CN112270898A - Heat dissipation device for liquid crystal display - Google Patents
Heat dissipation device for liquid crystal display Download PDFInfo
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- CN112270898A CN112270898A CN202011207066.XA CN202011207066A CN112270898A CN 112270898 A CN112270898 A CN 112270898A CN 202011207066 A CN202011207066 A CN 202011207066A CN 112270898 A CN112270898 A CN 112270898A
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- semiconductor thermoelectric
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/35—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
- H05K7/20972—Forced ventilation, e.g. on heat dissipaters coupled to components
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a heat dissipation device for a liquid crystal display, which is arranged between a heating element and a rear shell in the liquid crystal display, and comprises a heat dissipation plate, a first fan and a first semiconductor thermoelectric body which are sequentially arranged between the heating element and the rear shell in a linear manner, wherein the first semiconductor thermoelectric body comprises a bracket and semiconductor thermoelectric plates which are arranged on the bracket at intervals, and the semiconductor thermoelectric plates are made of semiconductor thermoelectric materials; a first air path is formed on the arrangement path of the heat dissipation plate, the first fan and the first semiconductor thermoelectric element, and a first air hole is formed in the rear shell and used for exhausting air of the first air path; the first air path extends from the heat dissipation plate to the first air hole; and an electric storage box electrically connected with the first semiconductor thermoelectric body is arranged in the rear shell. The first fan is arranged for assisting in heat dissipation, air flowing on the heat dissipation plate is accelerated, high-temperature air is discharged out of the liquid crystal display from the first air hole along the first air path, and heat dissipation efficiency is improved.
Description
Technical Field
The invention relates to the technical field of liquid crystal displays, in particular to a heat dissipation device for a liquid crystal display.
Background
A liquid crystal display (lcd) is a short name, and is a substance that is in a turbid solid state and in a crystalline particle state after being cooled, and is heated to a transparent liquid state using an organic compound having a regular molecular arrangement between a solid state and a liquid state. In a liquid crystal display device including a backlight unit that irradiates the entire image forming area with light-emitting diodes arranged in a concentrated manner, heat generated by the light-emitting diodes can be efficiently dissipated, as disclosed in publication No. CN 102608804A. The liquid crystal display device includes a liquid crystal panel and a backlight unit, the backlight unit being disposed on a back surface side of the liquid crystal panel and having, in order from a front surface side, a reflection sheet having a shape curved so that a front surface thereof is concave, a light emitting diode substrate on which a plurality of light emitting diodes are disposed along a longitudinal direction, and a heat dissipation plate having a length in a width direction larger than that of the light emitting diode substrate.
The existing liquid crystal display only uses a heat radiation plate to assist a heating element to radiate heat, however, in order to meet the requirements of viewing the images, the screen of the existing liquid crystal display is increasingly large, and larger heat productivity is brought to the heating elements such as a light emitting diode substrate and the like; the heat dissipation requirement cannot be met only by the heat dissipation plate for assisting heat dissipation, so that the light emitting diode generates heat and becomes high temperature, and therefore, the problems of light emitting efficiency reduction, light emitting diode degradation, image quality reduction and the like can be caused.
Disclosure of Invention
In view of the above, the present invention provides a heat dissipation device for a liquid crystal display, which can solve the problem of insufficient heat dissipation function of the conventional liquid crystal display to at least some extent.
The technical scheme of the invention is realized as follows:
a heat dissipating double-fuselage for LCD, this heat dissipating double-fuselage is set up between heating element and rear shell in the LCD, including heating panel, first fan and first semiconductor thermoelectricity body that is arranged linearly sequentially between heating element and rear shell, the said first semiconductor thermoelectricity body includes the support and semiconductor thermoelectric plate spaced on support, the said semiconductor thermoelectric plate is a semiconductor thermoelectric material; a first air path is formed on the arrangement path of the heat dissipation plate, the first fan and the first semiconductor thermoelectric element, and a first air hole is formed in the rear shell and used for exhausting air of the first air path; the first air path extends from the heat dissipation plate to the first air hole; and an electric storage box electrically connected with the first semiconductor thermoelectric body is arranged in the rear shell.
