KR20110053573A - Wafer handling apparatus - Google Patents

Abstract

PURPOSE: A wafer handling apparatus is provided to improve process efficiency by removing a wafer with high damage probability in a post-process. CONSTITUTION: A separating unit(10) is installed in a tank. A plurality of sliced wafers are stacked on a wafer stack(WS). The wafer stack is loaded on the separating unit. The separating unit separates wafers on the wafer stack one by one. A picker transfers the wafer separated from the separating unit. A test unit(40) removes the defective wafer by spraying fluid to the transferred wafer. An unloading unit(50) loads the wafer with high quality from the test unit.

Description

Wafer Handling Apparatus {Wafer Handling Apparatus}

The present invention relates to a wafer handling apparatus, and more particularly, to separate wafers one by one from a stack of a plurality of thinly stacked semiconductor wafers, inspecting wafers for defects, and unloading a good wafer. The present invention relates to a wafer handling apparatus that performs a loading operation on a part.

In microelectronics, wafers made of semiconductor materials are used as substrates for the production of microelectronic components. Suitable materials are, for example, II / VI compound semiconductors, III / V compound semiconductors, or elemental semiconductors such as germanium or particularly useful silicon.

A semiconductor wafer is manufactured by first cutting a cylindrical single crystal semiconductor ingot into ingot members of several centimeters to several tens of centimeters in length, and then slicing these ingot members into thin wafers.

The thinly sliced semiconductor wafers are immersed in a water bath, subjected to a predetermined process such as cleaning, and then separated by one by a wafer handling apparatus and transferred to a post-processing position. At this time, when the wafers are separated from the wafer stack in the tank by the handling device, the wafers that are broken or have a crack inside are separated and removed, and only the good wafers are removed to the post-processing position. It must be returned to increase the production yield.

However, in the conventional semiconductor wafer handling apparatus, fine cracks are generated inside or thinly sliced above a reference value, so that a defective wafer having a high possibility of breakage cannot be separated, and thus a wafer having fine cracks inside is broken in a subsequent wafer processing process. There is a problem that the production yield is lowered.

In addition, in the conventional wafer handling apparatus, when a picker separates a wafer from a wafer stack, a broken wafer piece passes over the picker's movement path, and the picker and the wafer piece collide with each other, and the wafer is completely broken. There is also a problem in that a broken piece of wafer serially breaks adjacent wafers of different good quality.

The present invention is to solve the above problems, an object of the present invention is to accurately remove even a wafer with a high possibility of damage in the post-process due to the occurrence of fine cracks inside the wafer or sliced thinner than the reference value, etc. It is an object of the present invention to provide only a wafer handling apparatus capable of carrying only a wafer to a post process and having excellent processing efficiency.

Another object of the present invention is to provide a wafer handling apparatus capable of preventing further wafer breakage by preventing the picker from interfering with the broken wafer in the process of separating the wafer from the wafer stack.

According to one aspect of the present invention for achieving the above object, a wafer stack is installed in the tank, a plurality of sliced wafers are stacked, separated from each other by a wafer located at one end of the wafer stack A separating unit; A picker for picking up and transferring wafers separated by one from the separator; A test unit which breaks and removes a defective wafer having a high possibility of damage by injecting a fluid into the wafer transferred by the picker; Provided is a wafer handling apparatus including an unloading unit in which wafers of good quality conveyed from the test unit are loaded.

According to another aspect of the present invention, there is provided a semiconductor device, comprising: a carrier on which a stack of wafers stacked with a plurality of wafers standing thereon is mounted; A wafer separation nozzle for injecting a fluid into one end of the wafer stack mounted on the carrier to separate the final wafer located at the end of the wafer stack from other wafers; An anti-conduction part including a body part supporting an edge of the final wafer separated from the end of the wafer stack, and an auxiliary support part extending inwardly to an inner circumferential part of the body part to support an inner part of the wafer.部); Provided is a wafer handling apparatus comprising a picker for picking up and conveying a wafer separated from the wafer stack.

