KR20120019066A - Structure for preventing misassembling of relay - Google Patents

Abstract

PURPOSE: A structure for preventing the wrong assembling of a relay is provided to prevent relay failures by forming only a predetermined normal relay to be assembled in a relay housing. CONSTITUTION: A terminal groove(21) is formed in a relay housing(20). A first wrong assembling prevention protrusion(22) is perpendicularly projected on the relay housing. Each coupling port(11) of a relay(10) is combined with a corresponding terminal groove. The relay is assembled to the relay housing. A first projection insertion groove(12) is combined with the first wrong assembling prevention protrusion by the relay.

Description

Relay misassembly prevention structure {STRUCTURE FOR PREVENTING MISASSEMBLING OF RELAY}

The present invention relates to a relay misassembly prevention structure, and more particularly, it is configured so that only a predetermined regular relay can be assembled in the relay housing, thereby preventing the misassembly of the relay inherently, thereby failure of the relay by misassembly The present invention relates to a relay misassembly prevention structure that prevents occurrence and improves the stability and operation reliability of the relay.

In general, a relay is a switch that interrupts the flow of electric current, and is an electronic component that performs a function of driving an electric and electronic product and transmitting a signal.

The well-known electromechanical relay mounts a coil to a yoke made of iron core and installs a movable contact to the yoke. When a low current is applied to the coil, the movable contact moves by a magnetic force formed in the coil to connect a high current contact terminal. And to control the flow of high current by control of low current.

In recent years, unlike the electromechanical relay described above, which is a contact relay, the use of a solid state relay, i.e., a semiconductor relay, which is an electronic switch that does not include moving parts, is gradually increasing.

Such semiconductor relays include semiconductor relays that respond to light, semiconductor relays that respond to voltage, and semiconductor relays that respond to both. For example, in a semiconductor relay that responds to light, an optical sensor diode that responds to light, A semiconductor switch such as a light emitting diode to which a voltage signal is applied to operate an optical sensor diode and a metal oxide semiconductor field effect transistor (MOSFET) connected to a load is used.

Semiconductor relays have a faster response time than electromechanical relays, can be operated between control logic and high voltage loads separately, and have a semi-permanent service life because there are no moving parts to wear out.

Semiconductor relays can also be useful in environments with low electrical noise, silent operation, and no sparking during turn-on.

On the other hand, Figure 1 is a perspective view showing a relay and a relay housing according to the prior art, the relay 10 used is provided to be electrically connected to the corresponding relay housing 20 provided in the junction box, etc., the relay housing 20 ) Is a kind of connector that is assembled so that each fixed relay 10 can be electrically connected.

That is, for electrical connection, the relay 10 is provided with a plurality of coupling terminals 11, and the relay housing 20 has each coupling terminal 11 at a corresponding position of each coupling terminal 11 of the relay 10. A plurality of terminal grooves 21 are inserted into and coupled to each other.

However, in the conventional case, no structure is provided at the mutually corresponding contact portion between the relay 10 and the relay housing 20 to prevent misassembly with other products.

Therefore, when the terminal spacing of each type of the relay product is commonly used and defined as a specific size, there is a possibility that other relays are assembled in the corresponding relay housing.

In this way, if a semiconductor relay having a different operating principle and a housing wiring structure is misassembled due to confusion with an existing product (general electromechanical relay), overheating may occur due to malfunction of the product and continuous energization, and eventually, product failure may occur. You can.

That is, when the semiconductor relay and the general relay are mixed and misassembled at the time of assembly, for example, the semiconductor relay is assembled in the relay housing in which the general electromechanical relay is to be assembled, or the general electromechanical relay is installed in the relay housing in which the semiconductor relay is to be assembled. If assembled, or if a relay with different specifications, even the same semiconductor relay or electromechanical relay in a specific relay housing, is misassembled, product failure can occur.

Accordingly, the present invention has been invented to solve the above problems, by only allowing a predetermined regular relay to be assembled in the relay housing, thereby preventing the incorrect assembly of the relay, thereby failing the relay due to incorrect assembly The purpose of the present invention is to provide a relay misassembly prevention structure that can prevent occurrence and increase the stability and operation reliability of the relay.

