KR20120005603U - LED module having dual PCB - Google Patents

LED module having dual PCB Download PDF

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Publication number
KR20120005603U
KR20120005603U KR2020110000743U KR20110000743U KR20120005603U KR 20120005603 U KR20120005603 U KR 20120005603U KR 2020110000743 U KR2020110000743 U KR 2020110000743U KR 20110000743 U KR20110000743 U KR 20110000743U KR 20120005603 U KR20120005603 U KR 20120005603U
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South Korea
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pcb
heat dissipation
led module
led
dual
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KR2020110000743U
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Korean (ko)
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박일중
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박일중
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Priority to KR2020110000743U priority Critical patent/KR20120005603U/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Abstract

본 고안은 듀얼 피시비판을 포함하는 엘이디 모듈에 대한 것으로서, 보다 상세하게는 두개의 피시비판을 엘이디 모듈의 방열을 위해 겹친 모듈에 관한 것이다.
본 발명은 제1열방출용납땜홀을 포함하는 제1피시비판과, 상기 제1피시비판에 일정 간격으로 관통홀을 통해 납땜으로 고정된 LED와, 상기 제1피시비판과 길이 또는 너비가 같거나 작고, 상기 제1피시비판에 밀착 부착되어 상기 제1열방출용납땜홀을 통하여 고정되는 제2열방출용납땜홀을 포함하는 제2피시비판이 일체로 형성된다.The present invention relates to an LED module including a dual PCB, and more particularly, to a module overlapping two PCBs for heat dissipation of the LED module.
The present invention provides a first PCB including a first heat dissipation soldering hole, an LED fixed by soldering through a through hole at a predetermined interval to the first PCB, and the same length or width as the first PCB. The second PCB may be integrally formed with a second heat dissipation solder hole which is smaller or smaller and adheres tightly to the first PCB, which is fixed through the first heat dissipation solder hole.

Description

듀얼 피시비판을 포함하는 엘이디 모듈{LED module having dual PCB}LED module having dual PCBs {LED module having dual PCB}

본 고안은 듀얼 피시비판을 포함하는 엘이디 모듈에 대한 것으로서, 보다 상세하게는 두개의 피시비판을 엘이디 모듈의 방열을 위해 겹친 모듈에 관한 것이다.The present invention relates to an LED module including a dual PCB, and more particularly, to a module overlapping two PCBs for heat dissipation of the LED module.

일반적으로 차량 튜닝용 엘이디는 다수개의 엘이디와 이를 부착시키기 위한 피시비판 위에 납땜을 사용하였다.In general, a vehicle tuning LED uses soldering on a plurality of LEDs and the PCB.

그러나 자동차 헤드라이트의 일명 아우디 라인을 튜닝할 경우 각 엘이디에서 나오는 열과 헤드라이트 자체에서 나오는 열 때문에 납땜의 연결부위의 신뢰성이 저하되고, 드물게 접속 불량이 발생하는 경우도 있었다.However, when tuning the so-called Audi line of the car headlights, the heat from each LED and the heat from the headlights themselves deteriorate the reliability of the solder joints, and in rare cases poor connection.

또한 자동차 안개등의 경우 열 방출이 안되어, 내부 납땜이 녹아 쇼트되는 상황이 발생되기도 한다.In addition, in the case of the fog light of the car can not emit heat, the internal solder melts short may occur.

한편 발광다이오드(LED)란 갈륨비소 등의 화합물에 전류를 흘려 빛을 발산하는 반도체소자이다.On the other hand, a light emitting diode (LED) is a semiconductor device that emits light by passing a current through a compound such as gallium arsenide.

이러한 엘이디는 아래 위에 전극을 붙인 전도물질에 전류가 통과하면 전자와 정공이라고 불리는 플러스 전하입자가 이 전극 중앙에서 결합해 빛의 광자를 발산하는 구조로 돼 있다. 이 물질의 특성에 따라 빛의 색깔이 달라진다.These LEDs have a structure in which positive charge particles, called electrons and holes, combine at the center of the electrode to emit photons of light when a current passes through a conductive material attached to an electrode on the bottom. The color of the light depends on the nature of the material.

따라서 현재 가장 많은 튜닝용 재료로 사용하는 엘이디가 부착되는 피시비판을 이용하여, 연결된 엘이디의 방출되는 열이 바로 방출되면서, 접속불량이 없고 신뢰성 있는 튜닝용 엘이디 모듈을 개발할 필요성이 증가하고 있다.Therefore, by using the PCB attached to the LED currently used as the most tuning material, the heat emitted from the connected LED is immediately released, there is an increasing need to develop a reliable LED module for connection failure and reliable.

