KR20110033588A - Evaporator for loop heat pipe system - Google Patents

Abstract

PURPOSE: An evaporator for a loop heat pipe system is provided to prevent bubble from occurring since working fluid is heated in a chamber. CONSTITUTION: An evaporator for a loop heat pipe system comprises a body(200), a first chamber and a porous capillary structure. The body comprises a sintering-wick holding part, a discharge hole and an intake hole. If working fluid, which is filled between the air gaps of a sintering wick, is heated, it is changed to gas and is discharged through the discharge hole. The working fluid is changed to liquid and flows into the intake hole. The first chamber is coupled to the intake hole and comprises an intake port, into the working fluid flows, and a space, in which the working fluid is held. The porous capillary structure is inserted into the space. The working fluid, which has flowed into the inlet port, flows into the body through the capillary structure.

Description

Evaporator for loop heat pipe system

The present invention relates to an evaporator which forms a loop heat pipe system together with a condenser, a gas conveying tube and a liquid conveying tube, in particular, when the vaporized working fluid is liquefied through the condenser and introduced into the first chamber and received therein, The present invention relates to an evaporator for a loop heat pipe system having an improved structure so that bubbles are not generated in the working fluid.

Electronic components such as CPUs and semiconductor chips used in various electronic devices such as computers generate a lot of heat during operation. Since such electronic products are usually designed to function properly at room temperature, if the heat generated during operation is not effectively cooled, their performance may be remarkably degraded and, in some cases, even damage to the product.

Various technologies such as heat conduction method using heat sink, natural convection and radiation method of air, steel convection method using fan, liquid circulation method or submersible cooling method have been developed as a cooling method for cooling the heat of electronic components. It is used.

However, as the electronic products become thinner and thinner, the interval between installation of the electronic components that generate heat during operation continues to narrow, so that the heat generated when using the electronic products is not properly cooled. In addition, since the heat load of the electronic components continues to increase due to the high integration and high performance of the electronic components, the above-described conventional cooling method may not effectively cool the electronic components.

As a new technology to solve this problem, the introduction of a phase change heat transport system capable of cooling an electronic component having a high heat load density per unit has recently been expanded. Examples of such phase change heat transfer systems include thermal siphon (thermosyphon) and cylindrical heat pipes.

Thermal siphon is a method in which a cooling is performed in a natural circulation method in a gravitational field according to a vapor-liquid phase change of a working fluid and a difference in specific gravity, and a typical cylindrical heat pipe 100 is illustrated in FIG. 1. By using the capillary pumping force of the sinter wick installed on the inner wall of the pipe, the working fluid is circulated and cooled. When the heat is transferred from the heat source 101, the working fluid contained in the sintered wick 102 is vaporized and moved along the arrow 103 indicated by the steam flow, and then liquefied again while losing heat to the heat sink 104. The sintering wick 102 is circulated while moving along the arrow 105 indicating the liquid flow by capillary pumping force.

However, the thermosiphon has to have a higher condensation than the evaporator, and the heat pipe is less dependent on the gravitational field than the thermal siphon. Since the two systems have a limited positional relationship between the components, there is a disadvantage in that they act as a constraint on the structure of the electronic product employing the cooling system.

In addition, in the heat siphon and the cylindrical heat pipe, since the vapor and the liquid flow in opposite directions in the straight tube, the mixing of the vapor and the liquid occurs in the middle of the tube. There is also a big problem that this mixing makes a substantial amount of heat actually delivered rather than theoretically transferable.

The Loop Heat Pipe (LHP) system has been proposed as an ideal heat transfer system that can solve these problems, namely, space and location constraints, and the problem of mixing vapor and liquid.

Loop heat pipe system is a kind of CPL (Capillary Pumped Loop Heat Pipe) technology developed by NASA in USA to cool large amount of heat generated from satellite communication equipment or electronic equipment.

2 is a schematic conceptual view of a conventional loop heat pipe system 110, in which a conventional loop heat pipe system 110 includes a condenser 112, an evaporator 114, and a vapor line 116 and a liquid line connecting them. 118 are connected to form a loop.

In addition, the evaporator 114 is provided with a chamber portion 1144 for receiving and buffering the liquefied working fluid before the working fluid penetrates into the sintered wick 1142 inserted into the evaporator 114. In the case of the loop heat pipe system 110, unlike the conventional straight heat pipe (see FIG. 1), the sinter wick 1142 is installed only in the evaporator 114.

