KR20110132059A - Led lamp - Google Patents

Led lamp Download PDF

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Publication number
KR20110132059A
KR20110132059A KR1020100051860A KR20100051860A KR20110132059A KR 20110132059 A KR20110132059 A KR 20110132059A KR 1020100051860 A KR1020100051860 A KR 1020100051860A KR 20100051860 A KR20100051860 A KR 20100051860A KR 20110132059 A KR20110132059 A KR 20110132059A
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South Korea
Prior art keywords
led
ceiling
base body
induction coil
induction
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KR1020100051860A
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Korean (ko)
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KR101151204B1 (en
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심현섭
김정윤
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심현섭
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/02—Wall, ceiling, or floor bases; Fixing pendants or arms to the bases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/03—Lighting devices intended for fixed installation of surface-mounted type
    • F21S8/033—Lighting devices intended for fixed installation of surface-mounted type the surface being a wall or like vertical structure, e.g. building facade
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Abstract

PURPOSE: An LED lamp using a contactless power supply method is provided to reduce the danger of power outage or fire by preventing direct contact between a socket and a socket base. CONSTITUTION: A ceiling or a wall fixing unit(1) includes an induced electromotive force part which is provided with common electricity. A base body(20) is combined with the induced electromotive force part at a non-contact state. An LED module board(30) exposes an LED chip into a dot form and emits light. A transparent light emitting tube(50) covers up the LED chip of LED module board. The transparent light emitting tube emits the light, which is emitted from the LED chip, to the outside.

Description

비접촉식 전원 공급 방식을 이용한 엘이디 조명등{LED LAMP}LED lighting lamp using non-contact power supply method {LED LAMP}

본 발명은 비접촉식 전원 공급 방식을 이용한 엘이디 조명등에 관한 것이며, 더욱 상세하게는, 엘이디 조명등의 베이스 몸체와 벽체 또는 천장에 설치된 벽체 또는 천장 고정부를 유도 기전력을 이용한 비접촉식의 전원 공급 방법을 활용하도록 함으로써, 베이스 몸체와 벽체 또는 천장 고정부의 직접적인 접촉을 피하여 그 접촉부위에 누적된 습기 등에 의해 발생되는 접촉 불량이나 전기 누전에 의한 정전이나 화재의 위험을 대폭 줄일 수 있는 비접촉식 전원 공급 방식을 이용한 엘이디 조명등에 관한 것이다.The present invention relates to an LED lighting lamp using a non-contact power supply method, and more particularly, by using a non-contact power supply method using the induced electromotive force to the base body and the wall or ceiling fixing unit installed on the wall or ceiling. LED lighting using a non-contact power supply system that can greatly reduce the risk of power failure or fire caused by poor contact or electrical leakage caused by moisture accumulated in the contact area, avoiding direct contact between the base body and the wall or ceiling fixing part. It is about.

일반적으로 조명등은 대표적으로 형광등 또는 할로겐 등이 건축물의 천장 또는 벽체에 설치되어 구현된다. 이와 같은, 형광등 또는 할로겐 등은 실내등으로 보편적인 것에 반하여 소비전력이 크고, 비교적 수명이 짧은 조명만을 제공할 수 밖에 없는 단점이 있다.In general, the lighting is typically implemented by installing a fluorescent lamp or a halogen lamp on the ceiling or wall of the building. As described above, fluorescent lamps or halogen lamps have a disadvantage in that they provide only high-power, relatively short-life lighting, as opposed to general lamps.

이러한 높은 소비전력 및 짧은 수명을 해결하고자 최근에는 형광등 또는 할로겐 등에 비해 낮은 소비전력으로 수명을 대폭 연장할 수 있는 엘이디(LED) 조명등이 다양한 형태로 출시되고 있다.Recently, in order to solve such high power consumption and short lifespan, LED lighting lamps, which can greatly extend the lifespan with low power consumption compared to fluorescent lamps or halogen lamps, have been released in various forms.

상기한 엘이디(LED)는 특정한 화합물로 된 반도체의 특성을 이용하여 전기 에너지를 빛 에너지로 변환시키는 반도체 소자의 일종으로서, 광 변환 효율이 높기 때문에 소비전력이 매우 적으며, 광원이 소형이므로 소형화, 박형화 및, 경량화에 적합하면서도 무한 확장 설치가 가능하고, 수명이 반영구적으로 매우 길며(청색, 보라색, 또는 자외선 LED의 경우 수명은 대략 100,000 시간이고 백색 LED의 경우 대략 30,000 시간)이고, 열적 또는 방전 발광이 아니므로 예열이 불필요하여 응답 속도가 대단히 신속하고, 점등회로가 매우 간단하며, 방전용 기체 및 필라멘트를 사용하지 않으므로 내충격성이 크고 안전하며 환경오염 유발 요인이 적고, 고(高)반복 펄스 동작이 가능하며, 시신경의 피로가 덜하고, 풀 칼라의 구현이 가능하다는 장점이 있으므로, 휴대폰, 캠코더, 디지털 카메라 및 개인 휴대 정보 단말기(PDA) 등의 액정 디스플레이(LCD) 배면 조명(back light)용 광원, 신호등, 전광판, 차량 전조등 및 후미등, 각종 전자기기, 사무기기, Fax 기기 등의 디스플레이부 발광등, 리모콘이나 감시카메라의 야간조명, 적외선 통신용, 적녹청 픽셀(pixel)의 다양한 조합에 의한 옥외 광고판의 정보전달용 디스플레이용, 초정밀 전광판 디스플레이용, 고급 실내외 조명용으로 널리 사용되고 있으며, 특히 종래 LED의 일반적인 문제점이었던 저휘도 문제를 개선한 고휘도 LED가 상업적 규모로 시판됨으로 인하여 그 용도 및 사용처는 급속히 확대되고 있다.The LED is a type of semiconductor device that converts electrical energy into light energy using characteristics of a semiconductor made of a specific compound. The LED has very low power consumption due to high light conversion efficiency, and has a small light source. Suitable for thin and light weights, but with infinitely extended installation, very long lifetime semi-permanently (approximately 100,000 hours for blue, purple, or UV LEDs and approximately 30,000 hours for white LEDs), thermal or discharge Because it does not require preheating, the response speed is very fast, the lighting circuit is very simple, and because it does not use gas and filament for discharge, the impact resistance is large and safe, and the cause of environmental pollution is low, and high repeat pulse operation This is possible, the fatigue of the optic nerve is less, full color implementation is possible, mobile phones, cams In addition, display units such as light sources for LCD back light, digital cameras and personal digital assistants (PDAs), traffic lights, billboards, vehicle headlights and taillights, various electronic devices, office equipment, fax machines, etc. It is widely used for light emitting lamps, night light of remote control or surveillance camera, infrared communication, information display of outdoor billboards by various combinations of red and green pixels, high precision billboard display, and high quality indoor and outdoor lighting. As the high-brightness LED, which is a general problem of the low-brightness LED, is commercially available on a commercial scale, its use and application are rapidly expanding.

특히, 백색 LED는 액정 디스플레이(LCD) 배면 조명(back light)용 광원과 실내외 조명용으로 매우 유용하므로 그 사용 빈도는 급격히 증대되고 있으며 형광등에 의한 백열전구의 시장 축출 경향과 동일하게 오래지 않아 조명 시장을 석권하게 될 것으로 예상되고 있다.In particular, since white LEDs are very useful for liquid crystal display (LCD) back light sources and indoor / outdoor lighting, the use frequency is rapidly increasing, and the lighting market does not last as long as the trend of ousting incandescent bulbs by fluorescent lamps. It is expected to be.

한편, 최근에는 기존의 소켓 타입의 전구와 같은 형태의 엘이디 조명등이 출시되어 건축물 실내의 천장 또는 벽체에 설치된 소켓내에 종래의 전구와 동일한 형태로 삽입하여 일반적인 상용전원을 공급받아 엘이디가 발광할 수 있도록 하고 있다.On the other hand, LED lamps of the same type as conventional socket type bulbs have recently been released, and the LEDs can be inserted into a socket installed on a ceiling or a wall of an interior of a building in the same form as a conventional bulb so that the LED can emit light under general commercial power supply. Doing.

그러나, 종래의 엘이디 조명등이 반도체 공정실이나 원예작물 재배실 등과 같은 밀폐된 실내 공간의 천장 또는 벽체에 설치된 경우에는 그 베이스 몸체와 소켓이 항시 접촉된 상태로 구동될 수밖에 없으며, 그 접촉 부위에 수분이 침투하여 누적된 습기에 의해 전기 누전이나 오작동 등이 발생하여 접촉 불량에 따른 정전이나 화재의 위험이 매우 높은 문제점이 있었다.However, when the conventional LED lighting is installed on the ceiling or the wall of an enclosed indoor space such as a semiconductor processing room or a garden planting room, the base body and the socket must be driven in contact at all times. There is a problem that the electrical leakage or malfunction occurs due to the accumulated moisture penetrated and the risk of power failure or fire due to poor contact.

