KR20120020515A - Led bulb with high optical and heat releasing property - Google Patents

Led bulb with high optical and heat releasing property Download PDF

Info

Publication number
KR20120020515A
KR20120020515A KR1020100084170A KR20100084170A KR20120020515A KR 20120020515 A KR20120020515 A KR 20120020515A KR 1020100084170 A KR1020100084170 A KR 1020100084170A KR 20100084170 A KR20100084170 A KR 20100084170A KR 20120020515 A KR20120020515 A KR 20120020515A
Authority
KR
South Korea
Prior art keywords
heat
heat dissipation
led
dissipation plate
led bulb
Prior art date
Application number
KR1020100084170A
Other languages
Korean (ko)
Inventor
김영철
Original Assignee
소닉스자펜 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 소닉스자펜 주식회사 filed Critical 소닉스자펜 주식회사
Priority to KR1020100084170A priority Critical patent/KR20120020515A/en
Priority to PCT/KR2011/006411 priority patent/WO2012030144A2/en
Publication of KR20120020515A publication Critical patent/KR20120020515A/en

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Power Engineering (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

PURPOSE: An LED lamp in which optical property and heat radiation property are excellent is provided to diversify the diffusion distribution of a light source by forming a glass bulb comprising an LED bulb into a concave lens part and a convex lens part. CONSTITUTION: A lens part(18) comprises a convex lens part(18a) and a concave lens part(18b). The lens part diffuses light to outside through the convex lens part and the concave lens part. A tap(11) is formed on the upper side of a mouthpiece(12). A wire attached to the mouthpiece is connected to an input part of a power supply part(13). A heat break board(14) is fixed to the lower surface of the power supply part fixed to the mouthpiece. A light-emitting diode module(19) is fixed to the surface of a laminate heat radiation board(17) by using a screw. The power supply part is electrically connected through an LED wiring passage(21) formed in the center of a heat radiation dust collecting plate(15). The laminate heat radiation board is fixed inside the lens part.

Description

광학특성 및 방열특성이 우수한 엘이디 전구{LED BULB WITH HIGH OPTICAL AND HEAT RELEASING PROPERTY}LED Bulb with Excellent Optical and Heat Dissipation Properties {LED BULB WITH HIGH OPTICAL AND HEAT RELEASING PROPERTY}

본 발명은 광학특성 및 방열특성이 우수한 엘이디전구에 관한 것으로, 보다 상세하게는 광원의 확산분포를 다각화 및 정밀화하고, 나아가 방열집진판과 유리구를 통해 열을 분산방열하는 이중의 방열구조를 취함으로써 효과적으로 열을 방출할 수 있는 엘이디 전구에 관한 것이다.
The present invention relates to an LED bulb having excellent optical characteristics and heat dissipation characteristics, and more particularly, by diversifying and precisely diffusing a distribution of a light source, and furthermore, by taking a double heat dissipation structure for dissipating and dissipating heat through the heat dissipation collecting plate and the glass sphere. The present invention relates to an LED bulb capable of effectively dissipating heat.

종래기술에 따른 엘이디 전구는 도 1에서와 같이, 일반적으로는 꼭지(1), 꼭지쇠(2), 전원공급부(3), 방열판(4), 엘이디모듈(5), 및 렌즈부인 유리구(6)로 구성되어 있으며, 보다 구체적으로는 유리구(6)가 방열판(4) 하단에 부착되고 방열판(4) 하단부분 중앙에 엘이디모듈(5)이 부착되며, 전원공급부(3)를 통해 전원이 공급되고, 꼭지쇠(2)와 방열판(4)사이에 전원공급부(3)가 부착된 구조를 취하고 있다.LED bulb according to the prior art, as shown in Figure 1, generally, the tap (1), the clasp (2), the power supply (3), the heat sink (4), the LED module (5), and the lens sphere glass sphere ( 6), more specifically, the glass sphere 6 is attached to the bottom of the heat sink (4), the LED module (5) is attached to the center of the lower part of the heat sink (4), the power supply through the power supply (3) Is supplied, and the power supply part 3 is attached between the clasp 2 and the heat sink 4. As shown in FIG.

상기 구조의 종래 엘이디 전구는 단순한 구형의 렌즈부로 이루어져, 광원의 확산분포가 단순하고 중심부로의 광원의 밀도를 높일 수 없는 한계가 존재한다.The conventional LED bulb of the above structure is composed of a simple spherical lens, there is a limit that the light distribution of the light source is simple and can not increase the density of the light source to the center.

