KR20120026316A - Manufacturing method of electronic paper display device - Google Patents

Abstract

PURPOSE: A method for manufacturing an electronic paper display device is provided to realize a quick response speed and increase resolution. CONSTITUTION: A first substrate includes a thin film transistor and a pixel electrode(S11). A second substrate includes display elements. An adhesive is coated on the first substrate or the second substrate(S12). The first substrate and the second substrate are bonded each other(S13). The bonded substrates are vacuum-sealed(S14).

Description

Manufacturing method of electronic paper display device {MANUFACTURING METHOD OF ELECTRONIC PAPER DISPLAY DEVICE}

The present invention relates to a method for manufacturing an electronic paper display device, and more particularly, to a method for manufacturing an electronic paper display device capable of maximizing the adhesion between two substrates while reducing the consumption of adhesive.

In general, digital paper displays are spotlighted as next-generation display devices following liquid crystal display devices, plasma display panels, and organic luminescence devices. It is evaluated as an ideal ideal device as a type display device. In particular, an electronic paper is a display device capable of displaying characters or images by a capsule containing micro particles scattered between flexible substrates such as thin plastics. The electronic paper can be reproduced and used millions of times, and is easy to carry and is expected to be used as a material to replace existing print media or billboards such as e-books, electronic newspapers, electronic magazines, large outdoor billboards, and the like.

The present invention is to provide a method for manufacturing an electronic paper display device which can improve the performance of the device by maximizing the adhesion of the two substrates while reducing the consumption of the adhesive.

According to another aspect of the present invention, there is provided a method of manufacturing an electronic paper display device, the method including: forming a first substrate including a thin film transistor and a pixel electrode; Forming a second substrate including display elements provided in the plurality of cells partitioned by the common electrode and the plurality of partitions; Applying an adhesive in a closed loop shape having an exhaust hole on the first or second substrate; Bonding the first or second substrate to which the adhesive is applied and another substrate; Vacuum sealing the bonded substrate; Curing the adhesive of the vacuum sealed cemented substrate; And heat treating the bonded substrate on which the adhesive is cured.

The present invention is to maximize the adhesive strength of the two substrates while reducing the consumption of the adhesive through the application of a closed loop adhesive having an exhaust hole in one of the two substrates, bonding the two substrates, vacuum sealing, curing the adhesive and heat treatment. It is possible to provide a method for manufacturing an electronic paper display device. The present invention can maximize the adhesion of the two substrates to increase the response speed and increase the resolution, thereby improving the performance of the electronic paper display device. In addition, the present invention can reduce the manufacturing cost through reducing the consumption of the adhesive.

1 is a plan view illustrating a unit pixel of an electronic paper display device according to an exemplary embodiment of the present invention.
FIG. 2 is an enlarged view of the line AA ′ of FIG. 1.
3 is a flowchart illustrating a method of manufacturing an electronic paper display device according to an embodiment of the present invention.
4 to 10 are perspective views illustrating a method of manufacturing an electronic paper display device according to an embodiment of the present invention.
11A and 11B are optical microscope images illustrating an example of driving an electronic paper display device implemented by a method of manufacturing an electronic paper display device according to an embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, embodiments of the present invention may be modified in many different forms, and the scope of the present invention should not be construed as being limited by the embodiments described below, it will be seen by those skilled in the art It is preferred that the present invention be interpreted as being provided to more fully explain the invention. Accordingly, the shapes and sizes of the elements in the drawings may be exaggerated for clarity, and the elements denoted by the same reference numerals in the drawings are the same elements.

One embodiment of the present invention relates to a method of manufacturing an electronic paper display device having a plurality of pixels. First, a unit pixel of the electronic paper display device will be described, and then a manufacturing method of the electronic paper display device having a plurality of pixels will be described.

1 is a plan view illustrating a unit pixel of an electronic paper display device according to an exemplary embodiment of the present invention, and FIG. 2 is an enlarged view of a cross-sectional view taken along the line A-A 'of FIG. 1.

As illustrated in FIGS. 1 and 2, the unit pixel 100 of the electronic paper display device includes a first substrate 110 and a second substrate 130.

The first substrate 110 includes a gate line 113 and a data line 120 formed on the first base substrate 111 with the gate insulating layer 114 interposed therebetween, and a thin film transistor formed at each intersection thereof. Tr) and a pixel electrode 124 formed in a cell region provided in a cross structure thereof.

