KR20120044271A - Metal printed circuit board - Google Patents

Metal printed circuit board Download PDF

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Publication number
KR20120044271A
KR20120044271A KR1020110126009A KR20110126009A KR20120044271A KR 20120044271 A KR20120044271 A KR 20120044271A KR 1020110126009 A KR1020110126009 A KR 1020110126009A KR 20110126009 A KR20110126009 A KR 20110126009A KR 20120044271 A KR20120044271 A KR 20120044271A
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South Korea
Prior art keywords
printed circuit
circuit board
aluminum plate
metal printed
conductive member
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KR1020110126009A
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Korean (ko)
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KR101214261B1 (en
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정제승
김인섭
고영창
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정제승
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Abstract

PURPOSE: A metal printed circuit board is provided to extend the life expectancy of a metal printed circuit board by minimizing the exfoliation of the metal printed circuit board with respect to an aluminum plate during a heat emitting process. CONSTITUTION: A metal printed circuit board(100) is composed of a conductive member(110) and an aluminum plate(120). The conductive member is obtained by coating one side of a copper plate(112) with an insulating material(114). The insulating material is adjacently placed to the aluminum plate. The insulating material of the conductive member and the aluminum plate are integrated based on hot pressing. A copper plate forming the conductive member is based on copper foil. The insulating material is obtained by adding ceramic filter into epoxy resin with insulating characteristic. One side of the aluminum plate is etched based on an electroless method.

Description

메탈 인쇄회로기판{METAL PRINTED CIRCUIT BOARD}Metal Printed Circuit Boards {METAL PRINTED CIRCUIT BOARD}

본 발명은 메탈 인쇄회로기판에 관한 것으로, 더 상세하게는 알루미늄판의 일면에 절연재(insulating material)가 부착된 동판(copper plate)을 밀착하고 핫프레싱하여 일체화하여 제조할 수 있어 제조가 간단하고 견고한 구조의 메탈 인쇄회로기판에 관한 것이다.
The present invention relates to a metal printed circuit board, and more particularly, a copper plate having an insulating material attached to one surface of an aluminum plate can be manufactured by being intimately manufactured by integrating it into a hot plate. The present invention relates to a metal printed circuit board having a structure.

최근 조명을 위해 사용되는 고휘도 LED는 그 사용범위가 계속 확대되고 있지만, 다수의 고휘도 LED를 패키지(package)화하여 사용하는 경우 LED 자체에서 발생하는 열이 기판내에 축적되어 LED 수명이 급격히 떨어져 사용하지 못하는 단점이 있다. 그리고, 최근의 전자장비의 고집적화로 LED 칩(chip)으로 들어가는 전력량이 점점 높아지고 이로 인해 발생하는 열이 점점 증가하고 있으며, LED 역시 사용자들의 요구에 따라 고휘도를 가지기 위해 많은 전력을 작은 칩에 인가시키고 있다.Recently, the range of high-brightness LEDs used for lighting continues to expand, but when a large number of high-brightness LEDs are packaged and used, the heat generated from the LED itself accumulates in the substrate and the LED lifespan decreases drastically. There is a disadvantage. In addition, due to the recent high integration of electronic equipment, the amount of power input to the LED chip is increasing and heat generated by the LED chip is increasing. have.

또한 모터나 전원공급장치, 인버터 등의 다양한 전자기기 등의 제어를 위한 인쇄회로기판 역시 대전력을 소모하며 그로 인해 발생하는 열을 효과적으로 방열시켜야 한다.In addition, a printed circuit board for controlling various electronic devices such as a motor, a power supply device, and an inverter also consumes a large amount of power and must effectively dissipate heat generated therefrom.

따라서, 최근에는 금속을 이용한 메탈 코어 PCB(이하, '메탈 인쇄회로기판'이라 한다.)가 개발되어 열 전달률이 높은 금속으로 열을 확산 및 냉각시킬 수 있게 되었다.Therefore, recently, a metal core PCB using a metal (hereinafter, referred to as a metal printed circuit board) has been developed to enable diffusion and cooling of heat to a metal having a high heat transfer rate.

이와 같은 메탈 인쇄회로기판은 공개특허 제10-2007-0039006호의 메탈 인쇄회로기판용 알루미늄절연기판, 공개특허 제10-2007-0040918호의 발광다이오드용 메탈 코어 인쇄회로기판 등에 그 구조가 제시된 바 있다.Such a metal printed circuit board has been shown in its structure, such as an aluminum insulating substrate for a metal printed circuit board of Patent Publication No. 10-2007-0039006, a metal core printed circuit board for a light emitting diode of Patent Publication No. 10-2007-0040918.

