KR101411776B1 - Olefin resin composition - Google Patents

Abstract

The present invention relates to an olefin resin composition. In the present invention, it is possible to provide an olefin resin composition which can be effectively used as a filling material for various optoelectronic devices, for example.

Description

Olefin resin composition [0002]

The present invention relates to an olefin resin composition.

The filling material encapsulates a light emitting portion or a light detecting portion in an optoelectronic device such as a photovoltaic cell, an LED (Light Emitting Diode) or an OLED (Organic Light Emitting Diode) Can be used.

For example, a solar cell module is usually manufactured by a lamination method in which elements such as a transparent front substrate, a filler, a photovoltaic element, and a backsheet are laminated according to a desired structure, and the produced laminate is heated and pressed ≪ / RTI >

EVA (ethylene-vinyl acetate) resin is most widely used as a filler used in a solar cell module in terms of processability, workability and cost.

However, the EVA resin is contained in an optoelectronic device such as a front substrate or a backsheet, and has a low bonding strength with an element in contact with the filler. Therefore, when the optoelectronic device is exposed to the outside for a long time, there is a problem that peeling easily occurs between the layers. Further, the EVA resin is pyrolyzed in a heat pressing process or the like to generate toxic gas such as acetic acid gas. Such toxic gases deteriorate the working environment, adversely affect the photovoltaic elements or electrodes contained in the module, deteriorate the module and lower the power generation efficiency.

An object of the present invention is to provide an olefin resin composition.

The present invention relates to an olefin resin having a hydrolyzable functional group; And an olefin resin composition comprising a basic hydrolysis catalyst.

Hereinafter, the olefin resin composition of the present invention will be described in more detail.

In one example, the olefin resin composition can be used as a filling material for encapsulating an element contained in an optoelectronic device such as a photovoltaic cell, an LED, or an OLED. However, the application in which the olefin resin composition of the present invention can be used is not limited to the above, but can also be used as an industrial material applied to, for example, a temperature-elevated lamination process.

The olefin resin contained in the resin composition includes a hydrolyzable functional group. In the above, the olefin resin means a polymer comprising at least one olefin as polymerized units, wherein the polymer is a homopolymer which is a homogeneous polymer made from a single monomer; And copolymers comprising chemically different segments or blocks, whether produced by the reaction of two or more different monomers or formed from a single monomer. The hydrolyzable functional group contained in the olefin resin can be converted into a reactive functional group by the action of a basic hydrolysis catalyst contained in the resin composition. In the present invention, it is possible to appropriately control the hydrolyzable functional groups introduced into the olefin resin and to control the kind and the ratio of the reactive functional groups generated by the hydrolysis of the functional groups, thereby exhibiting an effect suitable for the application to which the resin composition is applied have. In one example, when the resin composition is applied as a filler material for a photovoltaic device, the filler material may exhibit excellent adhesion with various elements contained in the device to contact the filler material. For example, when an element in contact with the material is a glass substrate frequently used in an optoelectronic device, the reactive functional group of the olefin resin may have a functional group such as a hydroxyl group on the surface of the glass substrate, ; Or a chemical covalent bond through a condensation reaction or the like, thereby improving the adhesion. In the composition of the present invention, the hydrolyzable functional group contained in the olefin resin may be hydrolyzed by the action of the basic hydrolysis catalyst. Hereinafter, the olefin resin having the hydrolyzable functional group or the hydrolyzate of the functional group as described above may be referred to as " modified olefin resin " in the present specification.

The kind of the hydrolyzable functional group is not particularly limited. In one example, the functional group may be a hydrolyzable silyl group. That is, the olefin resin may be a silane-modified olefin resin. The term " hydrolyzable silyl group " means a silyl group having at least one hydrolyzable moiety, and specifically may be a functional group represented by the following formula (1).

[Chemical Formula 1]

-Si (X) _m Y _(3-m)

X represents a hydrolyzable residue bonded to a silicon atom; Y represents a non-hydrolyzable residue bonded to a silicon atom; and m represents an integer of 1 to 3.

