KR20110050039A - Press apparatus - Google Patents

Press apparatus Download PDF

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Publication number
KR20110050039A
KR20110050039A KR1020090106861A KR20090106861A KR20110050039A KR 20110050039 A KR20110050039 A KR 20110050039A KR 1020090106861 A KR1020090106861 A KR 1020090106861A KR 20090106861 A KR20090106861 A KR 20090106861A KR 20110050039 A KR20110050039 A KR 20110050039A
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South Korea
Prior art keywords
pressing
partition wall
support
substrate
crimping
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KR1020090106861A
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Korean (ko)
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KR101135095B1 (en
Inventor
오봉필
엄승용
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삼성전기주식회사
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Priority to KR1020090106861A priority Critical patent/KR101135095B1/en
Publication of KR20110050039A publication Critical patent/KR20110050039A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B1/00—Presses, using a press ram, characterised by the features of the drive therefor, pressure being transmitted directly, or through simple thrust or tension members only, to the press ram or platen
    • B30B1/32—Presses, using a press ram, characterised by the features of the drive therefor, pressure being transmitted directly, or through simple thrust or tension members only, to the press ram or platen by plungers under fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Press Drives And Press Lines (AREA)

Abstract

PURPOSE: A press apparatus is provided to improve the management efficiency thereof by simultaneously pressing different kinds of substrates having difference pressing conditions. CONSTITUTION: A press apparatus comprises a support barrier(115) and first and second pressing units(120,130). The support barrier supports substrates(10,20) on both sides thereof. The first pressing unit presses the substrate, placed on one side of the support barrier, toward the support barrier. The second pressing unit presses the substrate, placed on the other side of the support barrier, toward the support barrier.

Description

프레스 장치{Press apparatus}Press apparatus {Press apparatus}

본 발명은 프레스 장치에 관한 것이다.The present invention relates to a press apparatus.

기판에 동박층을 형성하는 방법으로, 반경화 상태의 절연층인 프리프레그(Prepreg) 및 동박을 기판에 차례로 적층하고 압착하는 방법이 일반적으로 알려져 있다. As a method of forming a copper foil layer in a board | substrate, the prepreg which is an insulating layer of a semi-hardened state, and the method of laminating | stacking and crimping copper foil on a board | substrate are known generally.

이러한 동박 압착을 위해서는 기판을 압착하는 프레스 장치가 필수적이다.In order to crimp copper foil, a press apparatus for crimping a substrate is essential.

종래 기술에 따른 프레스 장치는, 대량 생산을 위하여 동일한 종류의 기판을 동시에 여러 장을 압착할 수 있도록 제작되었다.The press apparatus according to the prior art is manufactured to compress several sheets of the same type of substrate simultaneously for mass production.

그런데, 다품종 소량생산 시에는 한번에 압착하는 동일한 종류의 기판 수가 적어지므로, 종래 기술에 따른 프레스 장치는 운용의 효율이 떨어지는 문제가 있다.By the way, since the number of substrates of the same type to be crimped at a time is reduced when producing small quantities of various kinds, the press apparatus according to the prior art has a problem in that the operation efficiency is inferior.

본 발명은 동시에 다른 종류의 기판을 압착할 수 있는 프레스 장치를 제공하는 것이다.The present invention provides a press apparatus capable of simultaneously pressing different kinds of substrates.

본 발명의 일 측면에 따르면, 기판을 압착시키는 프레스 장치로서, 압착되는 기판을 양면으로 지지하는 지지격벽, 상기 지지격벽의 일면에 배치된 기판을 상기 지지격벽 측으로 압착시키는 제1압착부, 상기 지지격벽의 타면에 배치된 기판을 상기 지지격벽 측으로 압착시키는 제2압착부를 포함하는 프레스 장치 제공된다.According to an aspect of the present invention, a press apparatus for crimping a substrate, comprising: a support partition wall supporting both sides of the substrate to be crimped, a first crimping unit for crimping a substrate disposed on one surface of the support partition wall toward the support partition wall; It is provided with a press apparatus including a second pressing portion for pressing the substrate disposed on the other surface of the partition wall toward the support partition wall.

상기 제1압착부 및 상기 제2압착부는 동시에 상기 지지격벽 측으로 기판을 압착할 수 있다.The first pressing part and the second pressing part may simultaneously press the substrate toward the support partition wall.

상기 제1압착부 및 상기 제2압착부 중 적어도 어느 하나는 유압 실린더 또는 공기압 실린더를 포함할 수 있다.At least one of the first and second compression parts may include a hydraulic cylinder or a pneumatic cylinder.

상기 지지격벽은 가로로 배치되어 있으며, 상기 제1압착부 및 상기 제2압착부는 상기 지지격벽을 상측 및 하측에서 동시에 가압할 수 있다.The support bulkheads are disposed horizontally, and the first and second compression parts may simultaneously press the support bulkheads from the upper side and the lower side.