As a further alternative of the heat dissipation device for the liquid crystal display, the heat dissipation plate includes a plate body and a plurality of heat dissipation fins formed on one side of the plate body, and ventilation channels are formed between every two heat dissipation fins.
As a further alternative of the heat dissipation device for the liquid crystal display, a second air path is formed in the rear case, and an included angle is formed between a path of the second air path and a path of the first air path; a second fan and a second semiconductor thermoelectric body are arranged on the path of the second air path, and the second semiconductor thermoelectric body also comprises a support and a semiconductor thermoelectric plate spaced on the support; the second semiconductor thermoelectric body is electrically connected with the storage box; the rear shell is provided with a second air hole for the second air path to enter air; the second air passage extends from the second air hole to the heat dissipation plate, and is connected to the first air passage.
As a further alternative of the heat dissipation device for a liquid crystal display, two second air paths are provided at both ends of the ventilation channel.
As a further alternative of the heat dissipating apparatus for a liquid crystal display, the first fan may be plural, and the second fan may be plural.
As a further alternative of the heat dissipating apparatus for a liquid crystal display, a temperature sensor for detecting a temperature of the heating element or the heat dissipating plate is provided in the rear case.
As a further alternative of the heat dissipation device for the liquid crystal display, the material of the heat dissipation plate is graphene carbon plastic alloy.
The invention has the following beneficial effects: the first fan is arranged for assisting in heat dissipation, so that air flowing on the heat dissipation plate is accelerated, high-temperature air is discharged out of the liquid crystal display from the first air hole along the first air path, and the heat dissipation efficiency is improved; meanwhile, high-temperature air passes through the first semiconductor thermoelectric body on a first air path, and the semiconductor thermoelectric material on the first semiconductor thermoelectric body absorbs heat in the high-temperature air and converts the heat into electric energy to be stored in the electricity storage box, so that energy is saved; in addition, the temperature of the high-temperature air is reduced, the temperature of the air discharged by the first air path is prevented from being increased near the liquid crystal display, and the temperature of the rear shell of the liquid crystal display is prevented from being increased to scald people.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is an exploded view of a heat dissipation device for a liquid crystal display according to the present invention;
FIG. 2 is a schematic structural view of the back side of the rear housing;
FIG. 3 is a schematic view of the structure within the rear housing;
FIG. 4 is a schematic structural diagram of the first semiconductor pyroelectric body;
FIG. 5 is an exploded view of the first semiconductor pyroelectric body;
fig. 6 is a schematic structural view of the heat dissipation plate;
FIG. 7 is a schematic diagram of a heat dissipation device for a liquid crystal display according to the present invention.
In the figure: 1. a rear housing; 11. a first air vent; 12. a second air hole; 2. a heating element; 3. a heat dissipation plate; 31. a plate body; 32. a heat dissipating fin; 33. a ventilation channel; 4. a first fan; 5. a first semiconductor pyroelectric body; 51. a support; 52. a semiconductor thermoelectric plate; 6. a second fan; 7. a second semiconductor pyroelectric body; 8. a reflective sheet;
A. a first air passage; B. and a second air passage.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "above," and "over" a second feature may mean that the first feature is directly above or obliquely above the second feature, or that only the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
Referring to fig. 1 to 7, a heat dissipation device for a liquid crystal display is shown, which is disposed between a heating element 2 and a rear case 1 in the liquid crystal display, and comprises a heat dissipation plate 3, a first fan 4 and a first semiconductor thermoelectric element 5, which are sequentially disposed between the heating element 2 and the rear case 1 and are arranged in a linear arrangement, wherein the first semiconductor thermoelectric element 5 comprises a support 51 and a semiconductor thermoelectric plate 52 spaced on the support 51, and the semiconductor thermoelectric plate 52 is a semiconductor thermoelectric material; a first air passage a is formed on the installation path of the heat dissipation plate 3, the first fan 4 and the first semiconductor thermoelectric element 5, and the rear case 1 is provided with a first air hole 11 for exhausting air in the first air passage a; the first air passage a extends from the heat sink 3 to the first air hole 11; and an electricity storage box electrically connected with the first semiconductor thermoelectric body 5 is arranged in the rear shell 1.
