KR20110072122A - A device for loading-unloading substrate - Google Patents

Abstract

PURPOSE: A device for loading and unloading a substrate is provided to shorten tact time by efficiently supporting a lifting shaft which moves up and down. CONSTITUTION: A clamp plate(120) is arranged on a bottom plate. A lift pin plate(110) is arranged on the clamp plate. A lifting shaft(140) passes through the clamp plate and supports the lift pin plate. A lifting driving unit drives the lifting shaft up and down. A first guide unit is arranged on the bottom plate and guides a lifting shaft. A second guide unit is arranged on the first guide unit and guides the lifting shaft.

Description

A device for loading and unloading substrates {A DEVICE FOR LOADING-UNLOADING SUBSTRATE}

Embodiments relate to an apparatus for loading-unloading a substrate, and in particular, to more effectively support a lifting shaft that moves up and down to prevent shaking of the lifting shaft, thereby preventing breakage of the substrate and a tact time. It relates to a device for shortening.

Recently, with the development of various portable electronic devices such as mobile phones, personal digital assistants (PDAs), notebook computers, and the like, there is a need for a flat panel display device for light and thin applications that can be applied thereto. Is gradually increasing. Liquid crystal display (LCD), plasma display panel (PDP), field emission display (FED), and vacuum fluorescent display (VFD) are actively researched as such flat panel displays, but mass production technology, ease of driving means, and Liquid crystal display devices (LCDs) are now attracting attention for reasons of implementation.

A liquid crystal display device is a device that displays information on a screen using refractive index anisotropy. The liquid crystal display device displays information by controlling the amount of light passing through the liquid crystal layer by forming a liquid crystal layer between substrates and driving liquid crystal molecules.

In the liquid crystal display as described above, a process of stacking and then etching a plurality of conductive layers or semiconductor materials to form a thin film transistor, an electrode, or a semiconductor layer is repeated several times, among which a process for forming an electrode or a thin film transistor is performed. The sputtering process is mainly used.

In general, a sputtering system includes a substrate, a target of a metal material facing the substrate, a first electrode and a second electrode to which voltage is applied to face each other with the substrate and the target interposed therebetween, and a vacuum is provided. When a high voltage is applied to the first electrode and the second electrode while the inert gas is injected into the chamber, the inert gas is excited in a plasma state, and the excited plasma ions are accelerated to the second electrode and collide with the target, thereby causing a target. Metal particles are deposited on the surface of the substrate.

Referring to FIG. 1, the sputtering system as described above includes a sputtering unit 100 for sputtering a metal material on a substrate, a transfer unit 200 for transferring the substrate before sputtering, and a cassette for transferring the substrate. It includes a loading-unloading unit 300 for loading-unloading from.

Referring to FIG. 2A, there are a plurality of pins 111 on the lifting pin plate 110 in the apparatus for loading-unloading a substrate in the sputtering part 100. In addition, a susceptor 115 is disposed on the lifting pin plate 110, and the susceptor 115 has holes 116 through which the plurality of pins 111 of the lifting pin plate 110 pass. ) Is formed. Therefore, when the lifting pin plate 110 is raised, the plurality of pins 111 penetrate the holes 116 of the susceptor 115 so that the substrate 400 is seated on the pins 111. will be.

Conventionally, a vespel block is used as the guide portion 170 of the lifting shaft 140 during loading and unloading. However, the Vespel Block has a simple circular structure (FIG. 2B), and merely serves to support the elevating shaft 140, so that the Vespel block has no ability to correct distortion and friction of the elevating shaft 140. Therefore, a problem arises in that the substrate 400 is not properly seated due to twisting and shaking of the lifting shaft 140.

That is, referring to FIG. 3, the conventional Vespel block has a sliding friction method with the elevating shaft 140 when the elevating shaft 140 moves up and down, so that vibration is easily generated. In other words, the friction coefficient increases due to the surface contact between the lifting shaft 140 and the Vespel guide, thereby causing vibration in the lifting shaft 140. In addition, although the Vespel Block was polished due to the shaking of the lifting shaft 140, the shaking phenomenon was alleviated, but the original fixing function and the shaft guide function were virtually lost.

