KR20110043385A - Display apparatus to reduce emi emission - Google Patents

Abstract

PURPOSE: A display unit is provided to block an EMI which is emitted from a rear surface by directly linking a base chassis to a rear surface of a cover. CONSTITUTION: A plasma display panel(110) includes an upper plate panel, a driving electrode and a lower plate panel. A conductive sheet is connected to a back side of the lower plate panel. A driving circuit(150) drives the plasma display panel. In the base chassis(140), the conductive sheet is connected to a front side. In the base chassis, the driving circuit is mounted in a back side.

Description

DISPLAY APPARATUS TO REDUCE EMI EMISSION}

The present invention relates to a display device for reducing EMI radiation, and more particularly, to a display device for reducing the EMI radiated to the front portion and the EMI radiated to the rear portion through a separate configuration.

BACKGROUND OF THE INVENTION Flat display devices are widely used and widely used in portable devices, and according to the development of large-sized technology, large-scale display devices are rapidly replacing conventional CRT (Cathode-Ray-Tube) CRT displays.

Among these flat panel display devices, a plasma display panel (hereinafter referred to as a plasma display panel) is a type of flat display device in which characters or graphics are displayed by light emitted from plasma generated during gas discharge. Compared with the advantages of high luminance and luminous efficiency and wide viewing angle, it is widely commercialized today.

One of the drawbacks of the current plasma display panel is that a large amount of electromagnetic wave noise may be generated while driving the plasma display device, which may cause electromagnetic interference (EMI). That is, since the high voltage of about 200V and the RMS current of 2A or more are applied to each electrode constituting the plasma display panel, the energy of the driving wave to generate the discharge radiates EMI using the electrodes of the panel as antennas.

EMI creates radio noise interference that can interfere with the reception of the desired electromagnetic signal, which can cause malfunction of the electronic device, and it is absorbed by the living body in the form of electronic energy and raises the temperature rise of the living body. It will be damaged.

Accordingly, methods for reducing EMI generated when the plasma display panel is driven are sought.

The present invention has been made to solve the above problems, an object of the present invention is to provide a display device for reducing EMI radiation.

According to an aspect of the present invention, there is provided a display apparatus including a plasma display panel including an upper panel, driving electrodes, and a lower panel; A conductive sheet connected to a rear surface of the lower panel; A driving circuit for driving the plasma display panel; A base chassis to which the conductive sheet is connected to a front surface and the driving circuit is mounted to a rear surface; And a cover connected directly to the base chassis to shield the electromagnetic interference from the rear surface of the plasma display panel.

Here, the cover is not connected to the front surface of the display device, but directly connected to the base chassis at the rear of the display device to shield the EMI radiated from the back of the plasma display panel.

In addition, the EMI radiated from the front surface of the plasma display panel may be shielded based on at least one of the form of the conductive sheet, the form of the base chassis and the connection structure of the base chassis and the driving circuit.

In addition, the conductive sheet may be divided into a plurality of parts and connected to the rear surface of the lower panel through a plurality of conductive materials.

The plurality of conductive materials may be a plurality of conductive gaskets, and the base chassis may be connected to the plurality of conductive sheets, respectively, through at least one conductive gasket.

The plurality of conductive sheets may be a plurality of heat dissipation sheets used for heat dissipation of the plasma display panel, and may be divided in a direction horizontal or vertical to a direction in which the driving electrode is disposed. Can be connected to the back.

The driving circuit may be connected to the driving electrode, and the current generated by the driving circuit and transferred to the driving electrode may be returned to the driving circuit through the respective conductive sheets and the base chassis.

The plurality of conductive sheets may be divided in a form to shorten a path through which the current is returned, and may be connected to the rear surface of the lower panel, as compared with the case where the plurality of conductive sheets are integrated.

In addition, the plurality of conductive sheets may be divided in a form in which a capacitance formed between each conductive sheet and the driving electrode is reduced.

The active region in which the driving electrode is disposed to emit EMI may be included in a region where the lower panel is vertical, and the regions of the plurality of conductive sheets may be included in a region where the active region is vertical.

In addition, the conductive sheet may be E-Graf.

The base chassis may have at least one slit formed around a portion connected to the driving circuit.

In addition, the at least one slit is divided into the first region including the first chassis including a portion to which the driving circuit is connected and the second region not including a portion to which the driving circuit is connected. An electrical path is formed between the second region and the second region, and the current generated in the driving circuit may be transferred to the first region through a portion connected to the driving circuit.

In addition, a plurality of slits exist, and a part of currents transmitted to the first area is transferred from the first area to the second area through a path between the plurality of slits, and is transferred to the first area. The remaining portion of the current can circulate in the first region and cancel the EMI.

In addition, the base chassis may be mounted while conducting the driving circuit through at least one conductive connection element, and the driving circuit may be mounted through at least one non-conductive connection element.

In addition, some of the current generated in the driving circuit may be transferred to the base chassis through the at least one conductive connecting element, and some of the current generated in the driving circuit may circulate in the driving circuit and cancel the EMI. have.

The display apparatus may further include a conductive plate formed between the driving circuit and the base chassis and connected to the driving circuit. The base chassis may include the at least one The conductive plate may be connected to the conductive plate to be electrically conductive with the driving circuit, and may be connected to the conductive plate through the at least one non-conductive connecting element to mount the driving circuit.

The current generated by the driving circuit is transferred to the conductive plate, and a part of the current delivered to the conductive plate is transferred to the base chassis through the at least one conductive connecting element, and the current transferred to the conductive plate. The other part of the circuit can be circulated in the conductive plate to cancel the EMI.

The display apparatus may be a TV for receiving and outputting a broadcast, and the driving circuit may include a control circuit, and the control circuit may include a broadcast receiving unit for receiving a broadcast; And a broadcast processor for signal processing the received broadcast.

As a result, it is possible to effectively reduce the emission of EMI generated when the plasma display panel is driven.

Hereinafter, with reference to the drawings will be described the present invention in more detail. In particular, the structure and operation of the first half of the plasma display apparatus 100 and a method of reducing EMI emission from the rear part will be described with reference to FIGS. 1 to 4, and a front surface using a TSS shape is described with reference to FIGS. A method of reducing secondary EMI radiation will be described. 9 and 10, the front part EMI radiation reduction method using the structure of the base chassis will be described, and the front part EMI using the connection structure of the base chassis and the driving circuit will be described with reference to Figs. The radiation reduction method will be described.

