KR20110011219A - Heat sink - Google Patents

Heat sink Download PDF

Info

Publication number
KR20110011219A
KR20110011219A KR1020090068766A KR20090068766A KR20110011219A KR 20110011219 A KR20110011219 A KR 20110011219A KR 1020090068766 A KR1020090068766 A KR 1020090068766A KR 20090068766 A KR20090068766 A KR 20090068766A KR 20110011219 A KR20110011219 A KR 20110011219A
Authority
KR
South Korea
Prior art keywords
heat
base block
refrigerant
heat sink
present
Prior art date
Application number
KR1020090068766A
Other languages
Korean (ko)
Other versions
KR101072723B1 (en
Inventor
임창민
Original Assignee
임창민
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 임창민 filed Critical 임창민
Priority to KR1020090068766A priority Critical patent/KR101072723B1/en
Publication of KR20110011219A publication Critical patent/KR20110011219A/en
Application granted granted Critical
Publication of KR101072723B1 publication Critical patent/KR101072723B1/en

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

The present invention relates to a heat sink for cooling heat of a heat generating component such as a CPU, a semiconductor, and more specifically, an object of the present invention is to effectively radiate heat from a heat generating component to sustain performance.

In order to achieve the above object, the present invention includes a base block formed in one side of the plane to remove heat by contacting the heat source and a plurality of heat dissipation fins for discharging the heat transmitted to the air formed on the other side of the base block. In the heat sink, the base block is provided with a refrigerant hole formed in the base block for temporarily accommodating a fluid refrigerant and a refrigerant inlet tube formed on the side of the base block for inflow and outflow of the refrigerant. do.

Heating element, heat dissipation, heat sink

Description

Heat Sink {HEAT SINK}

The present invention relates to a heat sink for cooling heat of a heat generating component such as a CPU, a semiconductor, and more particularly, to a heat sink for effectively dissipating heat from a heat generating component to maintain performance.

Recent rapid development of technology has accelerated the high performance and miniaturization of machinery. In such small and high-performance devices, semiconductor chips, which play a major function, have become highly integrated, and heat generation per unit volume is increasing. On the other hand, various heat sinks have emerged to extinguish the calorific value.

A heat sink used as a device for cooling heat generated in heat generating parts such as a central processing unit (hereinafter, referred to as a CPU) and a semiconductor is generally a base block directly contacting a heat source, and received from the base block. Consists of heat radiation fins to dissipate heat into the air.

However, in the case of the base block of the metal constituting the heat sink, it is advantageous to take away from the heat source and radiate heat, but it may be limited to radiate heat depending only on a large amount of radiating fins contained in the base block itself.

In addition, the conventional heat sink as described above is increasing in volume in order to process the amount of heat generated from the heat generating component that generates high heat in accordance with the recent small size and high performance, but meets the limited space of electronic equipment and compact design requirements of the equipment In the following, there is a problem in that the limit, and if the heat-generating component is unable to maintain the proper temperature due to the heat dissipation performance of the conventional air-cooled heat sink, a problem occurs that the entire system malfunctions and fatal error.

The present invention is designed to solve the above problems, an object of the present invention is to effectively remove heat from the heat source using another heat radiation material in addition to the air-cooled heat radiation fin that is a conventional heat dissipation means, the heat contained in the base block itself It is to provide a heat sink that can perform a more effective heat dissipation function by rapidly dissipating heat.

In order to achieve the above object, the present invention includes a base block formed in one side of the plane to take heat into contact with the heat source and a plurality of heat dissipation fins for discharging the heat transmitted to the air formed on the other side of the base block; In the heat sink, wherein the base block, a refrigerant hole formed in the base block to temporarily receive the refrigerant in the fluid and a refrigerant inlet tube formed on the side of the base block for the inflow and outflow of the refrigerant is provided. It is done.

In addition, according to the present invention, the refrigerant inlet is characterized in that it further comprises a stopper for preventing the outflow of the refrigerant.

In addition, the inside of the coolant hole is characterized in that the guide wall for guiding the flow direction of the fluid is formed.

In addition, according to the present invention, the guide wall is characterized by forming a radial structure so that the refrigerant flowing into the refrigerant hole first reaches a close portion of the heat source and gradually flows away from the heat source.

The base block may be formed by mutual bonding of an upper block and a lower block.

As described above, the heat sink according to the present invention can supply heat to the base block by continuously supplying the working fluid, which is a coolant, to radiate heat not only from the heat source but also the heat contained in the base block through the working fluid. Has the effect of performing an effective heat dissipation function.