또한, 상기와 같은 구조적 형태를 취하고 있는 종래 엘이디 전구들은 엘이디모듈(5)에서 발생하는 발열을 많이 방출할 수 있도록 굴곡을 가진 방열판(4)이 이를 흡수하여 외부로 방열하는 과정에서 발열의 일부가 전원공급부(3)또는 꼭지쇠(2)로 이동하게 된다. 하지만 방열판(4)과 전원공급부(3)가 매우 좁은 공간에 밀착된 구조를 취하므로 전원공급부(3)로 전달되는 열로 인해 전원공급부(3)가 과부하되거나 또는 전원공급중단 등의 현상이 발생되고, 뿐만 아니라 방열판(4)의 과열로 매우 높은 온도를 발생시켜 여러 가지의 예상치 못한 결과를 초래하게 된다.In addition, the conventional LED bulbs having the above-described structural form is part of the heat generated in the process of absorbing the heat sink (4) having a bend so as to emit a large amount of heat generated from the LED module (5) It is moved to the power supply (3) or clasp (2). However, since the heat sink 4 and the power supply unit 3 are in close contact with each other in a very narrow space, the heat transmitted to the power supply unit 3 causes the power supply unit 3 to be overloaded or the power supply is interrupted. In addition, overheating of the heat sink 4 generates very high temperatures, which lead to various unexpected results.

이와 같이 종래의 기술에서는 유리구(6)에 전달되는 엘이디 모듈(5)의 열이 흡수방출되지 못하는 점과 방열판(4)의 구조가 그 내부에 전원공급장치(3)를 포함하고 있는 점이 엘이디 전구의 과열현상으로 이어지고 있다. 또한 방열판의 방열량을 늘리기 위한 수단으로 방열판(4)의 면적을 늘리면 엘이디 전구가 필요이상으로 무거워지고, 나아가 미관상으로도 좋지 못한 결과를 초래하게 된다.
As described above, in the related art, the heat of the LED module 5 transmitted to the glass sphere 6 is not absorbed and released, and the structure of the heat sink 4 includes the power supply device 3 therein. It leads to overheating of the bulb. In addition, if the area of the heat sink 4 is increased as a means for increasing the heat dissipation amount of the heat sink, the LED bulb becomes heavier than necessary, and furthermore, it may cause unsatisfactory appearance.

본 발명은 상기한 바와 같은 종래기술이 가지는 문제를 해결하기 위해 안출된 것으로, 그 목적은 광원의 확산분포를 다각화 및 정밀화하고, 나아가 방열집진판과 유리구를 통해 열을 분산방열하는 이중의 방열구조를 취함으로써 효과적으로 열을 방출할 수 있는 엘이디 전구를 제공함에 있다. The present invention has been made to solve the problems of the prior art as described above, its purpose is to diversify and refine the diffusion distribution of the light source, and further double heat dissipation structure to dissipate heat through the heat collecting plate and glass sphere It is to provide an LED bulb that can effectively release heat by taking the.

상기한 바와 같은 본 발명의 기술적 과제는 다음과 같은 수단에 의해 달성되어진다.The technical problem of the present invention as described above is achieved by the following means.

(1) 엘이디 모듈;(1) an LED module;

상기 엘이디 모듈에 전원을 공급하는 전원공급수단;Power supply means for supplying power to the LED module;

상기 엘이디 모듈에서 발생한 열을 방출하기 위한 열방출수단; 및 Heat dissipation means for dissipating heat generated in the LED module; And

상기 엘이디 모듈을 내부에 포함하고, 볼록렌즈부와 오목렌즈부를 통해 광을 외부로 확산하는 렌즈부를 포함하는 엘이디 전구.
An LED bulb including the LED module therein, and including a lens unit for diffusing light to the outside through the convex lens portion and the concave lens portion.

(2) 제 1항에 있어서, 열방출수단은 (2) The heat dissipation means according to claim 1, wherein

적층구조로 이루어지며, 하단의 엘이디 모듈로부터 발생된 열을 상부로 일부 전달하고, 일부는 렌즈부를 통해 방열하는 적층방열판;A laminated heat dissipation plate made of a laminated structure and partially transferring heat generated from the LED module at the bottom to the upper part, and partially radiating heat through the lens unit;

상기 적층방열판으로부터 전달된 열을 외부로 방출하는 방열집전판; 및A heat dissipation plate for dissipating heat transferred from the laminated heat dissipation plate to the outside; And

상기 적층방열판과 방열집전판 사이에 설치되어, 엘이디 모듈에서 발생한 일부의 열이 적층방열판으로부터 렌즈부를 통해 방열할 수 있도록 해주는 열이동제어판;A heat transfer control panel installed between the laminated heat dissipation plate and the heat dissipation plate to allow a part of heat generated by the LED module to radiate heat from the laminated heat dissipation plate through the lens unit;

을 포함하는 것을 특징으로 하는 엘이디 전구.
LED bulb comprising a.