<Structure and Operation of Display Device>

1 is a side cross-sectional view of a plasma display device 100 according to an embodiment of the present invention, Figure 2 is a partially exploded perspective view of the plasma display device 100. The plasma display apparatus 100 according to the present exemplary embodiment provides an image that a user can watch while satisfying an electromagnetic compatibility standard for conduction and radiation noise (EMI: ElectroMagnetic Interference). In particular, the plasma display apparatus 100 according to the present exemplary embodiment may not include an EMI glass filter for shielding EMI, and may shield EMI radiated to the front and EMI radiated to the rear surface based on the base chassis.

The plasma display apparatus 100 according to the present exemplary embodiment includes a panel 110, a thermal spread sheet (TSS) 120, a gasket 130, a base chassis 140, a driving circuit 150, and a cover 160. do.

The panel 110 generates an image by exciting the phosphor with vacuum ultraviolet rays caused by gas discharge therein. The panel 110 includes an upper panel 111 and a lower panel 113, and the upper panel 111 and the lower panel 113 are bonded to each other by a sealant 112 such as a frit. The panel 110 is configured. In the internal space between the upper panel 111 and the lower panel 113 whose edges are sealed by the sealing material 112, a plurality of discharge cells are formed, and Ne and Xe are mixed and filled in the respective discharge cells. do.

Meanwhile, electrodes connected to the driving circuit 150 are arranged in each of the discharge cells existing in the inner space between the upper panel 111 and the lower panel 113, and the driving circuit 150 is connected to the electrodes. By applying, the plasma display apparatus 100 is driven. A specific driving method of the plasma display apparatus 100 will be described later.

On the upper portion of the upper panel 111, a glass filter 114 is attached or coated for surface reflection prevention, color correction, and near infrared absorption. In particular, the upper portion of the upper panel 111, the glass filter 114 for EMI shielding is not provided separately. This is to shield EMI that is dusted to the front of the panel 110 in a separate manner rather than another glass filter 114. In addition, by shielding the EMI in a separate manner, the structure of the cover 160 is also simplified. Detailed description thereof will be described later.

 The glass filter 114 may be formed of one filter layer or may be formed of different filter layers for each function.

The reason why the filter layer is provided to prevent surface reflection is to prevent glare of viewers watching the image and to prevent scratches and static electricity on the surface, and the reason why the filter layer is provided for color correction and color purity is improved. In order to prevent the light having a wavelength of 580 nm to 590 nm from being provided to the user, the color reproduction range can be improved and the white deviation can be corrected.

In addition, the reason why the filter layer for absorbing near-infrared rays is provided is to prevent the light having a wavelength of 800 nm to 1200 nm from being provided to the user, thereby preventing malfunction of the plasma display apparatus 100 due to interference with the remote control wavelength band. To do so.

The TSS 120 is attached to the rear surface of the lower panel 113. The TSS 120 is used for heat dissipation of the plasma display apparatus 100.

In addition, the TSS 120 is connected to the base chassis 140 through the gasket 130 and used for the purpose of EMI shielding. That is, due to the voltage and current applied to the X electrode and the Y electrode, which will be described later, the energy of the driving wave to generate the discharge radiates EMI by using the electrodes of the panel 110 as an antenna, so that the TSS 120 is a gasket 130. It is connected to the base chassis 140 through), and serves to reduce the emission of EMI. In particular, the TSS 120 is configured in a divided form to reduce EMI radiation by shortening the return path of the current. A detailed method of shielding EMI will be described later.

Meanwhile, E-Graf may be used as the TSS 120.

In the above, it has been described as an example using the TSS 120 for the purpose of heat dissipation and EMI shielding, but only for illustrative purposes only, the case for separately configuring the sheet for heat radiation and EMI shielding purpose It will be considered to be within the technical scope of the invention. In addition, if the heat dissipation is not required or can be solved through other methods, it can be made of only the sheet for the purpose of EMI shielding.

The gasket 130 is made of an adhesive material to connect the TSS 120 and the base chassis 140 to each other. In particular, the gasket 130 transmits a current in the TSS 120 to the base chassis 140. Made of a conductive material such as metallic fabric. That is, the gasket 130 electrically connects the TSS 120 and the base chassis 140 so that the base chassis 140 is used as the ground, and through the connection between the TSS 120 and the base chassis 140, Form a return pass.

On the other hand, the gasket 130 may be composed of two, as shown in Figure 2, it may be composed of more. The gasket 120 is composed of a plurality of pieces because the TSS 120 is divided into a plurality of pieces. Specifically, the TSS 120 and the base chassis 140 are electrically connected to each other so that the TSS 120 and the base are electrically connected. This is to form a return path through the connection between the chassis 140.

The base chassis 140 mounts the driving circuit 150 and serves to ground the current generated by the driving circuit 150. In particular, the base chassis 140 is generated in the driving circuit 150 to ground the current transmitted through the electrodes, the panel capacitor, the TSS 120 and the gasket 130 connected to the driving circuit 150.

As shown in FIG. 2, the driving circuit 150 is composed of an X driving circuit, a Y driving circuit, an address driving circuit, a power supply circuit, and a control circuit. The X driving circuit, the Y driving circuit, and the address driving circuit transfer the X electrode driving signal, the Y electrode driving signal, and the address electrode driving signal to the X electrode, the Y electrode, and the address electrode, respectively, to drive the panel 110.

The cover 160 covers the rear surface of the base chassis 140 to perform a damage prevention task of the driving circuit 150. In addition, the cover 160 may perform an EMI shielding function for reducing EMI radiated to the rear surface of the plasma display apparatus 100. For this purpose, the cover 160 may be made of a conductive material.

As described above, the cover 160 is attached to the rear surface of the base chassis 140 to shield the EMI radiated to the rear surface of the base chassis 140, but the EMI radiated to the front surface of the base chassis 140 is covered by the cover 160. Not shielded However, EMI radiated to the front surface of the base chassis 140 is shielded in a separate manner by other components than the cover 160.

As such, separate methods, ① method using the division of the TSS 120, ② method using the gasket 130, ③ method using the structure of the base chassis 140 and ④ base chassis 140 and the drive circuit ( There are methods using the connection structure of 150). Details thereof will be described later.

Hereinafter, a driving method of the plasma display apparatus 100 will be described with reference to FIG. 3.

3 is a view for explaining a method of driving the plasma display apparatus 100.