Hereinafter, the most preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention.

1 is a perspective view showing a heat sink of one embodiment according to the present invention, Figure 2 is a cross-sectional perspective view showing a heat sink of one embodiment according to the present invention, Figure 3 shows a heat sink of a second embodiment according to the present invention 4 is a cross-sectional perspective view showing a heat sink of a third embodiment according to the present invention, FIG. 5 is a cross-sectional perspective view showing a heat sink of a fourth embodiment according to the present invention, and FIG. An exploded perspective view showing a heat sink of an embodiment.

Heat sink 200 according to the present invention, the base block 10 is formed in one side plane to take heat by contacting the heat source and the other side of the base block 10 to discharge the heat received in the air In the heat sink 200 including a plurality of heat dissipation fins 20, the base block 10, the refrigerant hole 110 formed in the base block and the inflow of the refrigerant to temporarily receive the refrigerant in the fluid The refrigerant inlet pipe 120 is formed on the side of the base block 10 for outflow.

As shown in FIG. 1, the base block 10 is a member for dissipating heat from a heat source, and a heat source is typically installed at the bottom surface side of the base block 10. In addition, as shown in FIGS. 1 and 2, the base block 10 has a coolant hole 110 for receiving a predetermined amount of coolant. The refrigerant used in the present invention may be various kinds of working fluids made of a fluid including water.

The coolant hole 110 may be replaced with a new refrigerant by the refrigerant flows in and out through the refrigerant inlet pipe 120, the heat exchange with the heat source, the coolant outlet pipe 120 is a stopper (121) to prevent the leakage of the refrigerant In addition, the refrigerant may be accommodated in the base block 10 for a long time through the stopper 121 according to a situation.

In this case, as shown in FIG. 2, a coolant flowing out through the coolant access pipe 120 may flow in the base block 10, and the pressure of the coolant, which is a fluid, is high so as to fill the base block 10. In this case, sufficient heat exchange between the base block 10 and the refrigerant is achieved.

Meanwhile, in the heat sink 200 according to the present invention, as illustrated in FIGS. 3 to 5, the guide wall 111 for guiding the flow direction of the refrigerant, which is a fluid, is formed in the refrigerant hole 110.

The guide wall 111 is for effective heat exchange with sufficient friction between the refrigerant and the guide wall 111, and as shown in FIG. 2, the pressure of the working fluid flowing inside the coolant hole 110 is weak. In this case, since the refrigerant heat-exchanged to the base block 10 flows irregularly and may not be flowed into the refrigerant access pipe 120, this is to prevent such a phenomenon.

As shown in FIG. 4 and FIG. 5, the guide walls 111a and 111b have a coolant flowing into the coolant hole 110 first reaching a close portion of the heat source 2, and then gradually turning off the heat source 2. Radial structures can be formed to flow to distant parts.

This heat-exchanges the working fluid flowing through the guide walls 111a and 111b from the heat source, releases the refrigerant whose cooling function is deteriorated from the heat source, and discharges the refrigerant into the refrigerant access pipe 120. In order to increase the cooling function by preferential contact with the heat exchanger), as shown in FIGS. 4 and 5, the shape of the guide walls 111a and 111b varies according to the direction in which the refrigerant inlet pipe 120 is formed.

The structure of the guide wall 111a shown in FIG. 4 may be effective when the heat source (semiconductor, etc.) is formed in an elongated form, and the structure of the guide wall 111b shown in FIG. 5 may be effective for the heat source having a square shape.

Meanwhile, in the heat sink 200 according to the present invention, the base block 10 may be formed by mutual bonding of the upper block 11 and the lower block 12 as shown in FIG. 6. The block 11 and the lower block 12 are preferably joined by brazing.

The brazing joining method is a joining method in which only a brazing material is melted and bonded without using a nonferrous metal or an alloy (lead material) having a lower melting point than a base material to be joined as a filler metal. Since the heat dissipation fin 20 is installed on the upper side of 10), the heat dissipation fin 20 is prevented from being damaged during the coupling process of the base block 10.

In addition, since the structure of the guide wall 111 formed therein in the base block 10 is in the form of a canyon structure, the upper block 11 having the heat dissipation fins 20 formed therein rather than forming one integrated base block 10. ) And the lower block 12 to be mutually coupled to each other may be advantageous in manufacturing.