According to still another aspect of the present invention, there is provided a wafer container comprising: a wafer accommodating portion configured to accommodate a wafer separated from a wafer stack and open a lower surface thereof; A support pin installed at an open lower surface of the wafer accommodating part to support a lower end of the wafer and having an end portion spaced apart from the first surface of the wafer accommodating part by a predetermined distance; Provided is a wafer handling apparatus comprising a defect removal jet nozzle for ejecting a defective wafer by injecting fluid into the wafer from the opposite side of the first surface of the wafer accommodating portion.

According to the present invention, the wafer separated from the wafer stack of the separating part is tested whether the test part withstands a predetermined hydraulic pressure, and the wafer whose strength is weaker than the reference value or damaged such as cracks or cracks is removed. Only the wafer is unloaded. Therefore, it is possible to prevent a decrease in the manufacturing yield that may occur due to the transfer of the defective wafer to the later process.

In addition, in the process of separating the wafer from the separating part, the wafer placed at the final end is evenly supported by the fall prevention part to the inner surface, thereby preventing the broken wafer from falling into the picker's path of movement, thereby preventing the picker from being damaged. There is also an advantage in that collisions between wafer pieces are prevented to prevent cascading breakage of other wafers.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the wafer handling apparatus according to the present invention.

1 illustrates the overall configuration of a wafer handling apparatus according to the present invention. Referring to FIG. 1, the wafer handling apparatus of the present invention is installed in a water tank 1 and inside the water tank 1, and a wafer stack WS. Separating unit 10 for sequentially separating the wafers one by one, the loading picker 20 for picking up and transporting the wafer (W) separated by one from the separating unit 10, and the loading picker 20 A test unit 40 for spraying fluid onto the wafer transferred by the N-type wafer to damage and remove a defective wafer having a high possibility of damage, and an unloading picker 25 for picking up and transferring the wafer W from the test unit 40. ), And an unloading unit 50 in which the wafers W of good quality conveyed by the unloading picker 25 are sequentially loaded.

In addition, the wafer W separated from the separator 10 by the loading picker 20 is photographed on the upper side of the water tank 1 to determine whether two or more wafers are picked up by the loading picker 20. The first vision inspection unit which checks the defective wafers and the second vision inspection which examines the wafer W picked up by the test unit 40 by the unloading picker 25 and examines the final wafer for damage. Addition is configured. In this embodiment, the first vision inspection unit is installed on the opposite side of the vision camera 71 with the vision camera 71 photographing the wafer adsorbed on the loading picker 20 and the loading picker 20 therebetween. It comprises a lighting unit 72 for irradiating light toward (W). Like the first vision inspection unit, the second vision inspection unit also includes an illumination unit 74 for irradiating light toward the wafer adsorbed by the vision camera 73 and the unloading picker 25. The illumination units 72 and 74 emit infrared rays (IR), more preferably near infrared rays (NIR), and the vision cameras 71 and 73 may be configured using a general camera, but also infrared rays sensitive to infrared wavelength bands. You can also use a camera. When using an infrared camera as the vision cameras 71 and 73, it is preferable to use an infrared filter which blocks the wavelength band below infrared rays.

On the one side of the test unit 40, when it is determined that two or more wafers W are simultaneously adsorbed to the loading picker 20 by the first vision inspection unit, a plurality of wafers adsorbed to the loading picker 20 ( The buffer part 30 to which W) is put and loaded is comprised.

The separating unit 10, the test unit 40, and the unloading unit 50 are disposed in the water tank 1. In the water tank 1, a heating unit 80 for smoothing the separation of the wafer from the wafer stack WS is provided by maintaining the water temperature in a predetermined range, for example, in the range of approximately 30 ° C to 35 ° C.

The separator 10 includes a carrier 11 on which a wafer stack WS stacked with a plurality of wafers W is placed, and a carrier for moving the carrier 11 to an arbitrary position in a horizontal direction. An inclination support plate 12 mounted on the driving unit, the carrier 11 to be inclined at a predetermined angle to support the wafer stack WS to be inclined at a predetermined angle, and mounted on the carrier 11. A wafer separation nozzle 14 which separates the final wafer located at the end of the wafer stack WS from other wafers by spraying water from one end of the wafer stack WS, and the opposite side of the inclined support plate 12. It is composed of a fall prevention portion 13 installed in the support for the final wafer is separated from the end of the wafer stack.

