KR20120017370A - Earthing apparatus for current sensor - Google Patents

Earthing apparatus for current sensor Download PDF

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Publication number
KR20120017370A
KR20120017370A KR1020100080035A KR20100080035A KR20120017370A KR 20120017370 A KR20120017370 A KR 20120017370A KR 1020100080035 A KR1020100080035 A KR 1020100080035A KR 20100080035 A KR20100080035 A KR 20100080035A KR 20120017370 A KR20120017370 A KR 20120017370A
Authority
KR
South Korea
Prior art keywords
core
printed circuit
circuit board
ground
hole
Prior art date
Application number
KR1020100080035A
Other languages
Korean (ko)
Inventor
김길수
Original Assignee
한국단자공업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한국단자공업 주식회사 filed Critical 한국단자공업 주식회사
Priority to KR1020100080035A priority Critical patent/KR20120017370A/en
Publication of KR20120017370A publication Critical patent/KR20120017370A/en

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
    • G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
    • G01R15/202—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices using Hall-effect devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/165—Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F38/00—Adaptations of transformers or inductances for specific applications or functions
    • H01F38/20—Instruments transformers
    • H01F38/22—Instruments transformers for single phase ac
    • H01F38/28—Current transformers
    • H01F38/30—Constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals

Abstract

PURPOSE: A ground device of a current sensor is provided to satisfy an environment regulation by fixing a ground connection pin to a through hole of a printed circuit board. CONSTITUTION: A core(22) is located in a core installation unit formed in a case. A gap is formed on one side of the core. A ground bus bar(30) closely adheres a hooking leg and a core adhering unit on both ends of the core. A bridge unit is protruded from the center of the ground bus bar. One end of the printed circuit board(28) is located between the core and the bridge unit and a hole sensor located in the gap.

Description

Earthing device for current sensor

The present invention relates to a current sensor, and more particularly, to a grounding device of a current sensor that is installed by connecting the ground bus bar to the printed circuit board inside the current sensor.

For example, the current sensor measures the current flowing in the lead wire in a non-contact manner using a hall effect for controlling the current consumption of a vehicle battery.

In general, there are two types of current measuring methods, a contact method for directly connecting a measuring device to a measuring circuit using a shunt resistor and a non-contact method using a hall effect.

Although the contact method is relatively inexpensive, power consumption is increased because the measuring element is directly inserted into the measuring circuit, and when heat is generated in the circuit, technical problems such as electrical insulation are lowered.

The non-contact method solves the problem of the contact method while having a problem of high price. However, in the control where high precision measurement is required, a non-contact method is generally used to supply an accurate current value.

In such a current sensor, noise must be minimized in order to increase the measurement accuracy. For this purpose, the ground of the printed circuit board provided inside the current sensor must be more sure.

In general, in order to ground the printed circuit board in the current sensor, one end of the ground wire is soldered to the printed circuit board, and the other end is soldered to one side of the core. However, due to recent environmental issues, the trend is not soldering printed circuit boards. Therefore, much research has been made on the configuration for grounding the printed circuit board.

Accordingly, the present invention is to solve the recent technical requirements as described above, and an object of the present invention is to provide a configuration for grounding the printed circuit board of the current sensor without soldering.

According to a feature of the present invention for achieving the object as described above, the present invention is located in the core installation portion formed inside the case and the core is formed in the gap on one side, and the hook leg and core close to both ends of the core The ground bus bar is installed in close contact with the bridge and is formed to protrude from the bridge, and the hall sensor is disposed in the gap between the core and the bridge and is located in the board installation part formed inside the case. It is configured to include a printed circuit board, a portion extending from the bridge portion of the ground bus bar is pressed into the through-hole formed in the printed circuit board is made of ground.

The bridge portion of the ground bus bar is formed by extending a bar-shaped ground connection pin press-fitted into the through hole of the printed circuit board.

The bridge portion of the ground bus bar is formed by protruding a ground connection portion having an insertion pin portion press-fitted into the through hole of the printed circuit board. The ground connection portion includes an extension piece extending from the bridge portion and the extension piece and the insertion pin portion. An elastically deformable bracing part is provided to connect the two pins and to push the insertion pin into the through hole of the printed circuit board.

The connection leg is bent orthogonally to the front end of the core contact portion extending from both ends of the bridge portion of the ground bus bar, the core contact portion is in close contact with the upper surface of the core and the connection leg is in close contact with both sides of the core.

The connecting legs of the ground bus bars are located in cutouts formed on both sides of the core.

At the front end of the connecting leg is further formed with a hook hung on the inner surface of the case.

At the tip of the ground connection pin or the insertion pin portion is provided a structure that is elastically deformed and inserted into the through hole of the printed circuit board.

