KR20120026964A - Substrate having concave-convex portion and manufacturing method thereof - Google Patents

Abstract

PURPOSE: A circuit board including a concavo-convex part and manufacturing method thereof are provided to improve legibility and to control a Newton ring effect by forming a small ridge unit and a big concave unit. CONSTITUTION: A circuit board includes a concavo-convex part on the surface of a resin layer(10). Sink parts(10a) which are smaller than the opening diameter of the concavo-convex part are formed within the concavo-convex part. The resin layer supports second resin to a base resin layer formed by first resin and hardens the second resin. The boundary of the concavo-convex part includes a concavo-convex shape.

Description

Substrate having concave-convex portion and manufacturing method therefor {SUBSTRATE HAVING CONCAVE-CONVEX PORTION AND MANUFACTURING METHOD THEREOF}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate to be used as a sensor substrate and the like, and relates to a substrate on which a fine concavo-convex portion is formed on its surface, and a manufacturing method thereof.

In an electronic device in which a thin air layer is formed in front of the display, when the thickness of the air layer is nonuniform, interference fringes of light are generated and the display quality by the display tends to be degraded. The interference fringe of the light is caused by a so-called Newton ring phenomenon in which the light reflected from one surface facing each other with the air layer therebetween and the light reflected from the other surface interfere.

For example, in an electronic device in which a light transmissive touch panel is disposed in front of the display, since an air layer is formed between two sensor substrates constituting the touch panel, the touch panel is pressed by a finger or the like to change the thickness of the air layer. When this occurs, interference fringes of light are likely to occur. Moreover, an air layer may be formed between a display and a touch panel, and an air layer may be formed between a touch panel and the cover sheet which covers this. Also in this case, interference fringes of light are likely to occur.

In order to suppress the occurrence of the interference fringe, conventionally, a resin layer is provided on the surface of the substrate facing the air layer, and fine concavities and convexities are molded on the surface of the resin layer, or on the surface of the substrate. The structure etc. which provide the resin layer which formed the fine unevenness | corrugation which the filler mixed in are employ | adopted.

However, the manufacturing cost of a metal mold | die is very high as a method of forming fine unevenness | corrugation using a metal mold | die, and it becomes high cost. In addition, when minute scratches occur on the surface of the mold, the scratches are transferred to the resin layer. In the sensor substrate, the transparent electrode layer is formed on the surface of the resin layer, but the transparent electrode layer may be damaged by the scratches transferred to the resin layer. On the other hand, in the structure in which a filler is mixed in resin, haze (fog) of a resin layer deteriorates, and total light transmittance also deteriorates easily.

In the invention described in Patent Document 1 below, a transparent resin layer is formed on a surface of the transparent gas facing the air layer, and the transparent resin layer has a plurality of regions having different refractive indices in the plane direction. Regions with different refractive indices are arranged in a stripe shape or a lattice shape in the plane direction. By providing regions with different refractive indices, it is possible to scatter reflected light and make it difficult to generate an interference fringe.

However, in the said invention, it is necessary to apply | coat different resin layers separately to the surface of a base, and a manufacturing method is complicated. Moreover, in order to make refractive index different, since an inorganic filler and a metal filler are mixed in synthetic resin, haze (fog) of a transparent resin layer deteriorates, and total light transmittance also becomes easy to deteriorate.

Japanese Unexamined Patent Publication No. 2007-273408

This invention solves the said conventional subject, and aims at providing the board | substrate which has an uneven part which is hard to generate | occur | produce an interference fringe of light when used facing an air layer.

An object of this invention is to provide the board | substrate which has the recessed part and the recessed part in which the surface of the board | substrate was smooth and it is easy to control the shape.

Moreover, an object of this invention is to provide the manufacturing method of the board | substrate which has the uneven | corrugated part which can be manufactured by a simple process, and can form the ridge | bulb part and recessed part with a smooth surface by controlling the size, an arrangement, etc. .

This invention is arrange | positioned inside the translucent layer, Comprising: The board | substrate with which the resin layer which opposes the said light transmission layer with the air layer interposed is provided, Compartment curved in the concave shape on the surface which opposes the said air layer of the said resin layer. A plurality of regions are formed, and a plurality of recessed portions whose opening diameter is smaller than the width dimension of the partition region are formed in each partition region.

The said resin layer in this invention is hardened | cured after supplying 2nd resin to several places of the base resin layer formed from 1st resin.

Since the board | substrate which has the uneven | corrugated part of this invention forms a recessed part by supplying two types of resin to the surface of a board | substrate, and two types of resin touch, it can form a smooth and smooth fine unevenness | corrugation on the surface of a resin layer. have.

Although the 1st resin and 2nd resin in this invention may be completely the same resin, it becomes easy to control the magnitude | size and thickness of a recessed part by combining resin which differs in surface tension, specific gravity, etc.

