KR20110133880A - Electronic card and manufacturing method thereof - Google Patents

Abstract

PURPOSE: An electronic card and manufacturing method thereof are provided to prevent the damage of a display device by reducing pressure through a protection layer. CONSTITUTION: A semiconductor device(110) is mounted on a rear printing layer(101b). A display device(120) is connected to the semiconductor device by being mounted on the rear printing layer. A protection layer is formed on the display device. A bonding layer(130) is formed on the rear printing layer and the semiconductor device. A front printing layer(101a) is arranged on the bonding layer and the protection layer. The protection layer is formed as a gel type.

Description

Electronic card and manufacturing method thereof

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic card and a method of manufacturing the same. More particularly, the present invention relates to an electronic card having a protective layer capable of suppressing damage or damage to a display device due to external mechanical stress. A card and a manufacturing method thereof.

In general, a credit card is a type of plastic card that is issued as a proof of probation for a certain period of time for the purchase of goods or other cash use to a registered member. These credit cards are provided with various types of credit cards differentiated according to the customer's credit rating.

Due to the development of technology, the above-mentioned credit cards have been mainstream in the form of cards adopting magnetic elements. However, in recent years, various cards and devices are mounted on the cards, and the credit card function is based on the mounted chips and devices. Is supported. Furthermore, credit cards equipped with display elements have been introduced to allow a user to visually check various information embedded in the chip. The display element mounted on the card is miniaturized and thinned to fit the intended use and mounted on the card.

However, the display elements mounted on the card are often subjected to mechanical stress such as pressure depending on the environment in which the card is stored or used. For example, a card in which a display element is disposed is generally stored without a separate case such as a wallet or a pocket, so that when the user performs an operation of picking up or inserting a card from the wallet or pocket for use of the card, the display element is disposed. A certain amount of pressure is applied to the entire card area, including the area.

In this case, when the above-mentioned periodic and predetermined pressure is intensively applied to a specific point of the display element, the display element having a characteristic vulnerable to pressure may perform a function as a display element by a change in data displayed by the applied pressure. There is a problem of missing or damaged.

Accordingly, in order to solve the above problems, the present invention provides a protective layer for protecting the display device on the region where the display device is disposed, thereby delaying or damaging the display device by dispersing or buffering the pressure applied to the display device. The present invention provides an electronic card and a method for providing the same.

In order to achieve the above object, the present invention discloses an electronic card comprising a back printing layer, a semiconductor device, a display device, a protective layer, an adhesive layer, a top printing layer. The semiconductor device is mounted on the back printing layer, and the display device is mounted on the back printing layer and electrically connected to the semiconductor device. The protective layer is formed on the display element, the adhesive layer is formed on the back printing layer and the semiconductor device, and the top printing layer is disposed on the adhesive layer and the protective layer.

The present invention also provides a process of arranging a back printing layer, mounting a display element on the back printing layer, applying a curable resin on a back printing layer except for a region in which the display element is disposed, and the curable resin. Disclosed is an electronic card manufacturing method including a process of disposing a top printing layer on a surface, and curing the curable resin into an adhesive layer. In this case, a process of forming a protective layer on the display element between the process of mounting the display element and the process of changing to the adhesive layer is performed.

Here, in the electronic card manufacturing method of the present invention, the forming of the protective layer is a buffer in the empty space formed by the display element and the top printing layer according to the arrangement of the top printing layer before curing the curable resin. Injecting the step, the process of disposing the protective structure having a height higher than the length in the height direction of the display element surrounding the display element in a hollow cylindrical shape before applying the curable resin, curing the curable resin A process of injecting a buffer into an empty space generated by placing one surface of the upper printing layer in contact with the upper surface of the protective structure, and removing the jelly having a certain viscosity before applying the curable resin to the display device. It may include at least one of the process of arranging to cover.

According to the present invention, a protective layer is disposed on a specific point of a display element disposed on one side of an electronic card, for example, above the display element to assist in dispersing or buffering pressure or shock applied to the display element, thereby displaying and displaying correct data. Can prevent damage.

1 is a view showing an integrated appearance of an electronic card according to an embodiment of the present invention.
FIG. 2 is a diagram illustrating some components of an electronic card according to an embodiment of the present disclosure so as to be more easily recognized.
FIG. 3 is a cross-sectional view taken along the cutting line “AA ′” of FIG. 2.
4 to 7 are views for explaining an electronic card manufacturing method according to a first embodiment of the present invention.
8 and 9 are diagrams for describing an electronic card manufacturing method according to a second embodiment of the present invention.
10 is a view for explaining a method of manufacturing an electronic card according to a third embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, only the parts necessary for understanding the operation according to the embodiment of the present invention will be described, it should be noted that the description of other parts will be omitted so as not to distract from the gist of the present invention.