The hydrolyzable moiety X in the above may be, for example, a halogen atom, an alkoxy group, an aryloxy group, an acyloxy group, an alkylthio group or an alkylenoxythio group. In this case, examples of the halogen atom include chlorine (Cl). Examples of the alkoxy group include an alkoxy group having 1 to 20 carbon atoms, 1 to 12 carbon atoms, 1 to 8 carbon atoms, or 1 to 4 carbon atoms, Examples of the aryloxy group include an aryloxy group having 6 to 18 carbon atoms and a carbon number of 6 to 12, and may be, for example, phenoxy. Examples of the acyloxy group include an acyloxy group having 1 to 12 carbon atoms, Examples of alkylthio groups include alkylthio groups having 1 to 12 carbon atoms, and examples of alkyleneoxy groups include alkyleneoxy groups having 1 to 12 carbon atoms. In the present invention, X in the general formula (1) may be preferably alkoxy, and specifically may be an alkoxy group having 1 to 12 carbon atoms, preferably 1 to 8 carbon atoms, and more preferably 1 to 4 carbon atoms. Examples of such an alkoxy group include a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group and a butoxy group, and preferable examples thereof include a methoxy group and an ethoxy group.

Examples of the nonhydrolyzable moiety of the above formula (1) may be hydrogen, an alkyl group, an aryl group or an aralkyl group. The alkyl group may be, for example, an alkyl group having 1 to 12 carbon atoms, 1 to 8 carbon atoms, or 1 to 4 carbon atoms. The aryl group in Y may be an aryl group having 6 to 18 carbon atoms, preferably 6 to 12 carbon atoms, such as a phenyl group, and the aralkyl group may be an aralkyl group having 7 to 19 carbon atoms, preferably 7 to 13 carbon atoms, For example, a benzyl group.

In Formula 1, m is an integer of 1 to 3, preferably 2 or 3, and more preferably 3.

In the present invention, the olefin resin having a hydrolyzable silyl group can be produced, for example, by copolymerizing an? -Olefin and an unsaturated silane compound, or by grafting an unsaturated silane compound to an olefin resin.

That is, the olefin resin having a hydrolyzable silyl group in the present invention is a copolymer comprising an? -Olefin and an unsaturated silane compound represented by the following formula (2) in copolymerized form; Or a graft polymer grafted with an unsaturated silane compound represented by the following formula (2) in an olefin resin.

(2)

DSi (X) _m Y _(3-m)

D in the above formula (2) is bonded to a silicon atom and represents alkenyl, and X, Y and m are as defined in the above formula (1).

In the above formula (2), the alkenyl group may be, for example, vinyl, allyl, propenyl, isopropenyl, butenyl, hexenyl, cyclohexenyl or octenyl, and preferably vinyl.

Specific examples of the unsaturated silane compound of the formula (2) include vinyltrimethoxysilane, vinyltriethoxysilane, vinyltripropoxysilane, vinyltriisopropoxysilane, vinyltributoxysilane, vinyltripentoxysilane, Silane, and vinyltriacetoxysilane. Of these, vinyltrimethoxysilane or vinyltriethoxysilane is preferably used, but not limited thereto.

Examples of the? -Olefin contained in the olefin resin contained in the copolymer in the form of the above copolymer or forming the graft polymer include ethylene, propylene, 1-butene, isobutylene, 1-pentene, Butene, 1-hexene, 1-heptane, 1-octene, 1-nonene or 1-decene, and may be ethylene, preferably ethylene. It is not.

In the olefin resin of the present invention, the above-mentioned unsaturated silane compound is preferably used in an amount of 0.1 to 10.0 parts by weight based on 100 parts by weight of the? -Olefin in the case of the graft polymer relative to 100 parts by weight of the olefin resin 0.5 part by weight to 5.0 parts by weight. Unless otherwise specified, unit weight parts in the present specification means weight ratios. In such a range, the adhesive property of the resin composition, for example, adhesion to a glass substrate and the like can be kept excellent.

