KR20110097283A - Method for measuring elastic modulus of thin film sample with dual section, method measuring for thermal expansion modulus of thin film sample with dual section, thin film sample for measuring elastic modulus and hermal expansion modulus and apparatus for measuring elastic modulus and thermal expansion modulus - Google Patents

Abstract

The present invention relates to a method for obtaining elastic modulus and thermal expansion coefficient of a thin film specimen, and more particularly, a first section having a width of W ₁ and a _second having a width of W ₂ . A single test measures the elastic modulus and thermal expansion coefficient of a thin film specimen by loading two specimens with sections and measuring two different strains in each section in one experiment. It's about how you can do it.
The present invention also relates to thin film specimens and measuring devices used in the above methods.

Description

Method of measuring elastic modulus using thin section specimens with double section, method of measuring thermal expansion coefficient using thin section specimens with double section, thin film specimen for measuring elastic modulus and thermal expansion coefficient MODULUS OF THIN FILM SAMPLE WITH DUAL SECTION, METHOD MEASURING FOR THERMAL EXPANSION

The present invention relates to a method for obtaining elastic modulus and thermal expansion coefficient of a thin film specimen, and more particularly, a first section having a width of W ₁ and a _second having a width of W ₂ . A single test measures the elastic modulus and thermal expansion coefficient of a thin film specimen by loading two specimens with sections and measuring two different strains in each section in one experiment. It's about how you can do it.

The present invention also relates to thin film specimens and measuring devices used in the above methods.

In order to measure the elastic modulus and thermal expansion coefficient of the test piece, the strain of the test piece should be measured. In this case, it is important to measure the strain due to temperature at a stress below the yield stress of the test piece.

When measuring the coefficient of thermal expansion of the bulk material, the change in the strain with respect to the temperature increase is taken to take the slope value, which is measured using a general displacement meter or a coefficient of thermal expansion measurement device.

When the thermal expansion coefficient of the thin film material is measured, a method using a high temperature tensile tester, a method using a wafer curvature measurement, a method using a warp of a cantilever type test piece, or the like is used. Among them, the method of measuring the coefficient of thermal expansion through tensile tests is known as the best method, but in the case of the thin film material, the strain measurement method used in the bulk material is difficult to measure the strain.

In the case of measuring the strain of a thin film material, measurement methods such as ISDG (Interferometric Strain / Displacement Gage) and DIC (Digital Image Correlation) using optical methods are known.

Meanwhile, when using a high temperature tensile tester, the coefficient of thermal expansion of a thin film material is measured based on data of strain change at different stress levels (stress level below yield stress) using a DWDM (Dual Weight Difference Method).

Since the thin film specimens have a thickness of several nanometers to several micrometers, it is difficult to fabricate bulk specimens and is mainly manufactured by applying MEMS process. The thin film deposited by electroplating, sputtering, depositing, etc. A method of defining the shape using phosphorus or non-optical lithography is used. Specimens produced by the MEMS process are small in size and very easily broken, and are therefore generally difficult to handle by hand. Accordingly, a Zig structure is designed and manufactured in addition to the material of the test piece.

That is, even if the width (width) of the thin film specimens is very large, it is not possible to handle it by hand because it has a size of 1 mm or less and a thickness of several nanometers to several micrometers. In addition, a large deformation occurs even with a slight force, which may damage the specimen before the experiment, and the additional structure should be designed together to maintain a stable state. Therefore, when two or more experiments need to be performed to measure the elastic modulus, the experiments are difficult due to the problem of the size.

On the other hand, the test piece is mainly produced by the MEMS process, it is possible to make several test pieces on one wafer. By the way, even if the test piece manufactured on the same wafer, there is a possibility that the thickness and composition vary depending on the position on the wafer. Therefore, when two or more experiments are performed using two or more different test pieces, errors due to minute differences between the test error and the manufacturing error of the test pieces are included.

That is, when two or more experiments are performed using two different specimens, the variation (thickness difference, composition difference, etc.) between the specimens may affect the experimental results.

On the other hand, in the case of an experiment through a dual weight difference method (DWDM) and a tensile test, data of strain change with respect to temperature at different stress levels are required. By the way, if the experiment is performed more than once with one specimen, the specimen has a possibility of being affected by the temperature history.

In addition, if the experiment is performed two or more times, there may be a slight difference in the external conditions of the experiment every time the experiment is performed, which implies an error in the test results and impairs the accuracy.

