KR20110102044A - Molding apparatus for manufacturing semi-conductor package - Google Patents

Abstract

The mold apparatus for manufacturing a semiconductor package according to the present invention includes a lower mold having a storage space for fixing a package semifinished product, an upper mold disposed on an upper surface of the lower mold and having a cavity into which a molding resin is injected, and a linear movement to the upper mold. It is installed so as to, and is composed of a plurality of eject pins in contact with the side of the molding resin and arranged along the circumferential surface of the molding resin, it is possible to remove the pin marks on the package by making the eject pins in close contact with the side of the semiconductor package, As a result, waste of materials can be reduced, and a manufacturing process can be shortened, thereby improving productivity.

Description

Mold device for semiconductor package manufacturing {MOLDING APPARATUS FOR MANUFACTURING SEMI-CONDUCTOR PACKAGE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold apparatus for manufacturing a semiconductor package by completing a semiconductor package by molding a semi-finished product, in which a semiconductor chip is mounted on a substrate and completed with wire bonding, using a molding resin.

In the semiconductor package manufacturing process, the molding process is a package semi-finished product in which a semiconductor chip is mounted on a substrate such as a leadframe or a printed circuit board (PCB) and the electrical connection is completed by wire bonding. Is a process of sealing semiconductor chips and electrical connections for protection from physical or chemical external environments.

Most of these molding processes are mainly used for the transfer molding method using an epoxy molding compound (EMC), which is a molding resin having excellent economical efficiency, mass productivity, and excellent water absorption.

In the transfer molding method, a tablet of a solid epoxy molding compound is heated and melted to have a constant viscosity, and then injected into a cavity of a molding die in which a package semifinished product is inserted and cured by a portion of the semifinished product package. It is a way to seal.

1 is a cross-sectional view showing a mold apparatus for manufacturing a semiconductor package according to the prior art.

The mold apparatus for manufacturing a semiconductor package according to the related art shown in FIG. 1 is an example of a molding apparatus of a transfer molding method, in which a semiconductor chip 120 is mounted on a printed circuit board 110, and the package semifinished product 100 is electrically connected with a bonding wire. It is a mold apparatus for sealing the upper surface of one side with a molding resin, that is, epoxy molding compound 150.

The conventional mold apparatus includes a lower mold 200 and an upper mold 300 through which the package semifinished product 100 is interposed. The lower mold 200 is provided with an accommodating space 210 for accommodating the printed circuit board 110, and a cavity 320 into which the epoxy molding compound 310 is injected is formed in the upper mold 300.

In addition, a gate 420 into which the epoxy molding compound 310 is injected into the cavity 320 and a runner 410 connected to the gate 420 are formed on side surfaces of the upper mold 300 and the lower mold 200. . In the upper mold 300, an eject pin 400 for separating the package semifinished product 100 from the lower mold 200 after completion of molding of the package semifinished product 100 is installed to be able to lift up and down.

An upper side of the upper mold 300 is provided with a pin plate 430 into which the eject pin 400 is inserted, and a dry plate 440 in contact with an end of the eject pin 400.

Looking at the operation of the mold apparatus for manufacturing a conventional semiconductor package, the epoxy molding compound 310 is the upper through the gate 410 in the state that the package semi-finished product 100 is accommodated in the receiving space 210 formed in the lower mold 200. It is injected into the cavity 320 of the mold 300.

After the molding of the package semifinished product 100 is completed, the upper mold 300 and the lower mold 200 are separated up and down, and the eject pin 400 is lifted to separate the package semifinished product 100 from the lower mold 200. .

2 is a top view of an epoxy molding compound into which an eject pin according to the prior art is inserted.

The side surface of the epoxy molding compound 310 injected into the cavity 320 is formed in an inclined surface shape so that it can be easily withdrawn from the upper mold 300. Therefore, in order to lift the epoxy molding compound 310 to the eject pin 400, the eject pins 400 contact the surface of the epoxy molding compound 310 at a predetermined interval in the circumferential direction.