The thin film transistor Tr includes a gate electrode 112 supplied with a gate voltage, a source electrode 118 connected to the data line 120, a drain electrode 119 connected to the pixel electrode 124, And an active layer 116 overlapping the gate electrode 112 and forming a channel between the source electrode 118 and the drain electrode 119.

An ohmic contact layer 117 for ohmic contact with the source electrode 118 and the drain electrode 119 may be further included on the active layer 116. Here, the active layer 116 and the ohmic contact layer 117 are commonly referred to as a semiconductor layer 115.

For example, the thin film transistor Tr may be a top gate type having a stacked structure of the gate electrode 112, the semiconductor layer 115, the source electrode 118, and the drain electrode 119. . Alternatively, the thin film transistor Tr may be a bottom gate type that is an inverted structure of the top gate type.

The pixel electrode 124 passes through the passivation layer 121 that protects the thin film transistor Tr and the contact hole 123 that exposes the drain electrode 119 through the organic insulating layer 122 thereon. It is connected to the electrode 119.

The second substrate 130 may be formed on the common electrode 132 formed under the second base substrate 131, the partitions 133 formed under the common electrode 132, and the partitions 133. The display elements 135 provided in the cells 134 partitioned by the cells, and the first and second protective films provided on the upper portion of the second base substrate 131 and the lower portion of the display elements 135, respectively. 139, 140).

The display elements 135 may be microcapsules including charge pigment particles. The microcapsule 135 may include black dye particles 136 in response to a positive voltage, white dye particles 137 and an oil 138 in response to a negative voltage.

Hereinafter, a manufacturing method of an electronic paper display device having a plurality of unit pixels 100 will be described.

3 is a flowchart illustrating a method of manufacturing an electronic paper display device according to an embodiment of the present invention, and FIGS. 4 to 10 are perspective views illustrating a method of manufacturing the electronic paper display device according to an embodiment of the present invention. .

1 to 4, a first substrate 110 including a display area PA having a plurality of pixels and a non-display area NPA provided outside the display area PA so as not to implement an image. (S11)

The display area PA is a thin film transistor array having a plurality of unit pixels 100. The display area PA includes a plurality of gate lines (not shown) and a plurality of data lines formed on the first base substrate 111 of the first substrate 110 with the gate insulating layer 114 interposed therebetween. (Not shown), thin film transistors (not shown) formed at each intersection thereof, and pixel electrodes (not shown) formed in the cell regions provided in the intersection structure thereof.

The thin film transistor Tr forms gate electrodes 112 on the first base substrate 111, a gate insulating layer 114 over the entire surface thereof, and on the gate insulating layer 114. The semiconductor layer 115 overlapping the gate electrode 112 may be formed, and the source electrode 118 and the drain electrode 119 spaced apart from each other may be formed on the semiconductor layer 115. The semiconductor layer 115 may include an active layer 116 and an ohmic contact layer 117 formed on the active layer 116 to expose a portion of the surface of the active layer 116.

The data line 120 is formed to be connected to the source electrode 118, and the gate line 113 is formed to be connected to the gate electrode 112. The pixel electrode 124 forms a contact hole 123 exposing the drain electrode 119 by forming a passivation layer 121 and an organic insulating layer 122 on the thin film transistor Tr and etching the same. A transparent conductive material may be deposited on the organic insulating layer 122 including the contact hole 123 and then patterned to be connected to the drain electrode 119. For example, the pixel electrode 124 may be formed of indium tin oxide (ITO) or indium zinc oxide (IZO).

The first base substrate 111 may be made of a material having flexibility. For example, glass, plastic, or a semiconductor substrate may be used as the first base substrate 111.

1 to 3 and 5, the second substrate 130 including the display elements 135 provided in the plurality of cells 134 partitioned by the common electrode 132 and the plurality of partitions 133. (S11)

The common electrode 132 may be formed by stacking a transparent conductive material on the second base substrate 131. For example, the common electrode 132 may be made of ITO or IZO.

The barrier ribs 133 may be formed by forming a multilayer barrier rib material through a laminate method and then etching the barrier rib material. The partitions 133 may be formed directly on the common electrode 132 or may be separately formed and then attached to the common electrode 132. The partitions 133 may be formed of a resin, for example, an epoxy resin.