In order to solve the above problems, the present invention provides an elastic modulus and a thermal expansion coefficient that can accurately and quickly obtain the elastic modulus and thermal expansion coefficient of a thin film specimen by performing one experiment using one thin film specimen having a different width. It is intended to provide a measurement method. That is, according to the present invention, when the total load P (T) is applied to test pieces having different widths (widths), different stresses are generated in the first section and the second section, respectively, In order to provide an elastic modulus and thermal expansion coefficient measuring method that can obtain the elastic modulus of the thin film specimen by measuring each strain in each section through a single experiment to obtain a reliable result.

In addition, the present invention is to provide a thin film test piece and measuring device used in the above method.

The present invention is a width W ₁ of the first section (section) (110) and the first section (section) (110) at the right end is formed integrally width is less than W _1, or greater than W ₂ of the second section of a specimen fixing step (S110) for fixing the left and right ends of the plate-like thin film specimen 100 having a section t 120 to the jig 210 and 220, respectively; A load application step (S121) of applying a load P _a along the left and right directions of the thin film specimen (100) by using an actuator (400) to apply a stress below the yield stress to the thin film specimen (100); A temperature change step (S123) of applying heat to the thin film specimen (100) to increase the temperature of the thin film specimen (100) from T ₀ to T; A total load measuring step (S130) of measuring a total load P (T) applied along the left and right directions of the thin film specimen 100; The strain ε ₁ of the first section 110 in a state where the total load applied along the left and right directions of the thin film specimen 100 is P (T) and the temperature of the thin film specimen 100 is T. A strain measurement step (S140) of measuring strain (T) and strain ε ₂ (T) of the second section (120); An elastic modulus obtaining step (S150) of obtaining an elastic modulus E (T) of the thin film specimen 100 by using a relational expression of? It relates to a method of measuring the elastic modulus using a thin film specimen having a double section comprising a. Here, P (T) is in the actuator (actuator), the load applied by a (400) P _a, and the temperature of the thin film sample 100 is changed from T ₀ to T and the thin film sample 100, the right and left direction It is the sum of the deformation loads P _T , which are additional loads as they are deformed.

In the present invention, wherein the actuator (actuator) when the load P _a force applied by 400 is a P _p la preset load value, and the tolerance of the load value P _d d, | P _p - P (T) Can be adjusted to be <P _d , and said W ₁ and W _2. It is preferable that ratio between them is two or more.

의 관계식을 이용하여 상기 박막 시편(100)의 열팽창 계수 α(Ｔ)를 획득하는 열팽창 계수 획득 단계(S250); 를 포함하는 것을 특징으로 하는 이중 섹션을 구비한 박막 시편을 이용한 열팽창 계수 측정 방법에 관한 것이다.On the other hand, the present invention is the width W ₁ of the first section (section) (110) and the first section (section) (110) formed at the right end as one body, and the width is less than or greater than W _1, W ₂ the A specimen fixing step S210 for fixing the left and right ends of the plate-like thin film specimen 100 having a thickness t having two sections 120 to the jig 210 and 220, respectively; Applying _a load Pa or a predetermined displacement along the left and right directions of the thin film specimen (100) using an actuator (400) to apply a stress less than a yield stress to the thin film specimen (100); A temperature change step (S223) of applying heat to the thin film specimen (100) to increase the temperature of the thin film specimen (100) from T ₀ to T; In the temperature of the thin film specimen (100) T state, the strain ε ₂ (T) of the first section (section) (110) strain ε ₁ (T) and said second section (section) (120) of Strain measurement step of measuring (S240);

A thermal expansion coefficient obtaining step (S250) of obtaining a thermal expansion coefficient α (T) of the thin film specimen 100 by using a relational expression of? It relates to a thermal expansion coefficient measurement method using a thin film specimen having a double section comprising a.

On the other hand, the present invention includes a first section (110) having a width W ₁ ; The first section (section) a second section that is smaller than W ₂ are integrally formed, the width W ₁ in the longitudinal direction side end of (110) (section) (120 ); It includes, but relates to a thin film specimen for measuring the elastic modulus and thermal expansion coefficient, characterized in that the plate-like thickness.

On the other hand, the present invention is the thin film specimen (100); First gripping portions 211 and 221 having one of a yaw shape and an iron shape formed on one surface thereof, and the first gripping portion (11) for gripping a longitudinal side end of the thin film specimen 100. The first jig 210 and the second jig 220 having second gripping portions 212 and 222 on one surface of which is formed a yaw shape and an iron shape so as to be engaged with the 211 and 221. ); A first beam 310 having one end connected to an actuator 400 and the other end connected to the first jig 210; A second beam 320 having one end connected to the second jig 220 and the other end connected to a load cell 500; A thermoelectric module 600 positioned below the thin film specimen 100 and disposed between the first jig 210 and the second jig 220 to apply heat to the thin film specimen 100; It relates to an elastic modulus and thermal expansion coefficient measuring apparatus comprising a.

