KR20120033178A - Semiconductor high temperature environment testing equipment - Google Patents

Semiconductor high temperature environment testing equipment Download PDF

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Publication number
KR20120033178A
KR20120033178A KR1020100094804A KR20100094804A KR20120033178A KR 20120033178 A KR20120033178 A KR 20120033178A KR 1020100094804 A KR1020100094804 A KR 1020100094804A KR 20100094804 A KR20100094804 A KR 20100094804A KR 20120033178 A KR20120033178 A KR 20120033178A
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KR
South Korea
Prior art keywords
high temperature
heat pipe
air
chamber
lower chamber
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KR1020100094804A
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Korean (ko)
Inventor
윤선진
정민영
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서울반도체 주식회사
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Priority to KR1020100094804A priority Critical patent/KR20120033178A/en
Publication of KR20120033178A publication Critical patent/KR20120033178A/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2862—Chambers or ovens; Tanks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature

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  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Automation & Control Theory (AREA)
  • Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)

Abstract

Provides a semiconductor device high temperature environment test equipment.
According to an aspect of the present invention, there is provided a device for testing a semiconductor device in a high temperature environment, the apparatus comprising: an upper chamber provided in the device main body to form a predetermined internal space in which a plurality of semiconductor devices are accommodated; A lower chamber provided in the apparatus main body to form an internal space having a predetermined size in which a heater for heating the upper chamber to a high temperature atmosphere is disposed; A cooler cooling the upper chamber to maintain a constant internal temperature of the upper chamber; A cooling fan installed in a lower chamber in which the cooler is disposed to prevent overheating of the cooler; Connected to the first exhaust heat pipe extending from the upper exhaust port formed in the upper chamber, and connected to the second exhaust heat pipe extending from the lower exhaust port formed in the lower chamber, having a first air pump in the middle of the length And an exhaust heat pipe line for discharging the high temperature air in the upper chamber and the lower chamber to the outside.

Description

Semiconductor device high temperature environment testing equipment

The present invention relates to a device for testing an electric device in a high temperature environment, and more particularly, the indoor temperature is installed by discharging the high temperature air discharged from the device to the outside through a separate exhaust line in the high temperature environment test of the semiconductor device A semiconductor device high temperature environmental test apparatus that can stably maintain room temperature while supplying low temperature air to the inside of the device to prevent overheating of the device, and convert the high temperature air discharged outside to low temperature for recycling. will be.

In general, a high temperature environmental test apparatus is a kind of reliability test for finding an initial defective device before supplying a semiconductor device such as an LED device to a consumer or mounting it in a system, which puts the semiconductor device in a specific environmental stress state, It is to remove the semiconductor element which has a defect, an abnormality, or is likely to become a defect immediately.

In other words, the high temperature environment test apparatus applies thermal stress to the semiconductor device at a high temperature of about 80 to 125 ° C. During the inspection, the semiconductor device operates under a high temperature and a high electric field, thereby accelerating the failure mechanism. .

Therefore, the initial defective semiconductor devices having a long lifespan fail to tolerate harsh conditions during the inspection and generate defects.

Good semiconductor devices that pass these tests can guarantee long life, which improves system reliability.

Korean Patent Publication No. 10-2010-0022168 (2010.03.02.) Discloses a device for inspecting a semiconductor device in a high temperature environment.

1 is a schematic diagram illustrating a general semiconductor device high temperature environment test apparatus, and FIG. 2 is a schematic diagram showing an internal configuration of a general semiconductor device high temperature environment test apparatus.

As illustrated in FIGS. 1 and 2, the semiconductor device testing device 1 may include a storage device (not shown) in which a semiconductor device, which is an inspection object, is accommodated for a high temperature test, inside the device body 1a. A predetermined size of the upper chamber 10a and a predetermined size of the lower chamber 10b in which the heating device 15 is arranged to provide heat to maintain the internal space of the upper chamber 10a at a high temperature at a predetermined temperature. The upper and lower structures are respectively provided, and the upper chamber 10a and the lower chamber 10b are separated into different spaces by the partition wall 1b.

The device body 1a is provided with an upper door 11 to open and close the internal space of the test chamber 10a, and has a controller 12 for controlling the temperature and humidity of the test device, and the lower chamber 10b. Lower door 13 is provided to open and close the inner space of the).