In the current sensor grounding apparatus according to the present invention, the following effects can be obtained.

That is, in the present invention, both sides of the ground bus bar are coupled to the core, and the ground connection pins extending from the bridge formed at the middle of the ground bus bar are inserted into the holes of the printed circuit board and fixed. Therefore, the ground connection pins can be fixed to the through-holes of the printed circuit board without soldering, thereby having an effect of satisfying environmental regulations.

In addition, in the present invention, the ground bus bar also serves to fix the core to the case, so that the number of parts can be minimized by fixing the core to the case without a separate fixing component.

In addition, in the present invention, the ground bus bar has a relatively large area in contact with the core, thereby increasing the grounding performance of the printed circuit board.

1 is an exploded perspective view showing the configuration of a current sensor employing a preferred embodiment of the grounding apparatus according to the present invention.
Figure 2 is a perspective view showing the main portion of the embodiment of the present invention.
Figure 3 is a perspective view showing the configuration of the ground bus bar constituting an embodiment of the present invention.
Figure 4 is a perspective view showing the configuration of the ground bus bar constituting another embodiment of the present invention.

Hereinafter, a preferred embodiment of a grounding device of a current sensor according to the present invention will be described in detail with reference to the accompanying drawings.

As shown in the figure, the case 10 forms an appearance and a skeleton. The case 10 is made of an insulating synthetic resin material, the core installation portion 12 is formed therein. A through pillar 14 is formed at the center of the core installation part 12, and a case through hole 14 ′ is formed inside the through pillar 14. The case through hole 14 ′ is a portion through which the measurement object passes, and does not communicate with the inside of the case 10. The core mounting portion 12 includes the through pillar 14 to form a hexahedral space as a whole.

The substrate mounting portion 16 is formed in the case 10 so as to communicate with the core mounting portion 12. The printed circuit board 28, which will be described below, is positioned in the board mounting unit 16. The substrate mounting portion 16 is also a substantially hexahedral space.

The connector part 18 is formed at one side of the case 10. The connector unit 18 is for electrical connection between the current sensor and the outside. The connector unit 18 is integrally formed with the case 10, and is formed adjacent to the substrate mounting unit 16. The connector portion 18 is a portion corresponding to the housing of the connector and is formed such that an insertion space 19 into which a mating connector (not shown) is inserted is opened to the outer surface of the case 10. The connector portion 18 is provided with a connector terminal 18 'such that both ends thereof protrude from the substrate installation portion 16 and the insertion space 19, respectively. The connector terminal 18 'is electrically connected to the terminal of the mating connector and also to the circuit of the printed circuit board 28 to be described below. The connector terminal 18 'may be insert molded and integrated when the case 10 is made.

The cover 20 is coupled to the upper end of the case 10 and installed. The cover 20 serves to shield the core installation unit 12 and the substrate installation unit 16 from the outside. The cover 20 is formed with a cover through hole 20 'at a position corresponding to the case through hole 14' of the through pillar 14. The cover through hole 20 'is a portion through which the measurement object passes, similarly to the case through hole 14'. The cover 20 is preferably coupled to the case 10 by ultrasonic welding.

The core 22 is made of ferrite, for example, and has a rectangular frame shape in which a core through-hole 24 is formed in the center. The through pillar 14 is located in the core through-hole 24. One side of the core 22 is cut and has a gap 22 '. In the gap 22 ′, a Hall sensor 29 to be described below is located.

Cutouts 26 are formed on both sides of the core 22. The cutouts 26 are formed to be recessed in portions of outer surfaces corresponding to two sides of the core 22 facing each other. The cutout portion 26 has a hanger leg 38 of the ground bus bar 30 to be described below.

The printed circuit board 28 is installed on the substrate mounting unit 16. Various components are mounted on the printed circuit board 28 and one end of the connector terminal 18 'is coupled. The printed circuit board 28 has a plurality of through holes 28 '. The rear end of the connector terminal 18 'is inserted and coupled to the through hole 28', and the ground connecting pin 34 of the ground bus bar 30 to be described below is also inserted and coupled thereto. The rear end of the connector terminal 18 'itself may be press-fitted into the through hole 28' or may have an elastically deformable shape to be inserted into and fixed in the through hole 28 '.

The printed circuit board 28 is provided with a hall sensor 29. The hall sensor 29 is positioned in the gap 22 ′ of the core 22 while being installed on the printed circuit board 28. The hall sensor 29 detects the magnetic flux focused on the core 22 when a current flows through the measurement object. The detected information is transmitted to the outside via the connector terminal 18 'through the printed circuit board 28.