The olefin resin contained in the resin composition of the present invention may preferably be a graft polymer obtained by grafting an unsaturated silane compound of the above formula (2) to an olefin resin. The olefin resin in the above may preferably be polyethylene. The term " polyethylene " includes not only a homopolymer of ethylene but also at least 50 mol% or more of ethylene as a polymerization unit, and also includes an? -Olefin having three or more carbon atoms or other comonomers Copolymers may also be included. The polyethylene may be, for example, one or more of low density polyethylene, medium density polyethylene, high density polyethylene, ultra low density polyethylene, ultralow low density polyethylene or linear low density polyethylene.

In the present invention, it is preferable to use polyethylene in which an unsaturated silane compound is grafted, and polyethylene having many side chains. For polyethylene having many side chains, grafting can be made more efficiently. Polyethylene having a large number of side chains generally has a low density, and a polyethylene having a small side chain generally has a high density. Therefore, in the present invention, it preferred to use a polyethylene of low density and, specifically, a density of 0.85 g / cm ³ to 0.96 g / cm ^3, preferably a density of about 0.85 g / cm ³ to 0.92 g / cm ³ Polyethylene can be used.

The polyethylene has a melt flow rate (MFR) at 190 占 폚 of about 0.1 g / 10 min to about 50 g / 10 min, preferably about 1.0 g / 10 min to 50.0 g / 10 min, About 1.0 g / 10 min to 30.0 g / 10 min. When such a MFR is used, for example, when the resin composition is used as a filling material for an optoelectronic device, excellent moldability and adhesiveness can be exhibited.

The resin composition of the present invention includes a basic hydrolysis catalyst. The basic hydrolysis catalyst can be converted into a reactive functional group by hydrolyzing a hydrolyzable functional group in a process of forming the resin composition of the present invention with a filler or in the process of encapsulating an optoelectronic device using the resin composition of the present invention. In particular, the basic hydrolysis catalyst can efficiently control the physical properties of the resin composition or the filler material by appropriately maintaining the degree of hydrolysis as described above. In addition, the basic hydrolysis catalyst does not adversely affect other components contained in the composition, for example, a UV stabilizer as described later, and thus the overall physical properties can be stably maintained as intended.

In the present invention, the specific type of the basic hydrolysis catalyst is not particularly limited and includes, for example, organic amine compounds, heterocyclic compounds containing a nitrogen atom as a ring constituent atom, metal hydroxides or metal amides Or more. Examples of the organic amine compound include alkylamines or dialkylamines. Specific examples thereof include alkylamines having 1 to 12 carbon atoms, 1 to 8 carbon atoms, or alkyl groups having 1 to 4 carbon atoms or alkylamines having 2 to 24 carbon atoms, A dialkylamine having an alkyl group of 2 to 16 carbon atoms or an alkyl group of 2 to 8 carbon atoms, and more specifically, ethylamine, hexylamine, n-propylamine or dibutylamine. The heterocyclic compound is a hydrocarbon ring compound containing nitrogen as a hetero atom constituting a ring, and specific examples thereof include pyridine. In addition, examples of the metal hydroxide is an example of NaOH, KOH, RbOH, or and the like CsOH, metal amide, NaNH _2, KNH _2, RbNH but are ₂ or CsNH ₂ or the like, without being limited thereto. In the present invention, preferably an organic amine compound, preferably an alkylamine or dialkylamine, more preferably an alkylamine having an alkyl group having 1 to 12 carbon atoms or a dialkylamine having an alkyl group having 2 to 24 carbon atoms Can be used.

The resin composition of the present invention may contain 0.01 to 5 parts by weight, preferably 0.01 to 2 parts by weight, of the basic hydrolysis catalyst relative to 100 parts by weight of the olefin resin. In this weight ratio, the physical properties of the resin composition can be effectively controlled, the adhesion with the substrate can be enhanced, and the activity of other additives contained in the resin composition can be kept excellent.

The resin composition of the present invention may further contain one or more kinds of additives selected from a light stabilizer, a UV absorber, a heat stabilizer and the like, if necessary.

The light stabilizer can act to prevent photo-oxidation by capturing the active species of the initiation of photo-initiation of the olefin resin, depending on the application to which the resin composition is applied. The type of light stabilizer that can be used in the present invention is not particularly limited, and for example, known compounds such as hindered amine compounds or hindered piperidine compounds may be used.