이러한 종래의 메탈 인쇄회로기판은 도 1에 도시된 바와 같이 통상 알루미늄판(10)의 상부에 절연재(insulating material)(20), 동판(copper plate)(30)이 순차적으로 적층되어서 이루어진다. 좀 더 상세하게는 상기 알루미늄판(10)은 방열기능을 담당하는 것으로, 열전달률이 우수하며, 절연재(20)는 전류가 흐르는 동판(30)과 알루미늄판(10)의 사이의 전기적인 절연 상태를 유지하는 기능을 한다.In the conventional metal printed circuit board, an insulating material 20 and a copper plate 30 are sequentially stacked on an aluminum plate 10 as shown in FIG. 1. More specifically, the aluminum plate 10 is responsible for the heat dissipation function, excellent heat transfer rate, the insulating material 20 is an electrical insulation state between the copper plate 30 and the aluminum plate 10 through which current flows. To maintain the function.

한편, 이와 같은 종래의 메탈 인쇄회로기판은 알루미늄판(10), 절연재(insulating material)(20) 및 동판(copper plate)(30)을 순차적으로 적층한 후 핫프레스기를 이용해 열압착함으로서 일체로 형성하게 된다. 그런데, 이와 같은 종래의 제조 방식의 경우 알루미늄판(10)과 절연재(insulating material)(20) 및 동판(copper plate)(30)을 한꺼번에 적층한 상태에서 핫프레싱을 함에 따라 메탈 인쇄회로기판을 양산시 불량률이 높은 문제점을 안고 있다.Meanwhile, the conventional metal printed circuit board is integrally formed by sequentially stacking an aluminum plate 10, an insulating material 20, and a copper plate 30, and thermally compressing the same using a hot press. Done. However, in the conventional manufacturing method as described above, when the aluminum plate 10, the insulating material 20 and the copper plate 30 are laminated in a state of hot pressing, the mass production of the metal printed circuit board is performed. The problem rate is high.

또한, 종래의 메탈 인쇄회로기판은 이와 같이 일체로 핫프레싱을 통해 제작하는 경우 동판(copper plate)(30)과 알루미늄판(10)의 사이에서 에폭시수지(Epoxy Resin) 등의 재질로 이루어지는 절연재(insulating material)(20)의 결합력이 약해 열이 방열되는 과정에서의 알루미늄판(10)과의 박리우려가 높아 메탈 인쇄회로기판의 수명 단축의 문제점도 안고 있다.In addition, the conventional metal printed circuit board is made of an insulating material made of a material such as epoxy resin (Epoxy Resin) between the copper plate 30 and the aluminum plate 10 when integrally manufactured through hot pressing. Due to the weak bonding force of the insulating material 20, the separation of the aluminum material 10 with the aluminum plate 10 in the process of heat dissipation causes a problem of shortening the life of the metal printed circuit board.

한편, 상기와 같은 문제점을 해결하기 위한 종래기술로 대한민국 등록특허공보 제10-0970209호에는 방열 인쇄회로기판용 금속 베이스 동박적층판의 제조방법이 게재되어 있는데, 그 주요 기술적 구성은 알루미늄 판의 일면에 유기필름을 부착한 후, 황산-염산 혼합용액으로 피트 에칭처리하여 유기필름이 부착된 면의 반대 면에 피트를 형성하고, 피트가 형성된 면에 에폭시 계의 절연수지 도포 동박을 적층한 후, 알루미늄 판과 절연수지 도포 동박을 압축시켜 접착함으로써 금속 베이스 동박적층판을 제조하되, 상기 황산-염산 혼합용액은 황산 10 내지 30 중량%, 염산 20 내지 50 중량%, 물 30 내지 60 중량%를 포함하여 30 내지 70℃에서 10초 내지 5분 동안 교반하여 생성하고, 황산-염산 혼합 용액에 직류 전류를 통전시켜 피트를 형성시키는 것을 특징으로 한다.Meanwhile, Korean Patent Publication No. 10-0970209 discloses a method of manufacturing a metal base copper clad laminate for a heat dissipation printed circuit board as a conventional technology for solving the above problems. The main technical configuration is on one surface of an aluminum plate. After attaching the organic film, pit etching was performed with a sulfuric acid-hydrochloric acid mixed solution to form a pit on the opposite side to which the organic film was attached, and then laminated an epoxy resin coated copper foil on the surface where the pit was formed. A metal base copper-clad laminate is prepared by compressing and adhering the plate and the insulating resin coated copper foil. It is produced by stirring for 10 seconds to 5 minutes at -70 ℃, characterized in that to form a pit by applying a direct current to the sulfuric acid-hydrochloric acid mixed solution .

하지만, 상기 구성은 전해방식에 의해 알루미늄 판에 피트를 형성시키는 것이므로, 피트 형성시 별도의 전기장치 시설이 필요하고, 피트 형성시간이 오래 걸리며, 피트 형성 공정이 복잡하므로 제조 원가가 높아지고, 대량 생산에 부적합하다는 문제점이 있었다.
However, since the above configuration is to form the pit on the aluminum plate by the electrolytic method, a separate electric device is required when forming the pit, the pit forming time is long, and the pit forming process is complicated, resulting in high manufacturing cost and mass production. There was a problem that was not suitable for.