In addition, the upper chamber 10a, which is an internal space in which the semiconductor element is located, is provided with an exhaust port 14 for externally discharging the high-temperature air inside the chamber in a high temperature or high temperature and high humidity environment, and the upper chamber 10b is provided in the lower chamber 10b. A cooler 16 and the cooler forcibly lowering the internal temperature when the internal temperature of the upper chamber 10a is heated above a preset temperature, together with a heater 15 that creates a high temperature environment by heating the 16 is provided with a fan 17 to cool it to prevent overheating.

In addition, the lower chamber 10b includes an exhaust port 18 for externally discharging the high temperature air inside the chamber and a suction port 19 for sucking the external air into the lower chamber.

However, such a conventional semiconductor device high temperature environment testing device (1) indoors because the internal air of the upper chamber (10a), the lower chamber (10b) is discharged as it is through the exhaust port (14, 18) as it is indoors Maintaining the temperature at high temperature may cause trouble of the equipment.

In particular, when a large number of high temperature environment test equipment is operated in a confined space of a test room for a long time, the following problems arise.

First, heavy worker fatigue

Since the air discharged from the test equipment to the room is relatively higher than the room temperature, even when the room is cooled, it causes a high temperature working environment of 40 to 50 degrees, thereby reducing the work efficiency of workers working at high temperatures, Dehydration, sunstroke, high temperature shock and loss of appetite caused safety problems.

Second, shorten test equipment life

The heater and cooler provided in the lower chamber of the test equipment consists of electronic parts, mechanical devices, and wire coating.The high-temperature exhaust air discharged into the room can drastically reduce the life of these devices, so the design life of the test equipment is To reduce costs and dispose of expensive equipment.

Third, frequent failure of test equipment

Since the internal temperature itself is a high temperature in the room where the test equipment is placed, it shortens the service life of the test equipment and causes frequent failures, thereby increasing the maintenance cost according to the increase in repair costs.

Fourth, total waste of semiconductor device in case of failure of test equipment

In most test equipment, the temperature is controlled under an unattended environment. If the water-cooling device and the controller of the test equipment fail, overheating occurs in the upper chamber, and the semiconductor element, which is a test object stored therein, is excessively heated. There was a problem in that eventually all of them have to be discarded because they are not exposed to impact.

Fifth, reducing indoor cleanliness

When the room where the test equipment is installed is exposed to high temperature, convection of indoor air is intensified, and even the small waves such as human foot are easily floated and floated in the air, harming the health of workers who inhale it. It also acted as a factor to shorten the life of the test equipment.

Sixth, maintenance costs and noise problems due to the installation of additional air conditioners

Most of the companies operating high temperature environment test equipment for many semiconductor devices operate a central air conditioner and install a separate air conditioner, which requires excessive installation and maintenance costs and causes noise problems during operation.

Therefore, the present invention is to solve the above problems, the purpose of the discharge of the high temperature air discharged from the outside of the device during the high temperature environment test of the semiconductor device to the outside through a separate exhaust line to increase the temperature of the room installed the device To provide a semiconductor device high temperature environment test device that can stably maintain indoor temperature, supply low temperature air to the inside of the device to prevent overheating of the device, and convert the high temperature air discharged outside to low temperature air for recycling. do.

As a specific means for achieving the above object, the present invention provides a device for testing a semiconductor device in a high temperature environment, the upper chamber is provided in the device body to form a predetermined size of the inner space in which a plurality of semiconductor devices are accommodated;

A lower chamber provided in the apparatus main body to form an internal space having a predetermined size in which a heater for heating the upper chamber to a high temperature atmosphere is disposed;

A cooler cooling the upper chamber to maintain a constant internal temperature of the upper chamber;

A cooling fan installed in a lower chamber in which the cooler is disposed to prevent overheating of the cooler;

Connected to the first exhaust heat pipe extending from the upper exhaust port formed in the upper chamber, and connected to the second exhaust heat pipe extending from the lower exhaust port formed in the lower chamber, having a first air pump in the middle of the length Provided is a semiconductor device high temperature environmental test apparatus comprising an exhaust heat pipe line for discharging the high temperature air in the upper chamber and the lower chamber to the outside.