(3) 제 2항에 있어서,(3) The method according to 2,

상기 방열집전판의 상부에 열차단판이 더 부착된 것을 특징으로 하는 엘이디 전구.
LED bulb, characterized in that the heat shield is further attached to the upper portion of the heat dissipation plate.

(4) 제 3항에 있어서,(4) the method of paragraph 3,

상기 방열집전판은 벌집형으로 형성된 것을 특징으로 하는 엘이디 전구.
LED bulb, characterized in that the heat dissipation plate is formed in a honeycomb.

(5) 제 2항에 있어서,(5) The method according to 2,

상기 적층방열판의 표면은 세라믹재질 또는 카본재질로 증착된 것을 특징으로 하는 엘이디 전구.
LED surface, characterized in that the surface of the laminated heat sink is deposited in a ceramic material or carbon material.

(6) 제 1항에 있어서,(6) The method according to 1,

상기 렌즈부는 하단 중앙 및 양 단이 볼록렌즈부를 이루고, 상기 볼록렌즈부의 사이에 오목렌즈부가 형성된 것을 특징으로 하는 엘이디 전구.
LED lens, characterized in that the center of the lower end and both ends of the convex lens portion, the concave lens portion formed between the convex lens portion.

(7) 제 1항에 있어서,(7) The method according to 1,

상기 방열집전판의 주위에 방열집진판 보호대가 부착된 것을 특징으로 하는 엘이디 전구.
LED bulb, characterized in that the heat dissipation plate protector is attached around the heat dissipation plate.

(8) 제 1항에 있어서,(8) The method according to 1,

상기 방열집전판은 렌즈고정홈을 두고, 상기 렌즈고정홈과 렌즈부의 상단개구부가 접착재를 매개하여 밀폐고정되어진 것을 특징으로 하는 엘이디 전구.
The heat dissipating plate has a lens fixing groove, the LED bulb, characterized in that the top of the lens fixing groove and the lens opening is sealed by the adhesive medium.

(9) 제 1항에 있어서,(9) The method according to 1,

상기 방열집전판은 전구내에서 발생한 화학성분을 배출하거나 내부로 첨가제를 투입하기 위한 배출구 및, 상기 배출구를 밀봉하기 위해 충진된 밀봉재를 소정 위치에 갖는 특징으로 하는 엘이디 전구.
The heat dissipation plate is an LED bulb characterized in that it has a discharge port for discharging the chemical component generated in the bulb or injecting additives therein, and a sealing material filled to seal the discharge port at a predetermined position.

상기와 같이 본 발명에 의하면, 엘이디 전구를 구성하는 유리구를 오목렌즈부와 볼록렌즈부로 구성하여 광원의 확산분포를 다각화하고 뿐만 아니라 보다 정밀하게 조사할 수 있어 밀도 높은 광원을 제공할 수 있다.According to the present invention as described above, the glass sphere constituting the LED bulb is composed of a concave lens portion and a convex lens portion to diversify the diffusion distribution of the light source as well as to be more precisely irradiated to provide a high-density light source.

나아가 본 발명은 방열집진판과 유리구를 통해 열을 분산방열하는 이중의 방열구조를 취함으로써 기존의 엘이디 전구에 비하여 열의 방출을 보다 효과적으로 수행할 수 있는 엘이디 전구를 제공한다.
Furthermore, the present invention provides an LED bulb that can more efficiently perform heat dissipation than a conventional LED bulb by taking a double heat dissipation structure for dissipating and dissipating heat through a heat collecting plate and a glass sphere.

도 1a,b는 각각 종래 기술에 따른 엘이디 전구의 구성도 및 렌즈부를 통한 광의 확산특성을 보여준다.
도 2는 본 발명에 따른 엘이디 전구의 조립전 상태의 분해 단면도이다.
도 3a,b는 각각 본 발명에 따른 엘이디 전구의 조립된 상태의 구성도 및 렌즈부를 통한 광의 확산특성을 보여준다.
도 4는 본 발명에 따른 엘이디 전구를 구성하는 열차단판의 실시도이다.
도 5는 본 발명에 따른 엘이디 전구를 구성하는 렌즈부의 실시도이다.Figures 1a, b shows the configuration of the LED bulb according to the prior art and the light diffusion characteristics of the light through the lens unit, respectively.
Figure 2 is an exploded cross-sectional view of a pre-assembled state of the LED bulb according to the present invention.
3A and 3B show the configuration of the assembled LED bulb according to the present invention and the light diffusing characteristics of the light through the lens unit, respectively.
Figure 4 is an embodiment of a heat shield plate constituting the LED bulb according to the present invention.
5 is an embodiment of the lens unit constituting the LED bulb according to the present invention.