The terms or words used in the specification and claims described below should not be construed as being limited to the ordinary or dictionary meanings, and the inventors are appropriate to the concept of terms in order to explain their invention in the best way. It should be interpreted as meanings and concepts in accordance with the technical spirit of the present invention based on the principle that it can be defined. Therefore, the embodiments described in the present specification and the configuration shown in the drawings are only the most preferred embodiments of the present invention, and do not represent all of the technical ideas of the present invention, and various alternatives may be substituted at the time of the present application. It should be understood that there may be equivalents and variations.

1 is a view schematically showing an electronic card exterior integrated according to an embodiment of the present invention, Figure 2 is a view showing in more detail the configuration of the exterior of the electronic card according to an embodiment of the present invention, Figure 3 is a view of FIG. It is a figure which shows the cross section cut along the cutting line "AA`."

1 to 3, the electronic card 100 of the present invention includes a back printing layer 101b, a top printing layer 101a, a semiconductor device 110, a display device 120, an adhesive layer 130, and the like. The protective layer 140 may be included.

In the electronic card 100 of the present invention having the configuration as described above, the protective layer 140 is disposed on the display element 120 to disperse external pressure or shock generated at a position where the display element 120 is disposed. Can be buffered. Accordingly, the electronic card 100 of the present invention can prevent an image change or damage to the display element 120 due to an external pressure applied to the display element 120. Hereinafter, each configuration will be described in detail.

The back printing layer 101b may be a substrate formed of a material such as PET having a thickness of several tens of microns that is capable of bending and has insulation. The semiconductor device 110, the display device 120, an antenna coil connected to the semiconductor device 110, a battery for power supply, and other wirings may be mounted on the back printing layer 101b. In the drawings, the markings of the antenna coil, the battery, and other wirings are omitted for convenience of description. The battery is a configuration that can be omitted according to the designer's intention. Meanwhile, after each of the above-described components are mounted on the rear printing layer 101b, a curable resin may be applied onto the components and the rear printing layer 101b. In this case, a reflective plate may be additionally disposed at a position where the display element 120 is disposed on the back printing layer 101b.

The upper printing layer 101a may use a film formed of a polymer-based material capable of bending. The top printing layer 101a is placed on top of the curable resin after the curable resin is applied on the back printing layer 101b. The top printing layer 101a may be formed of a transparent material as a whole. An area in which the display device 120 is disposed in the top printing layer 101a may directly contact the protective layer 140. Meanwhile, bubbles may be generated between the adhesive layers 130 in the process of covering the upper printing layer 101a on the curable resin, and in order to remove the bubbles, a roller is used at one end of the upper printing layer 101a from the other end to be fixed. The bubble removing operation can be performed while pressurizing at the pressure of.

The semiconductor device 110 may be mounted on the back printing layer 101b in the form of a chip on board (COB). The semiconductor device 110 may be connected to an antenna coil, and is configured to receive an RF electromagnetic signal emitted from a terminal based on the antenna coil and perform data processing corresponding thereto. The semiconductor device 110 may receive an RF electromagnetic signal through the antenna coil and use the received RF electromagnetic signal as a power source.

The display element 120 may be any one of various thin film display elements. That is, the display device 120 may be a liquid crystal display (LCD), a light emitting diode (LED), an organic light emitting diode (OLED), or an E-ink. When the LED is mounted, the power is supplied from the radio frequency conversion coil antenna to emit LEDs or other light emitters, and the data may be displayed by irradiating the light onto a thin film display film. The display element 120 is preferably formed of a flexible display element in consideration of the use characteristics of the electronic card 100.

The adhesive layer 130 is a layer formed by curing the curable resin applied on the upper surface when the semiconductor device 110 and the display device 120 are mounted on the back printing layer 101b. That is, the curable resin is coated on the back printing layer 101b and the top printing layer 101a is disposed thereon, and after the pressing process is completed, UV irradiation or a predetermined temperature is provided to cure the curable resin. The adhesive layer 130 may be formed. The adhesive layer 130 of the cured resin becomes a body of the electronic card 100. The curable resin according to the present invention uses heat or UV curable resins, and in the case of thermosetting resins, any one of polymer-based resins may be used.