따라서 이러한 문제점을 해결하기 위한 것으로서, 본 발명의 목적은 방열기능을 하는 알루미늄판의 일면에 절연재(insulating material)가 일면에 부착된 동판(copper plate)을 밀착하고 핫프레싱하여 일체화함에 따라 그 제조가 간단할 뿐만 아니라 양산시 불량률을 줄일 수 있는 메탈 인쇄회로기판 을 제공함에 있다.Therefore, to solve this problem, an object of the present invention is to manufacture the aluminum plate to the heat dissipation function in close contact with the copper plate (insulating material) attached to one surface (hot copper pressing) and integrating the hot plate. It is not only simple but also provides a metal printed circuit board which can reduce the defect rate during mass production.

또한, 본 발명은 메탈 인쇄회로기판 제조시 알루미늄판과 절연재(insulating material) 사이의 접촉면적을 넓혀 강한 결합 상태를 유지할 수 있는 메탈 인쇄회로기판 을 제공함에 다른 목적이 있다.In addition, another object of the present invention is to provide a metal printed circuit board that can maintain a strong bonding state by widening the contact area between the aluminum plate and the insulating material (insulating material) when manufacturing the metal printed circuit board.

또한, 본 발명은 비전해 방식에 의해 알루미늄판에 표면조도를 형성시킴으로써 별도의 전기장치 없이도 단순한 공정에 의해 표면조도를 형성시킬 수 있도록 하여 제조원가를 줄이고 생산성이 뛰어난 메탈 인쇄회로기판을 제공함에 또 다른 목적이 있다.
In addition, the present invention by forming the surface roughness on the aluminum plate by the non-electrolytic method to form the surface roughness by a simple process without a separate electrical device to reduce the manufacturing cost and to provide a metal printed circuit board with high productivity There is a purpose.

이와 같은 기술적 과제를 해결하기 위해 본 발명에 따른 메탈 인쇄회로기판은; Metal printed circuit board according to the present invention to solve such technical problems;

동박(Copper Foil)의 일면에 세라믹 필러(ceramic filler)가 첨가된 에폭시수지(Epoxy Resin)로 이루어진 절연재를 코팅하여 반경화시킨 도전성부재와,A conductive member semi-cured by coating an insulating material made of epoxy resin with a ceramic filler added to one surface of a copper foil;

상기 도전성부재의 절연재가 밀착되며 핫프레싱에 의해 일체로 결합되는 알루미늄판으로 이루어지되,The insulating member of the conductive member is in close contact and made of an aluminum plate which is integrally coupled by hot pressing,

상기 알루미늄판의 일면은 무전해 방식으로 에칭(etching) 처리하여 그 표면에 요철이 균일한 형상으로 반복되는 형태의 표면조도가 형성되며, 상기 표면조도가 형성된 일면에 도전성부재가 밀착되는 것을 특징으로 한다.One surface of the aluminum plate is etched in an electroless manner to form surface roughness in which irregularities are repeated in a uniform shape, and the conductive member is in close contact with one surface of the surface roughness. do.

이때, 상기 표면조도는 알루미늄판의 표면에서 3 ~4 ㎛ 깊이로 형성된 것을 특징으로 한다.
At this time, the surface roughness is characterized in that formed in a depth of 3 ~ 4 ㎛ on the surface of the aluminum plate.

본 발명에 따르면 동판의 일면에 절연재를 코팅하여 반경화시킨 도전성부재와 알루미늄판을 적층하고 핫프레싱 공정을 통해 일체로 결합함으로써 메탈 인쇄회로기판의 제조가 간단하고, 대량으로 메탈 인쇄회로기판을 양산시에도 정밀도를 요하지 않아 불량률을 획기적으로 줄일 수 있는 장점이 있다.According to the present invention, by manufacturing a metal printed circuit board by mass production of a metal printed circuit board by stacking a semiconducting conductive member and an aluminum plate coated with an insulating material on one surface of the copper plate and combining them integrally through a hot pressing process. Even though it does not require precision, there is an advantage that can significantly reduce the defective rate.

또한, 본 발명은 메탈 인쇄회로기판 제조시 알루미늄판의 일면에 무전해 에칭처리하여 표면에 요철이 균일한 형상으로 반복되는 형태의 표면 조도를 형성하여 절연재와의 접촉면적을 넓혀 강한 결합 상태를 유지할 수 있음은 물론, 추후 알루미늄을 통한 방열되는 과정에서의 알루미늄판과의 박리가 최소화되어 메탈 인쇄회로기판의 수명을 연장할 수 있는 장점도 있다.
In addition, the present invention in the manufacture of a metal printed circuit board by electroless etching on one surface of the aluminum plate to form a surface roughness of the shape of the irregularities repeated in a uniform shape on the surface to expand the contact area with the insulating material to maintain a strong bonding state Of course, there is also an advantage that can minimize the peeling with the aluminum plate in the process of heat dissipation through the aluminum later to extend the life of the metal printed circuit board.