Specifically, the heating element 2 is a light emitting diode substrate, and the heat dissipation plate 3 is tightly attached to the light emitting diode substrate, so that heat on the light emitting diode substrate can be transferred to the heat dissipation plate 3; the first fan 4 accelerates the air flow, and the first fan 4 drives the air near the heat sink 3 to flow to the position of the first air hole 11, that is, the air flows along the first air path a, which means the path of the air flow; since the heat dissipation plate 3 absorbs heat from the led substrate, air near the heat dissipation plate 3 becomes high-temperature air, the high-temperature air can pass through the first semiconductor thermoelectric element 5 while flowing in the first air path a, and the high-temperature air passes through a gap between every two semiconductor thermoelectric elements 52 of the first semiconductor thermoelectric element 5, and the semiconductor thermoelectric elements 52 of the first semiconductor thermoelectric element 5 absorb heat and convert the heat into electric energy to be stored in the power storage box; the semiconductor thermoelectric plate 52 is a semiconductor thermoelectric material, which can directly convert heat energy into electric energy, or directly generate refrigeration from electric energy. The first semiconductor thermoelectric element 5 includes a support 51 and semiconductor thermoelectric plates 52 spaced apart from the support 51, the support 51 fixes the positions of the semiconductor thermoelectric plates 52 and allows the semiconductor thermoelectric plates 52 to be spaced apart from each other, and the specific structure of the support 51 is not particularly limited as long as the above functions are achieved.
Thus, the first fan 4 is arranged to assist in heat dissipation, so that air flow on the heat dissipation plate 3 is accelerated, high-temperature air is discharged out of the liquid crystal display from the first air hole 11 along the first air path a, and the heat dissipation efficiency is improved; meanwhile, high-temperature air passes through the first semiconductor thermoelectric element 5 on the first air path a, and the semiconductor thermoelectric material on the first semiconductor thermoelectric element 5 absorbs heat in the high-temperature air and converts the heat into electric energy to be stored in the power storage box, so that energy is saved; in addition, the temperature of the high-temperature air is reduced, the temperature of the air discharged by the first air path A is prevented from being increased near the liquid crystal display, and the temperature of the rear shell 1 of the liquid crystal display is prevented from being increased to scald people.
In the above embodiment, referring to fig. 6, the heat dissipation plate 3 includes a plate body 31 and a plurality of heat dissipation fins 32 formed on one side of the plate body 31, and a ventilation channel 33 is formed between every two heat dissipation fins 32. The heat dissipating fins 32 increase the contact area with the air, so that the heat on the heat dissipating plate 3 is transferred to the air more quickly.
In some embodiments, in order to further improve the heat dissipation efficiency of the liquid crystal display, referring to fig. 7, a second air path B is formed in the rear case 1, and an included angle exists between a path of the second air path B and a path of the first air path a; a second fan 6 and a second semiconductor thermoelectric element 7 are arranged on the path of the second air passage B, and the second semiconductor thermoelectric element 7 also includes a support 51 and a semiconductor thermoelectric plate 52 spaced on the support 51; the second semiconductor thermoelectric element 7 is electrically connected with the storage box; the rear shell 1 is provided with a second air hole 12 for the second air passage B to enter air; the second air passage B extends from the second air hole 12 to the heat sink 3, and is connected to the first air passage a.