In order to achieve the above object, the present invention, the first mis-assessment prevention projection is formed to protrude in the relay housing formed with a terminal groove, and each coupling terminal is coupled to the terminal groove in the relay assembled to the relay housing Provided is a relay misassembly prevention structure, characterized in that the first projection insertion groove is formed to be coupled to the first misassembly preventing projection is formed in the corresponding position of the first misassembly preventing projection of the relay housing.

In a preferred embodiment, the second misassembly preventing projections are further protrudingly formed in the relay, the second misassembly preventing projections can be inserted into the relay housing corresponding to the second misassembly preventing projections of the relay in the relay housing. The second protrusion insertion groove may be further formed.

In addition, any one or two or more of the shape and size, position, and protrusion height of the protrusion, and correspondingly, the shape and size, position, and insertion depth of the protrusion insertion groove may be set differently for each relay specification. It is desirable to ensure that only a predetermined regular relay can be assembled in the relay housing.

Accordingly, according to the relay misassembly prevention structure according to the present invention, the protrusion and the groove structure is further formed in the contact portion between the relay and the relay housing, so that only a predetermined regular relay can be assembled in the relay housing, Misassembly of the relay can be prevented at the source, thereby preventing the occurrence of failure of the relay due to misassembly, and improving the stability and operation reliability of the relay.

1 is a perspective view showing a relay and a relay housing according to the prior art.
2 is a perspective view showing a relay and a relay housing having a misassembly prevention structure according to the present invention.
3 and 4 are perspective views illustrating that the misassembly of the relay can be prevented by the misassembly prevention structure according to the present invention.
5 is a perspective view illustrating a state in which a regular relay is assembled to a relay housing by a misassembly prevention structure according to the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention.

The present invention relates to a relay misassembly prevention structure that adds a shape for preventing misassembly to a part in contact with each other between a relay and a relay housing when the relay is assembled, so that only a predetermined regular relay can be assembled in the relay housing. will be.

For example, even if a semiconductor relay is assembled in a relay housing in which a general electromechanical relay is to be assembled, or a general electromechanical relay is assembled in a relay housing in which a semiconductor electromechanical relay is to be assembled, or a semiconductor relay or a general relay may be used in a specific relay housing. This is to prevent mismatching of relays with different specifications.

2 is a perspective view showing a relay and a relay housing having a misassembly prevention structure according to the present invention, Figures 3 and 4 is that the misassembly of the relay can be prevented by the misassembly prevention structure according to the present invention. 5 is a perspective view illustrating a state in which a regular relay is assembled to a relay housing by a misassembly prevention structure according to the present invention.

First, as shown in FIGS. 2 and 5, the relay 10 is provided with a plurality of coupling terminals 11, and the relay housing 20 has respective coupling terminals corresponding to respective coupling terminals 11 of the relay 10. A plurality of terminal grooves 21 to which the terminal 11 may be inserted and coupled are formed.

Such a structure is the same as the conventional structure, and apart from this, in the present invention, the first relay assembly preventing protrusion 22 protrudes from the relay housing 20, and a regular relay (which should be assembled to the relay housing 20). 10, at the corresponding position of the first misassembly preventing protrusion 22 of the relay housing 20, when the regular relay 10 is inserted into the relay housing 20 and assembled, the first misassembly preventing protrusion ( A first protrusion insertion groove 12 is formed to which 22 is inserted and coupled thereto.

At this time, the first misassembly preventing projection 22 may be formed in the singular or plural in the side position of the terminal groove 21 in the contact portion where the terminal groove 21 of the relay housing 20 is formed, the first projection insertion The groove 12 may be formed in the same number as the first misassembly preventing protrusion 22 on the contact portion of the relay 10 with the relay housing 20, that is, the lower surface of the relay 10.

The first misassembly preventing protrusion 22 of the relay housing 20 and the first protrusion insertion groove 12 of the relay 10 are formed to prevent misassembly of the relay, and the first 1 The misassembly preventing projection 22 is formed to be inserted only in the first projection insertion groove 11 formed in the regular relay 10 to be assembled in the relay housing.

In the present invention, the relay 10 in which the first protrusion insertion groove 12 is formed may be a semiconductor relay or a general electromechanical relay.

That is, the first protrusion insertion groove 12 may be selectively applied to any one of the semiconductor relay and the general electromechanical relay so that the semiconductor relay and the general electromechanical relay can be distinguished and assembled.

