KR20110050236A - Radiating heat and waterproof structure of electric sign - Google Patents

Radiating heat and waterproof structure of electric sign Download PDF

Info

Publication number
KR20110050236A
KR20110050236A KR1020090107129A KR20090107129A KR20110050236A KR 20110050236 A KR20110050236 A KR 20110050236A KR 1020090107129 A KR1020090107129 A KR 1020090107129A KR 20090107129 A KR20090107129 A KR 20090107129A KR 20110050236 A KR20110050236 A KR 20110050236A
Authority
KR
South Korea
Prior art keywords
heat
heat dissipation
coupled
waterproof structure
led module
Prior art date
Application number
KR1020090107129A
Other languages
Korean (ko)
Other versions
KR101117785B1 (en
Inventor
유은희
Original Assignee
유은희
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 유은희 filed Critical 유은희
Priority to KR1020090107129A priority Critical patent/KR101117785B1/en
Publication of KR20110050236A publication Critical patent/KR20110050236A/en
Application granted granted Critical
Publication of KR101117785B1 publication Critical patent/KR101117785B1/en

Links

Images

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G03B21/16—Cooling; Preventing overheating
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
    • G09F9/3026—Video wall, i.e. stackable semiconductor matrix display modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • G09F2013/222—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent with LEDs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Abstract

PURPOSE: A heat emitting and waterproof structure of an electric sign is provided to effectively protect an LED module. CONSTITUTION: A plurality of LED modules(10) is horizontally connected. A frame(30) combines an LED module with a first packing member(20) by forming a first penetration unit(31). An internal cover(50) is coupled with the frame and includes a plurality of second penetration units(51). One side of a heat emitting member(40) is inserted into the frontal surface of the first penetration unit to absorb heat of an IC. The other side of the heat emitting member is protruded toward the rear side of the second penetration unit to emit heat to the outside. An external cover(60) is coupled with the internal cover to prevent the radiant heat of solar energy.

Description

전광판의 방열 및 방수구조{Radiating heat and waterproof structure of electric sign}Radiating heat and waterproof structure of electric sign}

본 발명은 복수의 엘이디모듈을 이용한 전광판에 관한 것으로, 더욱 상세하게는 방열부재 및 패킹부재를 이용하여 열은 방출하고 수분은 차단함으로써 엘이디모듈을 효과적으로 보호할 수 있는 전광판의 방열 및 방수구조에 관한 것이다.The present invention relates to a display board using a plurality of LED modules, and more particularly to a heat dissipation and waterproof structure of the display board that can effectively protect the LED module by radiating heat and blocking moisture by using the heat radiation member and the packing member. will be.

일반적으로 하나의 매체를 사용하여 불특정 다수에게 문자 및 화상을 전달하는 수단으로 옥외 전광판장치가 널리 사용되고 있다. 이러한 옥외 전광판장치의 사용은 점차 확대되어 운동장의 대형 안내판, 도로의 교통정보 표지판, 옥외용 광고판 등으로 사용되고 있다.In general, an outdoor electronic display device is widely used as a means for delivering text and images to an unspecified number using a single medium. The use of such outdoor billboards has been gradually expanded to be used as large information boards of sports grounds, road traffic information signs, outdoor billboards, and the like.

종래의 전광판용 픽셀 모듈은 LED를 고정하기 위한 LED 모듈을 플라스틱 재료를 이용한 사출성형으로 제조됨으로써, LED 모듈을 용이하게 제조할 수 있는 장점이 있지만, 플라스틱의 낮은 열전도율로 인한 방열 효과의 미비로 LED의 구동으로 인해 발생한 열이 공기 중으로 방출되지 못하는 문제점이 있다. 이러한 문제점은 고열로 인한 LED의 열화를 발생시키고, LED의 광도저하와 LED의 수명을 단축하 는 문제점을 내포하고 있다. The conventional pixel module for the electronic display board is manufactured by injection molding using a plastic material of the LED module for fixing the LED, but there is an advantage that the LED module can be easily manufactured. There is a problem that the heat generated by the operation of the is not released into the air. This problem causes the degradation of the LED due to high heat, and includes a problem of reducing the light intensity of the LED and shortening the life of the LED.