The UV absorber has a role of absorbing ultraviolet rays from sunlight or the like and converting it into harmless heat energy in the molecule to prevent the activation of the photo-initiation species in the olefin resin from being excited, depending on the use of the resin composition can do. The specific kind of UV absorber that can be used in the present invention is not particularly limited and includes, for example, benzophenone, benzotriazole, acrylonitrile, metal complex salt, hindered amine, ultrafine titanium oxide, Inorganic UV absorbers and the like, or a mixture of two or more of them may be used.

Examples of the thermal stabilizer that can be used include tris (2,4-di-tert-butylphenyl) phosphite, bis [2,4-bis (1,1- dimethylethyl) -6- methylphenyl] (2,4-di-tert-butylphenyl) [1,1-biphenyl] -4,4'-diyl bisphosphonate and bis (2,4-di-tert- butylphenyl) pentaerythritol dioxide Phosphorus thermal stabilizers such as spits; Hydroxy-5,7-di-tert-butyl-furan-2-one and o-xylene, and the like.

In the resin composition of the present invention, the content of the light stabilizer, the UV absorber and / or the heat stabilizer is not particularly limited. That is, the content of the additive can be appropriately selected in consideration of the use of the resin composition, the shape and the density of the additive, and is suitably adjusted within the range of 0.01 to 5 parts by weight relative to 100 parts by weight of the total solid content of the resin composition Lt; / RTI >

In addition to the above components, the resin composition of the present invention may suitably further include various additives known in the art depending on the application to which the resin component is applied.

The present invention also relates to a filler comprising the olefin resin composition as described above.

The filler material can be used, for example, in applications encapsulating devices in a variety of optoelectronic devices.

The filler may contain the olefin resin composition in a state in which the respective components are uniformly mixed in the state, or may be molded in various forms such as hot melt extrusion and T-die molding There may be.

In the present invention, the shape of the filler is not particularly limited and may be, for example, a sheet or a film. In this case, the thickness of the filler can be adjusted to about 10 탆 to 2,000 탆, preferably about 100 탆 to 1250 탆, in consideration of the supporting efficiency of the element, the possibility of breakage, the weight of the apparatus, However, the film thickness of the filler material may be changed depending on the specific application to be applied.

The method for producing the filler in the present invention is not particularly limited. For example, the filler may be prepared by: preparing the above-mentioned olefin resin composition in a reactor; And molding the composition into a film or sheet form.

The method for producing the olefin resin composition in the reactor is not particularly limited. For example, an α-olefin, an unsaturated silane compound as described above, and, if necessary, other copolymerizable monomers are mixed in a reactor and reacted in the presence of a suitable radical polymerization initiator and optionally a chain transfer agent simultaneously or stepwise Or by grafting the unsaturated silane compound onto the olefin resin in the presence of an appropriate radical generator to prepare the modified olefin resin or by mixing the olefin resin and the unsaturated silane compound as described above in a reactor, , Followed by mixing with a basic hydrolysis catalyst.

In one embodiment, the step of preparing the olefin resin composition comprises: mixing an olefin resin, the silane compound of Formula 2 and a radical generator in a reactor, and grafting the silane compound to an olefin resin; And a basic hydrolysis catalyst into the same reactor, followed by mixing.

The type of the reactor in which the olefin resin is produced is not particularly limited as long as it can produce a desired resin by reacting reactants in a heat-fused or liquid state. For example, the reactor may be a cylinder with an extruder or a hopper. In the case of using such a reactor, for example, a liquid silane compound and a radical generator are added to an olefin resin heated and melted through an extruder and extruded, or an olefin resin, a radical generator and a silane compound are mixed in a hopper After the addition, the olefin resin can be produced by heating and melting in a cylinder and reacting.

In the above method, the hydrolysis catalyst may be introduced before or after the olefin resin is formed into the reactor in which the olefin resin is prepared as described above. In this case, the hydrolysis catalyst may be added to the reactor in which the ultraviolet absorbent, heat stabilizer, And other additives may be added together. Thus, by simultaneously producing the olefin resin and mixing with the additive in one reactor, the process can be simplified.