따라서, 본 발명의 목적은 엘이디 조명등의 베이스 몸체와 벽체 또는 천장에 설치된 벽체 또는 천장 고정부를 비접촉식의 유도전류를 통한 전원 공급 방법을 이용하도록 함으로써, 베이스 몸체와 벽체 또는 천장 고정부와의 직접적인 접촉을 피하여 그 접촉부위에 누적된 습기 등에 의해 발생되는 접촉 불량이나 전기 누전에 의한 정전이나 화재의 위험을 완전히 차단할 수 있는 비접촉식 전원 공급 방식을 이용한 엘이디 조명등을 제공하는 것이다.Accordingly, an object of the present invention is to directly contact the base body and the wall or ceiling fixing part by using a power supply method through a non-contact induced current through the base body and the wall or ceiling fixing part installed on the wall or ceiling. It is to provide an LED lighting using a non-contact power supply method that can completely block the risk of power failure or fire caused by poor contact or electrical leakage caused by moisture accumulated in the contact area.

상기 목적들을 달성하기 위한 본 발명에 따른 비접촉식 전원 공급 방식을 이용한 엘이디 조명등은, 실내 공간의 천장 또는 벽체에 형성되며, 상용 전원을 공급받는 유도 기전력부가 형성되는 천장 또는 벽체 고정부와; 일측에 상기 천장 또는 벽체 고정부의 유도 기전력부와 비접촉상태로 결합되며, 상기 유도 기전력부의 유도 기전력에 의해 유도 전류가 발생되는 유도 코일부가 형성되는 베이스 몸체와; 상기 베이스 몸체의 타측으로는 상기 유도 코일부와 전기적으로 연결되는 복수개의 엘이디 또는 엘이디 칩이 돗트(dot) 형태로 노출되어 광을 발광하도록 장착되는 엘이디 모듈판과; 상기 엘이디 모듈판의 상기 엘이디 또는 엘이디 칩을 커버하며, 상기 엘이디 또는 엘이디 칩으로부터 방출되는 광을 외부로 발광하기 위한 투명 발광관으로 이루어지는 것을 특징으로 한다.LED lighting using a non-contact power supply method according to the present invention for achieving the above object, the ceiling or wall fixing portion is formed on the ceiling or wall of the interior space, the induction electromotive force is supplied to receive commercial power; A base body coupled to one side of the ceiling or wall fixing part in an inductive contact with the induction electromotive unit, and having an induction coil unit for generating an induction current by the induction electromotive force of the induction electromotive unit; An LED module plate on the other side of the base body in which a plurality of LEDs or LED chips electrically connected to the induction coil unit are exposed in a dot form and mounted to emit light; Covering the LED or the LED chip of the LED module plate, characterized in that consisting of a transparent light emitting tube for emitting light emitted from the LED or LED chip to the outside.

여기서, 상기 베이스 몸체의 상기 일측에는 개구(開口)진 원통형의 네크부가 형성되며, 이 원통형의 네크부의 내주연을 따라 상기 유도 코일부가 설치되며, 상기 천장 또는 벽체 고정부와 베이스 몸체의 결합시에는 상기 유도 기전력부로서의 유도 기전력봉이 상기 베이스 몸체의 개구진 원통형 네크부내에 비접촉된 상태로 삽입되어짐이 바람직하다.Here, an opening cylindrical neck portion is formed at one side of the base body, and the induction coil portion is installed along the inner circumference of the cylindrical neck portion, and the ceiling or wall fixing portion and the base body are coupled to each other. Preferably, the induction electromotive force rod as the induction electromotive force portion is inserted into the open cylindrical neck portion of the base body in a non-contact state.

또한, 상기 천장 또는 벽체 고정부와 베이스 몸체는 중공형상의 원통형의 하우징을 개재하여 결합되어지되, 상기 원통형 하우징 내주연의 상측 단턱부에 상기 천장 또는 벽체 고정부의 하측부 가장자리가 체결 또는 압입 고정결합되며, 상기 원통형 하우징 내주연의 하측 단턱부에는 나사 체결부가 형성되어 상기 베이스 몸체의 상기 원통형 네크부 외측에 형성된 나사 체결부와 나사 결합됨으로써, 상기 천장 또는 벽체 고정부의 유도 기전력봉과 상기 베이스 몸체의 유도 코일부가 비접촉 상태로 결합되어짐이 바람직하다.In addition, the ceiling or wall fixing portion and the base body is coupled via a hollow cylindrical housing, the lower edge of the ceiling or wall fixing portion is fastened or press-fitted to the upper step of the inner circumference of the cylindrical housing It is coupled, the lower stepped portion of the inner circumference of the cylindrical housing is formed with a screw fastening screw coupled to the screw fastening portion formed on the outer side of the cylindrical neck portion of the base body, the induced electromotive force rod and the base body of the ceiling or wall fixing It is preferable that the induction coil of is coupled in a non-contact state.

또한, 상기 천장 또는 벽체 고정부는 상용 전원에 연결되는 상기 유도 기전력부로서의 제 1 유도 코일이 외주연으로 감겨지는 통형상의 끼움 홈부가 형성되고, 상기 베이스 몸체의 상단에는 내부 통로를 따라 상기 유도 코일부로서의 제 2 유도 코일이 감겨짐과 함께 상기 통형상의 끼움 홈부에 끼워져 결합되는 링형상의 삽입 돌기부가 형성되어, 상기 상용 전원에 연결된 제 1 유도 코일과 이에 비접촉식으로 전기적으로 연결된 상기 제 2 유도 코일에 의해 유도 전류가 발생되어 상기 복수개의 엘이디 또는 엘이디 칩이 발광함이 바람직하다.In addition, the ceiling or wall fixing portion is formed with a cylindrical fitting groove portion is wound around the outer periphery of the first induction coil as the induction electromotive force portion connected to the commercial power source, the induction nose along the inner passage at the top of the base body A second induction coil as a part is wound and a ring-shaped insertion protrusion is formed to be fitted into and coupled to the cylindrical fitting groove, so that the first induction coil connected to the commercial power supply and the second induction electrically connected thereto without contact. It is preferable that an induced current is generated by a coil so that the plurality of LEDs or LED chips emit light.

또한, 상기 천장 또는 벽체 고정부는 판(板)상으로서 그 상면 중앙으로 상용 전원에 연결되는 상기 유도 기전력부로서의 제 3 유도 코일이 외주연으로 감겨지는 통형상의 끼움 홈부가 형성되고, 상기 베이스 몸체의 상부 내측으로 상기 유도 코일부로서의 제 4 유도 코일이 감겨지고, 상기 베이스 몸체의 중앙 상부에는 상기 통형상의 끼움 홈부에 끼워져 결합되는 통형상의 삽입 돌기부가 형성되어, 상기 상용 전원에 연결된 제 3 유도 코일과 이에 비접촉식으로 전기적으로 연결된 상기 제 4 유도 코일에 의해 유도 전류가 발생되어 상기 복수개의 엘이디 또는 엘이디 칩이 발광함이 바람직하다.In addition, the ceiling or wall fixing portion is formed in the shape of a plate-like fitting groove portion is wound around the outer periphery of the third induction coil as the induction electromotive force portion connected to the commercial power source in the center of the upper surface, the base body A fourth induction coil as the induction coil part is wound inside an upper portion of the base body, and a cylindrical insertion protrusion is formed at the center upper portion of the base body to be fitted into and coupled to the tubular fitting groove portion, the third being connected to the commercial power source. It is preferable that an induction current is generated by an induction coil and the fourth induction coil electrically connected to the induction coil so that the plurality of LEDs or LED chips emit light.

또한, 상기 베이스 몸체의 상호 대향하는 상단 가장자리에는 두 개의 클립형태의 걸림돌기가 형성되고, 이에 대응하는 상기 판형상의 천장 또는 벽체 고정부의 저면에는 대향하는 두 개의 걸림턱이 형성되어 상기 베이스 몸체와 판형상의 천장 또는 벽체 고정부가 체결 및 고정됨이 바람직하다.In addition, at the upper edges of the base body, which face each other, two clip-like locking projections are formed, and two locking jaws are formed on the bottom surface of the plate-shaped ceiling or wall fixing part corresponding thereto. It is preferred that the ceiling or wall fixture of the phase is fastened and fixed.

상기와 같이 구성되는 본 발명에 따른 비접촉식 전원 공급 방식을 이용한 엘이디 조명등에 의하며, 수분이 존재하는 밀폐된 실내 공간(반도체 공정실이나 원예작물 재배실 등)의 천장 또는 벽체에 형성되어, 일반적인 상용 전원을 공급받는 유도 기전력봉이 형성되는 천장 또는 벽체 고정부와 비접촉 상태로 결합되는 베이스 몸체(유도 코일부)를 갖도록 함으로써, 외부의 상용 전원을 비접촉에 의한 유도 기전력에 의해 공급받게 됨으로써, 종래와 같은 소켓과 소켓 베이스와의 접촉부위가 습기 등에 의한 오작동이나 전기 누전을 완전 차단할 수 있는 효과가 있다.According to the LED lighting using the non-contact power supply system according to the present invention configured as described above, is formed on the ceiling or wall of the sealed indoor space (such as semiconductor process room or horticulture plant growing room) where moisture is present, general commercial power By having a base body (induction coil portion) coupled in a non-contact state with the ceiling or wall fixing portion in which the induced electromotive force rod is formed to be supplied, the external commercial power is supplied by the non-contact induced electromotive force, the same socket as the conventional The contact area between the socket base and the socket base has the effect of completely preventing malfunction or electrical leakage due to moisture.

