KR20120003310A - Light emitting module, backlight unit and display appratus having the same - Google Patents

Abstract

PURPOSE: A light emitting module, backlight unit, and display device including the same are provided to increase the reliability of a module substrate and a light emitting module by preventing the circuit open of a pad of a module substrate. CONSTITUTION: A plurality of light emitting diodes is loaded. A line unit(32A) includes a plurality of wiring lines(L1~L7) which are electrically connected to a plurality of light emitting diodes. A module PCB includes a bonding unit(32B) including a plurality of pads(P1~P7) in order to input/output the power of wiring lines. A first by-pass line is connected to the first pad which is connected to the first wiring line.

Description

LIGHT EMITTING MODULE, BACKLIGHT UNIT AND DISPLAY APPRATUS HAVING THE SAME}

The embodiment relates to a light emitting module, a backlight unit, and a display device having the same.

As information processing technology develops, display devices such as LCD, PDP and AMOLED are widely used. Among such display devices, an LCD requires a backlight unit capable of generating light in order to display an image.

The embodiment provides a light emitting module, a backlight unit, and a display device having the same, which improve an open circuit near a pad of a module substrate.

The embodiment provides a light emitting module, a backlight unit, and a display device including the same, in which a bypass circuit is disposed near a pad of a module substrate.

The embodiment provides a light emitting module, a backlight unit, and a display device having the same, in which wiring lines of a module substrate are arranged in a straight line with a bonding area of a pad.

The light emitting module according to the embodiment includes a plurality of light emitting diodes; And a line unit on which the plurality of light emitting diodes are mounted and including a plurality of wiring lines electrically connected to the plurality of light emitting diodes. And a bonding part including a plurality of pads connected to input and output power to the plurality of wiring lines, wherein the bonding part includes a first wiring line among the plurality of wiring lines and one of the plurality of pads. And at least one first bypass line connected in parallel to a first pad connected to the first wiring line.

The backlight unit according to the embodiment may include the light emitting module; A light guide plate having a light emitting diode of the light emitting module corresponding to at least one side surface; A reflective sheet under the light guide plate; An optical sheet on the steel plate; And a bottom cover accommodating the light emitting module, the light guide plate, the reflective sheet, and the optical sheet.

The embodiment can prevent the circuit from being opened near the pad of the module substrate, thereby improving the reliability of the module substrate and the light emitting module.

According to the embodiment, the flexible printed circuit board may increase the line width near the pad and further arrange the bypass line, thereby improving the degree of freedom of the bonding portion.

The embodiment can improve the reliability of the module substrate and the light emitting module.

The embodiment can ensure the reliability and stability of the backlight unit.

1 is an exploded perspective view of a display device according to an exemplary embodiment.
FIG. 2 is a detailed perspective view of the module substrate of FIG. 1. FIG.
3 is an enlarged view of a connector portion of the module board of FIG. 2.
4 is a cross-sectional view taken along the BB side of the module substrate of FIG. 3.
5 is an enlarged view of a portion A of FIG. 3.
6 is a diagram illustrating a configuration of a first wiring line and a pad.
7 is a diagram illustrating a configuration of a seventh wiring line and a pad.
8 is a diagram illustrating another example of a wiring line and a pad.

In the description of the embodiments, it is described that each substrate, frame, sheet, layer or pattern, etc., is formed on or "under" of each substrate, frame, sheet, layer or pattern, etc. In the case, “on” and “under” both reflect sheets that are formed “directly” or “indirectly” through other components. In addition, the upper or lower reference of each component is described with reference to the drawings. The size of each component in the drawings may be exaggerated for the sake of explanation and does not mean the size actually applied.

1 is an exploded perspective view illustrating a display device according to an exemplary embodiment.

Referring to FIG. 1, the display device 1 includes a display panel 10 on which an image is displayed, and a backlight unit 20 that provides light to the display panel 10.

The backlight unit 20 may include a light guide plate 70 that provides a surface light source to the display panel 10, a reflective sheet 45 that reflects leakage light, a light emitting module 30 that provides light in an edge region, And a bottom cover 40 forming a lower appearance of the display device 1.