The carrier drive unit may be configured using a known linear motion system such as a linear motion system consisting of a pulley and a belt and a motor, a linear motion system consisting of a ball screw and a motor.

In addition, the inclined support plate 12 is preferably configured with an injection body (not shown) for injecting water toward the wafer stack (WS).

One side of the separator 10 is provided with a sensor (not shown) for detecting whether the final wafer of the wafer stack WS has moved to a position where the wafer separation nozzle 14 can be separated.

As the sensor (not shown), for example, a distance measuring sensor measuring a distance from an object to be measured may be used. In this case, the sensor (not shown) is preferably composed of an upper measurement sensor and a lower measurement sensor to detect both the upper and lower portions of the wafer stack WS. If, as a result of the measurement, only the lower portion of the wafer stack WS falls within the injection range of the wafer separation nozzle 14, the upper portion of the wafer stack WS is determined to have not reached the injection range of the wafer separation nozzle 14. In this case, a carrier driving unit (not shown) operates to slowly push the wafer stack WS toward the fall prevention portion 13 to stand the wafer stack WS and at the same time located at one end of the wafer stack WS. The upper portion of the wafer W is allowed to enter the injection range. In order to prevent the wafer stack WS from being damaged, an overload detection function may be provided in the carrier driving unit (not shown). As an example, an overload sensor may be provided on the inclined support plate 12. On the contrary, when it is determined that only the upper portion of the wafer stack WS falls within the spray range of the wafer separation nozzle 14 and the lower portion of the wafer stack WS does not reach the spray range, the fall prevention part 13 By spraying water toward the inclined support plate 12 is provided with an injection body (not shown)) to prevent the phenomenon that the upper portion of the wafer stack (WS) is inclined to the fall prevention portion (13).

The fall prevention part 13 is installed to be fixed at a predetermined position in the water tank 1, and as shown in FIGS. 2 and 3, both sides and bottom sides of the final wafer W separated from the wafer stack WS. Body portion 131 for supporting the edge portion and a plurality of auxiliary support portion 132 formed to extend in the inner direction of the wafer (in the upper direction in this embodiment) in the inner peripheral portion of the lower end of the body portion 131 . When the final wafer of the wafer stack WS is damaged, the auxiliary supporting part 132 may interfere with the loading picker 20 which is not supported by the fall prevention part 13 and is tilted outward and descends. Function to prevent it. That is, the auxiliary support part 132 supports the inner portion of the wafer W so that even if there is a broken wafer W, the wafer W is entirely supported so that the broken piece of wafer falls into the movement trajectory of the loading picker 20. To prevent interference with.

On the other hand, the loading picker 20 is formed to open the escape groove 221 is inserted into the auxiliary support 132 in order to prevent interference with the auxiliary support 132 of the fall prevention portion (13). And, in order to facilitate the flow of water generated by the wafer separation nozzle 14, the size of the escape groove 221 is preferably larger than the size of the auxiliary support 132, more preferably the flow of water A resistance relaxation opening 222 may be formed in the loading picker 20 to further smoothly.

The wafer separation nozzle 14 is installed above the conductive barrier 13 and sprays water downward to separate the final wafer W positioned at the end of the wafer stack WS from the wafer stack WS. . The water guide 15 is provided below the wafer separation nozzle 14. The water guide 15 functions to allow a portion of the water jetted from the wafer separation nozzle 14 to flow toward the fall prevention portion 13. By the function of the water guide 15, the fluid ejected from the wafer separation nozzle 14 performs an inherent function of separating the final wafer located at the end of the wafer stack WS from other wafers. At the same time to stand the final wafer to move toward the fall prevention portion (13).

Referring back to FIG. 1, the loading picker 20 and the unloading picker 25 are horizontally moved in the X-axis direction along the X-axis guide frame 29 installed to cross the upper portion of the tank 1, respectively. The movable blocks 21 and 26 are installed, and the adsorption blocks 22 and 27 are installed on the movable blocks 21 and 26 so as to be movable in the vertical direction (Z-axis direction) to suck the wafer W under vacuum. do. Although not shown in the drawings, the movable block (21, 26) Y-axis drive unit for moving the adsorption blocks (22, 27) of the loading picker 20 and the unloading picker 25 in the left-right direction (Y-axis direction) (Not shown) is configured.

