KR20120004385U - A structure of capacitive touch sensor - Google Patents

Abstract

The present invention relates to a kind of capacitive touch sensor structure, and includes a first axis sensing layer, a second axis sensing layer, and an insulating layer provided between the first axis sensing layer and the second axis sensing layer. The biaxial sensing layer distinguishes a plurality of parallel sensing lines and etching zones from an etching line, and the etching zone is divided into discrete small area units, and the first axis sensing layer and the second axis sensing layer. The insulating layer is bonded together to form a transparent plate, and the first axis sensing line and the second sensing line are installed at right angles, and each capacitive sensitive unit on the first axis sensing line and the second axis sensing line is arranged in a matrix. Installed in an array.

Description

Capacitive Touch Detector Structure {A STRUCTURE OF CAPACITIVE TOUCH SENSOR}

The present invention relates to a capacitive touch sensor structure, and more particularly, to an improved capacitive touch sensor structure that improves a kind of transmittance uniformity and lowers noise of a capacitance value.

The capacitive touch plate generates a single capacitive effect on the panel instantaneously through the touch of a user's finger or conductor, and then determines the position of the finger or conductor from the change in the capacitance value. Allows you to achieve the purpose of the input.

In addition, the capacitive touch detector of the existing touch panel includes a plurality of X-axis traces (X-Trace) and Y-axis traces (Y-Trace), and a plurality of X- and Y-axis lines are interconnected with each other. A capacitive sensitive unit is installed, and the X-axis and Y-axis are intertwined and insulated so that each of the capacitive-sensitive units on the X and Y axes is arranged in a matrix and arranged in the working area of the touch plate. .

In general, the X-axis detection line and the Y-axis detection line are made of a transparent conductive thin film. For example, an indium tin oxide (ITO) material is used. By separating the units, each capacitive sensitive unit on the X and Y axes can be provided with a clearance of a suitable width to each other, to achieve the purpose of insulation installation.

However, since the installation portion and the etching removal portion of the capacitive sensitive unit have different transmittances, the light refraction passing through the panel may be uneven, so that the figure may appear when visually observed.

The present invention is to solve the above-described problems, by forming a sophisticated etching line on the transparent conductive film to separate the required figure, thereby significantly reducing the damage of the conductive film, the appearance plan view of the capacitive sensing structure And improve the uniformity of the transmittance, to improve the ambiguity and ambiguity of the developing film of the display of the bottom of the touch plate, and also to divide the etching region of the conductive film into discontinuous small area unit by using the etching line installation It is therefore an object of the present invention to provide a kind of improved capacitive touch sensor structure that lowers the noise of the capacitive value.

The present invention for achieving the above object is a kind of capacitive touch sensor structure, which is formed on the main surface of the first axis sensing layer, the first substrate, an etch line is required on the first axis sensing layer. Also, the figure has a plurality of first axis sensing lines and etching zones arranged in parallel with each other, and each of the first axis sensing lines has a plurality of capacitive sensitive units interconnected with each other. The etch zone is divided into a number of discrete small area units.

A second axis sensing layer and a second axis sensing line formed on the main surface of the second substrate, the second axis sensing layer on the second axis sensing layer is divided, and the figure is a plurality of second axis sensing lines arranged in parallel with each other And an etching zone, each second axis sensing line having a plurality of interconnected capacitive sensitive units, wherein the etching zone is divided into a plurality of discrete small area units.

The insulating layer is bonded between the insulating layer, the first axis sensing layer and the second axis sensing layer, and is formed of a transparent plate, and the first axis sensing line and the second axis sensing line are installed at right angles. Each capacitive sensing unit on the first axis sensing line and the second axis sensing line is arranged in a matrix, and one end of each of the first axis sensing line and the second axis sensing line is provided at the edge of the sensing layer, respectively. It is connected to the road, thereby transmitting the capacitance sensing signal via the signal road to subsequent signal processing circuits.

The first axis sensing layer and the second axis sensing layer are transparent conductive thin films having good conductive properties, and materials thereof include indium tin oxide, indium zinc oxide, indium aluminum oxide, or ethylenedioxythiophene (PEDOT). It is a transparent conductive thin film made of a back material.

The insulating layer is an insulating transparent adhesive layer.

The installation depth of the etch line finally cuts the conductive film of the first axis sensing layer or the second axis sensing layer completely, thereby causing the conductive film to split into two insulated portions.

The etching line has a width of about 150 μm or less.

