitting layer, and has the hole transport layer 13 as organic layers other than this light emitting layer.

As the entire display device 3, the hole transport layer 13 is provided on the driving substrate 10 over the entire surface of the pixels 30R, 30G, and 30B. On the hole transport layer 13, in the pixel 30R, In the red hole transport layer 31R and the pixel 30G, the green hole transport layer 31G is provided, respectively. The blue light emitting layer 33B is formed over the entire surface of the pixels 30R, 30G, and 30B so as to cover the green hole transporting layer 31G and the red hole transporting layer 31R.

In this embodiment, among these color light emitting layers, the green light emitting layer 33G and the red light emitting layer 33R are formed extremely thin compared with the blue light emitting layer 33B.

[Manufacturing Method of Display Device 3]

The display device 3 as described above can be manufactured, for example, as follows. 30-32 is sectional drawing which shows the manufacturing method of the display apparatus 3 in process order.

First, in the same manner as in the first embodiment, after the lower electrode 11 is formed on the driving substrate 10, the ribs 110 are formed, and the pixel regions R, G, and The hole transport layer 13 is formed over the entire surface of (B). Thereafter, as shown in FIG. 30A, the red hole transporting layer 31R made of the above-described material is formed by gradient deposition using the rib 110. At this time, the pixel region R is exposed to the vapor deposition source, and the pixel regions G and B are deposited from the angular direction D1 which becomes the shade of the rib 110. In this manner, the red hole transport layer 31R is selectively formed in the pixel region R serving as the pixel 30R. As a result, the red hole transporting layer 31R is formed on the side surface of the rib 110 provided between the pixel regions G and B, on the side of the pixel region B side.

Subsequently, as shown in FIG. 30B, in the pixel region R, the red light emitting layer is overlapped on the red hole transport layer 31R in the pixel region R by gradient deposition using the ribs 110. 33R is formed. As a result, the red light emitting layer 33R is also formed on the side surface of the rib 110 provided between the pixel regions G and B on the side of the pixel region B side.

Subsequently, as shown in FIG. 31A, the green hole transport layer 31G made of the above-described material is formed by gradient deposition using the rib 110. At this time, the pixel region G is exposed to the vapor deposition source, and the pixel regions R and B are deposited from the angular direction D2 which becomes the shade of the rib 110. In this way, the green hole transport layer 31G is selectively formed in the pixel region G serving as the pixel 30G. As a result, the green hole transporting layer 31G is formed on the side surface of the rib 110 provided between the pixel regions R and B, on the side of the pixel region B side.

Subsequently, as shown in FIG. 31B, in the pixel region G, the green light emitting layer is overlapped on the green hole transport layer 31G in the pixel region G by gradient deposition using the ribs 110. To form 33G. As a result, the green light emitting layer 33G is also formed on the side surface of the rib 110 provided between the pixel regions R and B on the side of the pixel region B side.

Thereafter, as shown in FIG. 32A, the blue color is applied over the entire surface of the pixel regions R, G, and B by vacuum deposition in a direction substantially perpendicular to the driving substrate 10. The light emitting layer 33R is formed. As a result, the blue light emitting layer 33R is formed on the driving substrate 10 as a common layer in each pixel region. As a result of this, the blue light emitting layer 33R is also deposited on the upper surface of each rib 110. In this way, organic laminated films 32R, 32G, and 32B are formed in the pixel regions R, G, and B, respectively.

Thereafter, as shown in FIG. 32B, the upper electrode 16 is, for example, over the entire surface of the pixel regions R, G, and B similarly to the first embodiment. The film is formed by vacuum deposition or sputtering. As a result, the pixels 30R, 30G, and 30B are formed on the drive substrate 10.

Finally, the protective layer 17 is formed so as to cover the entire surface of the formed pixels 30R, 30G, and 30B in the same manner as in the first embodiment, and then, on the upper surface of the protective layer 17, an adhesive layer ( By bonding the sealing substrate 19 through 18, the display device 3 shown in FIG. 28 is completed.

[Operation and Effects of the Display Device 3]

In the display device 3 of the present embodiment, when a driving current corresponding to an image signal of each color is applied to each of the pixels 30R, 30G, and 30B, the lower electrode 11 and the upper electrode 16 are applied. Electrons and holes are injected into the organic laminated films 32R, 32G, and 32B. These electrons and holes are recombined in the red light emitting layer 33R, the green light emitting layer 33G, and the blue light emitting layer 33B in the pixels 30R, 30G, and 30B, respectively, to generate light of respective colors. In this manner, in the display device 3, full-color video display of R, G, and B is performed.