The protective layer 140 may be an air layer or a gas layer containing an inert gas, a jelly layer generated with a buffer, or the like for protecting the display device 120 from an external impact. The protective layer 140 is disposed between the top printing layer 101a and the display element 120 to provide a function of alleviating pressure or shock applied from the outside of the card. Accordingly, the protective layer 140 of the present invention protects the display element 120 in the electronic card 100 so that the card can be used for a long time. When the protective layer 140 is disposed on the display element 120 and there is pressure or an impact from the outside of the back printing layer 101b and the top printing layer 101a, the force is applied to the display element 120. It will not be delivered directly to the air, thus relieving shock or pressure. In this case, the protective layer 140 transmits the force in an isotropic manner to distribute the force evenly as a whole, and can significantly reduce the amount of impact directly applied to a part of the display element 120.

On the other hand, the electronic card 100 has a hollow cylindrical shape to surround the display element 120 and is formed higher than the height in the height direction of the display element 120 and is in contact with the top printing layer 101a to protect the protective layer 140. It may further include a protective structure forming a space provided. This protective structure will be described later in more detail with reference to FIG. 6.

In the above, each configuration and role of the electronic card 100 according to an embodiment of the present invention have been described. Hereinafter, a method of manufacturing the above-described electronic card 100 will be described in more detail with reference to the accompanying drawings.

4 to 7 are diagrams for describing a method of manufacturing an electronic card according to a first embodiment of the present invention.

First, referring to FIG. 4, a rear printing layer 101b is provided. The size of the backside printing layer 101b may be substantially provided in a size for manufacturing several to tens or hundreds of electronic cards 100 at a time in a manufacturing process. The back printing layer 101b may be formed of polyvinyl chloride (PVC), glycol-modified polyethylene terephthalate (PET-G), or a PET material.

Next, referring to FIG. 5, a signal line connecting the semiconductor device 110, the display device 120, the semiconductor device 110, and the display device 120 to the back printing layer 101b may be additionally configured. For example, an antenna coil, a battery, or the like may be mounted. In more detail, after the rear printing layer 101b is provided, the production of the electronic card 100 is printed on the rear printing layer 101b, and the electronic card 100 is printed in each printed electronic card 100 area. The semiconductor device 110 for the function, the alignment mark for the position where the display element 120 and other components are to be mounted, or the like may be printed or disposed.

In addition, signal lines and antenna coils that may be connected to the semiconductor device 110 to be mounted on the top surface of the rear printing layer 101b may be first mounted or printed on the rear printing layer 101b. When signal lines, antenna coils, and the like are formed on the back printing layer 101b, the semiconductor device 110 is mounted to be electrically connected to the signal lines, the antenna coil, etc. along the alignment mark. In addition, the display element 120 is mounted on the back printing layer 101b so as to be electrically connected to the signal lines. Here, a battery or the like may be further disposed on the back printing layer 101b. However, when the electronic card 100 receives power at a radio frequency based on the antenna coil to supply power, the mounting of the battery configuration may be omitted.

The order of printing and mounting of the semiconductor device 110, the display device 120, and other signal lines described above may be changed according to a designer's intention. That is, the semiconductor device 100 and the display device 120 may be first mounted on the back printing layer 101b, and then other signal lines may be printed and mounted. Therefore, in the manufacturing process, the semiconductor device 110 and the display device 120 are mounted on the rear printing layer 101b, but other components are printed or mounted so that the semiconductor device 110 and the display device 120 are electrically connected to each other. It should be understood as a process that is.

Next, referring to FIG. 6, a protective structure 121 for forming the protective layer 140 on one side of the display element 120 may be disposed on the back printing layer 101b. In this case, the protective structure 121 may be disposed on the rear printing layer 101b in a form that surrounds the outer portion of the display element 120. The protective structure 121 may have a hollow cylindrical shape, and the hollow shape of the protective structure 121 may have a axial length higher than a lateral height of the display element 120 and may be disposed to have a structure surrounding the display element 120. . That is, since only the cross section is shown in the drawing, the protection structure 121 for forming the protective layer 140 on the upper portion of the display element 120 is illustrated as being placed on both sides of the display element 120. By being manufactured and disposed to surround the display device 120, a predetermined empty space in which the protective layer 140 may be formed may be formed.