이를 개선하기 위해 전광판의 내측에 팬을 구비하여 방열을 하고 있지만, 복수의 팬을 구동시키기 위한 전력이 손실이 클 뿐만 아니라, 팬이 먼지와 수분을 흡입하면 전광판의 회로에 쌓이게 되어 전기적인 고장을 초래하게 되는 문제점이 있다.In order to improve the heat dissipation, there is a fan inside the display board to dissipate heat, but the power to drive a plurality of fans is not only large, but also when the fan sucks in dust and moisture, it accumulates in the circuit of the display board, causing electrical failure. There is a problem that results.

본 발명은 상기와 같은 문제점을 해결하기 위한 것으로, 전기소자없이 방열 및 방수를 구현하기 위해 간단한 구조의 방열부재와 복수의 패킹부재에 의해 엘이디모듈을 전광판에 결합함으로써, 저비용 고효율을 갖는 전광판의 방열 및 방수구조를 제공함에 그 목적이 있다.The present invention is to solve the above problems, in order to implement the heat dissipation and waterproof without electrical elements by combining the LED module to the display board by a heat dissipation member and a plurality of packing member of a simple structure, the heat dissipation of the display board having a low cost high efficiency And to provide a waterproof structure.

본 발명에 의한 전광판의 방열 및 방수구조는 상하, 좌우로 연결되는 복수의 엘이디모듈과; 상기 엘이디모듈 및 제1패킹부재가 결합될 수 있도록 복수의 제1관통부가 형성된 프레임과; 상기 프레임과 결합되며 복수의 제2관통부가 형성된 내측커버와; 일측은 상기 제1관통부의 전면으로 삽입되어 아이씨(IC)의 열을 흡수하고 타측은 상기 제2관통부 후면으로 돌출되어 외부로 열을 방출하는 방열부재와; 상기 내측커버와 결합되어 태양에너지의 복사열을 차단하는 외측커버를 포함하여 구성되는 것을 그 기술적 특징으로 한다. The heat dissipation and waterproof structure of the electronic display board according to the present invention includes a plurality of LED modules connected vertically and horizontally; A frame formed with a plurality of first through-holes such that the LED module and the first packing member are coupled to each other; An inner cover coupled to the frame and having a plurality of second passages therein; One side is inserted into the front surface of the first through portion to absorb the heat of the IC (IC) and the other side protrudes to the rear of the second through portion to radiate heat to the outside; It is characterized in that it is configured to include an outer cover coupled to the inner cover to block the radiant heat of solar energy.

본 발명에 의한 전광판의 방열 및 방수구조에 의하면, 아이씨(IC)에 직접 밀착되는 방열부재(40)의 밀착부(42)가 전력의 손실 없이 방열을 행하고, 복수의 패킹부재(20)(21)(22)가 수분의 침투를 효과적으로 방지하여 엘이디모듈(10)을 열과 수분으로부터 보호함으로써 전광판의 수명을 연장하는 효과가 있다.According to the heat dissipation and waterproof structure of the electronic display panel according to the present invention, the close contact portion 42 of the heat dissipation member 40 which is in direct contact with the IC (IC) radiates heat without loss of power, and the plurality of packing members 20 (21) (22) effectively prevents the penetration of water, thereby protecting the LED module 10 from heat and moisture, thereby extending the life of the display.

본 발명의 바람직한 실시 예를 첨부된 도면을 통해 상세히 설명한다.Preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 1은 본 발명의 전광판을 도시한 사시도이고, 도 2는 본 발명의 전광판을 도시한 분해 사시도이고, 도 3은 본 발명의 전광판을 도시한 측단면도이고, 도 4는 본 발명의 방열부재를 도시한 사시도이다.1 is a perspective view showing an electric sign of the present invention, Figure 2 is an exploded perspective view showing an electric sign of the present invention, Figure 3 is a side cross-sectional view showing an electric sign of the present invention, Figure 4 is a heat dissipation member of the present invention It is a perspective view shown.

본 발명의 전광판은 도 1에서 도시한 바와 같이, 복수의 엘이디모듈(10)을 상하, 좌우로 연결하고 각각의 엘이디모듈(10)을 미리 프로그램된 제어부(도면미표시)에 의해 발광하도록 하여 문자 및 화상을 연출하는 것으로서, 이렇게 구성된 복수의 전광판을 다시 상하, 좌우로 연결하여 더욱 큰 전광판을 구성하게 된다.As shown in FIG. 1, the electronic display board of the present invention connects the plurality of LED modules 10 vertically and horizontally, and causes each LED module 10 to emit light by a pre-programmed controller (not shown). In order to produce an image, a plurality of electric signboards configured as described above are connected to each other up and down and left and right to form a larger electric signboard.