Here, also in the display device 3, in order to realize full-color video display similarly to the display device 1 of the first embodiment, patterning of each color emitting layer in the manufacturing process is performed by the rib 110. FIG. To use. Moreover, also in this embodiment, the organic laminated films 32R, 32G, and 32B contain one or more organic light emitting layers and other organic layers other than those, and the layer structure of the other organic layers differs for each kind of pixel. For example, as an organic layer other than an organic light emitting layer, the organic laminated film 32R includes the hole transport layer 13 and the red hole transport layer 31R, and the organic laminated film 32G includes the hole transport layer 13 and The green hole transport layer 31G is included, and the organic laminated film 32B includes the hole transport layer 13.

With this layer structure, in the pixel 30R, the recombination position Dr is formed in the red light emitting layer 33R due to the light emission energy mentioned above, and light emission of red light is obtained. Similarly, in the pixel 30G, the recombination position Dg is formed in the green light emitting layer 33G, and light emission of green light is obtained. In the pixel 30B, recombination occurs in the formed blue light emitting layer 33B, and light emission of blue light is obtained. Here, in the present embodiment, the red hole transport layer 31R and the green hole transport layer 31G are provided in the pixels 30R and 30G, whereby the red light emitting layer 33R and the green light emitting layer 33G are provided. It is possible to thin the film. For this reason, even if the red luminescent material and green luminescent material adhere to the pixel 30B in the film-forming process of the red luminescent layer 33R and the green luminescent layer 33G, the adhesion amount can be suppressed to a very small amount. Therefore, the influence of the mixed color by the adhesion of such a luminescent material can be suppressed to the minimum allowable range.

As described above, in the present embodiment, the organic laminated films 32R, 32G, and 32B provided between the lower electrode 11 and the upper electrode 16 include one or more light emitting layers and other organic layers other than the above. The layer structure in the organic layer is different for each of the pixels 30R, 30G, and 30B. For example, the green hole transport layer 31G is disposed at a predetermined position of the pixel 30G, and the red hole transport layer 31R is disposed at a predetermined position of the pixel 30R, respectively. Thereby, even when the organic light emitting material of a color different from its own color adheres to each pixel, the mixed color of the color light by the adhesion can be suppressed. Therefore, in the color display using a plurality of colors, it is possible to ensure good color purity.

<4th embodiment>

In the above embodiment and the like, the case where the lower electrode 11 functioning as the anode is provided so as not to cause a step with the surface (flattened film surface) of the driving substrate 10 has been described. Next, a suitable structural example in the case where occurrence of a step is unavoidable will be described. Here, the lower electrode 11 is disposed for each pixel on the flat surface of the drive substrate 10, and thereon, an inter-pixel insulating film (inter-pixel insulating film 42) having an opening facing the lower electrode 11 is formed. Take configuration as an example. In addition, also in this embodiment, illustration of the TFT and planarization film provided in the drive substrate 10 is abbreviate | omitted. In addition, only some components of the display device are shown.

33 shows the configuration of the substrate before the oblique deposition in this embodiment. In the present embodiment, the inter-pixel insulating film 42 is formed on the drive substrate 10 on which the lower electrode 11 is disposed. The organic layer 43 is formed using these lower electrodes 11 and the inter-pixel insulating film 42 as the base layer 41. The organic layer 43 is a layer formed by vapor deposition in the vertical direction, such as the above-mentioned hole transport layer or red light emitting layer. Although not shown in FIG. 33, also in this embodiment, each color light emitting layer or block layer is patterned for each pixel region by gradient deposition on the organic layer 43 in the same manner as the above embodiment, and the upper electrode ( 16), the protective layer 17, the contact bonding layer 18, and the sealing substrate 19 are provided in order.

The rib 110 is provided in the selective area between each pixel of R, G, and B according to a vapor deposition order and the color arrangement of a pixel similarly to the said embodiment. Here, the ribs 110 are disposed between the pixel regions S1 and S3 and the pixel regions S2 and S3 in the pixel regions S1 to S3 respectively corresponding to one of R, G, and B. That is, the ribs 110 are not disposed between the pixel regions S1 and S2 (for example, the pixel formation regions of G and B) to be subjected to the oblique deposition.