The display elements 135 may be injected into a plurality of cells 134 partitioned by the plurality of partitions 133. As the display elements 135, microcapsules including black dye particles 136 in response to a positive voltage, white dye particles 137 in response to a negative voltage, and an oil 138 may be used.

The second substrate 130 may include first and second protective films 139 and 140 on an upper portion of the second base substrate 131 and a lower portion of the display elements 135, respectively. The second protective film 140 blocks the flow of the spherical microcapsule 135 and serves to protect the microcapsule 135.

The second base substrate 131 and the first and second protective films 139 and 140 may be made of a transparent and flexible material. For example, a plastic polymer substrate may be used as the second base substrate 131 and the first protective film 139. The second protective film 140 may be made of a polymer, which is preferably applied in the form of a thin protective film.

3 and 6, a closed-loop having an exhaust hole 155 along the outer circumference of the display area PA on the non-display area NPA of the first substrate 110. The adhesive 150 is applied in the form of (S12).

The coating may be performed by inserting a UV curable sealant 162 into a syringe-type syringe 160 and spraying the sealant 162 through an injection needle 164. At this time, the amount of the sealant 162 to be injected is preferably adjusted to the pressure applied to the piston, the injection direction is possible both counterclockwise and clockwise. The application sprays the sealant 162 in the correct direction and size.

The adhesive 150 may be formed in a line type having a rectangular shape having an open portion, and the air existing therein may be formed in a subsequent bonding process (see FIG. 7) of the two substrates 110 and 130. The exhaust hole 155 may be formed within 5% of the entire adhesive application area for extraction.

In an embodiment of the present invention, the adhesive 150 is applied to the first substrate 110, but the present invention is not limited thereto, and the second protective film 140 may be formed on the second substrate 130. The adhesive 150 may be applied along the edge of the second protective film 140. However, in order to secure sufficient alignment margin when the first substrate 110 and the second substrate 130 are bonded together, the first substrate 110 may be disposed on the first substrate 110 rather than the second substrate 130. It is more advantageous to apply the adhesive 150.

3, 6, and 7, the first substrate 110 coated with the adhesive 150 and the second substrate 130 are bonded to each other (S13).

The bonding is performed by stacking the second substrate 130 in the vertical direction on the first substrate 110 to which the adhesive 150 is applied, and then aligning the first substrate to which the adhesive 150 is applied ( 110 and / or the second substrate 130 may be performed by rubbing with a roller 170.

The roller 170 may be composed of front and rear rollers (170a, 170b). The bonding may rub the roller 170 only on either the first substrate 110 or the second substrate 130 to which the adhesive 150 is applied, and the first adhesive to which the adhesive 150 is applied. The substrate 110 and the second substrate 130 may be rubbed on both sides. The bonding is carried out at room temperature without raising the temperature. The bonding process using the roller is also called lamination. The lamination direction A can proceed from front to back.

As such, when the first substrate 110 to which the adhesive 150 is applied and the second substrate 130 are rubbed to each other by using the roller 170, the two substrates 110 and 130 are in contact with each other. Adhered by the adhesive 150 to form a bonded substrate 180, the air existing between the two substrates 110 and 130 can be sufficiently removed through the exhaust hole 155.

On the other hand, if the adhesive 150 is applied on the second substrate 130, after laminating the second substrate 130 on which the adhesive 150 is applied on the first substrate 110 in a vertical direction The two substrates 110 and 130 may be bonded by rubbing with the roller 170.

3, 7 and 8, the cemented substrate 180 is vacuum sealed. (S14)

In the vacuum sealing, the bonding substrate 180 is placed inside a pouch film 190 for vacuum, and a predetermined pressure (for example, 75.8 KPa (568.54torr (mm) is used) using a vacuum sealing device (not shown). Hg O ° C.))) and the inlet 192 of the pouch film 190 is sealed using heat while all the air inside the pouch film 190 is removed.

By the vacuum sealing, residual air that may exist in the interior of the bonded substrate 180 may be completely removed, and the bonded substrate 180 may be a vacuum sealed bonded substrate 180 '. In addition, defects in unit pixels, distortion of pixels, and uneven surfaces of the display device, which may occur when the display device is driven, may be removed.

