KR20070008265A - Semiconductor module mounting tester using vortex tube - Google Patents

Abstract

A semiconductor module mounting tester is provided to effectively prevent deterioration of a mother board by supplying hot air to a first region and cold air to a second region. A tester includes a chamber(120) with a mother board(110) loaded, an air conditioning line(130) providing compressed air(131), and a vortex tube(150) receiving the compressed air from the air conditioning line to separate hot air and cold air. The hot air and the cold air which are separated by the vortex tube are supplied to the chamber, and the chamber is set to a condition suitable to perform a reliability test of a semiconductor module(112) by a temperature controller(170). A surrounding area of the mother board is divided into a first region and a second region which are isolated by a cover.

Description

Semiconductor module mounting tester using vortex tube

1 is a view schematically showing a semiconductor module mounting test apparatus according to the prior art.

2 is a view schematically illustrating a semiconductor module mounting test apparatus using a vortex tube according to an exemplary embodiment of the present invention.

3 is a cross-sectional view showing the passive vortex tube of FIG. 2.

4 is a view showing the automatic vortex tube of FIG.

FIG. 5 is a plan view illustrating a mother substrate of FIG. 2 in which a second region other than a first region in which a module is mounted is isolated by a cover.

FIG. 6 is a plan view illustrating a mother substrate of FIG. 2 in which a first region in which a module is mounted is isolated by a cover.

FIG. 7 is a temperature drop and temperature rise table according to the pressure and cold air ratio of the vortex tube of FIG. 2.

Description of the main parts of the drawing

110: mother substrate 112: semiconductor module

114: first region 116: second region

118: cover 120: chamber

122: unit chamber 130: air conditioning line

140: solenoid valve 150: vortex tube

160: on-off valve 170: temperature controller

180: temperature sensor 200: semiconductor module mounting test device

The present invention relates to a semiconductor module mounting test apparatus, and more particularly, to a semiconductor module mounting test apparatus using a vortex tube capable of simultaneously providing hot and cold air.

After the manufacturing process is completed, the semiconductor module is actually mounted on a mother board of the computer and performs a semiconductor module mounting test process for checking for abnormalities. The semiconductor module mounting test checks whether the semiconductor module operates normally in a low temperature (about 10 ° C), room temperature (about 25 ° C), and high temperature (about 55 ° C) mother substrate environment.

As illustrated in FIG. 1, the semiconductor module mounting test is performed in a state in which the mother substrates 10 on which the semiconductor modules 12 are mounted are loaded into the chamber 20. The semiconductor module mounting test apparatus 100 according to the related art includes a chamber 20 in which a test process is performed, a heating unit 30 for heating the chamber 20, and a cooling unit 40 for cooling the chamber 10. And a controller 70 for controlling the operation of each component. At this time, the heating unit 30 is composed of a heater and a fan to provide a warmer (32) to the chamber (20). The cooling unit 40 is a cooler using a conventional refrigerant, and is composed of a compressor 41, a condenser 42, and an evaporator 43 to provide the cold air 34 to the chamber 20.

Therefore, when the high temperature test process is performed in the conventional semiconductor module mounting test apparatus 100, the heating unit 30 supplies the warmer 32 to the chamber 20 to increase the temperature of the chamber 20, and performs the low temperature test process. When proceeding, the cooling unit 40 supplies the cold air 34 to the chamber 20 to lower the temperature of the chamber 20 and then proceeds with the test process.

At this time, the temperature in the chamber 20 is detected by the temperature sensor 80 and transmitted to the control unit 70, the control unit 70 is based on the temperature provided by the temperature sensor 80, the heating unit 30 and the cooling unit ( 40 is selectively operated to set the temperature inside the chamber 20 according to the temperature of the test process to be carried out.

However, since the space occupied by the heating unit 30 and the cooling unit 40 is large, the conventional semiconductor module mounting test apparatus 100 requires a large installation space.

Since the mother substrate 10 together with the semiconductor module 12 is exposed to a high temperature environment in a high temperature process, a problem may occur due to deterioration of the mother substrate 10. For example, the life of the mother substrate 10 may be shortened, and although not shown, a substrate constituting the mother substrate 10, a hard disk, a chip set, a power supply, and the like may be used. Abnormal operation of the test process may not proceed normally.