Although not shown, the display device 1 includes a panel supporter for supporting the display panel 10 from a lower side, a top that forms an edge of the display device 1, and surrounds and supports the display panel 1. It may include a cover.

Although not shown in detail, the display panel 10 is, for example, a lower substrate 12 and an upper substrate 11 bonded together to maintain a uniform cell gap facing each other, and a liquid crystal interposed between the two substrates. Layer (not shown). A plurality of gate lines and a plurality of data lines intersecting the plurality of gate lines are formed on the lower substrate 12, and a thin film transistor (TFT) is formed at an intersection of the gate lines and the data lines. Can be. Color filters may be formed on the upper substrate 11. The structure of the display panel 10 is not limited thereto, and the display panel 10 may have various structures. In another example, the lower substrate 12 may include a color filter as well as a thin film transistor. In addition, the display panel 10 may be formed in various shapes according to a method of driving the liquid crystal layer.

Although not shown, a gate driving printed circuit board (PCB) for supplying a scan signal to a gate line and a data driving printed circuit board (PCB) for supplying a data signal to a data line are provided at edges of the display panel 10. ) May be provided.

A polarizing film (not shown) may be disposed on at least one of the top and bottom of the display panel 10. An optical sheet 60 is disposed below the display panel 10, and the optical sheet 60 may be included in the backlight unit 20, and may include at least one prism sheet or / and a diffusion sheet. Can be. The optical sheet 60 may be removed but is not limited thereto.

The diffusion sheet evenly spreads the incident light, and the diffused light may be focused onto the display panel by the prism sheet. Here, the prism sheet may be selectively configured using a horizontal or / and vertical prism sheet, one or more roughness reinforcing sheets, and the like. Type or number of the optical sheet 60 may be added or deleted within the technical scope of the embodiment, but is not limited thereto.

The backlight unit 20 is, for example, an edge type backlight, and includes a light guide plate 70, a reflective sheet 45 under the light guide plate 70, a light guide plate edge side support plate 50, and a light guide plate 70. Edge-side light emitting module 30 is included.

The light emitting module 30 may be disposed on at least one side of the inner side of the bottom cover 40. The light emitting module 30 may be disposed on both side surfaces or all side surfaces of the bottom cover 40, but is not limited thereto.

The light emitting module 30 includes a module substrate 32 and a plurality of light emitting diodes 34 arranged on the front surface of the module substrate 32.

The plurality of light emitting diodes 34 are arranged at a predetermined pitch, and at least one of the plurality of light emitting diodes 34 emits at least one of at least one color, for example, white, red, green, and blue. The embodiment may use a light emitting diode that emits light of at least one color or a combination of light emitting diodes that emit a plurality of colors.

The light emitting diode 34 may include an LED chip using a group III-VI compound semiconductor and a molding member for protecting the LED chip. At least one kind of phosphor may be added to the molding member, but is not limited thereto. The LED chip may emit light in a visible light band or emit light in an ultraviolet band.

The light emitting diodes 34 may be arranged in at least one column, but are not limited thereto. The light emitting diodes 34 mounted on the module substrate 32 may be arranged at regular intervals or at irregular intervals.

The module substrate 32 may include a flexible printed circuit board. The module substrate 32 may be formed in a long bar shape and includes a connector part at a portion thereof. The connector part includes a line part 30A and a bonding part 30B, and the line part 30A is a module. An input / output wiring line, which is a circuit pattern of the substrate 32, is electrically connected to the plurality of light emitting diodes, and the bonding part 30B includes a pad to which another connector substrate or a power line is connected.

The module substrate 32 may be erected in a direction perpendicular to the bottom surface of the bottom cover 40, or may contact the bottom surface of the bottom cover 40 in a horizontal direction, but is not limited thereto. . The light emitting diodes 34 are mounted on the front surface (or top surface) of the module substrate 32.

The module substrate 32 may be adhered to the front surface of the support plate 50. The support plate may include a metal plate having high thermal conductivity, and the metal plate may include aluminum, gold, silver, tungsten, copper, nickel, platinum, iron, or the like. The back surface of the module substrate 32 is in contact with the front surface of the support plate 50, the surface area of the support plate 50 may be formed larger than the surface area of the module substrate 32, for example, the support plate The width of the 50 may be formed at least larger than the width of the module substrate 32.