본 고안은 LED가 방출하는 열을 용이하게 배출할 수 있어, LED의 오류 또는 불량을 방지하고, 열 방출 및 열 변형 방지가 가능한 듀얼 피시비판을 포함하는 엘이디 모듈을 제공하는 데 목적이 있다.An object of the present invention is to provide an LED module including a dual PCB, which can easily discharge the heat emitted by the LED, thereby preventing errors or defects of the LED, and preventing heat emission and thermal deformation.

본 발명은 제1열방출용납땜홀을 포함하는 제1피시비판과, 상기 제1피시비판에 일정 간격으로 관통홀을 통해 납땜으로 고정된 LED와, 상기 제1피시비판과 길이 또는 너비가 같거나 작고, 상기 제1피시비판에 밀착 부착되어 상기 제1열방출용납땜홀을 통하여 고정되는 제2열방출용납땜홀을 포함하는 제2피시비판이 일체로 형성된다.The present invention provides a first PCB including a first heat dissipation soldering hole, an LED fixed by soldering through a through hole at a predetermined interval to the first PCB, and the same length or width as the first PCB. The second PCB may be integrally formed with a second heat dissipation solder hole which is smaller or smaller and adheres tightly to the first PCB, which is fixed through the first heat dissipation solder hole.

상기 제1열방출용납땜홀과 제2열방출용납땜홀에는 납이 관통하여 접합된다.Lead penetrates the first heat dissipation solder hole and the second heat dissipation solder hole.

상기 피시비판들에는, 카본, CNT, 그라파이트의 첨가에 따라 열전도 특성의 단위조작을 수행할 수 있는 PMMA(Poly methy methacrylate: 폴리매틸메타아크릴래이트), 에폭시, 실리콘을 포함하는 열전도성 물질이 도포된다.The PCBs are coated with a thermal conductive material including PMMA (Poly methy methacrylate), epoxy, and silicon, which can perform unit operations of thermal conductivity according to addition of carbon, CNT, and graphite. do.

본 고안에 따르면 주로 사용되는 피시비판을 다시 피시비판으로 결합 형성하여 간단하고도 효율이 높은 듀얼 피시비판을 포함하는 엘이디 모듈을 제공할 수 있다.According to the present invention, it is possible to provide an LED module including a simple and highly efficient dual PCB plate by combining and forming the PCB to be used again.

본 고안에 따르면 피시비판에 형성된 LED가 방출하는 열을 아래층에 형성된 피시비판으로 용이하게 배출할 수 있어, LED의 오류 또는 불량을 방지할 수 있다.According to the present invention, the heat emitted from the LED formed on the PCB can be easily discharged to the PCB formed on the lower layer, thereby preventing errors or defects of the LED.

본 고안에 따르면 열전달을 원활히 하기 위하여, 열전도성의 페이스트(paste)나 접착제가 도포되어, 열 방출 및 열 변형 방지가 가능하다.According to the present invention, in order to facilitate heat transfer, a heat conductive paste or an adhesive is applied to prevent heat release and thermal deformation.

도1은 본 고안에 따른 듀얼 피시비판을 포함하는 엘이디 모듈이 자동차의 헤드라이트에 결합된 모습을 보여주는 도면.
도2는 본 고안에 따른 듀얼 피시비판을 포함하는 엘이디 모듈의 세부적인 구성을 보여주는 분해도.
도3은 본 고안에 따른 듀얼 피시비판을 포함하는 엘이디 모듈의 사시도.
도4는 본 고안에 따른 듀얼 피시비판을 포함하는 엘이디 모듈의 결합 방법 순서를 보여주는 도면.1 is a view showing a state in which an LED module including a dual PCB plate in accordance with the present invention is coupled to the headlight of the vehicle.
Figure 2 is an exploded view showing the detailed configuration of the LED module including the dual PCB according to the present invention.
Figure 3 is a perspective view of the LED module comprising a dual PCB plate according to the present invention.
Figure 4 is a view showing a sequence of coupling method of the LED module including a dual PCB according to the present invention.

이하 본 고안의 실시를 위한 구체적인 내용을 도면을 참조하여 자세히 설명한다.Hereinafter, with reference to the drawings in detail for the implementation of the present invention will be described in detail.