The principle of the operation of the loop heat pipe system 110 of this configuration is as follows.

First, when the contact surface 1148 of the evaporator 114 in contact with a heat source such as a heating element is heated, the working fluid that has permeated the sintered wick 1142 by the heat transferred from the contact surface 1148 is saturated. It is heated up to the temperature and is changed into gas. At this time, the generated gas is moved to the condenser 112 along the steam line 116 connected to one side of the evaporator 114. Subsequently, when the gas liquefies by releasing heat to the outside while passing through the condenser 112, the liquefied working fluid is moved back to the evaporator 114 along the liquid line 118 on one side of the condenser 112, The process is repeated and the heat source is cooled. As shown in FIG. 3, the sintered wick 1142 is coupled to the inner circumferential surface of the evaporator 114, and a space formed by the inner circumferential surface of the sintered wick 1142 is changed into a gas into a vapor line 116. It forms a moving steam passage.

On the other hand, the working fluid liquefied while passing through the condenser 112 is returned to the evaporator 114, where it is accommodated in the chamber portion 1144 before being absorbed by the sinter wick 1142. The liquefied working fluid ensures sufficient time to be absorbed by the capillary pressure of the sintered wick 1142 through the through hole 1146 of the chamber portion 1144. In addition, the chamber portion 1144 serves to prevent backflow of the liquefied working fluid flowing along the liquid line 118 to the evaporator 114 along the liquid line 118.

However, the conventional evaporator 114 for the loop heat pipe system by such a configuration causes a problem that the loop heat pipe system becomes unstable due to the working fluid contained in the chamber portion 1144.

Specifically, it is preferable that all of the heat of the heating element is transferred in the form of vaporization energy for the gas-liquid phase change of the working fluid, but some sensible heat is transferred through the outer wall of the evaporator 114 and the sintered wick 1142. It is delivered to generate bubbles in the working fluid contained in the chamber portion 1144. These bubbles form a bubble layer around the liquid line 118 connected to the chamber portion 1144, and the bubble layer acts as a boundary membrane, thereby preventing a smooth flow of the working fluid into the chamber portion 1144. . Thus, the working fluid does not smoothly penetrate into the sinter wick 1142 in the evaporator 114, so that the sinter wick 1142 is dried and the LHP is no longer operated.

In addition, the working fluid of the chamber portion 1144 is vaporized to cause a reverse circulation along the liquid line 118, or bubbles generated in the working fluid flow back along the liquid line 118 so that the inner circumferential surface of the liquid line 118 In this case, the temperature of each part of the system shows oscillation pattern, which may lead to system instability.

In addition, if other portions other than the through-holes 1146 formed in the chamber portion 1144 are not completely sealed, the working fluid contained in the chamber portion 1144 may be excessively introduced into the space into which the sintering wick 1142 is inserted. . That is, when a working fluid more than absorbed by the capillary pressure of the sintered wick 1142 flows into the space, the heat source causes the Bubbles may be formed, and the bubbles may prevent the working fluid contained in the sintered wick 1142 from vaporizing. This problem, in turn, raises the overall temperature of the loop bottom pipe system, making the system unstable and causing the problem of lowering the cooling efficiency by the loop bottom pipe system.

The present invention is to solve the above problems, by inserting a porous capillary structure in the chamber portion so that the liquid working fluid introduced through the liquid line primarily through the capillary structure, and then penetrates into the sintered wick, It is an object of the present invention to provide an evaporator for a loop bottom pipe system which prevents bubble formation in a chamber part and improves cooling efficiency.

Evaporator for a loop heat pipe system (LHP; Loop Heat Pipe) according to the present invention for achieving the above object, the sintered wick accommodating portion accommodates the sintered wick sintered metal powder, An evaporator body having a discharge hole discharged by phase change into a gas upon heating and a working fluid filled between the pores, and an inlet hole into which the working fluid phase changes into a liquid phase; A first chamber part coupled to the inlet hole and having an inlet through which the working fluid of the liquid flows and an accommodation space accommodating the working fluid of the liquid phase; And a porous capillary structure inserted into the receiving space portion, wherein the liquid working fluid introduced through the inlet is introduced into the evaporator body through the capillary structure.

In addition, at least a part of the capillary structure is preferably in contact with the sintered wick.

In addition, the capillary structure is preferably filled in the entire area of the receiving space.

