KR20110048094A

KR20110048094A - Back-up board for drilling printed circuit board

Info

Publication number: KR20110048094A
Application number: KR1020090104760A
Authority: KR
Inventors: 정민식
Original assignee: 정민식
Priority date: 2009-11-02
Filing date: 2009-11-02
Publication date: 2011-05-11

Abstract

PURPOSE: A back-up board for drilling a PCB(printed circuit board), capable of increasing the position accuracy of a drill hole, is provided to improve productivity by increasing the number of stackable PCBs to be drilled at one time. CONSTITUTION: A back-up board for drilling a PCB(printed circuit board) comprises coating layers(120,130) and a bonding sheet layer. The coating layers are formed on one side or both sides of the back-up board. The coating layers contain water-soluble resin. The bonding sheet layer is covered on one side or both sides of the back-up board. The coating layers are formed on the bonding sheet layer.

Description

BACK-UP BOARD FOR DRILLING PRINTED CIRCUIT BOARD}

The present invention relates to a backup board used in a drilling process for forming a hole in a printed circuit board.

A printed circuit board (PCB) has circuits formed on the top, bottom, and the like, and via holes penetrate through the substrate to electrically connect these circuits.

Therefore, the manufacturing process of the PCB includes a drilling process for forming these via holes.

FIG. 1 schematically illustrates a drilling process of a PCB 1, in which a plurality of target PCBs 1 to be formed on a back-up board 10 are stacked, and an entry sheet on the top surface thereof. (entry sheet, 20) is laminated.

At this time, the position of the upper and lower boards 10 and 20 and the PCB 1 through the pin 40 is fixed.

Then, the holes H are formed in the plurality of PCBs 1 stacked using the drill 30.

Here, the entry sheet 20 plays a role of dissipating heat generated in the PCB 1 in the drilling process, and is usually made of aluminum foil.

The backup board 10 protects the work table 50 from the drill 30 during drilling of the PCB 1, and also protects the drill 30, and surrounds the hole H formed in the PCB 1. It is responsible for preventing the occurrence of burrs.

Typically, such a backup board 10 is made of resin or wood as a main material. For example, when the resin is used as a main material, the backup board 10 may be formed of thermoplastic resin or glass fiber on a sheet. It may include a base layer of the form impregnated in the thermosetting resin, a surface layer and a back layer formed on the upper and lower surfaces of the base layer by impregnating and drying the metallic processing material in the thermosetting resin.

However, according to the conventional drilling process as described above, the chip generated when forming the hole (H) of the PCB (1) due to insufficient heat dissipation of frictional heat generated by the high-speed rotating drill 30 Due to the phenomenon of being pressed by the frictional heat, a burr is generated in the hole H, such that the drilled surface is not smooth and machining precision is inferior. Furthermore, this problem has been aggravated due to the reason that the chip generated when forming the hole H is not smoothly discharged along the axial direction of the drill 30 that rotates.

In addition, the friction heat generation and heat dissipation problem is a factor that limits the number of PCB (1) that can be drilled at a time by stacking between the backup board 10 and the entry sheet 20, the overall productivity is improved. There was a problem with dropping.

On the other hand, according to the conventional drilling process, the lower end portion of the drill 30 penetrating the PCB 1 is not in contact with the guide on the backup board 10 in place, the upper surface of the backup board 10 There was a problem of slipping in, resulting in a drop in the positional accuracy of the hole H.

An object of the present invention is to provide a backup board for a printed circuit board drill processing to improve the overall productivity by increasing the positional accuracy of the hole formed during the drilling of the PCB, and also increase the number of stacked PCBs that can be drilled once There is.

In order to achieve the above object, the present invention, in the PCB back-up board (PCB) drill processing (Back-up Board), PCB drill backing board, characterized in that the coating layer containing a water-soluble resin is formed on one or both sides To provide.

Here, the coating layer may be formed by laminating two or more coating layers of the same to different components from each other.

And, further comprising a bonding sheet layer applied to one or both sides of the backup board for PCB drill processing, the coating layer may be formed on the bonding sheet layer.