The X driving circuit 210 is connected to the X electrode to drive the panel 110 by applying a driving voltage to the X electrode, and the Y driving circuit 220 is connected to the Y electrode to apply a driving voltage to the Y electrode, thereby providing a panel ( 110 will be driven. In particular, the X driving circuit 210 and the Y driving circuit 220 perform sustain discharge on the selected pixel by alternately inputting a sustain voltage to the X electrode and the Y electrode.

The address driving circuit 230 applies a data signal for selecting a pixel to be displayed to the address electrode. The X electrode, the Y electrode and the address electrode are formed to be orthogonal to each other, and the X electrode and the Y electrode are disposed to face each other with the discharge space therebetween. At this time, the discharge space at the intersection of the address electrode, the X electrode and the Y electrode forms a discharge cell.

Hereinafter, the configuration of the detailed panel 110 will be described with reference to FIGS. 4A to 4C. 4A to 4C are diagrams for describing a detailed configuration of the panel 110.

Referring to FIG. 4A, for manufacturing the upper panel 111, first, the upper glass 300 is provided, and an indium tin oxide (ITO) electrode 310 is patterned on the upper glass 300. The ITO electrode 310 is a kind of transparent electrode, and is used to prevent a problem that light generated between the X electrode and the Y electrode, which will be described later, is hidden by the opaque X electrode and the Y electrode.

After the ITO electrode 310 is patterned, the bus electrodes (X electrode and Y electrode) 320 are patterned on the ITO electrode 310. The X electrode and the Y electrode are electrodes for causing sustain discharge to be performed for a selected pixel by alternately inputting a sustain voltage.

After the bus electrode 320 is patterned, the black stripe 330 is patterned on the upper glass 300. The black stripe 330 is formed between each pixel and is used to maintain a separation state between each pixel.

After the black stripes 330 are patterned, the dielectric layer 340 and the MgO protective layer 350 are coated. The dielectric layer 340 and the MgO protective layer 350 are used to stably generate plasma by maintaining insulation between the address electrode and the bus electrode 320 described later, and to prevent the electrodes from being eroded into the plasma.

Meanwhile, referring to FIG. 4B, for manufacturing the lower panel 113, first, the lower glass 400 is provided, and the address electrode 410 is patterned on the upper glass 400. The address electrode 410 is used to transmit a data signal for selecting a pixel to be displayed.

After the address electrode 410 is patterned, the dielectric layer 420 is covered. As described above, the dielectric layer 420 maintains insulation between the address electrode 410 and the bus electrode 320 to stably generate the plasma, and is used to prevent the electrodes from being eroded into the plasma.

 The partition wall 430 is formed on the dielectric layer 420. The partition wall 430 serves to block the phosphors to be described later, so that the R pixel, the G pixel, and the B pixel are separated.

After the partition wall 430 is formed, the phosphor 440 is applied between the partition walls 430, and then a sealing material 112 such as a frit is inserted therein.

The lower panel 113 is manufactured by such a process.

When both the upper panel 111 and the lower panel 113 are manufactured, the panel (see FIG. 4C) undergoes a process such as assembly, sealing, gas injection, aging, and lighting inspection of the upper panel 111 and the lower panel 113. 110) is completed.

Referring to FIG. 3 again, the panel 110 manufactured through the above process has a structure in which a plurality of pixels are arranged in a matrix, and an X electrode, a Y electrode, and an address electrode are formed on each pixel. do. Accordingly, the panel 110 is driven by an ADS (Address Dispaly Separate) driving method in which a voltage is applied to each electrode to emit light of the pixel. The ADS driving method refers to a method in which each subfield of the panel 110 is divided into a reset period, an address period, and a sustain discharge period.

The reset period serves to erase the previous wall charge state and to set up the wall charge in order to stably perform the next address discharge. The address section is a section in which wall charges are accumulated on cells (addressed cells) turned on by selecting cells turned on and cells not turned on in the panel. The sustain discharge section is a section in which a sustain voltage is alternately applied to the X electrode and the Y electrode to perform a discharge for actually displaying an image on the addressed cell.

In this way, the panel 110 generates a discharge by using a difference between the voltage applied from the X electrode and the voltage applied from the Y electrode, and is driven by obtaining light emission through plasma generation by the discharge.

On the other hand, it has been mentioned above that the X electrode and the Y electrode are disposed to face each other with the discharge space interposed therebetween, and the discharge space at the intersection of the address electrode, the X electrode and the Y electrode forms a discharge cell.

<Reduction of front EMI emission using TSS type>

On the other hand, in the above, it has been mentioned that it is possible to shield the EMI radiated to the front portion of the base chassis 140, by using the ① partitioning method of the TSS 120 and ② using the gasket 130. Hereinafter, a method of shielding EMI radiated to the front part of the base chassis 140 using this method will be described.

On the other hand, the arrangement of the X electrode and the Y electrode is related to the divided form of the TSS 120. First, the arrangement of the X electrode and the Y electrode will be described with reference to FIG. 5.

5 is a diagram showing an arrangement of electrodes. In particular, FIG. 5 is a diagram showing only the electrodes with the upper panel 111 and the lower panel 113 removed. In FIG. 5, for convenience of description, the address driving circuit 230 and the address electrode are not illustrated, and the X driving circuit 210 and the Y driving circuit 220 connected to the electrodes and disposed on the rear surface of the base chassis 140 are illustrated. ) Is shown on both sides of the electrode.

As described above, the X driving circuit 210 and the Y driving circuit 220 alternately input a sustain voltage to the X electrode and the Y electrode, so that a current is transmitted to the X electrode and the Y electrode, whereby the selected pixel is Allow sustain discharge.

The X electrode is connected to the X driving circuit 210, and a current is applied from the X driving circuit 210 in the direction of the Y driving circuit 220. In addition, the Y electrode is connected to the Y driving circuit 220, the current is applied in the direction of the X driving circuit 210 in the Y driving circuit 220. Since a high voltage of about 200V and an RMS current of 2A or more are applied to the X electrode and the Y electrode, energy of a driving wave to generate a discharge radiates EMI using the electrodes of the panel as antennas.

In order to solve this problem, EMI radiated from the X electrode and the Y electrode is transmitted to the TSS 120 and grounded at the base chassis 140, and in order to more effectively solve the problem, it is divided into a plurality of parts. TSS 120 is used, and TSS 120 is connected to base chassis 140 through gasket 130.

In particular, the X electrode and the Y electrode are arranged in the horizontal direction in the illustrated example, that is, in the direction of the Y driving circuit 220 in the X driving circuit 210 or in the direction of the X driving circuit 210 in the Y driving circuit 220. Therefore, in order to shorten the return path of the current, the TSS 120 in the longitudinally divided form is used.

