KR20120040569A - Vacuum chamber - Google Patents

Vacuum chamber Download PDF

Info

Publication number
KR20120040569A
KR20120040569A KR1020100102053A KR20100102053A KR20120040569A KR 20120040569 A KR20120040569 A KR 20120040569A KR 1020100102053 A KR1020100102053 A KR 1020100102053A KR 20100102053 A KR20100102053 A KR 20100102053A KR 20120040569 A KR20120040569 A KR 20120040569A
Authority
KR
South Korea
Prior art keywords
eccentric
chamber body
chamber
top lead
rotating
Prior art date
Application number
KR1020100102053A
Other languages
Korean (ko)
Inventor
김태식
Original Assignee
주식회사 원익아이피에스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 원익아이피에스 filed Critical 주식회사 원익아이피에스
Priority to KR1020100102053A priority Critical patent/KR20120040569A/en
Publication of KR20120040569A publication Critical patent/KR20120040569A/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The vacuum chamber includes a chamber body, a top lid, a sealing member, and an auxiliary opening. The chamber body has an inner space and is open at the top. The top lid opens and closes the upper opening of the chamber body. The auxiliary opening is disposed below the top lead and acts to push up the top lead. Accordingly, the chamber body can be easily opened after the process proceeds.

Description

Vacuum chamber {Vacuum chamber}

The present invention relates to a vacuum chamber in which various processes for manufacturing a semiconductor or flat panel display are performed.

In the process of manufacturing a semiconductor or flat panel display (FPD) or solar cell, a thin film deposition process or photolithography on a wafer or glass substrate (hereinafter referred to as substrate) A process, an etching process, a cleaning process for removing residues generated during the process, and various surface treatment processes are performed. At this time, each process is generally performed in a vacuum chamber inside the vacuum state.

For example, the vacuum chamber includes a chamber body having an inner space and an upper opening thereof, and a top lid opening and closing the upper opening of the chamber body. With the top lid opening the upper opening of the chamber body, the substrate is fed or discharged into the interior space of the chamber body. With the top lid closing the upper opening of the chamber body, the process proceeds with respect to the substrate accommodated in the interior space of the chamber body.

A sealing member, such as an o-ring, is provided between the top lid and the chamber body to seal the inner space of the chamber body during the process in the vacuum chamber to maintain the vacuum of the inner space. However, when the process is performed in the vacuum chamber, the internal space of the chamber body may be placed in a high temperature environment, and a high temperature process gas may be supplied to the internal space of the chamber body. Therefore, after the process proceeds, a phenomenon in which the sealing surface of the o-ring is fixed to the top lid or the chamber body by a high temperature environment or a high temperature process gas may occur. For this reason, there exists a problem that opening of the chamber main body is difficult.

An object of the present invention is to solve the above problems, to provide a vacuum chamber that can easily open the chamber body after the process proceeds.

Vacuum chamber according to the present invention for achieving the above object, the chamber body having an inner space and the upper opening; A top lead for opening and closing the upper opening of the chamber body; And an auxiliary opening disposed under the top lead and operative to push up the top lead.

According to the present invention, even if a sealing member such as an o-ring is adhered to the top lid or the chamber body by a high temperature environment or a high temperature process gas after the progress of various processes, the stuck state can be released by the auxiliary opening. Thus, the chamber body can be easily opened.

1 is a perspective view of a vacuum chamber according to an embodiment of the present invention.
FIG. 2 is an exploded perspective view of the auxiliary opening of FIG. 1; FIG.
3 is a perspective view illustrating a cross section of the auxiliary opening of FIG. 1;
4 is a perspective view illustrating a state in which the top lid is lifted and the chamber body is opened by the auxiliary opening of FIG. 3.
5 is an exploded perspective view showing another example in which the eccentric rotation body of FIG. 2 is installed in the chamber body.
6 is an exploded perspective view showing another example in which the eccentric rotation body of FIG. 2 is installed in the chamber body.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view of a vacuum chamber according to an embodiment of the present invention, FIG. 2 is an exploded perspective view of the auxiliary opening of FIG. 1, and FIG. 3 is a perspective view showing a cross section of the auxiliary opening of FIG. 1. 4 is a perspective view illustrating a state in which the top lead is lifted by the auxiliary opening of FIG. 3.