In the above, it is preferable that the boundary part of the adjacent partition area | region is uneven | corrugated shape. Alternatively, the boundary portion of the adjacent partition region is curved in a convex shape.

The depression has an opening diameter of 10 to 100 µm, a depth of 0.05 to 2 µm, a width dimension of 2 to 20 times the opening diameter of the depression, and a depth of 0.2 to 2.5 µm. It is more preferable that the width dimension of the said partition area is 3-10 times the opening diameter of the said recessed part.

Moreover, this invention is arrange | positioned inside the translucent layer, Comprising: The board | substrate with which the resin layer opposing the said translucent layer was provided in the convex shape on the surface which opposes the said air layer of the said resin layer. A plurality of partitioned regions are formed, and in each partition region, a plurality of raised portions having a diameter smaller than the width dimension of the partition region is formed.

Also in this case, the said resin layer is hardened | cured after supplying 2nd resin to several places of the base resin layer formed from 1st resin.

In this case, the boundary part of the adjacent partition area | region is comprised as that surface is curved in concave shape.

The ridge has a diameter of 10 to 100 µm, a height of 0.05 to 2 µm, a width dimension of 2 to 20 times the diameter of the ridge and a height of 0.2 to 2.5 µm. More preferably, the width dimension of the partition region is 3-10 times the diameter of the ridge.

The board | substrate of this invention is formed in the surface of the resin layer which opposes an air layer, and the partition area | region curved largely in concave shape is formed, and the several some recessed part is formed in the inside of this area | region, or is largely convex-shaped A partition region is formed, and a plurality of small ridges are formed inside the region. By mixing a large uneven part and a small uneven part, it is easy to suppress a Newton ring phenomenon, and also the visibility when visually seeing through a transmissive layer becomes favorable.

As for the board | substrate which has an uneven part of this invention, the said board | substrate and a resin layer are translucent, and a translucent conductive layer is formed in the surface of the said resin layer, and is used as a sensor substrate.

Or it is provided in the part which opposes the air layer between a display and a touch panel, or the air layer between a touch panel and a cover layer. Or it can also be used as a diffuse reflection surface of light.

In this invention, it is preferable that center line average roughness Ra of the said resin layer surface is 0.1 micrometer or more, 0.5 micrometer or less, and 10-point average roughness Rz is 0.6 micrometer or more and 2.0 micrometers or less.

The manufacturing method of the board | substrate which has the uneven | corrugated part of this invention is a process of apply | coating a liquid 1st resin to the surface of a board | substrate, forming a base resin layer which does not break in the middle in a predetermined range, and hardens the said 1st resin layer. Supplying a liquid second resin to a plurality of places of the base resin layer, and forming a recessed portion at the place where the second resin of the base resin layer touches, the first resin layer and the It has a process of hardening a 2nd resin layer and forming the resin layer which has several recessed parts.

In the above invention, it is preferable that the second resin is supplied in a plurality of dot patterns to a partition area having a predetermined area, the partition area is curved in a concave shape, and a plurality of the depressions are formed in the partition area. .

The said method becomes easy to achieve by making 2nd resin side smaller than 1st resin as a volume of resin supplied per unit area of the said board | substrate.

Moreover, the manufacturing method of the board | substrate which has the uneven | corrugated part of this invention is a process of apply | coating a liquid 1st resin to the surface of a board | substrate, and forming the base resin layer which is not interrupted in the predetermined range in the predetermined range, and the said 1st resin layer Supplying a liquid second resin to a plurality of places of the base resin layer, and forming a ridge at a place where the second resin of the base resin layer is supplied, without curing the first resin; It has a process of hardening a ground layer and a said 2nd resin layer, and forming the resin layer which has a some ridge.

In the said invention, it is preferable to supply the said 2nd resin to a division area of a predetermined area in a several dot pattern, to make the said division area | region curved in convex shape, and to form the said some ridge | bulb in the said division area. .

The said method becomes easy to achieve by making more 2nd resin side than 1st resin as the volume of resin supplied per unit area of the said board | substrate.

In the manufacturing method of the board | substrate which has an uneven part of this invention, by supplying two types of synthetic resins in a different process, the uneven surface which has a smooth recessed part and ridge | bulb part can be formed. In addition, by changing the supply amount and the supply pattern of the resin, it is possible to freely control the shape and size of the ridge and the depression.

In the present invention, by using the first resin and the second resin having different surface tensions, the shape and size of the depressions and the ridges can be easily controlled. However, this invention can also use the same synthetic resin material as 1st resin and 2nd resin.

This invention can supply a 2nd resin by an inkjet system. When the inkjet method is used, the supply amount of the second resin and the dot pattern when the second resin is provided can be freely designed, and the shape and size of the depressions and the ridges can be easily controlled.