The ground bus bar 30 is made by cutting and bending a metal plate into a predetermined shape through press working or the like. The bridge bus 32 is formed on the ground bus bar 30. The bridge portion 32 is formed to be stepped to be relatively higher than the other portion of the ground bus bar 30, it is located on the printed circuit board 28. The bridge portion 32 is provided with a ground connection pin 34. The ground connecting pin 34 has a rectangular pillar shape having a rectangular cross section. However, the ground connection pin 34 may be a bar of various shapes such as rod-shaped or hexagonal pillar shape. The ground connection pin 34 extends from one side of the bridge portion 32 and is bent to extend downward.

The ground connection pin 34 extends from one side of the bridge portion 32 and is inserted into a through hole 28 ′ formed in the lower printed circuit board 28. The ground connecting pin 34 is also pressed into the through hole 28 '. Of course, the structure may be elastically deformed at the tip of the ground connection pin 34 so that the through hole 28 'may be elastically deformed.

A core contact part 36 is formed to extend from both ends of the bridge part 32 to be in close contact with the upper surface of the core 22. The core contact part 36 extends along one side of the core 22 and extends to the cutout part 26. The core contact part 36 is in close contact with the upper surface of the core 22 to widen the ground area.

Hook leg 38 is formed at the end of the core contact portion 36. The hook leg 38 is formed to be bent orthogonal to the core contact portion 36. The hook leg 38 is installed in close contact with the cutout 26. At the tip of the hanger leg 38, a hanger jaw 40 that is hooked to the inner surface of the case 10 is formed. The hooking jaw 40 is coupled to the hooking jaw (not shown) formed on the inner surface of the case 10 serves to couple between the core 22 and the case 10. The hook jaw 40 is bent inclined by cutting one side of the hook leg (38). When the hooking jaw 40 is in close contact with the inner surface side of the case 10, the hook leg 38 may be elastically deformed to more firmly bond between the hook leg 38 and the core 22.

On the other hand, Figure 4 shows another embodiment of the ground bus bar. In the ground bus bar 130 of the present embodiment, the bridge portion 132 is formed relatively high in the center thereof. The bridge portion 132 is positioned above the printed circuit board 28.

The ground connection part 134 is formed to extend from the bridge part 132. The ground connection part 134 performs grounding of the printed circuit board 28 through the ground bus bar 130. The ground connection part 134 has an extension piece 134 ′ extending from the bridge part 132. One end portion of the extension piece 134 ′ is provided with a support portion 135 in the same direction as the extension direction of the bridge portion 132. The brace portion 135 is formed in a 'v' shape, and the brace so that the insertion pin portion 135 'provided at the front end thereof can be inserted into the through hole 28 ′ of the printed circuit board 28. Is part. The brace portion 135 is slightly elastically deformed in a state where the insertion pin 135 'is inserted into the through hole 28' so that the insertion pin 135 'can be pressed into the through hole 28'.

Hereinafter, the grounding device of the current sensor according to the present invention having the configuration as described above will be described in detail.

First, it will be described that the core 22 and the printed circuit board 28 and the like are installed in the case 10. The connector terminal 18 ′ is inserted into the connector portion 18 of the case 10. The connector terminal 18 'may be integrated into the case 10 by insert molding or may be installed after the case 10 is manufactured. The tip end of the connector terminal 18 'is located in the insertion space 19 of the connector part 18, and the other end is located in the substrate mounting part 16.

The ground connection pin 34 of the ground bus bar 30 is inserted into the through hole 28 ′ of the printed circuit board 28. The tip of the ground connecting pin 34 is press-fitted into the through hole 28 '. In this state, the printed circuit board 28 and the ground bus bar 30 are seated and coupled to the core 22.

That is, the hook legs 38 of the ground bus bar 30 are respectively seated at the cutouts 26 of the core 22, and the core close contact 36 is in close contact with the upper surface of the core 22. The hall sensor 29 of the printed circuit board 28 is positioned in the gap of the core 22.

Meanwhile, the core 22, the printed circuit board 28, and the ground bus bar 30 are coupled to the core mounting unit 12 and the board mounting unit 16 of the case 10. The connector terminal 18 'of the connector portion 18 is press-fitted into the through hole 28' of the printed circuit board 28, respectively.

At the same time, the core 22 is installed in the core mounting portion 12, so that the through pillar 14 penetrates through the core through-hole 24. The hooking jaw 40 of the ground bus bar 30 is hooked to the inner surface of the case 10 while the core 22 is installed in the core mounting part 12. In this case, the core 22 and the printed circuit board 28 are fixed to the case 10 by the ground bus bar 30.