상기 전광판은 도 2 및 도 3에서 도시한 바와 같이 복수의 구성요소가 결합되어 구성된다. As shown in FIG. 2 and FIG. 3, the electronic display board is configured by combining a plurality of components.

먼저 전면에는 복수의 엘이디로 이루어진 엘이디모듈(10)이 알루미늄으로 형성된 프레임(30)에 상하, 좌우로 결합된다.First, the front and rear LED module 10 consisting of a plurality of LED is coupled to the frame 30 formed of aluminum.

상기 프레임(30)은 엘이디모듈(10)의 배면이 결합되는 부위에 복수의 제1관통부(31)가 형성되고, 상기 엘이디모듈(10)과 제1관통부(31)의 사이에는 제1패킹부재(20)가 결합되는데, 상기 제1패킹부재(20)는 탄성력이 있는 재질로 형성되어 외 부의 수분이 제1관통부(31)를 통해 엘이디모듈(10)의 내부로 유입되는 것을 방지하게 된다. The frame 30 has a plurality of first through-holes 31 are formed at a portion where the rear surface of the LED module 10 is coupled, and a first portion between the LED module 10 and the first through-holes 31. The packing member 20 is coupled to each other, and the first packing member 20 is formed of an elastic material to prevent external moisture from being introduced into the LED module 10 through the first through part 31. Done.

또한, 상기 제1관통부(31)에는 방열부재(40)가 삽입되며, 상기 방열부재(40)의 일측으로 돌출된 복수의 밀착부(42)가 엘이디모듈(10)의 배면을 통해 회로기판(11)에 결합된 복수의 아이씨(IC)(12)와 밀착된다. 이는 아이씨에서 발생되는 열을 흡수하여 외부로 방출하기 위한 본원 발명의 기술적 특이성으로서, 상기 방열부재(40)는 열전도성이 높은 알루미늄으로 형성된다. In addition, the heat dissipation member 40 is inserted into the first through part 31, and a plurality of contact parts 42 protruding toward one side of the heat dissipation member 40 are connected to the circuit board through the rear surface of the LED module 10. It is in close contact with a plurality of ICs 12 coupled to 11. This is a technical specificity of the present invention for absorbing and releasing heat generated from the IC to the outside, the heat dissipation member 40 is formed of high thermal conductivity aluminum.

한편, 상기 방열부재(40)는 열을 효과적으로 외부 방출하기 위해 도 4에서 도시한 바와 같이 아이씨(12)에 밀착되는 복수의 밀착부(42)와, 상기 밀착부(42)에서 전달된 열을 방열핀(43)으로 전달하는 방열부(41)와, 상기 방열부(41)에서 전달된 열을 외부로 방출하는 방열핀(43)으로 구성된다. On the other hand, the heat dissipation member 40 is a plurality of close contact portion 42 in close contact with the IC 12 and the heat transmitted from the close contact portion 42 as shown in Figure 4 in order to effectively radiate heat outside The heat dissipation unit 41 is transferred to the heat dissipation fin 43, and a heat dissipation fin 43 for dissipating heat transferred from the heat dissipation unit 41 to the outside.

이때, 상기 밀착부(42)는 엘이디모듈(10)의 내측에 결합된 회로기판(11)의 아이씨(12)와 밀착되어 열을 직접 흡수하게 되며, 상기 흡수된 열은 방열부(41)의 배면에 적층 결합된 복수의 방열핀(43)에 의해 외부로 신속하게 배출되어 엘이디모듈(10)을 냉각시키는 것이다. At this time, the close contact portion 42 is in close contact with the IC 12 of the circuit board 11 coupled to the inside of the LED module 10 to absorb heat directly, the absorbed heat of the heat radiation portion 41 It is quickly discharged to the outside by a plurality of heat dissipation fins 43 laminated to the rear surface to cool the LED module 10.