The present invention includes a first beam male thread 311 protruding from the other end of the first beam 310; A first jig male screw 213 protruding from an outer surface of the first jig 210; A first connecting rod 810 having a female thread 811 corresponding to the first beam male thread 311 formed at one end and a female thread 812 corresponding to the first jig male thread 213 formed at the other end. ); A second jig male screw 223 protruding from an outer surface of the second jig 220; A second beam male thread 321 protruding from one end of the second beam 320; A second connecting rod having a female screw 821 corresponding to the second jig male thread 223 at one end thereof and a female screw 822 corresponding to the second beam male screw 321 formed at the other end ( 820); Including, but the female screw 811 formed on one side end of the first connecting rod 810 and the female screw 812 formed on the other end of the first connecting rod 810 are the same female screw, the second connecting rod ( The female screw 821 formed at one end of the 820 and the female screw 822 formed at the other end of the second connecting table 820 may be the same female screw.

In the present invention, a metal is coated on the upper surface of the thin film specimen 100, and the first bites 211 and 221 and the second bites 212 and 222 are insulators, and one end thereof is the first bite. It is attached to any one of the one surface of the portion (211, 221) and one surface of the second bleed portion (212, 222) in contact with the upper surface of the thin film specimen 100, the other end of the jig (210, 220) It may include a metal pad (212-1, 222-1) protruding outward.

The invention each case to which the other width (W) a total load of P (T) to the test piece having a width (width) is W ₁ of the first section, the second section is (section) and width (W), W ₂ ( Since different stresses (or strains) are generated in each section), the elastic modulus and the coefficient of thermal expansion of the thin film specimen can be obtained by measuring each strain in each section through one test with one specimen. . From this, it is possible to obtain an effect that the test time is short while the accuracy of the measurement results is high.

1 is a flowchart of Embodiment 1;
2 is a schematic diagram of an apparatus for implementation of the first embodiment;
3 is a detailed view of the thin film specimen of FIG.
4 is a flow chart of the load application step of FIG.
5 is a detail of the thin film specimen of FIG. 2 for strain measurement;
6 is a schematic diagram of an apparatus for image capture of FIG. 5;
7 is a flowchart of Embodiment 2. FIG.
8 is a schematic view of the first jig of FIG.
9 is a schematic view of the second jig of FIG.
10 is an explanatory diagram for fastening a first beam and a first jig of FIG.
FIG. 11 is an explanatory diagram for fastening a second jig and a second beam of FIG. 2; FIG.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Example 1

Example 1 relates to a method of measuring elastic modulus using a thin film specimen having a double section according to the present invention.

1 is a flowchart of Embodiment 1, FIG. 2 is a schematic diagram of an apparatus for implementing Embodiment 1, FIG. 3 is a detailed view of the thin film specimen of FIG. 2, and FIG. 4 is a flowchart of the load application step of FIG. 5 shows a detailed view of the thin film specimen of FIG. 2 for strain measurement, and FIG. 6 shows a schematic view of the apparatus for image capture of FIG.

Referring to FIG. 1, Example 1 includes a specimen fixing step (S110), a load application and temperature change step (S120), a total load measurement step (S130), a strain measurement step (S140), and an elastic modulus acquisition step (S150). do.

Referring to FIG. 2, in the specimen fixing step S110, the left end of the thin film specimen 100 is fixed to the first jig 210, and the right end of the thin film specimen 100 is fixed to the second jig 220, respectively. .

Referring to FIG. 3, the thin film specimen 100 has a first section 110 and a second section 120. The second section 120 is integrally formed at the right end of the first section 110. The first section 110 is W ₁ wide and the second section 120 is W ₂ wide, W ₁ > W ₂ . W ₁ = 2W ₂ Can be. W ₁ and W ₂ All you need is a difference between them, but if the difference is too small, another error factor is included, so W ₁ and W ₂ It is preferable that ratio between them is two or more. The thin film specimen 100 is formed in a plate shape having a thickness t. Meanwhile, round portions may be formed on the widthwise side surfaces of the first section 110 and the second section 120 to reduce stress concentration.

Referring to FIG. 1, the load application and temperature change step S120 includes a load application step S121 and a temperature change step S123.

Referring to FIG. 2, in the load application step S121, _a load P _a is applied along the left and right directions (lengthwise directions) of the thin film specimen 100 using an actuator 400. In the load application step (S121), a stress less than the yield stress is applied to the thin film specimen 100 by the actuator (actuator) 400.