The module substrate 32 may be attached to the support plate 50 with a separate adhesive or an adhesive, but is not limited thereto.

The light guide plate 70 may be formed in a polygonal shape including an upper surface on which a surface light source is generated, a lower surface on an opposite side of the upper surface, and at least four sides, but is not limited thereto.

The light emitting diodes 34 are disposed to face at least one side of the light guide plate 70. Light is incident on the side surface of the light guide plate 70. The light guide plate 70 is made of a transparent material, and may include, for example, one of an acrylic resin series such as polymethyl metaacrylate (PMMA), polyethylene terephthlate (PET), polycarbonate (PC), and polyethylene naphthalate (PEN) resin. Can be. The light guide plate 70 may be formed by an extrusion molding method, but is not limited thereto.

A pattern (not shown) may be formed on the top or / and bottom of the light guide plate 70. The pattern consists of a predetermined pattern, for example, a reflective pattern and / or a prism pattern, thereby reflecting or / and diffusely reflecting light, so that the light may be uniformly irradiated through the entire surface of the light guide plate 70. The lower surface of the light guide plate 70 may be formed in a reflective pattern, and the upper surface may be formed in a prism pattern. A scattering agent may be added to the inside of the light guide plate 70, but is not limited thereto.

The reflective sheet 45 may be provided under the light guide plate 70. The reflective sheet 45 reflects light traveling toward the lower portion of the light guide plate 70 in the display panel direction. The reflective sheet 45 re-injects the light leaked to the lower portion of the light guide plate 70 into the light guide plate 70, thereby preventing problems such as a decrease in light efficiency, a decrease in optical properties, and dark areas. The reflective sheet 45 may be formed of, for example, PET, PC, PVC resin, but is not limited thereto. The reflective sheet 45 may be an upper surface of the bottom cover 40, but is not limited thereto.

The bottom cover 40 may be opened at an upper side thereof, and the optical sheet 60, the light guide plate 70, and the reflective sheet 45 may be accommodated therein. The bottom cover 40 may be formed of a material having a high heat dissipation efficiency, such as a stainless material, but is not limited thereto.

A reflection sheet 45, a light guide plate 70, and an optical sheet 60 may be sequentially stacked on the inside 41 of the bottom cover 40, and the light emitting module 30 may be coupled to the support plate 50. After being coupled to the side of the bottom cover 40, it is disposed corresponding to one side of the light guide plate (70).

The light emitting module 30 may be attached to the side of the bottom cover 40 instead of the support plate 50 or to the bottom surface. In this case, the support plate may be removed.

The support plate 50 may also comprise a multi-stage bent shape, for example comprising an extension that extends further to the bottom surface, the extension may contact the bottom surface of the bottom cover, or a separate heat dissipation plate such as It may be in contact with a plurality of heat pipes. The support plate 50 and other heat dissipation members can be added to improve heat dissipation efficiency, and the structure is not limited to the above. The support plate 50 may be defined as a component of the light emitting module 30, but is not limited thereto.

Referring to FIG. 2, the module substrate 32 may include a flexible printed circuit board, and the flexible printed circuit board may be extended by bending the connector part, and the flexible printed circuit board may be installed up to a curved portion.

The line portion 32A of the connector portion may be bent and drawn out from the module substrate 32, and the bonding portion 32B may expose a plurality of pads and may be electrically connected to the wiring portion 32A.

3 is a partially enlarged view of FIG. 2, FIG. 4 is a sectional view taken along the line B-B of FIG. 3, and FIG. 5 is an enlarged view of a portion A of FIG. 3.

Referring to FIG. 3, the wiring lines L1 to L7 of the line part 32A are connected to the pads P1 to P7 of the bonding part 32B, respectively. The widths of the wiring lines L1 to L7 of the line part 32A may be formed to have a width of 100 μm to 300 μm, but is not limited thereto.

Some of the wiring lines L2, L4, and L5 of the plurality of wiring lines L1 to L7 may be connected to the wiring lines disposed inside the module substrate through the through holes 35. For example, the second wiring line L2, the fourth wiring line L4, and the fifth wiring line L5 are connected to the second pad P2 and the fourth pad through an inner layer wiring line connected to the through hole 35. P4) and a fifth pad P5, respectively.

