KR20120042497A - Multi spray nozzle of dispenser for pcb - Google Patents

Multi spray nozzle of dispenser for pcb Download PDF

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Publication number
KR20120042497A
KR20120042497A KR1020100104212A KR20100104212A KR20120042497A KR 20120042497 A KR20120042497 A KR 20120042497A KR 1020100104212 A KR1020100104212 A KR 1020100104212A KR 20100104212 A KR20100104212 A KR 20100104212A KR 20120042497 A KR20120042497 A KR 20120042497A
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South Korea
Prior art keywords
underfill
nozzle body
nozzle
spray
dispenser
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KR1020100104212A
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Korean (ko)
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KR101187637B1 (en
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문효재
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재성정밀주식회사
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Priority to KR1020100104212A priority Critical patent/KR101187637B1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/14—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Coating Apparatus (AREA)

Abstract

PURPOSE: A multi-spray nozzle of a printed circuit board(PCB) dispenser is provided to shorten spray time of under fill during dotting by installing a plurality of spray ports a plurality of spray ports in lower part of the nozzle. CONSTITUTION: A multi-spray nozzle of a PCB dispenser comprises a nozzle body(1), a spray control valve, and a spray port(2). A rotation pulley unit(103) is formed around outer circumference of the nozzle body. A drive motor(3) is installed in one side of the nozzle body. A rotation pulley part revolves with the drive motor. More than 2 injection pipes(201) are formed in the spray port. The injection pipe is connected with an exhausting part(102) of the nozzle body at the same time.

Description

피씨비용 디스펜서의 멀티 분사 노즐{Multi spray nozzle of dispenser for PCB} Multi spray nozzle of dispenser for PCB

본 발명은 피씨비용 디스펜서의 멀티 분사 노즐에 관한 것으로 보다 구체적으로는 피씨비(PCB) 상에 반도체 칩을 부착하기 위하여 언더필을 도팅하는 디스펜서의 노즐의 구조를 개선하여 이동속도와 도팅 속도를 향상시킴으로써 디스펜싱 작업의 생산성을 향상시킬 수 있도록 한 피씨비용 디스펜서의 멀티 분사 노즐에 관한 것이다.
The present invention relates to a multi-jet nozzle of a PCB cost dispenser, and more particularly, to improve the movement speed and the dotting speed of the dispenser by improving the structure of the nozzle of the dispenser for dotting the underfill to attach the semiconductor chip onto the PCB. The present invention relates to a multi-jet nozzle of a PCB dispenser that can improve the productivity of the fencing operation.

각종 전자기기가 점차 소형화되고, 그에 따른 두께도 얇아짐에 따라서 전자기기 내부에 설치되는 회로기판을 좀더 작고 얇게 만드는 기술이 개발되었으며 그러한 기술 중에서 대표적인 예가 바로 칩 스케일 패키지 형태의 플립 칩을 회로기판에 접합하는 것이었다.As various electronic devices are gradually miniaturized and the thickness thereof becomes thinner, a technology for making a circuit board installed inside the electronic device smaller and thinner has been developed. A representative example of such technologies is a chip scale package type flip chip on a circuit board. It was to join.

즉, 상기 플립 칩(flip chip)은 반도체 칩을 회로 기판에 부착시킬 때 금속 리드(와이어)와 같은 추가적인 연결 구조나 볼 그리드 어레이(BGA)와 같은 중간 매체를 사용하지 않고 칩 아랫면의 전극 패턴을 이용해 그대로 융착시키는 방식을 적용하기 때문에 플립 칩을 선 없는(leadless) 반도체라고도 한다.In other words, the flip chip is used to attach the electrode pattern on the bottom surface of the chip without using an additional connection structure such as a metal lead (wire) or an intermediate medium such as a ball grid array (BGA) when attaching the semiconductor chip to a circuit board. Flip chips are sometimes referred to as leadless semiconductors because they are applied as they are.