A detailed description thereof will be made with reference to FIG. 6.

6 is a view provided to explain the form of the TSS 120 and the connection structure between the TSS 120 and the base chassis 140. As shown, the TSS 120 is positioned between the display panel 110 and the base chassis 140.

In addition, the TSS 120 is divided into two parts divided into left and right sides at the rear of the lower panel 113, and is connected to each other. Each part of the TSS 120 is directly attached to the base chassis 140 and is not connected. Instead, each part of the TSS 120 is interconnected through one gasket 130.

When currents applied to the X and Y electrodes are transferred to the TSS 120, the TSS 120 forms capacitance using the lower panel 113 as a dielectric between the electrodes.

In addition, the current delivered to the TSS 120 is transferred back to the base chassis 140 through the gasket 130 connected to the TSS 120, and the current delivered to the base chassis 140 is connected to the base chassis 140. To the driving circuit 150, and as a result, current generated in the driving circuit 150 is returned to the driving circuit 150 through the electrode, the TSS 120, the gasket 130, and the base chassis 140. In addition, a capacitance is formed between the electrode and the TSS 120.

The reason for using the divided form of the TSS 120 is that when the current return path is large, the capacitance between the electrodes and the TSS 120 becomes large so that the EMI radiation is relatively large while the current is returned. This is because, when the path is small, the capacitance between the electrodes and the TSS 120 becomes small and the EMI radiation becomes relatively small.

In addition, the reason why the TSS 120 is connected to the base chassis 140 through the gasket 130 is to partially connect the TSS 120 and the base chassis 140 using a conductive material so that a return path of current is formed. To do this.

The return path of the current is as follows.

Current generated from the electrode and delivered to the left TSS 120-1 is returned to the driving circuit 150 through the gasket 130-1 and the base chassis 140 attached to the left TSS 120-1. The current generated in the TSS 120-2 is returned to the driving circuit 150 through the gasket 130-2 and the base chassis 140 attached to the right TSS 120-2.

Therefore, the return path is smaller than when implemented with one TSS 120. In addition, as described above, since the path through which the current is returned becomes smaller, the capacitance between the electrodes and the TSSs 120-1 and 120-2 becomes smaller and the EMI radiation becomes relatively smaller.

In this embodiment, the reason for dividing the TSS 120 into two parts divided into left and right is that since the X electrode and the Y electrode extend from left to right or from right to left, the return path of the current is from left to right or This is because it is preferable to divide the TSS 120 into two parts divided left and right in order to reduce the return path, which is formed from right to left.

However, it is merely an example for the convenience of description that the TSS 120 should be divided into two parts divided into left and right sides. The present invention can also be applied as it is divided into four parts. Of course, it can also be divided into further parts.

In addition, the TSS 120 may not be divided according to a predetermined partitioning method and shape, but may be divided into various methods and shapes according to the size, use environment, and the like of the plasma display apparatus 100. That is, even if the division type, the size of each part, the degree of separation, etc. of the TSS 120 is set in any way, it will be considered that the present invention is within the scope of application of the present invention to shorten the return path of the current.

Meanwhile, each part of the TSS 120 is not necessarily connected to the base chassis 140 through one gasket 130, and each part of the TSS 120 is connected to the base chassis through two or more gaskets 130. 140) may be connected. However, in order for current at the electrode to be transferred from the TSS 120 to the base chassis 140 so that a return path of current is formed, each portion of the TSS 120 may pass through the base chassis (at least one gasket 130). 140).

Of course, this is merely an example for convenience of description, and the TSS 120 and the base chassis 140 are not connected through the gasket 130, and the TSS 120 may be directly attached to the base chassis 140. Of course you can. However, even in this case, in order for the current at the electrode to be returned, each of the divided TSSs 120 should be connected to at least a portion of the base chassis 140.

On the other hand, when one gasket 130 is attached to each of the two divided TSS 120 as shown in the example, one gasket 130-1 is attached to the upper left of the left TSS (120-1) The other gasket 130-2 is attached to the lower right side of the right TSS 120-2.

The reason why the gasket 130 is attached to the TSS 120 in this manner is to shorten the return path of the current as much as possible. Of course, the gasket 130 may not be attached to the TSS 120 in this form, but may be attached in another form, and of course, the gasket 130 may be attached in the form of the least EMI radiation according to the experimental result. .

Meanwhile, this TSS 120 is attached in the active area of the panel 110. Referring to FIG. 7 for description of the active region. FIG. 7 is a diagram for describing an active region, and illustrates a state where the top panel 111 is removed and the rear surface of the panel 110 is viewed.

First, the active region 510 means a region in which electrodes are actually arranged. As shown, not all electrodes are disposed in regions perpendicular to the lower panel 113, and flexible printed circuits (FPCs) for connecting the driving circuit 150 and the electrodes are disposed at both edges. Therefore, the active region 510, which is the region where the electrode is actually disposed, is smaller than the size of the lower panel 113.

That is, the active region where the electrodes are disposed to emit the EMI is included in the region where the lower panel 113 is vertical, and the region of the TSS 120 is included in the region where the active region is vertical.

That is, as described above, since the EMI is radiated by the voltage and current applied to the X electrode and the Y electrode, the divided TSS 120 for EMI shielding is applied to all regions of the rear surface of the lower panel 113. It does not need to be attached, but rather is attached to an area 520 that is less than or equal to the active area 510.

Meanwhile, hereinafter, an effect of reducing EMI radiation by using the divided type TSS 120 will be described with reference to FIG. 8. 8 is a diagram comparing EMI radiation according to the shape of the TSS 120.

8 is a diagram showing the EMI radiation amount when the TSS 120 is not divided, and the diagram located at the bottom is a diagram showing the EMI radiation amount when the TSS 120 is divided left and right.

In particular, the reference line 810 represents the reference of the EMI radiation amount according to the international standard, waveform 1 820 represents the measured value of EMI for each frequency based on the horizontal frequency, waveform 2 (830) is vertical EMI is measured for each frequency based on frequency.

Therefore, the EMI radiation amount based on the horizontal frequency or the vertical frequency is low when the TSS 120 is divided when the TSS 120 is not divided. In particular, when comparing Peak / QP when the TSS 120 is divided with the TSS 120 is not divided, the case where the TSS 120 is divided is 5 dB to 10 dB than when the TSS 120 is not divided. It can be seen that the degree is low. Here, quasi-peak (QP) means a quasi-maximum value for EMI radiation.