In addition, the capillary pressure of the sintered wick is preferably greater than the capillary pressure of the capillary structure.

In addition, the transmittance of the sintered wick is preferably smaller than the transmittance of the capillary structure.

In addition, it is preferable to include a second chamber portion coupled to the discharge hole, the outlet having a phase change working fluid is discharged to the gas, and a gas accommodating portion accommodated in the gas phase change working fluid.

In addition, the sintered wick has a space therein, one side is made of a rectangular parallelepiped, the outer circumferential surface of the sintered wick is coupled to the inner circumferential surface of the sintered wick accommodation portion, the open one surface is preferably in communication with the discharge hole Do.

In addition, the sintered wick is made of a rectangular parallelepiped, and the inside of the sintered wick is in communication with the discharge hole so that the phase-changed working fluid flows, it is preferable that a plurality of vapor passages having a circular cross section is formed.

In addition, it is preferable that the plate-shaped first sub-sintered wicks connecting the upper and lower surfaces of the sintered wick are spaced apart from each other at regular intervals.

In addition, the upper and lower surfaces of the sintered wick, it is preferable that the protrusions projecting from the upper and lower surfaces are formed spaced apart from each other at a predetermined interval.

In addition, the plate-shaped first sub-sintered wick connecting the upper surface and the lower surface of the sintered wick are spaced apart from each other at a predetermined interval, protruding from the lower surface, the second pinned sub-sintered wick spaced from the upper surface is the first Preferably, the sub sintered wicks are spaced apart from each other at regular intervals.

By inserting the capillary structure in the evaporator for the loop heat pipe system according to the present invention, the chamber portion, the liquid working fluid primarily passes through the capillary structure, and the capillary pressure of the capillary structure is smaller than the capillary pressure of the sintered wick, The liquid working fluid via the capillary structure penetrates into the sintered wick without staying in the chamber for a long time, thus providing an effect of preventing the working fluid from being heated and forming bubbles in the chamber.

The present invention relates to an evaporator 200 constituting a loop heat pipe system together with a condenser 20, a gas transfer tube 40, and a liquid transfer tube 30.

As shown in FIG. 4, the loop heat pipe system includes an evaporator 200, a condenser 20, a gas transfer tube 40, and a liquid transfer tube 30.

The condenser 20 is a place where the working fluid of the gaseous state received from the evaporator 200 is phase-changed into a liquid. The condenser 20 takes heat from the working fluid and sends it to the outside atmosphere.

The gas transfer pipe 40 is a pipe member connecting the evaporator 200 and the condenser 20 so that the gas changed in the evaporator 200 is transferred to the condenser 20, and the liquid transfer pipe 30 is a condenser. It is a pipe member connecting the condenser 20 and the evaporator 200 so that the liquid phase-changed at 20 can be supplied to the evaporator 200 again.

On the other hand, with respect to the general description and operation of the condenser 20, the gas transfer pipe 40 and the liquid transfer pipe 30, what is described above in the background art is applied as it is.

The evaporator 200, which is the object of the present invention, is one of the components forming the loop heat pipe system together with the condenser 20, the liquid transfer pipe 30, and the gas transfer pipe 40.

An evaporator for a loop heat pipe system according to an embodiment of the present invention will be described in detail with reference to FIGS. 5 to 9.

FIG. 5 is an exploded perspective view of the evaporator constituting the loop heat pipe system, and FIG. 6 is a sectional view taken along the line VI-VI of FIG. FIG. 7 is a sectional view taken along line VII-VII of FIG. 5. FIG. 8 and 9 are views for explaining capillary pressure and transmittance.

Referring to FIG. 5, an evaporator 200 for a loop heat pipe system according to an embodiment of the present invention includes an evaporator body 210, a first chamber part 220, and a capillary structure 230. do.

The evaporator body 210 is in contact with the heat generating part 1 receives the heat of the heat generating part (1). As shown in FIG. 3, the heating element 1 contacts one surface of the outer circumferential surface of the evaporator body 210.

The evaporator body 210, the working fluid filled between the sintered wick accommodating portion 212, which accommodates the sintered wick (214) sintered metal powder, and the air gap of the sintered wick 214 is a gas upon heating It is configured to include a discharge hole 218 is discharged by the phase change, and the inlet hole 216 is introduced into the working fluid is phase change into a liquid phase.

The sintered wick accommodating part 212 is a space in which the sintered wick 214 can be accommodated, and forms a rectangular parallelepiped space in this embodiment.

