KR20110130256A - Substrate for photovoltaic module and manufacture methode of the same - Google Patents

Abstract

PURPOSE: A substrate for photovoltaic module and a method of manufacturing the same are provided to improve productivity by forming a circuit part, in a back sheet, electrically connected to a photovoltaic semiconductor and reducing an assembly time. CONSTITUTION: In a substrate for photovoltaic module and a method of manufacturing the same, a photovoltaic semiconductor(100) is formed into a rectangular shape. The photovoltaic semiconductor has a penetration hole which is open up and down. A back sheet(200) is arranged in the lower part of the photovoltaic semiconductor. A circuit part(300) is formed on the top of the back sheet. A circuit part is electrically connected to the anode and cathode of the photovoltaic semiconductor.

Description

Substrate For Photovoltaic Module And Manufacture Methode Of The Same}

The present invention relates to a substrate for a solar cell module, a method for manufacturing the same, and a solar cell module using the same, wherein the solar cell module substrate for converting solar energy into electrical energy using a solar semiconductor, a method for manufacturing the same, and a solar using the same It relates to a battery module.

The solar cell converts solar energy into electrical energy, and semiconductor materials such as silicon, gallium arsenide, cadmium tellurium, cadmium sulfide, indium phosphide, or a combination thereof are used. Silicone is used.

The solar cell is manufactured by a pn junction of a semiconductor material by a diffusion method, and uses a photovoltaic effect that a small amount of current flows when receiving a light, and most ordinary solar cells are a large area pn junction diode When the electromotive force generated at the anode terminal of the pn junction diode is connected to an external circuit, the pn junction diode functions as a unit solar cell or a battery cell.

Since the battery cell formed as described above has a small electromotive force, a plurality of battery cells are connected to form a solar cell module having a suitable electromotive force.

1 is a plan view of a conventional solar cell module.

In the conventional solar cell module, a plurality of photovoltaic semiconductors 2 are disposed in the main body 1, and the photovoltaic semiconductors 2 are electrically connected to each other by a bus ribbon 3.

The bus ribbon 3 has one end connected to the upper portion of the solar semiconductor 2 and the other end connected to the lower portion of the other solar semiconductor 2 adjacent to each other, thereby connecting the plurality of solar semiconductors 2 in series. do.

In the conventional solar cell module, the bus ribbon 3 formed in a roll shape is cut to a predetermined length in order to form the bus ribbon 3 in an actual process, and then welded to the solar semiconductor 2 by hand.

However, the welding of the bus ribbon 3 by positioning it on the solar semiconductor 2 is difficult to work and significantly increases the process time, and the light conversion efficiency is lowered due to the bus ribbon 3 located in the solar light collecting unit. There is.

The present invention is to solve the above problems, by forming a circuit portion electrically connected to the photovoltaic semiconductor on the back sheet, easy and convenient assembly, shorten the assembly time, can improve the light conversion efficiency An object of the present invention is to provide a substrate for a battery module, a manufacturing method thereof, and a solar cell module using the same.

In order to achieve the above object, the solar cell module substrate of the present invention is a solar cell module substrate having a light receiving unit and a photovoltaic semiconductor formed with an anode and a cathode opposite to the light receiving unit. A back sheet disposed; It is formed on the top of the back sheet, and is electrically connected to the solar semiconductor comprises a circuit portion for drawing the current generated in the solar semiconductor to the outside.

The back sheet includes a PET layer made of PET (Polyester) material; It is laminated on one side or the other side of the PET layer, and comprises a fluorine layer made of polyvinyl fluoride (PVF) or polyvinylidene fluoride (PVdf) or ethylene tetrafluoroethylene (EFTE) or Si0₂ material.

The back sheet is disposed between the PET layer and the fluorine layer, and further comprises an aluminum layer made of aluminum.

The thickness of the PET layer is thicker than the thickness of the fluorine layer and the aluminum layer.

The circuit portion includes a wiring layer made of copper, gold, silver, platinum, palladium, chromium or an alloy thereof; And an insulating layer covering the wiring layer.

