KR20120045994A - Encapsulant for optoelectronic device - Google Patents

Abstract

PURPOSE: A filling material for a photoelectron device is provided to improve profitability and workability of a manufacturing process by increasing combining strength with respect to a glass substrate. CONSTITUTION: A filling material(14) for a photoelectron device comprises an olefine resin and a basic hydrolysis catalyst. The olefine resin includes a hydrolyzable group or a reactive group which is a hydrolysate of the hydrolyzable group. A remaining amount of a catalyst is 1 to 50000 ppm. The hydrolysable group is comprised of a halogen atom, an alkoxy group, an acyloxy group, an alkylthio group, or an alkyleneoxythio group.

Description

Filler for optoelectronic devices {Encapsulant for optoelectronic device}

The present invention relates to a filling material for an optoelectronic device, an optoelectronic device, a solar cell module and a manufacturing method of the optoelectronic device.

An optoelectronic device, such as a photovoltaic cell, a light emitting diode (LED), or an organic light emitting diode (OLED), may include an encapsulant encapsulating a light emitting portion or a light sensing portion.

For example, a solar cell module is usually manufactured by laminating a transparent front substrate, a filler, a photovoltaic element, a filler, and a back sheet, which are light receiving substrates, and then heating and compressing the laminate with vacuum suction.

As the filler, EVA (ethylene-vinyl acetate) resin is most often used in view of processability, workability and cost.

However, since EVA resin has low adhesive strength with a front substrate, a back sheet, etc., when an optoelectronic device is exposed to the outdoors for a long time, peeling occurs easily between layers. In addition, in the modularization process of manufacturing a device using a filler including an EVA resin, the EVA resin may be thermally decomposed depending on the heat compression conditions, and acetic acid gas may be generated. Such an acetic acid gas not only deteriorates the working environment, but also adversely affects the optoelectronic elements or electrodes included in the optoelectronic device, and also causes the deterioration of the device and the deterioration of efficiency.

An object of the present invention is to provide a filling material for an optoelectronic device, an optoelectronic device, a solar cell module and a manufacturing method of the optoelectronic device.

The present invention is an olefin resin containing a hydrolyzable group or a reactive group which is a hydrolyzate of the hydrolyzable group; And a basic hydrolysis catalyst, wherein the remaining amount of the hydrolysis catalyst after modularization relates to an encapsulant for optoelectronic device.

Hereinafter, the filler of the present invention will be described in more detail.

The filler is an olefin resin (hereinafter sometimes referred to as a "modified olefin resin") in which a hydrolyzable group is introduced into the main chain, the side chain, or the terminal, or in which a monomer having a hydrolyzable group is grafted. It can be prepared using a composition comprising a decomposition catalyst.

The hydrolyzable group may be converted into a reactive group by the action of a basic hydrolysis catalyst in the process of filling or modularization. The term "reactive group" means a functional group which is included in an optoelectronic device and capable of physical or chemical interaction with a surface which is in contact with the filler, for example, a glass substrate.

The hydrolyzable group and reactive group which the said olefin resin has play an important role in forming an appropriate crosslinked structure in a filler, and ensuring adhesiveness with the component of an optoelectronic device. The basic hydrolysis catalyst may be converted into a reactive group at an appropriate ratio of the modified olefin resin into which a hydrolyzable group is introduced, in a process of preparing a filler or a modular process of forming a photovoltaic device using the prepared filler. It is controlled by the residual amount of basic hydrolysis catalyst in the filler after the modularization. Theoretically, since the catalyst maintains its original state after completion of the hydrolysis reaction of the hydrolyzable group, it can be considered that the amount of the catalyst blended when preparing the initial filler is maintained even after the modularization. However, in actual production of the filler and in the process of modularization, the mixed catalyst may be lost or the chemical structure or properties may be changed in the process of contributing to the hydrolysis reaction. The amount of the catalyst is not necessarily identical, and therefore it is difficult to design the filler of the desired physical property only by considering the amount of the catalyst in the filler. In the case of the filler, it is possible to control the remaining amount of the basic hydrolysis catalyst after modularization, to impart an appropriate crosslinked structure in the filler, and to effectively maintain physical properties such as adhesion.