따라서 패키지가 칩 크기와 같아 소형, 경량화에 유리하고, 전극 간 거리(피치)를 훨씬 미세하게 할 수 있기 때문에 전자기기의 소형화, 박형화에 유리한 것이다.
Therefore, the package is the same as the chip size, which is advantageous for miniaturization and weight reduction, and the distance (pitch) between electrodes can be made much smaller, which is advantageous for miniaturization and thinning of electronic devices.

한편, 플립칩 패키지에서 다이와 캐리어의 접합은 다이 표면에 형성된 도체 물질인 ‘범프(bump; 융기 또는 혹)’에 의해 이루어지게 되는데 다이에 범프를 형성시킨 후 범프가 형성된 면을 캐리어에 직접 접합하게 된다.Meanwhile, in the flip chip package, the die and the carrier are joined by a 'bump' which is a conductor material formed on the die surface. After the bump is formed on the die, the bumped surface is directly bonded to the carrier. do.

또한, 플립칩 접합은 일반적으로 솔더(solder)를 이용하거나 도체 성질을 가진 접착제를 사용하는 두 가지 중 한가지 방식으로 이루어지게 되는데 일반적으로는 솔더를 접합제로 사용하고 있는 실정이다.In addition, flip chip bonding is generally performed in one of two ways, using a solder or using an adhesive having a conductor property. Generally, solder is used as a bonding agent.

한편, 다이가 접합이 되면, 다이와 기판의 사이는 다이와 캐리어의 틈을 보강하기 위한 용도로 개발된 전용 에폭시(epoxy)인 언더필(underfill)을 사용하여 보강하는 디스펜싱 작업을 수행하게 된다.
On the other hand, when the die is bonded, the dispensing operation is performed between the die and the substrate by using an underfill, which is a dedicated epoxy developed for reinforcing the gap between the die and the carrier.

그런데 상기와 같이 디스펜싱 작업을 수행하기 위해서는 PCB 상에 부착되는 반도체의 정확한 위치를 판독한 후 그 위치로 노즐을 이동시켜 언더필을 도포하는 도팅(Dotting)을 수행해야 하지만, 종래에는 단순히 프로그램에 의해 가동되는 서보 시스템(SERVO SYSTEM)에 의해 위치 좌표를 인식하여 노즐이 이동하기 때문에 노즐이 이동하는 과정에서 미세한 오차가 발생하는 경우가 많고, 그러한 오차가 누적되어 정확한 위치에 디스펜싱 작업이 이루어지지 못한 불량이 발생하는 경우가 빈번한 문제점이 있었다.By the way, in order to perform the dispensing operation as described above, dotting is required to read the exact position of the semiconductor attached to the PCB and then move the nozzle to the position to apply the underfill. Since the nozzle moves by recognizing the position coordinate by the operating servo system, a small error often occurs during the movement of the nozzle, and the error is accumulated and the dispensing operation cannot be performed at the correct position. There was a frequent problem that the failure occurs.

또한, 디스펜서의 헤드에 복수의 노즐이 설치되어 있기는 하나, 각 노즐에는 언더필을 도팅하기 위한 분사포트(2)가 하나씩만 형성되어 있기 때문에 일정 양의 언더필을 분사하기 위해서 필요한 양을 분사하는데 따른 시간이 소요되어 도팅 속도가 떨어지는 문제점이 있었다.In addition, although a plurality of nozzles are provided in the head of the dispenser, since only one injection port 2 is formed in each nozzle for dotting underfill, the amount required for spraying a certain amount of underfill is required. There was a problem in that the dotting speed drops because of the time.