본 발명은 엘이디 모듈;The present invention is an LED module;

상기 엘이디 모듈에 전원을 공급하는 전원공급수단;Power supply means for supplying power to the LED module;

상기 엘이디 모듈에서 발생한 열을 방출하기 위한 열방출수단; 및 Heat dissipation means for dissipating heat generated in the LED module; And

상기 엘이디 모듈을 내부에 포함하고, 볼록렌즈부와 오목렌즈부를 통해 광을 외부로 확산하는 렌즈부를 포함하는 엘이디 전구를 제공한다.
An LED bulb is included in the LED module and includes a lens unit configured to diffuse light to the outside through the convex lens unit and the concave lens unit.

이하 본 발명의 내용을 도면에 도시되어진 실시예를 참조하여 보다 상세하게 설명하면 다음과 같다.Hereinafter, the content of the present invention will be described in detail with reference to the embodiments shown in the drawings.

도 2 및 도 3a,b에 도시된 바와 같은 본 발명의 엘이디 전구는 규격화된 꼭지(11)가 부착된 꼭지쇠(12), 전원공급부(13), 열차단판(14), 방열집진판(15), 열이동제어판(16), 적층방열판(17), 렌즈부(18), LED모듈(19), 및 방열집진판보호대(20)를 포함한다.
LED bulb of the present invention as shown in Figures 2 and 3a, b has a standardized tap 11 attached to the clasp 12, the power supply 13, heat shield plate 14, heat dissipation collecting plate 15 And a heat transfer control panel 16, a laminated heat sink 17, a lens unit 18, an LED module 19, and a heat dissipation plate protector 20.

본 발명의 상기 렌즈부(18)는 광원의 확산분포를 다각화하고 뿐만 아니라 보다 정밀하게 조사할 수 있어 밀도 높은 광원을 제공할 수 있도록 볼록렌즈부와 오목렌즈부를 포함하여 이루어진다. 바람직하게는 하단 중앙 및 양 단이 볼록렌즈부(18a)를 이루고, 상기 볼록렌즈부의 사이에 오목렌즈부(18b)가 형성된다. 상기 오목렌즈부(18b)는 일례로 도 5에 도시된 바와 같이 내부 전체를 유리로 구성하여 광원확산을 중앙으로 집진하고 광원의 중심을 넓게 하고 동시에, 주변의 광원은 좀 더 은은하게 유도할 수 있다.
The lens portion 18 of the present invention includes a convex lens portion and a concave lens portion so as to diversify the distribution of the light source as well as more precisely irradiate the light source to provide a high density light source. Preferably, the lower center and the both ends form a convex lens portion 18a, and a concave lens portion 18b is formed between the convex lens portions. For example, as shown in FIG. 5, the concave lens unit 18b may be formed of glass, and the light source diffusion may be concentrated to the center, and the center of the light source may be widened. .

상기 본 발명에 따른 렌즈부(18)의 구성에 의하면, 기존의 일반적인 엘이디 전구의 렌즈부(유리구)가 도 1b에서와 같이 단순히 사방으로 균일하게 광을 확산시켜주는 것에 비해, 도 3b에 제시된 바와 같이 중앙으로 광을 집중할 수 있고, 주변은 보다 은은한 빛을 창출할 수 있도록 한다는 점에서 광을 밀도있게 효율적으로 사용하게 해주는 장점을 제공한다.According to the configuration of the lens unit 18 according to the present invention, the lens unit (glass sphere) of the conventional general LED bulb is shown in FIG. 3B, as shown in FIG. As can be focused light in the center and the surroundings can produce a softer light, it provides the advantage of using light efficiently and densely.

이하, 본 발명에 따른 엘이디 전구의 전체 구성 및 특히 방열특성을 개선하기 위한 부가구성에 대하여 구체적으로 설명한다.
Hereinafter, the overall configuration of the LED bulb according to the present invention and in particular the additional configuration for improving the heat dissipation characteristics will be described in detail.