이렇게 복수의 방열부재(40)가 결합된 프레임(30)의 배면에는 합성수지로 형성된 내측커버(50)가 결합되며, 상기 프레임(30)과 내측커버(50)의 사이에는 외부 의 수분이 직접 유입되는 것을 방지하는 제2패킹부재(21)가 결합된다.The inner cover 50 formed of a synthetic resin is coupled to the rear surface of the frame 30 to which the plurality of heat dissipation members 40 are coupled, and external moisture flows directly between the frame 30 and the inner cover 50. The second packing member 21 is prevented from being coupled.

또한, 상기 내측커버(50)는 엘이디모듈(10)로 수분이 침투하지 못하도록 하는 역활을 수행하며, 프레임(30)의 제1관통부(31)와 대응하는 위치에 제2관통부(51)가 형성된다. In addition, the inner cover 50 serves to prevent moisture from penetrating into the LED module 10, and the second penetrating portion 51 at a position corresponding to the first penetrating portion 31 of the frame 30. Is formed.

이때, 상기 방열부(41)의 배면에 결합된 방열핀(43)은 제2관통부(51)를 관통하여 내측커버(50)의 배면 측으로 돌출되고, 상기 방열부재(40)와 내측커버(50)의 사이에는 제3패킹부재(22)가 결합되어 제2관통부(51)로 유입되는 수분을 차단한다.At this time, the heat dissipation fin 43 coupled to the rear surface of the heat dissipation portion 41 is projected to the rear side of the inner cover 50 through the second through portion 51, the heat dissipation member 40 and the inner cover 50 Between the third packing member 22 is coupled to block the water flowing into the second through portion (51).

한편, 상기 내측커버(50)의 배면에는 태양에너지에서 유입되는 복사열을 차단할 수 있도록 알루미늄으로 형성된 외측커버(60)가 결합된다. 이때, 외측커버(60)에는 방열핀(43)의 열이 외부로 빠르게 방출되어 급속한 냉각이 이루어질 수 있도록 복수의 슬롯(61)(slot)이 형성되어 있다. On the other hand, the inner cover 50 is coupled to the outer cover 60 made of aluminum so as to block the radiant heat flowing from the solar energy. In this case, a plurality of slots 61 are formed in the outer cover 60 so that the heat of the heat dissipation fin 43 is quickly discharged to the outside to allow rapid cooling.

또한, 상기 외측커버(60)의 배면에는 조립된 전광판을 편리하게 이동하고 설치할 수 있도록 한 쌍의 손잡이(62)를 결합되어 있다.In addition, a pair of handles 62 are coupled to the rear surface of the outer cover 60 to conveniently move and install the assembled display board.

이와 같이 구성된 본 발명의 전광판은 발열된 아이씨(12)를 냉각시키기 위하여 복수의 송풍팬을 사용할 필요가 없어 에너지를 절감을 할 수 있을 뿐만 아니라, 복수의 패킹부재가 여러 단계로 결합함으로써 엘이디모듈(10)로 유입되는 외부의 수분을 효과적으로 차단할 수 있다.The electric signboard of the present invention configured as described above does not need to use a plurality of blower fans to cool the heated IC 12, thereby saving energy, and by combining the plurality of packing members in various stages. 10) can effectively block the external moisture flowing into.

상기와 같은 본 발명은 상술한 특정의 실시 예에 한정되지 아니하며, 청구범위에서 청구하는 본 발명의 요지를 벗어남이 없이 당해 발명이 속하는 분야에서 통상의 지식을 가진 자라면 누구든지 다양한 변경 실시가 가능할 것이다.The present invention as described above is not limited to the above-described specific embodiments, and any person having ordinary skill in the art to which the present invention pertains may make various changes without departing from the gist of the present invention as claimed in the claims. will be.

도 1은 본 발명의 전광판을 도시한 사시도,1 is a perspective view showing an electric sign of the present invention,

도 2는 본 발명의 전광판을 도시한 분해 사시도,2 is an exploded perspective view showing an electric sign of the present invention;

도 3은 본 발명의 전광판을 도시한 측단면도,Figure 3 is a side cross-sectional view showing an electric sign of the present invention,

도 4는 본 발명의 방열부재를 도시한 사시도.Figure 4 is a perspective view showing a heat radiation member of the present invention.