The buffer unit 30 is disposed immediately in front of the test unit 40 and receives the wafers W from the loading picker 20 when the loading picker 20 simultaneously picks up a plurality of wafers W. It is a function of storing. In this embodiment, the buffer unit 30 is a rectangular box-shaped loading box 31 in which a plurality of wafers W are accommodated, and is formed to be inclined at a predetermined angle inside the loading box 31 to be loaded inside the loading box 31. The inclined support plate 32 supports the plurality of wafers to be loaded at an inclined state at a predetermined angle, and the wafers accommodated in the stack 31 by spraying a fluid on a surface opposite the inclined support plate 32. It consists of an injection body (not shown) which pushes in toward 32. As shown in FIG. Here, the injection body (not shown) may be composed of a plurality of injection nozzles which are built in one side wall surface 311 of the loading box 31.

The loading box 31 is configured to be separated from the water tank 1 so that the wafer separation process is completed or the inside of the loading box 31 is completely filled, and then the user removes the loading box 31 to position the wafers W at different process positions. It can be easily transported by

As shown in FIGS. 4 and 5, the test unit 40 accommodates the wafer W conveyed by the loading picker 20 and has a rectangular box-shaped wafer accommodating part 41 formed so that the lower surface thereof is opened. ), A plurality of support pins 43 provided on an open lower surface of the wafer accommodating portion 41 to support the lower end of the wafer W, and a wafer W on one surface of the wafer accommodating portion 41. It is composed of a defect removal injection nozzle 45 for spraying water to remove the defective wafer. Here, the end of the support pin 43 is provided to be spaced apart from the front surface of the wafer receiving portion 41 by a predetermined distance, the test pin between the support pin 43 and the front surface of the wafer receiving portion 41, the wafer damaged as a result of the test An opening is formed to discharge the wafer, which is found to be broken as a result of the inspection in the engraving or the first vision inspection unit, to the outside. That is, when the wafer is broken by spraying water from the test part 40, the broken wafer is discharged through an opening between the end of the support pin 43 and the open lower surface of the wafer accommodating part 41. In addition, even when the wafer W adsorbed by the loading picker 20 is found to be damaged as a result of the inspection by the first vision inspection unit, the damaged wafer has the end of the support pin 43 and the wafer accommodating portion 41. Is discharged through the opening between the open lower surface.

Guide grooves 42 are formed at both side surfaces of the wafer accommodating portion 41 to guide both edges of the wafer W. The upper end of the guide groove 42 preferably has a form extended upward to smooth entry of the wafer (W). In addition, a plurality of debris injection nozzles 47 spraying water toward the wafer W in the guide grooves 42 and on both side portions and the bottom of the wafer accommodating portion 41 to send the broken wafer pieces toward the front openings. ) Is installed. Here, the fragment removal injection nozzles 47 formed on both side portions of the wafer accommodating portion 41 spray water in an inclined direction at an angle of about 45 degrees so that the wafer fragments are well collected into the wafer accommodating portion 41. It is desirable to lose.

Although not shown in the drawings, a plurality of sensors are installed inside the wafer accommodating portion 41 to inspect cracks and the like of the edges of the wafer.

As shown in FIGS. 6 and 7, the unloading unit 50 includes a cassette 51 in which wafers W of good quality transferred from the test unit 40 are stacked upright, and a tank of the cassette 51. It may be configured as a cassette conveying unit (not shown) using a known linear motion system for horizontally conveying within. The lower end and the upper end of the cassette 51 are broken in the process of loading the wafer into the cassette 51, and the sensor detects the wafer fragment lowered to the bottom of the cassette and the upper end of the wafer which protrudes upward because it is not completely inserted into the cassette 51. Sensors (not shown) for detecting the are installed.

In this embodiment, the unloading unit 50 is composed of a cassette 51 in which good wafers are sequentially loaded. Alternatively, the unloading unit 50 is a wafer W conveyed from the test unit 40. ) May be configured as a conveyor belt that is placed while being switched to a horizontal state and conveyed to a post-processing position.

The wafer handling apparatus of the present invention configured as described above operates as follows.