도 1은 일반적인 메탈 인쇄회로기판의 제조 방식을 설명하기 위해 도시한 도면이다.
도 2는 본 발명에 따른 메탈 인쇄회로기판의 제조 방식을 설명하기 위해 도시한 도면이다.
도 3은 본 발명에 따른 메탈 인쇄회로기판의 제조 공정 흐름도이다.1 is a view illustrating a manufacturing method of a general metal printed circuit board.
2 is a view illustrating a manufacturing method of a metal printed circuit board according to the present invention.
3 is a flowchart illustrating a manufacturing process of a metal printed circuit board according to the present invention.

이하, 본 발명에 따른 메탈 인쇄회로기판을 첨부한 도면을 참고로 하여 상세히 기술되는 실시 예에 의하여 그 특징들을 이해할 수 있을 것이다.Hereinafter, with reference to the accompanying drawings of the metal printed circuit board according to the present invention will be understood the characteristics by the embodiments described in detail.

도 2에 의하면 본 발명에 따른 메탈 인쇄회로기판(100)은 동판(112)의 일면에 절연재(insulating material)(114)를 코팅하여 반경화시킨 도전성부재(110)와, 상기 도전성부재(110)의 절연재(insulating material)(114)가 밀착되며 핫프레싱에 의해 일체로 결합되는 알루미늄판(120)으로 이루어진다.Referring to FIG. 2, the metal printed circuit board 100 according to the present invention includes a conductive member 110 coated and semi-cured by coating an insulating material 114 on one surface of the copper plate 112, and the conductive member 110. The insulating material (114) of the close contact is made of an aluminum plate 120 which is integrally coupled by hot pressing.

이때, 상기 도전성부재(110)를 구성하는 동판(112)은 동박(Copper Foil)을 사용한다.At this time, the copper plate 112 constituting the conductive member 110 uses a copper foil.

그리고, 상기 절연재(insulating material)(114)는 절연성이 뛰어난 에폭시수지(Epoxy Resin)에 상기 에폭시 수지의 열팽창계수를 낮추기 위한 세라믹 필러(Ceramic Filler)를 첨가하여 이루어지지만, 이외에도 다양한 절연용 수지를 선택적으로 사용할 수 있다.In addition, the insulating material 114 is made by adding a ceramic filler to lower the thermal expansion coefficient of the epoxy resin to an epoxy resin having excellent insulation, but in addition to the various insulating resins Can be used as

한편, 상기 도전성부재(110)는 동판(112)의 일면에 절연재(insulating material)(114)를 코팅하고 반경화시킨 상태이므로, 도전성부재(110)를 알루미늄판(120)의 일면에 밀착시키고 일정한 열을 가하면서 압착하는 핫프레싱을 통해 도전성부재(110)와 알루미늄판(120)을 일체화시키게 된다.Meanwhile, since the conductive member 110 is coated and semi-cured with an insulating material 114 on one surface of the copper plate 112, the conductive member 110 closely adheres to one surface of the aluminum plate 120 and is fixed. The conductive member 110 and the aluminum plate 120 are integrated through hot pressing while applying heat.

특히 상기 알루미늄판(120)의 일면은 무전해 방식으로 에칭(etching) 처리하여 그 표면에 요철이 균일한 형상으로 반복되는 형태의 표면조도(122)를 형성함으로써 도전성부재(110)를 밀착하고 핫프레싱을 하는 경우 절연재(insulating material)(114)가 표면조도(122)의 사이로 침투되어 강한 결합상태를 유지할 수 있게 된다.In particular, one surface of the aluminum plate 120 is etched in an electroless manner to form a surface roughness 122 having a shape in which irregularities are repeated in a uniform shape on the surface thereof, thereby closely contacting the conductive member 110 and hot. In pressing, an insulating material 114 is penetrated between the surface roughness 122 to maintain a strong bonding state.

보다 상세히 설명하면, 염산 15%와 물 85%가 혼합되어 있는 수용액에 알루미늄판(120)의 일측면이 잠기도록 한 후 염산과 물의 혼합물에 요동을 가하여 5분 ~ 10분 정도 유지시키면 별도의 전기 공급이 없이도 화학반응에 의해 알루미늄판(120)의 표면에 요철 형상이 균일한 형태로 반복되는 표면조도(122)가 형성되는데, 이러한 무전해 방식은 별도의 전기장치가 필요 없으므로 공정이 간편할 뿐만 아니라, 제조비용과 시간을 줄일 수 있어 대량생산에 유리한 장점을 갖게 된다.In more detail, one side of the aluminum plate 120 is immersed in an aqueous solution in which 15% hydrochloric acid and 85% water are mixed, and then shakes the mixture of hydrochloric acid and water to maintain 5 minutes to 10 minutes. The surface roughness 122 is formed on the surface of the aluminum plate 120 by a chemical reaction without a supply, and the surface roughness 122 is repeated in a uniform form. The electroless method does not require a separate electric device, so the process is simple. In addition, manufacturing costs and time can be reduced, which is advantageous for mass production.