The inter-pixel insulating film 42 is an insulating film for electrically separating each pixel (light emitting region), and has openings H1 and H2 facing the lower electrode 11. The inter-pixel insulating film 42 is made of, for example, an organic insulating film such as polyimide, acrylic resin or novolac resin, or an inorganic insulating film such as silicon oxide (SiO _x ) or silicon nitride (SiN _x ). . The ribs 110 are disposed on the inter-pixel insulating film 42.

In the present embodiment, the thickness of the base layer 41 is toward the rib 110 side (as it approaches the rib 110) from the boundary B1 of the pixel regions S1 and S2 to be subjected to the oblique deposition. (Height) becomes larger step by step (it has step structures st1 and st2). Specifically, in the inter-pixel insulating film 42, the opening H1 is provided in common in the lower electrodes 11 of the pixel regions S1 and S2, that is, between the pixel regions S1 and S2 (the boundary). In the vicinity of (B1), the edge (end) of the lower electrode 11 is not covered with the insulating film, and the surface of the driving substrate 10 is also exposed. On the other hand, in the pixel region S3 (for example, the pixel formation region of R) which is not substantially subjected to oblique deposition, the opening H2 is provided so as to cover all of the edges of the lower electrode 11.

In this way, in the pixel regions S1 and S2 to be subjected to the oblique deposition, the thickness is gradually increased from the boundary B1 toward the ribs 110, so that vignetting at the oblique deposition as described below. This becomes difficult to occur, and the film thickness unevenness by vapor deposition can be reduced.

For example, as shown in FIGS. 34A and 34B, when the inter-pixel insulating film 42 ′ has an opening H1 for each lower electrode 11 (the lower electrode 11 in all the pixel regions). The case where the edge is covered by the inter-pixel insulating film 42 '). In this case, in the case of oblique deposition in the pixel region S1, vignetting is caused by the influence of the step X1 between the inter-pixel insulating film 42 'and the lower electrode 11, as shown in Fig. 34A. Occurs. For this reason, in the pixel region S1, a portion that becomes a thin film locally occurs on the lower electrode 11, and an organic material cannot be deposited with a uniform thickness. Alternatively, in the case of oblique deposition in the pixel region S2, vignetting occurs due to the influence of the step X2 between the inter-pixel insulating film 42 'and the lower electrode 11, as shown in Fig. 34B. . For this reason, also in the pixel area S2, organic material cannot be vapor-deposited on the lower electrode 11 with uniform thickness. In addition, the same phenomenon occurs even when the above-described oblique deposition process in the pixel regions S1 and S2 is continuously performed. As described above, when organic materials such as each color light emitting layer cannot be formed on the lower electrode 11 with a uniform film thickness, current may be concentrated in a local portion, or a desired light emission color may not be obtained.

On the other hand, in the present embodiment, as described above, in the inter-pixel insulating film 42, the opening H2 is commonly provided in both the pixel regions S1 and S2, and the ribs 110 are separated from the boundary B1. The stepped structures st1 and st2 are formed by changing the thickness of the base layer 41 in a stepwise manner. As a result, in the case of oblique deposition in the pixel region S1, as shown, for example, in FIG. 35A, a shadow is emitted from the deposition source (not shown) in which the organic material is emitted in the angular direction D1. No part is made. For this reason, in the pixel region S1, the organic material 44a can be deposited on the lower electrode 11 with a substantially uniform thickness. Alternatively, in the case of oblique deposition in the pixel region S2, as shown in B of FIG. 35, a portion that becomes a shadow does not occur with respect to a deposition source (not shown) in which organic materials are emitted along the angular direction D2. Do not. For this reason, in the pixel region S2, the organic material 44b can be deposited on the lower electrode 11 with a substantially uniform thickness. Therefore, at the time of oblique deposition, generation of vignetting can be suppressed, and an organic material can be formed with a substantially uniform thickness. Thereby, the effect equivalent to what was demonstrated by the said embodiment etc. (when each surface of the lower electrode 11 and the drive board 10 formed the same surface) can be acquired.

<Modification 3>

In the fourth embodiment, the edge of the lower electrode 11 is exposed in the pixel regions S1 and S2 to be subjected to the oblique deposition. For this reason, when the distance between adjacent pixels becomes very near, for example, when manufacturing a high precision organic electroluminescent display, a leak current generate | occur | produces through organic layers, such as a light emitting layer, between pixel areas S1 and S2. It is thought too. Since such a leak current affects light emission characteristics, it is preferable to be suppressed as much as possible.