The discharge hole 218 is formed in the evaporator body 210 so that the working fluid filled between the pores of the sintered wick 214 is vaporized by the heat of the heat generating part 1 to be discharged through the gas transfer pipe 40. do. In this embodiment, one open surface of the sintered wick accommodating part 212 becomes the discharge hole 218.

The inlet hole 216 is formed in the evaporator main body 210 so that the working fluid in the gas phase changes into a liquid phase while passing through the condenser 20 and flows back into the evaporator main body 210 through the liquid transfer pipe 30. do. In this embodiment, the inlet hole 216 is formed on the upper surface of the evaporator body 210. Of course, the position of the inlet 216 may be changed in various ways. For example, the inlet hole 216 may be formed to face the outlet hole 218.

The sintered wick accommodating part 212 is inserted into the sintered wick 214 sintered metal powder. In the present embodiment, the sintered wick 214 has a space therein, and is formed in a rectangular parallelepiped having one surface open. The outer circumferential surface of the sintered wick 214 is coupled to the inner circumferential surface of the sintered wick accommodation part 212, and the open one surface is in communication with the discharge hole 218. The open one surface serves as a vapor passage 214a through which a working fluid changed into a gas flows.

Numerous voids are formed in the sintered wick 214, and a working fluid in a fluid state is permeated between the voids. Generally, fluids such as water, acetone, pentane, ammonia, refrigerant (R-134a), and the like are used as working fluids.

The first chamber part 220 is coupled to the inlet hole 216 side to receive the working fluid of the liquid moving to the evaporator body 210 through the liquid transfer pipe 30. The first chamber part 220 includes an inlet 222 and a receiving space 224.

The inlet 222 communicates with the inlet hole 216 of the evaporator body 210 and is a portion to which the liquid transfer pipe 30 is coupled. The accommodation space 224 is a space accommodated before the liquid working fluid flows into the evaporator body 210. As shown in FIG. 6, in the present embodiment, two inlets 222 are formed on an upper surface of the first chamber unit 220, and a receiving space 224 is formed below the inlets 222. do. The accommodation space 224 is open downward.

The capillary structure 230 is made of a porous material and is inserted into the receiving space 224. The working fluid of the liquid introduced through the inlet 222 is configured to flow into the evaporator body 210 via the capillary structure 230. In this embodiment, the capillary structure 230 is filled in the entire area of the receiving space 224, the lower surface of the capillary structure 230 and the sintered wick 214 inserted into the evaporator body 210 and I'm in contact.

The capillary pressure of the capillary structure 230 is smaller than that of the sintered wick 214, and the transmittance of the capillary structure 230 is greater than that of the sintered wick 214.

8 and 9, the relationship between capillary pressure and transmittance will be described in detail. FIG. 8 is an enlarged portion "A" of FIG. 6, and is a schematic cross-sectional view of the particles constituting the sintered wick 214, and FIG. 9 is an enlarged portion "B" of FIG. 6, and a capillary structure 230. It is a schematic sectional drawing of the particle which comprises.

The capillary pressure is given by the equation

는 작동유체의 표면장력, r은 입자들이 형성하는 공극의 유효 반지름을 말한다. P is the capillary pressure,

Is the surface tension of the working fluid, and r is the effective radius of the voids formed by the particles.

Since the surface tension of the working fluid is constant, the capillary pressure depends on the difference in the effective radius of the voids formed by the particles.

As shown in Figs. 8 and 9, the effective radius of the void formed by the particles 2 constituting the sintered wick 214 is r1, and the void formed by the particles 3 constituting the capillary structure 230 is formed. When the effective radius of r2 is r1 <r2, the capillary pressure of the sintered wick 214 is greater than that of the capillary structure 230. On the other hand, since r1 <r2, the working fluid is more permeable in the capillary structure 230 than the sintered wick 214. That is, the transmittance of the capillary structure 230 is greater than that of the sintered wick 214.

As such, the capillary pressure of the sintered wick 214 is greater than the capillary pressure of the capillary structure 230, and the transmittance of the capillary structure 230 is greater than the transmittance of the sintered wick 214. The working fluid flows into the sintered wick 214 via the capillary structure 230. If the capillary pressure of the sintered wick 214 is lower than the capillary pressure of the capillary structure 230, the working fluid of the liquid flowing into the first chamber part 220 is more likely to penetrate the capillary structure 230 and sinter. Since it does not move easily to the wick 214 side, the circulation of the working fluid is not smoothly made.