이때, 상기 표면조도(122)의 깊이는 알루미늄판(120)의 표면에서 3 ~ 4 ㎛ 정도 형성함이 바람직한데 그 이유는, 표면조도(122)의 깊이가 3 ㎛ 보다 작은 경우 알루미늄판(120)과 도전성부재(110) 사이의 접착 면적이 줄어들어 밀착력이 떨어지게 되고, 표면조도(122)의 깊이가 4 ㎛ 보다 큰 경우에는 알루미늄판(120)과 도전성부재(110) 사이의 접착 면적은 넓어지지만, 표면조도(122)의 형성에 소요되는 시간 및 비용이 증가하게 되어 생산성이 떨어지게 되는 문제점이 있기 때문이다.At this time, the depth of the surface roughness 122 is preferably formed about 3 ~ 4 ㎛ on the surface of the aluminum plate 120, the reason is, if the depth of the surface roughness 122 is less than 3 ㎛ aluminum plate 120 Adhesion area between the conductive member 110 and the conductive member 110 decreases, and the adhesion area between the aluminum plate 120 and the conductive member 110 becomes wider when the surface roughness 122 has a depth greater than 4 μm. This is because the time and cost required to form the surface roughness 122 is increased, resulting in a drop in productivity.

한편, 본 발명에 따른 메탈 인쇄회로기판(100)은 그 알루미늄판(120)의 단면 또는 양면을 선택적으로 사용하거나 또는 다층으로 형성할 수 있다. 즉, 본 발명에 따른 메탈 인쇄회로기판은 단면구조(Single Side Substrate)이외에도 도면으로 도시하지는 않았지만, 양면구조(Double Side Substrate) 그리고 다층구조(Multi Layer Substrate) 등의 다양한 구조에 적용할 수 있다.
Meanwhile, the metal printed circuit board 100 according to the present invention may selectively use one or both surfaces of the aluminum plate 120 or may be formed in multiple layers. That is, the metal printed circuit board according to the present invention may be applied to various structures, such as a double side structure and a multi layer structure, although not illustrated in the drawings in addition to the single side substrate.

이하, 도 2 및 도 3을 참고로 본 발명에 따른 메탈 인쇄회로기판의 제조 공정을 상세히 설명한다.Hereinafter, a manufacturing process of a metal printed circuit board according to the present invention will be described in detail with reference to FIGS. 2 and 3.

먼저, 본 발명에 따른 메탈 인쇄회로기판(100)의 제조방법은 크게 3단계(S100,S200,S300)로 구성되는데, 제1단계(S100)는 동판(112)의 일면에 에폭수 수지를 포함한 절연용 수지로 이루어지는 절연재(114)를 코팅하여 반경화시킨 도전성부재(110)를 알루미늄판(120)의 일면에 결합시켜 일체화시킴으로써 메탈 인쇄회로기판(100)의 형상을 이루도록 하는 것이고, 제2단계(S200)는 제1단계(S100)에서 일체화된 도전성부재(110)와 알루미늄판(120)의 형상을 교정하여 메탈 인쇄회로기판(100)이 올바른 형상 및 모양을 이룰 수 있도록 하는 것이며, 제3단계(S300)는 약품처리를 통해 메탈 인쇄회로기판(100)의 제조과정 중 동판(112)의 표면에 발생하는 얼룩이나 스크래치 등을 제거하고, 동판(112)의 표면에 남아 있는 유기물 등의 오염물질을 제거하기 위하여 후처리하는 것이다.First, the manufacturing method of the metal printed circuit board 100 according to the present invention is largely composed of three steps (S100, S200, S300), and the first step (S100) includes an epoxy resin on one surface of the copper plate 112. The conductive member 110 formed by coating the insulating material 114 made of an insulating resin is bonded to one surface of the aluminum plate 120 to be integrated to form a metal printed circuit board 100. S200 is to correct the shapes of the conductive member 110 and the aluminum plate 120 integrated in the first step (S100) so that the metal printed circuit board 100 can achieve the correct shape and shape, and the third Step S300 is to remove stains or scratches generated on the surface of the copper plate 112 during the manufacturing process of the metal printed circuit board 100 through the chemical treatment, and to contaminate organic substances and the like remaining on the surface of the copper plate 112. Post-treatment to remove material.

보다 상세히 설명하면, 상기 제1단계(S100)는 표면조도 형성단계(S110)와, 수세 및 건조단계(S120)와, 프레스 결합단계(S130)를 포함하여 구성되는데, 상기 표면조도 형성단계(S110)는 알루미늄판(120)과 도전성부재(110)의 접합 면적을 증가시켜 결합력을 강화시키기 위하여 알루미늄판(120)의 일면에 표면조도(122)를 형성시키는 것으로, 알루미늄판(120)의 일면을 무전해 방식으로 에칭(etching) 처리하여 표면에 요철이 균일한 형상으로 반복되는 형태의 표면조도(122)를 형성시킬 수 있게 된다.In more detail, the first step (S100) comprises a surface roughness forming step (S110), washing and drying step (S120), and a press bonding step (S130), the surface roughness forming step (S110) ) Is to form a surface roughness 122 on one surface of the aluminum plate 120 to increase the bonding area of the aluminum plate 120 and the conductive member 110 to strengthen the bonding force, the surface of the aluminum plate 120 Etching is performed in an electroless manner to form a surface roughness 122 having a shape in which irregularities are repeated in a uniform shape on the surface.