Preferably, the first exhaust heat pipe and the second exhaust heat pipe selectively select the exhaust flow path by a control signal of a controller that receives a temperature sensor detecting an internal temperature of the upper chamber and an internal temperature of the lower chamber. Each shutoff valve is provided so that it can be blocked.

Preferably, the intake port formed in the lower chamber includes an intake heat pipe for supplying low temperature air, which is relatively lower than room temperature, to the inner space of the lower chamber, wherein the intake heat pipe extends from the air conditioner and is formed in the middle of the length. It is connected to the intake heat pipeline with two air pumps.

More preferably, the intake heat pipe is provided with an on / off valve to selectively block the intake flow path by a control signal of a controller that receives a temperature sensor for detecting the internal temperature of the lower chamber.

Preferably, the exhaust heat pipe line is connected to a cooler for supplying low-temperature air through an intake heat pipe connected to an intake port formed in the lower chamber.

More preferably, the exhaust heat pipe line is provided with an air filter to remove foreign substances and moisture contained in the hot air discharged from the upper and lower chambers.

More preferably, the exhaust heat pipe line includes a third air pump to forcibly circulate the hot air discharged from the upper and lower chambers to the air conditioner.

According to the present invention, the apparatus is installed by the high temperature air by discharging the high temperature air generated from the upper and lower chambers to the outside through the first and second exhaust heat pipes and the exhaust heat pipe line during the high temperature environment test of the semiconductor device. The indoor air temperature can be stably maintained at a comfortable temperature while preventing the indoor air from rising. Therefore, the service life of the equipment installed indoors can be extended, and the working environment of the worker can be enhanced by creating a pleasant working environment. Obtained.

1 is a schematic configuration diagram showing a general semiconductor device high temperature environment test apparatus.
2 is a schematic internal configuration diagram showing a general semiconductor device high temperature environment test apparatus.
3 is a block diagram showing a semiconductor device high temperature environment test apparatus according to a first embodiment of the present invention.
4 is a block diagram showing a semiconductor device high temperature environment test apparatus according to a second embodiment of the present invention.
5 is a block diagram showing a semiconductor device high temperature environment test apparatus according to a third embodiment of the present invention.

Preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

The semiconductor device high temperature environment test apparatus 100 according to the first embodiment of the present invention, as shown in Figure 3, the device body 100a, the upper chamber 110, the lower chamber 120, the heater 130, It includes a cooler 140, a cooling fan 145 and the exhaust heat pipe line 150.

The device body 100a includes an upper chamber 110 and a lower chamber 120 that are divided up and down with the partition wall 100b interposed therebetween.

The upper chamber 110 has an internal space of a predetermined size so that a stack containing a plurality of semiconductor elements as an inspection object is disposed, and the lower chamber 120 is separated from each other by the partition wall 100b ( It is provided with an internal space of a predetermined size so that the heater 130 for heating the 110 to a high temperature atmosphere of a predetermined temperature is arranged.

Accordingly, the inner space of the upper chamber 110 is heated to a temperature in advance by a high temperature heat source provided by the heater 130 of the lower chamber 120 to form a high temperature atmosphere, so that the upper chamber 110 The semiconductor device loaded on the internal stack is tested for reliability in a high temperature atmosphere.

The lower chamber 120 is provided with a cooling source to cool the upper chamber 110 when it is overheated to maintain a constant internal temperature of the upper chamber 110 heated by the heater to a high temperature atmosphere at a predetermined temperature. The cooler 140 is provided.

Here, the operation of the cooler 140 is performed in a state in which the operation of the heater 130 is stopped.

In addition, in the vicinity of the cooler 140, a cooling fan 145 is provided to cool the cooler 140 to prevent overheating while operating to maintain the internal temperature of the upper chamber at a constant temperature.

On the other hand, the upper chamber 110 and the lower chamber 120 are respectively provided with an upper exhaust pipe 112 and the lower exhaust pipe 122 to discharge the hot air to the outside, such an upper exhaust pipe 112 and The lower exhaust pipe 122 includes a first exhaust heat pipe 151 and a second exhaust heat pipe 152 extending therefrom.