As used herein, the term "residual amount of basic hydrolysis catalyst after modularization" refers to the amount of residual catalyst measured for the filler after encapsulating an optoelectronic device using the filler and manufacturing an optoelectronic device. For example, when the filler is applied to the solar cell module, the remaining amount is after the module is manufactured by laminating the filler, the light receiving substrate, the back sheet, and the photovoltaic device, and thermally compressing the filler. It may be a residual amount of the catalyst measured for. In the present invention, the remaining amount of the basic hydrolysis catalyst after the above-mentioned modularization is 1 ppm to 50,000 ppm, preferably 3 ppm to 10,000 ppm, more preferably 10 ppm to 10,000 ppm, even more preferably 50 ppm to 7,000 ppm More preferably, it may be 300 ppm to 6,000 ppm, and in this range, it is possible to maintain an appropriate crosslinked structure in the filler after the modularization, and to maintain excellent adhesiveness with components of the module and the like. The residual amount of the catalyst is a value measured by HPLC (High-performance liquid chromatography) after the modularization, as will be described later.

The type of the hydrolyzable group is. The hydrolysis reaction is not particularly limited as long as it can produce a reactive group. For example, the hydrolyzable group may be a halogen atom, an alkoxy group, an aryloxy group, an acyloxy group, an alkylthio group or an alkyleneoxythio group. In this case, examples of the halogen atom include chlorine (Cl), and examples of the alkoxy group include an alkoxy group having 1 to 20 carbon atoms, 1 to 12 carbon atoms, 1 to 8 carbon atoms or 1 to 4 carbon atoms, Examples of the aryloxy group include an aryloxy group having 6 to 12 carbon atoms, and examples of the acyloxy group include an acyloxy group having 1 to 12 carbon atoms. Examples of the alkylthio group include alkylthio having 1 to 12 carbon atoms. A group is mentioned, As an example of an alkyleneoxythio group, a C1-C12 alkyleneoxythio group is mentioned. The hydrolyzable group may be preferably alkoxy, specifically, an alkoxy group having 1 to 12 carbon atoms, preferably 1 to 8 carbon atoms, and more preferably 1 to 4 carbon atoms. As such alkoxy group, a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, butoxy group is mentioned, Preferably a methoxy group or an ethoxy group is mentioned. In addition, the type of the reactive group is determined according to the type of the hydrolyzable group, and is not particularly limited, and may be, for example, a hydroxy group.

The kind of the olefin resin including the hydrolyzable group as described above is not particularly limited, but may be, for example, a silane-modified olefin resin. The term "silane-modified olefin resin" means an olefin resin in which a silane compound is contained in a copolymerized unit or grafted.

In one example, the olefin resin is a copolymer comprising an α olefin and a silane compound represented by Chemical Formula 1 as a polymer unit; Or a graft polymer grafted with a silane compound of Formula 1 to a polyolefin.

[Formula 1]

DSi (X) _m Y _(3-m)

In Formula 1, D represents alkenyl, X represents a hydrolyzable group bonded to a silicon atom or a reactive group thereof, Y represents a non-hydrolyzable group bonded to a silicon atom, and m represents an integer of 1 to 3. Indicates.

In Formula 1, the alkenyl group may be, for example, vinyl, allyl, propenyl, isopropenyl, butenyl, hexenyl, cyclohexenyl or octenyl, and preferably vinyl.

In addition, in Chemical Formula 1, X may be a hydrolyzable group or a hydrolyzate thereof as described above.

In addition, examples of the non-hydrolyzable moiety represented by Chemical Formula 1 include hydrogen, an alkyl group, an aryl group, an aralkyl group, and the like. In the above, the alkyl group may be, for example, an alkyl group having 1 to 12 carbon atoms, 1 to 8 carbon atoms or 1 to 4 carbon atoms. The aryl group in Y may be an aryl group having 6 to 12 carbon atoms, for example, a phenyl group, and the aralkyl group may be an aralkyl having 7 to 12 carbon atoms, for example, a benzyl group.

In addition, in Formula 1, m is an integer of 1 to 3, preferably 3 may be.