즉, 염산 15%와 물 85%가 혼합되어 있는 수용액에 알루미늄판(120)의 일측면이 잠기도록 한 후 5분 ~ 10분 정도 유지시키면 알루미늄판(120)의 표면에 약 3~4㎛ 높이의 표면조도(122)가 형성되는 것이다.That is, one side of the aluminum plate 120 is immersed in an aqueous solution in which 15% hydrochloric acid and 85% water are mixed, and then maintained for about 5 minutes to about 10 minutes to have a height of about 3 to 4 μm on the surface of the aluminum plate 120. Surface roughness 122 is to be formed.

다음, 상기 수세 및 건조단계(S120)는 일면에 표면조도(122)가 형성된 알루미늄판(120)을 물로 세척하여 표면조도(122) 형성 후 알루미늄판(120)에 남아있는 이물질을 제거하고 건조시키는 단계이다.Next, the washing and drying step (S120) is to wash the aluminum plate 120 having the surface roughness 122 formed on one surface with water to remove foreign matter remaining on the aluminum plate 120 after the surface roughness 122 is formed and dried. Step.

또한, 상기 프레스 결합단계(S130)는 표면조도(122)가 형성된 알루미늄판(120)의 일면에 도전성부재(110)를 일체로 결합시키는 단계에 관한 것으로, 이때, 상기 도전성부재(110)로는 전술한 바와 같이, 동판(112)의 일면에 절연재(114)를 코팅하여 반경화시킨 도전성부재(110)를 사용하게 되고, 절연재(114)가 코팅된 면이 표면조도(122)가 형성된 알루미늄판(120)의 일면에 맞닿도록 한 후 핫프레스기를 이용하여 열압착의 방식으로 가압함으로써 도전성부재(110)와 알루미늄판(120)을 일체화시킬 수 있게 된다.In addition, the press coupling step (S130) relates to the step of integrally coupling the conductive member 110 to one surface of the aluminum plate 120, the surface roughness 122 is formed, in this case, the conductive member 110 As described above, one surface of the copper plate 112 is coated with an insulating member 114 to be semi-cured, and the conductive member 110 is used, and the surface coated with the insulating member 114 has an aluminum plate having a surface roughness 122 ( The conductive member 110 and the aluminum plate 120 may be integrally formed by contacting one surface of the substrate 120 and then pressurized in a thermocompression bonding manner using a hot press.

이때, 상기와 같이 도전성부재(110)의 절연재(insulating material)(114)가 알루미늄판(120)의 일면에 밀착되도록 적층시킨 상태에서 열압착 방식에 의해 압착 결합시키는 경우, 알루미늄판(120)에 형성된 표면조도(122)에 의해 알루미늄판(120)과 절연재(114) 사이의 접합 면적이 증가될 뿐만 아니라, 핫프레스기로부터 발생되는 열에 의해 절연재(114)가 거친 표면조도(122)에 침투되어 도전성부재(110)와 알루미늄판(120)이 강한 결합상태를 유지할 수 있게 된다.At this time, when the insulating material (114) of the conductive member 110 is laminated so as to be in close contact with one surface of the aluminum plate 120 as described above, when the compression bonding by a thermocompression method, to the aluminum plate 120 The surface roughness 122 formed not only increases the bonding area between the aluminum plate 120 and the insulating material 114, but also allows the insulating material 114 to penetrate into the rough surface roughness 122 by the heat generated from the hot press. The member 110 and the aluminum plate 120 can maintain a strong bonding state.

한편, 상기 제2단계(S200)는 휨교정단계(S210)와, 버(burr) 제거단계(S220) 및 라미네이팅 단계(S230)를 포함하여 구성되는데, 상기 휨교정단계(S210)는 핫프레싱 공정에 의해 일체화된 도전성부재(110)와 알루미늄판(120)이 휘어진 것을 바로잡아 평평한 형태를 이루도록 하는 것으로, 일체화된 도전성부재(110)와 알루미늄판(120)을 롤러 등의 장치에 통과시켜 평평하게 교정하는 단계이다.On the other hand, the second step (S200) comprises a bending correction step (S210), a burr (burr) removing step (S220) and laminating step (S230), the bending correction step (S210) is a hot pressing process The conductive member 110 and the aluminum plate 120, which are integrated by the straightening, are straightened to form a flat shape. The integrated conductive member 110 and the aluminum plate 120 are passed through a device such as a roller and flattened. This is a step to calibrate.