Among the wiring lines L1 to L7, the wiring lines L1, L3, L6, and L7, which are not connected to the inner layer wiring line, may be disposed on the module substrate and connected to the pads P1, P3, P6, and P7. . The wiring lines L1, L3, L6, and L7 may have a problem in that the boundary portion is opened due to the difference in the rigidity between the pad portion and the wiring line portion. The pattern width or pad width of L1, L3, L6, L7) is to be changed.

Referring to FIG. 3, the first wiring line L1 and the seventh wiring line L7 are disposed at the outermost side of the module substrate and connected to the first pad P1 and the seventh pad P7, respectively.

The second wiring line L2 is adjacent to the first wiring line L1 and is connected to the inside of the bonding portion 32B through the through hole 35 and is connected to the through hole 36 of the second pad P2. . The fourth wiring line L4 and the fifth wiring line L5 are connected to the inner layer pattern through the through holes 35 and connected to the through holes 36 in the fourth pad P4 and the fifth pad P5, respectively. do. The second, fourth, and fifth pads P2, P4, and P5 are arranged most apart from the line portion 32A, and are aligned at regular intervals.

The third wiring line L3 may be connected to the third pad P3 disposed on one side of the bonding portion 32B along the central portion of the module substrate. The sixth wiring line L6 is connected to the sixth pad P6 disposed on the other side of the bonding portion 32B through the upper portion of the module substrate, and the sixth pad P6 is connected to the third pad P3. And on the opposite side. The third and sixth pads P3 and P6 are disposed between the first and seventh pads P1 and P7 of the bonding portion 32B and the second, fourth and fifth pads P2, P4 and P5. .

Since the first pad P1 and the seventh pad P7 are disposed closer to each other than the other pads with respect to the boundary between the line portion 32A and the bonding portion 32B, the first pad P1 and the seventh pad P7 are more likely to be bent. Due to the difference in rigidity between the pad portion and the wiring line portion, a defect in which the wiring line portion is opened may occur. According to the embodiment, a wiring line is disposed between the first pad P1 and the first wiring line L1 in a double manner, and a wiring line is disposed between the seventh pad P7 and the seventh wiring line L7 in a double manner. can do.

4 is a sectional view taken along the line B-B in FIG.

Referring to FIG. 4, the bonding part 32B of the module substrate includes a top coverlay 133, a copper foil layer 132, and a bottom coverlay 131. A plurality of dummy patterns or through holes may be formed in the top coverlay 133 and the bottom coverlay 133 by a punching process.

The top coverlay 133 is attached to the copper foil layer 132 by pressing and heating with a hot press, and the copper foil layer 132 is patterned in a desired circuit pattern. The copper foil layer 132 may be formed in one layer or multiple layers, and a circuit pattern may be formed by the patterning.

The second wiring line L2, the fourth wiring line L4, and the fifth wiring line L5 are disposed in the bonding part 32B, and the wiring line patterns connected to the through hole 35 of FIG. 3. Connected with The first pad P1, the seventh pad P7, and the third and sixth wiring lines L3 and L6 may be disposed above the module substrate than other wiring line patterns. Here, a solder resistor or an insulating ink layer may be further disposed on the third and sixth wiring lines L3 and L6, but embodiments are not limited thereto.

3 and 5, the width of the first wiring line L1 and the seventh wiring line L7 is a bonding portion 32A region, that is, a boundary portion between the line portion 32A and the bonding portion 32B. It can be expanded to a large extent. The boundary part may be, for example, a bent portion of the wiring lines or an area connected to another through hole, but is not limited thereto.

The first wiring line L1 becomes a first connection line L11, and the first connection line L11 is formed to have a width wider than that of the first wiring line L1. A first bypass line L12 is further branched to a predetermined portion of the first connection line L11, and the first connection line L11 and the first bypass line L12 are connected to the first portion. Commonly connected to the pads P1 and arranged in parallel with each other. The width D1 of the first connection line L11 may be wider than the width of the first bypass line L12, and the width of the first bypass line L12 may be the first. It may be the same as or different from the width of the wiring line (L1).