본 발명의 엘이디 전구를 구성하는 꼭지쇠(12)에는 그 상단에 꼭지(11)가 형성되고, 전선이 부착되어진다. 전원이 인가되어지는 입력부분인 꼭지쇠의 지름은 Φ 27mm, Φ 17mm, Φ 11mm등으로 구성할 수 있다. 이때 꼭지쇠(12)에 부착되는 전선은 적당한 길이로 절단한 후 전원공급부(13)의 입력부분과 연결되며, 전원은 엘이디 모듈의 출력에 따라서 전원공급부의 출력을 조절하여 공급되어질 수 있다. 이와 같이 꼭지쇠(12)에 전원공급장치(13)가 삽입 고정되고, 이를 위해 가구물을 이용하거나 에폭시가 이용될 수 있다.
In the clasp 12 which comprises the LED bulb of this invention, the top 11 is formed in the upper end, and the electric wire is attached. The diameter of the clasp, the input part to which power is applied, can be composed of Φ 27mm, Φ 17mm, Φ 11mm, and so on. At this time, the wire attached to the clasp 12 is cut to a suitable length and then connected to the input of the power supply 13, the power can be supplied by adjusting the output of the power supply in accordance with the output of the LED module. As such, the power supply device 13 is inserted into and fixed to the clasp 12, and for this, furniture or epoxy may be used.

상기와 같이 꼭지쇠(12)에 고정된 전원공급부(13)의 하단면에 열차단판(14)이 고정부착되어진다. 상기 열차단판(14)은 열을 잘 흡수하지 않는 재료에서 선택되고, 특히 방열집진판(15)에 접착되는 부위를 도 4에 도시한 바와 같이 벌집형으로 구성함으로써 열을 최대한 방열집진판(15)으로 옮겨지도록 한다. 이의 구체적인 예로, 상기 열차단판(14)은 두께 1.0 내지 3.0 mm의 테프론으로 하고, 동시에 꼭지쇠(12)와 열차단판(14) 사이에 존재하는 전원공급부(13)가 고정되는 꼭지쇠(12)의 하단면은 열에 강하고 절연성이 좋은 플라스틱을 사용하며 나사를 이용하여 고정시킨다.
The heat shield plate 14 is fixed to the bottom surface of the power supply unit 13 fixed to the clasp 12 as described above. The heat shield plate 14 is selected from a material that does not absorb heat well, and in particular, the portion bonded to the heat radiation collecting plate 15 is configured in a honeycomb as shown in FIG. To be moved. As a specific example of this, the heat shield plate 14 is made of Teflon 1.0 to 3.0 mm thick, and at the same time the clasp 12 to which the power supply 13 existing between the clasp 12 and the heat shield plate 14 is fixed. The bottom surface of the board is made of heat-resistant plastic with good insulation and fixed with screws.

엘이디모듈(19)은 적층방열판(17) 표면에 나사 등을 이용하여 고정부착되어진다. 이러한 엘이디 모듈(19)은 다양한 색깔 및 출력을 갖는 제품으로부터 선택되어질 수 있으며, 상기 방열집진판(15) 중앙에 형성된 엘이디배선통로(21)를 통해서 전원공급부(13)와 전기적으로 접속되어진다.
The LED module 19 is fixedly attached to the surface of the laminated heat sink 17 using a screw or the like. The LED module 19 may be selected from products having various colors and outputs, and are electrically connected to the power supply unit 13 through the LED wiring passage 21 formed at the center of the heat dissipation collecting plate 15.

적층방열판(17)은 렌즈부(18)의 내부에 고정되며, 적층구조로 이루어지고, 하단의 엘이디모듈(19)로부터 발생된 열을 상부로 일부 전달하고, 일부는 렌즈부를 통해 방열하는 역할을 수행한다. 바람직하게는 상기 적층방열판은 알루미늄 재질을 사용하며, 특히 방열효과를 높이기 위해 세라믹재질 또는 카본재질을 표면에 증착한다. 상기 적층방열판(17)은 방열집진판(15)으로 열이 이동되는 과정에서 렌즈부(18)와의 사이 간격이 매우 좁아 렌즈부(18)를 통해 매우 높은 효율로 방열을 수행한다. 보다 구체적인 예로는 상기 적층방열판(17)은 두께 1.0mm, 간격 2.0 mm의 알루미늄을 사용하고 엘이디의 출력에 따라서 5 내지 12개 까지 적층하는 구성을 취할 수 있다. 바람직하게는 적층방열판 하단의 상기 엘이디 모듈의 고정면은 굴곡이 없어야 하며 면과 면 사이에는 열전도가 잘되도록 열전도효율이 높은 에폭시를 사용하는 것이 좋다.
The laminated heat dissipation plate 17 is fixed to the inside of the lens unit 18, has a laminated structure, and partially transfers heat generated from the LED module 19 at the lower portion thereof, and partially serves to radiate heat through the lens unit. To perform. Preferably, the laminated heat sink is made of aluminum, and in particular, in order to increase the heat dissipation effect, a ceramic material or carbon material is deposited on the surface. The laminated heat dissipation plate 17 performs heat dissipation with a very high efficiency through the lens unit 18 because the gap between the lens unit 18 is very narrow in the process of moving heat to the heat dissipation collecting plate 15. As a more specific example, the laminated heat sink 17 may use aluminum having a thickness of 1.0 mm and a thickness of 2.0 mm, and stack up to 5 to 12 pieces according to the output of the LED. Preferably, the fixing surface of the LED module at the bottom of the laminated heat sink should have no bending, and it is preferable to use an epoxy having high thermal conductivity so that thermal conductivity is good between the surfaces.