Therefore, when the eject pin 400 is linearly moved to separate the molded package from the mold, a pin bureau 480 is formed on the surface of the epoxy molding compound 310, and the pin trace 480 completes the product. Afterwards, the epoxy molding compound 310 should be cut along the cutting line P to remove the portion where the pin marks 480 are formed.

As described above, the mold apparatus for manufacturing a semiconductor package according to the related art has to cut an edge of an epoxy molding compound in order to remove pin marks, which are ejected pins. There is a problem in that the waste of waste increases and thus the manufacturing cost increases.

The present invention provides a mold apparatus for manufacturing a semiconductor package that can improve productivity by preventing pin marks from forming in a molded epoxy molding compound.

The technical problem to be achieved by the present invention is not limited to the technical problem mentioned above, and other technical problems not mentioned above may be clearly understood by those skilled in the art from the following description. will be.

In one embodiment, the mold apparatus for manufacturing a semiconductor package includes a lower mold having a receiving space for fixing a package semifinished product, an upper mold disposed on an upper surface of the lower mold and having a cavity into which molding resin is injected, and a straight line on the upper mold. It is movably installed, and includes a plurality of eject pins in contact with the side surface of the molding resin and arranged along the circumferential surface of the molding resin.

The upper mold is lifted in the vertical direction to adjust the height of the cavity, the upper surface of the lifting plate is formed with a first inclined surface, and the upper surface of the lifting plate is disposed, the lower surface corresponding to the first inclined surface A slide plate having two inclined surfaces and moving linearly, a front end key and a rear end key disposed on the front and rear surfaces of the elevating plate to guide the elevating plate up and down, and forming a side surface of the cavity; A cover plate disposed on an upper surface of the plate, the edges of which are fixed to the front end key and the rear end key, and an operation unit for linearly moving the slide plate.

According to the mold apparatus for manufacturing a semiconductor package of the present invention, the eject pins can be brought into close contact with the side surfaces of the molding resin, thereby preventing the formation of pin marks on the surface of the semiconductor package. Therefore, it is not necessary to cut a portion where pin marks are formed after completing the semiconductor package, thereby reducing waste of materials and shortening the manufacturing process, thereby improving productivity.

1 is a cross-sectional view showing a mold apparatus for manufacturing a semiconductor package according to the prior art.
2 is a top view of a molded semiconductor package according to the prior art.
3 is a cross-sectional view showing a mold apparatus for manufacturing a semiconductor package according to an embodiment of the present invention.
4 is a top view of a slide plate according to an embodiment of the present invention.
5 is a side view of a slide plate according to an embodiment of the present invention.
6 is a top view of a molded semiconductor package according to an embodiment of the present invention.
7 is a partial cross-sectional view of a mold apparatus for manufacturing a semiconductor package according to an embodiment of the present invention.
8 is a partial cross-sectional view of a mold apparatus showing an operating part according to an embodiment of the present invention.
9 and 10 is an operating state diagram showing an operating state of the upper mold according to an embodiment of the present invention.
11 and 12 are operating state diagrams of a mold apparatus for manufacturing a semiconductor package according to an embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In this process, the size or shape of the components shown in the drawings may be exaggerated for clarity and convenience of description. In addition, terms that are specifically defined in consideration of the configuration and operation of the present invention may vary depending on the intention or custom of the user or operator. Definitions of these terms should be made based on the contents throughout the specification.

3 is a cross-sectional view showing a mold apparatus for manufacturing a semiconductor package according to an embodiment of the present invention.

The mold apparatus for manufacturing a semiconductor package according to an embodiment of the present invention includes a lower mold 20 to which the package semifinished product 10 is fixed, and an upper mold 30 having a cavity 40 having a variable height. .

In the package semifinished product 10, a semiconductor chip 12 is mounted on a substrate 14, and electrical connection is completed by wire bonding. Bonding is performed using wires between each lead of the semiconductor chip 12 and an internal lead of the substrate 14, thereby making an electrical connection. The substrate 14 may be a lead frame or a printed circuit board (PCB). The semiconductor chip 12 is attached to the chip mounting plate of the substrate 14, and then a wire bonding process is performed through the wire bonder. That is, the package semifinished product 10 refers to a state in which the semiconductor chip 12 is bonded to the substrate 14 through the wire 130. The molding process is performed to protect the package semifinished product 10 from the outside, and to use the mold apparatus according to an embodiment of the present invention to perform this molding process.

