KR20110139819A - Vapor deposition machine of e-beam type - Google Patents

Vapor deposition machine of e-beam type Download PDF

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KR20110139819A
KR20110139819A KR1020100059870A KR20100059870A KR20110139819A KR 20110139819 A KR20110139819 A KR 20110139819A KR 1020100059870 A KR1020100059870 A KR 1020100059870A KR 20100059870 A KR20100059870 A KR 20100059870A KR 20110139819 A KR20110139819 A KR 20110139819A
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chamber
carrier
product
deposition
chambers
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이재백
김종회
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이재백
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08Oxides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/32Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D17/00Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
    • F04D17/08Centrifugal pumps
    • F04D17/16Centrifugal pumps for displacing without appreciable compression
    • F04D17/168Pumps specially adapted to produce a vacuum
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE: A device for depositing inline type of e-beam way is provided improve the production quantity and multi evaporation of products. CONSTITUTION: A device for depositing inline type of e-beam way comprises a first chamber(10), a second chamber(20), a third chamber(30), a vacuum pump, a transfer rail part(40) and gate valves(51,52). The first chamber establishes a carrier(5) in which product installs. The second chamber evaporates the product of the carrier carried from the first chamber to the e-beam mode. The vacuum pump is respectively installed inside the first, second, and third chambers under vacuum conditions. The transfer rail part gradually transfers the carrier. The gate valve opens and closes along the first, second, and third chambers.

Description

이-빔 방식의 인라인형 증착장치{VAPOR DEPOSITION MACHINE OF E-BEAM TYPE}E-beam type in-line evaporation system {VAPOR DEPOSITION MACHINE OF E-BEAM TYPE}

본 발명은 이-빔(E-beam) 방식이 적용된 증착장치에 관한 것으로서, 좀더 상세하게는 종래 단일 챔버로 증착 작업하는 이-빔 방식에서 제품 케리어를 설치하는 제1챔버와, 제품 케리어의 제품에 이-빔 방식으로 증착 작업하는 제2챔버 및 제품 케리어를 회수하는 제3챔버를 인라인 형태로 병렬 구성하여 제품의 설치, 증착, 회수를 제1,2,3챔버에 의해 순차 작업하므로 종래 이-빔 방식의 장점인 제품의 메탈 및 멀티 증착과 제품의 생산 수량을 증대시켜 상품성과 제조 생산성을 우수하게 제공하는 이-빔 방식의 인라인형 증착장치에 관한 것이다.The present invention relates to a deposition apparatus to which an E-beam method is applied, and more particularly, to a first chamber for installing a product carrier in an e-beam method of depositing a conventional single chamber, and a product of a product carrier. The second chamber for e-beam deposition and the third chamber for recovering the product carrier are configured in parallel in the in-line form to sequentially install, deposit, and recover the product by the first, second, and third chambers. The present invention relates to a two-beam type in-line deposition apparatus that provides excellent merchandise and manufacturing productivity by increasing metal and multi-deposition of a product, which is an advantage of the beam method, and increasing the production quantity of the product.

최근 핸드폰이나 가전제품 등의 사출 성형 제품 표면에 증착하는 방식이 많이 적용되고 있는데, 글씨나 디자인의 고급스러움을 부여하여 그 상품성을 높이기 때문이다.Recently, a method of depositing on the surface of an injection molded product such as a mobile phone or a home appliance is applied, because it gives a luxury of a letter or a design to increase its commerciality.

이러한 증착 방식은 주로 이-빔(E-beam) 방식과 스퍼터링 방식이 적용되고 있다.This deposition method is mainly applied to the E-beam (E-beam) method and sputtering method.

상기 이-빔 방식은 단일 챔버 내부에 증착할 제품을 케리어에 장착하여 설치하고, 챔버 내부를 증착 가능한 진공도(5.0 E-5 torr)까지 펌핑한 후, 하부 증착부에서 증발되는 소재에 의해 제품의 증착 작업을 행하고, 증착이 완료되면 챔버 내부의 진공을 파지하고 캐리어를 회수하여 작업을 완료하게 되는 것이다.The two-beam method is installed by mounting a product to be deposited in a single chamber in a carrier, pumping the inside of the chamber to a vacuum degree (5.0 E-5 torr) that can be deposited, and then the material of the product is evaporated from the lower deposition unit The deposition operation is performed, and when the deposition is completed, the vacuum inside the chamber is gripped and the carrier is recovered to complete the operation.

이때 상기 증착 소재는 굴절율이 다른 물질(예를 들면 Ti02, SiO2, ZrO2) 등과 메탈 물질(Ni, Cr, Al) 등으로 채택된다.In this case, the deposition material may be made of a material having a different refractive index (for example, Ti02, SiO2, ZrO2), or a metal material (Ni, Cr, Al).