The hydrolysis catalyst and / or other additives may be introduced into the reactor as it is, or may be added in the form of a master batch and mixed. The master batch means a pellet-shaped raw material in which additives to be added are concentrated and dispersed at a high concentration. In general, when a plastic raw material is processed by a method such as extrusion or injection, Is used to introduce additives.

The method for introducing an additive such as a hydrolysis catalyst into the reactor in which the olefin resin is formed is not particularly limited. For example, a side feeder may be installed at an appropriate position of the extruder or the cylinder, A method of adding an additive in the form of a master batch, or a method of mixing the mixture with an olefin resin or the like in a hopper and inputting the mixture.

In the above method, the conditions such as the specific kind and design of the reactor, the heating and melting, the mixing or the reaction and the conditions such as the time and the kind, the kind of the radical generator and the production method of the master batch are not particularly limited, Can be appropriately selected.

There is no particular limitation on the method of molding the obtained composition into a sheet or film after the above-mentioned process. For example, a conventional filming or sheeting process such as a T-die process or extrusion may be used. In the above method, it is preferable to carry out the in-situ process using an apparatus in which the above-described manufacturing process of the resin composition and the film-forming or sheet-forming process are connected to each other.

The present invention also relates to an optoelectronic device comprising an element encapsulated by a filler material prepared from the resin composition described above.

The element to be encapsulated in the present invention may be, for example, a light emitting or light sensing part such as a photovoltaic cell, LED or OLED.

The specific structure of the optoelectronic device or the method of encapsulating the optoelectronic device using the resin composition is not particularly limited, and a system and a structure that are conventionally applied in the field may be applied according to the device.

For example, when the optoelectronic device is a photocell, the optoelectronic device includes the light-receiving substrates 11 and 21, the backsheets 12 and 22, and the light-receiving substrates 11 and 21, And the photovoltaic elements 13 and 23 encapsulated by the fillers 14 (a), 14 (b), and 24 between the backsheets 12 and 22, and in this case, The filler may be one prepared from the resin composition of the present invention.

The module can be manufactured by a usual molding method such as a lamination method in which a light receiving substrate, a filler, a photovoltaic element, a back sheet, and the like are laminated and then vacuum-sucked together as a whole according to a desired structure. In this case, the process conditions of the lamination method are not particularly limited, and are usually carried out at a temperature of 90 to 230 캜, preferably 110 to 190 캜 for 5 to 60 minutes, preferably 8 to 40 minutes can do.

The specific types of the light-receiving substrate, the backsheet, and the photovoltaic device that can be used in the above are not particularly limited. For example, the light receiving substrate may be a conventional plate glass; Or a transparent composite sheet obtained by laminating a glass, a fluororesin sheet, a weather resistant film and a barrier film, and the back sheet may be a composite sheet comprising a metal such as aluminum, a fluororesin sheet, a weather resistant film and a barrier film. The photovoltaic device may be, for example, a silicon wafer type active layer or a thin film active layer formed by chemical vapor deposition (CVD) or the like.

In the present invention, it is possible to provide an olefin resin composition which can be effectively used as a filling material for various optoelectronic devices, for example.

1 and 2 are sectional views showing a solar cell module which is an exemplary optoelectronic device of the present invention.

Hereinafter, the present invention will be described in more detail with reference to the following examples and comparative examples, but the scope of the present invention is not limited by the following examples.

Example 1

Manufacture of fillers

98 parts by weight of polyethylene having a density of 0.880 g / cm ³ and an MFR of 5 g / 10 minutes at 190 캜, 2 parts by weight of vinyltrimethoxysilane and 0.1 part by weight of a radical generator (dicumyl peroxide) were mixed in an extruder , And the mixture was heated and melt stirred at 200 DEG C to graft the vinyltrimethoxysilane onto the polyethylene. Further, 100 parts by weight of a linear low density polyethylene having a density of 0.870 g / cm ³ , 4 parts by weight of a hindered amine light stabilizer, 2 parts by weight of a benzophenone ultraviolet absorber, 2 parts by weight of a phosphorus- And 1 part by weight of dodecylamine (C ₁₂ H ₂₅ NH ₂ ) were melted and processed into pelletized master batches were fed into the extruder from 5 parts by weight to 10 parts by weight using a side feeder, and vinyltrimethoxysilane And mixed with the grafted polyethylene to prepare a resin composition. Subsequently, the resin composition was fed into a side hopper of a film forming machine having a twin-screw extruder (27 mm) and a T die (width: 500 mm) and processed at an extrusion temperature of 200 캜 and a take-off speed of 3 m / In-sheet filler was processed.