In order to achieve the above object, a method of manufacturing a substrate for a solar cell module according to the present invention includes a solar cell module substrate having a light receiving unit and a solar semiconductor formed together with an anode and a cathode opposite to the light receiving unit. A back sheet disposed below the; In the manufacturing method of a substrate for a solar cell module formed on top of the back sheet, comprising a circuit portion electrically connected to the solar semiconductor for drawing the current generated in the solar semiconductor to the outside, the back A cutting step of forming a wiring layer on the upper part of the sheet by any one of a laminating method and a deposition method; A circuit forming step of etching the wiring layer in any one of a screen method and a photo method according to a designed pattern; And a solder resist step of completing a circuit part by laminating an insulating layer on the upper part of the wiring layer etched in a designed pattern by either a screen method or a photo method.

A solar cell module substrate having a light receiving unit and a solar semiconductor having an anode and a cathode formed on opposite sides of the light receiving unit, comprising: a back sheet disposed below the solar semiconductor; A circuit unit formed on an upper portion of the backsheet and electrically connected to an anode and a cathode of the solar semiconductor to draw current generated in the solar semiconductor to the outside; A method of manufacturing a substrate for a solar cell module comprising: a printing step of printing a seed circuit in a pattern designed on an upper portion of a back sheet; A plating step of electrolytic or electroless copper plating on the seed circuit; And a solder resist step of stacking an insulating layer on the plated seed circuit to complete the circuit portion.

In order to achieve the above object, the solar cell module of the present invention comprises: a light-receiving unit, a solar semiconductor having an anode and a cathode formed together on the opposite side of the light-receiving unit; A back sheet disposed below the solar semiconductor; It is formed on the top of the back sheet, and is electrically connected to the anode and cathode of the solar semiconductor comprises a circuit portion for drawing the current generated in the solar semiconductor to the outside.

As described above, the substrate for a solar cell module, a method of manufacturing the same, and a solar cell module using the same have the following effects.

By forming a circuit portion in which the conductive material of the solar semiconductor is electrically connected to the back sheet, it is easy to assemble and shorten the assembly time and productivity by attaching the plurality of solar semiconductors to the circuit portion without the need to connect them individually with a bus ribbon. It is effective to improve.

In addition, the bus ribbon, which hindered the light transmission of the solar semiconductor, is removed, thereby maximizing the light conversion efficiency.

1 is a cross-sectional structure diagram of a solar cell module according to the prior art,
2 is a cross-sectional structural view of a solar cell module according to an embodiment of the present invention;
3 is a cross-sectional structural view of a substrate according to an embodiment of the present invention;
4 is a cross-sectional structural view of a substrate according to another embodiment of the present invention;
5 is a manufacturing process of the solar cell module according to an embodiment of the present invention,
6 is a manufacturing process of the mounting step according to an embodiment of the present invention,
7 is a manufacturing process of the laminating method according to an embodiment of the present invention,
8 is a manufacturing process diagram of the deposition method according to an embodiment of the present invention,
9 is a manufacturing process of the solar cell module according to another embodiment of the present invention,
10 is a cross-sectional structural view of a solar cell module according to another embodiment of the present invention;

2 is a cross-sectional structural view of a solar cell module according to an embodiment of the present invention, Figure 3 is a cross-sectional structural view of a back sheet according to an embodiment of the present invention, Figure 4 is a cross section of a back sheet according to another embodiment of the present invention 5 is a manufacturing process diagram of a solar cell module according to an embodiment of the present invention, Figure 6 is a manufacturing process diagram of the mounting step according to an embodiment of the present invention, Figure 7 is a laminating method according to an embodiment of the present invention 8 is a manufacturing process diagram, Figure 8 is a manufacturing process of the deposition method according to an embodiment of the present invention, Figure 9 is a manufacturing process diagram of a solar cell module according to another embodiment of the present invention, Figure 10 is another embodiment of the present invention Cross-sectional structure diagram of a solar cell module according to.