도 1은 본 발명에 따른 비접촉식 전원 공급 방식을 이용한 엘이디 조명등의 분해 사시도이다.
도 2는 본 발명에 따른 비접촉식 전원 공급 방식을 이용한 엘이디 조명등의 결합 단면도이다.
도 3은 본 발명에 따른 비접촉식 전원 공급 방식을 이용한 엘이디 조명등의 작동 상태도이다.
도 4a 및 도 4b는 본 발명의 다른 실시예에 따른 비접촉식 전원 공급 방식을 이용한 엘이디 조명등의 절결 사시도 및 결합 단면도이다.
도 5a 및 도 5b는 본 발명의 또 다른 실시예에 따른 비접촉식 전원 공급 방식을 이용한 엘이디 조명등의 절결 사시도 및 결합 단면도이다.1 is an exploded perspective view of an LED lamp using a non-contact power supply system according to the present invention.
2 is a cross-sectional view of the LED lamp using a non-contact power supply system according to the present invention.
3 is an operating state diagram of the LED lighting using a non-contact power supply system according to the present invention.
4A and 4B are cutaway perspective views and coupling cross-sectional views of an LED lamp using a non-contact power supply method according to another embodiment of the present invention.
5A and 5B are cutaway perspective views and coupling cross-sectional views of an LED lamp using a non-contact power supply method according to another embodiment of the present invention.

이하, 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자가 본 발명을 용이하게 실시할 수 있을 정도로 본 발명의 바람직한 실시예를 첨부된 도면을 참조하여 상세히 설명하기로 한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention.

도 1은 본 발명에 따른 비접촉식 전원 공급 방식을 이용한 엘이디 조명등의 분해 사시도이고, 도 2는 본 발명에 따른 비접촉식 전원 공급 방식을 이용한 엘이디 조명등의 결합 사시도이고, 도 3은 본 발명에 따른 비접촉식 전원 공급 방식을 이용한 엘이디 조명등의 작동 상태도로서, 편의상 함께 설명하기로 한다.1 is an exploded perspective view of the LED lighting using a non-contact power supply according to the present invention, Figure 2 is a perspective view of the combined LED lighting using a non-contact power supply according to the present invention, Figure 3 is a non-contact power supply according to the present invention As an operational state diagram of the LED lighting using the method, it will be described together for convenience.

여기서, 본 발명에 따른 비접촉식 전원 공급 방식을 이용한 엘이디 조명등(100)은, 수분이 존재하는 밀폐된 실내 공간(수분에 민간함 반도체 공정실이나 수분으로 가득한 원예작물 재배실 등)의 천장 또는 벽체에 형성되어, 상용 전원(예컨대, 일반적인 12V의 교류 또는 직류 전원)을 공급받는 유도 기전력봉(2)이 형성되는 천장 또는 벽체 고정부(1)에 비접촉 상태로 결합되는 베이스 몸체(20)(유도 코일부(22))를 갖는 것을 특징으로 하며, 이에 의해 외부의 상용 전원을 비접촉에 의한 유도 기전력(起電力)에 의해 공급받게 됨으로써, 종래와 같은 소켓과 소켓 베이스와의 접촉부위가 습기 등에 의해 발생될 수 있는 오작동이나 전기 누전을 원천적으로 차단할 수 있게 된다.Here, the LED lighting lamp 100 using the non-contact power supply method according to the present invention, the ceiling or the wall of the closed interior space (moisture-free semiconductor process chamber or horticulture plant cultivation room filled with moisture, etc.) where moisture is present. The base body 20 (induction nose) is formed to be coupled to the ceiling or wall fixing portion (1) is formed, the induction electromotive force rod (2) receiving a commercial power supply (for example, a typical 12V AC or DC power supply) is formed. And part 22), whereby external commercial power is supplied by non-contact induced electromotive force, whereby a contact portion between the socket and the socket base as in the prior art is generated by moisture or the like. It is possible to fundamentally prevent any malfunction or electrical leakage.

도시된 바와 같이, 본 발명에 따른 비접촉식 전원 공급 방식을 이용한 엘이디 조명등(100)은, 수분이 존재하는 밀폐된 실내 공간의 천장 또는 벽체에 형성되며, 상용 전원을 공급받는 유도 기전력봉(2)이 형성되는 천장 또는 벽체 고정부(1)와; 일측에 상기 천장 또는 벽체 고정부(1)의 유도 기전력봉(2)과 비접촉상태로 결합되며, 상기 유도 기전력봉(2)의 유도 기전력에 의해 유도 전류가 발생되는 유도 코일부(22)가 형성되는 베이스 몸체(20)와; 상기 베이스 몸체(20)의 타측으로는 상기 유도 코일부(22)와 전기적으로 연결되는 복수개의 엘이디 또는 엘이디 칩(40)이 돗트(dot) 형태로 노출되어 광을 발광하도록 장착되는 엘이디 모듈판(30)과; 상기 엘이디 모듈판(30)의 상기 엘이디 또는 엘이디 칩(40)을 커버하며, 상기 엘이디 또는 엘이디 칩(40)으로부터 방출되는 광을 외부로 발광하기 위한 원통형 형상의 투명 발광관(50)으로 이루어진다.As shown, the LED lamp 100 using the non-contact power supply method according to the present invention is formed on the ceiling or wall of the sealed indoor space in which water is present, the induced electromotive force rod (2) is supplied with commercial power A ceiling or wall fixing part 1 formed; Induction coil unit 22 coupled to the induction electromotive force bar 2 of the ceiling or wall fixing portion 1 in a non-contact state, the induction current is generated by the induction electromotive force of the induction electromotive force rod 2 is formed on one side A base body 20; On the other side of the base body 20, a plurality of LED or LED chip 40 electrically connected to the induction coil unit 22 is exposed in the form of a dot (dot) LED module plate mounted to emit light ( 30); Covering the LED or the LED chip 40 of the LED module plate 30, and made of a transparent light emitting tube 50 of a cylindrical shape for emitting light emitted from the LED or LED chip 40 to the outside.

상기한 천장 또는 벽체 고정부(1)의 하측에 돌출형성되는 유도 기전력봉(2)은 그 내측에 유도 코일(도면 번호 미부여)이 감겨진 형태로 형성되어 있어, 상용 전원(일반적인 전원 스위치의 작동 또는 리모컨 작동 가능)을 공급받아서 유도 코일에서 유도 기전력이 발생되어지는 구조로 되어 있다.The induction electromotive force bar 2 protruding from the ceiling or the wall fixing part 1 is formed in a shape in which an induction coil (not shown in the figure) is wound around the inside of the ceiling or wall fixing part 1, Operation or remote control operation), so that induced electromotive force is generated in the induction coil.

여기서, 도시된 예에서는 유도 기전력봉(2)을 나타내고 있으나, 유도 기전력을 발생시킬 수 있는 공지된 판(板)형상의 유도 기전력판도 본 발명에서 가능하며, 그 형상을 한정하는 것은 아니다.Here, although the induction electromotive rod 2 is shown in the illustrated example, the well-known induction plate of electromotive force plate which can generate an induction electromotive force is also possible in this invention, It does not limit the shape.

또한, 상기한 베이스 몸체(20)의 일측(상측)에는 개구(開口)진 원통형의 네크부(21)가 형성되며, 이 원통형의 네크부(21)의 내주연을 따라 유도 코일부(22)가 설치되어, 비접촉 상태로의 결합시에 상술한 유도 기전력봉(2)의 유도 기전력에 의해 유도 코일부(22)에 유도 전류가 발생되어 이에 전기적으로 연결된 복수개의 엘이디 또는 엘이디 칩(40)이 발광될 수 있게된다. 이러한 유도 기전력봉과 유도 코일에 의한 유도 전류의 발생 기술은 널리 알려져 있음으로 추가적인 부연 설명은 생략하기로 한다.In addition, an open cylindrical neck portion 21 is formed at one side (upper side) of the base body 20, and the induction coil portion 22 is formed along the inner circumference of the cylindrical neck portion 21. Is installed, the induced current is generated in the induction coil unit 22 by the induction electromotive force of the induction electromotive force bar 2 described above, and the plurality of LEDs or LED chips 40 electrically connected thereto It can be emitted. Since the technology of generating the induced current by the induction bar and the induction coil is widely known, further description will be omitted.