Specific examples of the unsaturated silane compound represented by Formula 1 include vinyltrimethoxy silane, vinyltriethoxy silane, vinyltripropoxy silane, vinyltriisopropoxy silane, vinyltributoxy silane, vinyltripentoxy silane, and vinyltriphenoxy Cysilane, vinyl triacetoxy silane, etc. are mentioned, It is preferable to use a vinyl trimethoxy silane or a vinyl triethoxy silane, but it is not limited to this.

Moreover, as an example of the alpha olefin which can comprise a copolymer above or the polyolefin of a graft polymer, ethylene, propylene, 1-butene, isobutylene, 1-pentene, 2-methyl-1- butene, 3 -Methyl-1-butene, 1-hexene, 1-heptane, 1-octene, 1-nonene or 1-decene may be one kind or two or more, preferably ethylene, and examples of the polyolefin, The resin may include the same α olefin in a polymerized form, but is not limited thereto.

The olefin resin is 0.1 to 10 parts by weight, preferably 0.5 to 5.0 parts by weight of the silane compound, based on 100 parts by weight of α olefin in the case of a copolymer and 100 parts by weight of polyolefin in the case of a graft polymer. It can be included as a wealth. Unless otherwise specified, in the present specification, the unit "parts by weight" means a weight ratio. In this range, the filler may exhibit excellent adhesion after modularization.

The olefin resin may be preferably a graft polymer obtained by grafting a silane compound of Formula 1 to a polyolefin. In the above, the polyolefin may be polyethylene. In the present invention, polyethylene is a resin comprising ethylene in a polymerized form, a homopolymer of ethylene; Or a copolymer comprising ethylene as the main component in a polymerized form and further including other comonomers in a polymerized form. Specifically, the polyethylene may be, for example, one or more kinds of low density polyethylene, medium density polyethylene, high density polyethylene, ultra low density polyethylene, ultra low density polyethylene, or linear low density polyethylene.

Polyethylene having many side chains may be used as the polyethylene to which the silane compound is grafted. For polyethylene with many side chains, grafting can be made more efficient. Usually, polyethylene with many side chains is low in density, and polyethylene with few side chains is high in density. That is, in the present invention, it is preferable to use polyethylene of low density, for example, the density is 0.85 g / cm ³ to 0.96 g / cm ³ , and preferably the density is about 0.85 g / cm ³ to 0.92 g / cm ³ . Polyethylene can be used.

In addition, the polyethylene has a MFR (Melt Flow Rate) at 190 ° C of about 0.1 g / 10 minutes to about 50 g / 10 minutes, preferably about 10 g / 10 minutes to 50 g / 10 minutes, more preferably About 1.0 g / 10 minutes to 30 g / 10 minutes. In this MFR range, the filler may exhibit excellent moldability and adhesion.

The filler may include a basic hydrolysis catalyst, and such a catalyst may induce a hydrolysis reaction of the hydrolyzable group in the preparation or modularization of the filler. In the present invention, by using a basic hydrolysis catalyst and adjusting the remaining amount after the modularization, the degree of hydrolysis is effectively controlled, and also the undesirable reaction of the catalyst with other components of the filler is suppressed, and the adhesiveness of the filler is reduced. While securing the other properties can also be excellently maintained.

Examples of the basic hydrolysis catalyst include one or more kinds of organic amine compounds, nitrogen-based heterocyclic compounds, metal hydroxides, metal amides, and the like. Examples of the organic amine compound may include alkylamine or dialkylamine, and specifically, alkylamine or dialkylamine having an alkyl group having 1 to 12 carbon atoms, 1 to 8 carbon atoms, or 1 to 4 carbon atoms. More specifically, ethylamine, hexylamine, n-propylamine or dibutylamine. In addition, the nitrogen-based heterocyclic compound is a hydrocarbon ring compound containing nitrogen as the ring-constituting hetero atom, and specific examples thereof include pyridine. In addition, examples of the metal hydroxide may include NaOH, KOH, RbOH or CsOH, and examples of the metal amide may include NaNH ₂ , KNH ₂ , RbNH _2, or CsNH ₂ , but are not limited thereto. In the present invention, it is preferable to use an organic amine compound, preferably an alkyl amine or a dialkyl amine having an alkyl group having 1 to 20 carbon atoms in the catalyst.

In the filler of the present invention, the content of the basic hydrolysis catalyst is not particularly limited and may be adjusted in a range capable of exhibiting the remaining amount as described above after the modularization.