When the wafer stack WS is placed inside the carrier 11 of the separating unit 10 and the handling device is operated, the carrier 11 moves toward the fall prevention unit 13 by the carrier driving unit. The carrier 11 stops when the wafer located at the end of the wafer stack WS is located under the wafer separation nozzle 14. At this time, the wafer stack WS is maintained obliquely by the inclined support plate 12.

Subsequently, water is injected from the wafer separation nozzle 14 to separate the final wafer W positioned at the distal end of the wafer stack WS from other wafers. The final wafer W separated from the wafer stack WS is vertically supported while being supported by the body 131 and the auxiliary support 132 of the conductive barrier 13.

At this time, the adsorption block 22 of the loading picker 20 is vertically lowered and then horizontally advanced a predetermined distance above the fall prevention portion 13 of the separating portion 10 and is supported by the fall prevention portion 13. The final wafer W is vacuum-absorbed and then vertically raised again to take the wafer W out of the water tank 1.

As described above, when the loading picker 20 vacuum-adsorbs the wafer W and takes it out of the water tank 1, light is provided from the illumination unit 72 of the first vision inspection unit toward the wafer W, and the vision camera ( 71 photographs the wafer W adsorbed on the loading picker 20 to obtain an image. At this time, if two wafers W are carried out by the loading picker 20 in a state where they are overlapped together, the contrast of the wafer image obtained by the vision camera 71 becomes darker than the contrast of one wafer image. Through this contrast, the controller (not shown) of the handling device detects that two wafers are overlapped.

As a result of the inspection by the first vision inspection unit, when it is determined that there are two or more wafers adsorbed on the loading picker 20, the loading picker 20 transfers the buffer unit 30 to transfer both wafers W. The buffer unit 30 is lowered in the loading box 31 and moved to the separating unit 10 again. At this time, the buffer unit 30 sprays water through the spraying body (not shown) to push the wafers W toward the inclined support plate 32, whereby the loading picker 20 then transfers the other two stacked wafers. When lowered into the stack 31, it is not to interfere with previously loaded wafers.

On the other hand, when the inspection result by the first vision inspection unit, it is determined that only one wafer (W) that does not have an apparent appearance on the loading picker 20, the loading picker 20 moves to the test unit 40 The wafer W is placed on the wafer accommodating portion 41 of the test portion 40. At this time, both sides of the wafer W are guided by inserting the wafer accommodating portion 41 into the guide groove 42 and the lower end of the wafer W is supported on the support pin 43.

As a result of the inspection by the first vision inspection unit, when the cracked or damaged wafer, that is, the defective wafer is absorbed by the loading picker 20, the end of the support pin 43 and the wafer accommodating part 41 are opened. The defective wafer is immediately discharged through the opening between the lower surfaces.

On the other hand, when the first vision inspection unit inspects the wafer adsorbed to the loading picker 20, the offset indicating the left and right (Y-axis direction) bias of the wafer relative to the reference line (for example, the longitudinal center line of the loading picker) The offset value is also measured. When the position of the wafer adsorbed by the loading picker 20 is biased to one side by using the offset value, the Y-axis driving unit (not shown) of the loading picker 20 operates to offset the offset. The wafer is aligned by correcting the value. As a result, it is possible to prevent the wafer from being broken when the wafer adsorbed to the loading picker 20 is introduced into the buffer unit 30 or the test unit 40. Similarly, the Y-axis driver (not shown) is also configured in the unloading picker 25 to correct the position of the wafer adsorbed on the unloading picker 25 by utilizing the offset value obtained by the second vision inspection unit, thereby Can be prevented from being damaged when is inserted into the cassette 51.

As described above, when one wafer W of the loading picker 20 is accommodated inside the wafer accommodating portion 41 after the vision inspection by the first vision inspection unit, it is predetermined through the injection nozzle 45 for defect removal. Water is sprayed toward the wafer W at a water pressure of. At this time, when the strength of the wafer is weakened due to a defect in the wafer, such as a crack occurring inside the wafer W or being processed thinner than the reference value, the wafer W is damaged by hydraulic pressure. As such, when the wafer W is broken, sensors (not shown) installed in the wafer accommodating part 41 sense the same and spray water through the fragment removal spray nozzle 47 to guide the broken wafer pieces into the guide groove 42. And out to the front opening.