The present invention separates the figures required by forming elaborate etching lines on the transparent conductive film, thereby significantly reducing the hollow portion of the conductive film, and improving the uniformity of the appearance planarity and transmittance of the capacitance sensing structure. In addition, the development film of the display on the bottom of the touch panel may not be clear and may improve the ambiguity.

1 is a plan view of a component combination according to a first embodiment of the present invention;
2 is a side cross-sectional view of a component combination according to a first embodiment of the present invention;
3 is a plan view of a lower substrate according to the first embodiment of the present invention;
4 is an enlarged view of a portion A shown in FIG. 3;
5 is a side cross-sectional view of the line CC shown in FIG. 4;
6 is a side cross-sectional view of the DD line shown in FIG. 4;
7 is a plan view of a top plate according to a first embodiment of the present invention;
8 is a plan view of a lower substrate according to a second embodiment of the present invention;
9 is a plan view of a top plate according to a second embodiment of the present invention;
10 is a plan view of a component combination according to a second embodiment of the present invention;
11 is a side cross-sectional view of a component combination according to a second embodiment of the present invention.

1 and 2, the capacitive touch sensor structure includes a lower substrate 1 and an upper plate 2, and the lower substrate 1 and the upper plate ( On the surface of 2), the capacitive sensitive layers 12 and 22 are provided, respectively, and the two plates are bonded together using the glue layer 3 to be bonded to each other to form a transparent plate.

Among them, the lower substrate 1 and the upper plate 2 are materials having high transmittance, and may be flat or non-planar thin plates, and the material is glass thin plates or other flexible thin plates, for example, poly Carbonate (PC), PET (PET), polymethyl methacrylate (PMMA) or cyclo olefin copolymer (COC). However, the scope of the material to be implemented is not limited to the above-described materials, all of a variety of flexible or rigid thin plates can be used.

The glue layer 3 may use a transparent UV adhesive, an OCA adhesive or an IR adhesive having insulating properties.

3 to 5, a lower sensing layer 12 is provided on an upper surface of the lower substrate 1, and the lower sensing layer 12 is a transparent conductive thin film made of indium tin oxide. The etching process is performed to form the etching lines 13 on the transparent conductive film to distinguish the required figures. The etching process may employ a dry etching process, for example, laser etching, plasma etching, or the like.

In addition, a wet etching process may be adopted, for example, a technical means such as printing etching, yellow etching, ink etching, or the like may be used.

The figure on the transparent conductive film includes a plurality of X-axis sensing lines 121 and etching regions 122 arranged in parallel with each other, and each of the X-axis sensing lines 121 is connected to each other and is shown in a diamond shape. The capacitive sensitive unit 121a is provided, and at one end of each of the X-axis lines 121 is connected to the signal conductor 14 which is provided at the edge of the lower substrate 1, respectively, and the etch zone 122 is divided into several discrete small area units 122a.

As shown in FIG. 7, the upper sensing layer 22 is provided on the lower surface of the upper plate 2, and the upper sensing layer 22 is a transparent conductive thin film made of indium tin oxide (ITO). In addition, by using the laser etching process to form the etching line 23 on the transparent conductive film to distinguish the required figure, the figure is also the Y-axis detection line 221 and the etching zone ( 222, each of the Y-axis sensing lines 221 includes a capacitive sensitive unit 221a, a plurality of which are connected to each other and appearing in a rhombus shape, and at one end of each of the Y-axis sensing lines 221. The etch zone 222 is divided into several discrete small area units 222a, each of which is connected to a signal conductor 24 installed at an edge of the upper face plate 2. The lower surface of the face plate 2 and the In the outer peripheral area adjacent between the upper sensing layers 22, a color frame 21 coated with metal sputtering is installed, which is the edge of the upper plate 2 and the lower substrate 1 at the edge of the signal. It is used to screen the conductors 14 and 24.

As shown in FIG. 5, the etch lines 13 and 23 have a horizontal width of approximately 150 μm or less, and the installation depth can finally cut the transparent conductive film completely, thereby allowing the conductive film to be insulated from each other. Divide into parts.

In combination, the thermally sensitive glue layer 3 is bonded and combined between the upper sensing layer 22 and the lower sensing layer 12 to form a transparent plate. In addition, the Y-axis sensing line 221 and the X-axis sensing line 121 are installed at right angles, and each of the capacitive sensing units 121a and 221a on the Y and X-axis sensing lines is provided in a matrix arrangement. The sensing signal generated by the sensing layer is transmitted to the subsequent signal processing circuit via the signal conductors 14 and 24.