The filler of the present invention may further include one or more additives selected from light stabilizers, UV absorbers, heat stabilizers, and the like as necessary.

The light stabilizer may serve to prevent photooxidation by capturing active species of photodegradation initiation of the olefin resin depending on the use to which the filler of the present invention is applied. The kind of light stabilizer that can be used in the present invention is not particularly limited, and for example, a known compound such as a hindered amine compound or a hindered piperidine compound can be used.

In addition, the UV absorber may play a role of absorbing ultraviolet rays from sunlight or the like, converting them into harmless thermal energy in the molecule, and preventing the active species of photodegradation initiation in the olefin resin depending on the use of the filler. Can be. The specific kind of UV absorber that can be used in the present invention is not particularly limited, and for example, benzophenone, benzotriazole, acrylonitrile, metal complex salt, hindered amine, ultrafine titanium oxide or ultrafine zinc oxide, etc. One kind or a mixture of two or more kinds such as inorganic UV absorbers may be used.

In addition, examples of the heat stabilizer that can be used include tris (2,4-di-tert-butylphenyl) phosphite and bis [2,4-bis (1,1-dimethylethyl) -6-methylphenyl] ethyl ester phosphorous acid , Tetrakis (2,4-di-tert-butylphenyl) [1,1-biphenyl] -4,4'-diylbisphosphonate and bis (2,4-di-tert-butylphenyl) pentaerythritoldipo Phosphorus thermal stabilizers such as spikes; Lactone system thermal stabilizers, such as the reaction product of 8-hydroxy-5,7-di-tert- butyl-furan- 2-one and o-xylene, are mentioned, One or more types of the above can be used.

In the filler, the content of the light stabilizer, UV absorber and / or heat stabilizer is not particularly limited. That is, the content of the additive may be appropriately selected in consideration of the use of the resin composition, the shape or density of the additive, and the like, and may be appropriately adjusted within the range of 0.01 wt% to 5 wt% in the filler.

In addition to the above components, the filler may further appropriately include various additives known in the art, depending on the application applied.

The shape of the filler as described above is not particularly limited, and may be, for example, sheet or film. In this case, the film thickness of the filler may be adjusted to about 10 μm to 2,000 μm, preferably about 100 μm to 1250 μm, in consideration of the support efficiency and the possibility of breakage of the device, the weight reduction and workability of the device, and the like. However, the film thickness of the filler may be changed depending on the specific use applied.

The method for producing the filler is not particularly limited. For example, the filler may include preparing a composition including an olefin resin having a hydrolyzable group introduced therein; And it may be prepared by a method comprising the step of molding the composition into a film or sheet shape.

The method for producing the olefin resin into which the hydrolyzable group is introduced in the reactor is not particularly limited. For example, the said olefin resin mixes (alpha) olefin, the unsaturated silane compound as mentioned above, and other copolymerizable monomer in the heat-melted state in the reactor as needed, and it is suitable radical polymerization initiator under predetermined temperature and pressure. If necessary, it may be prepared by copolymerization simultaneously or stepwise in the presence of a chain transfer agent. In addition, such an olefin resin can be prepared by mixing the olefin resin and the unsaturated silane compound as described above in a molten state in a reactor and grafting the unsaturated silane compound to the olefin resin in the presence of a suitable radical generator. It may be.

In one example, a method of preparing a composition including the olefin resin may include mixing an olefin resin, a silane compound of Formula 1 and a radical generator in a reactor, and grafting the silane compound to an olefin resin; And it may include the step of mixing, by adding a hydrolysis catalyst into the same reactor.

The kind of the reactor in which the olefin resin is produced is not particularly limited as long as it can produce the desired resin by reacting the reactant in a hot melt or liquid state. For example, the reactor may be a cylinder with an extruder or a hopper. In the case of using such a reactor, for example, a liquid silane compound and a radical generator are added to a heat-melted olefin resin through an extruder and extruded, or an olefin resin, a radical generator and a silane compound are mixed in a hopper. After the addition, the mixture may be heated and melted in a cylinder to react to prepare an olefin resin.