Since the test process is performed in a state in which the plurality of mother substrates 10 are loaded in the chamber 20, it is difficult to change the temperature of the chamber 20 from high temperature to low temperature or from low temperature to high temperature. I have a problem. That is, since the test process proceeds in the chamber 20 in which the entire mother substrate 10 is exposed in addition to the portion of the semiconductor module 12 where the warm air 32 and the cold air 34 will act, the temperature inside the chamber 20 is increased. It takes a lot of time to convert.

The heating unit 30 and the cooling unit 40 require periodic maintenance, which is expensive.

Freon gas, which was mainly used as the refrigerant of the cooling unit 40, is restricted in use according to environmental regulations, and the cost burden of using a new refrigerant suitable for environmental regulations is also increasing. In addition, since the noise is severely generated in the compressor 41 when the cooling unit 40 is operated, a problem due to the noise may occur.

Therefore, the first object of the present invention is to minimize the size of the cooling unit and the heating unit to reduce the size of the device.

It is a second object of the present invention to solve a problem caused by deterioration of a mother substrate in a high temperature process.

It is a third object of the present invention to shorten the cold / hot conversion time.

A fourth object of the present invention is to make it possible to reduce maintenance costs of equipment.

A fifth object of the present invention is to provide an environmentally friendly semiconductor module mounting test apparatus capable of providing low noise and providing cold air without using a refrigerant.

In order to achieve the above object, the present invention is a semiconductor module mounting test apparatus for testing a plurality of semiconductor modules mounted on a mother substrate, a chamber in which the mother substrate is loaded, an air conditioning line for providing a constant pressure compressed air, and air A vortex tube that receives compressed air from an air conditioning line and separates it into hot and cold, and a temperature controller that provides the chamber with warm or cold separated from the vortex tube and sets the chamber to a temperature condition suitable for the reliability test of the semiconductor module. .

In the semiconductor module mounting test apparatus according to the present invention, the mother substrate may further include a cover that thermally isolates a first region in which the semiconductor modules are mounted and a second region other than the first region.

In the semiconductor module mounting test apparatus according to the present invention, the chamber may include unit chambers in which a mother substrate is loaded / unloaded, respectively. The unit chambers are stacked in a cube to enable loading / unloading of the mother substrate, and vortex tubes are installed in the unit chambers.

In the semiconductor module mounting test apparatus according to the present invention, a solenoid valve is installed between the air conditioning line and the vortex tubes. The temperature controller then regulates the solenoid valve to regulate the pressure of the compressed air provided to the vortex tubes.

In the semiconductor module mounting test apparatus according to the present invention, the vortex tube is provided with a supply unit to which compressed air is supplied, a rotary chamber separating the compressed air supplied to the supply unit from hot and cold, and a hot air outlet installed at an outlet of the rotary chamber. And a warm air discharge portion which is installed to extend from the inlet side of the rotary chamber to the rear and discharges cold air.

In addition, the semiconductor module mounting test apparatus according to the present invention may further include an on / off valve configured to receive warm and cold air from each of the warm air discharge part and the cold air discharge part, to supply one to the chamber and to exhaust the other. In this case, the cool air exhausted from the on / off valve may be supplied to the second region. Cold air or warm air supplied from the on-off valve to the chamber is supplied to the first region.

Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of the present invention.

2 is a diagram schematically illustrating a semiconductor module mounting test apparatus 200 using the vortex tube 150 according to an exemplary embodiment of the present invention. 3 is a cross-sectional view illustrating the passive vortex tube 150 of FIG. 2.

2 and 3, the semiconductor module mounting test apparatus 200 according to an embodiment of the present invention separates the compressed air 131 into the warmth 132 and the cold air 134 using the vortex tube 150. After that, it is a test apparatus for selectively supplying the chamber 120 to set the chamber 120 at a temperature condition suitable for the reliability test to perform a reliability test process.

The semiconductor module mounting test apparatus 200 according to an embodiment of the present invention provides a chamber 120 in which a mother substrate 110 on which a plurality of semiconductor modules 112 are mounted is loaded, and compressed air 131 of a predetermined pressure. The air conditioning line 130 and the vortex tube 150, which receives the compressed air 131 from the air conditioning line 130, is separated into the warmer 132 and the cold air 134, and is separated from the vortex tube 150. And a temperature controller 170 for selectively providing the warmth 132 and the cold air 134 to the chamber 120 to set the chamber 120 to a temperature condition suitable for the reliability test of the semiconductor module 112.