In the capacitive touch sensor structure described above, one equivalent capacitance may be formed between the X-axis line 121 and the signal lead line 14, and one of the capacitive touch sensor structures may also be formed between the Y-axis line 122 and the signal lead line 24. An equivalent capacitance of may be formed, so that when the touch or the touch plate surface is touched by the finger and the conductor, the signal processing circuit determines the touch position of the conductor or the finger from the change in capacitance.

According to the second embodiment of the present invention as shown in Figures 8 to 11, the overall structure is the same as the first embodiment, the main difference is that the lower sensing layer 12 'is formed on the lower surface of the lower substrate 1' The upper plate 2 ', the upper sensing layer 22', the lower substrate 1 ', and the lower sensing layer 12' are overlapped and bonded by using a glue layer (3 '). (Shown in detail in FIG. 11).

In addition, the specifications of the figures formed on the upper and lower sensing layers 22 'and 12' are different, and the etching lines 13 'of the lower sensing layer 12' on the lower surface of the lower substrate 1 'are divided. The figure includes a plurality of mutually parallel X-axis sensing lines 121 'and etching regions 122', and the capacitive sensitive units of each X-axis sensing line 121 'are rectangular in the X-axis direction. The X-axis sensing line 121 'is connected to a signal road 14' installed at the edge of the lower substrate 1 'at one end of each of the X-axis sensing lines 121', and is further connected to the etching area 122 '. ) Is divided into a plurality of elongated rectangular small area units 122a '.

The figure divided by the etching line 23 'of the upper sensing layer 22' of the lower surface of the upper plate 2 'is formed of a plurality of mutually parallel Y-axis sensing lines 221' and an etching region 222 '. And the capacitive sensitive unit of each Y-axis sensing line 221 'is represented by a rectangular area extending in the Y-axis direction, and at each end of each Y-axis sensing line 221', the upper plate 2 It is connected to the signal lead 24 'installed at the edge of'), and the etching zone 222 'is divided into a plurality of rectangular small area units 222a'.

In addition, the change installation of another figure specification formed on the sensing layer may achieve the same or similar effect as that of the first embodiment, and the description of parts other than the first embodiment will be omitted.

Claims (5)

A first axis sensing layer formed on a main surface of the first substrate, and on the first axis sensing layer, a figure requiring an etch line is distinguished from the first axis sensing line, wherein the figures are arranged in parallel with each other; And a first etching zone, each first axis sensing line having a plurality of interconnected capacitive sensitive units, wherein the first etching zone is divided into a plurality of discrete small area units. ;
A second axis sensing layer formed on the main surface of the second substrate, and on the second axis sensing layer a figure requiring an etch line is distinguished, and the figure is a plurality of second axis sensing lines arranged in parallel with each other. And a second etching zone, each second axis sensing line having a plurality of interconnected capacitive sensitive units, wherein the second etching zone is divided into a plurality of discrete small area units. Become;
The insulating layer is bonded between the insulating layer, the first axis sensing layer and the second axis sensing layer, and is formed of a transparent plate, wherein the first axis sensing line and the second axis sensing line are installed at right angles, Each capacitive sensing unit on one axis sensing line and the second axis sensing line is arranged in a matrix, and at each end of each of the first axis sensing line and the second axis sensing line, a signal is provided at the edge of the sensing layer. A capacitive touch sensor structure, which is connected to a lead, thereby transmitting a capacitive sensing signal through the signal lead to a subsequent signal processing circuit. The method of claim 1,
The first axis sensing layer and the second axis sensing layer are transparent conductive thin films having good conductive properties, and materials thereof include indium tin oxide, indium zinc oxide, indium aluminum oxide, or ethylenedioxythiophene (PEDOT). A kind of capacitive touch sensor structure, characterized in that the transparent conductive thin film made of a material. The method of claim 1,
The insulating layer is a kind of capacitive touch sensor structure, characterized in that the insulating transparent adhesive layer. The method of claim 1,
The installation depth of the etch line is a kind of capacitive touch sensor, characterized in that the conductive film of the first axis sensing layer or the second axis sensing layer is completely cut to divide the conductive film into two insulated portions. rescue. The method of claim 1,
The etching line is a kind of capacitive touch sensor structure, characterized in that having a horizontal width of less than about 150㎛.

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