한편, 유도 기전력봉(2)을 갖는 천장 또는 벽체 고정부(1)와 베이스 몸체(20)의 결합 구조를 보다 상세히 설명하면, 도시된 바와 같이, 천장 또는 벽체에 설치되는 소천장 또는 벽체 고정부(1)의 하측에 유도 기전력봉(2)이 돌출 설치되며, 중공 형상의 원통형 하우징(10) 내주연의 상측 단턱부(11)에 천장 또는 벽체 고정부(1)의 하측부 가장자리가 체결 또는 압입 고정결합되며, 중공 형상의 원통형 하우징(10) 내주연의 하측 단턱부(12)에는 나사 체결부(12-1)가 형성되어, 베이스 몸체(20)의 원통형 네크부(21) 외측에 형성된 나사 체결부(21-1)와 나사 결합됨으로써, 천장 또는 벽체 고정부(1)의 유도 기전력봉(2)과 베이스 몸체(20)의 유도 코일부(22)가 비접촉 상태로 결합되어지게 된다. Meanwhile, the coupling structure of the ceiling or wall fixing part 1 having the induction electromotive force rod 2 and the base body 20 will be described in more detail. As shown, the small ceiling or wall fixing part installed in the ceiling or wall is shown. An induction electromotive force bar 2 protrudes from the lower side of the lower part 1, and the lower edge of the ceiling or wall fixing part 1 is fastened to the upper stepped part 11 of the inner circumference of the hollow cylindrical housing 10. The screw fastening part 12-1 is formed at the lower stepped part 12 of the inner circumference of the hollow cylindrical housing 10, and is press-fitted and fixed to the outer side of the cylindrical neck part 21 of the base body 20. By screwing the screw coupling part 21-1, the induction electromotive force bar 2 of the ceiling or wall fixing part 1 and the induction coil part 22 of the base body 20 are coupled in a non-contact state.

물론, 유도 기전력봉(2)을 갖는 천장 또는 벽체 고정부(1)와 베이스 몸체(20)의 결합시에는 유도 기전력봉(2)은 베이스 몸체(20)의 개구(開口)진 원통형 네크부(21)내에 비접촉된 상태로 삽입되어지며, 상용 전원(일반적인 전원 스위치의 작동 또는 리모컨의 작동도 가능)을 공급받은 경우, 상술한 바와 같이, 유도 기전력에 의해 비접촉식으로 유도 전류가 발생되어 복수개의 엘이디 또는 엘이디 칩(40)이 발광할 수 있게 된다.Of course, when the ceiling or wall fixing part 1 having the induction electromotive force rod 2 and the base body 20 are coupled, the induction electromotive force rod 2 is an open cylindrical neck portion of the base body 20 ( 21) is inserted in a non-contact state, and when supplied with commercial power (operation of the general power switch or operation of the remote control), as described above, induction current is generated in a non-contact by the induced electromotive force, so that a plurality of LEDs Alternatively, the LED chip 40 may emit light.

이와 같이, 비접촉식으로 복수개의 엘이디 또는 엘이디 칩(40)을 간단히 발광할 수 있게 됨으로써, 종래와 같이, 소켓과 소켓 베이스의 접촉에 의해 복수개의 엘이디 또는 엘이디 칩(40)이 발광하는 경우에 그 접촉부위에 누적된 습기 등에 의해 발생되는 오작동이나 전기 누전을 원천적으로 차단할 수 있게 된다.As described above, the plurality of LEDs or LED chips 40 can be easily emitted in a non-contact manner, so that when the plurality of LEDs or LED chips 40 emit light due to the contact between the socket and the socket base as in the related art, the contact thereof occurs. It is possible to fundamentally prevent malfunction or electrical leakage caused by moisture accumulated in the site.

한편, 상기한 베이스 몸체(20)는 대략 일반 백열 전구의 소켓(socket)과 비슷한 구조로서 개방된 타측(도면에서 하측)에는 회로 기판(23)이 장착되며, 상기 회로 기판(23)은 그 중앙홀(도면 번호 미부여)을 관통하는 유도 코일부(22)와 연결된 케이블(도면 번호 미부여)에 의해 엘이디 모듈판(30)의 엘이디 또는 엘이디 칩(40)에 전기적으로 연결되는 구조로 되어 있다.On the other hand, the base body 20 is a structure similar to the socket (socket) of the general incandescent bulb, the circuit board 23 is mounted on the other side (lower side in the figure) open, the circuit board 23 is the center It is structured to be electrically connected to the LED or the LED chip 40 of the LED module plate 30 by a cable (not shown) connected to the induction coil 22 passing through the hole (not shown). .

상기한 원판형상의 엘이디 모듈판(30)은 회로 기판(23)상에 전기적으로 연결된 상태로 장착되며, 그 일면(도면에서 하측)에는 복수개의 엘이디 또는 엘이디 칩(40)이 돗트 형태로 노출되어 상기 유도 코일부(22)의 유도 전류에 의해 발광하도록 장착되어진다.The disc-shaped LED module plate 30 is mounted on the circuit board 23 in an electrically connected state, and a plurality of LEDs or LED chips 40 are exposed on one surface (lower side in the drawing) in the form of dots. The induction coil unit 22 is mounted to emit light by the induction current.

또한, 상기한 원판형상의 엘이디 모듈판(30)의 외곽은 약간 돌출된 형태이거나 홈이 형성되어 후술하는 원통형 형상의 투명 발광관(50)의 하측 외주면이 끼워져 간단히 결합될 수 있는 구조가 바람직하나, 본 발명에 있어 그 결합 구조를 한정하는 것은 아니며, 다양한 결합 구조를 적용할 수 있다.In addition, the outer shape of the disc-shaped LED module plate 30 is a slightly protruding shape or a groove is formed, the lower outer peripheral surface of the cylindrical light emitting tube 50 to be described later is fitted with a simple structure that can be easily combined. In the present invention, the bonding structure is not limited, and various bonding structures can be applied.

상기한 원판형상의 엘이디 모듈판(30) 상면에 복수개가 매트릭스 형태로 장착되는 엘이디 또는 엘이디 칩(40)은 면방향으로 빛을 발광하도록 한다. 이러한 엘이디 또는 엘이디 칩(40)의 종류로는 청색 LED, 보라색 LED, 자외선 LED, 백색 LED 등이나, 이들의 조합된 형태로 이루어질 수도 있으며, 미리 정해진 색조와는 무관하게 후술하는 바와 같은 조명색 변환용 형광판에 의해 발광색을 간단하고 용이하게 변환시킬 수가 있다.The plurality of LEDs or LED chips 40 mounted on the upper surface of the disk-shaped LED module plate 30 in a matrix form emits light in a plane direction. The LED or the LED chip 40 may be a blue LED, a purple LED, an ultraviolet LED, a white LED, or the like, or a combination thereof, and may be used to convert an illumination color as described below regardless of a predetermined color tone. The fluorescent plate can easily and easily convert the emission color.

또한, 상기 빛을 외부로 발광하는 투명 발광관(50)은 하부가 개방된 대략 원통형(튜브형)으로서, 그 하측 외주면은 상기한 원판형상의 엘이디 모듈판(30)의 돌출된 원형 외곽 또는 홈에 끼워지는 형태로 간단히 결합하도록 되어 있다.In addition, the transparent light emitting tube 50 for emitting the light to the outside is a substantially cylindrical (tube-shaped) with an open bottom, the lower outer peripheral surface of the disk-shaped LED module 30 in the protruding circular outer or grooves It is designed to be easily combined in a fitted form.

이러한 투명 발광관(50)의 소재로는 아크릴, 유리 또는 PVC 등의 투명 소재가 바람직하나 그 재질을 한정하는 것은 아니다.The material of the transparent light emitting tube 50 is preferably a transparent material such as acrylic, glass or PVC, but the material is not limited thereto.

도시된 예에서는 투명 발광관(50)이 튜브 형태의 원통형 형태를 하고 있지만, 그 형태를 직관형, 절곡형 또는 구형 등으로 다양한 형상에 적용하여 사용할 수 있다.In the illustrated example, the transparent light emitting tube 50 has a cylindrical shape in the form of a tube. However, the transparent light emitting tube 50 may be used in various shapes such as a straight line, a bent form, a spherical form, or the like.

여기서, 투명 발광관(50)에는 후술하는 광확산체 또는 형광체(분말 또는 시트)를 도포하여 일체로 형성할 수도 있다.Here, the light emitting tube 50 may be formed integrally by applying a light diffuser or phosphor (powder or sheet) described later.

한편, 도시되어 있지는 않지만, 원통형의 투명 발광관(50)의 내측에는 원통형의 필름 또는 시트 형태의 조명색 변환용 형광판이 더 끼워질 수 있다.Meanwhile, although not shown, a fluorescent plate for converting illumination colors in the form of a cylindrical film or sheet may be further fitted inside the cylindrical transparent light emitting tube 50.

이러한 원통형상의 조명색 변환용 형광판은 매트릭스(matrix) 수지 중에 형광체, 광확산체(비드)와 안료가 균질하게 분산되는 형태가 바람직하다.The cylindrical illumination color conversion fluorescent plate is preferably a form in which the phosphor, the light diffuser (bead) and the pigment are uniformly dispersed in the matrix resin.