As for the board | substrate with the unevenness | corrugation of this invention, a large concave division area | region or a large convex partition area | region is arrange | positioned, and a plurality of small depressions and ridges are formed in each division area, and can suppress a Newton ring phenomenon. It is also possible to prevent deterioration of visibility. Moreover, the uneven surface which has the recessed part and ridge which are smooth and the surface is smooth can be formed in the surface of a board | substrate by a comparatively simple process, and it becomes easy to control the shape and size of a recessed part, a ridge part, an arrangement state, etc.

As a result, the visibility when facing an air layer by using it as a light transmissive sensor board | substrate etc. can be improved.

1 is a cross-sectional view of a touch panel in which a substrate having irregularities in an embodiment of the present invention is used;
2 is an enlarged cross-sectional view of a sensor substrate having irregularities used in the touch panel of FIG. 1;
3 is a schematic diagram illustrating a method of manufacturing a substrate having irregularities;
4 is an enlarged schematic diagram illustrating a process of forming a depression in the resin layer;
5 is an enlarged schematic diagram illustrating a process in which a ridge is formed in the resin layer;
6 is an explanatory diagram showing an example of a supply pattern of a second resin;
7 (A), 7 (B), and 7 (C) are image diagrams showing measurement patterns obtained by measuring the uneven patterns of the substrates of Examples 1 to 3 in a non-contact manner;
8 is a line diagram showing the dimensions of the uneven pattern shown in FIG. 7 (A);
9 (A) is an image diagram showing a measurement pattern in which the uneven pattern of the substrate of Example 4 is measured by non-contact, 9 (B) is a line diagram showing the dimensions of the uneven pattern;
10 (A) is an image diagram showing a measurement pattern in which the uneven pattern of the substrate of Example 5 is measured by non-contact, 10 (B) is a line diagram showing the dimensions of the uneven pattern;
11 (A), 11 (B) and 11 (C) are image diagrams showing measurement patterns obtained by measuring the uneven patterns of the substrates of Examples 6 to 8 in a non-contact manner,
12 is an image diagram showing a measurement pattern in which the uneven pattern of the substrate of Example 9 is measured in a non-contact manner;
FIG. 13A is an image diagram showing a measurement pattern in which the uneven patterns of the substrates of Examples 10, 11, and 12 are measured by non-contact, respectively, and FIG. 13 (B) is a line diagram showing the dimensions of the uneven pattern.

The touch panel 1 shown in FIG. 1 is provided on the surface of the main body panel 2 of various apparatuses, such as portable. Inside the main body panel 2, a self-luminous display such as a liquid crystal display device is incorporated. The touch panel 1 and the main body panel 2 are transmissive, and the display light of the display passes through the main body panel 2 and the touch panel 1 and is visible from the front of the touch panel 1. have.

Translucent in this specification means the state which is transparent or almost transparent, and can transmit the display light of a display, and means the total light transmittance is 60% or more, Preferably it is 80% or more.

The touch panel 1 has a lower sensor board 3 and an upper sensor board 6. On the opposing surface of the lower sensor substrate 3, a transparent conductive layer 4 formed of ITO or the like is formed. Electrode layers 5 and 5 formed of silver paste or the like are formed at both ends of the conductive layer 4 in the left and right directions. A translucent conductive layer 7 formed of ITO or the like is formed on the opposing surface of the upper sensor substrate 6, and electrode layers are formed at both ends in a direction orthogonal to the surface of the conductive layer 7.

The lower sensor board | substrate 3 and the upper sensor board | substrate 6 oppose the spacer 8 formed in frame shape in the outer peripheral part between them. The conductive layer 4 formed on the lower sensor substrate 3 and the conductive layer 7 formed on the upper sensor substrate 6 are formed over the entire operation region of the touch panel 1. The conductive layer 4 and the conductive layer 7 face each other via the air layer 9.

In this touch panel 1, a voltage is alternately applied to the electrode layers 5 and 5 on the lower sensor substrate 3 side and the electrode layer on the upper sensor substrate 6 side. Since the conductive layer 4 has electrical resistance, when a voltage is applied to the electrode layers 5 and 5, a voltage gradient is formed from one electrode layer 5 to the other electrode layer 5. At this time, when the upper sensor substrate 6 is pressed by a finger or the like and the conductive layer 7 and the conductive layer 4 partially contact each other, the conductive layer 7 and the electrode layer of the upper sensor substrate 6 are connected to the contact portion. It becomes the corresponding electric potential. By detecting this potential, it can be known which part of the left-right direction of FIG. 1 was operated.

On the contrary, when the voltage is applied to the electrode layer of the upper sensor substrate 6, if the upper sensor substrate 6 is pressed by a finger or the like and the conductive layer 7 and the conductive layer 4 partially contact each other, they are perpendicular to the ground. It can be seen which part of the direction to operate.