2 to 8, the solar cell module according to the embodiment of the present invention is composed of a solar semiconductor 100 and a substrate, in the embodiment of the present invention the substrate is a backsheet 200 and the circuit portion ( 300).

The solar semiconductor 100 is formed in a quadrangular shape as shown in FIG. 2, and a through hole 110 opened in an up and down direction is formed.

The through hole 110 is filled with a conductive material 120 to electrically connect the upper and lower ends of the solar semiconductor 100.

As described below, the conductive material 120 is electrically connected to the circuit unit 300 to draw current generated from the solar semiconductor 100 to the outside.

The solar semiconductor 100 is made of a plurality, and is regularly spaced between the base frame (410).

The base frame 410 functions as a housing surrounding and fixing the solar cell module.

The base frame 410 is filled with a sealing agent 420 made of ethylene vinyl acetate resin (EVA), and a protective cover 430 is mounted on the sealing agent 420.

The protective cover 430 is made of a transparent material, that is, glass, and passes through the sunlight without being reflected.

In some cases, as shown in FIG. 10, the solar semiconductor 100 may have both an anode (+) and a cathode (−) formed on opposite sides of the light receiving unit of the solar semiconductor 100.

That is, the solar semiconductor 100 may be configured such that an anode (+) and a cathode (−) are respectively disposed in the direction of the back sheet 200, and are electrically connected to the circuit unit 300, respectively.

At this time, the solar semiconductor 100 may or may not include the through hole 100 and the conductive material 120.

The back sheet 200 is mounted under the sealing agent 420 and is disposed under the solar semiconductor 100.

In detail, the backsheet 200 includes an adhesive layer 210, a PET layer 220, and a fluorine layer 230 as shown in FIG. 3.

The adhesive layer 210 is formed thin and made of a material having an adhesive force to easily attach the back sheet 200 to another place.

The PET layer 220 is stacked on the adhesive layer 210, the thickness is formed thicker than the adhesive layer 210.

And the PET layer 220 is made of a PET material, that is, polyester (polyester).

PET is a saturated polyester obtained by condensation polymerization of terephthalic acid and ethylene glycol, and is a crystalline plastic having excellent heat resistance, rigidity, electrical properties, and oil resistance.

The fluorine layer 230 is stacked on top of the PET layer 220, a film made of a fluorine polymer compound.

Specifically, the fluorine layer 230 is made of polyvinyl fluoride (PVF).

In some cases, the fluorine layer 230 may be made of polyvinylidene fluoride (PVdf), ethylene tetrafluoroethylne (EFTE), or Si0₂.

The fluorine layer protects the solar cell module from external shock, corrosion and impurity penetration due to its high weather resistance, UV resistance, chemical stability, moisture barrier, electrical insulation and adhesion.

In addition, the fluorine layer 230 may be disposed above and below the PET layer 220, respectively.

That is, as shown in FIG. 4A, the backsheet 200 may include an adhesive layer 210, a first fluorine layer 230a, a PET layer 220, and a second fluorine layer 230b.

In this case, the thickness of the PET layer 220 is formed to be thicker than the thickness of the adhesive layer 210, the first fluorine layer 230a and the second fluorine layer 230b.

 In some cases, as illustrated in FIG. 4B, an aluminum layer 250 may be inserted between the PET layer 220 and the fluorine layer 230.

In this case, the PET layer 220 is formed to be thicker than the thickness of the adhesive layer 210, the fluorine layer 230 and the aluminum layer 250.

Meanwhile, the circuit part 300 is formed on the back sheet 200.

 The circuit unit 300 is electrically connected to the conductive material 120 to draw current generated from the solar semiconductor 100 to the outside.

More specifically, the circuit unit 300 includes a wiring layer 310 and an insulating layer 320.

The wiring layer 310 is formed of a conductive material through which a current flows, that is, copper, gold, silver, platinum, palladium, chromium, or an alloy thereof.

The insulating layer 320 is an insulator through which no current flows, and is made of a solder resist ink or a coverlay film.