1 to 4, the vacuum chamber 100 includes a chamber body 110, a top lead 120, and an auxiliary opening 130.

The chamber body 110 has an inner space 111 and has an open top portion. The inner space 111 of the chamber body 110 may accommodate a substrate such as a wafer or a glass substrate to be processed. The inner space 111 of the chamber body 110 may perform various processes such as a thin film deposition process, a photolithography process, an etching process, a cleaning process, and other surface treatment processes in a closed state. The inner space 111 of the chamber body 110 is maintained in a vacuum state during various processes.

The top lid 120 opens and closes the upper opening of the chamber body 110. The top lid 120 opens the upper opening of the chamber body 110 for the purpose of maintaining the members in the chamber body 110, such as a showerhead. Alternatively, when the substrate is to be supplied to the interior space 111 of the chamber body 110 or the substrate is discharged from the interior space of the chamber body 110, the top lid 120 opens the upper opening of the chamber body 110. do. When the various processes are to be performed in the internal space 111 of the chamber body 110, the top lid 120 closes the upper opening of the chamber body 110.

The sealing member 140 is installed between the top lid 120 and the chamber body 110 to seal the internal space 111 of the chamber body 110 with the top lid 120 closed. Can be. The sealing member 140 may maintain the vacuum of the inner space 111 by sealing the inner space 111 of the chamber body 110 while the process is performed in the inner space 111 of the chamber body 110.

The sealing member 140 may be installed to surround the entrance and exit of the internal space 111 in the chamber body 110. For example, the o-ring 141 may be used as the sealing member 140. In addition, the O-ring 141 may be fitted into the mounting groove 112 formed along the periphery of the entrance of the inner space. The mounting grooves 112 may be formed in two or more concentric shapes, and the o-ring 141 may be fitted to each of the mounting grooves 112. The o-ring 141 is pressed while the top lid 120 closes the internal space 111 of the chamber main body 110, and is compressed to the top lid 120, thereby causing the internal space 111 of the chamber main body 110 to be closed. To be sealed. On the other hand, the sealing member 140 is not installed in the chamber body 110, it may be provided in the top lid 120 in the above-described form.

The top lid 120 may be locked to the chamber body 110 by a locking mechanism (not shown) so that the inner space 111 of the chamber body 110 may be kept closed. The locking mechanism may be coupled to the fastener 121 of the top lead 120 and the fastener 113 of the chamber body 110 to lock the top lead 120 to the chamber body 110. When the locking mechanism is separated from the fastener 121 of the top lead 120 and the fastener 113 of the chamber body 110, the locking mechanism releases the top lead 120 from the chamber body 110. .

The auxiliary opening 130 is disposed below the top lead 120 to operate to push up the top lead 120. The auxiliary opening 130 is spaced apart from the lower side of the top lid 120 when the chamber body 110 is closed, and operates to push up the top lid 120 when the chamber body 110 is opened. Open 110. That is, when the inner space 111 of the chamber body 110 is to be closed or sealed, the auxiliary opening 130 is spaced apart from the lower side of the top lid 12 so as not to interfere with the top lid 120. There is.

When the inner space 111 of the chamber body 110 is to be opened, the auxiliary opening 130 operates to push up the top lead 120 under the top lead 120. In this process, the internal space 111 of the chamber body 110 is opened.

For example, when a process is performed in the vacuum chamber 100, the internal space 111 of the chamber body 110 may be placed in a high temperature environment, and the process gas of high temperature may flow into the internal space 111 of the chamber body 110. May be supplied. Therefore, after the process proceeds, the sealing surface of the sealing member 140, for example, the o-ring 141, is adhered to the top lid 120 or the chamber body 110 by a high temperature environment or a high temperature process gas, so that the chamber body ( The opening of 110 may be difficult.

In this case, the auxiliary opening 130 pushes up the top lid 120 from the chamber body 110 in a state spaced apart from the bottom of the top lid 120. At this time, the state in which the o-ring 141 is fixed to the top lead 120 or the chamber body 110 may be released by a force that the auxiliary opening 130 pushes up the top lead 120. Accordingly, the chamber body 110 can be easily opened while the top lid 120 is separated from the o-ring 141. The protruding height of the auxiliary opening 130 is set such that the o-ring 141 can sufficiently release the state where the o-ring 141 is fixed to the top lid 120.