The upper surface of the lower mold 20 is formed with a receiving space 22 for receiving the package semi-finished product 10.

The molding thickness of the molding resin 42 is determined by the height T1 of the cavity 40 formed in the upper mold 30. The molding thickness of the molding resin 42 is changed according to the product type of the semiconductor package 10.

To this end, the upper mold 30 allows the height T1 of the cavity 40 to be adjusted to control the molding thickness of the molding resin 42.

The upper mold 30 includes an elevating plate 32 elevating in the vertical direction to adjust the height of the cavity 40, a slide plate 34 disposed on the upper surface of the elevating plate 32 so as to be linearly movable, and a slide. And an actuating part 50 for linearly moving the plate 34.

The lifting plate 32 has a bottom surface of which forms a bottom surface of the cavity 40, and a first slope surface 52 that is in contact with the slide plate 34 is formed on the top surface of the lifting plate 32.

In addition, the front end key 36 and the rear end key 38 are disposed at the front and rear of the elevating plate 32 to guide the elevating plate 32 to elevate and form an inner surface of the cavity 40. do.

The front entry key 36 is formed with a gate 46 into which an epoxy molding compound, which is a molding resin 42, is injected into the cavity 40.

As shown in FIGS. 4 and 5, the slide plate 34 has a second inclined surface 54 corresponding to the first inclined surface 52 and an operation part 50 connected to one side thereof. The screw groove 60 and the fixing groove 62 are formed. As described above, since the elevating plate 32 and the slide plate 34 are in contact with the first inclined plane 52 and the second inclined plane 54, the elevating plate 32 moves up and down when the slide plate 34 is linearly moved. do.

The cover plate 64 is installed on the upper surface of the slide plate 34 to support the slide plate 34 to be linearly moved. The cover plate 64 is fixed at the upper end of the front end key 36 and the rear end key 38 to form an inner space 66 in which the slide plate 34 is linearly moved.

Since the slide plate 34 is in a state where the cover plate 64 is in contact with the upper surface, the slide plate 34 does not flow vertically, and only linear movement.

The upper mold 30 is provided with an eject pin 70 for separating the package semifinished product 10 from the lower mold 20 after completion of molding of the package semifinished product 10.

6 is a plan view showing that the eject pins are arranged in the molded resin according to an embodiment of the present invention.

The eject pin 70 is disposed in contact with the side face of the molded molding resin 42. That is, in the state in close contact with the side surface of the molding resin 42, a plurality of them are arranged along the circumferential surface of the molding resin 42 at regular intervals.

And the side surface of the shaping | molding resin 42 is formed in a vertical plane. That is, since the side surface of the molding resin 42 is formed by the front end key 36 and the rear end key 38, the side surface of the molding resin is formed in the vertical plane.

The eject pin 70 is formed in a polygonal cross section in order to widen the contact area with the side surface of the molding resin 42. More preferably, the cross section of the eject pin 70 is formed in a rectangular shape and is in surface contact with the side surface of the molding resin 42.

As such, since the eject pin 70 is in close contact with the side surface of the molding resin 42, it is not necessary to cut the molding resin 42 after molding is completed, thereby reducing the waste of materials and reducing the manufacturing process.

Inner surfaces of the front end key 36 and the rear end key 38 are formed with guide holes 28a and 28b for guiding the eject pin 70 to be elevated in the vertical direction as shown in FIG. 7. Here, the guide holes 28a and 28b are formed in such a manner that the side surfaces of the front and rear end keys 36 and 38 are open.

The slide plate 34 is formed with a slot 56 through which the eject pin 70 passes. Here, the length of the slot 56 is formed to be equal to or greater than the maximum length that the slide plate 34 is linearly moved so that the eject pin 70 does not interfere with the linear movement of the slide plate 34. The slot 56 is formed to open to the side of the slide plate 34.