이러한 이- 빔 방식은 메탈 및 멀티 증착으로 보는 각도에 따라 색상이 변하거나 반짝이는 광택으로 글씨나 디자인의 고급스러움을 우수하게 제공하는데 반하여, 증착 과정에 많은 시간이 소요되어 제조 생산성이 저하되는 문제점이 있었다.While this e-beam method provides excellent quality of letters or designs by changing colors or glittering luster depending on the angle of metal and multi deposition, the deposition process takes a lot of time and reduces manufacturing productivity. There was this.

예를 들면, 굴절율이 다른 물질을 이용하여 3층 구조의 증착 작업을 하는데 챔버 내부를 증착 가능한 진공도까지 펌핑하는데 대략 15분, 증착시간이 10분, 챔버 내부의 진공을 파기하는데 6분이 소요되어 총 30~40분이 소요되는데, 실제 증착을 행하는 시간 이외에 증착 가능한 진공도까지 펌핑하거나 진공을 파기하는 시간이 20~30분 정도 소요되어 제조 생산성이 저하될 수밖에 없었다.For example, a three-layer deposition process using materials with different refractive indices takes about 15 minutes to pump the chamber to a vacuum degree that can be deposited, 10 minutes to deposit, and 6 minutes to break the vacuum inside the chamber. It takes 30 to 40 minutes, in addition to the actual deposition time, the time to pump or discard the vacuum to 20 to 30 minutes to the deposition possible vacuum was inevitably deteriorated manufacturing productivity.

이에 반해, 스퍼터링 방식은 단일 챔버를 사용하는 것이 아니라 다수 챔버에 의한 인라인 방식을 적용하기 때문에 제조 생산성을은 향상시키기게 되나, 메탈 증착 및 타겟 장착 제한으로 인해 한가지 산화물만 증착 가능하게 되므로 상품성이 저하되는 문제점이 있었다.On the contrary, sputtering method improves manufacturing productivity by applying in-line method by multiple chambers instead of using a single chamber, but due to metal deposition and target mounting limitations, only one oxide can be deposited, thereby degrading the merchandise. There was a problem.

따라서, 본 출원인은 상기 이-빔 방식의 장점을 유지하면서 스퍼터링 방식을 일부 적용시켜 상품성 향상과 함께 제조 생산성의 향상을 이루도록 하고자 연구노력하였다.Therefore, the present inventors have tried to achieve the improvement of the manufacturing productivity with the improvement of the commerciality by applying a part of the sputtering method while maintaining the advantages of the two-beam method.

본 발명은 상기한 종래 기술이 갖는 제반 문제점을 해결하고자 발명된 것으로서, 종래 단일 챔버로 증착 작업하는 이-빔 방식에서 제1,2,3챔버를 인라인 형태로 병렬 구성하여 제품의 설치, 증착, 회수를 제1,2,3챔버에 의해 순차 작업하므로 종래 이-빔 방식의 장점인 제품의 메탈 및 멀티 증착과 함께 제2챔버에서 증착 작업을 연속 수행하면서 제품의 생산 수량을 증대시켜 상품성과 제조 생산성을 모두 우수하게 제공하는데 그 목적이 있다.The present invention has been invented to solve the above problems of the prior art, the installation of the first, second, third chamber in parallel in the in-line form in the two-beam method of conventional deposition work in a single chamber installation, deposition, Since the recovery is sequentially performed by the first, second, and third chambers, the metal and multi-deposition of the product, which is the advantage of the conventional two-beam method, are continuously deposited in the second chamber while increasing the production quantity of the product to manufacture the product performance. The aim is to provide excellent productivity.

이러한 본 발명은, 제품이 장착된 케리어를 설치하는 제1챔버와, 상기 제1챔버에서 이동된 케리어의 제품을 증착부에서 증발되는 소재에 의해 이-빔 방식으로 증착하는 제2챔버와, 상기 제2챔버에서 증착 완료되어 이동된 케리어를 회수하는 제3챔버를 인라인 방식으로 병렬 구성하되, 상기 제1,2,3챔버에는 내부의 진공이나 진공파기를 위해 각각 설치되는 진공펌프와, 케리어를 순차 이동 이동시키는 이동레일부와, 상기 제1,2,3챔버 사이에서 개폐 작동하는 게이트 밸브를 설치 구성하도록 함에 그 특징이 있다.The present invention includes a first chamber for installing a carrier on which a product is mounted, a second chamber for depositing a product of a carrier moved from the first chamber by an evaporation material by a material evaporated in a deposition unit, and A third chamber for recovering a carrier moved after the deposition is completed in the second chamber is configured in an in-line manner in parallel, wherein the first, second, and third chambers have a vacuum pump and a carrier installed for vacuum or vacuum destruction, respectively. It is characterized in that the moving rail portion for sequential movement and the gate valve for opening and closing operation between the first, second, third chambers.