Therefore, as shown in FIG. 36, the leak prevention insulating film 45 may be provided in the vicinity of the boundary B1 between the pixel regions S1 and S2. The leak prevention insulating film 45 is an insulating rib (protrusion), for example, and is comprised by the same material as the inter pixel insulation film 42, for example. The leak prevention insulating film 45 is set so that its aspect ratio (ratio of thickness and width) is set so that the area | region which becomes dead-angle on the boho lower electrode 11 from a vapor deposition source side is not formed. It is preferable. This is to prevent the influence of vignetting caused by the leak prevention insulating film 45 from falling on the lower electrode 11. Such a leak prevention insulating film 45 can also be patterned in the same process as the inter-pixel insulating film 42, for example.

As a result, also in the present modification, when the vapor deposition is carried out in the pixel region S1, as shown, for example, in FIG. 37A, a deposition source (not shown) that emits an organic material along the angular direction D1. For the part that does not become a shadow occurs. For this reason, in the pixel region S1, the organic material 46a can be deposited on the lower electrode 11 with a substantially uniform thickness. Alternatively, in the case of oblique deposition in the pixel region S2, as shown in B of FIG. 35, a portion that becomes a shadow does not occur with respect to a deposition source (not shown) in which organic materials are emitted along the angular direction D2. Do not. For this reason, in the pixel region S2, the organic material 46b can be deposited on the lower electrode 11 with a substantially uniform thickness. Therefore, at the time of oblique deposition, generation of vignetting can be suppressed, and an organic material can be formed with a substantially uniform thickness. In addition, in this modification, since the leak prevention insulating film 45 is provided between pixel area S1, S2, generation | occurrence | production of the leakage current between pixel area S1, S2 can be suppressed, and light emission characteristic Can prevent deterioration.

In addition, in the said modification 3, although the leak prevention insulating film 45 (rib) was provided between pixel area S1, S2, it will not be specifically limited to a rib as long as it is a structure by which insulation between pixels is attained. For example, a groove may be formed in a range that does not affect the patterning of the organic material, or a structure made of an insulating material different from the inter-pixel insulating film 42 may be provided.

<Modification 4>

FIG. 38 shows a substrate configuration according to a modification (modification 4) of the fourth embodiment. In this modification, the insulating film 42a is formed to fill the gap between the rib 110 and the lower electrode 11. Stepped structures st1 and st2 are formed on the drive substrate 10 by these insulating films 42a and the lower electrodes 11. The insulating film 42a is made of, for example, an organic insulating film such as polyimide, acrylic resin or novolac resin, or an inorganic insulating film such as silicon oxide or silicon nitride.

In this way, the insulating film 42a may be formed so as to fill the gap between the rib 110 and the lower electrode 11, and even in this case, an effect equivalent to that of the fourth embodiment can be obtained.

In addition, although the case where the lower electrode 11 and the rib 110 isolate | separated and was provided in the said modification 4, as shown in FIG. 39, these may be arrange | positioned adjacently. In this case, the stepped structure st1 can be formed by forming the insulating film 42a in the corner portion adjacent to the lower electrode 11 and the rib 110.

[Overall Configuration of Pixels 1 to 3, Pixel Circuit Configuration]

Next, the overall configuration and the pixel circuit configuration of the display devices 1 to 3 according to the first to third embodiments will be described. 40 shows the overall configuration including the peripheral circuit of the display device used as the organic EL display. In this manner, for example, on the driving substrate 10, a display region 30 in which a plurality of pixels PXLC including organic EL elements are arranged in a matrix form is formed, and is formed around the display region 30. A horizontal selector (HSEL) 31 as a signal line driver circuit, a light scanner (WSCN) 32 as a scan line driver circuit, and a power scanner (DSCN) 33 as a power line driver circuit are provided.