As shown in FIG. 8, the operation part 50 is provided with a protective cover 72 mounted on an outer surface of the front end key 36 and disposed inside the protective cover 72 and formed on the slide plate 34. It comprises a screw 74 is screwed to the screw groove 60 is rotatably supported by the front end key (36).

The screw 74 is screwed into the screw groove 60 of the slide plate 34, passes through the support hole 88 formed in the front end key 36, and the screw head 90 is inside the protective cover 72. Is placed on. In addition, a snap ring 86 is installed on an outer circumferential surface of the screw 74 positioned at both side surfaces of the support hole 88 to prevent the screw 74 from linearly moving in the support hole 88.

In addition to the snap ring, any structure may be applied as long as the structure is supported so that the screw 74 is not linearly moved to the support hole 88.

The protective cover 72 has an inner space 76 formed therein, and at one side thereof, a through hole 84 through which a tool for adjusting the screw 74 passes is formed.

When the operating unit 50 rotates the screw 74 in the forward or reverse direction, the slide plate 34 screwed with the screw 74 is linearly moved.

The operation part 50 is coupled to the fixing groove 62 formed at one side of the slide plate 34, and the other side is the operation rod 78 is located in the inner space 76 of the protective cover 72, this operation It further includes a gauge block 82 fitted in the gap between the end of the rod 78 and the inner surface of the protective cover 72 to determine the height T1 of the cavity 40.

The gauge block 82 is provided with a plurality of thicknesses different from each other, and the thickness T2 of the gauge blocks 82 corresponds to the height T1 of the cavity 40. That is, for example, when the thickness of the molding resin 42 is determined, the screw 74 is rotated to move the lifting plate 32 upward or downward, and corresponds to the height T1 of the cavity 40. When the gauge block 82 having the thickness T2 is fitted into the gap between the actuating rod 78 and the protective cover 72, the height T1 of the cavity 40 is determined as the desired height.

As described above, the operation of the mold apparatus for manufacturing a semiconductor package according to the embodiment of the present invention constituted will be described below.

First, the process of adjusting the molding thickness of the molding resin will be described.

9 and 10 is an operating state diagram showing controlling the molding thickness of the molding resin according to an embodiment of the present invention.

First, as shown in FIG. 9, when the screw 74 is rotated in the forward direction, the screw 74 is tightened to the screw groove 60. Then, the slide plate 34 is linearly moved in the direction of the arrow A, and thus the lifting plate 32 is moved upward in the direction of the arrow B, thereby increasing the height of the cavity 40 and molding resin as the cavity height is increased. The thickness of 42 is increased.

And, as the operation rod 78 fixed to the slide plate 34 is moved to the inside of the protective cover 72, the gap between the operating rod 78 and the inner surface of the protective cover 72 is reduced. Then, the gauge block 82 having a small thickness is fitted into this gap. At this time, the thickness of the gauge block 82 corresponds to the height of the cavity 40, and when the thickness of the gauge block 82 is checked, the height of the cavity can be known.

On the contrary, as shown in FIG. 10, when the screw 74 is rotated in the reverse direction, the screw 74 is loosened to the screw groove 60. Then, the slide plate 34 is linearly moved in the direction of arrow C. Accordingly, the height of the cavity 40 is lowered while the lifting plate 32 is moved downward in the direction of the arrow D. FIG. Therefore, the thickness of the molding resin is reduced as the cavity height is lowered.

At this time, a gap between the working rod 78 fixed to the slide plate 34 and the inner surface of the protective cover 72 is opened, and the gauge block 82 having a large thickness is fitted into the gap. In this case, the thickness of the gauge block 82 corresponds to the height of the cavity, and when the thickness of the gauge block 82 is checked, the height of the cavity can be known.

As such, when the elevating plate is elevated in the vertical direction by rotating the screw in the forward or reverse direction, the height of the cavity can be adjusted, and the height of the cavity can be determined by checking the thickness of the gauge block. It is possible to control the thickness of the molding resin without replacement.

11 and 12 are operating state diagrams of a mold apparatus for manufacturing a semiconductor package according to an embodiment of the present invention.