The above-described embodiments are merely illustrative of one embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and may be appropriately changed within the scope of the invention registration claims. For example, the shape and structure of each component specifically shown in the embodiment of the present invention can be modified.

1 is a perspective view showing a heat sink of one embodiment according to the present invention;

Figure 2 is a cross-sectional perspective view showing a heat sink of one embodiment according to the present invention,

3 is a cross-sectional perspective view showing a heat sink of a second embodiment according to the present invention;

4 is a cross-sectional perspective view showing a heat sink of a third embodiment according to the present invention;

5 is a cross-sectional perspective view showing a heat sink of a fourth embodiment according to the present invention;

Figure 6 is an exploded perspective view showing a heat sink of another embodiment of the present invention.

♣ Explanation of symbols for main part of drawing ♣

200: heat sink 10: base block

20: heat radiation fin 110: refrigerant hole

120: refrigerant access pipe 121: stopper

111: guide wall

Claims (5)

In the heat sink comprising a base block formed in one side of the plane to contact the heat source to extract heat and a plurality of heat dissipation fins formed on the other side of the base block for releasing the received heat into the air, The base block is a heat sink, characterized in that provided with a refrigerant hole formed in the base block to temporarily receive the refrigerant in the fluid and the refrigerant inlet pipe formed on the side of the base block for the inflow and outflow of the refrigerant. The method of claim 1, The coolant entry pipe further comprises a stopper that prevents the outflow of the coolant. The method of claim 1, The inside of the refrigerant hole is a heat sink, characterized in that a guide wall for guiding the flow direction of the fluid is formed. The method of claim 3, wherein The guide wall is a heat sink, characterized in that to form a radial structure so that the refrigerant flowing into the coolant hole first reaches a close portion of the heat source and gradually flows away from the heat source. The method of claim 1, The base block is a heat sink, characterized in that formed by the junction of the upper block and the lower block.
KR1020090068766A 2009-07-28 2009-07-28 Heat sink KR101072723B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020090068766A KR101072723B1 (en) 2009-07-28 2009-07-28 Heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090068766A KR101072723B1 (en) 2009-07-28 2009-07-28 Heat sink

Publications (2)

Publication Number Publication Date
KR20110011219A true KR20110011219A (en) 2011-02-08
KR101072723B1 KR101072723B1 (en) 2011-10-11

Family

ID=43771470

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090068766A KR101072723B1 (en) 2009-07-28 2009-07-28 Heat sink

Country Status (1)

Country Link
KR (1) KR101072723B1 (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100677617B1 (en) * 2005-09-29 2007-02-02 삼성전자주식회사 Heat sink assembly

Also Published As

Publication number Publication date
KR101072723B1 (en) 2011-10-11

Similar Documents

Publication Publication Date Title
CN107567248B (en) Liquid cooling heat radiator
US7584781B2 (en) Liquid-cooling device
US20130056178A1 (en) Ebullient cooling device
US9704779B2 (en) Semiconductor module cooler and method for manufacturing same
US20120063090A1 (en) Cooling mechanism for stacked die package and method of manufacturing the same
JP4551261B2 (en) Cooling jacket
JP4586772B2 (en) COOLING STRUCTURE AND COOLING STRUCTURE MANUFACTURING METHOD
US20070034355A1 (en) Heat-dissipation structure and method thereof
US20170027081A1 (en) Liquid-cooling device and system thereof
JP6482954B2 (en) Liquid cooling system
US20100296249A1 (en) Micro passage cold plate device for a liquid cooling radiator
JP2009267033A (en) Cooling apparatus for electronic equipment and electronic equipment equipped with the same
TWI402032B (en) Device for cooling an elecronic apparatus
TW201334679A (en) Heat dissipating module
WO2015146110A1 (en) Phase-change cooler and phase-change cooling method
JP2007200957A (en) Liquid-cooled heat dissipation apparatus
WO2016117342A1 (en) Cooling device and electronic device in which same is installed
JP2011187523A (en) Liquid cooling unit
US20100065248A1 (en) Heat sink
KR101072723B1 (en) Heat sink
US20080308257A1 (en) Heat dissipating assembly
JP2013026527A (en) Cooling unit
EP4325555A1 (en) Chip heat dissipation cover, chip packaging structure and device interconnection system
CN116868335A (en) Conformal cooling assembly with substrate fluidic prevention for multi-die electronic assemblies
JP2007081375A (en) Cooling device

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
LAPS Lapse due to unpaid annual fee