As such, by using the divided structure TSS 120, it is possible to effectively reduce the emission of EMI generated when the plasma display panel is driven.

<Reduction of front side EMI radiation using base chassis structure>

Meanwhile, the plasma display apparatus 100 according to the present exemplary embodiment may shield EMI emitted to the front surface of the panel 110 in a manner of using a split structure and a gasket of the TSS 120, but the base chassis 140 may be shielded. Of course, you can also use EMI's own structure to shield EMI radiated to the front.

Hereinafter, a method using the structure of the base chassis 140 will be described with reference to FIGS. 9 and 10.

9 is a diagram illustrating the structure of the base chassis 140 according to an embodiment of the present invention.

As described above, the gasket 130 is attached to one side of the base chassis 140, while the driving circuit 150 is connected to the other side of the base chassis 140 through a screw 910 which is a conductive material.

The base chassis 140 mounts a driving circuit (X driving circuit, Y driving circuit, address driving circuit, power supply circuit, and control circuit) 150 and serves to ground the current generated by the driving circuit 150. .

To this end, as described above, the base chassis 140 and the driving circuit 150 are connected by a screw 910 which is a conductive material, and the base chassis 140 is also made of a conductive material.

Meanwhile, the base chassis 140 has a first slit 920 and a second slit 930 to shield EMI radiated to the front surface of the base chassis 140.

The first slit 920 is formed by processing a long groove around the portion of the base chassis 140 to which the X driving circuit is connected. In particular, the first slit 920 is composed of two separate slits instead of one slit, so that an electric passage through which current can flow between the two slits is provided.

Accordingly, the current generated in the X driving circuit is transferred to the base chassis 140 through a screw 910 connecting the X driving circuit and the base chassis 140 to be primarily grounded. In particular, the current is transmitted to the base chassis 140 located below the X driving circuit among the areas of the base chassis 140 separated by the first slit 920 and grounded through the screw 910.

In addition, the current transferred to the area of the base chassis 140 located below the X driving circuit and grounded through the passage formed between the two separated first slits 920 is provided by the Y driving circuit, the address driving circuit, and the power supply. The supply circuit and the control circuit are transferred to another area of the base chassis 140 in which the supply circuit and the control circuit are located and are secondarily grounded.

As such, the current formed in the X driving circuit is primarily grounded in the region of the base chassis 140 located below the X driving circuit, and is secondly grounded in the region of the base chassis 140 located outside the bottom of the X driving circuit. In addition, EMI radiation noise can be removed, and only one portion is connected to each other between the double grounds by the first slit 920, thereby more efficiently removing EMI radiation noise.

The role of the second slit 930 is also the same as that of the first slit 920. That is, the second slit 930 is formed by digging a long groove around a portion of the base chassis 140 to which the Y driving circuit is connected. In particular, the second slit 930 is composed of two separate slits. It is created to provide a passage through which current can flow.

Accordingly, the current generated in the Y driving circuit is transferred to the base chassis 140 through a screw 910 connecting the Y driving circuit and the base chassis 140 to be primarily grounded. In particular, the current is transmitted to the base chassis 140 located under the Y driving circuit among the areas of the base chassis 140 separated by the second slit 930 through the screw 910 and grounded.

In addition, the current transmitted to the base chassis 140 located below the Y driving circuit and grounded through the passage formed between the two separated second slits 930 may be formed by the X driving circuit, the address driving circuit, and the power supply. The supply circuit and the control circuit are transferred to another area of the base chassis 140 in which the supply circuit and the control circuit are located and are secondarily grounded.

As such, the current formed in the Y driving circuit is primarily grounded in the region of the base chassis 140 located below the Y driving circuit, and is secondarily grounded in the region of the base chassis 140 located outside the bottom of the Y driving circuit. In addition, the EMI radiation noise can be removed, and the second slit 930 allows only a part of the dual grounds to be connected to each other, thereby efficiently eliminating EMI radiation noise.

On the other hand, it has been described above that the slits are formed in the form of digging a long groove around the portion of the base chassis 140 where the X driving circuit and the Y driving circuit are connected. However, this is merely an example for convenience of description, and may be implemented such that a slit is generated only around one of the X driving circuit and the Y driving circuit, and other circuits such as an address driving circuit, a power supply circuit, and a control circuit may be used. Of course, the slit may be created around the connected portion.

In addition, in the above, it has been mentioned that the first slit 920 and the second slit 930 are each composed of two slits, and each of the two slits generates one electrical path. Since current flows through one electrical path and is grounded, this is called a one-point ground method. However, it is only an example for convenience of description that only one electrical path is generated.

Accordingly, of course, the first slit 920 or the second slit 930 may be composed of two or more slits. For example, when the first slit 920 is composed of three slits, two passages through which current can be transferred may be formed between the primary ground and the secondary ground.

In this case, two electrical paths are generated, but for this reason it would be appropriate to see that the single point grounding scheme was used in two places rather than the single point grounding scheme.

In addition, the shapes of the first slit 920 and the second slit 930 shown in FIG. 9 are merely exemplary, and the first slit 920 and the second slit 930 are shown in FIG. 10. Likewise, it may be formed to have a shape different from that of the slits shown in FIG. 9.

10 is a diagram illustrating the structure of a base chassis 140 according to another embodiment of the present invention. In FIG. 10, for convenience of description, the address driving circuit, the power supply circuit, and the control circuit are omitted.

As shown in FIG. 10, when two first slits 940 and two second slits 950 form a passage, current can be transferred between the primary ground and the secondary ground through the formed passage, and more efficiently. EMI can be eliminated.

<Reduction of front side EMI emission by using base chassis and driving circuit connection structure>

On the other hand, as described above, through the use of ① divided TSS 120 and ② gasket 130 and ③ base chassis 140 itself, it is possible to shield the EMI radiated to the front of the panel 110. By using the connection structure of the base chassis 140 and the driving circuit 150, EMI may be shielded to the front.

Hereinafter, a method using a connection structure between the base chassis 140 and the driving circuit 150 will be described with reference to FIGS. 11 to 14.

11 is a diagram illustrating a structure of a base chassis 140 according to another embodiment of the present invention. As shown, the X driving circuit is connected to the base chassis 140 through one screw 1110 instead of a plurality, and is connected to the base chassis 140 through four non-conductive connecting elements 1120. In addition, the Y driving circuit is connected to the base chassis 140 through a single screw 1110 rather than a plurality, and is connected to the base chassis 140 through four non-conductive connecting elements 1120.

