KR20110117928A - Cover film for circuit board and circuit board assembly having the same - Google Patents

Cover film for circuit board and circuit board assembly having the same Download PDF

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Publication number
KR20110117928A
KR20110117928A KR1020100037437A KR20100037437A KR20110117928A KR 20110117928 A KR20110117928 A KR 20110117928A KR 1020100037437 A KR1020100037437 A KR 1020100037437A KR 20100037437 A KR20100037437 A KR 20100037437A KR 20110117928 A KR20110117928 A KR 20110117928A
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KR
South Korea
Prior art keywords
circuit board
cover film
insulating layer
layer
heat
Prior art date
Application number
KR1020100037437A
Other languages
Korean (ko)
Inventor
이성규
정인원
Original Assignee
이성규
정인원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이성규, 정인원 filed Critical 이성규
Priority to KR1020100037437A priority Critical patent/KR20110117928A/en
Publication of KR20110117928A publication Critical patent/KR20110117928A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

The present invention is attached to one surface of the circuit board, the cover film for a circuit board for protecting the circuit board, the insulating layer, provided on the lower surface of the insulating layer and an adhesive layer for bonding the insulating layer and the circuit board And a heat transfer particle dispersed in the adhesive layer and transferring heat generated from the circuit board to the insulating layer, and a circuit board assembly including the circuit board. It is to provide a structure of a cover film for a circuit board further comprising a heat dissipation function for releasing heat generated from the substrate.

Description

COVER FILM FOR CIRCUIT BOARD AND CIRCUIT BOARD ASSEMBLY HAVING THE SAME

The present invention relates to a circuit board cover film for protecting a circuit board and a circuit board assembly having the same.

In general, electronic devices have chips, electronic components, and the like for operating them, and they have a structure mounted on a circuit board. In the circuit board, wirings that make up an electric circuit are patterned, and they are connected to respective electronic components. Since the circuit pattern of the circuit board is vulnerable to external impact or scratches, a structure for protecting the circuit board is required, and solder resist is generally used as such a structure.

Recently, the use of flexible printed circuit boards (FPCBs) that can be bent or folded due to miniaturization and high integration of electronic devices has increased, and flexible printed circuit boards have cover films to protect circuit patterns. It is used. 1 illustrates a structure of a cover film for a general flexible printed circuit board.

Referring to FIG. 1, a cover film 10 is attached to a circuit board 20.

The circuit board 20 includes an insulating member 21 and a circuit pattern 22 in which a conductive material is patterned. The cover film 10 includes an insulating layer 11, an adhesive layer 12 for bonding the insulating layer 21 and the circuit board 20 to each other.

According to such a configuration, the cover film 10 has a structure in which the insulating layer 21 covers the circuit pattern 22 to protect the circuit pattern 22 from the outside.

The present invention provides a cover film for a circuit board further comprising a heat dissipation function for releasing heat generated from the circuit board as a cover film of a different form from the conventional art.

In order to achieve the above object, the present invention is attached to one surface of a circuit board, the cover film for a circuit board for protecting the circuit board, the insulating layer, provided on the lower surface of the insulating layer, the insulating layer and the circuit An adhesive layer for adhering a substrate, and a cover film for a circuit board comprising a heat transfer particles formed in the interior of the adhesive layer to transfer the heat generated from the circuit board to the insulating layer and a circuit having the same Disclosed is a substrate assembly.

The circuit board has a form of a flexible circuit board that can be bent and deformed, and the insulating layer can be formed of a material that can be bent and deformed according to the bending deformation of the circuit board. The insulating layer may be formed of any one of polyimide (PI), polyphenylene sulfide (PPS), and liquid crystal polymer (LCP).

The heat transfer particles may be formed of any one of alumina (Al 2 O 3 ), silica (SiO 2 ), carbon nanotubes (CNT), and aluminum nitride (AlN).

A heat dissipation coating layer for dissipating heat of the insulation layer to the outside may be further formed on the outer surface of the insulation layer, and the heat dissipation coating layer may be formed of titanium oxide (TIO 2 ) material.