The auxiliary opening 130 may be configured in various ways. For example, the auxiliary opening 130 includes an eccentric rotating body 131. The eccentric rotating body 131 is rotatably installed by an external rotating mechanism (not shown) in the state eccentric to the chamber main body 110. The eccentric rotating body 131 operates to push up the top lead 120 according to the rotational position. That is, as shown in FIG. 3, when the eccentric rotor 131 rotates so that the closest part of the rotation center faces upward, the eccentric rotor 131 is in contact with the top lead 120 or is spaced apart from the maximum. In this state, as shown in FIG. 4, when the eccentric rotating body 131 rotates so that the portion furthest from the rotation center is directed upward, the top lead 120 is pushed up to the maximum.

The eccentric rotating body 131 may include a rotating member 132, a first eccentric shaft 133, and a coupling part 135. The first eccentric shaft 133 is eccentrically formed by the rotating member 132 on one surface of the rotating member 132. The engaging portion 135 is formed on the other side of the rotating member 132. The coupling part 135 may be formed coaxially with the first eccentric shaft 133. Coupling unit 135 is coupled or separated from the rotating mechanism. The coupling part 135 may be formed at the end of the second eccentric shaft 134 protruding from the rotating member 132. The second eccentric shaft 134 protrudes coaxially with the first eccentric shaft 133 with the rotation member 132 interposed therebetween.

The coupling part 135 may be formed in the shape of a polygonal groove, for example, a hexagonal groove or a square groove. The polygonal groove is formed so that the polygonal rod can be fitted. Polygonal rods can be mounted on rotating instruments, such as wrenches or power tools. Polygonal rod can rotate as the operator rotates the wrench by the force, or by the power of the power tool. The polygon rod rotates while being fitted in the polygon groove to rotate the rotating member 132.

As another example, although not shown, a coupling portion in the shape of a polygonal head, such as a hexagonal head or a square head, may be formed at the end of the second eccentric shaft 134 protruding from the cover 116. As the operator rotates the polygon head by a spanner or the like, the second eccentric shaft 134 and the rotating member 132 can be rotated. In addition, examples of rotating the rotating member 132 may be variously made, and are not limited to the above-described examples.

The eccentric rotating body 131 may be installed in the chamber body 110 in the following aspects. The chamber body 110 has a receiving groove 114 on at least one side. The receiving groove 114 is formed to be recessed and open at the top. In addition, the receiving groove 114 is formed to a size that the rotation member 132 is rotatable. In the receiving groove 114, a shaft support groove 115 is formed to sandwich the first eccentric shaft 133 and support it.

The cover 116 is fixed to the accommodation groove 114. The cover 116 is for preventing the eccentric rotating body 131 from being separated from the receiving groove. The cover 116 may have a hole that exposes the end of the coupling unit 135. When the eccentric rotating body 131 includes the second eccentric shaft 134, the cover 116 has a structure in which the end of the second eccentric shaft 134 is fitted to support the second eccentric shaft 134. Can be.

Accordingly, the rotating member 132 is rotatably supported in an eccentric state, and can be protruded or immersed through the upper opening of the receiving groove 114 according to the rotational position. The rotating member 132 is in contact with or spaced apart from the lower side of the top lead 120 when it is immersed into the interior of the receiving groove 114, and the top lead 120 when protruding to the outside of the receiving groove 114. ) Will be pushed up.

The cover 116 may be fixed with bolts 101 in a state where the cover 116 is inserted into the receiving groove 114 so as not to protrude from the chamber body 110. In this case, the receiving groove 114 may be formed with a jaw 117 that supports the edge of the cover 116, the screw grooves may be formed in the jaw 117. The cover 116 is formed with through holes corresponding to the screw grooves. The bolts 101 are respectively fitted into the through holes on the outside of the cover 116 and screwed into the screw grooves, thereby fixing the cover 116 in the receiving groove 114.