아울러, 종래에는 노즐이 헤드에 완전히 고정된 상태에서 서보 시스템에 의해 이동하는 헤드에 의해 노즐의 좌표가 설정되기 때문에 도팅을 위하여 헤드를 다른 위치로 이동하기 위해서는 서보 시스템이 헤드를 최대한 빨리 움직여야 함으로써 서보 시스템의 부담이 가중되는 문제점이 있을 뿐만 아니라, 서보 시스템에 의해서만 위치 좌표를 인식하여 헤드가 이동하는 경우에는 노즐의 위치 좌표에 미세한 오차가 발생하는 경우가 많고, 그러한 오차가 누적됨으로써 정확한 위치에 도팅이 이루어지지 못하는 불량이 발생하는 문제점이 있었다.
In addition, conventionally, since the nozzle coordinates are set by the head moving by the servo system while the nozzle is completely fixed to the head, the servo system must move the head as quickly as possible to move the head to another position for dotting. Not only is there a problem that the burden on the system is increased, but when the head is moved by recognizing the position coordinates only by the servo system, a small error often occurs in the position coordinates of the nozzle, and such an error accumulates and the dots are precisely placed. There was a problem that a failure that can not be made.

본 발명은 상기와 같은 종래의 문제점을 해소하기 위하여 안출한 것으로서, 본 발명의 목적은 디스펜서의 헤드에 설치된 노즐 하단부에 복수의 분사포트(2)를 설치함으로써 도팅시 언더필의 분사 시간을 단축시켜 작업 속도를 향상시킬 수 있을 뿐만 아니라, 노즐의 독립적인 회전 작동이 가능케 함으로써 디스펜서 헤드의 이동 횟수뿐만 아니라 이동 거리를 단축시킴으로써 그에 따른 도팅 속도를 향상시킬 수 있도록 한 피씨비용 디스펜서의 멀티 분사 노즐을 제공하는 데 있다.
The present invention has been made to solve the conventional problems as described above, the object of the present invention is to provide a plurality of injection ports (2) at the lower end of the nozzle installed in the head of the dispenser to reduce the injection time of the underfill during the operation In addition to increasing speed, the independent rotational operation of the nozzles allows the PCC dispenser's multi-dispensing nozzles to improve the dotting speed by shortening the travel distance as well as the number of moves of the dispenser head. There is.

상기와 같은 목적을 달성하기 위하여 본 발명은 언더필을 공급받는 공급부(101)와, 공급받은 언더필을 배출하는 배출부(102)가 형성되는 노즐바디(1)와; 상기 노즐바디(1)에 설치되어 언더필을 선택적으로 배출하기 위한 분사제어밸브와; 상기 배출부(102)에 설치되어 언더필을 방울 형태로 미세 분사하는 분사포트(2)를 설치하여 PCB상에 반도체 칩을 접착하기 위하여 언더필을 도팅하는 피씨비용 디스펜서 노즐에 있어서, In order to achieve the above object, the present invention includes a nozzle body (1) is formed with a supply unit 101 receives the underfill, and a discharge unit 102 for discharging the supplied underfill; An injection control valve installed at the nozzle body 1 to selectively discharge the underfill; In the PC cost dispenser nozzle is installed in the discharge portion 102 to install the injection port (2) for finely spraying the underfill in the form of droplets to do the underfill to adhere the semiconductor chip on the PCB,

상기 노즐바디(1)의 외주면 둘레에는 회전풀리부(103)를 형성하고, 상기 노즐바디(1) 일측에는 구동모터(3)를 설치하여 구동모터(3)에 의해 상기 회전풀리부(103)의 회전이 가능케 하고, 상기 분사포트(2)에는 상기 노즐바디(1)의 배출부(102)와 동시에 연통되는 2개소 이상의 분사관(201)을 형성한 구성이다.
The rotation pulley 103 is formed around the outer circumferential surface of the nozzle body 1, and a driving motor 3 is installed at one side of the nozzle body 1 so that the rotation pulley 103 is driven by the driving motor 3. It is possible to rotate, and the injection port (2) is formed in the two or more injection pipes 201 are formed in communication with the discharge portion 102 of the nozzle body (1) at the same time.