In order to overcome the above problems, the embodiment more effectively supports the lifting shaft moving up and down to prevent the shaking of the lifting shaft, thereby preventing breakage of the substrate and shortening the tact time. SUMMARY An apparatus for loading-unloading a substrate is provided.

An apparatus for loading-unloading a substrate according to an embodiment includes a bottom plate; A clamp plate disposed on the lower plate; A lift pin plate disposed on the clamp plate; A lifting shaft penetrating the clamp plate and supporting the lifting pin plate; A lift driver for driving the lift shaft up and down; A first guide part disposed on the lower plate and guiding the lifting shaft; And a second guide part disposed on the first guide part and guiding the lifting shaft.

Further, in the apparatus for loading-unloading a substrate according to an embodiment, the second guide portion includes a rotating body which rotates in direct contact with the lifting shaft, and an outer circumferential surface of the rotating body is curved along an outer circumferential surface of the lifting shaft. The second guide portion is disposed in a position closer to the lower plate than the clamp plate.

An apparatus for loading-unloading a substrate according to an embodiment supports the lifting shaft moving up and down more effectively to prevent the shaking of the lifting shaft, thereby preventing the substrate from breaking and reducing the tact time. It can be shortened.

That is, since the lifting shaft and the guide portion do not make surface contact, friction hardly occurs, and thus, the lifting shaft can be more effectively supported. Therefore, the guide part can be provided with a correction ability for the twist and friction of the lifting shaft.

In addition, by forming the guide portion into two bodies, it is convenient to replace the guide portion later, and thereby the tact time can be shortened.

In the description of the embodiments, in the case where each plate, part, shaft, or plate is described as being formed "on" or "under" of each plate, part, shaft, or plate, "On" and "under" include both being formed "directly" or "indirectly" through other components.

In addition, the criteria for the top, side or bottom of each component will be described with reference to the drawings. The size of each component in the drawings may be exaggerated for the sake of explanation and does not mean the size actually applied.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

4 is an exploded perspective view showing a loading-unloading device and a substrate in the sputtering portion according to one embodiment.

Referring to FIG. 4, an apparatus for loading-unloading a substrate 400 according to an embodiment may include a lower plate 150, a clamp plate 120, a clamp 125, a lifting pin plate 110, and a susceptor. 115, the lifting shaft 140, the lifting driving unit 160, a first guide part, and a second guide part. In addition, the apparatus for loading-unloading the substrate 400 further includes a clamp shaft 130 disposed next to the lifting shaft 140.

The lower plate 150 is disposed at the bottom of the apparatus for loading-unloading the substrate 400. A plurality of lifting shafts 140 and clamp shafts 130 may be disposed on the lower plate 150. The first guide part 170 may be disposed on the lower plate 150 to support the plurality of lifting shafts 140 and the clamp shafts 130. That is, the first guide part 170 is attached to the lower plate 150 to support them at the lower part of the lifting shaft 140 and the clamp shaft 130.

The lifting plate 160 corresponding to the lifting shaft 140 and driving the lifting shaft 140 is disposed on a rear surface of the lower plate 150. The lifting drive unit 160 causes the lifting shaft 140 to move up and down, and the lifting pin plate 110 moves up and down with the up and down movement of the lifting shaft 140. In addition, a clamp driver 155 corresponding to the clamp shaft 130 and capable of driving the clamp shaft 130 is disposed on the rear surface of the lower plate 150. The clamp drive unit 155 causes the clamp shaft 130 to move up and down, and the clamp plate 120 moves up and down with the up and down movement of the clamp shaft 130.

The clamp plate 120 is disposed on the lower plate 150. The clamp plate 120 is penetrated by the lifting shaft 140. The clamp plate 120 is supported by the clamp shaft 130. The clamp plate 120 is connected to the clamp support 121, the clamp rotating part 123, the elastic member 124, and the clamp 125. Therefore, when the clamp plate 120 moves up and down, the clamp support portion 121 also moves up and down, and the clamp rotation part 123 rotates to pull or return the elastic member 124. The clamp 125 is turned on / off. Here, the clamp 125 is turned on / off means that the clamp 125 is inclined toward the substrate 117 to contact the substrate 117 (on), or the The clamp 125 is detached from the substrate 117 and returned to the original state (off).