Manufacture of photovoltaic modules

(Thickness: 38 μm), an aluminum foil (thickness: 30 μm), and a polyimide film (thickness: 30 μm) having a thickness of about 3 mm, a filler material, a crystalline silicon wafer, Laminated sheet of a vinyl fluoride sheet (thickness: 38 mu m) were laminated in this order and pressed in a vacuum laminator at 150 DEG C for 15 minutes to produce a photovoltaic module.

Example 2

A filler and a module were prepared in the same manner as in Example 1 except that 1 part by weight of butylamine (C ₄ H ₉ NH ₂ ) was used as a hydrolysis catalyst in the preparation of the masterbatch.

Comparative Example 1

A filler and a photovoltaic module were prepared in the same manner as in Example 1, except that 1 part by weight of DBTDL (dibutyl dilaurate) as an organic metal catalyst was used instead of the basic hydrolysis catalyst in the preparation of the masterbatch.

Comparative Example 2

A filler and a photovoltaic module were prepared in the same manner as in Example 1, except that no hydrolysis catalyst was used in the preparation of the masterbatch.

≪ Measurement of physical properties &

1. FT-IR analysis

FT-IR analysis was performed on the prepared filler using an FT-IR analyzer (FTS 3000, BIO-RAD). The peak derived from the stretching motion of the methoxy group of methoxysilyl (Si-OCH ₃ ), which is a hydrolyzable group introduced into the olefin resin, was observed at 1091 cm ^-1 in the spectrum derived after the analysis, and the hydrolyzable group was hydrolyzed A peak due to the stretching motion of the hydroxy group of the resulting reactive group (Si-OH) was observed at 3645 cm ^-1 . Accordingly, by substituting the intensity of the peak observed in the intensity of the peak 1091 (intensity) observed in cm ^-1, 720 cm-1 peak intensity, and 3645 cm ^-1 as measured in the in the general formula 1 and 2, respectively , Hydrolyzable group and reactive group index were determined.

[Formula 1]

Hydrolyzable group index = (peak intensity at 1091 cm ^-1 ) / (peak intensity at 720 cm ^-1 )

[Formula 2]

Reactive group index = (peak intensity at 3645 cm ^-1 ) / (peak intensity at 720 cm ^-1 )

2. Measurement of peel strength

The specimens were prepared by cutting the prepared filler to 15 m × 200 m (width × length). Subsequently, the test piece was bonded to a plate glass used as a front substrate of a photovoltaic module for 10 minutes under a condition of 150 mm in a vacuum laminator (manufactured by Meier (trade name: ICOLAM)). Thereafter, using the tensile tester (Lloyd, trade name: LEPlus), the adhered filler was peeled off at a peeling speed of 50 mm / min and a peel angle of 90 degrees, and the peel force was measured.

3. Measurement of gel fraction

The prepared filler was cut into a size of 10 mm × 10 mm (width × length) to prepare a test piece. Thereafter, the specimen was held in hot water at 90 DEG C for 18 hours to gel, and the gel fraction of the filler was measured according to the content specified in ASTM D-2765.

The results of the analysis are summarized in Table 1 below.

FT-IR Peel strength
(N / 15 mm) Gel fraction
(weight%) Reactive factor index Hydrolyzable group index Example 1 0.08 0.12 210 44 Example 2 0.05 0.16 180 27 Comparative Example 1 0.12 0.06 20 81 Comparative Example 2 0.00 0.20 50 2

As can be seen from the results of Table 1, the resin composition of the Example exhibited a high adhesive strength to the glass substrate used for the module. In addition, it shows a low gel content and, for example, it can be seen that the reuse or recycling of the module parts can be effectively achieved. On the other hand, in the case of Comparative Example 1 including the organometallic catalyst, the hydrolysis reaction of the hydrolytic functional groups contained in the resin proceeded excessively and showed a very high gel content. In addition, in the case of Comparative Example 2 in which no catalyst was used, the hydrolysis reaction of the hydrolyzable functional group was hardly progressed, and thus the bonding strength to the glass substrate was very low.