본 발명 상기 이동레일부는 케리어를 제1,2,3챔버로 순차 이동한 후 다시 제1챔버로 복귀하도록 무한 궤도 형태로 형성하도록 함에 그 특징이 있다.The moving rail unit is characterized in that the moving rail portion is formed in an endless track shape so as to return to the first chamber after sequentially moving the carrier to the first, second, third chamber.

이러한 본 발명은 종래 단일 챔버로 증착 작업하는 이-빔 방식에서 제품 케리어를 설치하는 제1챔버와, 제품 케리어의 제품에 이-빔 방식으로 증착 작업하는 제2챔버 및 제품 케리어를 회수하는 제3챔버를 인라인 형태로 병렬 구성하여 제품의 설치, 증착, 회수를 제1,2,3챔버에 의해 순차 작업하므로 종래 이-빔 방식의 장점인 제품의 메탈 및 멀티 증착과 함께 제2챔버에서 증착 작업을 연속 수행하면서 제품의 생산 수량을 증대시켜 상품성과 제조 생산성을 우수하게 제공하는 효과를 갖는 것이다.The present invention relates to a first chamber for installing a product carrier in a two-beam method of depositing a conventional single chamber, a second chamber for e-beam deposition on a product of a product carrier, and a third to recover a product carrier. Since the chambers are arranged inline in parallel, the installation, deposition, and recovery of products are performed sequentially by the first, second, and third chambers. It is to have an effect of providing excellent productivity and manufacturing productivity by increasing the production quantity of the product while performing the continuous.

도 1은 본 발명의 정면 구성도.
도 2는 본 발명의 구성도.
1 is a front configuration diagram of the present invention.
2 is a block diagram of the present invention.

이하, 상기한 본 발명의 바람직한 실시 예를 첨부도면을 참조하여 구체적으로 살펴보기로 한다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

본 발명 이-빔 방식의 인라인형 증착장치는 도 1 내지 도 2에 도시된 바와 같이, 제품이 장착된 케리어(5)를 설치하는 제1챔버(10)와,As shown in FIGS. 1 and 2, the two-beam type inline deposition apparatus of the present invention includes: a first chamber 10 for installing a carrier 5 on which a product is mounted;

상기 제1챔버에서 이동된 케리어(5)의 제품을 증착부(70)에서 증발되는 소재에 의해 이-빔 방식으로 증착하는 제2챔버(20)와,A second chamber 20 for depositing a product of the carrier 5 moved in the first chamber by an e-beam method by a material evaporated from the deposition unit 70;

상기 제2챔버에서 증착 완료되어 이동된 케리어(5)를 회수하는 제3챔버(30)를 인라인 방식으로 병렬 구성하되,In parallel configuration of the third chamber (30) for recovering the carrier (5) is completed in the second chamber and moved, in an inline manner,

상기 제1,2,3챔버(10)(20)(30)에는 내부의 진공이나 진공파기를 위해 각각 설치되는 진공펌프와, 케리어(5)를 순차 이동 이동시키는 이동레일부(40)와, 상기 제1,2,3챔버(10)(20)(30) 사이에서 개폐 작동하는 게이트 밸브(51)(52)를 설치 구성하여 이루어진다.The first, second and third chambers 10 and 20 and 30 have a vacuum pump which is installed for the internal vacuum or the vacuum breaker, and a moving rail part 40 for sequentially moving the carrier 5, The first, second, third chambers 10, 20, 30 between the gate valve 51, 52 for opening and closing the operation is installed and configured.

이때, 상기 이동레일부(40)는 케리어(5)를 제1,2,3챔버(10)(20)(30)로 순차 이동한 후 다시 제1챔버(10)로 복귀하도록 무한 궤도 형태로 형성함이 바람직하다.At this time, the moving rail portion 40 is moved to the first, second, third and third chambers 10, 20, 30 in sequence to move the carrier 5 in the form of an endless track so as to return to the first chamber 10 again. It is preferable to form.