Referring to FIG. 2, in the temperature change step S123, heat is applied to the thin film specimen 100 to increase the temperature of the thin film specimen 100 from T ₀ to T. The thermoelectric module 600 may be installed under the thin film specimen 100, and heat may be generated by supplying a current to the thermoelectric module 600 to increase the temperature of the thin film specimen 100.

Referring to FIG. 2, in the total load measuring step S130, the total load P (T) applied along the left and right directions of the thin film specimen 100 by the load cell 500 is measured. The total load P (T) is the load applied by the actuator 400, P _a , the temperature of the thin film specimen 100 is changed from T ₀ to T, so that the thin film specimen 100 is deformed in the left and right directions. when the load of the deformation load applied to the added P _T d, P (T) is the sum of P _a and P _T. Meanwhile, Referring to Figure 4, the total load measuring step (S130) in the load P _a a _{| P p - P (T)} | = | P p - (P a + P T) | in the controlled state so that the <P _d The total load P (T) applied along the left and right directions of the thin film specimen 100 is measured using a load cell 500.

Referring to Figure 4, the load P _a force applied by the actuator (actuator) (400) in the load applied to step (S121) is _{| P p - P (T)} | = | P p - (P a + P T) | < It is adjusted to be P _d . Here, P _p represents a predetermined total force, P _d represents a tolerance weight. In other words, if P _p (P _a + P _T ) ≥ P _d , increase or decrease P _a to make _{p p} -P (T) = P _p (P _a + P _T ) is adjusted to be _d .

Since Example 1 should be performed at a stress below the yield stress, the total load P (T) should be controlled so that the stress above the yield stress is not applied to the thin film specimen 100. When the temperature is applied to the thin film specimen 100, the thin film specimen 100 generally increases, so when the total load P (T) is too small, there may be a problem in measuring the strain due to the characteristics of the thin film. Since the value at high temperature tends to be lower than the value at room temperature, the total load P (Ｔ) If you manipulate the load to be close to the yield load, there is a possibility of measuring the wrong value.

Therefore, the preset total load P _p should be set to a value less than the load corresponding to the yield stress by performing a tensile test before the thermal expansion coefficient measurement experiment to check the yield stress of the material, and the value is different for each material. The preset total load P _p is preferably set to a value of 50% or less of the yield load measured by the room temperature tensile test. As a result of the high temperature tensile test of the electroplated nickel thin film, the yield stress at 218 ° C. is reported to have a value of about 65% of the yield stress at room temperature.

In the case of the allowable deviation load P _d , it is basically set based on the resolution of the load cell 500 used for load measurement, and the tension and compression speed of the actuator 400 are fast and are not controlled properly. Can be set arbitrarily according to

With reference to Figure 1 is the measurement of strain ε ₂ (T) of the first section (section) (110) strain ε ₁ (T) and a second section (section) (120) of the strain measurement step (S140). The strain ε ₁ (T) and the strain ε ₂ (T) are strains in a state where the total load applied along the left and right directions of the thin film specimen 100 is P (T) and the temperature of the thin film specimen 100 is T. .

Referring to FIG. 5, a first-first pattern 111 and a first-second pattern 112 are formed in a first section 110, and a second-first pattern is formed in a second section 120. The pattern 121 and the second-second pattern 122 may be formed. Therefore, the distance between the 1-1st pattern 111 and the 1-2 pattern 112 is d ₁ , and the distance between the 2-1st pattern 121 and the 2-2 pattern 122 is d. ₂ , in the strain measurement step (S140) d ₁ after applying the load and performing the temperature change step (S120) And d ₂ is measured, d ₁ before applying these values and load and performing the temperature change step (S120). And can be used to calculate the strain d ₂ ε ₂ (T) of the first section (section) (110) strain ε ₁ (T) and a second section (section) (120) of.

Referring to FIG. 6, d ₁ and d ₂ may be measured by separately photographing images of the first section 110 and the second section 120 using two CCD cameras. In this case, one barrel is used for each CCD camera, and a first mirror is located under the barrel located on the left side, and a second mirror is located under the barrel located on the right side. The second mirror may be a half mirror that transmits 50% of the light and reflects 50% of the light. Since a method of photographing different portions using two CCD cameras is a known method, detailed description thereof will be omitted.

의 관계식을 이용하여 박막 시편(100)의 탄성 계수 Ｅ(Ｔ)를 획득하게 된다.Referring to Figure 1 in the elastic modulus acquisition step (S150)

The elastic modulus E (T) of the thin film specimen 100 is obtained using the relational expression of.