In addition, one or more bonding sheet layers may be interposed between the laminated coating layers.

According to the backup board for PCB drill processing according to the present invention as described above, due to the lubrication action of the coating layer formed on the surface of the backup board drilled through the PCB is processed on the PCB as it is contacted and guided in place without slipping on the backup board It is possible to increase the positional accuracy of the holes.

In addition, as the coating layer lubricates the drill that rotates at high speed, the frictional heat generated by the drill may be smoothly dissipated, thereby improving processing accuracy of holes formed in the PCB.

In addition, through the smooth dissipation of frictional heat, it is possible to increase the productivity of the PCB drilling process as a whole by increasing the number of stacked PCB can be drilled once.

In addition, as the coating layer on the backup board rises on the bit surface of the rotating drill, chips generated in the inner surface of the hole formed by the drill may be more smoothly discharged to the outside through the bit surface on which the coating layer is formed. As a result, it can contribute to the improvement of the machining precision of the hole.

PCB drill processing backup board 100 according to the first embodiment of the present invention, as shown in Figure 2, the main backup board layer 110, and the upper and lower surfaces formed on both upper and lower sides of the main backup board layer 110 and Lower coating layers 120 and 130.

The main backup board layer 110 is the same part as a conventional conventional backup board, and as is widely known, is made of resin or wood as the main material, and when the resin is the main material, the glass fiber on the sheet It may include a base layer of the form impregnated with a thermoplastic resin or thermosetting resin, a surface layer and a back layer formed on the upper and lower surfaces of the base layer by impregnating and drying the metallic processing material in the thermosetting resin.

The upper and lower coating layers 120, 130 according to the first embodiment of the present invention is a layer composed of a mixture containing a water-soluble resin, the water-soluble resin is a material for performing a lubricating action and the heat of friction heat to the drill surface, That is, as a water-soluble lubricant, for example, polyethylene glycol, trimethylol propane, polypropylene glycol, polyoxyethylene monostearate, polyoxyethylene monosorate, polyoxyethylene monolaurate, polyoxyethylene stearyl ether, polyoxyethylene oleate It comprises at least one of one ether, polyoxyethylene lauryl ether, polyoxyethylene dodil ether, polyoxyethylene nonylphenyl ether, polyoxyethylene phenyl ether, polyoxyethylene sorbitan monoester, polyglycerol monostearate Can be.

The method of forming the coating layers 120 and 130 on the upper and lower surfaces of the main backup board layer 110 is not particularly limited as long as it is commercially available in a solvent type resin coating method. Such methods include comma coating, die coating, roll coating, Spray coating, curtain coating, flow coating and the like are applicable.

On the other hand, the coating layers 120 and 130 are formed on the upper and lower surfaces of the main backup board layer 110, the backup board for PCB drill processing according to the present invention is not limited to this, but one surface of the main backup board layer 110 Only such a coating layer may be provided.

3 is a partially enlarged cross-sectional view illustrating a PCB drill processing backup board 200 according to a second embodiment of the present invention, in which the coating layers 220 formed on one or both surfaces of the main backup board layer 110 have three details. The coating layers 221, 222, and 223 are formed in a multi-layered layer.

The three coating layers 221, 222, and 223 may be all made of the same component, or conversely, may be made of different components.

As described above, when the multilayer structure is provided, stability of the coating layer 220 can be ensured.

Meanwhile, in the present embodiment, the coating layer 220 is described as being divided into three layers, but the PCB drill board backup board according to the present invention is not limited to this embodiment, and the coating layers of the same to different components as described above are It should be understood that all laminates formed in two or more are included in the scope of the present invention.

4 is a partially enlarged cross-sectional view illustrating a PCB drill backing board 300 according to a third embodiment of the present invention, in which the coating layers 320 formed on one or both surfaces of the main backing board layer 110 are provided in detail. The coating layers 321 and 322 are laminated, and the coating layer 320 is formed on the main backup board layer 110 through the bonding sheet layer 140.

A bonding sheet constituting the bonding sheet layer 140 refers to an adhesive material generally used between the layers for bonding individual layers in a laminated PCB, and in this embodiment, the bonding sheet layer composed of such bonding sheets After coating 140 on the main backup board layer 110, coating layers 321 and 322 are sequentially formed thereon.