In the display area 30, a plurality of (n integer) signal lines DTL1 to DTLn are arranged in the column direction, and a plurality of (m integer) scan lines WSL1 to WSLm and a power supply line (in the row direction). DSL1 to DSLm) are disposed respectively. Further, each pixel PXLC (any one of pixels corresponding to R, G, and B) is provided at the intersection of each signal line DTL and each scan line WSL. Each signal line DTL is connected to a horizontal selector 31 so that a video signal is supplied to each signal line DTL from the horizontal selector 31. Each scanning line WSL is connected to the light scanner 32, and a scanning signal (selection pulse) is supplied to each scanning line WSL from this light scanner 32. As shown in FIG. Each power supply line DSL is connected to a power supply scanner 33, and a power signal (control pulse) is supplied from the power supply scanner 33 to each power supply line DSL.

41 illustrates an example of a specific circuit configuration of the pixel PXLC. Each pixel PXLC has a pixel circuit 40 including an organic EL element 3D. This pixel circuit 40 is an active drive circuit having a sampling transistor 3A and a driving transistor 3B, a storage capacitor element 3C, and an organic EL element 3D.

The sampling transistor 3A has its gate connected to a corresponding scan line WSL, one of its source and drain is connected to a corresponding signal line DTL, and the other has a gate of the driving transistor 3B. Is connected to. The driving transistor 3B has a drain connected to a corresponding power supply line DSL, and a source connected to an anode of the organic EL element 3D. Moreover, the cathode of this organic EL element 3D is connected to the ground wiring 3H. This ground wiring 3H is wired in common to all the pixels PXLC. The storage capacitor 3C is disposed between the source and the gate of the driving transistor 3B.

The sampling transistor 3A conducts in accordance with the scanning signal (selection pulse) supplied from the scanning line WSL to sample the signal potential of the video signal supplied from the signal line DTL, and the storage capacitor 3C To preserve. The driving transistor 3B receives a current from a power supply line DSL set at a predetermined first potential (not shown), and generates a driving current in response to the signal potential stored in the storage capacitor 3C. It supplies to the element 3D. The organic EL element 3D emits light with luminance corresponding to the signal potential of the video signal by the driving current supplied from the driving transistor 3B.

In such a circuit configuration, the sampling transistor 3A according to the scanning signal (selection pulse) supplied from the scanning line WSL conducts, so that the signal potential of the video signal supplied from the signal line DTL is sampled and stored. It is stored in the capacitor 3C. In addition, a current is supplied from the power supply line DSL set at the first potential to the driving transistor 3B, and the driving current is generated in response to the signal potential stored in the storage capacitor 3C. Red, green, and blue organic EL elements). Each organic EL element 3D emits light with luminance corresponding to the signal potential of the video signal by the supplied driving current. As a result, the display device performs video display based on the video signal.

<Red application example>

Hereinafter, a red application example to the electronic device of the display devices 1 to 3 as described above will be described. The display devices 1 to 3 can be red for electronic devices in all fields such as television devices, digital cameras, notebook personal computers, portable terminal devices such as mobile phones, or video cameras. In other words, the display devices 1 to 3 can redistribute video signals input from the outside or internally generated video signals to electronic devices in all fields that display as images or images.

(module)

The display device is, for example, a module as shown in Fig. 35, and is assembled to various electronic devices such as red applications 1 to 5 described later. The module provides, for example, a region 210 exposed from the sealing substrate 50 on one side of the substrate 10, and the horizontal selector 31 and the light in the exposed region 210. The wiring of the scanner 32 and the power scanner 33 is extended to form an external connection terminal (not shown). This external connection terminal may be provided with a flexible printed wiring board (FPC) 220 for inputting and outputting signals.

(Red application example 1)

36 shows the appearance of a television apparatus. This television device has a video display screen unit 300 including, for example, a front panel 310 and a filter glass 320, and the video display screen unit 300 is a display device 1 to 3. Corresponds to

(Red example 2)

37 shows the appearance of a digital camera. This digital camera has, for example, a light emitting unit 410 for flash, a display unit 420, a menu switch 430, and a shutter button 440. The display unit 420 includes display devices 1 to 3. Corresponds to).

(Red Example 3)

38 shows the appearance of a notebook personal computer. This notebook personal computer has, for example, a main body 510, a keyboard 520 for input operation such as characters, and a display unit 530 for displaying an image, and the display unit 530 is a display device 1. To 3).

(Red Application 4)

39 shows the appearance of a video camera. For example, the video camera includes a main body 610, a lens 620 for photographing a subject provided on the front side of the main body 610, a start / stop switch 630 and a display 640 at the time of shooting. Have This display portion 640 corresponds to the display devices 1 to 3.