Specifically, the first duct a is a path through which high-temperature air near the heat sink 3 is discharged to the first air hole 11, and the second duct B is a path through which outside room-temperature air flows near the heat sink 3; under the driving of the second fan 6, ambient room temperature air enters from the second air hole 12 of the rear case 1 and passes through the second semiconductor thermoelectric element 7, the semiconductor thermoelectric plate 52 on the second semiconductor thermoelectric element 7 generates refrigeration effect by electric energy, so that the room temperature air is changed into low temperature air, and the low temperature air flows to the vicinity of the heat dissipation plate 3, so that the heat dissipation plate 3 is rapidly cooled; wherein the electric energy on the semiconductor thermoelectric plate 52 on the second semiconductor thermoelectric element 7 can be provided by the storage box. It should be noted that the structures of the first semiconductor thermoelectric element 5 and the second semiconductor thermoelectric element 7 are not strictly different, and the biggest difference is that the semiconductor thermoelectric plate 52 on the first semiconductor thermoelectric element 5 functions to convert thermal energy into electric energy, and the semiconductor thermoelectric plate 52 on the second semiconductor thermoelectric element 7 functions to generate refrigeration by using electric energy.
In the above embodiment, referring to fig. 6 and 7, two second air passages B are provided at two ends of the ventilation channel 33. The low-temperature air in the two second air paths B enters from the two ends of the ventilation channel 33, absorbs the heat of the heat dissipation plate 3, and is then discharged from the first air holes 11 under the driving of the first fan 4; wherein, the temperature of the wind discharged from the first wind hole 11 is not high due to the heat absorption of the semiconductor thermoelectric plate 52 on the first semiconductor thermoelectric element 5, thereby preventing high-temperature air from entering the liquid crystal display from the second wind hole 12. In addition, there may be a plurality of the first fans 4, and a plurality of the second fans 6, which may be selected according to actual needs.
In some embodiments, in order to satisfy the appropriate resource allocation, a temperature sensor (not shown) for detecting the temperature of the heating element 2 or the heat dissipation plate 3 is disposed in the rear case 1. When the heating temperature of the heating element 2 is below the preset temperature, only the heat dissipation function in the first state can be adopted, that is, only the first fan 4 and the first semiconductor thermoelectric element 5 work to meet the heat dissipation requirement, and in the process, the power storage box is continuously charged; if the heating temperature of the heating element 2 reaches the preset temperature, the heat dissipation function in the second state is adopted, that is, the second fan 6 and the second semiconductor thermoelectric element 7 also work, and low-temperature air is introduced to the vicinity of the heat dissipation plate 3 to improve the heat dissipation efficiency; in the heat dissipation function in the second state, since low-temperature air is introduced, the temperature of the air in the first air passage a is not high in the first state, and the charging efficiency of the power storage box at this time is reduced, even the charging is stopped; the second semiconductor thermoelectric element 7 may be supplied with power from the power storage case or from another power source. Therefore, the second fan 6 and the second semiconductor thermoelectric element 7 do not need to work continuously, and energy is saved.
In some specific embodiments, the material of the heat dissipation plate 3 is graphene carbon plastic alloy. Therefore, the heat dissipation plate 3 is made of the graphene carbon-plastic alloy, the heat conductivity of the graphene carbon-plastic alloy is far higher than that of the traditional heat conduction plastic, the heat radiation rate is far higher than that of the aluminum alloy, a heat source can be quickly led out and radiated to an external medium, the weight is light, the specific weight of the carbon-plastic alloy is smaller than that of aluminum by more than 40%, the manufacturing cost is low, and the heat dissipation effect is obvious; it should be noted that the graphene carbon-plastic alloy is an existing material, and reference may be made to a controllable preparation method based on a high-stacking-degree graphene modified high-thermal-conductivity carbon-plastic alloy disclosed in publication No. CN 108976700A.
In addition, referring to fig. 7, in the lcd, the led substrate is used in cooperation with a reflector 8, and the back surface of the reflector can provide a certain auxiliary function for guiding the wind in the second wind path B to the vicinity of the heat sink 3.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (7)
1. A heat dissipating double-fuselage for LCD, this heat dissipating double-fuselage sets up between heating element and rear shell in the LCD, characterized by that, include being equipped with the linear heat-dissipating plate, first fan and first semiconductor thermoelectricity body between heating element and rear shell sequentially, the said first semiconductor thermoelectricity body includes the support and semiconductor thermoelectric plate spaced on support, the said semiconductor thermoelectric plate is the semiconductor thermoelectric material; a first air path is formed on the arrangement path of the heat dissipation plate, the first fan and the first semiconductor thermoelectric element, and a first air hole is formed in the rear shell and used for exhausting air of the first air path; the first air path extends from the heat dissipation plate to the first air hole; and an electric storage box electrically connected with the first semiconductor thermoelectric body is arranged in the rear shell.