상기 방열집진판(15), 적층방열판(17) 사이에 바람직하게는 열이동제어판(16)을 나사 등을 이용하여 고정시킨다. 열이동제어판(16)은 구체적인 예로 두께 1.5 mm 정도의 테프론이 사용될 수 있고, 엘이디모듈(19)에서 발생하는 열이 적층방열판(17)으로 이동하여 방열집진판(15)으로 전달되는 열의 일부를 적층방열판(17)에서 바로 렌즈부(18)를 통해 방열을 유도하는 역할을 수행한다. 바람직하게는 상기 방열집진판의 단부에 열을 효과적으로 방열시킬 수 있도록 하면서 이를 외부로부터 보호하기 위한 방열집진판보호대(20)가 삽입되어질 수 있다.
Preferably, the heat transfer control plate 16 is fixed between the heat dissipation collecting plate 15 and the laminated heat dissipating plate 17 by using a screw or the like. For example, Teflon having a thickness of about 1.5 mm may be used as the heat transfer control panel 16. The heat generated from the LED module 19 is transferred to the laminated heat sink 17, and a part of the heat transferred to the heat collecting dust plate 15 is laminated. The heat sink 17 directly serves to induce heat radiation through the lens unit 18. Preferably, the heat dissipation plate protector 20 may be inserted to protect the heat dissipation plate from the outside while effectively dissipating heat at the end of the heat dissipation plate.

본 발명은 상기 방열집진판(15)의 단부에 렌즈고정홈(22)을 두고, 상기 홈의 내부에 에폭시와 같은 접착제를 골고루 적당량으로 도포한 후 렌즈부(18)의 상단개구부를 밀착하고, 접착제를 경화시켜 고정한다.
The present invention has a lens fixing groove 22 at the end of the heat dissipation collecting plate 15, and evenly apply an adhesive such as epoxy to the inside of the groove evenly in an appropriate amount and then close the top opening of the lens unit 18, the adhesive Harden and fix.

상기 방열집진판(15)과 렌즈부(18)를 밀착하고 접착제를 경화하는 과정에서 방열집진판(15)과 렌즈고정홈(22) 사이가 밀폐되어 에폭시의 화학적 성분이 엘이디모듈(19)에서 발생하는 열로 인하여 렌즈부(18) 내부에 남아 장시간 경과 후 엘이디모듈(19)의 광원에 악영향을 줄 수 있다. 따라서, 바람직하게는 상기 렌즈부의 밀폐된 공간에 남아있는 화학적 성분을 배출할 수 있도록 방열집진판의 소정 위치에 배출구(23)를 형성하여 원하지 않는 화학성분이 일정시간 외부로 배출될 수 있도록 한 후 제품 완성이후 출하 전에 밀봉재를 충진하여 막아준다.
In the process of closely contacting the heat dissipation collecting plate 15 and the lens unit 18 and curing the adhesive, the heat dissipating collecting plate 15 and the lens fixing groove 22 are sealed so that the chemical composition of the epoxy is generated in the LED module 19. Due to heat, it may remain inside the lens unit 18 and may adversely affect the light source of the LED module 19 after a long time. Therefore, preferably, the discharge port 23 is formed at a predetermined position of the heat dissipation collecting plate to discharge the chemical component remaining in the closed space of the lens unit so that the unwanted chemical component can be discharged to the outside for a predetermined time. After completion, fill and seal the sealing material before shipping.

또한, 상기 배출구(23)는 내부 부품의 산화를 방지할 수 있는 첨가제 뿐만 아니라, 기타 다른 용도를 위한 각종 첨가제의 주입구로써도 사용되어질 수 있다.
In addition, the outlet 23 may be used as an inlet for various additives for other purposes as well as additives that can prevent oxidation of internal parts.