In addition, as a touch panel, it is not limited to what used said voltage gradient. For example, on the opposite surface of the lower sensor substrate 3, a plurality of lower conductive layers are provided in parallel with each other, and on the opposite surface of the upper sensor substrate 6, the plurality of upper conductive layers are parallel to each other, It may be formed in the direction orthogonal to a lower conductive layer. In this case, when the upper sensor substrate 6 is pressed with a finger or the like, any lower conductive layer and any upper conductive layer are in contact with the pressing position or the vicinity thereof. By detecting the lower conductive layer and the upper conductive layer in contact, it is possible to know which position has been operated.

As enlarged in FIG. 2, the resin layer 10 is formed on the opposing surface 3a of the lower sensor substrate 3, and the conductive layer 4 is formed on the surface of the resin layer 10. It is. The lower sensor board | substrate 3 is a translucent resin film, such as PET, and the resin layer 10 is formed with acrylic resin which is a translucent resin.

The upper sensor substrate 6 and the conductive layer 7 are light transmitting layers positioned above the air layer 9, and the lower sensor substrate 3, the resin layer 10, and the conductive layer 4 are the air layer 9. ) Is a light transmitting layer located below. The display light generated from the display provided inside the main body panel 2 is transmitted forward through the lower light transmitting layer, the air layer 9 and the upper light transmitting layer.

As shown in FIG. 4 and FIG. 5 etc., fine unevenness | corrugation is formed in the surface (interface with the conductive layer 4) of the resin layer 10, and this unevenness | corrugation presses the upper sensor board 6, and the air layer ( It is possible to suppress the occurrence of interference fringes of light due to the Newton ring phenomenon when the thickness of 9) changes in part.

The resin layer 10 is formed by supplying a resin material to the opposing surface 3a of the lower sensor substrate 3 by an inkjet method. The resin material is supplied with UV curing type 1st resin and 2nd resin in 2 processes. However, this invention does not exclude supplying a 3rd resin etc. at a 3rd process and subsequent process further.

In the inkjet method, the first resin and the second resin are discharged to the surface of the lower sensor substrate 3 by different processes from the discharge holes in which the inkjet head is drilled. As for the viscosity of 1st resin and 2nd resin suitable for an inkjet system, 8-12 mPa * s is preferable at 45 degreeC. In addition, the conductive layer 4 is formed on the surface of the resin layer 10, and when the touch panel 1 operates, the upper sensor substrate 6 is frequently pressed and pressed by the conductive layer 4. Therefore, the resin layer 10 needs to have some hardness. It is preferable that hardness (pencil hardness) prescribed | regulated by JISK-5600-5-6 is H-3H of 1st resin and 2nd resin.

In addition, in order to transmit the display light of the display, the color b ^* is preferably 0.25% or less. When the color b ^* becomes 0.3% or more, the resin layer 10 becomes yellowish and the visibility of the display light from the display tends to deteriorate.

As shown in FIG. 3, in the 1st process, the 1st resin 11 is apply | coated uniformly to the whole area | region of the opposing surface 3a of the lower sensor board | substrate 3 by the inkjet head, and a base resin layer Is formed. While the 1st resin 11 of a base resin layer is not hardened, the 2nd resin 12 is supplied by the inkjet head. The second resin 12 is supplied in a predetermined dot pattern, and the second resin 12 is supplied to a plurality of portions spaced apart from the first resin 11.

As a result, as shown in FIG. 4, the 2nd resin 12 enters the base resin layer of the 1st resin 11, and the recessed part 10a is formed in the place where the 2nd resin 12 was supplied. Or as shown in FIG. 5, while the 2nd resin 12 mixes with the 1st resin 11, the place where the 2nd resin 12 adhered protrudes, and the raised part 10b is formed.

After the depression 10a shown in FIG. 4 and the ridge 10b shown in FIG. 5 are formed, ultraviolet-ray is irradiated and the 1st resin 11 and the 2nd resin 12 harden | cure before the shape is eliminated. 4 or 5, the resin layer 10 in which the uneven surface was formed in the surface is formed.

Since the base resin layer of uniform thickness is formed with the 1st resin 11, since a 2nd resin layer is supplied in dot shape and the uneven surface which has the recessed part 10a or the raised part 10b is formed, unevenness | corrugation is The boundary of the face is smooth, and the entire surface of the resin layer 10 is smooth. Since no sharp edge portion is formed on the surface of the cured resin layer 10, it is easy to form the conductive layer 4 on the surface of the cured resin layer 10 by ITO or the like, and the defects are caused in the conductive layer 4. This is difficult to form. In addition, the surface of the resin layer 10 is a curved shape in any place, and there is no flat surface parallel to the surface of the lower sensor substrate 3. Therefore, excellent optical characteristics can be exhibited.

After the 2nd resin 12 is supplied to the base resin layer of the 1st resin 11, in order to be able to maintain the uneven | corrugated shape shown in FIG. 4 and FIG. 5 until UV irradiation, the 1st resin 11 And the surface tension of the second resin 12 are preferably 20 mN / m or more, and the viscosity is preferably 7 mPa · s or more.