The insulating layer 320 is stacked on the wiring layer 310 to cover the wiring layer 310 except for a part of the insulating layer 320 that requires electrical connection with the solar semiconductor 100.

It describes a method of manufacturing a solar cell module according to an embodiment of the present invention made of the above configuration.

As shown in FIG. 5, the manufacturing method of the solar cell module according to the exemplary embodiment of the present invention includes a preparation step (S10), a cutting step (S20), a circuit forming step (S30), a solder resist step (S40), and a mounting step ( S50) is made.

The preparation step (S10) is a step of forming the through hole 110 in the solar semiconductor 100 and filling the conductive material 120 in the through hole 110.

The cutting step (S20) is a step of stacking the wiring layer 310 on the back sheet 200.

This cutting step (S20) is made of a laminating method.

In the laminating method, as shown in FIG. 7, a step of applying an adhesive resin to the upper portion of the back sheet 200 (S21) and heating and melting the adhesive resin applied to the upper portion of the back sheet 200 is performed. S22 and laminating the wiring layer 310 on the molten adhesive resin and laminating with a roller (S23).

Of course, in some cases, the cutting step (S20) may be made by a deposition method as shown in FIG.

As illustrated in FIG. 8, the deposition method includes a preheating step S26, a cooling step S27, and a sputtering step S28.

On the other hand, the circuit forming step (S30) is a step of etching by processing the wiring layer 310 in a designed pattern.

The circuit forming step (S30) is made of a screen method.

In the screen method, an etching resist is selectively printed on the wiring layer 310 by using a screen, the etching resist is not printed on the wiring layer 310, and the remaining etching resist is peeled off to form a circuit. do.

Of course, the circuit forming step S30 may be performed by a photo method.

The photo method closely adheres the dry film to the wiring layer 310, selectively irradiates the Art Work film, and forms an unexposed portion of the dry film.

Thereafter, the portion formed in the wiring layer 310 is etched, and the remaining etching resist is peeled off to form a circuit.

The solder resist step S40 is a step of completing the circuit part 300 by stacking the insulating layer 320 on the wiring layer 310 etched in a designed pattern after the circuit forming step S30 is completed.

The solder resist step (S40) is made of a screen method.

In the screen method, a solder resist is selectively printed on the wiring layer 310 using a screen to form the insulating layer 320 on the wiring layer 310.

Of course, in some cases, the solder resist step (S40) may be made by a photo method.

The photo method completely prints a solder resist on the wiring layer 310 and selectively exposes an art work film thereon.

The unexposed solder resist ink is developed to form the insulating layer 320.

Thereafter, in the mounting step S50, the solar semiconductor 100 is disposed on the circuit unit 300 to electrically connect the circuit unit 300 to the conductive material 120.

Specifically, the mounting step (S50) is composed of a coating step (S51), an alignment step (S52), a curing step (S53) as shown in FIG.

In the coating step (S51), the conductive adhesive is dispensed on the circuit unit 300.

That is, a small amount of the conductive adhesive is applied to the upper portion of the wiring layer 310 which is not covered with the insulating layer 320.

In addition, in the alignment step S52, the solar semiconductor 100 is arranged so that the through hole 110 coincides with the application point of the conductive adhesive on the circuit part 300 to which the conductive adhesive is applied.

Thereafter, in the curing step (S53), the conductive adhesive is cured to fix the solar semiconductor 100 to the backsheet 200 while the wiring layer 310 of the conductive material 120 and the circuit unit 300 is fixed. Is electrically connected.

In some cases, the mounting step (S50) may use a solder cream instead of a conductive adhesive.

The mounting step (S50) using the solder cream is made including a coating step, an alignment step, a reflow step.

In the coating step, the solder cream is applied to the upper portion of the circuit unit 300.

In the alignment step, the photovoltaic semiconductor 100 is arranged so that the through-hole 110 coincides with the application point of the solder cream on the circuit portion 300 on which the solder cream is applied.

Thereafter, in the reflow step, the solder cream is heated and solidified to electrically connect the conductive material 120 and the circuit unit 300 while fixing the solar semiconductor 100 to the backsheet 200. .