According to the present invention having the above configuration, it is possible to implement a cover film having a heat dissipation function by dispersing the heat transfer particles in the adhesive layer.

In addition, the present invention can further improve the heat dissipation effect by further forming a heat dissipation coating layer on the insulator layer.

1 is a cross-sectional view showing the structure of a cover film for a circuit board according to the prior art.
2 is a cross-sectional view of a cover film for a circuit board according to an embodiment of the present invention.
3 is a cross-sectional view of the circuit board assembly to which the cover film of FIG. 2 is applied.
4 is a cross-sectional view of a circuit board assembly to which a cover film is applied according to another embodiment of the present invention.

Hereinafter, a circuit board cover film and a circuit board assembly having the same according to the present invention will be described in detail with reference to the accompanying drawings.

2 is a cross-sectional view of a cover film for a circuit board according to an embodiment of the present invention, and FIG. 3 is a cross-sectional view of a circuit board assembly to which the cover film of FIG. 2 is applied.

The cover film 100 for the circuit board of the present embodiment includes an insulating layer 110, an adhesive layer 120, and heat transfer particles 130.

The insulating layer 110 constitutes a substantial appearance of the cover film 100, and functions to protect the circuit pattern 22 of the circuit board 20 from the outside.

The cover film 100 for a circuit board of the present invention can be applied to both a rigid substrate and a flexible substrate, but this embodiment will be described based on the application to the flexible substrate (flexible circuit board). When the circuit board 20 has a form of a flexible circuit board that can be bent or folded, the insulating layer 110 can be formed of a material that can be bent and deformed according to the deformation of the circuit board 20. Mid (PI: polyimide), polyphenylene sulfide (PPS: polyphenylene sulfide), a liquid crystal polymer (LCP: liquid crystal polymer), and the like. The insulating member 21 of the circuit board 20 may also be formed of such a material.

The adhesive layer 120 is provided on the lower surface of the insulating layer 110 to bond the insulating layer 110 and the circuit board 20. The adhesive layer 120 is formed of an insulating adhesive material.

The heat transfer particles 130 are dispersed in the adhesive layer 120 and serve to transfer the heat generated from the circuit board 20 to the insulating layer 110. A material having excellent heat transfer rate may be used as the heat transfer particles 130, and examples of the material may include alumina (Al 2 O 3 ), silica (SiO 2 ), carbon nanotubes (CNT), and aluminum nitride (AlN). have.

According to the present invention, the adhesive layer 120 in which the heat transfer particles 130 are dispersed may be formed by applying the adhesive paste in which the heat transfer particles 130 are dispersed to the insulating layer 110. When the cover film 100 configured as described above is placed on the circuit board 20 and thermally compressed, the cover film 100 is attached to the circuit board 20. In this process, some of the heat transfer particles 130 are in contact with the circuit pattern 22 of the circuit board 20.

Arrows in FIG. 3 indicate the direction of travel of the columns. Heat generated in the circuit pattern 22 is transferred to the heat transfer particles 130, and the heat transfer particles 130 transfer heat to the insulating layer 110 by heat transfer processes such as conduction and convection to be released to the outside.

As described above, the cover film 100 of the present invention performs not only a function of protecting the circuit pattern 22 of the circuit board 20 but also a function of releasing heat generated from the circuit board 20. Accordingly, as the temperature of the circuit board 20 rises, it is possible to prevent a phenomenon such as noise occurring in the circuit board 20 or malfunctioning of the circuit.

4 is a cross-sectional view illustrating a circuit board assembly to which a cover film according to another embodiment of the present invention is applied.

The cover film 200 according to the present embodiment includes the insulating layer 210, the adhesive layer 220, and the heat transfer particles 230 as in the previous embodiment, and the description thereof will be replaced with the above description. The cover film 200 according to the present exemplary embodiment includes a heat dissipation coating layer 240 coated on the outer surface of the insulating layer 210 in addition to the components of the foregoing exemplary embodiment.