The first connection line L11 is disposed outside the first bypass line L12 so that the first connection line L11 may be connected to the first pad P1 in a straight line shape.

The seventh wiring line L7 is symmetrically disposed on the opposite side of the first wiring line L1 and is branched into at least two wiring lines and disposed in the bonding portion. The seventh wiring line L7 is divided into a seventh connection line L71 and a seventh bypass line L72, and one side of the seventh connection line L71 and the seventh bypass line 72 is formed. Commonly connected to the seventh wiring line (L7), the opposite side of the one side is commonly connected to the seventh pad (P7) and disposed in parallel to each other.

The seventh connection line L71 may be connected to be wider than the width of the seventh wiring line L7, and the seventh bypass line L72 may be the same as the width of the seventh wiring line L7. Can be different.

The second connection line L71 and the second bypass line L72 may have different widths. For example, the width D1 of the second connection line L71 may correspond to the first bypass line (L1). It can be formed wider than the width of L72).

The seventh connection line L71 is disposed outside the seventh bypass line L72 and may be connected to the seventh pad P7 in a straight line shape.

Bonding regions of the first pad P1 and the seventh pad P7 may be disposed outside the other wiring lines, thereby preventing a short circuit from being caused by the other wiring lines by solder bonding.

On the other hand, since the first pad P1 and the seventh pad P7 are arranged closer to the boundary portion of the line portion 32A and the bonding portion 32B than other pads, the first pad P1 and the seventh pad P7 are more likely to be bent. Due to the difference in rigidity between the pad portion and the wiring line portion, a defect in which the wiring line portion is opened may occur. According to the embodiment, the first bypass line L12 is further disposed to replace the first connection line L11, and the second bypass line L72 is further disposed to replace the second connection line L71. It is a structure. Accordingly, when the first and second connection lines L11 and L71 are open, an electrical circuit may be configured using the first and second bypass lines L11 and L71.

As shown in FIGS. 5 and 6, the first pad P1 includes a bonding region P11 and a non-bonding region P12, and the bonding region P11 is disposed outside as a solder portion and the non-bonding. The area P12 may be disposed inwardly than the bonding area P11.

The first connection line L11 has a width equal to the width D1 of the bonding area P11 and is connected to the bonding area P11 in a straight line shape. The first bypass line L12 may extend in a straight line to the non-bonding region P12 of the first pad P1.

The first bypass line L12 is connected to the middle portion of the first connection line L11 and extends to the non-bonding region P12 of the first pad P1, and the length thereof is 3 mm or more. Can be configured to constitute a substantial bypass circuit.

The first connection line L11 has the same width D1 as the bonding area P11 of the first pad P1, and is formed to have a width of about 1 mm ± 0.05 mm and to bond the first pad P1. The bending problem of the stiffness difference with the area P11 can be uniformly distributed through the entire width.

A spacer 37 may be disposed between the first connection line L11 and the first bypass line L12, and the spacer 37 may have a width of 0.1 mm to 0.5 mm. The connection line L11 and the first bypass line L12 may be spaced apart from each other. The shape of the spacer 37 may be a polygonal shape such as a rectangle, a pentagonal shape, and the like, but is not limited thereto.

The width D1 + D2 of the first pad P1 is equal to the sum of the width D1 of the first connection line L11, the spacer 37, and the width D2 of the first bypass line L12. It can be formed in a width, it can effectively distribute the bending force applied to the substrate.

By further adding the non-bonding region P12 to the first pad P1, the first connection line L11 may be extended and connected in a straight line to the bonding region P11 of the first pad P1. The first bypass line L12 may extend in a straight line to the non-bonding region P12 of the first pad P1. Accordingly, an open problem between the first pad P1 and the two connection lines L11 and L12 may be prevented, and electrical reliability may be improved through a double line pattern.

Meanwhile, as illustrated in FIGS. 5 and 7, the seventh pad P7 includes a bonding region P71 and a non-bonding region P72, and the bonding region P71 is disposed outside as a solder portion. The non-bonding region P72 may be disposed inwardly than the bonding region P71.