본 발명에 따르면, 다른 압착조건을 가지는 이종의 기판을 동시에 가압할 수 있어서, 프레스 장치의 운용효율을 높일 수 있다.According to the present invention, it is possible to pressurize heterogeneous substrates having different crimping conditions at the same time, thereby increasing the operating efficiency of the press apparatus.

또한, 기판의 종류에 따른 최적을 압착력을 제공함으로써, 압착의 균일성을 확보할 수 있다.In addition, the uniformity of the pressing can be ensured by providing the optimum pressing force according to the type of the substrate.

이하에서 본 발명의 실시예를 첨부도면을 참조하여 상세하게 설명한다. Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 1은 본 발명의 일 실시예에 따른 프레스 장치를 나타낸 단면도이다.1 is a cross-sectional view showing a press device according to an embodiment of the present invention.

본 발명의 일 실시예에 따른 프레스 장치는 기판(10, 20)을 압착시키는 장치로서, 지지격벽(115), 제1압착부(120) 및 제2압착부(130)를 포함한다.The press apparatus according to an embodiment of the present invention is a device for compressing the substrates 10 and 20, and includes a support partition wall 115, a first crimping part 120, and a second crimping part 130.

지지격벽(115)은 압착 시에 기판(10, 20)을 지지하는 부분이다. 본 실시예의 지지격벽(115)은 이종의 기판(10, 20)을 동시에 지지하기 위하여, 각각이 기판(10, 20)을 지지할 수 있는 일면 및 타면을 구비한다. 또한, 지지격벽(115)은 기판(10, 20)의 압착이 이루어지는 공간을 형성하는 작업챔버(110)를 양분함으로써, 양분된 작업챔버(110)에서 각각의 압착조건으로 압착공정이 이루어지게 한다.The support partition wall 115 is a portion that supports the substrates 10 and 20 during compression. In order to simultaneously support the heterogeneous substrates 10 and 20, the support partition wall 115 of the present embodiment includes one surface and the other surface that can support the substrates 10 and 20, respectively. In addition, the support partition wall 115 bisects the working chamber 110 forming a space in which the substrates 10 and 20 are pressed, so that the pressing process is performed under the respective pressing conditions in the divided working chamber 110. .

제1압착부(120) 및 제2압착부(130)는 지지격벽(115)의 일면 및 타면에 배치된 기판(10, 20) 각각을 지지격벽(115) 측으로 각각 압착시키는 부분이다. 이에 따라, 제1압착부(120)의 압착력과 제2압착부(130)의 압착력을 다르게 설정할 수 있다. 따라서, 이종의 기판(10, 20)을 각각 지지격벽(115)의 일면 및 타면 측에 배치하고, 제1압착부(120) 및 제2압착부(130)에 의해 각각에 필요한 압착력으로 압착공정을 수행할 수 있다. 이에 따라, 기판의 종류에 따른 최적을 압착력을 제공함으로써, 압착의 균일성을 확보할 수 있다.The first crimping unit 120 and the second crimping unit 130 are portions that compress each of the substrates 10 and 20 disposed on one surface and the other surface of the support partition wall 115 to the support partition wall 115. Accordingly, the pressing force of the first pressing part 120 and the pressing force of the second pressing part 130 may be set differently. Therefore, the heterogeneous substrates 10 and 20 are disposed on one side and the other side of the support partition wall 115, respectively, and the pressing process is performed by the pressing force required for each of the first pressing part 120 and the second pressing part 130. Can be performed. As a result, by providing an optimum pressing force according to the type of substrate, uniformity of the pressing can be ensured.

이 때, 제1압착부(120) 및 제2압착부(130)의 압착은 동시에 이루어질 수도 있다. 즉, 다른 압착조건을 가지는 이종의 기판(10, 20)을 동시에 가압할 수 있어서, 프레스 장치의 운용효율을 높일 수 있다.At this time, the pressing of the first pressing part 120 and the second pressing part 130 may be simultaneously performed. That is, the heterogeneous substrates 10 and 20 having different crimping conditions can be simultaneously pressed, thereby increasing the operating efficiency of the press apparatus.

여기서, 제1압착부(120) 및 제2압착부(130) 중 적어도 어느 하나는 유압 실린더 또는 공기압 실린더를 포함할 수 있다. 유압 실린더 및 공기압 실린더는 유체의 압력을 이용하여 가압력을 조절하므로, 기판(10, 20) 압착에 필요한 압착력을 용이하게 조절할 수 있다.Here, at least one of the first compression unit 120 and the second compression unit 130 may include a hydraulic cylinder or a pneumatic cylinder. Since the hydraulic cylinder and the pneumatic cylinder adjust the pressing force by using the pressure of the fluid, the pressing force necessary for pressing the substrates 10 and 20 can be easily adjusted.