The broken wafer pieces in the wafer accommodating portion 41 are discharged downward through the opening between the open bottom surface of the wafer accommodating portion 41 and the support pin 43 and are deposited on the bottom surface of the water tank 1.

The good wafer W which is not broken in the test unit 40 is vacuum-adsorbed by the unloading picker 25 and taken out of the water tank 1, and then inspected for final damage by the second vision inspection unit. It is transferred to the unloading unit 50.

In the unloading unit 50, the unloading picker 25 sequentially loads the wafer W from one side of the cassette 51 and then moves up to the test unit 40. At this time, the unloading picker 25 preferably loads the wafer W sequentially from the rear of the cassette 51. That is, when the wafers W are sequentially loaded from the rear of the cassette 51 as shown in FIGS. 6 and 7, the unloading picker 25 lowers the wafers W on the cassette 51. Since it can be moved straight in the diagonal direction to move to the test unit 40 can minimize the movement trajectory of the unloading picker 25 can significantly shorten the working time. To this end, the adsorption surface direction of the unloading picker 25 is preferably formed to be opposite to the adsorption surface direction of the loading picker 20.

On the other hand, when the wafer W is loaded from the front of the cassette 51 as shown in FIGS. 8 and 9, the unloading picker 25 lowers the wafer W on the cassette 51. After moving horizontally in a horizontal distance to the rear, ascends upward to avoid interference with the wafer W loaded on the cassette 51, and then moves horizontally to the test unit 40, so that the relative movement of the unloading picker 25 It may take a lot of time and may be disadvantageous when a quick operation of the unloading picker 25 is required. Of course, when the fast loading time is not required for the unloading picker 25, a method of sequentially filling the wafer W from the front of the cassette 51 may be selected as shown in FIGS. 8 and 9. will be.

As described above, according to the present invention, water can be easily and reliably separated from the wafer stack WS of the separating unit 10 by discharging water, and the test unit 40 can be separated from the wafer W. Water can be sprayed at a predetermined water pressure to remove unsatisfactory products that have weak strength, cracks, or cracks, thereby unloading only wafers of good quality.

In addition, since the inner portion of the wafer may be supported together with the edge of the wafer W in the fall prevention portion 13, the broken wafer pieces are transferred to the back of the fall prevention portion 13 and interfere with the loading picker 20. This phenomenon can be prevented, thereby preventing chain breakage of the wafer by broken wafer pieces.

1 is a cross-sectional view schematically showing the overall structure of a wafer handling apparatus according to an embodiment of the present invention.

2 and 3 are partial perspective views showing the main configuration of the separating portion of the wafer handling apparatus of FIG.

4 and 5 are perspective views showing the configuration of the buffer unit and the test unit of the wafer handling apparatus of FIG.

6 and 7 are cross-sectional views illustrating an example of an operation of loading a wafer into an unloading part of the wafer handling apparatus of FIG. 1.

8 and 9 are cross-sectional views illustrating another example of an operation of loading a wafer into an unloading part of the wafer handling apparatus of FIG. 1.

Explanation of symbols on the main parts of the drawings

1: Water tank 10: Separating part

11 carrier 12 inclined support plate

13: fall prevention portion 131: body portion

132: auxiliary support 14: a nozzle for separating the wafer

20: loading picker 22: adsorption block

25: unloading picker 27: adsorption block

30: buffer part 31: loading box

32: inclined support plate 40: test unit

41: wafer accommodating part 43: support pin

45: injection nozzle for defect removal 50: unloading unit

51: cassette 71, 73: vision camera

72, 74: lighting unit 80: heating unit

W: Wafer WS: Wafer Stack

Claims (17)