1, 2: Solar cell module
11, 21: light receiving substrate
12, 22: photovoltaic element
13, 23: back sheet
14 (a), 14 (b), 24: filler

Claims (17)

An olefin resin having a hydrolyzable functional group; And a basic hydrolysis catalyst which is an alkylamine having an alkyl group having 1 to 12 carbon atoms or a dialkylamine having an alkyl group having 2 to 24 carbon atoms. The olefin resin composition for filling according to claim 1, wherein the olefin resin is a silane-modified olefin resin having a silyl group represented by the following formula
[Chemical Formula 1]
-Si (X) _m Y _(3-m)
In the above formula (1), X represents a halogen atom, an alkoxy group, an aryloxy group, an acyloxy group, an alkylthio group or an alkyleneoxy group which is bonded to a silicon atom, Y is bonded to a silicon atom, An alkyl group, an aryl group or an aralkyl group, and m represents an integer of 1 to 3; The olefin resin composition for fillings according to claim 2, wherein X represents an alkoxy group having 1 to 12 carbon atoms. 3. The composition of claim 1, wherein the olefin resin comprises a copolymer comprising an alpha -olefin and an unsaturated silane compound of formula (2) in copolymerized form; Or a graft polymer grafted with an unsaturated silane compound represented by the following formula (2) to an olefin resin:
(2)
DSi (X) _m Y _(3-m)
D in the above formula (2) is bonded to a silicon atom and represents alkenyl, and X, Y and m are the same as defined in claim 2. 5. The olefin resin composition for fillings according to claim 4, wherein the copolymer or graft polymer comprises 0.1 to 10.0 parts by weight of an unsaturated silane compound per 100 parts by weight of the? -Olefin or the olefin resin. The olefin resin composition for filling according to claim 1, wherein the olefin resin is a graft polymer grafted with an unsaturated silane compound represented by the following formula (2) in polyethylene:
(2)
DSi (X) _m Y _(3-m)
Wherein D, X, Y and m are as defined in claim 4. The method according to claim 6, wherein the unsaturated silane compound of formula (2) is selected from the group consisting of vinyltrimethoxysilane, vinyltriethoxysilane, vinyltripropoxysilane, vinyltriisopropoxysilane, vinyltributoxysilane, Vinyltrialkoxysilane, vinyltriethoxysilane, vinyltriethoxysilane, and the like. The olefin resin composition for filling according to claim 6, wherein the polyethylene has a density of 0.85 g / cm ³ to 0.96 g / cm ³ . The olefin resin composition for filling according to claim 6, wherein the polyethylene has an MFR of 0.1 g / 10 min to 50 g / 10 min at 190 캜. delete delete The olefin resin composition for fillings according to claim 1, wherein the basic hydrolysis catalyst is contained in an amount of 0.01 to 5.0 parts by weight based on 100 parts by weight of the olefin resin. The olefin resin composition for filling according to claim 1, further comprising at least one member selected from the group consisting of a light stabilizer, a UV absorber and a heat stabilizer. A filler material comprising the olefin resin composition for a filler according to claim 1. Producing an olefin resin composition for a filler according to claim 1 in a reactor; And molding the composition into a film or sheet form. 16. The method for producing an olefin resin composition according to claim 15, wherein the step of preparing the olefin resin composition comprises: mixing an olefin resin, a silane compound represented by the following formula (2), and a radical generator in a reactor and grafting the silane compound onto an olefin resin; And a basic hydrolysis catalyst into the same reactor and mixing them.
(2)
DSi (X) _m Y _(3-m)
Wherein D, X, Y and m are as defined in claim 4. The method for producing a filler according to claim 15, wherein the step of preparing the olefin resin composition and the step of forming the composition into a film or a sheet are performed in situ using an apparatus connected to each other.

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