본 발명은 디스펜서의 헤드에 설치되는 노즐 하단부에 복수의 분사관을 형성한 분사포트를 설치함으로써 일정 양의 언더필을 분사하더라도 단일 분사관을 가진 분사포트에 비해 분사 시간이 단축되어 도팅 시간을 단축시킬 수 있는 효과가 있다.According to the present invention, even when a certain amount of underfill is injected, a spraying time is shortened compared to the spraying port having a single spraying tube, thereby shortening the dotting time by installing a spraying port having a plurality of spraying tubes formed at the lower end of the nozzle installed in the head of the dispenser. It can be effective.

또한, 헤드에 설치된 각 노즐의 독립적인 회전 작동이 가능케 함으로써 디스펜서 헤드의 이동 횟수뿐만 아니라 이동 거리를 단축시킴으로써 그에 따른 도팅 속도를 향상시켜 디스펜싱 작업의 생산성이 크게 향상되는 효과가 있다.
In addition, by enabling independent rotation operation of each nozzle installed in the head, as well as the number of movements of the dispenser head to shorten the moving distance thereby improving the dotting speed accordingly has the effect of greatly improving the productivity of the dispensing operation.

도 1은 본 발명의 바람직한 실시 예에 따른 사시도
도 2는 본 발명의 바람직한 실시 예에 따른 정면 예시도
도 3은 본 발명의 바람직한 실시 예에 따른 측면 예시도
도 4는 본 발명의 바람직한 실시 예에 따른 다양한 분사포트의 저면 예시도
도 5는 본 발명의 바람직한 실시 예에 따른 사용상태 예시도
도 6은 피씨비용 디스펜서를 나타낸 예시도이다.1 is a perspective view according to a preferred embodiment of the present invention
2 is a front view illustrating a preferred embodiment of the present invention.
Figure 3 is an illustration of a side according to a preferred embodiment of the present invention
Figure 4 is an illustration of the bottom of the various injection port in accordance with a preferred embodiment of the present invention
5 is an exemplary state of use according to a preferred embodiment of the present invention
6 is an exemplary view showing a PC cost dispenser.

이하, 본 발명을 첨부된 도면에 의하여 더욱 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

첨부된 도면들 중에서 동일한 구성 요소들은 가능한 어느 도면에서든지 동일한 부호를 사용하고 있음을 유의해야 하며, 본 발명의 요지를 불필요하게 흐릴 수 있는 공지 기능 또는 공지 구성에 대한 상세한 설명은 생략하였음을 미리 밝혀두는 바이다.
It is to be noted that like elements in the accompanying drawings use the same reference numerals in any of the drawings, and detailed descriptions of well-known functions or known configurations that may unnecessarily obscure the gist of the present invention are omitted. Come on.

먼저, 첨부도면 도 1 내지 도 3은 본 발명의 바람직한 실시 예에 따른 구성을 나타낸 노즐의 외관을 나타낸 예시도로서 도면에서 도시한 바와 같이 본 발명은 언더필을 공급받는 공급부(101)와, 공급받은 언더필을 배출하는 배출부(102)가 형성되는 노즐바디(1)와, 상기 노즐바디(1)에 설치되어 언더필의 분사를 제어하는 분사제어밸브와, 상기 배출부(102)에 설치되어 언더필을 방울 형태로 미세 분사하는 분사포트(2)로 구성된다.First, Figures 1 to 3 is an exemplary view showing the appearance of the nozzle showing the configuration according to a preferred embodiment of the present invention as shown in the drawing the present invention is supplied with an underfill supply unit 101, A nozzle body 1 having a discharge part 102 for discharging an underfill, an injection control valve installed at the nozzle body 1 to control injection of the underfill, and an underfill installed at the discharge part 102 It consists of a spray port (2) for fine spraying in the form of a drop.