That is, when the substrate 117 is seated on the susceptor 115, the clamp plate 120 is lowered in the direction of the lower plate 150, so that the clamp rotating part 123 moves the elastic member 124. By pulling on, the clamp 125 is turned on. On the contrary, when the substrate 117 is detached from the susceptor 115, the clamp plate 120 is raised in the lifting pin plate direction, and the clamp rotating part 123 returns the elastic member 124. The clamp 125 is off.

The clamp plate 120 may be made of stainless steel that is not corroded well. The clamp 125 may have a hook shape, and the hook-shaped clamp 125 should not damage the substrate 117 when contacted with the substrate 117 because the tip is not pointed. In addition, the clamp 125 may have a tong shape, and the clamp 125 is not limited thereto as long as it fixes the substrate 117 to the susceptor 115. In addition, the clamp rotation part 123 may be a roller, but is not limited thereto. In addition, the elastic member 124 may be a spring that can be extended, but is not limited thereto.

The lifting pin plate 110 is disposed on the clamp plate 120. A plurality of lifting pins 111 are attached to the lifting pin plate 110 as shown in FIG. 4. In addition, the elevating pin plate 110 is supported by the elevating shaft 140, and when the elevating shaft 140 moves up and down, the elevating pin plate 110 is also moved up and down with it. When the lifting pin plate 110 is raised, the plurality of lifting pins 111 pass through the holes 116 provided in the susceptor 115 to seat the substrate 117.

The lifting pins 111 correspond to the holes 116 of the susceptor 115. The end of the lifting pin 111 may be provided with a contact portion 112 for mounting the substrate 117 and the like. The contact part 112 may be shaped to effectively mount the substrate 117. The material of the contact portion 112 may be perfluoro alkoxy (PFA). In addition, as described above, the lifting pins 111 may be plural and penetrate the susceptor 117 to effectively mount the substrate 117 on the lifting pin plate 110.

The susceptor 115 is disposed above the lifting pin plate 110. The susceptor 115 is provided with a plurality of holes 116 through which the pins 111 of the lifting pin plate 110 can pass. The substrate 117 is mounted on the susceptor 115. The clamp 125 may hold the substrate 117 seated on the susceptor 115 to prevent the substrate 117 from twisting during the sputtering process.

The lifting shaft 140 is moved up and down. The lifting shaft 140 is raised through the clamp plate 120. At this time, the lifting pin plate 110 is also raised at the same time. The lifting shaft 140 may be disposed on a part of the rear surface of the lifting pin plate 110. The lifting shaft 140 may be arranged in plurality. When the plurality of lifting shafts 140 are arranged, the lifting shafts 140 may be arranged in a line or diagonally. In addition, as long as the elevating shaft 140 supports the elevating pin plate 110, the position at which the elevating shaft 140 is disposed is not limited.

The lifting shaft 140 may be moved up and down by the lifting driving unit 160. The lift driver 160 may be disposed on the rear surface of the lower plate 150. The lifting driving unit 160 may be a motor, but is not limited thereto if it drives the lifting shaft 140.

The clamp shaft 130 is moved up and down. At this time, the clamp plate 120 is also moved up and down at the same time. Due to the vertical movement of the clamp shaft 130 and the clamp plate 120, the clamp 125 is turned on / off. The clamp shaft 130 may be disposed on a portion of the rear surface of the clamp plate 120. The clamp shaft 130 may be arranged in plurality.

The clamp shaft 130 may be moved up and down by the clamp driver 155. The clamp driver 155 may be disposed on the rear surface of the lower plate 150. The clamp driving unit 155 may be a pneumatic cylinder, but is not limited thereto if it drives the clamp shaft 130.

The diameter of the lifting shaft 140 may preferably be 60 mm, but is not limited now. In addition, the diameter of the clamp shaft 130 may be preferably 40 mm, but is not limited thereto.

5A through 5D are cross-sectional views illustrating a process of mounting and detaching a substrate in a loading-unloading apparatus according to an embodiment of the present invention, taken along the line II ′ of FIG. 4.