In addition, the first misassembly preventing protrusion 22 may include a relay 10 having a first protrusion insertion groove 12 formed therein, so that the semiconductor relay and the general electromechanical relay can be distinguished and assembled. It may be selectively applied only to the relay housing 20 to be assembled.

For example, the first projection insertion groove 12 is formed only in the semiconductor relay 10 shown in FIG. 2, and at the same time, the first misassembly preventing projection 22 is formed only in the relay housing 20 in which the semiconductor relay 10 is assembled. 3, since the first projection insertion groove is not formed in the general electromechanical relay 10a, the general electromechanical relay 10a is provided in the relay housing (semiconductor relay housing) 20. As shown in FIG. In order to assemble, the first misassembly preventing protrusion 22 of the relay housing 20 contacts and collides with the lower surface of the general electromechanical relay 10a, thereby causing interference. 10a) becomes impossible to assemble.

That is, before the coupling terminal 11 of the electromechanical relay 10a is inserted into the terminal groove 21 of the relay housing (the housing for the semiconductor relay) 20, the first misassembly preventing projection of the relay housing 20 ( Since the 22 contacts the lower surface of the electromechanical relay 10a first, in the case of the electromechanical relay 10a, the coupling terminal 11 is connected to the terminal groove 22 in the relay housing (housing for semiconductor relay) 20. It is impossible to be fully inserted and electrically connected.

Therefore, the electromechanical relay 10a may be incorrectly assembled in the relay housing 20 in which the semiconductor relay is to be assembled.

In addition, a first projection insertion groove 12 formed in the first misassembly preventing projection 22 of the relay housing 20 and a regular relay (10 in FIGS. 2 and 5) to be fitted to the relay housing 20. ), The same semiconductor relay (or the same electromechanical relay) differentiating according to the specification, for example, any one or two or more of the shape and size, position, protrusion height of the first misassembly preventing projection 22, and corresponding thereto It is possible to set any one or two or more of the shape and size, position, insertion depth of the first projection insertion groove 12 to be different for each relay specification.

That is, by setting them differently, only the first protrusion for preventing assembly 22 of the corresponding relay housing 20 and the first protrusion insertion groove 12 of the regular specification relay 10 can be inserted and coupled thereto. Only the specification relay 10 is to be assembled to the corresponding relay housing (20).

In this case, since only the relay 10 having a regular specification corresponding to the specific relay housing 20 can be assembled, it is possible to prevent the relay of another specification from being assembled incorrectly.

Meanwhile, in the preferred embodiment, apart from the first misassembly preventing protrusion 22 and the first protrusion insertion groove 12, as shown in FIGS. 2 and 5, the second misassembly is mounted on the relay 10. In the relay housing 20 in which the protruding protrusion 13 protrudes and the relay 10 is to be assembled, the regular relay 10 is positioned at a position corresponding to the second misassembly preventing protrusion 13 of the regular relay 10. When the second housing is inserted into the relay housing 20 is assembled, a second projection insertion groove 23 is formed which can be coupled to the second misassembly preventing projection 13 is formed.

At this time, the second misassembly preventing projection 13 may be formed in the singular or plural on the contact portion with the relay housing 20, that is, the lower surface of the relay 10 in the relay 10, the second projection insertion groove 23 may be formed in the same number as the second misassembly preventing projection 13 at the side of the terminal groove 21 at the contact portion where the terminal groove 21 of the relay housing 20 is formed.

The second misassembly preventing protrusion 13 of the relay 10 and the second protrusion insertion groove 23 of the relay housing 20 are additionally formed to prevent misassembly of the relay. The second misassembly preventing projection 13 is formed so that the relay 13 can be inserted only in the second projection insertion groove 23 formed in the relay housing 20 to be assembled.

In the present invention, the relay 10 in which the second misassembly preventing protrusion 13 is formed may be a semiconductor relay or a general electromechanical relay.

That is, the second misassembly preventing projection 13 may be selectively applied to any one of the semiconductor relay and the general electromechanical relay so that the semiconductor relay and the general electromechanical relay can be distinguished and assembled.

In addition, the second protrusion insertion groove 23 may include a relay 10 having a second misassembly preventing protrusion 13 formed between the semiconductor relay and the general electromechanical relay so that the semiconductor relay and the general electromechanical relay can be distinguished and assembled. It may be selectively applied only to the relay housing 20 to be assembled.