이때, 상기 노즐바디(1)의 외주면 둘레에는 회전풀리부(103)를 노즐바디(1)와 일체로 형성하고, 상기 노즐바디(1) 일측에는 구동모터(3)를 설치하여 상기 회전풀리부(103)와 구동모터(3)의 구동풀리를 구동벨트로 연결함으로써, 구동모터(3)의 제어를 통해서 노즐바디(1)를 정회전 또는 역회전시킬 수 있게 된다.At this time, a rotation pulley 103 is integrally formed with the nozzle body 1 around the outer circumferential surface of the nozzle body 1, and a driving motor 3 is installed on one side of the nozzle body 1 to rotate the pulley. By connecting the driving pulley of the 103 and the driving motor 3 to the driving belt, the nozzle body 1 can be rotated forward or reversely through the control of the driving motor 3.

또한, 노즐바디(1)의 배출부(102)에 설치되는 분사포트(2)에는 노즐바디(1)의 배출부(102)와 동시에 연통되는 2개소 이상의 분사관(201)을 형성함으로써, 노즐바디(1)의 배출부(102)를 통해 배출되는 언더필을 2개소 이상의 분사관(201)을 이용해 동시에 분사할 수 있게 된다.In addition, the injection port 2 provided in the discharge part 102 of the nozzle body 1 forms two or more injection pipes 201 which communicate with the discharge part 102 of the nozzle body 1 at the same time. Underfill discharged through the discharge part 102 of the body 1 can be sprayed simultaneously using two or more injection pipes 201.

이렇게 2개소 이상의 분사관(201)을 통해 분사된 언더필은 피씨비 상면에 도팅됨과 동시에 한 방울로 뭉쳐지기 때문에 동일한 양의 언더필을 분사할 때 분사관(201)이 하나인 종래의 분사포트(2)에 비해 언더필의 분사 시간을 단축시킬 수 있게 되어 언더필 분사에 따른 도팅 시간을 단축시킬 수 있게 된다.
Since the underfill injected through two or more injection pipes 201 is doped on the upper surface of the PCB and agglomerated into one drop, the conventional injection port 2 having one injection pipe 201 when spraying the same amount of underfill is injected. In comparison with the above, it is possible to shorten the injection time of the underfill, thereby reducing the dotting time according to the underfill injection.

한편, 첨부도면 도 4는 본 발명의 여러 개의 분사관(201)을 가진 다양한 분사포트(2)를 도시한 저면 예시도로서 도 4의 (가)와 같이 분사관(201)이 2개인 경우에 피씨비 상면에 도팅된 언더필은 두 분사관(201) 간의 간격을 길이 방향으로 하는 타원형으로 된 언더필 방울이 형성되는 반면에 도 4의 (나) 또는 (다)와 같은 경우에는 그 방울의 크기가 점차 커지는 정원 형태의 언더필 방울이 형성된다.On the other hand, Figure 4 is a bottom view showing a variety of injection port (2) having a plurality of injection pipe 201 of the present invention as shown in Figure 4 (a) in the case of two injection pipe 201 The underfill doped on the upper surface of the PCB has an elliptical underfill droplet having a length between the two injection pipes 201 in the longitudinal direction, whereas the size of the droplet gradually increases in the case of (B) of FIG. 4. Underfill drops in the form of a garden are formed.

따라서 노즐바디(1)의 회전 기능과 2개소의 분사관(201)을 가진 분사포트(2)에 의해 형성되는 언더필 방울의 타원 형상을 이용하면 서보 시스템에 의한 헤드의 이동 없이도 언더필 방울의 긴 방향으로 가로 또는 세로 방향으로 선택하여 도팅할 수 있기 때문에 헤드의 이동 횟수뿐만 아니라 이동 거리를 단축시킬 수 있을 뿐만 아니라 그에 따른 도팅 속도를 향상시킬 수 있게 되는 것이다.
Therefore, by using the elliptical shape of the underfill droplet formed by the spraying function of the nozzle body 1 and the injection port 2 having two injection pipes 201, the long direction of the underfill droplet can be moved without moving the head by the servo system. By selecting in the horizontal or vertical direction, the number of head movements as well as the moving distance can be shortened, and thus the dotting speed can be improved.