상기와 같이 고정된 렌즈부(18)의 비틀림을 없애기 위하여 렌즈부(18) 상단 면을 볼 수 있도록 하는 지그를 이용하여 고정시킨 후 전자특성과 각종 규격의 이상 유무를 판별할 수 있다.
In order to eliminate the torsion of the fixed lens unit 18 as described above, using the jig for viewing the upper surface of the lens unit 18 can be fixed, it is possible to determine the abnormality of the electronic characteristics and various standards.

상기와 같이, 본 발명의 바람직한 실시 예를 참조하여 설명하였지만 해당 기술 분야의 숙련된 당업자라면 하기의 특허청구범위에 기재된 본 발명의 사상 및 영역으로부터 벗어나지 않는 범위 내에서 본 발명을 다양하게 수정 및 변경시킬 수 있음을 이해할 수 있을 것이다.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It can be understood that

11: 꼭지
12: 꼭지쇠
13: 전원공급부
14: 열차단판
15: 방열집진판
16: 열이동제어판
17: 적층방열판
18: 렌즈부
19: 엘이디 모듈
20: 방열집진판보호대
21: 엘이디배선통로
22: 렌즈고정홈
23: 배출구11: faucet
12: clasp
13: power supply
14: heat shield
15: heat collecting dust plate
16: heat transfer control panel
17: laminated heat sink
18: lens unit
19: LED module
20: heat collecting dust cover
21: LED wiring passage
22: Lens fixing groove
23: outlet

Claims (9)

엘이디 모듈;
상기 엘이디 모듈에 전원을 공급하는 전원공급수단;
상기 엘이디 모듈에서 발생한 열을 방출하기 위한 열방출수단; 및
상기 엘이디 모듈을 내부에 포함하고, 볼록렌즈부와 오목렌즈부를 통해 광을 외부로 확산하는 렌즈부를 포함하는 엘이디 전구. LED module;
Power supply means for supplying power to the LED module;
Heat dissipation means for dissipating heat generated in the LED module; And
An LED bulb including the LED module therein, and including a lens unit for diffusing light to the outside through the convex lens portion and the concave lens portion. 제 1항에 있어서, 열방출수단은
적층구조로 이루어지며, 하단의 엘이디 모듈로부터 발생된 열을 상부로 일부 전달하고, 일부는 렌즈부를 통해 방열하는 적층방열판;
상기 적층방열판으로부터 전달된 열을 외부로 방출하는 방열집전판; 및
상기 적층방열판과 방열집전판 사이에 설치되어, 엘이디 모듈에서 발생한 일부의 열이 적층방열판으로부터 렌즈부를 통해 방열할 수 있도록 해주는 열이동제어판;
을 포함하는 것을 특징으로 하는 엘이디 전구.The heat dissipation means according to claim 1,
A laminated heat dissipation plate made of a laminated structure and partially transferring heat generated from the LED module at the bottom to the upper part, and partially radiating heat through the lens unit;
A heat dissipation plate for dissipating heat transferred from the laminated heat dissipation plate to the outside; And
A heat transfer control plate installed between the laminated heat dissipation plate and the heat dissipation plate to allow a part of heat generated from the LED module to radiate heat from the laminated heat dissipation plate through the lens unit;
LED bulb comprising a. 제 2항에 있어서,
상기 방열집전판의 상부에 열차단판이 더 부착된 것을 특징으로 하는 엘이디 전구.The method of claim 2,
LED bulb, characterized in that the heat shield is further attached to the upper portion of the heat dissipation plate. 제 3항에 있어서,
상기 방열집전판은 벌집형으로 형성된 것을 특징으로 하는 엘이디 전구.The method of claim 3,
LED bulb, characterized in that the heat dissipation plate is formed in a honeycomb. 제 2항에 있어서,
상기 적층방열판의 표면은 세라믹재질 또는 카본재질로 증착된 것을 특징으로 하는 엘이디 전구.The method of claim 2,
LED surface, characterized in that the surface of the laminated heat sink is deposited in a ceramic material or carbon material. 제 1항에 있어서,
상기 렌즈부는 하단 중앙 및 양 단이 볼록렌즈부를 이루고, 상기 볼록렌즈부의 사이에 오목렌즈부가 형성된 것을 특징으로 하는 엘이디 전구.The method of claim 1,
LED lens, characterized in that the center of the lower end and both ends of the convex lens portion, the concave lens portion formed between the convex lens portion. 제 1항에 있어서,
상기 방열집전판의 주위에 방열집진판 보호대가 부착된 것을 특징으로 하는 엘이디 전구.The method of claim 1,
LED bulb, characterized in that the heat dissipation plate protector is attached around the heat dissipation plate. 제 1항에 있어서,
상기 방열집전판은 렌즈고정홈을 두고, 상기 렌즈고정홈과 렌즈부의 상단개구부가 접착재를 매개하여 밀폐고정되어진 것을 특징으로 하는 엘이디 전구.The method of claim 1,
The heat dissipating plate has a lens fixing groove, the LED bulb, characterized in that the top of the lens fixing groove and the lens opening is sealed by the adhesive medium. 제 1항에 있어서,
상기 방열집전판은 전구내에서 발생한 화학성분을 배출하거나 내부로 첨가제를 투입하기 위한 배출구 및, 상기 배출구를 밀봉하기 위해 충진된 밀봉재를 소정 위치에 갖는 특징으로 하는 엘이디 전구.The method of claim 1,
The heat dissipation plate is an LED bulb characterized in that it has a discharge port for discharging the chemical component generated in the bulb or injecting additives therein, and a sealing material filled to seal the discharge port at a predetermined position.
KR1020100084170A 2010-08-30 2010-08-30 Led bulb with high optical and heat releasing property KR20120020515A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020100084170A KR20120020515A (en) 2010-08-30 2010-08-30 Led bulb with high optical and heat releasing property
PCT/KR2011/006411 WO2012030144A2 (en) 2010-08-30 2011-08-30 Led light bulb having superior optical and heat-dissipating qualities