즉, 원통형의 조명색 변환용 형광판은, 발광 LED 자체는 건드리는 일 없이 독립적으로 엘이디 조명등에 적용되어 간단하고도 저렴하게 LED의 발광색을 청색, 보라색, 자외선으로부터 백색광 내지 황백색광으로 전환시킬 수가 있음과 아울러, 상기 광확산체(비드)에 의한 산란에 의해 조명색 변환용 형광판의 형광체가 충분한 발광색 전환을 수행할 수 있게 하므로 형광체의 엄격히 균질한 분포가 특별히 문제가 되지 아니함과 동시에, 광원을 직접 바라볼 경우의 LED의 고휘도로 인한 눈 따가움이나 피로도를 현저히 경감 내지 완화시킬 수가 있다.In other words, the cylindrical illumination color conversion fluorescent plate is applied to the LED light independently without touching the light emitting LED itself, it is possible to easily and inexpensively convert the light emitting color of the LED from blue, purple, ultraviolet light to white light to yellow white light. In addition, since the phosphor of the illumination color conversion fluorescent plate can perform sufficient light emission color conversion by scattering by the light diffuser (bead), a strictly homogeneous distribution of the phosphor is not particularly a problem, and at the same time looks directly at the light source In this case, eye sting and fatigue due to the high brightness of the LED can be significantly reduced or alleviated.

상기한 매트릭스 수지로서는 투명성과 내열성이 우수한 것들이 바람직하게 사용될 수 있으며, 투명성과 내열성이 양호한 것이라면 본 발명에 있어 특별한 제한은 없지만, 바람직한 내열성의 투명한 매트릭스 수지로서는 실리콘(silicon) 수지, 폴리메칠 펜텐(polymethyl pentene) 수지, 폴리에테르 설폰(polyether sulfon) 수지, 폴리에테르 이미드(polyether imide) 수지, 폴리아릴레이트(polyarylate) 수지, 또는 폴리메틸메타크릴레이트(polymethyl methacylate) 수지를 들 수 있으며, 이들 매트릭스 수지의 첨가량은 조성물 전 중량 기준으로 50∼99중량%, 바람직하게는 82∼97중량%의 범위이다.As the above-mentioned matrix resin, those having excellent transparency and heat resistance can be preferably used. If the transparency and heat resistance are good, there is no particular limitation in the present invention, but preferred heat-resistant transparent matrix resins include silicone resin and polymethyl pentene. pentene resin, polyether sulfon resin, polyether imide resin, polyarylate resin, or polymethyl methacylate resin, and these matrix resins The addition amount of is in the range of 50 to 99% by weight, preferably 82 to 97% by weight based on the total weight of the composition.

이들 내열성의 투명한 매트릭스 수지의 함량이 조성물 전 중량 기준으로 50중량% 미만인 경우에는 투명성이 열등하게 되고, 산란에 의한 후광 효과로 인하여 휘도가 지나치게 저하될 우려가 있으며, 역으로 97중량%를 초과하는 경우에는 조명색 변화효과가 미흡하거나 고휘도로 인한 눈부심 현상의 완화 정도가 충분하지 못하게 될 우려가 있다.When the content of these heat-resistant transparent matrix resin is less than 50% by weight based on the total weight of the composition, transparency may be inferior, and the luminance may be excessively lowered due to the halo effect caused by scattering. In this case, there is a concern that the light color change effect is insufficient or the degree of alleviation of the glare due to high brightness is insufficient.

상기한 수지 모두는 당업계에 내열성의 투명한 수지로서 공지된 것들이므로 이에 대한 부연은 생략하기로 한다.All of the above-mentioned resins are those known in the art as heat-resistant transparent resins, so the description thereof will be omitted.

한편, 본 발명에 적용 가능한 백색광으로의 조명색 변환용 형광체로서는, 청색 LED를 이용할 경우에는 당업계 공지의 YAG계 황색 형광체만을 이용할 수도 있으나, 바람직하게는 녹색 형광체 및 적색 형광체를 사용하는 것이 3파장의 자연스러운 백색광을 얻을 수 있다는 점에서 바람직하며, 보라색 LED 또는 자외선 LED를 이용할 경우는 녹색 형광체 및 적색 형광체와 청색 형광체를 사용하는 것이 마찬가지의 이유로 바람직하다.On the other hand, as a phosphor for converting the illumination color into white light applicable to the present invention, when using a blue LED, only a YAG-based yellow phosphor known in the art may be used, but it is preferable to use a green phosphor and a red phosphor. It is preferable at the point that natural white light can be obtained, and when using a purple LED or an ultraviolet LED, it is preferable to use a green fluorescent substance, a red fluorescent substance, and a blue fluorescent substance for the same reason.

청색 LED와 YAG 황색 형광체를 사용할 경우 얻어지는 백색 LED는 Nichia 사가 개발한 (YGd)3Al5O12: Ce가 전형적이며 상기한 YAG 황색 형광체는 550∼560㎚에서 여기된다.The white LED obtained when using a blue LED and a YAG yellow phosphor is typically (YGd) 3 Al 5 O 12: Ce developed by Nichia, and the above-mentioned YAG yellow phosphor is excited at 550 to 560 nm.

한편, 청색 LED(425㎚∼475㎚ 파장 영역)와 녹색 형광체 및 적색 형광체와 청색 형광체를 사용할 경우, 본 발명이 이에 한정되는 것은 아니며 당업계 공지의 다양한 것들이 사용될 수 있기는 하지만 430㎚-480㎚의 파장 영역에서 여기될 수 있는 적색 형광체의 예로서는 Y2O2S:Eu,Gd, Li2TiO3: Mn, LiAlO2: Mn, 6MgO·As2O5:Mn4+, 또는 3.5MgO·0.5MgF2·GeO2: Mn4+를 들 수 있으며, 515㎚-520㎚의 파장 영역에서 여기될 수 있는 녹색 형광체의 예로서는 ZnS:Cu,Al, Ca2MgSi2O7:Cl, Y3(GaxAl1-x)5O12: Ce(0<x<1), La2O3·11Al2O3: Mn, Ca8Mg(SiO4)4Cl2: Eu, Mn를 들 수 있다.On the other hand, when using the blue LED (425 nm to 475 nm wavelength region) and the green phosphor and the red phosphor and blue phosphor, the present invention is not limited thereto, but various ones known in the art can be used 430 nm to 480 nm Examples of red phosphors that can be excited in the wavelength range of include Y2O2S: Eu, Gd, Li2TiO3: Mn, LiAlO2: Mn, 6MgO · As2O5: Mn4 +, or 3.5MgO.0.5MgF2.GeO2: Mn4 +, and 515 nm-. Examples of green phosphors that can be excited in the wavelength region of 520 nm include ZnS: Cu, Al, Ca2MgSi2O7: Cl, Y3 (GaxAl1-x) 5O12: Ce (0 <x <1), La2O3 · 11Al2O3: Mn, Ca8Mg (SiO4 ) 4Cl2: Eu, Mn.

청색 LED와 적색 및 녹색 형광체 이용한 3 파장 백색 LED는 적색 및 녹색형광체 혼합물을 여기시켜 상기 청색 LED 칩의 청색광과 혼합되는 적색광 및 녹색광을 생성함으로써 3파장 백색광을 발광하게 된다.A three-wavelength white LED using a blue LED and red and green phosphors excites a mixture of red and green phosphors to produce red and green light mixed with the blue light of the blue LED chip to emit three wavelength white light.

또한, 상기한 청색 LED에 의해 여기될 수 있는 적색 및 녹색 형광체는 산화물 형태로서 안정성이 크고 연장된 수명을 갖는다.In addition, the red and green phosphors that can be excited by the blue LEDs described above are stable in oxide form and have an extended lifetime.

본 발명에 있어서는 상기한 녹색 형광체와 적색 형광체를 적절한 비율로 혼합하여 직간접적으로 청색 LED 칩에 직접 코팅하여 3 파장 백색광을 얻는 것이 아니라, LED 와는 직접적인 관련이 없이 그에 별도의 부재(member)로서 장착하는 조명색 변환용 형광판 필름이나 시트를 형성시키는 것에 의해 3 파장 백색광을 얻는 것임을 유의할 필요가 있다.In the present invention, the above-mentioned green phosphor and red phosphor are mixed at an appropriate ratio and directly coated directly or indirectly on a blue LED chip to obtain 3-wavelength white light, and are mounted as a separate member thereof without being directly related to the LED. It is to be noted that 3-wavelength white light is obtained by forming a fluorescent plate film or sheet for illumination color conversion.

상기한 적색 및 녹색 형광체 중 적색 형광체는 발광 피크 파장이 약 659㎚일 경우에는 Li2TiO3:Mn이 바람직하며, 발광 피크 파장이 약 670㎚일 경우에는 LiAlO2:Mn이 바람직하고, 발광 피크 파장이 약 650㎚일 경우에는 6MgO·As2O5:Mn4+이바람직하며, 발광 피크 파장이 약 650㎚일 경우에는 3.5MgO·0.5MgF2·GeO2:Mn4+이 바람직하다.Among the red and green phosphors, the red phosphor is preferably Li 2 TiO 3: Mn when the emission peak wavelength is about 659 nm, and when the emission peak wavelength is about 670 nm, LiAlO 2: Mn is preferable and the emission peak wavelength is about 650 nm. In the case of nm, 6MgO.As2O5: Mn4 + is preferred, and in the case where the emission peak wavelength is about 650 nm, 3.5MgO.0.5MgF2.GeO2: Mn4 + is preferable.