In some cases, as illustrated in FIG. 9, the wiring layer 310 of the solar cell module substrate may be formed by a plating method.

In this case, as illustrated in FIG. 9, the seed circuit is printed in a pattern designed on the back sheet 200 in the printing step S120.

In the plating step S130, the seed circuit is copper plated electrolytically or electrolessly to form a wiring layer 310.

The solar cell module substrate of the present invention, a method for manufacturing the same, and a solar cell module using the same are not limited to the above-described embodiments, and may be variously modified within a range that allows the technical idea of the present invention.

100: solar semiconductor, 110: through hole, 120: conductive material, 200: back sheet, 210: adhesive layer, 220: PET layer, 230: fluorine layer, 240: silicon layer, 250: aluminum layer, 300: circuit part, 310 : Wiring layer, 320: insulating layer, 410: base frame, 420: sealing agent, 430: protective cover, S10: preparation step, S20: cutting step, S30: circuit forming step, S40: solder resist step, S50: mounting step,

Claims (8)

In the solar cell module substrate mounted with a light receiving unit, and a solar semiconductor formed with an anode and a cathode opposite to the light receiving unit,
A back sheet disposed below the solar semiconductor;
The solar cell module substrate is formed on an upper portion of the backsheet, and electrically connected to the anode and the cathode of the solar semiconductor, and includes a circuit unit for drawing current generated in the solar semiconductor to the outside. . The method of claim 1,
The back sheet,
A PET layer made of PET (Polyester) material;
Is laminated on one side or the other side of the PET layer, PVF (Poly vinyl fluoride) or PVdf (Polyvinylidene Fluoride) PVF (Ethylene Tetrafluoroethylene) or a substrate for a solar cell module comprising a fluorine layer made of Si0₂ material. The method of claim 2,
The back sheet is disposed between the PET layer and the fluorine layer, the solar cell module substrate, characterized in that further comprises an aluminum layer made of aluminum. The method according to claim 2 or 3,
The thickness of the PET layer is a solar cell module substrate, characterized in that thicker than the thickness of the fluorine layer and the aluminum layer. The method according to any one of claims 1 to 3,
The circuit portion,
A wiring layer made of copper, gold, silver, platinum, palladium, chromium or an alloy thereof;
A solar cell module substrate comprising an insulating layer covering the wiring layer. A solar cell module substrate on which a light receiving unit and a solar semiconductor having a positive electrode and a negative electrode are formed on opposite sides of the light receiving unit are mounted. In the method of manufacturing a substrate for a solar cell module comprising a circuit portion electrically connected to the anode and cathode of the solar semiconductor to draw the current generated in the solar semiconductor to the outside,
A cutting step of forming a wiring layer on the upper part of the back sheet by any one of a laminating method and a deposition method;
A circuit forming step of etching the wiring layer in any one of a screen method and a photo method according to a designed pattern;
A method of manufacturing a substrate for a solar cell module comprising a solder resist step of forming a circuit layer by forming an insulating layer on the etched wiring layer by any one of a screen method and a photo method. A solar cell module substrate on which a light receiving unit and a solar semiconductor having a positive electrode and a negative electrode are formed on opposite sides of the light receiving unit are mounted. In the method of manufacturing a substrate for a solar cell module comprising a circuit portion electrically connected to the anode and cathode of the solar semiconductor to draw the current generated in the solar semiconductor to the outside,
A printing step of printing a seed circuit in a pattern designed on the back sheet;
A plating step of electrolytic or electroless copper plating on the seed circuit;
And a solder resist step of completing a circuit part by forming an insulating layer on the plated seed circuit. A photovoltaic semiconductor having a light receiving portion and an anode and a cathode formed on opposite sides of the light receiving portion;
A back sheet disposed below the solar semiconductor;
Is formed on top of the back sheet, the solar cell module, characterized in that it comprises a circuit for electrically connected to the anode and the cathode of the solar semiconductor to draw the current generated in the solar semiconductor to the outside.

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