또한, 상기 증착부(70)의 소재는 굴절율이 다른 물질(예를 들면 Ti02, SiO2, ZrO2) 등과 메탈 물질(Ni, Cr, Al) 등을 이용한 이-빔 방식으로 메탈 및 멀티 증착이 가능하여 다양한 칼라 구현은 물론 보는 각도에 따라 색상이 변하거나 반짝이는 광택 구현이 가능하다.In addition, the material of the deposition unit 70 is capable of metal and multi-deposition by the two-beam method using a material having a different refractive index (for example Ti02, SiO2, ZrO2) and metal materials (Ni, Cr, Al), etc. Various colors can be realized, as well as color change or shiny gloss depending on the viewing angle.

미설명부호로서, 80은 케리어를 회전 구동시키는 회전구동부, 90은 제2챔버(20)의 약품 보충부를 나타내는 것이다.As the reference numeral, reference numeral 80 denotes a rotary drive unit for rotating the carrier, and 90 denotes a chemical refilling unit of the second chamber 20.

다음은 상기와 같이 구성되는 본 발명의 작동 및 작용에 대해 설명하기로 한다.Next will be described the operation and action of the present invention configured as described above.

먼저 증착하고자 하는 제품을 준비하여 케리어(5)에 장착한다.First, a product to be deposited is prepared and mounted on the carrier (5).

그리고 상기 케리어(5)를 제1챔버(10)의 전면 도어부 개방으로 이동레일부(40)에 설치한 후 도어부를 폐쇄한다.Then, the carrier 5 is installed on the moving rail part 40 by opening the front door part of the first chamber 10 and then closing the door part.

이 상태에서 상기 제1챔버(10) 내부는 진공펌프에 의해 증착 가능한 진공도(5.0 E-5 torr)까지 펌핑하게 된다.In this state, the inside of the first chamber 10 is pumped up to a vacuum degree (5.0 E-5 torr) that can be deposited by a vacuum pump.

그리고 제1챔버의 진공이 완료되면, 제1챔버(10)와 제2챔버(20) 사이의 게이트 밸브(51)를 개방하고 상기 제1챔버에 있던 케리어(5)를 이동레일부(40)에 의해 제2챔버(20)로 이동시킨다.When the vacuum of the first chamber is completed, the gate valve 51 between the first chamber 10 and the second chamber 20 is opened, and the carrier 5 in the first chamber is moved to the moving rail part 40. Move to the second chamber 20.

이때 상기 제2챔버는 증착 가능한 진공 상태를 유지하고 있고, 제1챔버에서 이동된 케리어의 제품은 종래 이-빔 방식과 동일한 방법으로 제품의 증착 작업을 행한다.At this time, the second chamber maintains a vacuum capable of depositing, and the product of the carrier moved from the first chamber performs the deposition of the product in the same manner as the conventional e-beam method.

즉, 상기 케리어(5)를 회전구동부(80)에 의해 회전하면서 증착부(70)에서 증발되는 소재에 의해 이-빔 방식으로 제품 표면을 증착하게 된다.That is, while rotating the carrier 5 by the rotary drive unit 80 to deposit the product surface in a two-beam method by the material evaporated in the deposition unit 70.

이때, 상기 소재는 굴절율이 다른 물질(예를 들면 Ti02, SiO2, ZrO2) 등과 메탈 물질(Ni, Cr, Al) 등을 이용한 메탈 및 멀티 증착으로 다양한 칼라 구현은 물론 보는 각도에 따라 색상이 변하거나 반짝이는 광택 구현이 가능하게 되는 것이다.At this time, the material is a metal and multi-deposition using a material having a different refractive index (for example, Ti02, SiO2, ZrO2) and metal materials (Ni, Cr, Al) and the like to implement a variety of colors as well as color changes depending on the viewing angle It is possible to realize shiny luster.

이와 같이 상기 제2챔버에서 이-빔 방식으로 증착 작업이 진행되는 과정중에 상기 제1챔버의 진공 상태를 파기하고, 다시 새로운 제품이 장착된 케리어(5)를 이동레일부(40)에 설치한 후, 전술한 바와 같이 증착 가능한 진공도까지 펌핑 작업하여 준비시킨다.In this way, during the deposition process in the second chamber by the e-beam method, the vacuum state of the first chamber is discarded, and the carrier 5 on which the new product is mounted is installed on the moving rail part 40. After that, it is prepared by pumping to a vacuum degree capable of deposition as described above.

그리고 상기 제2챔버에서 증착 작업이 완료되면, 제2챔버(20)와 제3챔버(30) 사이의 게이트 밸브(52)를 개방하고 상기 제2챔버에 있던 케리어(5)를 이동레일부(40)에 의해 제3챔버(30)로 이동시킨다.When the deposition operation is completed in the second chamber, the gate valve 52 between the second chamber 20 and the third chamber 30 is opened and the carrier 5 in the second chamber is moved to the moving rail part ( 40 to move to the third chamber (30).