또한, 상기 버 제거단계(S220)는 일체화된 도전성부재(110)와 알루미늄판(120)의 외곽 부분에 형성된 버를 면취가공(Bevelling)을 통해 제거함으로써 메탈 인쇄회로기판(100)의 불량률을 감소시킬 수 있도록 하는 것이고, 상기 라미네이팅(Laminating) 단계(S230)는 알루미늄판(120)의 노출된 면에 보호테이프를 접착하여 노출면을 밀폐시킴으로써 후술할 제3단계(S300)의 에칭 및 수세단계(S320)에서 알루미늄판(120)의 노출된 면을 보호할 수 있도록 하기 위한 단계이다.In addition, the burr removing step (S220) reduces the defect rate of the metal printed circuit board 100 by removing burrs formed on the outer portions of the integrated conductive member 110 and the aluminum plate 120 through beveling. In the laminating step (S230), the protective tape is adhered to the exposed surface of the aluminum plate 120 to seal the exposed surface, thereby etching and washing in the third step (S300). In step S320 to protect the exposed surface of the aluminum plate 120.

다음, 상기 제3단계(S300)는 전술한 바와 같이, 후처리 과정을 통해 동판(112)의 표면을 깨끗이 함으로써 본 발명에 따른 메탈 인쇄회로기판(100)을 완성시킬 수 있도록 하는 것으로, 탈지 및 수세단계(S310)와, 에칭 및 수세단계(S320) 및 방청 및 수세단계(S330)를 포함하여 구성된다.Next, the third step (S300), as described above, to complete the metal printed circuit board 100 according to the present invention by cleaning the surface of the copper plate 112 through a post-treatment process, degreasing and It comprises a washing step (S310), etching and washing step (S320) and rust prevention and washing step (S330).

보다 상세히 설명하면, 상기 탈지 및 수세단계(S310)는 동판(112)의 표면에 존재하는 지문이나 이물질들을 제거하기 위한 것으로, 본 발명에서는 가성소다 또는 아민계열의 혼합물을 이용한 알칼리 탈지법이 사용된다. 즉, 가성소다 또는 아민계열의 혼합물을 이용하여 유지분을 산화시켜 동판(112)의 표면에 존재하는 지문이나 이물질을 제거하는 것이다.In more detail, the degreasing and washing step S310 is for removing fingerprints or foreign substances present on the surface of the copper plate 112. In the present invention, an alkali degreasing method using a mixture of caustic soda or amine series is used. . That is, the oil or fat is oxidized using a mixture of caustic soda or an amine series to remove fingerprints or foreign substances present on the surface of the copper plate 112.

이때, 상기 가성소다에 계면활성제를 첨가하여 유화작용이 원활히 이루어지도록 할 수도 있음은 물론이다.At this time, it is also possible to add a surfactant to the caustic soda to facilitate the emulsification.

또한, 탈지작업은 반응속도를 향상시키기 위해 약 30도 정도로 온도를 높여 4~5분 동안 이루어지고, 탈지가 마무리된 후에는 물로 세척하여 동판(112)의 표면에 남아 있는 알칼리 성분을 씻어낸다.In addition, the degreasing operation is performed for 4 to 5 minutes by raising the temperature to about 30 degrees to improve the reaction rate, and after degreasing is completed by washing with water to wash off the alkaline components remaining on the surface of the copper plate (112).

다음, 상기 에칭 및 수세단계(S320)는 동판(112)의 표면에 존재하는 스크래치들을 없애기 위한 것으로, 본 발명에서는 과황산 소다와 황산의 혼합물을 사용하여 에칭작업을 진행함으로써 동판(112)의 색상이 변하지 않고 유지되도록 함과 동시에 탈지작업 후 동판(112)의 표면에 남아 있는 가성소다 또는 아민계열의 혼합물의 성분을 중화시킬 수 있도록 한다.Next, the etching and washing step (S320) is to remove the scratches on the surface of the copper plate 112, in the present invention, the color of the copper plate 112 by performing an etching operation using a mixture of soda persulfate and sulfuric acid It is possible to neutralize the components of the mixture of caustic soda or amine series remaining on the surface of the copper plate 112 after the degreasing operation while maintaining this unchanged.

이때, 상기 에칭작업은 실온에서 약 1~2분 동안 실시되고, 에칭 후에는 물로 세척하여 동판(112)의 표면에 남아 있는 황산 성분을 씻어낸다.At this time, the etching operation is carried out at room temperature for about 1 to 2 minutes, and after etching to wash off the sulfuric acid component remaining on the surface of the copper plate 112 by washing with water.

다음, 상기 방청 및 수세 단계(S330)는 동판(112)의 표면이 공기 중에서 산화되는 것을 방지하기 위한 것으로, 이와 같은 방청작업은 종래부터 사용되고 있는 것이므로 상세한 설명은 생략하기로 한다.Next, the rust prevention and washing step (S330) is to prevent the surface of the copper plate 112 is oxidized in the air, such a rust prevention operation is conventionally used, so a detailed description thereof will be omitted.