5A to 5D, a substrate 117 is first disposed on the susceptor 115 by a robot (not shown). At this time, the lifting shaft 140 is raised, and the lifting pin plate 110 is also raised at the same time. Lift pins 111 of the lift pin plate 110 pass through the holes 116 of the susceptor 115 and are disposed under the substrate 117. The substrate 117 is seated on the contact portions 112 of the lifting pins 111.

Thereafter, the lifting shaft 140 is lowered, and the lifting pin plate 110 is also lowered at the same time. At this time, the substrate 117 seated on the contact portion 112 of the lifting pin 111 is seated on the susceptor 115. Then, the clamp shaft 130 is lowered, and at the same time, the clamp plate 120 is lowered to rotate the clamp rotation part 123 to turn on the clamp 125 while pulling the elastic member 124. . At this time, the clamp 125 holds the substrate 117. Accordingly, the substrate 117 may be prevented from being distorted or separated from the susceptor 115.

Thereafter, a sputtering process is performed on the substrate 117. After the sputtering process is completed, the clamp shaft 130 is raised and at the same time the clamp plate 120 is raised to rotate the clamp rotating part 123 to return the elastic member 124 to the clamp ( 125) off. Thus, the clamp 125 is detached from the substrate 117.

Thereafter, the lifting shaft 140 is raised and at the same time the lifting pin plate 110 is also raised. The lifting pins 11 of the lifting pin plate 110 pass through the holes 116 of the susceptor 115 to detach the substrate 117 from the susceptor 115. The detached substrate 117 is moved to a chamber for the next process by a robot (not shown).

The lifting shaft 140 and the clamp shaft 130 may be supported by the first guide unit 170. The first guide portion 170 may have a simple circular shape. The first guide part 170 may be attached to the lower plate 150 to support the lifting shaft 140 and the like. That is, the first guide part 170 supports the lower part of the lifting sharp 140. The first guide part 170 guides the lifting shaft 140 when the lifting shaft 140 moves up and down.

FIG. 6 is a view illustrating a portion B in FIG. 5A. 7 is a diagram illustrating an upper surface of a second guide part according to an exemplary embodiment. 8 is a view illustrating a rotating body part of a second guide part according to an exemplary embodiment.

6 to 8, the second guide part 180 is disposed on the first guide part 170. The second guide part 180 guides the lifting shaft 140. The second guide part 180 includes a body part 181 and a rotating body part 186 provided in the body part 181.

The rotating body 186 includes a rotating body 182, a bracket 183 surrounding the rotating body 182, a rotating shaft 184 for rotating the rotating body, and a rotating shaft support part 185 supporting the rotating shaft. do.

More specifically, the second guide portion 180 is rotated by two disposed in each of the two body parts 181a, 181b and the two body parts 181a, 181b surrounding the lifting shaft 140. Body portion 186. In addition, the rotating body portion 186 may be arranged two each up and down. Therefore, by forming the second guide portion 180 into two bodies 181a and 181b, it is convenient to replace the second guide portion 180 later, thereby shortening the tact time.

In addition, the two body parts 181a and 181b of the second guide part 180 may be disposed to face each other with the lifting shaft 140 therebetween. That is, each of the two body parts 181a and 181b may have an outer circumferential surface and an inner surface corresponding to the lifting shaft 140 may be curved. Thus, when the two body parts 181a and 181b are coupled, the body parts 181a and 181b may have a circular shape surrounding the lifting shaft 140.

In addition, the second guide part 180 may have four body parts. In this case, one rotation body part 186 may be disposed in each of the four body parts. As a result, the second guide part 180 may be more easily assembled to be fastened to the lifting shaft 140. In addition, when replacing it with damage, wear, etc. of the second guide portion 180, it is easy to disassemble. That is, the maintenance and repair of the second guide part 180 can be facilitated. Therefore, by manufacturing the body portion of the second guide portion 180 in a combination of two or four, it is possible to reduce the replacement and maintenance cost of the second guide portion 180.