Next, referring to FIG. 7, a material for forming the protective layer 140 on the protective structure 121 of the display device 120, for example, an air layer or a gas layer by an inert gas included in the air layer at a predetermined concentration, may be Various materials may be applied to distribute the force by isotropically transferring the forces acting from the outside, such as a jelly layer having a viscosity, a liquid layer formed above a certain value of intermolecular kinetic energy, and isotropic among the internal molecules. After the protective layer 140 is formed on the inside of the protective structure 121 and the upper layer of the display element 120, the curable resin is applied on the back printing layer 101b, and the top printing layer 101a is formed on the curable resin. Is placed. In this case, bubbles may be generated between the curable resins according to the arrangement of the top printing layer 101a, and a process for removing bubbles may be added. Thereafter, UV curing or a process of applying a predetermined temperature may be performed to cure the curable resin. In this case, the curable resin may be adjusted so as not to be coated on the protective layer 140.

Meanwhile, in the process of forming the protective layer 140, when the material forming the protective layer 140 has fluidity at room temperature and basic atmospheric pressure, such as air, the method of manufacturing the electronic card 100 of the present invention may include the display element 120. After applying the curable resin to a region excluding the upper portion, the top printing layer 101a may be disposed to cover the upper portion of the curable resin and the display element 120. In this process, the electronic card manufacturing method may include injecting a material for forming the protective layer 140 into an empty space formed of the top printing layer 101a, the display element 120, and the protective structure 121. have.

Accordingly, the electronic card 100 of the present invention provides a protective layer 140 in which a buffer is injected into the upper layer of the display element 120, thereby applying a pressure applied to a specific point of the display element 120 through the protective layer 140. The pressure can be buffered by isotropic dispersion or absorption. For example, when pressure is applied to a specific point of the protective layer 140 provided on the upper layer of the display element 120, the pressure transmitted through the specific point of the upper printing layer 101a is applied to the protective layer 140 around the specific point. It is evenly distributed throughout the prepared material. Accordingly, the pressure started at a specific point is not directly transmitted to the display element 120, but diffuses through the protective layer 140, so that the entire display element 120 is evenly distributed. Accordingly, damage to the display element 120 may be prevented through pressure distribution transmitted to the display element 120.

8 and 9 are diagrams for describing an electronic card manufacturing method according to a second embodiment of the present invention.

Prior to the description, the electronic card manufacturing method according to the second embodiment of the present invention is based on a state in which the semiconductor device 110, the display device 120, and other components are mounted on the back printing layer 101b of FIG. 5. Let's explain.

Referring to FIG. 8, the protective layer 140 is formed by disposing a gel-type buffer so as to cover the display element 120 by a predetermined thickness. Here, the gel buffer is a material having a viscosity of a predetermined or more, and when disposed on the display element 120, preferably has a viscosity covering the display element 120 in a dome shape, and considering the adhesive layer 130. The buffer of the type may have a high viscosity such that it does not flow to the side of the display element 120. In this case, when the buffer is formed of the protective layer 140 having a high viscosity, since it may have a possibility that it can not properly disperse the pressure of a specific point applied from the outside, even if the jelly-type buffer is a high viscosity It is preferable to adopt a viscosity that isotropically disperses with respect to pressure.

Next, referring to FIG. 9, a curable resin is coated on the back printing layer 101b provided with the protective layer 140 to cover the display element 120. And the upper surface printing layer 101a is arrange | positioned on curable resin in the state in which curable resin was apply | coated. In addition, a process of applying a temperature for curing UV rays or curing may be performed to cure the curable resin. In this case, a separate curable resin is not applied to the area where the protective layer 140 is formed, and the curable resin is adjusted to be applied only to a region other than the protective layer 140, and then an upper surface printing layer (on the top of the curable resin and the protective layer 140) 101a) may be disposed. The electronic card manufacturing method of the present invention may add a roller process or the like to remove bubbles that may occur while the top printing layer 101a is disposed on the curable resin upper layer. At this time, it is preferable to prevent the curable resin from being pushed between the protective layer 140 and the top printing layer 101a by performing rolling around the region where the display element 120 is disposed in the roller process.

In the protective layer 140 formed as described above, when pressure is applied at a specific point on the upper side of the display element 120, the transmitted pressure is dispersed according to the form in which the protective layer 140 is disposed. Along the layer 140 may be transferred to the back printing layer 101b. However, since the pressure transmitted along the protective layer 140 may be concentrated in the corner region of the display element 120, damage to the corner region of the display element 120 may proceed rapidly. Accordingly, the thickness of the protective layer 140 formed in the corner region of the display device 120 of the jelly-type protective layer 140 may be adjusted so as not to be thinner than other regions.

10 is a view for explaining a method of manufacturing an electronic card according to a third embodiment of the present invention.

Prior to the description, the electronic card manufacturing method according to the third exemplary embodiment of the present invention is based on a state in which the semiconductor device 110, the display device 120, and other components are mounted on the back printing layer 101b of FIG. 5. This will be described.