Although the same synthetic resin material may be used for the 1st resin 11 and the 2nd resin 12, the 1st resin 11 which forms a base resin layer has a surface tension and a viscosity more than the 2nd resin 12. It is preferable that both are large. The surface tension of the first resin 11 is preferably in the range of 24 to 28 mN / m, and the surface tension of the second resin 12 is preferably 20 to 24 mN / m.

As a supply amount (supply volume) of resin per unit area of the opposing surface 3a of the lower sensor board | substrate 3, when the supply amount of the 1st resin 11 is made larger than the supply amount of the 2nd resin 12, it is as shown in FIG. Similarly, the depression 10a is easily formed at the place where the second resin 12 is supplied. When the supply amount of the first resin 11 is reduced and the supply amount of the second resin 12 is increased in comparison with that, as shown in FIG. 5, the ridge 10b is provided at a place where the second resin 12 is supplied. It becomes easy to form.

The centerline average roughness Ra of the uneven surface of the cured resin layer 10 surface is preferably 0.1 µm or more and 0.5 µm or less, and the ten-point average roughness Rz is preferably 0.6 µm or more and 2.0 µm or less. . It is preferable that the diameter of the depression 10a or the ridge 10b is not less than 100 µm and not more than 100 µm.

If it is the said range, it will be easy to form the conductive layer 4 by ITO etc. on the surface with high quality, without being interrupted. In addition, when the upper sensor substrate 6 is pressed in the touch panel 1 and the thickness of the air layer 9 changes from place to place, interference fringes of light due to the Newton ring phenomenon hardly occur.

[Example]

In the Example, Resin A, Resin B, and Resin C shown in Table 1 below were used. Resin A, B, and C are acryl-type UV curable resin, respectively, and a viscosity, surface tension, and specific gravity differ from each other. In addition, the pencil hardness in Table 1 means the hardness when UV was irradiated and hardened, and the optical characteristic also means the state hardened | cured.

Ink type Viscosity (mPa? S) Surface tension (mN / m) importance Pencil hardness Optical characteristic (b ^* ) Resin A 10.1 24.5 0.98 2H 0.21 Resin B 8 ~ 10 21-23 1.06 2H - Resin C 8.1 24.6 1.03 2H 0.15

In each of the following embodiments, the dot pattern at the time of supplying the 2nd resin 12 using the inkjet head is shown in FIG. After the 1st resin 11 was apply | coated to the opposing surface 3a of the lower sensor board | substrate 3 to a fixed thickness, and the base resin layer was formed, the pattern of the dot 21 in which the 2nd resin 12 is arranged regularly is Supplied by. As shown in FIG. 6, a plurality of dots 21 are regularly arranged inside the partition region 22, and a plurality of partition regions 22 each having a plurality of dots 21 are regularly lined up. It is set to.

(Examples 1 to 3)

7 (A) shows Example 1, FIG. 7 (B) shows Example 2, and FIG. 7 (C) shows Example 3. FIG. 7 shows the measurement pattern of the result of measuring the uneven pattern formed on the surface of the resin layer of each example with a non-contact three-dimensional shape measuring instrument.

FIG. 8 shows the dimensions of the uneven pattern of Example 1 in the same range as in FIG. 7A, where the horizontal axis represents the distance from the surface of the resin layer, and the vertical axis represents the height dimension of the uneven surface. In FIG. 8, one scale with numbers on the horizontal axis is 0.2 mm, while one scale with numbers on the vertical axis is 0.1 µm. The dimension ratio of the vertical and horizontal dimensions of the measurement pattern of FIG. 7 is the same as that of FIG. 8, and the actual uneven | corrugated pattern formed in the surface of the resin layer of Example 1, 2, 3 is sufficiently gentler than the image shown in FIG.

In Example 1 shown to FIG. 7 (A) and FIG. 8, resin A shown in Table 1 is used as 1st resin 11, the base resin layer is formed, and resin B is used as 2nd resin 12, and 2nd resin 12 is supplied in the pattern of the dot 21 shown in FIG.

In Example 1, the recessed part 21a is formed in the place where the 2nd resin 12 was supplied in the pattern of the dot 21 on the surface of the resin layer 10. FIG. This depression 21a is formed similarly to the depression 10a shown in FIG. The range corresponding to the partition area 22 of FIG. 6 becomes the partition area 22a shown to FIG. 7 (A). Since the 2nd resin 12 is pinched by the inkjet head in the some part in this division area | region 22a, while the some recessed part 21a is arranged in the surface of the resin layer 10, The whole partition area 22a is also recessed in the shape which curves gently in concave shape. In the boundary portion 23a of the adjacent partition region 22a, the resin pushed from the partition region 22a is slightly raised. As shown in FIG. 8, the small recessed part of the same grade as the recessed part 21a is formed in the vicinity of the top part of the boundary part 22a.

The surface of the resin layer 10 is smooth overall, and there is no edge part. In addition, there is no plane portion parallel to the opposing surface 3a of the lower sensor substrate 3.