In the above method, as described above, the hydrolysis catalyst can be introduced into or before the formation of the olefin resin into the reactor in which the olefin resin is produced. In this case, the hydrolysis catalyst as well as the ultraviolet absorber, the heat stabilizer or the light stabilizer can be introduced. Other additives, such as these, can also be added together. Thus, by simultaneously performing the production of the olefin resin and mixing with the additive in one reactor, the process can be simplified.

In the above, the hydrolysis catalyst and / or other additives may be introduced into the reactor as it is or mixed in a form of a master batch. In the above, the master batch refers to a pellet-shaped raw material in which the additives to be added are concentrated and dispersed at a high concentration, and in particular, in processing and molding plastic raw materials by extrusion or injection method, a specific function is applied to the finished product. Used to introduce additives.

The method of injecting an additive such as a hydrolysis catalyst into the reactor in which the olefin resin is formed is not particularly limited. For example, a side feeder may be installed at an appropriate position of an extruder or a cylinder, and the feeder may be The method of inject | pouring the additive of a masterbatch form, or the method of mixing by mixing with an olefin resin etc. in a hopper can be used.

In the above method, the specific kind and design of the reactor, the conditions such as the heating and melting, the mixing or the temperature and time of the reaction, the kind of the radical generator and the manufacturing method of the master batch are not particularly limited. May be appropriately selected.

In addition, the method of molding the obtained composition into a sheet or film shape after the above process is not particularly limited, and for example, a conventional filming or sheeting process such as a T die process or an extrusion may be used.

In the above method, preferably, the above-described manufacturing process of the resin composition and the sheeting process or the filming process can be carried out in an in-situ process in a device connected to each other.

The present invention further relates to an optoelectronic device comprising an optoelectronic device encapsulated by the filler for optoelectronic devices, wherein the residual amount of basic hydrolysis catalyst in the filler is 1 ppm to 50,000 ppm.

In one example, the optoelectronic device encapsulated may be, for example, a light emitting or photosensitive site such as a photovoltaic cell, an LED, or an OLED. In the present invention, the specific structure of the optoelectronic device is not particularly limited and may be applied to the manner and structure commonly applied in the field according to the device.

For example, when the optoelectronic device is a solar cell module, the device may include a light receiving substrate; Back sheet; And a photovoltaic device encapsulated by the filler between the light receiving substrate and the back sheet, wherein the remaining amount of the basic hydrolysis catalyst in the filler may be 1 ppm to 50,000 ppm.

1 and 2 are cross-sectional views of exemplary modules. As shown in FIG. 1 or 2, the solar cell module includes the light receiving substrates 11 and 21, the back sheets 12 and 22, and the light receiving substrates 11 and 21 and the back sheets 12 and 22. It can include a photovoltaic device (13, 23) encapsulated by the filler (14, 24).

Specific types of the light receiving substrate, the back sheet, the photovoltaic device and the like are not particularly limited. For example, the light receiving substrate may include a conventional plate glass; Or it may be a transparent composite sheet laminated with glass, a fluorine-based resin sheet, weather resistant film and a barrier film, the back sheet may be a composite sheet laminated with a metal such as aluminum, a fluorine-based resin sheet, weather resistant film and a barrier film. In addition, the photovoltaic device may be, for example, a thin film active layer formed by a silicon wafer-based active layer or chemical vapor deposition (CVD).

In the present invention, such an optoelectronic device includes, for example, manufacturing a laminate using a substrate, an optoelectronic device, and the filler of the present invention; And it can be produced by a method comprising the step of heat-compressing the produced laminate.

The method of manufacturing a laminate using the substrate, the optoelectronic device, and the filler and the stacking order of each layer in the laminate are not particularly limited, and are commonly applied in this field in consideration of the structure of the desired optoelectronic device. This can be done. Moreover, the system of the said heat-compression process is not specifically limited, either, The appropriate system according to the said apparatus can be selected.

For example, the above-described solar cell module may be manufactured by laminating a light receiving substrate, a filler, a photovoltaic device, a back sheet, and the like according to a desired structure, and then heating and compressing the same as a single body with vacuum suction.

In addition, the conditions of the heat compression process in the above, can be carried out for 5 minutes to 60 minutes, preferably 8 minutes to 40 minutes at a temperature of 90 ℃ to 230 ℃, preferably 110 ℃ to 190 ℃.