본 고안에 따른 피시비(PCB)판에 엘이디(LED)와 같은 일정 소자를 실장하고, 전원을 공급하면 상기 소자에는 부하가 걸려 필연적으로 열이 발생한다.When a certain device such as an LED (LED) is mounted on a PCB board according to the present invention and power is supplied, heat is inevitably generated due to a load on the device.

따라서 도1과 도2에서 보는 바와 같이 본 고안에 따른 듀얼 피시비판을 포함하는 엘이디 모듈(10)은 제1피시비판(100)과 LED(110) 와 제2피시비판(200)이 일체형으로 구성된다.Therefore, as shown in FIGS. 1 and 2, the LED module 10 including the dual PCB according to the present invention includes a first PCB 100, an LED 110, and a second PCB 200 in one piece. do.

상기 제1피시비판(100)은 제1열방출용납땜홀(150)을 포함하는 피시비판으로서, 본 고안에 따른 듀얼 피시비판을 포함하는 엘이디 모듈(10)은 도1과 같은 형상에 한정되는 것은 아니며, 일명 아우디 라인과 같은 곡선상 또는 직선 및 곡선이 조합된 형태로 할 수도 있다. The first PCB 100 is a PCB board including a first heat dissipation solder hole 150, the LED module 10 including a dual PCB board according to the present invention is limited to the shape as shown in FIG. It is not a matter of course, and may be in the form of a curved line such as Audi line, or a combination of straight lines and curves.

또한, 직선상으로만 형성시키지 않고, 곡선상으로만 형성시키거나, 또는 이들을 적절히 조합하여 배열시킬 수도 있다.It is also possible to form not only a straight line but only a curved line, or to arrange them in a proper combination.

상기 LED(110)는 상기 제1피시비판에 일정 간격으로 관통홀을 통해 납땜(115)으로 고정된 모듈로서, 일반적인 자동차 튜닝용 LED가 사용되는 것이 바람직하다.The LED 110 is a module fixed to the soldering 115 through the through-hole at a predetermined interval to the first PCB, it is preferable that a general automotive tuning LED is used.

상기 제2피시비판(200)은 상기 제1피시비판(100)과 길이 또는 너비가 같거나 작고, 상기 제1피시비판(100)에 밀착 부착되어 상기 제1열방출용납땜홀(150)을 통하여 고정되는 제2열방출용납땜홀(250)을 포함하는 피시비판이다.The second PCB 200 is the same or smaller in length or width than the first PCB 100, and closely adhered to the first PCB 100 to close the first heat dissipation hole 150. It is a PCB including a second heat dissipation solder hole 250 is fixed through.

따라서, 상기 제1열방출용납땜홀(150)과 제2열방출용납땜홀(250)에는 납이 관통하여 접합되고, 상기 제1피시비판(100)에 형성된 LED(110)가 방출하는 열을 상기 제2피시비판(200)을 통하여 용이하게 배출할 수 있어, LED(110)의 오류 또는 불량을 방지할 수 있다.Therefore, the lead penetrates through the first heat dissipation solder hole 150 and the second heat dissipation solder hole 250, and heat is emitted by the LED 110 formed on the first PCB 100. It can be easily discharged through the second PCB (200), it is possible to prevent the error or failure of the LED (110).

상기 제1피시비판(100)과 제2피시비판(200)의 재질은 절연, 기계적 강도 및 그 외면에 탑재되는 LED(110)로부터 발생되는 열의 원활한 전달을 고려하여 적정히 결정되어야 한다. The material of the first PCB 100 and the second PCB 200 should be appropriately determined in consideration of insulation, mechanical strength and smooth transfer of heat generated from the LED 110 mounted on the outer surface.

예를 들어 제1피시비판(100)이 합성수지 재질일 경우, 그 두께는 2mm 이하인 것이 열전달 특성을 얻기 위해 바람직하다.For example, when the first PCB 100 is a synthetic resin material, the thickness thereof is preferably 2 mm or less in order to obtain heat transfer characteristics.

또한 상기 제1피시비판(100)과 제2피시비판(200)의 열전달을 원활히 하기 위하여, 열전도성의 페이스트(paste)나 접착제 등이 도포될 수 있다.In addition, in order to facilitate heat transfer of the first PCB 100 and the second PCB 200, a thermal conductive paste or adhesive may be applied.