상기한 적색 및 녹색 형광체 중 녹색 형광체는 발광 피크 파장이 약 520㎚일 경우에는 La2O3·11Al2O3: Mn이 바람직하고, 발광 피크 파장이 약 516㎚일 경우에는 Y3(GaxAl1-x)5O12: Ce(0<x<1)이 바람직하며, 발광 피크 파장이 약 515㎚일 경우에는 Ca8Mg(SiO4)4Cl2: Eu, Mn이 바람직하다.Among the red and green phosphors described above, the green phosphor is preferably La 2 O 3 · 11Al 2 O 3: Mn when the emission peak wavelength is about 520 nm, and Y 3 (GaxAl 1-x) 5 O 12: Ce (0) when the emission peak wavelength is about 516 nm. <x <1) is preferred, and Ca8Mg (SiO4) 4Cl2: Eu, Mn is preferred when the emission peak wavelength is about 515 nm.

상기한 녹색 형광체와 적색 형광체는 다양한 비율로 혼합될 수 있으며 분홍 또는 청백색과 같은 중간색의 LED를 형성할 수도 있다. 한편, 상기한 청색 LED 칩은 InGaN형, SiC형 또는 ZnSe형일 수 있다.The green phosphor and the red phosphor may be mixed in various ratios and may form an intermediate color LED such as pink or blue white. Meanwhile, the blue LED chip may be InGaN type, SiC type, or ZnSe type.

한편, 보라색 LED 또는 자외선 LED의 경우에는 상기한 녹색 형광체와 적색 형광체 외에, 청색 형광체로서는 BaMgAl10O17 또는 (Sr,Ca,BaMg)10(PO4)6Cl2:Eu를 사용할 수 있다.On the other hand, in the case of the purple LED or the ultraviolet LED, in addition to the green phosphor and the red phosphor, BaMgAl 10 O 17 or (Sr, Ca, BaMg) 10 (PO 4) 6 Cl 2: Eu may be used as the blue phosphor.

상기한 적색, 청색 및 녹색 형광체의 적절한 배합에 의해 백색광 또는 다양한 색상의 광이나 또는 색 온도가 상이한 다양한 광을 얻을 수가 있다.By appropriate combination of the red, blue and green phosphors described above, white light or light of various colors or various light having different color temperatures can be obtained.

얻어지는 백색광은 적색, 청색 및 녹색 형광체의 적절한 배합에 의해 수요자의 요구에 따라 3200∼7500K 범위 내에서 적절히 조절될 수 있음은 물론이다.It is a matter of course that the white light obtained can be appropriately adjusted within the range of 3200 to 7500K according to the needs of the consumer by appropriate combination of red, blue and green phosphors.

상기한 적색 형광체, 청색 형광체, 녹색 형광체, 또는 이들의 조합물의 함량은 전 조성물 중량 기준으로 0.8∼30중량%, 바람직하게는 2.0∼15중량%이며, 청색 LED에 대하여 적색 형광체와 녹색 형광체를 사용할 경우 그 중량 비율은 1: 0.2∼1.2의 비율, 바람직하게는 1:0.3∼0.8의 비율이며, 보라색 LED 또는 자외선 LED에 대하여 적색 형광체, 청색 형광체 및, 녹색 형광체를 사용할 경우의 그 중량 비율도 1: 0.2∼1.2: 0.2∼1.2의 비율, 바람직하게는 1:0.3∼0.8:0.3∼0.8의 비율이다.The content of the red phosphor, the blue phosphor, the green phosphor, or a combination thereof is 0.8 to 30% by weight, preferably 2.0 to 15% by weight, based on the total weight of the composition, and red phosphor and green phosphor may be used for the blue LED. In this case, the weight ratio is 1: 0.2 to 1.2, preferably 1: 0.3 to 0.8, and the weight ratio when using the red phosphor, the blue phosphor, and the green phosphor with respect to the purple LED or the ultraviolet LED is also 1. : 0.2 to 1.2: 0.2 to 1.2, preferably 1: 0.3 to 0.8: 0.3 to 0.8.

상기한 형광체의 함량이 전 조성물 중량 기준으로 0.8중량% 미만인 경우에는 만족스러운 백색광이 얻어지지 않을 우려가 있으며 역으로 30중량%를 초과하면 휘도가 지나치게 저하될 우려가 있으므로 바람직하지 못하다.When the content of the phosphor is less than 0.8 wt% based on the total weight of the composition, satisfactory white light may not be obtained. On the contrary, when the content of the phosphor exceeds 30 wt%, the luminance may be excessively lowered.

한편, 첨가되는 광확산체(20c)의 예로써는, 실리콘 수지(silicon resin: 굴절율 1.43), 폴리아크릴레이트(polyacrylate: 굴절율 1.49), 폴리우레탄(polyurethane: 굴절율 1.51), 폴리에틸렌(polyethylene: 굴절율 1.54), 폴리프로필렌(polypropylene: 굴절율 1.46), 나일론(Nylon: 굴절율 1.54), 폴리스티렌(polystyrene: 굴절율 1.59), 폴리메틸메타크릴레이트(polymethylmethacrylate: 굴절율 1.49), 폴리카보네이트(polycarbonate: 굴절율 1.59) 등의 호모 중합체나 이들의 단량체의 공중합체 등과 같은 유기계 광확산제와; 실리카(silica: 굴절율 1.47), 알루미나(alumina: 굴절율 1.50∼1.56), 글래스(glass: 굴절율 1.51), 탄산칼슘(CaCO3: 굴절율 1.51), 탈크(talc: 굴절율 1.56), 마이카(mica: 굴절율 1.56), 황산바륨(BaSO4: 굴절율 1.63), 산화아연(ZnO: 굴절율 2.03), 산화세슘(CeO2: 굴절율 2.15), 이산화티탄(TiO2: 굴절율 2.50∼2.71), 산화철(2.90) 등의 무기계 광확산제, 또는 이들의 임의의 혼합물을 들 수 있으나, 바람직한 것은 유기계 광확산제이며, 가장 바람직한 것은 높은 투명성 측면에서 폴리메틸메타크릴레이트이고, 매트릭스 수지와 같은 종류를 첨가하지 않는 것이 의도하는 적절한 광확산에 의한 형광체의 충분한 여기를 담보한다는 측면에서 필요하다.On the other hand, examples of the light diffuser 20c to be added include a silicone resin (refractive index of 1.43), polyacrylate (refractive index of 1.49), polyurethane (refractive index of 1.51), polyethylene (polyethylene: of refractive index 1.54) , Homopolymers such as polypropylene (refractive index 1.46), nylon (Nylon: refractive index 1.54), polystyrene (polystyrene: 1.59), polymethylmethacrylate (refractive index 1.49), polycarbonate (polycarbonate: 1.59) Organic light diffusing agents such as copolymers of monomers thereof; Silica (refractive index 1.47), alumina (refractive index 1.50 to 1.56), glass (glass: refractive index 1.51), calcium carbonate (CaCO3: refractive index 1.51), talc (talc: refractive index 1.56), mica (mica: 1.56) Inorganic light diffusing agents such as barium sulfate (BaSO 4: refractive index 1.63), zinc oxide (ZnO: refractive index 2.03), cesium oxide (CeO 2: refractive index 2.15), titanium dioxide (TiO 2: refractive index 2.50 to 2.71), iron oxide (2.90), Or any mixture thereof, but preferred is an organic light diffusing agent, most preferred is polymethylmethacrylate in terms of high transparency, and by appropriate light diffusion intended not to add the same kind as the matrix resin. This is necessary in terms of ensuring sufficient excitation of the phosphor.

상기한 광확산체는 평균 입경 0.2∼30㎛, 바람직하게는 0.5∼5㎛, 특정하게는 1.0∼3.5㎛인 것이 사용되며, 그 첨가량은 조성물 전 중량 기준으로 0.2∼20중량%, 바람직하게는 0.5∼10중량%, 특정하게는 1.0∼3.0중량%이다.The light diffuser described above has an average particle diameter of 0.2 to 30 µm, preferably 0.5 to 5 µm, and particularly 1.0 to 3.5 µm, and the amount of the light diffuser is 0.2 to 20 wt%, preferably based on the total weight of the composition. 0.5 to 10 weight%, specifically 1.0 to 3.0 weight%.

광확산체(80c)의 평균 입경이 0.2㎛ 미만일 경우에는 투명성이나 투광성이 열등하게 될 우려가 있어 바람직하지 아니하며 역으로 30㎛를 초과하는 경우에는 형광체의 여기가 불충분하거나 균일하지 못하게 될 우려가 있어 마찬가지로 바람직하지 못하다.If the average particle diameter of the light diffuser 80c is less than 0.2 µm, the transparency or light transmittance may be inferior. In contrast, if the average diameter of the light diffuser 80c exceeds 30 µm, the excitation of the phosphor may be insufficient or uneven. Likewise not preferred.

상기한 광확산체의 전 조성물에 대한 첨가량이 0.2 중량% 미만에서는 형광체의 여기가 불충분하거나 균일하지 못하게 될 우려가 있어 바람직하지 못하며, 역으로 20중량%를 초과하면 투명성이나 투광성이 열등하게 될 우려가 있어 바람직하지 아니하다.If the amount of the light diffuser added to the total composition is less than 0.2% by weight, the excitation of the phosphor may be insufficient or uneven, which is undesirable. Conversely, if the amount is more than 20% by weight, transparency or light transmittance may be inferior. It is not desirable to have.