The seventh connection line L71 has a width equal to the width D1 of the bonding area P71 and is connected to the bonding area P71 in a straight line shape. The seventh bypass line L72 may extend in a straight line to the non-bonding region P72 of the seventh pad P7.

The seventh bypass line L72 may be formed to have a length of 3 mm or more to constitute a substantial bypass circuit.

The seventh connection line L71 has the same width D1 as the bonding area P71 of the seventh pad P7, and is formed to have a width of about 1 mm ± 0.05 mm and to bond the seventh pad P7. The bending problem of the difference in stiffness from the region P71 can be uniformly distributed throughout the entire width.

A spacer 38 may be disposed between the seventh connection line L71 and the seventh bypass line L72, and the spacer 38 may have a width of 0.1 mm to 0.5 mm. The connection line L71 and the seventh bypass line L72 may be spaced apart from each other. The shape of the spacer 38 may be a polygonal shape such as a rectangle, a pentagonal shape, and the like, but is not limited thereto.

The width D1 + D4 of the seventh pad P7 is equal to the sum of the width D1 of the seventh connection line L71, the width D4 of the spacer 38, and the seventh bypass line L72. It can be formed in a width, it can effectively distribute the bending force applied to the substrate.

By further adding the non-bonding region P72 to the seventh pad P7, the seventh connection line L71 may be connected to the bonding region P71 of the seventh pad P7 in a straight line form. The seventh bypass line L72 may extend in a straight line to the non-bonding region P72 of the seventh pad P7. Accordingly, an open problem between the seventh pad P7 and the two lines L71 and L72 may be prevented, and electrical reliability may be improved through a double line pattern.

As illustrated in FIG. 5, the third pad P3 connected to the third wiring line L3 further includes a non-bonding region P31 so as to be connected in a straight line with the third wiring line L3. It may include. The width D3 of the third pad P3 may have the same width as that of the bonding area and the non-bonding area P31, but is not limited thereto.

The sixth pad P6 connected to the sixth wiring line L6 may further include a non-bonding region P61 so as to be connected in a straight line with the sixth wiring line L6. The width D3 of the sixth pad P6 may have the same width as that of the bonding area and the non-bonding area P61, but is not limited thereto.

The third and sixth wiring lines L3 and L6 are connected to the non-bonding regions P31 and P61 of the pads P3 and P6 in a straight line, so that the wiring lines may be installed even in a bent structure or solder bonding. The short problem between L3 and L6 and the pads P3 and P6 can be reduced.

The second, fourth, and fifth wiring lines L2, L4, and L5 are connected to the pads P2, P4, and P5, as shown in FIG. Here, the second pad P2 connected to the second wiring line L2, the fourth pad P4 connected to the fourth wiring line L4, and the fifth pad P5 connected to the fifth wiring line L5. The non-bonding regions P22, P42, and P52 are further extended to the portions where the wiring lines are connected, so that the wiring lines L2, L4, and L5 are not bonded to the pads P2, P4, and P5. It can be connected to the bonding area. Accordingly, it is possible to prevent a short problem between the wiring lines L2, L4 and L5 and the pads P2, P4 and P5.

8 is a diagram illustrating a modification of the wiring line pattern.

As shown in FIG. 8, the wiring line L may be separated into at least two connection lines La and Lb, and any one of the separated connection lines La and Lb becomes a connection line La and the rest It can be used as the bypass line (Lb). Widths D5 of each of the two connection lines La and Lb may be formed to have the same width, and a spacer Lc may be disposed between the connection lines La and Lb. The width of Lc may be the same as that of the connection lines La and Lb, but is not limited thereto.

The connection line La may be connected in a straight line to the bonding area Pd of the pad P, and the other connection line Lb may be connected in a straight line to the non-bonding area Pa of the pad P. Can be. Accordingly, the non-bonding region Pa and the connection line Lb connected to each other in a straight line are separated from the solder, thereby preventing a short problem.

Although the embodiment has been described as one bypass line, two may be used, but the structure is substantially parallel to the connection line, but the structure is not parallel to each other, but is not limited thereto. In addition, at least two spacers and at least two bypass lines may be disposed in one line, but are not limited thereto.