As such, when the bonding sheet layer 140 is first applied to form the coating layer 320, the stability of the coating layer 320 may be further secured.

FIG. 5 is a partially enlarged cross-sectional view illustrating a backup board 400 for a PCB drill process according to a fourth embodiment of the present invention. As shown in FIG. 5, a bonding sheet layer ( 241 and 242 may also be interposed between two or more, such as between the coating layer, the main backup board layer 110 and the first coating layer 421.

Of course, if necessary, the bonding sheet layer may be interposed between all layers of the main backup board layer and the coating layer.

Referring to the function and action of the PCB drill board backup board according to the present invention, including the illustrated embodiments are as follows.

6 and 7 are partial cross-sectional view showing a process of using the backup board 100 for PCB drill processing according to the first embodiment of the present invention described above.

As shown in FIG. 6, when the high-speed rotating drill 30 passes through the stacked PCBs 1 through the entry sheet 20 and enters the backup board 100 at the bottom, the upper coating layer 120 is formed. The lower end of the drill 30 is started to be applied to the surface, the coating layer 120 applied to the lower surface of the drill 30 rides the bit surface 31 with the rotation of the drill 30 Is raised and applied to the entire drill 30 surface.

Accordingly, due to the lubrication of the coating layer 120 to the drill 30, the drill 30 can be contacted and guided in place without slipping on the backup board 100, which is caused by the drill 30 The friction heat can be smoothly dissipated, and the chip generated in the inner surface of the hole (H) during the drilling process of the PCB 1 can be discharged to the outside more smoothly through the bit surface coated with the coating layer.

As shown in FIG. 6, the used backup board 100 may be reused as shown in FIG. 7 again by changing its upper and lower sides.

In FIG. 7, it can be seen that the above functions and functions of the backup board 100 to be reused are achieved by the lower coating layer 130.

6 and 7 illustrate only the use process of the PCB drill processing backup board 100 according to the first embodiment of the present invention, but the PCB drill processing backup board according to the second to fourth embodiments of the present invention is also described above. The same can be used.

On the other hand, since the description of the first to fourth embodiments and their functions and operations are merely illustrative for the purpose of understanding the present invention, the scope of the present invention should not be understood as being limited thereto.

The scope of the invention to the technical scope is defined by the claims and equivalents described below.

1 is a schematic diagram for explaining a PCB drilling process using a conventional backup board,

Figure 2 is a cross-sectional view showing a backup board for PCB drill processing according to a first embodiment of the present invention,

3 is a partially enlarged cross-sectional view showing a backup board for a PCB drill process according to a second embodiment of the present invention;

Figure 4 is a partially enlarged cross-sectional view showing a backup board for PCB drill processing according to a third embodiment of the present invention,

5 is a partially enlarged cross-sectional view showing a backup board for machining a PCB drill according to a fourth embodiment of the present invention;

6 and 7 are partially enlarged cross-sectional view showing a state of use of the backup board for PCB drill processing according to the present invention.

1: PCB 10: Backup Board

20: entry sheet 30: drill

31: Bit face 40: Pin

50: worktable 100, 200, 300, 400: backup board

110: main backup board layer 120: top coating layer

130: lower coating layer 140, 241, 242: bonding sheet layer

Claims

In the PCB back-up board (PCB) drill processing,

Back-up board for PCB drill processing, characterized in that the coating layer containing a water-soluble resin is formed on one or both sides.

The method of claim 1,

The coating layer is a PCB drill backing board, characterized in that the coating layer formed of two or more of the same to different components from each other.

The method according to claim 1 or 2,

And a bonding sheet layer applied to one or both surfaces of the backup board for PCB drill processing, wherein the coating layer is formed on the bonding sheet layer.

The method of claim 3,

The PCB drill board back-up board, characterized in that at least one bonding sheet layer is interposed between the coating layer is formed.

The method of claim 2,

The PCB drill board backup board, characterized in that at least one bonding sheet layer is interposed between the coating layer to be laminated.