8, the depth of each recessed part 21a arrange | positioned in a dot shape is 0.05 micrometer-2.0 micrometers, and the diameter (opening diameter) of each recessed part 21a is the range of 10-100 micrometers. . Moreover, the partition area | region 22a in which the whole curves in concave shape is 0.2 micrometer-2.5 micrometers in depth, and the width | variety, ie, the period (pitch) of the partition area 22a arrange | positioned regularly, has a recessed part ( It is 2 times-20 times the opening diameter of 21a), Preferably it is 3 times-10 times.

The center line average roughness Ra of the surface of the resin layer 10 of Example 1 shown to FIG. 7 (A) and FIG. 8 is 0.1-0.5 micrometer, and 10-point average roughness Rz is 0.6 micrometer-2.0 O. [Mu] m.

As shown in FIG. 7 (A), a plurality of uneven patterns having a dot-shaped depression 21a and in which the entire partition region 22a in which the depression 21a is arranged are formed in a gentle concave shape are provided. A kind of uneven part is mixed, and the function which suppresses the interference fringe of the light by Newton ring phenomenon becomes high. In addition, it is difficult to visually see the uneven pattern from the front through the upper sensor substrate 6 which is the light transmitting layer.

In Example 2 shown to FIG. 7B, resin A shown in Table 1 is used as 1st resin 11, the base resin layer is formed, and resin C is used as 2nd resin 12, and FIG. The second resin 12 is supplied in the pattern of dots 21 shown in FIG. In Example 3 shown in FIG.7 (C), resin C shown in Table 1 is used as 1st resin 11, the base resin layer is formed, resin B is used as 2nd resin 12, and FIG. The second resin 12 is supplied in the pattern of dots 21 shown in FIG.

In any combination, it is possible to form a depression on the surface of the resin layer 10 to form an uneven surface.

As in the first embodiment of FIG. 7A, the partition regions 22a in which the plurality of recesses 21a are arranged are regularly lined up, and the partition regions 22a themselves are concave to be gently curved. In order to form the uneven | corrugated pattern which the boundary part 23a raises slightly, it is necessary to use resin A shown in Table 1 as the 1st resin 11, and to use resin B as the 2nd resin 12. As shown in FIG. That is, the surface tension of the second resin 12 is lower than that of the first resin 11, the viscosity of the second resin 12 is lower than that of the first resin 11, and the second resin is lower than the first resin 11. It is preferable that the specific gravity of (12) is large.

(Examples 4 and 5)

9 shows Example 4, 9 (A) shows a measurement pattern obtained by measuring a concave-convex pattern formed on the surface of the resin layer with a non-contact three-dimensional shape measuring instrument, and 9 (B) shows the dimension of the concave-convex pattern 9 ( The line diagram shown in the same range as A). FIG. 10: shows Example 5, 10 (A) is the measurement pattern which measured the uneven | corrugated pattern formed in the surface of the resin layer with the non-contact three-dimensional shape measuring instrument, and 10 (B) measures the dimension of the uneven | corrugated pattern 10 (A The line diagram shown in the same range as ().

The resin used in Example 4 shown in FIG. 9 and Example 5 shown in FIG. 10 is the same as that of Example 1 shown in FIG. 7 (A) and FIG.

In Example 4 and Example 5, the substantially hexagonal partition area 22a is lined regularly, and each partition area 22a is a smooth concave shape. In each partition area 22a, the some recessed part 21a is arrange | positioned regularly and is formed. The boundary portion of the adjacent partition region 22a is smoothly curved in a convex shape, and the boundary portion is an uneven shape in which a plurality of small recesses 24a are formed near the top portion thereof. The dimension of the small recessed part 24a is about the same as that of the recessed part 21a.

In Examples 4 and 5, the surface of the resin layer 10 is smooth all over, and the edge part does not exist. In addition, there is no plane portion parallel to the opposing surface 3a of the lower sensor substrate 3.

(Examples 6 to 8)

11 (A) shows Example 6, FIG. 11 (B) shows Example 7, and FIG. 11 (C) shows Example 8. FIG. FIG. 11: shows the measurement pattern of the result which measured the uneven | corrugated pattern formed in the surface of the resin layer of each Example with the non-contact three-dimensional shape measuring instrument. The dimension ratio of the length and width of the image diagram of FIG. 11 is the same as that of each Example shown in FIGS.

As for the Example shown in FIG. 11, all resin A shown in Table 1 is used as 1st resin 11, a base resin layer is formed, resin B is used as 2nd resin 12, and the dot shown in FIG. The second resin 12 is supplied in the pattern of (21).