< 도면의 주요부분에 대한 부호의 설명 >Description of the Related Art

10 : 엘이디모듈 11 : 회로기판10: LED module 11: circuit board

12 : 아이씨(IC) 20 : 제1패킹부재12: IC 20: first packing member

21 : 제2패킹부재 22 : 제3패킹부재21: second packing member 22: third packing member

30 : 프레임 31 : 제1관통부30 frame 31: first through part

40 : 방열부재 41 : 방열부40: heat dissipation member 41: heat dissipation unit

42 : 밀착부 43 : 방열핀42: close contact 43: heat dissipation fin

50 : 내측커버 51 : 제2관통부50: inner cover 51: second through portion

60 : 외측커버 61 : 슬롯(slot)60: outer cover 61: slot

62 : 손잡이62: handle

Claims (4)

상하, 좌우로 연결되는 복수의 엘이디모듈(10)과;A plurality of LED modules 10 connected vertically and horizontally; 상기 엘이디모듈(10) 및 제1패킹부재(20)가 결합될 수 있도록 복수의 제1관통부(31)가 형성된 프레임(30)과;A frame 30 in which a plurality of first through-holes 31 are formed such that the LED module 10 and the first packing member 20 are coupled to each other; 상기 프레임(30)과 결합되며 복수의 제2관통부(51)가 형성된 내측커버(50)와;An inner cover 50 coupled to the frame 30 and having a plurality of second through holes 51 formed therein; 일측은 상기 제1관통부(31)의 전면으로 삽입되어 아이씨(IC)의 열을 흡수하고 타측은 상기 제2관통부(51) 후면으로 돌출되어 외부로 열을 방출하는 방열부재(40)와;One side is inserted into the front surface of the first through portion 31 to absorb the heat of the IC (IC) and the other side of the heat dissipation member 40 for protruding to the rear of the second through portion 51 to release heat to the outside; ; 상기 내측커버(50)와 결합되어 태양에너지의 복사열을 차단하는 외측커버(60);An outer cover 60 coupled to the inner cover 50 to block radiant heat of solar energy; 를 포함하여 구성되는 것을 특징으로 하는 전광판의 방열 및 방수구조. Heat dissipation and waterproof structure of the display board, characterized in that comprising a. 제 1항에 있어서, The method of claim 1, 상기 방열부재(40)는 엘이디모듈(10)의 아이씨(12)에 밀착되는 복수의 밀착부(42)와, 상기 밀착부(42)에서 전달된 열을 방열핀(43)으로 전달하는 방열부(41)와, 상기 방열부(41)에서 전달된 열을 외부로 방출할 수 있도록 방열부(41)의 배면 에 적층 결합된 복수의 방열핀(43)으로 구성되는 것을 특징으로 하는 전광판의 방열 및 방수구조.The heat dissipation member 40 may include a plurality of contact parts 42 closely contacted with the IC 12 of the LED module 10, and a heat dissipation part configured to transfer heat transferred from the contact part 42 to the heat dissipation fins 43. 41 and the heat dissipation and waterproof of the electric light plate, characterized in that composed of a plurality of heat dissipation fins (43) laminated on the back of the heat dissipation unit 41 to discharge the heat transferred from the heat dissipation unit 41 to the outside. rescue. 제 1항에 있어서,The method of claim 1, 상기 프레임(30)과 내측커버(50)의 사이에는 제2패킹부재(21)가 결합되며, 상기 방열부재(40)와 제2관통부(51)의 사이에는 제3패킹부재(22)가 결합되어 내측으로 유입되는 수분을 차단하는 것을 특징으로 하는 전광판의 방열 및 방수구조.The second packing member 21 is coupled between the frame 30 and the inner cover 50, and the third packing member 22 is disposed between the heat dissipation member 40 and the second through part 51. Heat dissipation and waterproof structure of the electric signboard, characterized in that coupled to block the moisture flowing into the inside. 제 1항에 있어서,The method of claim 1, 상기 외측커버(60)는 태양에너지의 복사열을 차단할 수 있도록 알루미늄으로 이루어지며, 방열핀(43)의 열이 외부로 빠르게 방출되어 급속한 냉각이 이루어질 수 있도록 복수의 슬롯(61)(slot)이 형성되는 것을 특징으로 하는 전광판의 방열 및 방수구조.The outer cover 60 is made of aluminum to block the radiant heat of the solar energy, a plurality of slots 61 (slot) is formed so that the heat of the heat radiation fin 43 is quickly released to the outside to achieve rapid cooling Heat dissipation and waterproof structure of the display board.
KR1020090107129A 2009-11-06 2009-11-06 Radiating heat and waterproof structure of electric sign KR101117785B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020090107129A KR101117785B1 (en) 2009-11-06 2009-11-06 Radiating heat and waterproof structure of electric sign

