KR20110011219A - Heat sink - Google Patents
Heat sink Download PDFInfo
- Publication number
- KR20110011219A KR20110011219A KR1020090068766A KR20090068766A KR20110011219A KR 20110011219 A KR20110011219 A KR 20110011219A KR 1020090068766 A KR1020090068766 A KR 1020090068766A KR 20090068766 A KR20090068766 A KR 20090068766A KR 20110011219 A KR20110011219 A KR 20110011219A
- Authority
- KR
- South Korea
- Prior art keywords
- heat
- base block
- refrigerant
- heat sink
- present
- Prior art date
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Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Thermal Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Human Computer Interaction (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
The present invention relates to a heat sink for cooling heat of a heat generating component such as a CPU, a semiconductor, and more specifically, an object of the present invention is to effectively radiate heat from a heat generating component to sustain performance.
In order to achieve the above object, the present invention includes a base block formed in one side of the plane to remove heat by contacting the heat source and a plurality of heat dissipation fins for discharging the heat transmitted to the air formed on the other side of the base block. In the heat sink, the base block is provided with a refrigerant hole formed in the base block for temporarily accommodating a fluid refrigerant and a refrigerant inlet tube formed on the side of the base block for inflow and outflow of the refrigerant. do.
Heating element, heat dissipation, heat sink
Description
The present invention relates to a heat sink for cooling heat of a heat generating component such as a CPU, a semiconductor, and more particularly, to a heat sink for effectively dissipating heat from a heat generating component to maintain performance.
Recent rapid development of technology has accelerated the high performance and miniaturization of machinery. In such small and high-performance devices, semiconductor chips, which play a major function, have become highly integrated, and heat generation per unit volume is increasing. On the other hand, various heat sinks have emerged to extinguish the calorific value.
A heat sink used as a device for cooling heat generated in heat generating parts such as a central processing unit (hereinafter, referred to as a CPU) and a semiconductor is generally a base block directly contacting a heat source, and received from the base block. Consists of heat radiation fins to dissipate heat into the air.
However, in the case of the base block of the metal constituting the heat sink, it is advantageous to take away from the heat source and radiate heat, but it may be limited to radiate heat depending only on a large amount of radiating fins contained in the base block itself.
In addition, the conventional heat sink as described above is increasing in volume in order to process the amount of heat generated from the heat generating component that generates high heat in accordance with the recent small size and high performance, but meets the limited space of electronic equipment and compact design requirements of the equipment In the following, there is a problem in that the limit, and if the heat-generating component is unable to maintain the proper temperature due to the heat dissipation performance of the conventional air-cooled heat sink, a problem occurs that the entire system malfunctions and fatal error.
The present invention is designed to solve the above problems, an object of the present invention is to effectively remove heat from the heat source using another heat radiation material in addition to the air-cooled heat radiation fin that is a conventional heat dissipation means, the heat contained in the base block itself It is to provide a heat sink that can perform a more effective heat dissipation function by rapidly dissipating heat.
In order to achieve the above object, the present invention includes a base block formed in one side of the plane to take heat into contact with the heat source and a plurality of heat dissipation fins for discharging the heat transmitted to the air formed on the other side of the base block; In the heat sink, wherein the base block, a refrigerant hole formed in the base block to temporarily receive the refrigerant in the fluid and a refrigerant inlet tube formed on the side of the base block for the inflow and outflow of the refrigerant is provided. It is done.
In addition, according to the present invention, the refrigerant inlet is characterized in that it further comprises a stopper for preventing the outflow of the refrigerant.
In addition, the inside of the coolant hole is characterized in that the guide wall for guiding the flow direction of the fluid is formed.
In addition, according to the present invention, the guide wall is characterized by forming a radial structure so that the refrigerant flowing into the refrigerant hole first reaches a close portion of the heat source and gradually flows away from the heat source.
The base block may be formed by mutual bonding of an upper block and a lower block.
As described above, the heat sink according to the present invention can supply heat to the base block by continuously supplying the working fluid, which is a coolant, to radiate heat not only from the heat source but also the heat contained in the base block through the working fluid. Has the effect of performing an effective heat dissipation function.
Hereinafter, the most preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention.
1 is a perspective view showing a heat sink of one embodiment according to the present invention, Figure 2 is a cross-sectional perspective view showing a heat sink of one embodiment according to the present invention, Figure 3 shows a heat sink of a second embodiment according to the present invention 4 is a cross-sectional perspective view showing a heat sink of a third embodiment according to the present invention, FIG. 5 is a cross-sectional perspective view showing a heat sink of a fourth embodiment according to the present invention, and FIG. An exploded perspective view showing a heat sink of an embodiment.
As shown in FIG. 1, the
The
In this case, as shown in FIG. 2, a coolant flowing out through the
Meanwhile, in the
The
As shown in FIG. 4 and FIG. 5, the
This heat-exchanges the working fluid flowing through the
The structure of the
Meanwhile, in the
The brazing joining method is a joining method in which only a brazing material is melted and bonded without using a nonferrous metal or an alloy (lead material) having a lower melting point than a base material to be joined as a filler metal. Since the
In addition, since the structure of the
The above-described embodiments are merely illustrative of one embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and may be appropriately changed within the scope of the invention registration claims. For example, the shape and structure of each component specifically shown in the embodiment of the present invention can be modified.
1 is a perspective view showing a heat sink of one embodiment according to the present invention;
Figure 2 is a cross-sectional perspective view showing a heat sink of one embodiment according to the present invention,
3 is a cross-sectional perspective view showing a heat sink of a second embodiment according to the present invention;
4 is a cross-sectional perspective view showing a heat sink of a third embodiment according to the present invention;
5 is a cross-sectional perspective view showing a heat sink of a fourth embodiment according to the present invention;
Figure 6 is an exploded perspective view showing a heat sink of another embodiment of the present invention.
♣ Explanation of symbols for main part of drawing ♣
200: heat sink 10: base block
20: heat radiation fin 110: refrigerant hole
120: refrigerant access pipe 121: stopper
111: guide wall
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090068766A KR101072723B1 (en) | 2009-07-28 | 2009-07-28 | Heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090068766A KR101072723B1 (en) | 2009-07-28 | 2009-07-28 | Heat sink |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20110011219A true KR20110011219A (en) | 2011-02-08 |
KR101072723B1 KR101072723B1 (en) | 2011-10-11 |
Family
ID=43771470
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020090068766A KR101072723B1 (en) | 2009-07-28 | 2009-07-28 | Heat sink |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR101072723B1 (en) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100677617B1 (en) * | 2005-09-29 | 2007-02-02 | 삼성전자주식회사 | Heat sink assembly |
-
2009
- 2009-07-28 KR KR1020090068766A patent/KR101072723B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR101072723B1 (en) | 2011-10-11 |
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E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
LAPS | Lapse due to unpaid annual fee |