In addition, the first exhaust heat pipe 151 and the second exhaust heat pipe 152 have a length such that the hot air in the upper chamber 110 and the hot air in the lower chamber 120 can be discharged to the outside. It is connected to the exhaust heat pipe line 150 having a first air pump 154 in the middle.

Accordingly, when the first air pump 154 is operated, the hot air in the upper chamber 110 and the high temperature air in the lower chamber 120 are the first and second exhaust heat pipes 151 and 152 and the exhaust heat pipe. It is discharged to the outdoor through the line 150.

Here, the first and second exhaust heat pipes 151 and 152 and the exhaust heat pipe line 150 may be prevented from increasing the internal temperature of the room by high heat convection in the process of exhausting the hot air to the outside. It is desirable to insulate the outer surface with insulation.

In addition, the internal temperature of the upper chamber 110 is in the first exhaust heat pipe 151 connected to the upper exhaust pipe 112 and the second exhaust heat pipe 152 connected to the lower exhaust pipe 122. And on / off valves 112a and 122a to selectively block the exhaust flow path by a control signal of a controller that receives a temperature sensor (not shown) for detecting the internal temperature of the lower chamber 120.

Accordingly, when the internal temperature of the upper and lower chambers 110 and 120 rises above a predetermined temperature value, the opening and closing of the valves 112a and 122a and the operation of the first air pump 154. The high temperature air in the upper and lower chambers 110 and 120 is simultaneously or selectively discharged to the outside through the exhaust heat pipe line 150.

At this time, the operation of the cooler and the cooling fan installed in the lower chambers 110 and 120 are stopped.

In addition, the intake port 124 formed in the lower chamber 120 is connected to the intake heat pipe 153 so as to supply air from the outside.

4 is a block diagram illustrating a semiconductor device high-temperature environment testing apparatus according to a second embodiment of the present invention, wherein the inlet port 124 formed in the lower chamber 120 has a lower temperature than the room temperature in the lower chamber. An intake heat pipe 153 is supplied to the inner space of the 120, and the intake heat pipe 153 extends from the air conditioner 160 lowering the air temperature and the second air pump 164 in the middle of the length. It is connected to the intake heat pipe line 160 having a.

Here, the intake heat pipe 153 is also controlled by a controller that receives a temperature sensor (not shown) that detects the internal temperature of the lower chamber 120, similarly to the first and second exhaust heat pipes 151 and 152. On and off valves 124a are provided to selectively block the intake passage.

In addition, the air conditioner 170 connected to the intake heat pipe line 160 supplies low-temperature cooling air to maintain a constant internal temperature of the room R1 where at least one test device 100 is installed. Although illustrated and described as being installed in another room (R2) isolated so as not to be limited thereto, it may be installed in the room (R1) in which the test device 100 is installed.

5 is a block diagram illustrating a semiconductor device high temperature environment test apparatus according to a third embodiment of the present invention, wherein the exhaust heat pipe line 150 is connected to an inlet 124 formed in the lower chamber 120. It is connected to the air conditioner 170 for supplying low temperature air through the intake heat pipe 160.

Accordingly, the hot air discharged from the upper and lower chambers 110 and 120 is not discharged to the outside through the first and second exhaust heat pipes 151 and 152 and the exhaust heat pipe line 150. By supplying the circulation to 170, the hot air discharged to the outside can be circulated to the low temperature air which is relatively lower than the room temperature to the internal space of the lower chamber 120.

Here, the exhaust heat pipe line 150 to prevent the foreign matter and moisture contained in the hot air discharged from the upper, lower chamber 110, 120 to be supplied to the air conditioner 170 to prevent corrosion of the equipment It is preferable to have an air filter 175 for removing the foreign matter and moisture contained in the hot air to prevent.

 In addition, the exhaust heat pipe line 150 is made of a smooth air supply by the pressure loss generated in the process of supplying the hot air discharged from the upper, lower chamber 110, 120 to the cooling unit 170. It may be provided with a third air pump 174 for forced circulation of the air to prevent it.

While the invention has been shown and described with respect to particular embodiments, it will be understood that various changes and modifications can be made in the art without departing from the spirit or scope of the invention as set forth in the claims below. It will be appreciated that those skilled in the art can easily know.