Referring to FIG. 10, in the method of manufacturing an electronic card of the present invention, the semiconductor device 110, the display device 120, and the like are mounted on the back printing layer 101b, and the back printing layer 101b and the semiconductor device ( 110) may be applied to cover the curable resin. In this case, the curable resin may be adjusted so as not to be applied around the display element 120.

When the coating of the curable resin is completed, an upper surface printing layer 101a may be disposed on the curable resin upper layer. In this case, since the curable resin is not applied to the upper layer of the display element 120, the curable resin applied to the entire rear printing layer 101b except for the upper layer of the display element 120 and the upper print layer 101a are engaged with the display element 120. ) And an empty space may be formed between the top printing layer 101a. The protective layer 140 may be formed by injecting a buffer using the injector 20 into the empty space thus formed. In this case, the shape of the protective layer 140 may be changed according to the pressure for injecting the buffer to form the protective layer 140 and the viscosity of the curable resin. After the buffer injection is completed, the adhesive layer 130 may be formed through a curing process of the curable resin. In this process, the electronic card 100 may use the air layer filled in the empty space formed without performing a separate buffer injection process as the protective layer 140.

As described above, the electronic card 100 of the present invention provides a protective layer 140 on the display element 120, disperses direct pressure that may be applied to the display element 120, and concentrates on a specific point. It is possible to prevent the display element 120 from bleeding or torsion, which may occur due to the pressure. Further, the electronic card 100 of the present invention can prevent damage to the display element 120.

Meanwhile, the electronic card 100 may further have a magnetic tape attached to the back printing layer 101b, and other hologram images may be placed on the back printing layer 101b or the top printing layer 101a. Can be used selectively depending on the type of.

The above-described electronic card 100 preferably employs a flexible display device that is free from damage due to its flexible display element. When the LCD is employed, the liquid crystal may use a micro liquid crystal cell LCD formed of micro-sized cells.

The electronic card 100 according to the present invention may provide a contact and contactless information input and output interface, and provides a function to transmit and receive information in the card to a contact or contactless reader, employee ID and access control that requires security It can be used for transportation or for transportation (prepaid and postpaid transportation card) and for parking.

The electronic card 100 of the present invention is a card including the display element 120, a contact type (ISO-7816 Contact IC Card), a non-contact type (ISO-14443 Type A / B Contactless Card or Remote Coupling Communication Card), Magnetic card (MSR: Magnetic Stripe Read), RFID-Card, TAG (ISO-15963,15693) may be produced in at least one form.

100: e-card 101a: top printing layer
101b: rear printing layer 110: semiconductor device
120: display element 130: adhesive layer
140: protective layer 20: injector

Claims (9)

Rear printing layer;
A semiconductor device mounted on the back printing layer;
A display element mounted on the back printing layer and electrically connected to the semiconductor element;
A protective layer formed on the display element;
An adhesive layer formed on the back printing layer and the semiconductor element;
And a top printing layer disposed above the adhesive layer and the protective layer. The method of claim 1,
The protective layer
An electronic card, characterized in that formed in a gel type having a certain viscosity. The method of claim 1,
The protective layer
An electronic card, which is an air layer or an inert gas layer. The method of claim 1,
A protective structure is formed in a hollow cylindrical shape surrounding the periphery of the display element and higher than the height in the height direction of the display element.
The protective card is formed inside the protective structure. Placing a rear print layer;
Mounting a display element on the back printing layer;
Applying a curable resin on a backside printing layer except for an area where the display element is disposed;
Disposing a top printing layer on the curable resin;
And curing the curable resin to change it into an adhesive layer.
And forming a protective layer over the display element between mounting the display element and changing the adhesive layer to the adhesive layer. The process of claim 5, wherein the forming of the protective layer is performed.
And injecting a buffer into an empty space formed by the display element and the top printing layer according to the arrangement of the top printing layer before curing the curable resin. The process of claim 5, wherein the forming of the protective layer is performed.
Arranging a protective structure having a height greater than a height in a height direction of the display element and surrounding the periphery of the display element in a hollow shape before applying the curable resin; Way. The process of claim 7, wherein the forming of the protective layer is performed.
Injecting a buffer into the empty space created by arranging one surface of the top printing layer to be in contact with the upper surface of the protective structure before curing the curable resin. . The process of claim 5, wherein the forming of the protective layer is performed.
And disposing a jelly having a predetermined viscosity so as to cover the display element before applying the curable resin.

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