The equation required for the elastic modulus acquisition step S150 is derived from thermo-elasticity as follows.

[Equation 1]

[Equation 2]

,

이고, α(Ｔ)는 박막 시편(100)의 열팽창 계수를 나타낸다.[Equation 1] and [Equation 2] are equations widely used in the structure of the test piece to uniaxial thermoelastic deformation, and from the definition of stress

,

Α (T) represents the thermal expansion coefficient of the thin film specimen 100.

[Equation 1]-[Equation 2] to obtain the following [Equation 3].

&Quot; (3) &quot;

That is, in the elastic modulus acquisition step (S150), the elastic modulus E (T) of the thin film specimen 100 is obtained by using Equation (3).

On the other hand, when W ₁ = 2W ₂ [Equation 4] can be obtained from [Equation 3].

&Quot; (4) &quot;

That is, when W ₁ = 2W ₂ , Equation 3 is simplified to Equation 4.

In Equations 3 and 4, W ₁ and W ₂ are known values, ε ₁ (T) and ε ₂ (T) are measurable values in the strain measurement step S140, and P ( T) is a value measurable in the total load measuring step (S130). Therefore, Example 1 can obtain the elastic modulus of the thin film specimen 100 by performing a single experiment using one thin film specimen 100 having a different width.

On the other hand, even if the width (width) of the test piece is very large, it is not possible to handle by hand because it has a size of less than 1mm and a thickness of several nano to several micro. In addition, a large deformation occurs even with a slight force, which may damage the specimen before the experiment, and the additional structure should be designed together to maintain a stable state. Therefore, when two or more experiments need to be performed to measure the elastic modulus, the experiments are difficult due to the problem of the size.

On the other hand, the test piece is mainly produced by the MEMS process, it is possible to make several test pieces on one wafer. By the way, even if the test piece manufactured on the same wafer, there is a possibility that the thickness and composition vary depending on the position on the wafer. Therefore, when two or more experiments are performed using different test pieces, a problem occurs due to manufacturing error of the test pieces.

That is, when two or more experiments are performed using two different specimens, the variation (thickness difference, composition difference, etc.) between the specimens may affect the experimental results.

On the other hand, in the case of an experiment through a dual weight difference method (DWDM) and a tensile test, data of strain change with respect to temperature at different stress levels are required. By the way, if the experiment is performed more than once with one specimen, the specimen has a possibility of being affected by the temperature history.

In addition, if the experiment is performed more than once, there may be a slight difference in the external conditions of the experiment every time the experiment is performed, which implies that a reliable result may not be obtained.

However, Example 1 according to the present invention can obtain the elastic modulus of the thin film specimen 100 by performing one experiment using one thin film specimen 100 having different widths, thus eliminating the above problems. There is an advantage to this. That is, in Example 1, when the total load P (T) is applied to a test piece having a different width (width), different stresses are generated in the first section and the second section 120, respectively. The elastic modulus of the thin film specimen 100 may be obtained by measuring each strain in each section 110 and 120 through one experiment with one test specimen.

Example 2

Example 2 relates to a method of measuring thermal expansion coefficient using a thin film specimen having a double section according to the present invention.

7 shows a flowchart of Embodiment 2. FIG.

Referring to FIG. 7, Example 2 includes a specimen fixing step S210, a load application and a temperature change step S220, a strain measurement step S240, and a thermal expansion coefficient obtaining step S250.

Specimen fixing step (S210), load application and temperature change step (S220) and strain measurement step (S240) is the specimen fixing step (S110), load application and temperature change step (S120) and strain measurement step ( Since it is the same as S140, description thereof is omitted. That is, the load application and temperature change step S220 includes the load application step S221 and the temperature change step S223 as in the first embodiment.

의 관계식을 이용하여 박막 시편(100)의 열팽창 계수 α(Ｔ)를 획득하게 된다.Referring to Figure 7, in the thermal expansion coefficient acquisition step (S250)

The thermal expansion coefficient α (T) of the thin film specimen 100 is obtained using the relational equation of.

Using [Equation 1] and [Equation 2] described in Example 1, [Equation 1] × σ _1- [Equation 2] × σ ₂ is obtained.

[Equation 5]

That is, in the acquiring coefficient of thermal expansion (S250), the coefficient of thermal expansion α (T) of the thin film specimen 100 is obtained by using Equation (5). It can be seen from the above equation that the load measurement is unnecessary when only the coefficient of thermal expansion is measured. In other words, it is possible to configure a system for measuring the coefficient of thermal expansion without including a load measuring sensor.