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090107129A KR101117785B1 (en) 2009-11-06 2009-11-06 Radiating heat and waterproof structure of electric sign

Publications (2)

Publication Number Publication Date
KR20110050236A true KR20110050236A (en) 2011-05-13
KR101117785B1 KR101117785B1 (en) 2012-03-20

Family

ID=44361085

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090107129A KR101117785B1 (en) 2009-11-06 2009-11-06 Radiating heat and waterproof structure of electric sign

Country Status (1)

Country Link
KR (1) KR101117785B1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102682672A (en) * 2011-09-30 2012-09-19 杨东佐 LED (light-emitting diode) dot matrix display screen
CN102930788A (en) * 2012-11-22 2013-02-13 段四才 Adhesive filling-free waterproof structure of LED module
KR101306188B1 (en) * 2012-01-31 2013-09-11 국민대학교산학협력단 Message sign apparatus with waterproofing structure
CN104252819A (en) * 2014-09-11 2014-12-31 苏州合欣美电子科技有限公司 LED (light emitting diode) display screen and waterproof box thereof
CN104318874A (en) * 2014-11-14 2015-01-28 厦门强力巨彩光电科技有限公司 LED display screen liner board and LED display screen
CN105202324A (en) * 2015-10-23 2015-12-30 湖南新亚胜科技发展有限公司 Supporting device and LED display screen for court

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030067449A (en) * 2002-06-07 2003-08-14 에이피전자 주식회사 Module for an electric sign

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102682672A (en) * 2011-09-30 2012-09-19 杨东佐 LED (light-emitting diode) dot matrix display screen
KR101306188B1 (en) * 2012-01-31 2013-09-11 국민대학교산학협력단 Message sign apparatus with waterproofing structure
CN102930788A (en) * 2012-11-22 2013-02-13 段四才 Adhesive filling-free waterproof structure of LED module
CN104252819A (en) * 2014-09-11 2014-12-31 苏州合欣美电子科技有限公司 LED (light emitting diode) display screen and waterproof box thereof
CN104318874A (en) * 2014-11-14 2015-01-28 厦门强力巨彩光电科技有限公司 LED display screen liner board and LED display screen
CN104318874B (en) * 2014-11-14 2016-09-07 厦门强力巨彩光电科技有限公司 A kind of LED display
CN105202324A (en) * 2015-10-23 2015-12-30 湖南新亚胜科技发展有限公司 Supporting device and LED display screen for court

Also Published As

Publication number Publication date
KR101117785B1 (en) 2012-03-20

Similar Documents

Publication Publication Date Title
KR101117785B1 (en) Radiating heat and waterproof structure of electric sign
TWI302590B (en) Heat-dissipating module for a back light set of a liquid crystal display
CN105276411B (en) Light irradiation device
US20160348887A1 (en) Light illuminating apparatus
JP2005167102A (en) Electronic unit and its heat radiation structure
US8529097B2 (en) Lighting system with heat distribution face plate
JP2007207595A (en) Illumination device and image display apparatus
JP6006379B2 (en) Light irradiation device
JP6101518B2 (en) Display device
RU2002107437A (en) Electronic device with heat-generating components and heat-absorbing elements
JP2008041638A (en) Heat dissipation device for backlight light source for flat panel display
CN213656552U (en) LED lamp strip module
CN112270898A (en) Heat dissipation device for liquid crystal display
KR20110065864A (en) Led cooler
CN103759236A (en) Ultraviolet lamp
KR200464800Y1 (en) Light emitted diode dispaly unit with radiating structure
KR101585376B1 (en) Led lighting having ladiant heat apparatus
JP2009199980A (en) Led lighting device
WO2019114295A1 (en) Illumination device
KR100930376B1 (en) Led panel easy to sink heat
CN110114714A (en) Lighting device and display device
KR20190134570A (en) A Cooler for Display Device
KR102186603B1 (en) A Cooler for Display Device
JP2012119521A (en) Cooling device of led light source
CN218788128U (en) Light emitting device

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20150211

Year of fee payment: 4

LAPS Lapse due to unpaid annual fee