In the drawing, a portion indicated by '○' is a portion in which a screw 1110 connecting the X driving circuit or Y driving circuit and the base chassis 140 is formed, and the portion indicated by '◎' is the X driving circuit or the Y driving circuit. The non-conductive connector 1120 connecting the base chassis 140 is formed.

Here, the non-conductive connecting element 1310 is irrelevant for the purpose of transferring the current generated from the X driving circuit or the Y driving circuit to the base chassis 140, and is simply the screw 1110 to drive the X driving circuit or the Y driving circuit. In the case of connecting the furnace and the base chassis 140, it is used for the purpose of compensating for the weak connection strength. Accordingly, the X driving circuit and the Y driving circuit are connected to the base chassis 140 through only the screw 1110 which is only one conductive medium, respectively.

As such, since the X driving circuit and the Y driving circuit are grounded to the base chassis 140 through the single point grounding method, current generated in the X driving circuit and the Y driving circuit is transferred to the base chassis 140 only through the single point. Grounded. Accordingly, some of the current generated in each of the X driving circuit and the Y driving circuit is transferred to the base chassis 140, and the other part is circulated in the X driving circuit and the Y driving circuit, thereby canceling the EMI.

Of course, the use of four non-conductive connecting elements 1120 in the above is merely an example for convenience of description, of course, may be used more than five or three or less. In addition, if there is no problem connecting the X driving circuit or the Y driving circuit and the base chassis 140 only with the screw 1110, the non-conductive connecting element 1120 may not be used at all.

In addition, in the above, it is assumed that only one screw 1110, which is a conductive connection element, exists. However, the present invention may be applied even when two or more screws 1110 exist as necessary. However, as the number of screws 1110 increases, the effect of EMI reduction may be reduced.

In FIG. 11, a method of grounding the X driving circuit and the Y driving circuit to the base chassis 140 with a single point ground has been described. In FIG. 11, a single point ground was used but no double ground was used. However, the present invention can be applied even when both single point ground and double ground are used. Hereinafter, a method of performing a single point grounding in a double ground method will be described.

Likewise, in the embodiments of FIGS. 12 to 14, the non-conductive connecting element 1310 may be used as many as necessary. However, for convenience of description, in the following description, illustration and reference to the non-conductive connecting element 1310 will be omitted.

12 is a diagram illustrating the structure of a base chassis 140 according to another embodiment of the present invention. As illustrated, the X driving circuit is connected to the conductive plate 1230 through a plurality of screws 1210, and the conductive plate 1230 is connected to the base chassis 140 through one screw 1220. In addition, the Y driving circuit is connected to the conductive plate 1240 through a plurality of screws 1210, and the conductive plate 1240 is connected to the base chassis 140 through one screw 1220.

In the drawing, a portion indicated by '○' is a portion in which a screw 1210 is formed to connect the X driving circuit or Y driving circuit and the conductive plates 1230 and 1240, and the portion indicated by '●' is the conductive plates 1230 and 1240. ) And a screw 1220 connecting the base chassis 140 is formed.

To help understand how the screws 1210 and 1220 are formed, reference will be made to FIG. 13.

FIG. 13 is a perspective view of the base chassis 140 of FIG. 12. As shown, since the X driving circuit is connected to the conductive plate 1230 through the plurality of screws 1210, the current generated in the X driving circuit is transferred to the conductive plate 1230 through the plurality of screws 1210. And is first grounded at the conductive plate 1230. In addition, since the current delivered to the conductive plate 1230 is connected to the base chassis 140 through one screw 1220, the current generated in the conductive plate 1230 is transferred to the base chassis through one screw 1220. Passed to 140 is secondary grounded in the base chassis 140.

Similarly, since the Y driving circuit is connected to the conductive plate 1240 through the plurality of screws 1210, the current generated in the Y driving circuit is transmitted to the conductive plate 1240 through the plurality of screws 1210, thereby conducting the conductive plate. Ground at 1240 is primarily grounded. In addition, since the current delivered to the conductive plate 1240 is connected to the base chassis 140 through one screw 1220, the current generated in the conductive plate 1240 is connected to the base chassis through one screw 1220. Passed to 140 is secondary grounded in the base chassis 140.

As such, since the X driving circuit and the Y driving circuit are grounded to the base chassis 140 through the single point grounding method, current generated in the X driving circuit and the Y driving circuit is transferred to the base chassis 140 only through the single point. And ultimately grounded, whereby the current delivered to the conductive plates 1230 and 1240 circulates in the conductive plates 1230 and 1240, thereby canceling the EMI.

In the above description, it is assumed that the conductive plate 1230 connected to the X driving circuit and the conductive plate 1240 connected to the Y driving circuit are separately provided. However, this is also an exemplary matter. In the case of providing the conductive plate 1250, the present invention may be applied.

14 is a diagram illustrating a structure of a base chassis 140 according to another embodiment of the present invention. As shown, the X driving circuit and the Y driving circuit are connected to one conductive plate 1250 through a plurality of screws 1210. That is, the X driving circuit and the Y driving circuit are formed together on one conductive plate 1250.

The conductive plate 1250 is connected to the base chassis 140 through one screw 1220.

As a result, the current generated from the X driving circuit or the Y driving circuit is transferred to one conductive plate 1250 together, and the current delivered to the conductive plate 1250 is grounded to the base chassis 140 through a single point grounding method. do. Therefore, the current generated in the X driving circuit and the Y driving circuit is transmitted to the base chassis 140 only through a single point and ultimately grounded, so that the current delivered to the conductive plate 1250 is primarily transferred to the conductive plate 1250. Circulating within will cancel EMI.

Of course, the number of screws 1210 and 1220 mentioned above may also be changed as necessary.

On the other hand, the structure of the base chassis 140 according to the embodiment of Figures 9, 10, 12, 13, X drive circuit and Y drive circuit is grounded to the base chassis 140 through a different single point, X drive circuit The ground potential level of the furnace and the ground potential level of the Y driving circuit may be different from each other.

In addition, when a difference occurs between ground potential levels, the plasma display apparatus 100 may malfunction due to an operation of a control circuit that transmits a control signal without considering different ground potential levels.

FIG. 15 illustrates a state in which an isolation IC is additionally provided in the base chassis 140 to solve the above problem. In FIG. 15, I-couplers 1510 and 1520 are used as examples of an isolation IC.