On the other hand, when W ₁ = 2W ₂ [Equation 6] can be obtained from [Equation 5].

&Quot; (6) &quot;

That is, when W ₁ = 2W ₂ , Equation 5 is simplified to Equation 6.

In Equations 5 and 6, W ₁ and W ₂ are known values, ε ₁ (T) and ε ₂ (T) are measurable values in the strain measurement step S240, and T ₀ And T are also measurable values. Therefore, in Example 2, the coefficient of thermal expansion of the thin film specimen 100 may be obtained by performing one experiment using one thin film specimen 100 having a different width.

Example 3

Example 3 relates to the thin film specimens used in Examples 1 and 2.

Referring to FIG. 3, as described in Example 1, the thin film specimen 100 of Example 3 includes a first section 110 and a second section 120. The second section 120 is integrally formed at the right end of the first section 110. The first section 110 is W ₁ wide and the second section 120 is W ₂ wide, W ₁ > W ₂ . W ₁ = 2W ₂ Can be. The thin film specimen 100 is formed in a plate shape having a thickness t.

Meanwhile, round portions may be formed on the widthwise side surfaces of the first section 110 and the second section 120 to reduce stress concentration.

Referring to FIG. 5, a first-first pattern 111 and a first-second pattern 112 are formed in a first section 110, and a second-first pattern is formed in a second section 120. The pattern 121 and the second-second pattern 122 may be formed. The first-first pattern 111 and the first-second pattern 112 are for measuring the distance d ₁ between the _first-first pattern 111 and the first-second pattern 112 and the second-first pattern 111. The pattern 121 and the second-second pattern 122 are for measuring the distance d ₂ between the _second-first pattern 121 and the _{second-second} pattern 122.

Example 4

Example 4 relates to a device for measuring elastic modulus and thermal expansion coefficient for carrying out Examples 1 and 2.

8 is a schematic diagram of the first jig of FIG. 2, FIG. 9 is a schematic diagram of the second jig of FIG. 2, FIG. 10 is an explanatory diagram for fastening the first beam and the first jig of FIG. FIG. 11 is an explanatory view for fastening the second jig and the second beam of FIG. 2.

Referring to FIG. 2, the fourth embodiment includes the thin film specimen 100, the first jig 210, the second jig 220, the first beam 310, and the second beam ( 320 and the thermoelectric module 600.

Although not shown in the drawings, a metal may be coated on the upper surface of the thin film specimen 100.

Referring to FIGS. 2 and 8, the first jig 210 may include a first gripping portion 211 having a concave shape on an upper surface thereof, and a first jig 210 for gripping the left end of the thin film specimen 100 in the longitudinal direction. A second bite portion 212 is formed on the bottom surface to be engaged with the bite portion 211. The distance between the top surface of the first stitch portion 211 and the bottom surface of the second stitch portion 212 may be adjusted by tightening or releasing the first stitch portion 211 and the second stitch portion 212 by a clamp or the like. .

Referring to FIGS. 2 and 9, the second jig 220 may include a first gripping portion 221 having a concave shape formed on an upper surface thereof, and a first right side in order to grip the right end in the longitudinal direction of the thin film specimen 100. A second bite portion 222 having an iron shape is formed on the bottom surface to be engaged with the bite portion 221. The distance between the upper surface of the first portion 221 and the lower surface of the second portion 222 may be adjusted by tightening or releasing the first portion 221 and the second portion 222 by a clamp or the like. .

8 and 9, the first bites 211 and 221 and the second bites 212 and 222 may be insulators, and a thin film specimen 100 may be formed on the bottom surface of the second bites 212 and 222. Metal pads 212-1 and 222-1 in contact with the upper surface of the side ends of the are attached. The left end of the metal pad 212-1 attached to the second engagement portion 212 of the first jig 210 protrudes to the outside of the second engagement portion 212, and the second portion of the second jig 220 is disposed. The right end of the metal pad 222-1 attached to the bite portion 222 protrudes out of the second bite portion 222. Although not shown in the drawings, the metal pads 212-1 and 222-1 are connected to both terminals of the galvanometer for measuring the current flowing through the thin film specimen 100, respectively. ) Can be checked for breakage.

Referring to FIG. 2, the first beam 310 has a left end connected to an actuator 400 and a right end connected to a first jig 210. The actuator 400 is to apply a tensile force along the longitudinal direction of the thin film specimen 100 and uses a commercially available actuator having a good resolution.