이와 같이, 방청작업을 마친 후 마지막으로 일체화된 도전성부재(110)와 알루미늄판(120)의 외측 표면에 남아 있는 이물질이나 약품 성분들을 물로 씻어낸 후 건조시키면 본 발명에 따른 메탈 인쇄회로기판(100)이 완성되는 것이다.As such, after finishing the rust preventive work, the foreign matter or chemical components remaining on the outer surfaces of the conductive member 110 and the aluminum plate 120 integrated with the water are dried after washing with water and then the metal printed circuit board 100 according to the present invention. ) Is completed.

그리고, 완성된 메탈 인쇄회로기판(100)은 전기 절연 테스트, 절연층 쇼트 테스트 등의 검수과정을 거친 후 진공 포장하여 출하하게 된다.
Then, the completed metal printed circuit board 100 is vacuum-packed after the inspection process such as electrical insulation test, insulation layer short test, and shipped.

따라서, 전술한 바와 같이 구성된 본 발명에 따른 메탈 인쇄회로기판에 의하면 동판(112)의 일면에 절연재(114)를 코팅하여 반경화시킨 도전성부재(110)와 알루미늄판(120)을 적층하고 핫프레싱 공정을 통해 일체로 결합함으로써 메탈 인쇄회로기판(100)의 제조가 간단하고, 대량으로 메탈 인쇄회로기판(100)을 양산시에도 정밀도를 요하지 않아 불량률을 획기적으로 줄일 수 있고, 메탈 인쇄회로기판(100) 제조시 알루미늄판(120)의 일면에 무전해 에칭처리하여 요철이 균일한 형상으로 반복되는 형태의 표면조도(122)를 형성하여 절연재(114)와의 접촉면적을 넓혀 강한 결합 상태를 유지할 수 있음은 물론, 추후 알루미늄을 통한 방열되는 과정에서의 알루미늄판(120)과의 박리가 최소화되어 메탈 인쇄회로기판(100)의 수명을 연장할 수 있는 등의 다양한 장점을 갖는 것이다.
Therefore, according to the metal printed circuit board according to the present invention configured as described above, the conductive member 110 and the aluminum plate 120, which are semi-cured by coating the insulating material 114 on one surface of the copper plate 112, are laminated and hot pressed. By integrally combining through the process, the manufacturing of the metal printed circuit board 100 is simple, and even when mass production of the metal printed circuit board 100 does not require precision, the defect rate can be drastically reduced, and the metal printed circuit board 100 ) During manufacturing, electroless etching is performed on one surface of the aluminum plate 120 to form a surface roughness 122 in which irregularities are repeated in a uniform shape, thereby widening the contact area with the insulating material 114 to maintain a strong bonding state. Of course, the peeling with the aluminum plate 120 in the process of heat dissipation through the aluminum is minimized later to have a variety of advantages such as to extend the life of the metal printed circuit board 100 will be.

이상에서는 본 발명의 바람직한 실시 예를 설명하였으나, 본 발명의 권리범위는 이에 한정되지 않으며, 본 발명의 실시 예와 실질적으로 균등한 범위에 있는 것까지 본 발명의 권리범위가 미치는 것으로 본 발명의 정신을 벗어나지 않는 범위 내에서 당해 발명이 속하는 기술분야에서 통상의 지식을 가진 자에 의해 다양한 변형 실시가 가능한 것이다.
While the present invention has been described in connection with what is presently considered to be preferred embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

100: 메탈 인쇄회로기판 110: 도전성부재
112: 동판 114: 절연재
120: 알루미늄판 122: 표면조도100: metal printed circuit board 110: conductive member
112: copper plate 114: insulating material
120: aluminum plate 122: surface roughness

Claims (2)

동박(Copper Foil)의 일면에 세라믹 필러(ceramic filler)가 첨가된 에폭시수지(Epoxy Resin)로 이루어진 절연재를 코팅하여 반경화시킨 도전성부재와,
상기 도전성부재의 절연재가 밀착되며 핫프레싱에 의해 일체로 결합되는 알루미늄판으로 이루어지되,
상기 알루미늄판의 일면은 무전해 방식으로 에칭(etching) 처리하여 그 표면에 요철이 균일한 형상으로 반복되는 형태의 표면조도가 형성되며, 상기 표면조도가 형성된 일면에 도전성부재가 밀착되는 것을 특징으로 하는 메탈 인쇄회로기판.
A conductive member semi-cured by coating an insulating material made of epoxy resin with a ceramic filler added to one surface of a copper foil;
The insulating member of the conductive member is in close contact and made of an aluminum plate which is integrally coupled by hot pressing,
One surface of the aluminum plate is etched in an electroless manner to form surface roughness in which irregularities are repeated in a uniform shape, and the conductive member is in close contact with one surface of the surface roughness. Metal printed circuit board.
제 1항에 있어서,
상기 표면조도는 알루미늄판의 표면에서 3 ~4 ㎛ 깊이로 형성된 것을 특징으로 하는 메탈 인쇄회로기판.
The method of claim 1,
The surface roughness is a metal printed circuit board, characterized in that formed on the surface of the aluminum plate 3 ~ 4 ㎛ depth.
KR1020110126009A 2011-11-29 2011-11-29 Metal printed circuit board KR101214261B1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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