The light emitting module according to the embodiment may be applied not only to a backlight unit such as a portable terminal, a computer, but also to a lighting device such as a lighting lamp, a traffic light, a vehicle headlight, an electric sign, a street lamp, and the like, but is not limited thereto. In addition, the light guide plate may not be disposed in the direct type light emitting module, but is not limited thereto. In addition, a light transmitting material such as a lens or glass may be disposed on the light emitting module, but is not limited thereto.

It is not intended to be limited to the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, it will be apparent to those skilled in the art that various forms of substitution, modification, and alteration are possible without departing from the technical spirit of the present invention described in the claims, and the appended claims. Will belong to the technical spirit described in.

DESCRIPTION OF SYMBOLS 1 Display apparatus 10 Display panel 20 Backlight unit 60 Optical sheet 70 Light guide plate 45 Reflective sheet 30 Light emitting module 32 Module substrate 34 Light-emitting diode 50 Support plate 32 A : Line part, 32B: Bonding part, L1 to L7: Wiring line, 35, 36: Through hole, L11, L71: Connection line, L12, L72: Bypass line, P1 to P7: Pad

Claims (15)

A plurality of light emitting diodes; And
A line unit on which the plurality of light emitting diodes are mounted and including a plurality of wiring lines electrically connected to the plurality of light emitting diodes; And a module substrate including a bonding part including a plurality of pads respectively connected to input and output power to the plurality of wiring lines.
The bonding unit includes a first wiring line of the plurality of wiring lines and at least one first bypass line connected in parallel to a first pad connected to the first wiring line of the plurality of pads. The light emitting module of claim 1, wherein the module substrate comprises a flexible printed circuit board. The method of claim 1, wherein the first pad includes a bonding area and a non-bonding area.
The bonding region is connected to the first wiring line,
And the non-bonding region is connected to the first bypass line. The light emitting module of claim 3, wherein the width of the first wiring line is equal to the width of the bonding region. The method of claim 3, further comprising a first spacer to space the first wiring line and the first bypass line,
The sum of the widths of the first spacer and the first bypass line is equal to the width of the non-bonding region of the first pad. The light emitting module of claim 3, wherein the width of the first wiring line is at least wider than the width of the lines arranged in the line part. The light emitting module of claim 3, wherein a width of the bonding area of the first pad and the first wiring line is in a range of 1 mm ± 0.05 mm. The method of claim 3, wherein the bonding area of the first pad and the first wiring line are connected in a straight line shape.
The non-bonding region of the first pad and the second wiring line are connected in a straight line shape. The method of claim 3, wherein the second pad disposed symmetrically with the first pad of the plurality of pads includes a bonding area and a non-bonding area.
The bonding unit includes a second wiring line connected to the bonding area in a width of the bonding area among the wiring lines, and a second bypass line connected to the non-bonding area in parallel with the second wiring line. The light emitting module of claim 9, further comprising a second spacer between the second wiring line and the second bypass line. The light emitting module of claim 3, wherein the first pad is disposed closer to the line portion than other pads of the bonding portion. The light emitting module of claim 3, wherein the first wiring line is disposed outside the other wiring lines. The light emitting module of claim 3, wherein the bonding part comprises at least one through hole, and the through hole connects some wiring lines and pads to each other through a line pattern disposed in an inner layer. A plurality of light emitting diodes; And a line unit on which the plurality of light emitting diodes are mounted and including a plurality of wiring lines electrically connected to the plurality of light emitting diodes. And a bonding part including a plurality of pads connected to input and output power to the plurality of wiring lines, respectively, wherein the bonding part includes a first wiring line of the plurality of wiring lines and the plurality of pads. A light emitting module including at least one first bypass line connected to a first pad connected to the first wiring line in parallel;
A light guide plate having a light emitting diode of the light emitting module corresponding to at least one side surface;
A reflective sheet under the light guide plate;
An optical sheet on the steel plate; And
And a bottom cover to accommodate the light emitting module, the light guide plate, the reflective sheet, and the optical sheet. The backlight unit of claim 14, further comprising a support plate to which the module substrate of the light emitting module is attached, wherein a part of a rear surface of the support plate is in surface contact with the bottom cover.

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