For example, the second misassembly preventing projection 13 is formed only in the semiconductor relay 10 shown in FIG. 2, and at the same time, the second projection insertion groove 23 is formed only in the relay housing 20 in which the semiconductor relay 10 is assembled. As shown in FIG. 4, since the second protrusion insertion groove is not formed in the relay housing 20a in which the general electromechanical relay is assembled, the relay housing (housing for general electromechanical relay) 20a is formed. In order to assemble the semiconductor relay 10 to the second, the second misassembly prevention projection 13 of the semiconductor relay 10 is in contact with the corresponding surface of the relay housing 20a and collision occurs bar general The semiconductor relay 10 cannot be assembled to the relay housing 20a in which the electromechanical relay is to be assembled.

That is, before the coupling terminal 11 of the semiconductor relay 10 is inserted into the terminal groove 21 of the relay housing (housing for general electromechanical relay) 20a, the second misassembly preventing projection of the semiconductor relay 10 is provided. Since the contact 13 first contacts the corresponding surface of the relay housing 20a, the semiconductor relay 10 has a coupling terminal 11 completely connected to the terminal groove 21 in the relay housing (housing for general electromechanical relay) 20a. It becomes impossible to be inserted and electrically connected.

Therefore, the semiconductor relay 10 can be prevented from being assembled incorrectly in the relay housing 20a in which the electromechanical relay is to be assembled.

In addition, the second misalignment prevention projection 13 of the regular relay (denoted by reference numeral 10 in FIGS. 2 and 5) and the second projection insertion groove 23 formed in the relay housing 20 to which the regular relay 10 should be fitted. ), The same semiconductor relay (or the same electromechanical relay) differentiating according to the specification, for example, any one or two or more of the shape and size, position, and protrusion height of the second misassembly preventing projection 13, and corresponding thereto. It is possible to set any one or two or more of the shape and size, position, insertion depth of the second projection insertion groove 23 to be different for each relay specification.

That is, by setting them differently, only the second misassembly preventing protrusion 13 of the regular specification relay 10 and the second protrusion inserting groove 23 of the relay housing 20 can be inserted and coupled thereto. Only the specification relay 10 is to be assembled to the corresponding relay housing (20).

In this case, since only the relay 10 having a regular specification corresponding to the specific relay housing 20 can be assembled, it is possible to prevent the relay of another specification from being assembled incorrectly.

In this way, the present invention is formed so that the projection and the groove structure is further formed in the mutually contacting portions of the relay and the relay housing, so that only a regular relay can be assembled in the relay housing, the misassembly of the relay can be prevented at the source. And, this has the advantage that can effectively prevent the occurrence of failure of the relay due to incorrect assembly.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the scope of the present invention is not limited to the disclosed exemplary embodiments. Modified forms are also included within the scope of the present invention.

10: relay 11: coupling terminal
12: first projection insertion groove 13: second misassembly prevention projection
20: relay housing 21: terminal groove
22: first misassembly prevention projection 23: second projection insertion groove

Claims (3)

The relay housing 20 is coupled to the terminal groove 21 by the first misassembly preventing protrusion 22 and each coupling terminal 11 protruding from the relay housing 20 in which the terminal groove 21 is formed. The first projection insertion groove that can be coupled to the first misassembly preventing projection 22 is inserted into the corresponding position of the first misassembly preventing projection 22 of the relay housing 20 in the relay 10 is assembled to 12) is configured to prevent the relay misassembly, characterized in that the configuration.
The method according to claim 1,
The second misassembly preventing protrusion 13 is further protruded from the relay 10, and the second misassembly preventing protrusion 13 of the relay 10 in the relay housing 20 corresponds to a second misassembly preventing protrusion 13. The assembly preventing protrusion 13 is a relay misassembly prevention structure, characterized in that the second projection insertion groove 23 is further formed to be coupled to be inserted.
The method according to claim 1 or 2,
One or two or more of the shape and size, position, and protrusion height of the protrusions 22 and 13, and any one or two of the shape and size, position, and insertion depth of the protrusion insertion grooves 12 and 23 corresponding thereto. The relay misassembly prevention structure, characterized in that the above is set differently for each relay specification, so that only a predetermined regular relay 10 can be assembled in the relay housing 20.

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