(Red example 5)

40 shows the appearance of a mobile phone. The mobile phone is, for example, the upper body 710 and the lower body 720 is connected by a connecting portion (hinge) 730, the display 740, the sub display 750, the picture light 760 and It has a camera 770. The dual display 740 or the sub display 750 corresponds to the display devices 1 to 3.

As mentioned above, although this invention was demonstrated based on embodiment and a modification, this invention is not limited to these embodiment, A various deformation | transformation is possible for it. For example, in the above embodiment and the like, a case where an electron block layer having an electron blocking function is used as the carrier block layer of the present invention has been described as an example, but not limited to this, a hole block layer having a hole block function May be used.

In addition, although the above-mentioned embodiment demonstrated the case where diagonal deposition is performed using protrusion members, such as a rib, it does not necessarily need to form such a protrusion member on a board | substrate, and responds to a vapor deposition direction. It is good to use a shadow mask which can mask a specific pixel area.

In the above embodiment, as an example of organic layers other than the organic light emitting layer, an example in which an electron blocking layer or a film thickness adjusting layer is provided in selective pixels of three types of pixels of R, G, and B has been described. The pixel providing the layer of is not limited to the above-mentioned thing, and may be provided in all the pixels.

In addition, the organic laminated film in this invention is not limited to the organic laminated film demonstrated in the said embodiment etc., and may be provided with the other layer further.

Claims (20)