Next, the cover 20 is installed to shield the core mounting portion 12 and the substrate mounting portion 16 of the case 10. The cover 20 is coupled to the case 10 by ultrasonic welding.

The current sensor assembled as described above passes through the case through hole 14 ′ and the cover through hole 20 ′ so that a measurement object is positioned, and supplies power by coupling a mating connector to the connector unit 18. The measurement is taken.

That is, when a current flows through the measurement object, a magnetic field proportional to the current is formed around the measurement object, which is focused on the core 22. The magnetic field focused on the core 22 is detected by the Hall sensor 29, and the information detected by the Hall sensor is connected to the connector 18 via the printed circuit board 28. It is passed to the outside.

On the other hand, the ground bus bar 30 in which the ground connection pin 34 is pressed into and coupled to the through hole 28 ′ of the printed circuit board 28 is hooked with the core contact portion 36 at both ends of the bridge portion 32. The legs 38 are in close contact with the core 22 so that more reliable grounding can be performed.

The scope of the present invention is not limited to the embodiments described above, but is defined by the claims, and various changes and modifications can be made by those skilled in the art within the scope of the claims. It is self evident.

For example, the cutout 26 is not necessarily formed in the core 22. That is, the hook leg 38 of the ground bus bar 30 may be installed in close contact with both side surfaces of the core 22.

In addition, the core 22 is not necessarily fixed to the case 10 by the hooking jaw 40 of the ground bus bar 30. For example, the core 22 may be pressed into a structure formed inside the case 10.

10: case 12: core mounting portion
14: through column 14 ': case through hole
16: Board mounting portion 18: Connector portion
18 ': Connector terminal 19: Insertion space
20: Cover 20 ': Cover Through Hole
22: core 22 ': gap
24: core through hole 26: notch
28: printed circuit board 28 ': through hole
29: Hall sensor 30: Ground bus bar
32: bridge portion 34: ground connection pin
36: core contact part 38: hanger leg
40: hanger

Claims (7)

A core located in a core mounting portion formed inside the case and having a gap formed at one side thereof;
A ground bus bar installed at both ends of the core in close contact with a hook leg and a core close contact portion and protruding a bridge portion at an intermediate portion thereof;
And a printed circuit board having one end disposed between the core and the bridge part and positioned in a substrate installation part formed in the case, and having a hall sensor located in the gap.
The grounding device of the current sensor, characterized in that the ground extending from the bridge portion of the ground bus bar is pressed into the through hole formed in the printed circuit board is made.
The grounding device of claim 1, wherein a bar-shaped ground connection pin press-fitted into the through hole of the printed circuit board is extended to the bridge portion of the ground bus bar.
According to claim 1, wherein the bridge portion of the ground bus bar is formed by protruding the ground connection portion formed with the insertion pin is pressed into the through-hole of the printed circuit board, the ground connection portion extending from the bridge portion and the And an elastically deformable brace portion connected between the extension piece and the insertion pin portion and pushing the insertion pin portion to the through hole of the printed circuit board.
According to claim 2 or 3, wherein the connecting leg is bent orthogonally to the front end of the core contact portion extending from both ends of the bridge portion of the ground bus bar, the core contact portion is in close contact with the upper surface of the core and the connection leg The grounding device of the current sensor, characterized in that in close contact with both sides of the core.
5. The grounding device of a current sensor according to claim 4, wherein the connection legs of the ground bus bars are located in cutouts formed on both sides of the core.
6. The grounding device of claim 5, wherein a hooking jaw on the inner surface of the case is further formed at the front end of the connection leg.
7. The grounding device of claim 6, wherein the front end of the ground connection pin or the insertion pin portion is provided with a structure that is elastically deformed and inserted into the through hole of the printed circuit board.
KR1020100080035A 2010-08-18 2010-08-18 Earthing apparatus for current sensor KR20120017370A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020100080035A KR20120017370A (en) 2010-08-18 2010-08-18 Earthing apparatus for current sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100080035A KR20120017370A (en) 2010-08-18 2010-08-18 Earthing apparatus for current sensor

Publications (1)

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KR20120017370A true KR20120017370A (en) 2012-02-28

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KR1020100080035A KR20120017370A (en) 2010-08-18 2010-08-18 Earthing apparatus for current sensor

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017044486A (en) * 2015-08-24 2017-03-02 アイシン精機株式会社 Current sensor
JP2021012991A (en) * 2019-07-09 2021-02-04 株式会社デンソー Coil module and power conversion apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017044486A (en) * 2015-08-24 2017-03-02 アイシン精機株式会社 Current sensor
JP2021012991A (en) * 2019-07-09 2021-02-04 株式会社デンソー Coil module and power conversion apparatus

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