4 and 5, the evaporator for a loop heat pipe system according to the present embodiment includes a second chamber portion 240. As shown in FIG.

The second chamber part 240 is coupled to the discharge hole 218 side and includes an outlet 242 and a gas accommodating part 244. The outlet 242 is an outlet through which the working fluid changed into gas is discharged, and the gas transfer pipe 40 is coupled thereto. The gas accommodating part 244 is a part accommodating a gaseous working fluid moving through the vapor passage 214a of the sintered wick 214. The gas accommodating part 244 is provided to prevent a sudden pressure drop when the working fluid in the gas state moves to the gas transfer pipe 40. Since the sudden pressure drop can make the system unstable by rapidly increasing the speed of the working fluid in the gas state, the gas accommodating part 244 serves to prevent the sudden pressure drop in advance by receiving the working fluid in the gas state. do.

Hereinafter, the operation and effects of the evaporator 200 for the loop heat pipe system according to the above configuration will be described in detail.

One surface of the evaporator body 210 is in contact with the heat generating part 1, the heat generated from the heat generating part 1 is transmitted to the sintered wick 214 inserted into the evaporator body 210. The working fluid that has penetrated the sintered wick 214 is phase-changed into a gas state by the transferred heat.

The working fluid phase-changed in the gas state moves to the second chamber part 240 through the discharge hole 218, and is temporarily accommodated in the gas accommodating part 244 of the second chamber part 240, and then the gas transfer pipe 40. To move to the condenser 20.

The working fluid in the gaseous state in the condenser 20 is phase-changed into a liquid phase by depriving heat, and moves to the first chamber portion 220 along the liquid transfer pipe 30.

The capillary structure 230 inserted into the receiving space 224 of the first chamber portion 220 absorbs the working fluid in the liquid phase, and the working fluid in the liquid phase is in contact with the capillary structure 230 ( 214).

At this time, the lower side of the receiving space 224 is open, the lower surface of the capillary structure 230 inserted into the receiving space 224 is in contact with the outer peripheral surface of the sintered wick 214, the working fluid of the liquid After being absorbed into the structure 230, the capillary pressure of the sintered wick 214 penetrates into the pores of the sintered wick 214.

The liquid working fluid permeated between the pores of the sintered wick 214 is heated again by the heat of the heat generating parts 1 to be phase-changed into a gaseous state to cool the heat generating parts 1.

As such, the evaporator for a loop hipfight system according to an embodiment of the present invention has a transmittance higher than that of the sintered wick 214 in the first chamber portion 220, and a capillary pressure smaller than the capillary pressure of the sintered wick 214. The working fluid of the liquid entering the inlet 222 by inserting the capillary structure 230 is absorbed into the capillary structure 230 in a short time, the working fluid of the liquid absorbed in the capillary structure 230 is sintered wick 214 By the capillary pressure of the sintered wick 214 is permeated between the pores.

Therefore, the working fluid of the liquid absorbed in the capillary structure 230 of the first chamber part 220 is generated even when heat of the heat generating part 1 is transferred to the first chamber part 220 to generate bubbles. To prevent it. In addition, since the capillary structure 230 absorbs the liquid working fluid in a short time, bubble formation is suppressed by reducing the time for the working fluid to be heated by the heat of the heat generating part 1.

In addition, the heat energy of the heat generating part 1 is transmitted to the sintering wick 214 or the evaporator body 210 to prevent bubbles from being formed in the working fluid accommodated in the first chamber part 220 by the heat. Thus, bubbles are prevented from flowing back into the liquid transfer pipe 30, the inflow of the working fluid by the bubble layer formed in the first chamber portion 220, or drying of the sintered wick 214. Therefore, the loop heat pipe system is kept more stable than before.

In addition, to minimize the flow of the working fluid absorbed into the capillary structure 230 of the first chamber portion 220 between the sintering wick 214 and the coupling surface of the evaporator body 210, the sintering to the evaporator body 210 Bubbles may be suppressed from being directly formed on the wick 214 or the bonding surface of the sintered wick 214 and the evaporator body 210 through thermal bonding or metal bonding. Therefore, bubble formation is suppressed at the joining surface of the sinter wick 214 and the evaporator body 210, so that the working fluid is prevented from entering the first chamber portion 220 by the bubble layer, or sintered by forming the bubble layer. The wick 214 is prevented from drying out.