상기 열전도성 물질은 합성수지에 카본, CNT, 그라파이트 중 어느 하나 이상의 물질을 첨가 혼합하여서 된다.The thermally conductive material may be added and mixed with any one or more materials of carbon, CNT, and graphite to the synthetic resin.

여기에서 상기 열전도성 물질은 합성수지에 카본, CNT(Carbon Nanotube: 탄소나노튜브), 그라파이트(Graphite) 중 어느 하나 이상의 물질을 첨가 혼합하여서 된 열전도 기능을 갖는 조성물을 도포하여 몰딩형성된다. Here, the thermally conductive material is formed by coating a composition having a thermal conductivity function by adding and mixing any one or more materials of carbon, carbon nanotube (CNT), and graphite (graphite) to the synthetic resin.

이 때, 상기 합성수지는 전술한 카본, CNT, 그라파이트의 첨가에 따라 열전도 특성의 단위조작을 수행할 수 있는 PMMA(Poly methy methacrylate: 폴리매틸메타아크릴래이트), 에폭시, 실리콘 등의 수지를 선택하여 적용된다.At this time, the synthetic resin by selecting a resin such as PMMA (Poly methy methacrylate: polymethyl methacrylate), epoxy, silicone, which can perform the unit operation of the thermal conductivity according to the addition of the carbon, CNT, graphite Apply.

상기 합성수지 및 카본, CNT, 그라파이트의 혼합 조성물 적용은 제품의 사양 등을 고려하여 적절히 선택된다.Application of the mixed composition of the synthetic resin and carbon, CNT, graphite is appropriately selected in consideration of the specifications of the product.

100 : 제1피시비판
110 : LED
150 : 제1열방출용납땜홀
200 : 제2피시비판
250 : 제2열방출용납땜홀100: first fish plate
110: LED
150: first heat dissipation solder hole
200: second fish plate
250: second heat dissipation soldering hole

Claims (3)

제1열방출용납땜홀을 포함하는 제1피시비판과;
상기 제1피시비판에 일정 간격으로 관통홀을 통해 납땜으로 고정된 LED와,
상기 제1피시비판과 길이 또는 너비가 같거나 작고, 상기 제1피시비판에 밀착 부착되어 상기 제1열방출용납땜홀을 통하여 고정되는 제2열방출용납땜홀을 포함하는 제2피시비판;
이 일체로 형성되는 것을 특징으로 하는 듀얼 피시비판을 포함하는 엘이디 모듈.A first PCB including a first heat dissipation solder hole;
LEDs fixed by soldering through the through holes at predetermined intervals on the first PCB;
A second PCB including a second heat dissipation solder hole having a length or width equal to or smaller than the first PCB, and closely attached to the first PCB, and fixed through the first heat dissipation solder hole;
LED module comprising a dual PCB, characterized in that formed integrally. 제1항에 있어서,
상기 제1열방출용납땜홀과 제2열방출용납땜홀에는 납이 관통하여 접합되는 것을 특징으로 하는 듀얼 피시비판을 포함하는 엘이디 모듈.The method of claim 1,
An LED module comprising a dual PCB, characterized in that lead is joined to the first heat dissipation solder hole and the second heat dissipation solder hole. 제1항에 있어서,
상기 피시비판들에는,
카본, CNT, 그라파이트의 첨가에 따라 열전도 특성의 단위조작을 수행할 수 있는 PMMA(Poly methy methacrylate: 폴리매틸메타아크릴래이트), 에폭시, 실리콘을 포함하는 열전도성 물질이 도포되는 것을 특징으로 하는 듀얼 피시비판을 포함하는 엘이디 모듈.The method of claim 1,
In the PCBs,
Dual, characterized in that the thermal conductive material is coated with PMMA (Poly methy methacrylate), epoxy, silicon which can perform the unit operation of the thermal conductivity according to the addition of carbon, CNT, graphite LED module including a PCB.
KR2020110000743U 2011-01-26 2011-01-26 LED module having dual PCB KR20120005603U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105485595A (en) * 2014-10-01 2016-04-13 通用汽车环球科技运作有限责任公司 Automotive light assembly with inner lens for combined daytime running light and position light functions

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105485595A (en) * 2014-10-01 2016-04-13 通用汽车环球科技运作有限责任公司 Automotive light assembly with inner lens for combined daytime running light and position light functions
CN105485595B (en) * 2014-10-01 2018-12-28 通用汽车环球科技运作有限责任公司 For combining the lights of vehicle component with interior len of daytime portable lighter and clearance lamps function

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