On the substrate, it has a plurality of types of pixels emitting different color light,
Each of the pixels,
An organic laminated film comprising at least one organic light emitting layer and another type of organic layer, wherein the layer structure of the different type of organic layer is different for each type of pixel;
And a first electrode and a second electrode sandwiching the organic laminated film. The method of claim 2,
A projection-shaped member is disposed in a selective region between the plurality of types of pixels. The method of claim 2,
The plurality of types of pixels are red pixels, green pixels, and blue pixels,
As the organic laminated film,
The red pixel includes a red light emitting layer and a blue light emitting layer,
The green pixel includes a red light emitting layer, a green light emitting layer and a blue light emitting layer, and a green carrier block layer.
The blue pixel includes a red light emitting layer, a blue light emitting layer, and a blue carrier block layer. The method of claim 3,
In turn from the substrate side,
The first electrode disposed for each pixel;
A red light emitting layer commonly provided in the red pixel, the green pixel, and the blue pixel;
A green carrier block layer and a green light emitting layer selectively disposed on the green pixel;
A blue carrier block layer selectively disposed on the blue pixel;
A blue light emitting layer commonly provided in the red pixel, the green pixel, and the blue pixel;
And a second electrode common to the red pixel, the green pixel, and the blue pixel. The method of claim 3,
The red pixel, the green pixel, and the blue pixel each have an optical resonator structure including the first electrode, the second electrode, and the organic stacked layer.
A display device, characterized in that a film thickness adjusting layer is provided as a part of the organic laminated film in a selective pixel among the red pixel, the green pixel, and the blue pixel. The method of claim 5,
In order from the substrate side,
The first electrode disposed for each pixel;
A green film thickness adjusting layer selectively disposed on the green pixel and a blue film thickness adjusting layer selectively disposed on the blue pixel;
A red light emitting layer commonly provided in the red pixel, the green pixel, and the blue pixel;
A green carrier block layer and a green light emitting layer selectively disposed on the green pixel;
A blue carrier block layer selectively disposed on the blue pixel;
A blue light emitting layer commonly provided in the red pixel, the green pixel, and the blue pixel;
And a second electrode common to the red pixel, the green pixel, and the blue pixel. The method of claim 6,
The green film thickness adjusting layer and the blue film thickness adjusting layer are made of a hole transporting material. The method of claim 3,
And the green carrier block layer and the blue carrier block layer are made of a hole transport material. The method of claim 2,
The plurality of types of pixels are red pixels, green pixels, and blue pixels,
As the organic laminated film,
The red pixel includes a red light emitting layer, a green light emitting layer, and a blue light emitting layer,
The green pixel includes a red light emitting layer, a green light emitting layer and a blue light emitting layer, and a green carrier block layer.
The blue pixel includes a red light emitting layer, a green light emitting layer and a blue light emitting layer, and a blue carrier block layer. 10. The method of claim 9,
In turn from the substrate side,
The first electrode disposed for each pixel;
A red light emitting layer provided in common to the red pixel, the green pixel, and the blue pixel;
A green carrier block layer selectively disposed on the green pixel;
A green light emitting layer provided in common to the red pixel, the green pixel, and the blue pixel;
A blue carrier block layer selectively disposed on the blue pixel;
A blue light emitting layer provided in common to the red pixel, the green pixel, and the blue pixel;
And a second electrode provided in common with the red pixel, the green pixel, and the blue pixel. The method of claim 2,
In turn from the substrate side,
The first electrode disposed for each pixel;
A green hole transport layer and a green light emitting layer selectively disposed on the green pixel;
A red hole transport layer and a red light emitting layer selectively disposed on the red pixel;
A blue light emitting layer commonly provided in the red pixel, the green pixel, and the blue pixel;
A second electrode commonly provided in the red pixel, the green pixel, and the blue pixel;
A film thickness of the green light emitting layer and the red light emitting layer is formed thinner than the blue light emitting layer. The method of claim 2,
While the substrate is a drive substrate planarized by an insulating film, the first electrode is disposed for each pixel,
The first electrode is provided such that its surface is flush with the surface of the insulating film, or
And the first electrode is provided below the organic layer, and the thickness of the underlayer including the first electrode is increased stepwise as the protruding member approaches. When forming a plurality of types of pixels emitting different color light on the substrate,
In each pixel area,
Forming a first electrode on the substrate;
Forming at least one organic light emitting layer and another type of organic layer or organic layers, wherein the layer structure of the other type of organic layer or organic layers is different for each type of pixel;
And forming a second electrode after the organic laminated film is formed. The method of claim 13,
Protruding members are formed in selective regions between the plurality of types of pixels,
A part of said organic laminated film is formed by diagonal deposition using the said projection member, The manufacturing method of the display apparatus characterized by the above-mentioned. The method of claim 14,
In the step of forming the organic laminated film,
Forming a red light emitting layer over all regions of the red pixel, the green pixel, and the blue pixel;
After forming the red light emitting layer, forming a green carrier block layer in a region of the green pixel by oblique deposition;
Forming a green light emitting layer on the green carrier block layer by gradient deposition;
After forming the green light emitting layer, selectively forming a blue carrier block layer in the region of the blue pixel by gradient deposition;
And forming a blue light emitting layer over all the regions of the red pixel, the green pixel, and the blue pixel after the blue carrier block layer is formed. 16. The method of claim 15,
In the step of forming the organic laminated film,
Before forming the red light emitting layer,
Forming a green film thickness adjusting layer in a region of the green pixel by oblique deposition;
And forming a blue film thickness adjustment layer in a region of the blue pixel by oblique deposition. The method of claim 14,
In the step of forming the organic laminated film,
Forming a red light emitting layer over all regions of the red pixel, the green pixel, and the blue pixel;
After forming the red light emitting layer, forming a green carrier block layer in a region of the green pixel by oblique deposition;
After forming the green carrier block layer, forming a green light emitting layer over all regions of the red pixel, the green pixel, and the blue pixel;
After the green light emitting layer is formed, selectively forming a blue carrier block layer in the region of the blue pixel by gradient deposition;
And forming a blue light emitting layer over all regions of the red pixel, the green pixel, and the blue pixel after forming the blue carrier block layer. The method of claim 14,
In the step of forming the organic laminated film,
Forming a green hole transporting layer in a region of the green pixel by gradient deposition;
Forming a green light emitting layer on the green hole transport layer;
Forming a red hole transporting layer in the region of the red pixel by oblique deposition;
Forming a red light emitting layer on the red hole transport layer;
Forming the green light emitting layer and the red light emitting layer, and then forming a blue light emitting layer over all regions of the red pixel, the green pixel, and the blue pixel;
The film thickness of the said green light emitting layer and the red light emitting layer is formed thinner than the said blue light emitting layer, The manufacturing method of the display apparatus characterized by the above-mentioned. The method of claim 18,
And after forming the green light emitting layer, the step of forming the red hole transporting layer and the step of forming the red light emitting layer are performed. On the substrate, it has a plurality of types of pixels emitting different color light,
The plurality of types of pixels are each,
An organic laminated film comprising at least one organic light emitting layer and another type of organic layer, wherein the layer structure of the different type of organic layer is different for each type of pixel;
An electronic device comprising a display device having a first electrode and a second electrode sandwiching the organic laminated film.

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