A separating unit installed inside the water tank, the wafer stack having a plurality of sliced wafers stacked thereon, and separating one by one from a wafer positioned at one end of the wafer stack; A picker for picking up and transferring wafers separated by one from the separator; A test unit which breaks and removes a defective wafer having a high possibility of damage by injecting a fluid into the wafer transferred by the picker; Wafer handling apparatus comprising an unloading unit for loading the wafer of good quality conveyed from the test unit. The method of claim 1, wherein the wafer separated from the separator by the picker is photographed from an outside of a tank to examine whether a plurality of wafers are overlapped, whether a wafer is defective, and an offset value of the wafer with respect to the picker. Wafer handling apparatus further comprises a first vision inspection unit. The method of claim 2, wherein the first vision inspection unit comprises a vision camera installed outside the tank and an illumination unit provided on the opposite side of the vision camera with the picker therebetween to provide light toward the wafer. Wafer handling equipment. The wafer handling apparatus according to claim 1 or 2, further comprising a buffer unit in which the plurality of wafers are placed and loaded when the plurality of wafers picked up from the separator by the picker are inspected. . The storage unit of claim 4, wherein the buffer unit is installed in the tank and accommodates a plurality of wafers, and is formed to be inclined at a predetermined angle in the loading box so that the plurality of wafers loaded in the loading box are inclined at a predetermined angle. And an inclined support plate for supporting the inclined support plate, and an injecting body for injecting fluid from a surface facing the inclined support plate to push the wafers accommodated in the storage box toward the inclined support plate. According to claim 1, wherein the picker is a loading picker for picking up the wafer from the separating unit and transported to the test unit while moving in the horizontal direction and the vertical direction from the upper side of the tank, while moving in the horizontal and vertical direction from the upper side of the tank Wafer handling apparatus comprising an unloading picker for picking up the wafer inspected as good in the test section and conveyed to the unloading section. The wafer handling apparatus according to claim 1, wherein the unloading unit is installed in the water tank, and is configured of a cassette in which the wafer conveyed from the test unit is loaded upright. The wafer handling apparatus of claim 1, wherein the unloading unit comprises a conveyor belt which is placed while the wafer conveyed from the test unit is switched to a horizontal state and conveyed to a post-processing position. The apparatus of claim 1, further comprising a second vision inspection unit configured to photograph the wafer conveyed from the test unit to the unloading unit by the picker to inspect whether the wafer is defective or the offset value of the wafer with respect to the picker. Wafer handling equipment. A carrier on which a stack of wafers stacked with a plurality of wafers upright is placed; A wafer separation nozzle which separates the final wafer located at the end of the wafer stack from other wafers by injecting fluid into one end of the wafer stack mounted on the carrier; An anti-conduction part including a body part supporting an edge of a final wafer separated from an end of the wafer stack, and an auxiliary support part extending inwardly to an inner circumference of the body part to support an inner part of the wafer; And a picker for picking up and transporting the wafer separated from the wafer stack. 11. The wafer handling apparatus of claim 10, wherein the picker is formed such that an escape groove in which the auxiliary support is inserted is opened to avoid interference with the auxiliary support of the fall prevention portion. The wafer handling apparatus according to claim 10 or 11, wherein the picker is provided with a resistance relaxation opening for smoothly flowing the fluid ejected from the wafer separation nozzle. 12. The method of claim 10 or 11, characterized in that it further comprises a water guide installed on one side of the wafer separation nozzle to switch a portion of the fluid injected from the wafer separation nozzle flows toward the fall prevention portion. Wafer handling equipment. The wafer handling apparatus according to claim 10, wherein the fall prevention part is provided with an injection nozzle for spraying a fluid toward the wafer stack to push the wafer stack toward the inclined support plate. A wafer accommodating portion configured to accommodate the wafer separated from the wafer stack and open the lower surface thereof; A support pin installed at an open lower surface of the wafer accommodating part to support a lower end of the wafer and having an end portion spaced apart from the first surface of the wafer accommodating part by a predetermined distance; Wafer handling apparatus comprising a defect removal injection nozzle for removing a defective wafer by injecting a fluid to the wafer from the opposite side of the first surface of the wafer receiving portion. The wafer handling apparatus of claim 15, wherein guide grooves are formed at both side surfaces of the wafer accommodating portion to guide both edges of the wafer. 17. The method of claim 15 or 16, further comprising a plurality of debris injection nozzles for injecting fluid from the inside of the wafer receiving portion toward the wafer to break the broken wafer pieces toward the inner opening when the wafer is broken. Wafer handling apparatus.

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