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100084170A KR20120020515A (en) 2010-08-30 2010-08-30 Led bulb with high optical and heat releasing property

Publications (1)

Publication Number Publication Date
KR20120020515A true KR20120020515A (en) 2012-03-08

Family

ID=45773382

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100084170A KR20120020515A (en) 2010-08-30 2010-08-30 Led bulb with high optical and heat releasing property

Country Status (2)

Country Link
KR (1) KR20120020515A (en)
WO (1) WO2012030144A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103615670B (en) * 2013-10-17 2016-12-07 上虞市正和照明科技有限公司 A kind of LED bulb

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4725176B2 (en) * 2005-04-25 2011-07-13 パナソニック電工株式会社 Optical component and lighting apparatus using the optical component
KR200430022Y1 (en) * 2006-07-05 2006-11-02 주식회사 티씨오 Lighting for High brightness light emitting diode
KR100945862B1 (en) * 2007-11-22 2010-03-05 주식회사 세명반도체 A light emitting diode lamp having a spread light medium and reflector
KR100923435B1 (en) * 2009-03-31 2009-10-27 주식회사 신한빛 Led lighter having air channel

Also Published As

Publication number Publication date
WO2012030144A3 (en) 2012-05-31
WO2012030144A2 (en) 2012-03-08

Similar Documents

Publication Publication Date Title
JP5953428B2 (en) LED module sealing method
WO2017152879A1 (en) Light emitting diode module and manufacturing method therefor, and lamp
CN208090482U (en) UV-LED curing light source systems
JP2009033081A (en) Light emitting diode device
TW201326663A (en) LED packages for an LED bulb
TWI429848B (en) Even-heat distribution structure and heat-dissipation module incorporating the structure
JP2010109368A (en) Insulating and dissipating heat structure of electronic part
TWM436465U (en) UV LED fingernail lamp structure with low illumination angle and high illuminance and LED light source module thereof
TWM309757U (en) Side view LED package structure
US20200028047A1 (en) Light emitting diode array package structure with high thermal conductivity
CN102748626B (en) LED (Light-Emitting Diode) tube and manufacturing method thereof
CN105529390A (en) Inorganic-packaged self-focusing integrated UVLED module
TW201221830A (en) LED light device with improved thermal and optical characteristics
TWM494257U (en) Color wheel fixtures and color wheel components and their application in projection system
CN105974719B (en) A kind of Wavelength converter and laser display system
KR20160132825A (en) Novel led lighting apparatus
TW201644075A (en) Solid-state encapsulated LED light bulb
CN203273334U (en) Luminaire
KR20120020515A (en) Led bulb with high optical and heat releasing property
CN103085466B (en) For solidifying the mixed wavelengths UV LED light source device of tradition UV ink
KR101237685B1 (en) Heat radiating substrate and method of manufacturing the same
CN211297488U (en) Heat radiation structure of electronic element
TWI751526B (en) Deep ultraviolet LED module structure
CN205335294U (en) Inorganic encapsulation from integrated UVLED module of spotlight
KR101592637B1 (en) LED lighting device

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right