3, 6, 8, and 9, the adhesive 150 of the vacuum-sealed bonded substrate 180 'is cured. (S15)

The curing may be performed by irradiating UV to the adhesive 150. The intensity of the UV may be from several hundred W to several tens of Kw, which is somewhat stronger than the general UV intensity.

In particular, the curing may be performed in a state in which the display area PA of the first substrate 110 is covered using the object 200 that is not affected by UV. This is because when the elements of the semiconductor device in the array portion of the display area PA are exposed to the UV, the characteristics of the elements are significantly degraded, making them unsuitable for use as drive elements for display devices. The object 200 which is not affected by UV is removed after the curing is completed.

After the curing, the exhaust hole 155 of the adhesive 150 remains, and the vacuum-sealed bonding substrate 180 'becomes the bonding substrate 180 ″ on which the adhesive 150 is cured.

2, 3, 6, 9, and 10, the adhesive 150 heat-treats the bonded substrate 180 ″. (S16)

The heat treatment is performed in a state where the pouch film 190 is removed after the vacuum sealing. The heat treatment may be performed for several seconds to several minutes at a temperature of 100 to 150 ℃ of the second protective film 140 does not melt. For example, the heat treatment may be performed by placing the bonded substrate 180 ″ on which the adhesive 150 is cured in the air atmosphere on the hot plate 210.

By the heat treatment, the second protective film 140 is slightly melted due to heat, and the first substrate 110 and the second substrate 130 are almost completely adhered to each other while automatically contacting the pixel electrode 124. Done.

In particular, since the heat treatment is performed immediately after the pouch film 190 is removed, the first substrate 110 and the second substrate 130 are completely attached to each other, so that the exhaust hole 155 remains even if the exhaust hole 155 remains. Through 155, there is no fear of air entering the inside of the bonded substrate 180 ″ where the adhesive 150 is cured.

According to one embodiment of the present invention, while the consumption of the adhesive 150 is reduced through the manufacturing method, the adhesion of the first substrate 110 and the second substrate 130 can be implemented almost completely. As a result, when voltage is applied to the pixel electrode 124 and the common electrode 132 formed on each of the first and second substrates 110 and 130, the charged particles 136 and 137 for displaying an image are completely filled. In this case, the response speed can be increased by moving from black to white or white to black in a short time.

11A and 11B are optical microscope images illustrating an example of driving an electronic paper display device implemented by a method of manufacturing an electronic paper display device according to an embodiment of the present invention.

FIG. 11A illustrates a black state of the electronic paper display manufactured by an embodiment of the present invention, and FIG. 11B illustrates a white state of the electronic paper display manufactured by an embodiment of the present invention. White state)

In the electronic paper display device manufactured according to an embodiment of the present invention, since all pixels are uniformly bonded to each other to emit light more reliably, as shown in FIG. I could confirm it.

The present invention is not limited by the above-described embodiment and the accompanying drawings, but is intended to be limited by the appended claims. Accordingly, various forms of substitution, modification, and alteration may be made by those skilled in the art without departing from the technical spirit of the present invention described in the claims, which are also within the scope of the present invention. something to do.

100: unit pixel of the electronic paper display device
110: first substrate 111: first base substrate
112: gate electrode 113: gate line
114: gate insulating film 115: semiconductor layer
116: active layer 117: ohmic contact layer
118: source electrode 119: drain electrode
120: data line 121: protective film
122: organic insulating film 123: contact hole
124: pixel electrode 130: second substrate
131: second base substrate 132: common electrode
133: partition 134: cell
135: display element 136: black dye particles
137: white dye particles 138: oil
139: first protective film 140: second protective film
150: adhesive 155: exhaust hole
170: roller 180: bonding substrate
180 ': vacuum-sealed bonded substrate 180 ": adhesive-bonded bonded substrate
190: pouch film 200: object not affected by UV
210: hot plate Tr: thin film transistor
PA: display area NPA: non-display area

Claims (1)

Forming a first substrate including a thin film transistor and a pixel electrode;
Forming a second substrate including display elements provided in the plurality of cells partitioned by the common electrode and the plurality of partitions;
Applying an adhesive in a closed loop shape having an exhaust hole on the first or second substrate;
Bonding the first or second substrate to which the adhesive is applied and another substrate;
Vacuum sealing the bonded substrate;
Curing the adhesive of the vacuum sealed cemented substrate; And
And heat-treating the bonded substrate on which the adhesive is cured.

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