11 (A), 11 (B), and 11 (C), the resin layers are made so that the supply amount (volume) of the resin per unit area in the opposing surface 3a of the lower sensor substrate 3 is different from each other. An uneven pattern was formed in the. In Example 6 shown in FIG. 11 (A), the supply amount of the second resin 12 was very large with respect to the supply amount of the first resin 11. In Example 7 shown in FIG. 11 (B), although the supply amount of the 2nd resin 12 was large with respect to the supply amount of the 1st resin 11, the supply amount of the 1st resin 11 was made larger than Example 4. FIG. In Example 8 shown to FIG. 11 (C), the supply amount of the 2nd resin 12 was made smaller than the supply amount of the 1st resin 11.

As shown in Examples 6 and 7 shown in Figs. 11A and 11B, the supply amount per unit area of the second resin 12 is increased as compared with the supply amount per unit area of the first resin 11, which is shown in Fig. 6. The dot-shaped raised part 21b can be formed in the part which supplied the 2nd resin 12 in the pattern of the dot 21. FIG. Further, the partition regions 22b themselves regularly arranged with a plurality of dot-shaped ridges 21b are gently raised in a convex shape, so that the boundary 23b of the neighboring partition regions 22b is smooth. It is a recessed part curved in concave shape.

As shown in Figs. 11A and 11B, by combining the dot-shaped ridge 21b and the gentle ridge of the partition region 22b, the effect of suppressing interference fringes of the light due to the Newton ring phenomenon is obtained. Can be made higher.

(Example 9)

As shown in FIG. 12, the pattern which supplies the 2nd resin 12 is not made into a regular dot shape, but is randomly supplied using the inkjet head, and the random uneven | corrugated pattern with a high effect of preventing interference fringes is formed. It is also possible.

(Examples 10 to 12)

13 (A), 13 (B), and 13 (C) show Examples 10, 11, and 12, and all of the measurement patterns obtained by measuring the uneven pattern formed on the surface of the resin layer with a non-contact three-dimensional shape measuring instrument, Line diagrams showing the dimensions of the uneven pattern in the same range are shown side by side.

In Example 10 shown to Fig.13 (A), the partition area | region 22b has a gentle convex shape, and several ridge | bulb part is formed in this partition area | region 22b. Moreover, the boundary part 23b of the adjacent division area | region 22b is a small uneven | corrugated shape.

In Example 11 shown to FIG. 13 (B), the partition area | region 22b has a gentle convex shape, and several ridge | bulb part is formed in this partition area | region 22b. Moreover, the boundary part 23b of the adjacent division area | region 22b is also uneven | corrugated.

In Example 12 shown to FIG. 13C, the partition area | region 22b is gentle in convex shape, and several minute ridges are formed in this partition area | region 22b. In addition, the boundary 23b of the adjacent partition area 22b is approximately smooth.

The light transmittance was 92.3% in Example 10, 92.0% in Example 11, and 92.0% in Example 12. In Examples 10, 11, and 12, the effect of suppressing the Newton ring phenomenon was high. The haze was 0.16% in Example 10, 0.34% in Example 11, and 0.20% in Example 12. As in this embodiment, the haze is preferably less than 1%.

In the structure shown in FIG. 1, when the display light of the liquid crystal display device was transmitted, in Example 10, there was almost no adultiness of the display image and almost no uneven pattern on the surface of the resin layer 10 was observed. In Example 11, there was almost no flicker of the display image, but the uneven pattern on the surface of the resin layer 10 was slightly visible. In Example 12, although there was almost no flicker of the display image, compared with Example 10, the uneven | corrugated pattern of the surface of the resin layer 10 was slightly outstanding.

The board | substrate which has the said resin layer 10 is not only used as the sensor board | substrate 3, but also in the part which faces the air layer between a display, such as a liquid crystal panel, and a touch panel, and the part which faces the air layer between a touch panel and a cover sheet. You may install it. By this structure, generation | occurrence | production of the interference fringe of the light resulting from each air layer can be suppressed.

In addition, the uneven surface of the resin layer surface can also be used as a diffuse reflection surface of light.

1 Touchpad 2 Body panel
3: lower sensor substrate 3a: opposing surface
4 conductive layer 5 electrode layer
6 upper sensor substrate 7 conductive layer
9: air layer 10: resin layer
10a: depression 10b: ridge
11: first resin 12: second resin
21 dot 21a depression
22: compartment area
22a, 22b: compartment area
23a, 23b: boundary

Claims (25)