이때, 상기 제3챔버(30)는 진공 상태이다.At this time, the third chamber 30 is in a vacuum state.

또한, 상기 제1챔버(10)에 대기중이던 새로운 제품이 장착된 케리어(5)는 제2챔버(20)로 이동시킨다.In addition, the carrier 5 mounted with the new product in the first chamber 10 is moved to the second chamber 20.

상기와 같이 증착 완료된 케리어를 제3챔버로 이동 시키면, 게이드 밸브(52)를 차단하고 제3챔버(30)의 진공을 파기한 후, 도어부를 개방하여 케리어(5)를 회수하므로 증착 완료된 제품을 얻게 되는 것이다.Moving the deposited carrier to the third chamber as described above, the gate valve 52 is blocked and the vacuum of the third chamber 30 is discarded, and the door part is opened to recover the carrier 5 so that the deposited product is removed. You will get

이와 같이 상기 제1,2,3챔버(10)(20)(30)의 케리어 설치, 증착, 케리어 회수 과정이 연속 작업으로 이루어지게 되는 것이다.As such, the carrier installation, deposition, and carrier recovery of the first, second, and third chambers 10, 20, 30 are performed in a continuous operation.

따라서, 본 발명은 종래 단일 챔버로 증착 작업하는 이-빔 방식에서 케리어의 설치, 증착, 케리어의 회수를 제1,2,3챔버에 의해 순차 작업하므로 종래 이-빔 방식의 장점인 제품의 메탈 및 멀티 증착과 함께 제2챔버에서 제품의 증착 작업을 연속 수행하면서 제품의 생산 수량을 증대시키게 되는 것이다.Accordingly, the present invention is a metal of the product which is an advantage of the conventional two-beam method because the installation of the carrier, the deposition, the number of carriers by the first, second and third chambers sequentially work in the two-beam method of the conventional deposition process in a single chamber And increasing the production quantity of the product while continuously performing the deposition operation of the product in the second chamber together with the multi deposition.

5: 케리어
10: 제1챔버 20: 제2챔버
30: 제3챔버 70: 증착부
51,52: 게이트 밸브
5: carrier
10: first chamber 20: second chamber
30: third chamber 70: vapor deposition
51,52: gate valve

Claims (2)

이-빔 방식의 증착장치에 있어서,
제품이 장착된 케리어(5)를 설치하는 제1챔버(10)와,
상기 제1챔버에서 이동된 케리어(5)의 제품을 증착부(70)에서 증발되는 소재에 의해 이-빔 방식으로 증착하는 제2챔버(20)와,
상기 제2챔버에서 증착 완료되어 이동된 케리어(5)를 회수하는 제3챔버(30)를 인라인 방식으로 병렬 구성하되,
상기 제1,2,3챔버(10)(20)(30)에는 내부의 진공이나 진공파기를 위해 각각 설치되는 진공펌프와, 케리어(5)를 순차 이동 이동시키는 이동레일부(40)와, 상기 제1,2,3챔버(10)(20)(30) 사이에서 개폐 작동하는 게이트 밸브(51)(52)를 설치 구성하여 이루어진 것을 특징으로 하는 이-빔 방식의 인라인형 증착장치.
In the e-beam deposition apparatus,
A first chamber 10 for installing a carrier 5 on which a product is mounted;
A second chamber 20 for depositing a product of the carrier 5 moved in the first chamber by an e-beam method by a material evaporated from the deposition unit 70;
In parallel configuration of the third chamber (30) for recovering the carrier (5) is completed in the second chamber and moved, in an inline manner,
The first, second and third chambers 10 and 20 and 30 have a vacuum pump which is installed for the internal vacuum or the vacuum breaker, and a moving rail part 40 for sequentially moving the carrier 5, 2. The two-beam inline deposition apparatus of claim 1, wherein the first and second chambers (10, 20, 30) are installed and configured to open and close a gate valve (51) (52).
제1항에 있어서,
상기 이동레일부(40)는 케리어(5)를 제1,2,3챔버(10)(20)(30)로 순차 이동한 후 다시 제1챔버(10)로 복귀하도록 무한 궤도 형태로 형성하여 이루어진 것을 특징으로 하는 이-빔 방식의 인라인형 증착장치.
The method of claim 1,
The moving rail part 40 is formed in an endless track shape so as to sequentially move the carrier 5 to the first, second, and third chambers 10, 20, 30, and then return to the first chamber 10 again. Two-beam type inline deposition apparatus, characterized in that made.
KR1020100059870A 2010-06-24 2010-06-24 Vapor deposition machine of e-beam type KR20110139819A (en)

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