The top lead 120 may include a reinforcing member 122 mounted at a portion in contact with the eccentric rotating body 131. The reinforcing member 122 prevents scratching of the top lead 120 when the eccentric rotating body 131 is pushed up while contacting the top lead 120. The top lead 120 may be made of a lightweight aluminum material. In this case, when the force is repeatedly applied by the eccentric rotating body 131, the top lead 120 may be deformed, such as deformation. The reinforcing member 122 may be made of a material such as stainless steel having superior rigidity than that of aluminum, and the top lead 120 may be mounted at a portion where the top lead 120 is in contact with the eccentric rotating body 131 to prevent scratches of the top lead 120. To be.

Meanwhile, the top lead 120 may be coupled to the hinge shaft 150 on one side of the chamber body 110. The top lid 120 opens and closes the upper opening of the chamber body 110 as it rotates so as to be spaced apart or close to the chamber body 110. The auxiliary opening 130 may be installed anywhere except when the hinge shaft 150 is installed in the chamber body 120.

5 is an exploded perspective view showing another example in which the eccentric rotating body of FIG. 2 is installed in the chamber body. As shown in FIG. 5, the eccentric rotating body 131 is inserted into the chamber main body 110 from the top of the chamber main body 110 and installed.

The chamber body 110 has a receiving groove 211 for accommodating the eccentric rotating body 131. The receiving groove 211 is formed by recessing from the upper surface of the chamber body 110 so that the eccentric rotating body 131 is inserted from the top of the chamber body 110. The accommodating groove 211 has a space for accommodating the rotating member 132 and a space for seating the first eccentric shaft 133. When the eccentric rotating body 131 includes the second eccentric shaft 134, the receiving groove 211 may further have a space for seating the second eccentric shaft 134.

The cover 212 is inserted into and fixed to the accommodation groove 211. The covers 212 cover and support the upper portions of the first and second eccentric shafts 133 and 134 so that the eccentric rotor 131 can be rotated only without being separated from the receiving groove 211 from the upper side. An exposure hole 213 is formed at the side surface of the chamber body 110 to expose the end of the coupling part 135. The rotating mechanism may be coupled to or separated from the coupling unit 135 exposed through the exposure hole 213. On the other hand, each structure of the receiving groove 211 and the cover 212 is not limited to the above-described example.

6 is an exploded perspective view showing another example in which the eccentric rotation body of FIG. 2 is installed in the chamber body. As shown in FIG. 6, the auxiliary opening 330 is fixed to the side of the chamber body 110. In this case, the top lead 120 has a structure in which at least a portion thereof protrudes so as to correspond to an upper side of the eccentric rotating body 131.

The auxiliary opening 330 has a housing 331 for receiving the eccentric rotating body 131. The housing 331 is fixed to the side of the chamber main body 110 and supports to be rotatable in a state where the eccentric rotating body 131 is accommodated. For example, the housing 331 may have a space for receiving the rotating member 132, and a shaft support groove may be formed on one side thereof to support the first eccentric shaft 133. When the eccentric rotor 131 includes the second eccentric shaft 134, the housing 331 may further include a shaft support groove that supports the second eccentric shaft 134 by inserting it. The housing 331 may have a structure in which the housing 331 is divided into two parts so as to be easily assembled with the eccentric rotating body 131.

The housing 331 is open at the top. The eccentric rotating body 131 can be sunk through the upper opening of the housing 331. An exposure hole 332 is formed at a side surface of the housing 331 to expose the coupling part 135. The exposure hole 332 may be formed by penetrating a shaft support groove into which the second eccentric shaft 134 of the shaft support grooves of the housing 331 is fitted. The rotating mechanism may be coupled or separated to the coupling unit 135 exposed through the exposure hole 332.

Although the present invention has been described with reference to one embodiment shown in the accompanying drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Could be. Accordingly, the true scope of protection of the present invention should be determined only by the appended claims.