Referring to FIG. 10, a first beam male screw 311 protrudes to the right at the right end of the first beam 310. In addition, the first jig male screw 213 is protruded to the left on the left side of the first jig 210. The first beam 310 and the first jig 210 are integrally fastened to each other by the first connecting rod 810. Accordingly, a female screw 811 corresponding to the first beam male thread 311 is formed at the left end of the first connecting rod 810, and a first jig male screw 213 is formed at the right end of the first connecting rod 810. The female screw 812 corresponding to the above is formed. The female screw 811 formed at the left end of the first connecting rod 810 and the female screw 812 formed at the right end of the first connecting rod 810 are the same female screw, and the first beam male thread 311 The first jig male threads 213 are the same male threads. Therefore, the right end of the first connecting rod 810 is deeply fastened with the first jig male thread 213, and the right end of the first beam male screw 311 is adjacent to the left end of the first connecting rod 810. In order to reduce the bite length of the right end of the first connecting rod 810 and the first jig male screw 213 by rotating the first connecting rod 810, the right end of the first connecting rod 810 is the first beam male thread. It is bitten by 311. Therefore, the first beam 310 and the first jig 210 are integrally fastened to each other by the first connecting rod 810.

2, the left end of the second beam 320 is connected to the second jig 220 and the right end of the second beam 320 is connected to the load cell 500. The load cell 500 is for measuring a load applied along the longitudinal direction of the thin film specimen 100.

Referring to FIG. 11, a second beam male screw 321 protrudes to the left at a left end of the second beam 320. In addition, the second jig male screw 223 protrudes to the right on the right side of the second jig 220. The second beam 320 and the second jig 220 are integrally fastened to each other by the second connecting rod 820. Accordingly, a female screw 821 corresponding to the second jig male screw 223 is formed at the left end of the second connecting rod 820, and a second beam male screw 321 is formed at the right end of the second connecting rod 820. A female screw 822 is formed correspondingly. The female screw 821 formed at the left end of the second connecting rod 820 and the female screw 822 formed at the right end of the second connecting rod 820 are the same female screw, and the second beam male screw 321 is the same. The 2nd jig male thread 223 is the same male thread mutually. The fastening method of the second beam 320 and the second jig 220 corresponds to the fastening method of the first beam 310 and the first jig 210.

Referring to FIG. 2, a thermoelectric module 600 is disposed between the first jig 210 and the second jig 220. The thermoelectric module 600 is for applying heat to the thin film specimen 100 and is disposed below the thin film specimen 100. As the current is supplied to the thermoelectric module 600, heat is generated from the thermoelectric module 600, and heat is applied to the thin film specimen 100.

Meanwhile, referring to FIG. 2, the jig 210 and 220 and the thermoelectric module 600 are installed in the high temperature chamber 700, and the actuator 400 and the load cell 500 are the high temperature chamber. It is installed outside the 700. When the load cell 500 is positioned inside the high temperature chamber 700, thermal drift due to temperature may occur. In the high temperature chamber 700, two CCD cameras installed outside the high temperature chamber 700 may be used to take images of the first section 110 and the second section 120 separately. Make sure The first mirror and the second mirror are also installed outside the high temperature chamber 700.

100: Thin Film Specimen
110: first section 120: second section
210: first jig 211: first bite portion
212: 2nd fold 212-1: metal pad
213: 1st jig male thread
220: the second jig 221: the first bite portion
222: second bleeding portion 222-1: metal pad
223: 2nd jig male thread
310: first beam 311: first beam male thread
320: second beam 321: second beam male thread
400: actuator 500: load cell
600: thermoelectric module 700: high temperature chamber
810: first connecting rod 811: female thread
812: female thread
820: 2nd connecting rod 821: female thread
822: female thread

Claims (8)

The first section a width of W ₁ (section) (110) and the first section (section) a second section formed at the right end as one body, and the width is less than or greater W ₂ than W ₁ of (110) (section) A specimen fixing step (S110) of fixing the left and right ends of the plate-shaped thin film specimen 100 having a thickness t with the jig 210 and 220, respectively;
A load application step (S121) of applying a load P _a along the left and right directions of the thin film specimen (100) by using an actuator (400) to apply a stress below the yield stress to the thin film specimen (100);
A temperature change step (S123) of applying heat to the thin film specimen (100) to increase the temperature of the thin film specimen (100) from T ₀ to T;
A total load measuring step (S130) of measuring a total load P (T) applied along the left and right directions of the thin film specimen 100;
The strain ε ₁ of the first section 110 in a state where the total load applied along the left and right directions of the thin film specimen 100 is P (T) and the temperature of the thin film specimen 100 is T. A strain measurement step (S140) of measuring strain (T) and strain ε ₂ (T) of the second section (120);