The heat dissipation coating layer 240 is a material having a very excellent heat transfer rate, and serves to release the heat of the insulating layer 210 to the outside. The heat dissipation coating layer 240 may be formed by coating a material such as titanium oxide (TiO 2 ) on the outer surface of the insulating layer 210. Since titanium oxide (TiO 2 ) has a very high reflectance, when the light emitting device is mounted on the circuit board 20, the light emitted from the light emitting device may be reflected to improve luminous efficiency. However, this is not limited to titanium oxide (TiO 2 ), and titanium oxide (TiO 2 ) may be replaced with a material having high reflectance and excellent heat transfer rate.

Heat generated in the circuit pattern 22 of the circuit board 20 is transferred to the heat dissipation coating layer 240 through the heat transfer particles 230 and the insulating layer 210, and heat is released from the heat dissipation coating layer 240. . As such, the present embodiment further improves the heat dissipation function by further coating the heat dissipation coating layer 240 on the insulating layer 210.

The above-described cover film for a circuit board and a circuit board assembly having the same are not limited to the configuration and method of the above-described embodiments, but the embodiments are all or part of each of the embodiments so that various modifications can be made. It may be configured in combination.

Claims (7)

In the cover film for a circuit board attached to one side of the circuit board, for protecting the circuit board,
Insulating layer;
An adhesive layer provided on a lower surface of the insulating layer to bond the insulating layer and the circuit board to each other; And
The cover film for a circuit board, which is dispersed in the adhesive layer and includes heat transfer particles to transfer heat generated from the circuit board to the insulating layer. The method of claim 1,
The circuit board has the form of a flexible circuit board capable of bending deformation.
The insulating layer is a circuit board cover film, characterized in that formed of a material that can be bent deformation in accordance with the bending deformation of the circuit board. The method of claim 2,
The insulating layer is a cover film for a circuit board, characterized in that formed of any one of polyimide (PI: polyimide), polyphenylene sulfide (PPS: polyphenylene sulfide), and liquid crystal polymer (LCP). The method of claim 1,
The heat transfer particles are a cover film for a circuit board, characterized in that formed of any one of alumina (Al 2 O 3 ), silica (SiO 2 ), carbon nanotubes (CNT), and aluminum nitride (AlN). The method of claim 1,
The coating film is formed on the outer surface of the insulating layer, the cover film for a circuit board further comprising a heat dissipation coating layer for dissipating heat of the insulating layer to the outside. The method of claim 5,
The heat dissipation coating layer is a cover film for a circuit board, characterized in that formed of titanium oxide (TIO 2 ) material. Circuit board; And
A circuit board assembly comprising a cover film for a circuit board according to any one of claims 1 to 6 attached to one surface of the circuit board to protect the circuit board.
KR1020100037437A 2010-04-22 2010-04-22 Cover film for circuit board and circuit board assembly having the same KR20110117928A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020100037437A KR20110117928A (en) 2010-04-22 2010-04-22 Cover film for circuit board and circuit board assembly having the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100037437A KR20110117928A (en) 2010-04-22 2010-04-22 Cover film for circuit board and circuit board assembly having the same

Publications (1)

Publication Number Publication Date
KR20110117928A true KR20110117928A (en) 2011-10-28

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KR1020100037437A KR20110117928A (en) 2010-04-22 2010-04-22 Cover film for circuit board and circuit board assembly having the same

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KR (1) KR20110117928A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018016829A1 (en) * 2016-07-20 2018-01-25 스템코 주식회사 Flexible circuit board and manufacturing method therefor
KR20210039993A (en) 2021-03-23 2021-04-12 김계성 Electric insulation cover for circuit board of LED lighting

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018016829A1 (en) * 2016-07-20 2018-01-25 스템코 주식회사 Flexible circuit board and manufacturing method therefor
KR20180010064A (en) * 2016-07-20 2018-01-30 스템코 주식회사 Flexible printed circuit boards and method for fabricating the same
CN109804717A (en) * 2016-07-20 2019-05-24 斯天克有限公司 Flexible circuit board and its manufacturing method
KR20210039993A (en) 2021-03-23 2021-04-12 김계성 Electric insulation cover for circuit board of LED lighting

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