이상에서는 본 발명의 바람직한 실시 예에 대하여 도시하고 설명하였으나, 본 발명은 상술한 특정의 실시 예에 한정되지 아니하며, 청구범위에서 청구하는 본 발명의 요지를 벗어남이 없이 당해 발명이 속하는 기술 분야에서 통상의 지식을 가진 자에 의해 다양한 변형 실시나 응용이 가능한 것은 물론이고, 이러한 변형 실시나 응용 예는 본 발명의 기술적 사상이나 전망으로부터 개별적으로 이해돼서는 안 될 것이다.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be construed as limiting the scope of the invention as defined by the appended claims. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.

1: 노즐바디 101: 공급부
102: 배출부 103: 회전풀리부
2: 분사포트 201: 분사관
3: 구동모터 4: 헤드1: nozzle body 101: supply part
102: discharge portion 103: rotary pulley
2: injection port 201: injection pipe
3: drive motor 4: head

Claims (1)

언더필을 공급받는 공급부(101)와, 공급받은 언더필을 배출하는 배출부(102)가 형성되는 노즐바디(1)와; 상기 노즐바디(1)에 설치되어 언더필을 선택적으로 배출하기 위한 분사제어밸브와; 상기 배출부(102)에 설치되어 언더필을 방울 형태로 미세 분사하는 분사포트(2)를 설치하여 PCB상에 반도체 칩을 접착하기 위하여 언더필을 도팅하는 피씨비용 디스펜서 노즐에 있어서,
상기 노즐바디(1)의 외주면 둘레에는 회전풀리부(103)를 형성하고, 상기 노즐바디(1) 일측에는 구동모터(3)를 설치하여 구동모터(3)에 의해 상기 회전풀리부(103)의 회전이 가능케 하고, 상기 분사포트(2)에는 상기 노즐바디(1)의 배출부(102)와 동시에 연통되는 2개소 이상의 분사관(201)을 형성한 구성으로 된 피씨비용 디스펜서의 멀티 분사 노즐. A nozzle body 1 having a supply unit 101 receiving an underfill and a discharge unit 102 for discharging the underfill; An injection control valve installed at the nozzle body 1 to selectively discharge the underfill; In the PC cost dispenser nozzle is installed in the discharge portion 102 to install the injection port (2) for finely spraying the underfill in the form of droplets to do the underfill to adhere the semiconductor chip on the PCB,
The rotation pulley 103 is formed around the outer circumferential surface of the nozzle body 1, and a driving motor 3 is installed at one side of the nozzle body 1 so that the rotation pulley 103 is driven by the driving motor 3. Multi-spray nozzles of the PCB dispenser having a configuration in which two or more injection pipes 201 are formed in the injection port 2 and communicate with the discharge part 102 of the nozzle body 1 at the same time. .
KR1020100104212A 2010-10-25 2010-10-25 Multi spray nozzle of dispenser for PCB KR101187637B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109433519A (en) * 2018-11-26 2019-03-08 长沙科悦企业管理咨询有限公司 Spot gluing equipment is used in a kind of processing of electronic coil
CN112221861A (en) * 2020-10-27 2021-01-15 苏州威达智电子科技有限公司 Dispensing equipment with waste gas discharging system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109433519A (en) * 2018-11-26 2019-03-08 长沙科悦企业管理咨询有限公司 Spot gluing equipment is used in a kind of processing of electronic coil
CN112221861A (en) * 2020-10-27 2021-01-15 苏州威达智电子科技有限公司 Dispensing equipment with waste gas discharging system
CN112221861B (en) * 2020-10-27 2023-08-04 苏州威达智科技股份有限公司 Dispensing equipment with exhaust gas discharging system

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