110: upper chamber 112: upper exhaust vent
120: lower chamber 122: lower exhaust port
124: intake port 112a, 122a, 124a: on-off valve
130: heater 140: cooler
145: cooling fan 150: exhaust heat pipe line
151: heat pipe for the first exhaust 152: heat pipe for the second exhaust
153: intake heat pipe 154: first air pump
160: intake heat pipe 164: second air pump
170: air conditioner 174: third air pump
175: air filter

Claims (7)

In a device for testing a semiconductor device in a high temperature environment,
An upper chamber provided in the device body to form a predetermined size of an inner space in which the plurality of semiconductor devices are accommodated;
A lower chamber provided in the apparatus main body to form an internal space having a predetermined size in which a heater for heating the upper chamber to a high temperature atmosphere is disposed;
A cooler cooling the upper chamber to maintain a constant internal temperature of the upper chamber;
A cooling fan installed in a lower chamber in which the cooler is disposed to prevent overheating of the cooler;
Connected to the first exhaust heat pipe extending from the upper exhaust port formed in the upper chamber, and connected to the second exhaust heat pipe extending from the lower exhaust port formed in the lower chamber, having a first air pump in the middle of the length An apparatus for testing high temperature environment of semiconductor devices, comprising an exhaust heat pipe line for discharging high temperature air in the upper chamber and the lower chamber to the outside. The method of claim 1,
The first exhaust heat pipe and the second exhaust heat pipe may selectively block the exhaust flow path by a control signal of a controller that receives a temperature sensor detecting an internal temperature of the upper chamber and an internal temperature of the lower chamber. High temperature environmental test equipment for semiconductor devices, characterized in that each provided with an on-off valve. The method of claim 1,
The intake port formed in the lower chamber has an intake heat pipe for supplying low temperature air, which is relatively lower than room temperature, to the inner space of the lower chamber, and the intake heat pipe extends from the air conditioner and has a second air pump in the middle of the length. High temperature environmental test apparatus for a semiconductor device, characterized in that connected to the intake heat pipeline having a. The method of claim 3,
The intake heat pipe is a semiconductor device high-temperature environment testing apparatus, characterized in that the on-off valve to selectively block the intake flow path by the control signal of the controller for receiving a temperature sensor for detecting the internal temperature of the lower chamber. The method of claim 1,
The exhaust heat pipe line is a semiconductor device high temperature environment test apparatus, characterized in that connected to the air conditioner for supplying low-temperature air through the intake heat pipe connected to the inlet formed in the lower chamber. The method of claim 5,
The exhaust heat pipe line is a semiconductor device high temperature environment test apparatus, characterized in that it comprises an air filter to remove foreign matter and moisture contained in the high temperature air discharged from the upper and lower chambers. The method of claim 5,
The exhaust heat pipe line is a semiconductor device high temperature environment test apparatus, characterized in that it comprises a third air pump for forced circulation of the hot air discharged from the upper and lower chambers to the air conditioner.
KR1020100094804A 2010-09-29 2010-09-29 Semiconductor high temperature environment testing equipment KR20120033178A (en)

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KR1020100094804A KR20120033178A (en) 2010-09-29 2010-09-29 Semiconductor high temperature environment testing equipment

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KR1020100094804A KR20120033178A (en) 2010-09-29 2010-09-29 Semiconductor high temperature environment testing equipment

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109827986A (en) * 2019-03-18 2019-05-31 东莞市伟煌试验设备有限公司 High-speed high-low-temperature impact test gas control system
KR102295219B1 (en) * 2020-11-18 2021-08-31 주식회사 넥스트솔루션 Air circulation system for test chamber of electronic component

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109827986A (en) * 2019-03-18 2019-05-31 东莞市伟煌试验设备有限公司 High-speed high-low-temperature impact test gas control system
CN109827986B (en) * 2019-03-18 2023-08-29 东莞市伟煌试验设备有限公司 High-speed high-low temperature impact test gas control system
KR102295219B1 (en) * 2020-11-18 2021-08-31 주식회사 넥스트솔루션 Air circulation system for test chamber of electronic component

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