In the present invention, it is possible to provide a filler which can be used in various optoelectronic devices and exhibits excellent adhesion with components of devices such as substrates. In addition, the present invention can provide a filler capable of maintaining excellent workability and economical efficiency of device manufacturing without adversely affecting parts and working environments such as an optoelectronic device or a wiring electrode to be encapsulated.

1 and 2 are cross-sectional views illustrating a solar cell module which is an optoelectronic device according to one example of the present invention.

Hereinafter, the present invention will be described in more detail with reference to the following examples and comparative examples, but the scope of the present invention is not limited by the following examples.

Example 1

Preparation of Filler

98 parts by weight of polyethylene, 2 parts by weight of vinyl trimethoxy silane and 0.1 parts by weight of radical generator (dicumyl peroxide) having a density of 0.880 g / cm ³ and a MFR of 5 g / 10 min at 190 ° C. were mixed in an extruder, The mixture was heated and stirred at 200 ° C to graf the vinyl trimethoxy silane to the polyethylene. In addition, 100 parts by weight of linear low density polyethylene having a density of 0.870 g / cm ³ , 4 parts by weight of a hindered amine light stabilizer, 2 parts by weight of a benzophenone ultraviolet absorber, 2 parts by weight of a phosphorus thermal stabilizer and a basic hydrolysis catalyst. 1 part by weight of dodecyl amine (C ₁₂ H ₂₅ NH ₂ ) was mixed, melted and processed into pelletized masterbatch in an amount of 10 parts by weight relative to 100 parts by weight of polyethylene grafted with vinyl trimethoxy silane. It was introduced into the extruder, and mixed with polyethylene grafted vinyl trimethoxy silane to prepare a resin composition. Subsequently, the resin composition was introduced into a side hopper of a film forming machine having a twin screw extruder (φ: 27 mm) and a T die (width: 500 mm), processed at an extrusion temperature of 200 ° C., a extraction rate of 3 m / min, and the thickness was about 500. A sheet-like filler having a μm was processed.

Manufacturing of Photovoltaic Modules

Plate glass having a thickness of about 3 mm, the filler prepared above, the crystalline silicon wafer photovoltaic device, the filler prepared and the back sheet (thickness: polyvinyl fluoride sheet (thickness: 38 μm), aluminum foil (thickness: 30 μm) and poly A laminated sheet of vinyl fluoride sheet (thickness: 38 µm) was laminated in this order, and pressed in a vacuum laminator at 150 ° C. for 15 minutes to prepare a photovoltaic module.

Example 2

Fillers and modules were prepared in the same manner as in Example 1 except that 10 parts by weight of butyl amine (C ₄ H ₉ NH ₂ ) was used as the hydrolysis catalyst in the preparation of the master batch.

Comparative Example 1

Instead of using a basic hydrolysis catalyst in the preparation of the master batch, a filler and a photovoltaic module were prepared in the same manner as in Example 1 except that 10 parts by weight of dibutyl dilaurate (DBTDL), an organic metal catalyst, was used.

Comparative Example 2

Fillers and photovoltaic modules were prepared in a manner according to Example 1, except that no hydrolysis catalyst was used in the preparation of the master batch.

1. Residual amount analysis of basic catalyst

The residual amount of catalyst in the filler after production of the photovoltaic module was measured according to the manufacturer's manual using an HPLC instrument (Model: Alliance 2690, Detector: PDL, manufactured by Waters).

2. Measurement of Peel Strength

The prepared filler was cut to a size of 15 mm × 200 mm (width × length) to prepare a specimen. Subsequently, the specimen was pressed and adhered to a plate glass used as the front substrate of the photovoltaic module for 10 minutes in a vacuum laminator (manufacturer: Meier, trade name: ICOLAM) under conditions of 150 ° C. Then, the peeling force was measured using a tensile tester (manufacturer: Lloyd, trade name: LEPlus) while peeling the adhered filler at a peel rate of 50 mm / min and a peel angle of 90 degrees.

3. Measurement of gel fraction

The prepared filler was cut to a size of 10 mm x 10 mm (width x length) to prepare a specimen. Thereafter, the specimen was gelled by immersing it in hot water at 90 ° C. for 18 hours, and the gel fraction of the filler was measured according to the contents specified in ASTM D-2765.