110. Chamber body 114. Receiving groove
115. Shaft support groove 116. Cover
120. Top lid 122. Reinforcement member
130.Secondary opening 131.Eccentric rotor
140. Sealing member 141 O-ring

Claims (10)

A chamber body having an inner space and an upper portion thereof opened;
A top lead for opening and closing the upper opening of the chamber body; And
An auxiliary opening disposed under the top lead and operative to push up the top lead;
Vacuum chamber comprising a. The method of claim 1,
The auxiliary opening portion,
And an eccentric rotating body which is rotatable by an external rotating mechanism in an eccentric state and is operable to push up the top lead according to the rotational position. The method of claim 2,
The chamber body,
And an accommodating groove recessed from at least one side surface and open at an upper portion thereof to support the eccentric rotational body so as to be rotatable. The method of claim 3,
And a cover which prevents the eccentric rotating body from being separated from the receiving groove. The method of claim 2,
The chamber body,
And a receiving groove recessed from an upper surface to support the eccentric rotating body so as to be rotatable. The method of claim 5,
And a cover which prevents the eccentric rotating body from being separated from the receiving groove. The method of claim 2,
The auxiliary opening portion,
A housing fixed to a side of the chamber body, the housing being rotatably supported in an accommodating state of the eccentric rotating body and having an upper opening;
The top lid is a vacuum chamber, characterized in that at least a portion protrudes so as to correspond to the upper side of the eccentric rotor. 8. The method according to any one of claims 2 to 7,
The eccentric rotating body,
And a rotating member, a first eccentric shaft formed eccentrically on one side of the rotating member, and an engaging portion formed on the other side of the rotating member to be coupled to or separated from the rotating mechanism. The method of claim 8,
The eccentric rotating body,
And a second eccentric shaft protruding coaxially with the first eccentric shaft on the other side of the rotating member, wherein the engaging portion is formed at the end of the second eccentric shaft. The method according to any one of claims 1 to 7,
The top lead is,
And a reinforcement member mounted to a portion of the auxiliary opening.
KR1020100102053A 2010-10-19 2010-10-19 Vacuum chamber KR20120040569A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020100102053A KR20120040569A (en) 2010-10-19 2010-10-19 Vacuum chamber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100102053A KR20120040569A (en) 2010-10-19 2010-10-19 Vacuum chamber

Publications (1)

Publication Number Publication Date
KR20120040569A true KR20120040569A (en) 2012-04-27

Family

ID=46140444

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100102053A KR20120040569A (en) 2010-10-19 2010-10-19 Vacuum chamber

Country Status (1)

Country Link
KR (1) KR20120040569A (en)

Similar Documents

Publication Publication Date Title
US8011315B2 (en) Thin film forming apparatus
US7134642B2 (en) Vacuum gate valve
CN110017384B (en) Mounting structure of valve plate relative to valve rod
US20170211706A1 (en) Ceramic slit valve doors and assemblies
US20070257033A1 (en) Seal member, depressurized chamber, depressurizing processing apparatus, seal mechanism of depressurized chamber, and method of manufacturing a depressurized chamber
KR19980080903A (en) Chamber with isolation valve to preserve vacuum during maintenance
JP2004014785A (en) Storing container of workpiece and processing system using the same
JP6275755B2 (en) Chamber for physical vapor deposition
US7296783B2 (en) Vacuum processing apparatus
TWI674227B (en) Multi-cassette carrying case
TWI390134B (en) Valve body and gate valve device
TW201618223A (en) Substrate transfer apparatus
JP5986023B2 (en) Barrel polishing equipment
KR20120040569A (en) Vacuum chamber
JP2003174080A (en) Container for housing/storing thin plate
US7762425B2 (en) Vacuum container apparatus used for manufacturing semiconductor devices and lid apparatus for same
US20230071716A1 (en) Horizontal articulated robot and substrate transfer system comprising same
JP3177136U (en) Container for semiconductor devices
TWI677460B (en) Methods and apparatus for transferring a substrate
JP3177145U (en) Container for semiconductor devices
JP2008045640A (en) Gate valve device
JP2006339618A (en) Manual foup opener
JP4550554B2 (en) Sample processing equipment
KR20070048936A (en) Process chamber
KR102645711B1 (en) Wafer processing apparatus

Legal Events

Date Code Title Description
N231 Notification of change of applicant
A201 Request for examination
E902 Notification of reason for refusal
N231 Notification of change of applicant
E601 Decision to refuse application