The chamber 120 includes unit chambers 122 into which one mother substrate 110 is loaded, and the unit chambers 122 are stacked in a cube shape to enable loading / unloading of the mother substrate 110. Can be installed. Vortex tubes 150 are respectively installed in the unit chambers 122. Since the chamber 120 may be configured in the form of a cube as described above, the installation area of the semiconductor module mounting test apparatus 200 may be reduced as compared with the conventional loading / unloading of the mother substrate.

The solenoid valve 140 is installed between the air conditioning line 130 and the vortex tubes 150. The temperature controller 170 adjusts the solenoid valve 140 to adjust the pressure of the compressed air 131 provided to the vortex tubes 150 to warm the heat 132 and the cold air 134 separated from the vortex tube 150. Adjust the temperature.

At this time, since the air conditioning line 130 uses the air conditioning line installed in the factory as it is, it is possible to reduce the cost burden due to additional facility expansion. Compressed air 131 of 5 to 7 atm is provided through the air conditioning line 130.

The vortex tube 150 has a supply unit 151 to which compressed air 131 is supplied, a rotating chamber 152 connected to the supply unit 151 and extending to one side, and a warmth discharge installed at an end of the rotating chamber 152. It includes a portion 153, the control valve 155 and the supply unit 151 installed inside the warmth outlet 153, the other side and the cold air outlet 154 connected to the rotating chamber 152.

The vortex tube 150 is installed such that the warm air outlet 153 faces the chamber 120 by a worker's manual operation, or the cold air outlet 154 faces the chamber 120.

When the vortex tube 150 having the structure described above separates the compressed air 131 into the warmth 132 and the cold air 134, the compressed air 131 is first supplied through the supply unit 151. The rotary chamber 152 is rotated by one million rpm. The primary rotary air 132a is discharged toward the warmth discharge unit 153 and the remaining air is returned from the control valve 155 to discharge the cold air discharge unit 154 while forming the secondary rotary air 134a. At this time, the flow of the secondary rotary air 134a loses heat and is directed toward the cold air outlet 154 while passing through a region of lower pressure inside the flow of the primary rotary air 132a.

In the flow of the primary and secondary rotary air 132a, 134a, since the secondary rotary air 134a has the same time as one rotation with the primary rotary air 132a, the actual movement speed is the primary rotary air. Slower than 132a. The difference in the kinetic speed means that the kinetic energy is reduced, and the lost kinetic energy is converted into heat to raise the temperature of the primary rotating air 132a and lower the temperature of the secondary rotating air 134a. Therefore, the first rotary air 132a finally discharged through the warm air discharge part 153 is discharged to the warmer 132 having an elevated temperature compared to the temperature of the compressed air 131, and through the cold air discharge part 154. The secondary rotary air 134a discharged is discharged to the cold air 134 having the temperature lowered compared to the temperature of the compressed air 131.

The temperature drop and temperature rise table according to the pressure of the compressed air 131 provided to the vortex tube 150 and the ratio of the cold air 134 are shown in FIG. 7. At this time, the upper number represents the magnitude of the temperature drop compared to the temperature of the supply air, and the lower number represents the magnitude of temperature rising to the temperature of the supply air.

For example, when the supply air is 1.4 atm and 25 ° C., if the cold air rate is set at 20%, the temperature drop is 34.4 ° C. and the temperature rise is 8.3 ° C. Therefore, the cold air temperature of the vortex tube is 25 ° C-34.4 ° C = -9.4 ° C, and the warmth temperature is 25 ° C + 8.3 ° C = 33.3 ° C.

3 illustrates an example in which the warmth 132 or the cold air 134 separated from the vortex tube 150 is manually supplied to the chamber, but as shown in FIG. 4, the warmth separated from the vortex tube 150 is illustrated. 132 or cold air 134 may be automatically provided to the chamber through the opening and closing valve 160. In this case, since the structure of the vortex tube 150 has the same structure as that of the vortex tube illustrated in FIG. 3, the opening and closing valve 160 will be described.

The opening / closing valve 160 includes an intake pipe 161 to which the warmer 132 and the cold air 134 separated from the vortex tube 150 are supplied, and the warmer 132 and the cold air supplied through the intake pipe 161. One of the valves 134 includes a valve chamber 164 that supplies one side to the chamber through the supply pipe 162 and the other side exhausts through the exhaust pipe 163.

In this case, the warmer 132 exhausted from the open / close valve 160 is heat exhausted to the outside, and as will be described later, the cold air 134 exhausted from the open / close valve 160 may be supplied to an area other than the region in which the semiconductor module is mounted.