The rotor 182 rotates in direct contact with the lifting shaft 140. The rotating body 182 may have a roller shape and a ball shape, but is not limited thereto. That is, when the lifting shaft 140 moves up and down, the rotating body 182 is also rotated by the rotating shaft 184. In this case, the rotation shaft support 184 supports the rotation shaft 184 so that the rotation body 182 can rotate together with the lifting shaft 140. In addition, the rotor 182 is protected by a bracket 183. The bracket 183 may have a '' shape. One surface of the bracket 183 may be formed with a hole (not shown) through which the rotating shaft 184 passes.

As a result, the rotating body 182 does not have surface contact because it moves together with the lifting shaft 140. Therefore, friction does not occur because the lifting shaft 140 and the second guide portion 180 do not have surface contact, and thus the lifting shaft 140 may be more effectively supported. Therefore, correction of distortion and friction occurring when the lifting shaft 140 moves up and down is possible. In addition, it is possible to prevent the shaking of the lifting shaft 140.

The outer circumferential surface of the rotating body 182 is formed in a curved surface along the outer circumferential surface of the lifting shaft 140. That is, the outer circumferential surface of the rotating body 182 and the outer circumferential surface of the lifting shaft 140 face each other and have a shape of a corresponding curved surface. Therefore, when the vertical movement of the elevating shaft 140, the smooth linear drive is possible than the conventional case, and the correction ability is excellent even when the elevating shaft 140 is distorted.

In addition, the second guide part 180 may be disposed at a position closer to the lower plate 150 than to the clamp plate 120. Preferably, the second guide portion 180 may be disposed at a position that is 1/5 of the height between the lower plate 150 and the clamp plate 120 from the lower plate 150. That is, the second guide portion 180 does not support the lower portion of the elevating shaft 140, but supports the elevating shaft 140 at the position as described above. The bearing capacity is further improved.

Therefore, the apparatus for loading-unloading the substrate according to the embodiment more effectively supports the lifting shaft 140 moving up and down to prevent the shaking of the lifting shaft 140, thereby preventing breakage of the substrate The tact time can be shortened.

That is, since the lifting shaft 140 and the guide portion do not make surface contact, friction hardly occurs, and thus the lifting shaft 140 may be more effectively supported. Therefore, correction of the twisting and friction of the lifting shaft is possible.

Although described above with reference to the embodiment is only an example and is not intended to limit the invention, those of ordinary skill in the art to which the present invention does not exemplify the above within the scope not departing from the essential characteristics of this embodiment It will be appreciated that many variations and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

1 is a block diagram of a general sputtering system.

Figure 2a is a view showing a loading-unloading device and a substrate in the sputtering portion of a typical sputtering system, Figure 2b is a view showing the top surface of part A in Figure 2a.

3 is a view showing a general movement of the lifting shaft and the contact with the guide portion accordingly.

4 is an exploded perspective view showing a loading-unloading device and a substrate in the sputtering portion according to one embodiment.

5A through 5D are cross-sectional views illustrating a process of mounting and detaching a substrate in a loading-unloading apparatus according to an embodiment of the present invention, taken along the line II ′ of FIG. 4.

FIG. 6 is a view illustrating a portion B in FIG. 5A.

7 is a diagram illustrating an upper surface of a second guide part according to an exemplary embodiment.

8 is a view illustrating a rotating body part of a second guide part according to an exemplary embodiment.

Claims (7)

Bottom plate; A clamp plate disposed on the lower plate; A lift pin plate disposed on the clamp plate; A lifting shaft penetrating the clamp plate and supporting the lifting pin plate; A lift driver for driving the lift shaft up and down; A first guide part disposed on the lower plate and guiding the lifting shaft; And And a second guide portion disposed on the first guide portion and guiding the lifting shaft. The method of claim 1, And the second guide portion includes a rotating body that rotates in direct contact with the lifting shaft. The method of claim 2, And an outer circumferential surface of the rotating body is curved along an outer circumferential surface of the lifting shaft. The method of claim 2, And the second guide portion includes two body portions surrounding the lifting shaft and two rotatable portions disposed on each of the two body portions. The method of claim 4, wherein And the two body portions of the second guide portion are disposed to face each other with the lifting shaft therebetween. The method of claim 1, And the second guide portion is disposed at a position closer to the lower plate than the clamp plate. The method of claim 6, And the second guide portion is disposed from the bottom plate at a position that is one fifth of the height between the bottom plate and the clamp plate.

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