In the board | substrate which is arrange | positioned inside a light transmission layer, and the resin layer which opposes the said light transmission layer through the air layer is provided,
A plurality of partition regions curved in a concave shape are formed on a surface of the resin layer facing the air layer, and in each partition region, a plurality of recesses having an opening diameter smaller than the width dimension of the partition region are formed. The board | substrate which has an uneven part made into. The method of claim 1,
The said resin layer is a board | substrate which has an uneven part which is hardened | cured after supplying 2nd resin to several places of the base resin layer formed from 1st resin. The method of claim 1,
The board | substrate which has an uneven | corrugated part whose boundary part of an adjacent division area is an uneven | corrugated shape. The method of claim 1,
The board | substrate which has an uneven | corrugated part whose boundary part is curved in convex shape on the boundary part of an adjacent division area | region. The method of claim 1,
The recessed portion has an opening diameter of 10 to 100 µm, a depth of 0.05 to 2 µm, and the division region has an uneven portion having a width dimension of 2 to 20 times the opening diameter of the recessed portion and a depth of 0.2 to 2.5 µm. Substrate. The method of claim 5,
The board | substrate which has an uneven | corrugated part whose width dimension of the said partition area | region is 3-10 times the opening diameter of the said recessed part. The method of claim 1,
The board | substrate which has an uneven part in which the said board | substrate and a resin layer are translucent, and a translucent conductive layer is formed in the surface of the said resin layer, and is used as a sensor substrate. The method of claim 1,
The board | substrate which has an uneven | corrugated part whose center line average roughness Ra of the surface of the said resin layer is 0.1 micrometer or more and 0.5 micrometer or less, and 10-point average roughness Rz is 0.6 micrometer or more and 20 micrometers or less. In the board | substrate which is arrange | positioned inside a light transmission layer, and the resin layer which opposes the said light transmission layer through the air layer is provided,
On the surface of the resin layer opposite to the air layer, a plurality of convexly curved partition regions are formed, and in each partition region, a plurality of raised portions having a diameter smaller than the width dimension of the partition region are formed. The board | substrate which has an uneven part to say. 10. The method of claim 9,
The said resin layer is a board | substrate which has an uneven part which is hardened | cured after supplying 2nd resin to several places of the base resin layer formed from 1st resin. 10. The method of claim 9,
The board | substrate which has an uneven | corrugated part whose boundary part is curved in concave shape in the boundary part of the adjacent division area | region. 10. The method of claim 9,
The ridge has a diameter of 10 to 100 µm, a height of 0.05 to 2 µm, and the division region has a substrate having an uneven portion having a width dimension of 2 to 20 times the diameter of the ridge and a height of 0.2 to 2.5 µm. . The method of claim 12,
The board | substrate which has an uneven | corrugated part whose width dimension of the said partition area | region is 3-10 times the diameter of the said ridge. 10. The method of claim 9,
The board | substrate which has an uneven part in which the said board | substrate and a resin layer are translucent, and a translucent conductive layer is formed in the surface of the said resin layer, and is used as a sensor substrate. 10. The method of claim 9,
The board | substrate which has an uneven | corrugated part whose center line average roughness Ra of the surface of the said resin layer is 0.1 micrometer or more and 0.5 micrometer or less, and 10-point average roughness Rz is 0.6 micrometer or more and 20 micrometers or less. Applying a liquid first resin to the surface of the substrate to form a base resin layer that does not break midway in a predetermined range;
Supplying a liquid second resin to a plurality of places of the base resin layer without curing the first resin layer, and forming a depression at a place where the second resin of the base resin layer has touched;
It has a process of hardening the said 1st resin layer and the said 2nd resin layer, and forming the resin layer which has several recessed parts, The manufacturing method of the board | substrate which has an uneven part characterized by the above-mentioned. The method of claim 16,
Manufacturing the board | substrate with an unevenness | corrugation which supplies the said 2nd resin to a some area | region with a predetermined area, curves the said partition area | region in concave shape, and forms the said recessed part in the said partition area | region. Way. The method of claim 16,
The manufacturing method of the board | substrate which has an uneven | corrugated part whose volume of resin supplied per unit area of the said board | substrate is smaller than a 1st resin. The method of claim 16,
The manufacturing method of the board | substrate which has an uneven | corrugated part using 1st resin and 2nd resin from which surface tension differs. The method of claim 16,
The manufacturing method of the board | substrate which has an uneven part which supplies a 2nd resin by an inkjet system. Applying a liquid first resin to the surface of the substrate to form a base resin layer that does not break midway in a predetermined range;
Supplying a liquid second resin to a plurality of places of the base resin layer without forming the first resin layer, and forming a ridge at a place where the second resin of the base resin layer is supplied; ,
It has a process of hardening | curing the said 1st resin layer and the said 2nd resin layer, and forming the resin layer which has a some ridge part, The manufacturing method of the board | substrate with an uneven part characterized by the above-mentioned. The method of claim 21,
Manufacturing the board | substrate which has an uneven | corrugated part which supplies said 2nd resin to a some area | region of a predetermined area in a several dot pattern, curves the said area | region in convex shape, and forms a some said ridge | bulb in the said area | region. Way. The method of claim 21,
The manufacturing method of the board | substrate which has an uneven part in which the volume of resin supplied per unit area of the said board | substrate has more 2nd resin than a 1st resin. The method of claim 21,
The 1st resin and 2nd resin are manufacturing methods of the board | substrate which has an uneven | corrugated part using what differs in surface tension. The method of claim 21,
The manufacturing method of the board | substrate which has an uneven part which supplies a 2nd resin by an inkjet system.

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