Accordingly, the heat of the heat generating part 1 is used intact as the vaporization energy of the working fluid permeated between the pores of the sintered wick 214, thereby effectively securing the vaporization energy and improving the cooling efficiency.

10 shows a cross section of an evaporator for a loop heat pipe system according to another embodiment of the present invention. In FIG. 10, the same reference numerals are assigned to components that perform the same functions as FIG. 6, and detailed description thereof will be omitted.

As shown in FIG. 10, the evaporator according to the present embodiment, unlike FIG. 6, the capillary structure 230 is filled in only a part of the receiving space 224. That is, at least a portion of the capillary structure 230 may be configured to be in contact with the sintered wick 214.

In this embodiment, the upper surface of the capillary structure 230 is in contact with the inlet 222 side, the edge portion is extended downward to be in contact with the sintered wick 214. In this embodiment, the capillary structure 230 directly absorbs the working fluid flowing from the inlet 222 at the upper surface, and delivers the working fluid of the liquid to the sintering wick 214 through the edge portion.

A liquid working fluid may be accommodated between the upper surface of the capillary structure 230 and the edge portion extending downward. Even if bubbles are generated in the working fluid of the liquid contained in the space formed by the sintered wick 214 and the capillary structure 230, the bubbles flow back through the inlet 222 because the upper surface is in contact with the inlet 222. Is prevented. In addition, since the upper surface is in contact with the inlet 222 side, bubbles do not interfere with the inflow of the working fluid.

Then, in order to prevent the working fluid flows between the sintering wick 214 and the coupling surface of the evaporator body 210 to generate bubbles, the sintered wick 214 is directly formed on the evaporator body 210, or a thermal bond or metal The sintered wick 214 and the evaporator body 210 may be coupled through the coupling.

Since the operation and effects of the present embodiment are similar to those of FIG. 6, detailed description thereof will be omitted.

11-14 illustrate the shape of a sintered wick 214 employed in an evaporator for a loop heat pipe system according to another embodiment of the present invention. 11 through 14, the same reference numerals are assigned to components that perform the same functions as those in FIG. 6, and detailed description thereof will be omitted.

Referring to FIG. 11, the sintered wick 214 inserted into the evaporator main body 210 has a rectangular parallelepiped shape, and the working fluid penetrated between the pores of the sintered wick 214 is changed into a gas so that the gas transfer pipe 40 A plurality of vapor passages (214b) are formed to move to). The steam passage 214b communicates with the discharge hole 218 and has a circular cross section.

Referring to FIG. 12, the sintered wick 214 inserted into the evaporator main body 210 has a rectangular parallelepiped shape and includes a plate-shaped first sub sintered wick 215 connecting upper and lower surfaces. The first sub sintered wicks 215 are spaced apart at regular intervals, and the space between the first sub sintered wicks 215 forms a vapor passage 214c of the working fluid in which the phase changes into gas.

Referring to FIG. 13, the sintered wick 214 inserted into the evaporator main body 210 has a rectangular parallelepiped shape and has protrusions 215 protruding from the upper and lower surfaces thereof. The protrusions 215 are formed spaced apart from each other at regular intervals. The space between the protrusions 215 and the space formed between the upper and lower surfaces form a vapor passage 214d of the working fluid phase-changed with gas.

Referring to FIG. 14, the sintered wick 214 inserted into the evaporator main body 210 has a rectangular parallelepiped shape, a plate-shaped first sub sintered wick 215 connecting upper and lower surfaces, and the first sub sintering. And a second sub sintered wick 219 disposed between the wicks 215.

The first sub sintered wick 215 is arranged to be spaced apart from each other at regular intervals by connecting an upper surface and a lower surface as in FIG. 11. The second sub-sintered wick 219 is formed in a pin shape protruding from the lower surface, and the upper end of the second sub-sintered wick 219 is spaced apart from the upper surface. The second sub sintered wicks 219 are spaced apart at regular intervals between the first sub sintered wicks 215. An upper end of the second sub sintered wick 219, an upper surface of the sintered wick 214, and a space formed by the first sub sintered wick 215 form a vapor passage 214e of a working fluid phase-changed with gas. Done.

Of course, the outer shape of the sintered wick 214 shown in FIGS. 11 to 14 is made of a rectangular parallelepiped, but the shape of the sintered wick receiving part 212 is varied in various shapes to correspond to the sintered wick receiving part 212. It is changeable.