An elastic modulus obtaining step (S150) of obtaining an elastic modulus E (T) of the thin film specimen 100 by using a relational expression of?
Elastic modulus measurement method using a thin film specimen having a double section comprising a.
Here, P (T) is in the actuator (actuator), the load applied by a (400) P _a, and the temperature of the thin film sample 100 is changed from T ₀ to T and the thin film sample 100, the right and left direction It is the sum of the deformation loads P _T , which are additional loads as they are deformed.
The method of claim 1,
When the actuator (actuator) (400) load P _a is a preset load value P _p LA, and tolerance load value applied by the P _{d d, | P p - P (T} ) | <P d is Elastic modulus measurement method using a thin film specimen having a double section characterized in that it is adjusted to.
The method according to claim 1 or 2,
W ₁ = 2W _{2 The} elastic modulus measuring method using a thin film specimen having a double section, characterized in that.
A width W ₁ of the first section (section) 110, and the first section (section) is formed integrally with the right end of 110 of the second section (section) width is less W ₂ than W ₁ (120 A specimen fixing step (S210) for fixing the left and right ends of the plate-shaped thin film specimen 100 having a thickness t with jiges 210 and 220, respectively;
Applying _a load Pa or a predetermined displacement along the left and right directions of the thin film specimen (100) using an actuator (400) to apply a stress less than a yield stress to the thin film specimen (100);
A temperature change step (S223) of applying heat to the thin film specimen (100) to increase the temperature of the thin film specimen (100) from T ₀ to T;
In the temperature of the thin film specimen (100) T state, the strain ε ₂ (T) of the first section (section) (110) strain ε ₁ (T) and said second section (section) (120) of Strain measurement step of measuring (S240);

A thermal expansion coefficient obtaining step (S250) of obtaining a thermal expansion coefficient α (T) of the thin film specimen 100 by using a relational expression of?
Thermal expansion coefficient measurement method using a thin film specimen having a double section comprising a.
A first section 110 of width W ₁ ;
The first section (section) a second section that is smaller than W ₂ are integrally formed, the width W ₁ in the longitudinal direction side end of (110) (section) (120 );
Including,
A thin film specimen for measuring elastic modulus and thermal expansion coefficient, characterized in that it is plate-like in thickness.
Thin film specimen 100 of claim 5;
First gripping portions 211 and 221 having one of a yaw shape and an iron shape formed on one surface thereof, and the first gripping portion (11) for gripping a longitudinal side end of the thin film specimen 100. The first jig 210 and the second jig 220 having second gripping portions 212 and 222 on one surface of which is formed a yaw shape and an iron shape so as to be engaged with the 211 and 221. );
A first beam 310 having one end connected to an actuator 400 and the other end connected to the first jig 210;
A second beam 320 having one end connected to the second jig 220 and the other end connected to a load cell 500;
A thermoelectric module 600 positioned below the thin film specimen 100 and disposed between the first jig 210 and the second jig 220 to apply heat to the thin film specimen 100;
Elastic modulus and thermal expansion coefficient measuring apparatus comprising a.
The method of claim 6,
A first beam male thread 311 protruding from the other end of the first beam 310;
A first jig male screw 213 protruding from an outer surface of the first jig 210;
A first connecting rod 810 having a female thread 811 corresponding to the first beam male thread 311 formed at one end and a female thread 812 corresponding to the first jig male thread 213 formed at the other end. );
A second jig male screw 223 protruding from an outer surface of the second jig 220;
A second beam male thread 321 protruding from one end of the second beam 320;
A second connecting rod having a female screw 821 corresponding to the second jig male thread 223 at one end thereof and a female screw 822 corresponding to the second beam male screw 321 formed at the other end ( 820);
Including,
The female screw 811 formed at one end of the first connecting rod 810 and the female screw 812 formed at the other end of the first connecting rod 810 are the same female screw.
The female screw 821 formed at one end of the second connecting table 820 and the female screw 822 formed at the other end of the second connecting table 820 are identical to each other, and thus have an elastic coefficient and a coefficient of thermal expansion. Device.
The method according to claim 6 or 7,
The upper surface of the thin film specimen 100 is coated with metal,
The first bites 211 and 221 and the second bites 212 and 222 are insulators,
One side end is attached to any one surface of the first specimen portion (211, 221) and one surface of the second bleed portion (212, 222) in contact with the upper surface of the thin film specimen 100, the other end is An elastic modulus and thermal expansion coefficient measuring apparatus comprising a metal pad (212-1, 222-1) protruding to the outside of the jig (210, 220).

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