As described above, when the height adjustment of the cavity is completed, as shown in FIG. 11, the upper mold 30 and the lower mold 20 are separated and then packaged in the storage space 22 of the lower mold 20. The semifinished product 10 is fixed. Then, the upper mold 30 and the lower mold 20 are coupled to each other, and as shown in FIG. 3, a molding resin is injected into the cavity through a Kate to mold the package semifinished product.

Then, when the molding of the package semifinished product 100 is completed, as shown in FIG. 12, the upper and lower molds 30 and 20 are separated up and down and the eject pin 40 is raised to raise the package semifinished product 10. Is separated from the lower mold 20.

At this time, since the eject pin 70 is in close contact with the side of the molded molding resin 42, it is not necessary to cut the molding resin 42 after completion, thereby reducing material waste and shortening the manufacturing process.

 On the other hand, in the mold apparatus for manufacturing a semiconductor package of the present invention, the lower surface of the upper mold 30 and the upper surface of the lower mold 20 coincide with each other as the lower mold 20 is fixed and lifted up and down. The package semi-finished product 10 may be molded after contact and pressurization, and the package semi-finished product 10 may be molded by lowering the lower die 20 while the upper die 30 is fixed. That is, in any case, any mold apparatus provided with the features of the present invention will be said to belong to the scope of the present invention.

The embodiments of the present invention described above and illustrated in the drawings should not be construed as limiting the technical idea of the present invention. The protection scope of the present invention is limited only by the matters described in the claims, and those skilled in the art can change and change the technical idea of the present invention in various forms. Therefore, such improvements and modifications will fall within the protection scope of the present invention, as will be apparent to those skilled in the art.

10: package semi-finished product 12: semiconductor chip
14: substrate 20: lower mold
22: storage space 30: upper mold
32: elevating plate 34: slide plate
36: front end key 38: rear end key
40: cavity 42: molding resin
50: operating part 52: the first inclined surface
54: second slope 60: screw groove
64: cover plate 70: eject pin
72: protective cover 74: screw
78: working rod 82: gauge block

Claims (6)

A lower mold having a receiving space to which the package semi-finished product is fixed;
An upper mold disposed on an upper surface of the lower mold and formed with a cavity into which a molding resin is injected; And
A mold apparatus for manufacturing a semiconductor package including a plurality of eject pins installed on the upper mold so as to be linearly movable and contacting side surfaces of the molding resin and arranged along a circumferential surface of the molding resin. The method of claim 1,
The upper mold is elevated in the vertical direction to adjust the height of the cavity, the lifting plate is formed with a first slope on the upper surface;
A slide plate disposed on an upper surface of the elevating plate and linearly moved, and having a second sloped surface corresponding to the first sloped surface on a lower surface thereof;
A front end key and a rear end key disposed on the front and rear surfaces of the elevating plate to guide the elevating plate to move up and down, and forming a side surface of the cavity;
A cover plate disposed on an upper surface of the slide plate and whose edges are fixed to the front end key and the rear end key; And
Mold apparatus for manufacturing a semiconductor package comprising an operation unit for linearly moving the slide plate. The method of claim 1,
The eject pin is formed in a polygonal cross-section is a mold device for manufacturing a semiconductor package that is in surface contact with the side surface of the molding resin. The method of claim 2,
Mold device for manufacturing a semiconductor package is formed on the inner surface of the front end key and the rear end key to guide holes for guiding the eject pin up and down. The method of claim 2,
The slide plate is formed with a slot through which the eject pin passes, the length of the slot is a mold apparatus for manufacturing a semiconductor package, characterized in that the same or longer than the moving distance of the slide plate. The method of claim 2,
The operating unit is screwed to the screw groove formed on one side of the slide plate and the adjustment screw is rotatably supported by the front end key;
A protective cover protecting the adjusting screw;
A moving rod having one end fixed to the slide plate and the other end positioned inside the protective cover; And
Mold device for manufacturing a semiconductor package comprising a gauge block that is inserted in the gap between the end of the movable rod and the inner surface of the protective cover to determine the thickness of the cavity.

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