또한, 드물게는 조명색과 같은 기호도에 따라 무기 또는 유기 안료를 0.1∼3.0중량%, 바람직하게는 0.1∼1.0중량% 포함시킬 수도 있으며, 투명성 측면을 고려하면 유기 안료가 바람직하며, 이러한 안료의 예로서는 니트로계 안료, 아조계 안료, 인단트렌계 안료, 티오인디고계 안료, 페릴렌계 안료, 디옥사진계 안료, 퀴나트리돈계 안료, 프탈로시아닌계 안료, 퀴노프탈론계 안료 공지된 다양한 종류를 사용할 수 있다. 예컨대, 따뜻한 느낌을 주는 황색 안료의 경우로서는 모노아조, 디아조, 나프탈아조벤젠, 황벽, 황련 또는 이들의 임의의 혼합 안료를 들 수 있으나, 이는 어디까지나 본 발명에 있어서 선택적이다.In addition, rarely, inorganic or organic pigments may be included in an amount of 0.1 to 3.0% by weight, preferably 0.1 to 1.0% by weight, depending on the degree of preference such as illumination color, and in view of transparency, organic pigments are preferable. Pigments, azo pigments, indanthrene pigments, thioindigo pigments, perylene pigments, dioxazine pigments, quinatridone pigments, phthalocyanine pigments, and quinophthalone pigments can be used. For example, yellow pigments that give a warm feeling include monoazo, diazo, naphthalazobenzene, yellow wall, rhubarb or any mixed pigments thereof, but these are optional in the present invention.

도 4a 및 도 4b는 본 발명의 다른 실시예에 따른 비접촉식 전원 공급 방식을 이용한 엘이디 조명등(100a)의 절결 사시도 및 결합 단면도로서, 천장 또는 벽체 고정부(101)와 베이스 몸체(120)가 직접 결합되는 구조를 하는 것으로, 다른 모든 사항은 전술한 바와 실질적으로 동일하므로 이에 대한 부연 설명은 생략하기로 한다.4A and 4B are cutaway perspective views and a cross-sectional view of an LED lamp 100a using a non-contact power supply method according to another embodiment of the present invention, in which a ceiling or wall fixing portion 101 and a base body 120 are directly coupled to each other. All other matters are substantially the same as described above, and thus the description thereof will be omitted.

즉, 상기한 천장 또는 벽체 고정부(101)는 상용 전원(미도시)에 연결되는 제 1 유도 코일(102)이 외주연으로 감겨지는 통형상의 끼움 홈부(103)가 형성되고, 상기한 베이스 몸체(220)의 상단에는 내부 통로를 따라 제 2 유도 코일(122)이 감겨짐과 동시에 상기 통형상의 끼움 홈부(103)에 끼워져 결합되는 링형상의 삽입 돌기부(121)가 형성되어, 상용 전원에 연결된 제 1 유도 코일(102)과 이에 비접촉식으로 전기적으로 연결된 제 2 유도 코일(122)에 의해 유도 전류가 발생되어 투명 발광관(50)이 발광할 수 있게 된다.That is, the ceiling or wall fixing portion 101 is formed with a cylindrical fitting groove 103 in which the first induction coil 102 connected to a commercial power source (not shown) is wound around the outer periphery, and the base On the upper end of the body 220 is formed a ring-shaped insertion protrusion 121 which is wound on the second induction coil 122 along the inner passage and is fitted into the tubular fitting groove 103 to be coupled thereto. An induction current is generated by the first induction coil 102 connected to the second induction coil 122 and the second induction coil 122 electrically connected to the induction coil so that the transparent light emitting tube 50 can emit light.

여기서, 상기한 천장 또는 벽체 고정부(101)는 그 코너부에는 체결홀(미도시)이 형성되어 체결볼트나 나사 등에 의해 천장 또는 벽체에 용이하게 고정될 수 있도록 되어있다.Here, the ceiling or wall fixing portion 101 is a fastening hole (not shown) is formed in the corner portion is to be easily fixed to the ceiling or wall by a fastening bolt or screw or the like.

또한, 상기한 제 1 및 제 2 유도 코일 사이에서 유도기전력을 전달하는 통형상의 끼움 홈부(103) 및 링형상의 삽입 돌기부(121)의 재질은 유도 전류를 발생시켜 전달하는 재질이라면 어떠한 것도 가능하며, 바람직하게는 페라이트(ferrite) 가 바람직하다.In addition, the material of the cylindrical fitting groove 103 and the ring-shaped insertion protrusion 121 for transmitting the induced electromotive force between the first and second induction coils can be any material as long as it generates and transmits an induced current. Preferably, ferrite is preferable.

도 5a 및 도 5b는 본 발명의 또 다른 실시예에 따른 비접촉식 전원 공급 방식을 이용한 엘이디 조명등(100b)의 절결 사시도 및 결합 단면도로서, 천장 또는 벽체 고정부(201)와 베이스 몸체(220)가 도 4a 및 도 4b와 동일하게 직접 결합되는 구조를 하는 것으로, 다른 모든 사항은 전술한 바와 실질적으로 동일하므로 이에 대한 부연 설명은 생략하기로 한다.5A and 5B are cutaway perspective views and a cross-sectional view of the LED lamp 100b using a non-contact power supply method according to another embodiment of the present invention, wherein the ceiling or wall fixing part 201 and the base body 220 are shown. 4a and 4b have the same structure as the direct coupling, all other matters are substantially the same as described above, so a detailed description thereof will be omitted.

즉, 상기한 천장 또는 벽체 고정부(201)는 대략 판상으로서 그 상면 중앙으로 상용 전원(미도시)에 연결되는 제 3 유도 코일(202)이 그 외주연으로 감겨지는 통형상의 끼움 홈부(203)가 형성되고, 상기한 베이스 몸체(220)의 상부 내측으로 제 4 유도 코일(222)이 감겨지며, 상기한 베이스 몸체(220)의 상면 중앙에는 상기 통형상의 끼움 홈부(203)에 끼워져 결합되는 통형상의 삽입 돌기부(221)가 형성되어, 상용 전원에 연결된 제 3 유도 코일(202)과 이에 비접촉식으로 전기적으로 연결된 제 4 유도 코일(222)에 의해 유도 전류가 발생되어 투명 발광관(50)이 발광할 수 있게 된다.That is, the ceiling or wall fixing portion 201 is substantially plate-like, and the tubular fitting groove portion 203 wound around the outer circumference of the third induction coil 202 connected to the commercial power source (not shown) in the center of the upper surface thereof. ) Is formed, and the fourth induction coil 222 is wound inside the upper portion of the base body 220, and is fitted into the cylindrical fitting groove 203 at the center of the upper surface of the base body 220. The cylindrical insertion protrusion 221 is formed, the induced current is generated by the third induction coil 202 connected to the commercial power source and the fourth induction coil 222 non-contacted electrically to the transparent light emitting tube 50 ) Can emit light.

또한, 상기한 베이스 몸체(220)의 상호 대향하는 상단 가장자리에는 두 개의 클립(clip)형태의 걸림돌기(223)가 형성되고, 이에 대응하는 상기 판형상의 천장 또는 벽체 고정부(201)의 저면에는 대향하는 두 개의 걸림턱(204)이 형성되어 그 들의 상호 체결에 의해 상기 베이스 몸체(220)와 판형상의 천장 또는 벽체 고정부(201)가 더욱 더 용이하게 체결 및 견고히 고정될 수 있게 된다.In addition, two clip-like locking protrusions 223 are formed at upper edges of the base body 220 that face each other, and the bottom surface of the plate-like ceiling or wall fixing portion 201 is formed thereon. Two opposing latching jaws 204 are formed so that the base body 220 and the plate-shaped ceiling or wall fixing portion 201 can be more easily fastened and firmly fixed by their mutual fastening.

물론, 상기한 천장 또는 벽체 고정부(201)는 그 코너부에는 체결홀(도면 번호 미부여)이 형성되어 체결볼트나 나사 등에 의해 천장 또는 벽체에 용이하게 고정될 수 있도록 되어있다.Of course, the ceiling or wall fixing portion 201 is a fastening hole (not shown in the figure) is formed in the corner portion is to be easily fixed to the ceiling or wall by a fastening bolt or screw.

지금까지 본 발명에 따른 바람직한 구체예를 들어 본 발명을 상세히 설명하였으나, 이는 본 발명을 예증하기 위한 것일 뿐 본 발명을 제한하려는 것은 아니며, 당업자라면 본 발명의 영역으로부터 일탈하는 일 없이도 다양한 변화 및 수정이 가능함은 물론이나 이 또한 본 발명의 영역 내임을 유의하여야만 할 것이다.Although the present invention has been described in detail with reference to preferred embodiments according to the present invention, this is only for illustrating the present invention and is not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the scope of the present invention. It should be noted that this is possible as well as this is also within the scope of the present invention.