본 실시예에서는 지지격벽(115)을 가로로 배치한다. 이에 따라, 지지격벽(115)의 상측에서는 제1기판(10, 20)이 지지되어, 제1기판(10, 20)은 지지격벽(115)에 상측에 배치되어 하측으로 가압하는 제1압착부(120)에 의해 압착될 수 있다. 또한, 제2기판(10, 20)은 지지격벽(115)에 하측에 배치된 제2압착부(130)에 지지되어, 상측의 지지격벽(115)으로 가압하는 제2압착부(130)에 의해 압착될 수 있다. In this embodiment, the support partition wall 115 is disposed horizontally. Accordingly, the first pressing portion 10, 20 is supported on the upper side of the support partition wall 115, and the first substrates 10, 20 are disposed on the support barrier wall 115 and pressed upward. May be compressed by 120. In addition, the second substrates 10 and 20 are supported by the second crimping unit 130 disposed below the support partition wall 115 to press the second crimping unit 130 to press the upper support partition wall 115. Can be compressed.

상기에서는 본 발명의 실시예를 참조하여 설명하였지만, 해당 기술 분야에서 통상의 지식을 가진 자라면 하기의 특허 청구의 범위에 기재된 본 발명의 사상 및 영역으로부터 벗어나지 않는 범위 내에서 본 발명을 다양하게 수정 및 변경시킬 수 있음을 이해할 수 있을 것이다.Although the above has been described with reference to embodiments of the present invention, those skilled in the art may variously modify the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. And can be changed.

전술한 실시예 외의 많은 실시예들이 본 발명의 특허청구범위 내에 존재한다.Many embodiments other than the above-described embodiments are within the scope of the claims of the present invention.

도 1은 본 발명의 일 실시예에 따른 프레스 장치를 나타낸 단면도.1 is a cross-sectional view showing a press device according to an embodiment of the present invention.

<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>

10, 20: 기판10, 20: substrate

110: 작업챔버110: working chamber

115: 지지격벽115: support bulkhead

120: 제1압착부120: first pressing portion

130: 제2압착부130: second pressing portion

Claims (4)

기판을 압착시키는 프레스 장치로서,A press device for crimping a substrate, 압착되는 기판을 양면으로 지지하는 지지격벽;A support partition wall supporting both sides of the substrate to be compressed; 상기 지지격벽의 일면에 배치된 기판을 상기 지지격벽 측으로 압착시키는 제1압착부; 및A first crimping unit for crimping the substrate disposed on one surface of the support partition wall toward the support partition wall; And 상기 지지격벽의 타면에 배치된 기판을 상기 지지격벽 측으로 압착시키는 제2압착부를 포함하는 프레스 장치.And a second pressing part for pressing the substrate disposed on the other surface of the support partition wall toward the support partition wall side. 제1항에 있어서,The method of claim 1, 상기 제1압착부 및 상기 제2압착부는 동시에 상기 지지격벽 측으로 기판을 압착하는 것을 특징으로 하는 프레스 장치.And the first crimping portion and the second crimping portion simultaneously press the substrate onto the support partition wall. 제1항에 있어서,The method of claim 1, 상기 제1압착부 및 상기 제2압착부 중 적어도 어느 하나는 유압 실린더 또는 공기압 실린더를 포함하는 것을 특징으로 하는 프레스 장치.At least one of the first pressing portion and the second pressing portion comprises a hydraulic cylinder or a pneumatic cylinder. 제1항에 있어서,The method of claim 1, 상기 지지격벽은 가로로 배치되어 있으며, 상기 제1압착부 및 상기 제2압착부는 상기 지지격벽을 상측 및 하측에서 가압하는 것을 특징으로 하는 프레스 장치.The support bulkhead is disposed horizontally, and the first pressing portion and the second pressing portion is characterized in that the pressing device for pressing the support bulkhead from the upper side and the lower side.
KR1020090106861A 2009-11-06 2009-11-06 Press apparatus KR101135095B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018016824A1 (en) * 2016-07-18 2018-01-25 엘지전자 주식회사 Material molding device
CN108859210A (en) * 2018-07-13 2018-11-23 苏州普莱特环保新材料有限公司 A kind of linerless board finished product cold press of composite production line

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01139229A (en) * 1987-11-25 1989-05-31 Nec Corp Manufacture of multi layer printed wiring board
IT1271942B (en) * 1993-02-10 1997-06-10 Cedal Srl PROCEDURE FOR THE PRODUCTION OF PLASTIC LAMINATES WITH METAL LAMINS IN SPCIE FOR PRINTER CIRCUITS WITH DOUBLE BELT LAMINES.
JP2001114523A (en) 1999-10-19 2001-04-24 Matsushita Electric Ind Co Ltd Mold for forming optical element, method for producing mold for forming optical element and method for using mold for forming optical element
KR100878961B1 (en) * 2007-07-23 2009-01-19 삼성전기주식회사 Press apparatus for fabricating of printed circuit board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018016824A1 (en) * 2016-07-18 2018-01-25 엘지전자 주식회사 Material molding device
KR20180009070A (en) * 2016-07-18 2018-01-26 엘지전자 주식회사 Apparatus for fabricating materials
CN108859210A (en) * 2018-07-13 2018-11-23 苏州普莱特环保新材料有限公司 A kind of linerless board finished product cold press of composite production line
CN108859210B (en) * 2018-07-13 2024-04-16 苏州普莱特环保新材料有限公司 Lining plate-free finished product cold press for composite production line

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