2. The heat dissipating device of claim 1, wherein the heat dissipating plate comprises a plate body and a plurality of heat dissipating fins formed on one side of the plate body, and the heat dissipating fins have a ventilation channel formed therebetween.
3. The heat dissipation device of claim 2, wherein a second air path is formed in the rear housing, and an included angle is formed between a path of the second air path and a path of the first air path; a second fan and a second semiconductor thermoelectric body are arranged on the path of the second air path, and the second semiconductor thermoelectric body also comprises a support and a semiconductor thermoelectric plate spaced on the support; the second semiconductor thermoelectric body is electrically connected with the storage box; the rear shell is provided with a second air hole for the second air path to enter air; the second air passage extends from the second air hole to the heat dissipation plate, and is connected to the first air passage.
4. The heat dissipating device of claim 3, wherein two second air paths are disposed at two ends of the ventilation channel.
5. The heat dissipating device of claim 3, wherein the first fan is plural and the second fan is plural.
6. The heat dissipating device of claim 3, wherein a temperature sensor is disposed in the rear housing for detecting the temperature of the heat generating element or the heat dissipating plate.
7. The heat dissipation device of claim 1, wherein the heat dissipation plate is made of graphene carbon-plastic alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011207066.XA CN112270898A (en) | 2020-11-03 | 2020-11-03 | Heat dissipation device for liquid crystal display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011207066.XA CN112270898A (en) | 2020-11-03 | 2020-11-03 | Heat dissipation device for liquid crystal display |
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| Publication Number | Publication Date |
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| CN112270898A true CN112270898A (en) | 2021-01-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011207066.XA Pending CN112270898A (en) | 2020-11-03 | 2020-11-03 | Heat dissipation device for liquid crystal display |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113436544A (en) * | 2021-05-26 | 2021-09-24 | 绍兴汇恒建设管理有限公司 | LED display screen module and preparation method thereof |
| CN117075390A (en) * | 2023-09-27 | 2023-11-17 | 惠科股份有限公司 | Backlight module and display device |
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| CN101131503A (en) * | 2006-08-23 | 2008-02-27 | 中华映管股份有限公司 | Backlight module |
| CN102588841A (en) * | 2012-02-21 | 2012-07-18 | 南京汇兴博业数字设备有限公司 | Direct type liquid crystal backlight module with adaptive-temperature and high-brightness LEDs (light-emitting diode) |
| CN202546687U (en) * | 2012-05-09 | 2012-11-21 | 京东方科技集团股份有限公司 | Heat dissipation device of LED (light emitting diode) light bar, backlight module and display device |
| CN110389474A (en) * | 2018-04-23 | 2019-10-29 | 夏普株式会社 | Liquid crystal display device |
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2020
- 2020-11-03 CN CN202011207066.XA patent/CN112270898A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1760734A (en) * | 2004-10-15 | 2006-04-19 | Lg电子株式会社 | Light emitting device package and back light unit for liquid crystal display using the same |
| CN101131503A (en) * | 2006-08-23 | 2008-02-27 | 中华映管股份有限公司 | Backlight module |
| CN102588841A (en) * | 2012-02-21 | 2012-07-18 | 南京汇兴博业数字设备有限公司 | Direct type liquid crystal backlight module with adaptive-temperature and high-brightness LEDs (light-emitting diode) |
| CN202546687U (en) * | 2012-05-09 | 2012-11-21 | 京东方科技集团股份有限公司 | Heat dissipation device of LED (light emitting diode) light bar, backlight module and display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117075390A (en) * | 2023-09-27 | 2023-11-17 | 惠科股份有限公司 | Backlight module and display device |
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Application publication date: 20210126 |