The operation and effect of the evaporator for the loop bottom pipe system according to FIGS. 11 to 14 are similar to the operation and effect of the evaporator of FIG. 6, and thus a detailed description thereof will be omitted.

As mentioned above, although the present invention has been described in detail with reference to preferred embodiments, the present invention is not limited to the above embodiments, and many various modifications may be provided without departing from the scope of the present invention. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

1 is a schematic diagram illustrating the operation of a conventional cylindrical heat pipe;

2 is a conceptual diagram of a conventional loop heat pipe system;

3 is a schematic cross-sectional view of the evaporator employed in FIG. 2;

4 is a schematic perspective view of a loop heat pipe system employing an evaporator according to an embodiment of the present invention;

5 is an exploded perspective view of the evaporator of FIG. 4;

6 is a cross-sectional view taken along line VI-VI of FIG. 5;

FIG. 7 is a sectional view taken along line VII-VII of FIG. 5;

8 and 9 are views for explaining capillary pressure and transmittance;

10 is a cross-sectional view of an evaporator according to another embodiment of the present invention;

11 to 14 are views showing the shape of the sintered wick employed in another embodiment of the present invention.

<Explanation of symbols for main parts of the drawings>

1 ... heating element 200 ... evaporator

210 ... Evaporator body 212 ... Sintered wick housing

214 ... Sintered wick 215 ... First sub sintered wick

216 ... Inlet 217 ... Overhang

218 ... vent 219 ... second sub-sinter wick

220. First chamber part 222 ... Inlet

224 ... receiving space 230 ... capillary structure

240 ... 2nd chamber part 242 ... Outlet

244 ... gas holding part 30 ... liquid transfer pipe

40 ... gas transfer pipe 20 ... condenser

Claims (11)

A sintered wick accommodating part accommodating the sintered wick in which the metal powder is sintered, a working fluid filled between the pores of the sintered wick and a discharge hole which is discharged by being phased out as a gas upon heating, An evaporator body having an inlet hole that is changed and introduced; A first chamber part coupled to the inlet hole and having an inlet through which the working fluid of the liquid flows and an accommodation space accommodating the working fluid of the liquid phase; And Including; porous capillary structure inserted into the receiving space; The working fluid of the liquid introduced through the inlet is introduced into the evaporator body through the capillary structure evaporator for a loop heat pipe system (LHP; Loop Heat Pipe). The method of claim 1, At least a portion of the capillary structure is in contact with the sintered wick. The method of claim 1, The capillary structure is filled in the entire area of the receiving space evaporator for a loop heat pipe system. The method of claim 1, The capillary pressure of the sintered wick is greater than the capillary pressure of the capillary structure evaporator for a loop heat pipe system. The method of claim 1, Evaporator for a loop heat pipe system, characterized in that the transmittance of the sintered wick is smaller than the transmittance of the capillary structure. The method of claim 1, Is coupled to the discharge hole side, And a second chamber having a discharge port through which the working fluid changed into phase gas is discharged, and a gas accommodating part accommodating the working fluid changed into phase gas. The method of claim 1, The sintered wick has a space therein, and is made of a rectangular parallelepiped with one side open, The outer circumferential surface of the sintered wick is coupled to the inner circumferential surface of the sintered wick accommodating part, and the open one surface is in communication with the discharge hole. The method of claim 1, The sintered wick is made of a rectangular parallelepiped, An evaporator of a loop heat pipe system, characterized in that a plurality of vapor passages communicating with the discharge hole and having a circular cross section are formed in the sintered wick so that the working fluid changed into the gas flows. The method of claim 7, wherein Evaporator for a loop heat pipe system, characterized in that the plate-shaped first sub-sintered wick connecting the upper and lower surfaces of the sintered wick are spaced apart from each other at regular intervals. The method of claim 7, wherein Evaporator for a loop heat pipe system, characterized in that the upper and lower surfaces of the sintered wick, protrusions protruding from the upper and lower surfaces are formed spaced apart from each other at regular intervals. The method of claim 7, wherein Plate-shaped first sub-sintered wick connecting the upper and lower surfaces of the sintered wick are spaced apart from each other at regular intervals, And a fin-shaped second sub sintered wick protruding from the lower surface and spaced apart from the upper surface, and spaced apart from each other at regular intervals between the first sub sintered wicks.

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