The I-couplers 1510 and 1520 are a type of digital isolation device and perform DC-DC conversion.

Therefore, when the I-coupler 1510 is connected between the X drive circuit and the control circuit, and the I-coupler 1520 is connected between the Y drive circuit and the control circuit, the ground potential of the X drive circuit and the Y drive circuit Even if the ground potentials are different, the plasma display apparatus 100 can operate without a malfunction.

That is, the I-couplers 1510 and 1520 convert the control signal generated in the control circuit into a control signal based on the ground potential of the X driving circuit, and the control signal generated in the control circuit converts the ground potential of the Y driving circuit. By converting to a control signal based on the above, the X driving circuit and the Y driving circuit are controlled by the control signal according to the ground potential level of the X driving circuit and the ground potential level of the Y driving circuit.

Of course, the method of correcting the difference between the ground potential levels by using the I-coupler 1510, 1520 has been described above, but the use of the I-coupler 1510, 1520 is an exemplary matter for the ground potential level correction. It is only. Therefore, the technical concept of the present invention is also corrected when the ground potential level is corrected by changing the shape of the base chassis 140 without using an element other than the I-couplers 1510 and 1520 or by using a separate element. This can be applied as it is.

Examples thereof include the following.

First, as shown in FIGS. 9 and 10, in the case of the base chassis 140 in which the slits are formed, the ground potential level may be corrected by adjusting the thickness of the slits or the interval between the slits. For example, when the distance between the slits shown in FIG. 9 is widened, a passage through which current flows from the region where the X driving circuit or the Y driving circuit is located among the base chassis 140 is widened.

Accordingly, the current generated in the X driving circuit or the Y driving circuit can flow more easily to the region where the X driving circuit or the Y driving circuit is not located among the base chassis 140, so that the X driving circuit in the base chassis 140 can be easily flown. The ground level between the region where the furnace or Y driving circuit is located and the other region is reduced.

Next, as shown in FIGS. 12 and 13, in the case of the base chassis 140 formed to perform single point grounding through one screw, the ground potential level may be corrected by adjusting the number of grounded screws. For example, in the case of increasing the number of screws ('●') connecting the conductive plates 1230 and 1240 and the base chassis 140 among the screws shown in FIG. 12, the base chassis in the conductive plates 1230 and 1240 is increased. There are many passages through which current flows to 140.

Accordingly, the current generated in the X driving circuit or the Y driving circuit can be more easily flowed to the base chassis 140 through the conductive plates 1230 and 1240, so that the conductive element in which the X driving circuit is located among the base chassis 140 is located. The ground level between the plate 1230 and the conductive plate 1240 in which the Y driving circuit is located is reduced.

As described above, the shape of the base chassis 140 may be changed to correct the ground potential level.

<Reduction of EMI emission on the back side using cover>

As described above, the upper side of the upper panel 111 may not include a separate configuration or material for shielding EMI, and a material for preventing surface reflection, a material for color correction and color purity, and near infrared absorption. It has been mentioned that only the coating material can be coated. However, irrespective of whether or not a separate structure or material for EMI shielding is provided on the upper side of the upper panel 111, ① a method using the division of the TSS 120, ② a method using the gasket 130, ③ a base chassis Through the method using the structure of 140 or the method using the connection structure of the ④ base chassis 140 and the driving circuit 150, it is possible to effectively shield the EMI radiated to the front of the panel 110.

Hereinafter, the structure of the cover 160 for reducing EMI radiated to the rear portion of the plasma display apparatus 100 will be described with reference to FIG. 1 again.

As described above, EMI radiated to the front portion of the plasma display apparatus 100 can be effectively reduced in the above manner.

Therefore, the cover 160 according to the present exemplary embodiment does not cover the rear surface of the plasma display apparatus 100 while being connected to the front surface of the panel 110, the rear surface of the panel 110, or the front surface of the base chassis 140. . Instead, the cover 160 is radiated to the rear surface of the base chassis 140 by covering the rear surface of the plasma display apparatus 100 while being directly connected to the rear surface of the base chassis 140 as shown in FIG. 1. It shields the EMI and performs the task of preventing the damage of the driving circuit 150. To this end, the cover 160 is made of a conductive material.

As described above, according to various embodiments of the present disclosure, even when a separate filter is not provided on the front surface of the plasma display apparatus 100, the plasma display panel may be driven using only the structure of other components of the plasma display apparatus. It is possible to effectively reduce the emission of EMI generated.

Meanwhile, the plasma display apparatus 100 described above may be a TV (Television) for receiving and outputting a broadcast. The above-described control circuit integrates components for receiving and outputting a broadcast on a single board. Can be implemented. This will be described with reference to FIG. 16.

16 is a block diagram of components provided in a control circuit according to an exemplary embodiment of the present invention.

As shown in FIG. 16, the control circuit includes a broadcast receiver 1610, a broadcast processor 1620, a broadcast output unit 1630, a user command receiver 1640, a controller 1650, and a graphical user interface (GUI) generator. 1660 and storage 1670 are provided.

The broadcast receiving unit 1610 tunes and demodulates any one of broadcasts received by wire or wirelessly.

The broadcast processor 1620 performs signal processing on the broadcast signal output from the broadcast receiver 1610. The broadcast processor 1620 performing the above function includes a broadcast separator 1641, an audio decoder 1623, an audio processor 1625, a video decoder 1627, and a video processor 1629.

The broadcast separator 1621 separates and outputs a broadcast signal output from the broadcast receiver 1610 into a video signal, an audio signal, and additional data.

The additional data separated from the broadcast signal is applied to the controller 1650 and used to provide additional information.

The audio decoding unit 1623 decodes the audio signal output from the broadcast separation unit 1621. Accordingly, the audio decoding unit 1623 outputs the decompressed audio signal.

The audio processor 1625 converts the decoded audio signal output from the audio decoder 1623 into an audio signal of a format that can be output through a speaker provided in the TV.

The video decoding unit 1627 decodes the video signal output from the broadcast separation unit 1621. Accordingly, the video decoding unit 1627 outputs the decompressed video signal.

The video processor 1629 converts the decoded video signal output from the video decoder 1627 into a video signal in an outputable format. To this end, the video processor 1629 performs color signal processing and scaling on the decoded video signal.

The GUI generator 1660 generates a GUI to be displayed on the display. The GUI generated by the GUI generator 1660 is applied to the video processor 1629 and added to the video to be displayed on the display, which is known as OSD (On Screen Display) processing.