The analysis results are summarized in Table 1 below.

Catalyst residual (ppm) Peel Strength (N / 15mm) Gel fraction (% by weight) Example 1 470 210 27 Example 2 5000 200 48 Comparative Example 1 - 20 81 Comparative Example 2 0 50 0

As can be seen from the results in Table 1, in the case of the examples in which the residual amount of the basic hydrolyzable catalyst falls within the scope of the present invention, it can be confirmed that an appropriate crosslinked structure is formed in the filler and exhibits high adhesive strength to the glass substrate. have.

1, 2: solar cell module
11, 21: light receiving substrate
12, 22: photovoltaic device
13, 23: back sheet
14, 24: filler

Claims (16)

An olefin resin containing a hydrolyzable group or a reactive group which is a hydrolyzate of the hydrolyzable group; And a basic hydrolysis catalyst, wherein the residual amount of the catalyst after modularization is 1 ppm to 50,000 ppm. The filler for optoelectronic devices according to claim 1, wherein the residual amount of catalyst after modularization is 3 ppm to 10,000 ppm. The filler for an optoelectronic device according to claim 1, wherein the hydrolyzable group is a halogen atom, an alkoxy group, an aryloxy group, an acyloxy group, an alkylthio group or an alkyleneoxythio group. The filler for an optoelectronic device according to claim 1, wherein the hydrolyzable group is an alkoxy group having 1 to 12 carbon atoms. The filler for an optoelectronic device according to claim 1, wherein the reactive group is a hydroxy group. The method of claim 1, wherein the olefin resin is a copolymer comprising an alpha olefin and a silane compound of the formula (1) as a polymer unit; Or a filler for an optoelectronic device, which is a graft polymer in which a silane compound of formula 1 is grafted onto a polyolefin:
[Formula 1]
DSi (X) _m Y _(3-m)
In Formula 1, D represents alkenyl, and X each independently represents a halogen atom, an alkoxy group, an aryloxy group, an acyloxy group, an alkylthio group, or an alkyleneoxythio group, or any one of the above hydrolyzates Y each independently represents hydrogen, an alkyl group, an aryl group, or an aralkyl group, and m represents an integer of 1 to 3. The copolymer according to claim 6, wherein the copolymer comprises 0.1 to 10 parts by weight of the silane compound of Formula 1 based on 100 parts by weight of α olefin, and the graft polymer is 0.1 part by weight of silane compound of Formula 1 to 100 parts by weight of polyolefin. Filler for optoelectronic devices containing from 10 to 10 parts by weight. The filling material for an optoelectronic device according to claim 1, wherein the olefin resin is a graft polymer in which an unsaturated silane compound of formula (1) is grafted to polyethylene:
[Formula 1]
DSi (X) _m Y _(3-m)
In Formula 1, D, X, Y and m are as defined in claim 6. The filler of claim 8, wherein the polyethylene has a density of 0.85 g / cm ³ to 0.96 g / cm ³ . The filler of claim 8, wherein the polyethylene has an MFR of from 0.1 g / 10 minutes to 50 g / 10 minutes at 190 ° C. The filler for an optoelectronic device according to claim 1, wherein the basic hydrolysis catalyst is an organic amine compound, a nitrogen-based heterocyclic compound, a metal hydroxide or a metal amide. The filler for an optoelectronic device according to claim 1, wherein the basic hydrolysis catalyst is alkylamine or dialkylamine. The filler material for optoelectronic devices according to claim 1, further comprising at least one selected from the group consisting of a light stabilizer, a UV absorber, and a heat stabilizer. An optoelectronic device comprising an optoelectronic device encapsulated by a filler for an optoelectronic device according to claim 1, wherein the residual amount of basic hydrolysis catalyst in the filler is 1 ppm to 50,000 ppm. A light receiving substrate; Back sheet; And a photovoltaic device encapsulated by the filler according to claim 1 between the light-receiving substrate and the back sheet, wherein the remaining amount of the basic hydrolysis catalyst in the filler is 1 ppm to 50,000 ppm. Preparing a laminate using the substrate, the optoelectronic device and the filler according to claim 1; And thermally compressing the manufactured laminate.

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