100, 100a, 100b: 비접촉식 전원 공급 방식을 이용한 엘이디 조명등
1, 101, 201: 천장 또는 벽체 고정부 2: 유도 기전력봉
10: 원통형의 하우징 11: 상측 단턱부
12: 하측 단턱부 20, 120, 220: 베이스 몸체
21: 원통형의 네크부 12-1, 21-1: 나사 체결부
22: 유도 코일부 23: 회로 기판
30: 엘이디 모듈판 40: 엘이디 또는 엘이디 칩
50: 튜브 형태의 투명 발광관 102, 202, 122, 222: 유도 코일
103, 203: 통형상의 끼움 홈부 121: 링형상의 삽입 돌기
204: 걸림턱 221: 통형상의 삽입 돌기부
223: 클립형태의 걸림돌기100, 100a, 100b: LED lighting using contactless power supply
1, 101, 201: ceiling or wall fixture 2: induction bar
10: cylindrical housing 11: upper step
12: lower step 20, 120, 220: base body
21: cylindrical neck portion 12-1, 21-1: screw fastening portion
22: induction coil unit 23: circuit board
30: LED module board 40: LED or LED chip
50: transparent light emitting tube 102, 202, 122, 222 in the form of a tube: induction coil
103, 203: cylindrical fitting groove 121: ring-shaped insertion protrusion
204: locking jaw 221: cylindrical insertion protrusion
223: locking projection in the form of a clip

Claims (6)

실내 공간의 천장 또는 벽체에 형성되며, 상용 전원을 공급받는 유도 기전력부가 형성되는 천장 또는 벽체 고정부와,
일측에 상기 천장 또는 벽체 고정부의 유도 기전력부와 비접촉상태로 결합되며, 상기 유도 기전력부의 유도 기전력에 의해 유도 전류가 발생되는 유도 코일부가 형성되는 베이스 몸체와,
상기 베이스 몸체의 타측으로는 상기 유도 코일부와 전기적으로 연결되는 복수개의 엘이디 또는 엘이디 칩이 돗트(dot) 형태로 노출되어 광을 발광하도록 장착되는 엘이디 모듈판과,
상기 엘이디 모듈판의 상기 엘이디 또는 엘이디 칩을 커버하며, 상기 엘이디 또는 엘이디 칩으로부터 방출되는 광을 외부로 발광하기 위한 투명 발광관으로 이루어지는 것을 특징으로 하는 비접촉식 전원 공급 방식을 이용한 엘이디 조명등.A ceiling or wall fixing part which is formed on the ceiling or wall of the indoor space and in which an induced electromotive force part receiving commercial power is formed;
A base body coupled to one side of the ceiling or wall fixing unit in an inductive contact with the induction electromotive unit, and having an induction coil unit for generating an induction current by the induction electromotive force of the induction electromotive unit;
On the other side of the base body is a plurality of LED or LED chip electrically connected to the induction coil portion is exposed to the dot (dot) LED module plate mounted to emit light;
An LED lamp using a non-contact power supply method covering the LED or the LED chip of the LED module plate, a transparent light emitting tube for emitting light emitted from the LED or LED chip to the outside. 제 1 항에 있어서,
상기 베이스 몸체의 상기 일측에는 개구(開口)진 원통형의 네크부가 형성되며, 이 원통형의 네크부의 내주연을 따라 상기 유도 코일부가 설치되며, 상기 천장 또는 벽체 고정부와 베이스 몸체의 결합시에는 상기 유도 기전력부로서의 유도 기전력봉이 상기 베이스 몸체의 개구진 원통형 네크부내에 비접촉된 상태로 삽입되어지는 것을 특징으로 하는 비접촉식 전원 공급 방식을 이용한 엘이디 조명등.The method of claim 1,
An opening cylindrical neck portion is formed at one side of the base body, and the induction coil portion is installed along the inner circumference of the cylindrical neck portion, and the induction is performed when the ceiling or wall fixing portion and the base body are coupled. An induction electromotive force rod as an electromotive force portion is an LED lamp using a non-contact power supply method characterized in that the non-contact power supply is inserted into the open cylindrical neck portion of the base body. 제 2 항에 있어서,
상기 천장 또는 벽체 고정부와 베이스 몸체는 중공형상의 원통형의 하우징을 개재하여 결합되어지되, 상기 원통형 하우징 내주연의 상측 단턱부에 상기 천장 또는 벽체 고정부의 하측부 가장자리가 체결 또는 압입 고정결합되며, 상기 원통형 하우징 내주연의 하측 단턱부에는 나사 체결부가 형성되어 상기 베이스 몸체의 상기 원통형 네크부 외측에 형성된 나사 체결부와 나사 결합됨으로써, 상기 천장 또는 벽체 고정부의 유도 기전력봉과 상기 베이스 몸체의 유도 코일부가 비접촉 상태로 결합되어지는 것을 특징으로 하는 비접촉식 전원 공급 방식을 이용한 엘이디 조명등.The method of claim 2,
The ceiling or wall fixing portion and the base body are coupled via a hollow cylindrical housing, and the lower edge of the ceiling or wall fixing portion is fastened or press-fitted to an upper step of the inner circumference of the cylindrical housing. And a screw fastening portion is formed at a lower stepped portion of the cylindrical housing inner periphery and screwed with a screw fastening portion formed outside the cylindrical neck portion of the base body, thereby inducing the induced electromotive force rod of the ceiling or wall fixing portion and the base body. LED lighting using a non-contact power supply method characterized in that the coil unit is coupled in a non-contact state. 제 1 항에 있어서,
상기 천장 또는 벽체 고정부는 상용 전원에 연결되는 상기 유도 기전력부로서의 제 1 유도 코일이 외주연으로 감겨지는 통형상의 끼움 홈부가 형성되고, 상기 베이스 몸체의 상단에는 내부 통로를 따라 상기 유도 코일부로서의 제 2 유도 코일이 감겨짐과 함께 상기 통형상의 끼움 홈부에 끼워져 결합되는 링형상의 삽입 돌기부가 형성되어, 상기 상용 전원에 연결된 제 1 유도 코일과 이에 비접촉식으로 전기적으로 연결된 상기 제 2 유도 코일에 의해 유도 전류가 발생되어 상기 복수개의 엘이디 또는 엘이디 칩이 발광하는 것을 특징으로 하는 비접촉식 전원 공급 방식을 이용한 엘이디 조명등.The method of claim 1,
The ceiling or wall fixing portion is formed with a cylindrical fitting groove in which the first induction coil as the induction electromotive portion connected to the commercial power source is wound around the outer circumference, and the upper end of the base body as the induction coil portion along the inner passage. A second induction coil is wound and a ring-shaped insertion protrusion is inserted into and coupled to the tubular fitting groove, and the first induction coil connected to the commercial power supply and the second induction coil electrically connected to the second induction coil are formed. LED lamps using a non-contact power supply method characterized in that the induced current is generated by the plurality of LEDs or LED chips to emit light. 제 1 항에 있어서,
상기 천장 또는 벽체 고정부는 판상으로서 그 상면 중앙으로 상용 전원에 연결되는 상기 유도 기전력부로서의 제 3 유도 코일이 외주연으로 감겨지는 통형상의 끼움 홈부가 형성되고, 상기 베이스 몸체의 상부 내측으로는 상기 유도 코일부로서의 제 4 유도 코일이 감겨지고, 상기 베이스 몸체의 상면 중앙에는 상기 통형상의 끼움 홈부에 끼워져 결합되는 통형상의 삽입 돌기부가 형성되어, 상기 상용 전원에 연결된 제 3 유도 코일과 이에 비접촉식으로 전기적으로 연결된 상기 제 4 유도 코일에 의해 유도 전류가 발생되어 상기 복수개의 엘이디 또는 엘이디 칩이 발광하는 것을 특징으로 하는 비접촉식 전원 공급 방식을 이용한 엘이디 조명등.The method of claim 1,
The ceiling or wall fixing portion has a plate-like fitting groove portion in which a third induction coil as the induction electromotive force portion, which is connected to a commercial power source in the center of the upper surface thereof, is wound around the outer periphery thereof. A fourth induction coil as an induction coil part is wound, and a cylindrical insertion protrusion is formed in the center of the upper surface of the base body to be fitted into and coupled to the cylindrical fitting groove, and thus the third induction coil connected to the commercial power source and the non-contact type Induction current is generated by the fourth induction coil electrically connected to the LED lamps using a non-contact power supply method characterized in that the plurality of LEDs or LED chips to emit light. 제 5 항에 있어서,
상기 베이스 몸체의 상호 대향하는 상단 가장자리에는 두 개의 클립형태의 걸림돌기가 형성되고, 이에 대응하는 상기 판형상의 천장 또는 벽체 고정부의 저면에는 대향하는 두 개의 걸림턱이 형성되어 상기 베이스 몸체와 판형상의 천장 또는 벽체 고정부가 체결 및 고정되는 것을 특징으로 하는 비접촉식 전원 공급 방식을 이용한 엘이디 조명등.The method of claim 5, wherein
The upper edges of the base body, which are opposed to each other, are formed with two clip-like locking projections, and the lower surface of the plate-shaped ceiling or wall fixing portion corresponding to the two locking projections is formed to correspond to the base body and the plate-shaped ceiling. Or LED lighting using a non-contact power supply method characterized in that the fastening and fixing the wall.
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