The output unit 1630 outputs video and audio corresponding to the video signal and the audio signal output from the broadcast processor 1620 and provides the same to the user. The output unit 1630 that performs the above function includes an audio output unit 1163 and a video output unit 1635.

The audio output unit 1631 outputs an audio signal output from the audio processor 1625 through the speaker.

The video output unit 1635 outputs a video signal output from the video processor 1629 through the display.

The user command receiving unit 1640 transmits a user command received from the remote controller to the control unit 1650, and the control unit 1650 controls the overall operation of the TV according to the user command received from the user command receiving unit 1640, and digital broadcasting. The operations of the broadcast receiver 1610 and the broadcast processor 1620 are controlled to provide the program to the user.

The storage unit 1680 is a storage medium in which broadcast programs are stored, and may be implemented as a memory, a hard disk drive (HDD), or the like.

While the above has been shown and described with respect to preferred embodiments of the present invention, the present invention is not limited to the specific embodiments described above, it is usually in the technical field to which the invention belongs without departing from the spirit of the invention claimed in the claims. Various modifications can be made by those skilled in the art, and these modifications should not be individually understood from the technical spirit or the prospect of the present invention.

1 is a side cross-sectional view of a plasma display device according to an embodiment of the present invention;

2 is a partially exploded perspective view of the plasma display device;

3 is a view provided to explain a method of driving a plasma display device;

4A to 4C are diagrams for describing a detailed configuration of a panel;

5 is a view showing an arrangement of electrodes;

6 is a view provided to explain the shape of the TSS and the connection structure between the TSS and the base chassis;

7 is a view for explaining an active region;

8 is a view comparing EMI radiation according to the form of TSS;

9 illustrates the structure of a base chassis according to an embodiment of the present invention;

10 illustrates a structure of a base chassis according to another embodiment of the present invention;

11 is a view illustrating a structure of a base chassis according to another embodiment of the present invention;

12 is a diagram illustrating a structure of a base chassis according to another embodiment of the present invention;

FIG. 13 is a perspective view of the base chassis of FIG. 12;

14 is a view illustrating a structure of a base chassis according to another embodiment of the present invention;

15 is a view illustrating a state in which an isolation IC is additionally provided in a base chassis;

16 is a block diagram of components provided in a control circuit according to an exemplary embodiment of the present invention.

*** Description of the symbols for the main parts of the drawings ***

110: panel 120: TSS

130: gasket 140: base chassis

150: drive circuit 160: cover

Claims (19)

In the display device, A plasma display panel including an upper panel, driving electrodes, and a lower panel; A conductive sheet connected to a rear surface of the lower panel; A driving circuit for driving the plasma display panel; A base chassis to which the conductive sheet is connected to a front surface and the driving circuit is mounted to a rear surface; And And a cover connected directly to the base chassis to shield the electromagnetic interference emitted from the rear surface of the plasma display panel. The method of claim 1, The cover, And a display device connected directly to the base chassis at a rear surface of the display device, not connected to the front surface of the display device, to shield EMI emitted from the rear surface of the plasma display panel. The method of claim 1, EMI radiated from the front surface of the plasma display panel is shielded based on at least one of the form of the conductive sheet, the form of the base chassis and the connection structure of the base chassis and the driving circuit. The method of claim 3, wherein The conductive sheet is divided into a plurality of display devices, characterized in that connected to the back of the lower panel through a plurality of conductive materials. The method of claim 4, wherein The plurality of conductive materials are a plurality of conductive gaskets, The base chassis, A display device, characterized in that connected to the plurality of conductive sheets, respectively through at least one conductive gasket. The method of claim 4, wherein The plurality of conductive sheets, A plurality of heat dissipation sheets used for heat dissipation of the plasma display panel, divided into a horizontal direction or a vertical direction and the direction in which the driving electrode is disposed, the display is connected to the rear panel of the lower panel Device. The method of claim 4, wherein The driving circuit is connected to the driving electrode, The current generated in the driving circuit and delivered to the driving electrode is And returning to the driving circuit through each of the conductive sheets and the base chassis. The method of claim 7, wherein The plurality of conductive sheets, Compared to the case where the plurality of conductive sheets are integrated, the display device is divided into a form for shortening a path through which the current is returned and connected to the rear surface of the lower panel. According to claim 4, The plurality of conductive sheets, And a capacitance formed between each conductive sheet and the driving electrode is divided in such a manner as to reduce capacitance. According to claim 4, An active region in which the driving electrode is disposed to emit EMI is included in an area in which the lower panel is vertical. And a region of the plurality of conductive sheets is included in a region in which the active region is vertical. The method of claim 1, The said conductive sheet is E-Graf, The display apparatus characterized by the above-mentioned. The method of claim 3, wherein And the base chassis has at least one slit formed around a portion connected to the driving circuit. The method of claim 12, The at least one slit is, The base chassis is divided into a first region including a portion to which the driving circuit is connected and a second region not including a portion to which the driving circuit is connected, and an electrical path between the first region and the second region. Is formed to produce, The current generated by the drive circuit is, And a display device which is transferred to the first area through a portion connected to the driving circuit. The method of claim 13, There are a plurality of slits, Some of the current delivered to the first region is transferred from the first region to the second region through a path between the plurality of slits, and some of the current delivered to the first region is transferred from the first region. Display device characterized in that circulating to cancel the EMI. The method of claim 3, wherein The base chassis, And mounting the driving circuit through at least one conductive connection element while conducting the driving circuit, and mounting the driving circuit through at least one non-conductive connection element. The method of claim 15, Some of the current generated in the driving circuit is transferred to the base chassis through the at least one conductive connecting element, and the other part of the current generated in the driving circuit circulates in the driving circuit and cancels EMI. Display device. The method of claim 15, A conductive plate formed between the driving circuit and the base chassis and connected to the driving circuit; The base chassis is connected to the conductive plate via the at least one conductive connecting element and is electrically connected to the driving circuit, and is connected to the conductive plate through the at least one non-conductive connecting element to mount the driving circuit. Display device characterized in that. The method of claim 17, Current generated in the driving circuit is transferred to the conductive plate, Some of the current delivered to the conductive plate is transferred to the base chassis through the at least one conductive connecting element, and the remaining portion of the current delivered to the conductive plate circulates in the conductive plate to cancel EMI. Display device. The method of claim 1, The display device is a TV that receives and outputs a broadcast, The driving circuit includes a control circuit, The control circuit, A broadcast receiver for receiving a broadcast; And And a broadcast processor for signal processing the received broadcast.

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