The temperature controller 170 sets the temperature of the chamber 110 based on the temperature provided by the temperature sensor 180 installed in the chamber 120. That is, the temperature controller 170 adjusts the opening / closing amount of the solenoid valve 140 and the opening / closing amount of the control valve 155 of the vortex tube 150 based on the temperature provided by the temperature sensor 180 to test the semiconductor module to be performed. The temperature inside the chamber 110 is set according to the temperature of the process.

In addition, to prevent the deterioration of the mother substrate 110 during the high temperature process, as shown in FIGS. 5 and 6 to stably perform the high temperature reliability test process for the semiconductor module 112, the insulating cover 118. The first region 114 in which the semiconductor module 112 is mounted on the mother substrate 110 and the second region 116 other than the first region 114 may be thermally isolated from the mother substrate 110.

The cover 118 covers the second area 116 as shown in FIG. 5 and is isolated from the first area 114, or as shown in FIG. 6 and covers the first area 114 as shown in FIG. 6. Can be isolated at 116.

In addition, the warmth 132 separated from the vortex tube 150 is supplied to the first region 114, and the cold air 134 is supplied to the second region 116, thereby deteriorating the mother substrate 110. It can be effectively suppressed.

Therefore, according to the structure of the present invention, the vortex tube occupies a smaller installation space than the heating section and the cooling section installed in the conventional semiconductor module mounting test apparatus, and it is possible to install the unit chamber in a three-dimensional form. Installation space can be reduced, including the size of the.

During the high temperature process of the semiconductor module mounting test process, the first region and the second region of the mother substrate are thermally isolated using a cover, thereby solving the problem caused by deterioration of the mother substrate. Furthermore, the warm air separated from the vortex tube is supplied to the first region of the mother substrate, and the cold air is supplied to the second region, thereby effectively solving the problem caused by the deterioration of the mother substrate.

It is possible to proceed with a semiconductor module mounting test process by applying warm or cold air to the first region, and since the space occupied by the first region is small compared to the entire region of the mother substrate, it is possible to shorten the cold / hot switching time of the first region in the chamber. Can be. This reduces semiconductor module mounting test time.

Vortex tubes require little maintenance and can be used semi-permanently, reducing maintenance costs.

In addition, since only compressed air is used without using any refrigerant, electricity, or chemicals, there is an advantage in that an environment-friendly semiconductor module mounting test apparatus can be implemented.

Claims (8)

A semiconductor module mounting test apparatus for testing a plurality of semiconductor modules mounted on a mother substrate, A chamber into which the mother substrate is loaded; An air conditioning line for providing a constant pressure of compressed air; A vortex tube receiving compressed air from the air conditioning line and separating hot and cold air; And a temperature controller for providing hot or cold air separated from the vortex tube to the chamber and setting the chamber to a temperature condition suitable for a reliability test of the semiconductor module. . The semiconductor device of claim 1, further comprising a cover configured to thermally isolate a first region in which the semiconductor modules are mounted and a second region other than the first region in the mother substrate. Module mount test unit. 3. The chamber of claim 2, wherein the chamber includes unit chambers in which the mother substrate is loaded / unloaded, respectively, and the unit chambers are stacked in a cubic form to enable loading / unloading of the mother substrate. The semiconductor module mounting test apparatus using the vortex tube, characterized in that each of the vortex tube is installed. 4. The air conditioner of claim 3, further comprising a solenoid valve disposed between the air conditioning line and the vortex tubes, wherein the temperature controller controls the solenoid valve to adjust the pressure of the compressed air provided to the vortex tubes. Semiconductor module mounting test apparatus using a vortex tube, characterized in that. The method of claim 4, wherein the vortex tube, A supply unit to which the compressed air is supplied; A rotary chamber separating the compressed air supplied to the supply unit into hot and cold parts; A warmth discharge part installed at an outlet side of the rotary chamber and discharging the warmth; It is installed extending from the inlet side of the rotary chamber to the rear, the semiconductor module mounting test apparatus using a vortex tube, characterized in that it comprises a; 6. The vortex tube according to claim 5, further comprising: an opening / closing valve configured to receive warmth and cold air from the warmth exhaust part and the cold air discharge part, and supply one side to the chamber and the other side to exhaust the other side. Semiconductor module mounting test apparatus. 7. The semiconductor module mounting test apparatus of claim 6, wherein the cool air exhausted from the on-off valve is supplied to the second region. The semiconductor module mounting test apparatus of claim 6, wherein cold air or warm air supplied from the on-off valve to the chamber is supplied to the first region.

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