KR20110009317A - Heat radiation structure for electronic device - Google Patents

Abstract

Disclosed is a heat dissipation structure of an electronic device. According to an aspect of the present invention, a connector in which a card-type information medium is inserted and one end thereof are coupled to a connector, and the other end is coupled to one side of an electronic device that reads the card-type information medium, thereby generating heat generated from the card-type information medium. The heat dissipation structure of an electronic device including a heat loader to be transmitted to one side of the device has an effect of efficiently and sufficiently dissipating heat generated from the card-type information medium.

Description

Heat radiation structure for electronic device

The present invention relates to an electronic device, and more particularly to a heat dissipation structure of the electronic device.

Electronic devices such as mobile communication terminals have evolved to include functions such as network connection, mail transmission, image capturing, navigation, etc. in addition to basic telephone call functions. Recently, security functions such as contact or contactless IC cards are also added. It is becoming. With such multifunctionalization of the mobile communication terminal, various card type information media that have been developed for miniaturization and thinness as well as for multifunctionality have been developed in the card field mounted and used in the card slot of the mobile communication terminal.

1 is a cross-sectional view of a SIM (Subscriber Identity Module) card according to the prior art. 1 is a cross-sectional view of a SIM card disclosed in Patent Application No. 2006-0022185 (semiconductor device and method for manufacturing the same), in order to promote the multifunctionality of a small SIM card, the front side (top side) and the back side of the SIM card. Terminals are formed on the lower surface side, respectively.

In the illustrated SIM card 1, three semiconductor chips 3 (3I, 3M, 3C) are sandwiched between two wiring boards 2A, 2B, and these semiconductor chips 3 (3I, 3M, 3C). ) Is sealed with a mold resin (4).

One surface of the wiring board 2A is exposed on the surface side of the SIM card 1, and the wiring board 2A is made of a general-purpose resin such as a glass epoxy resin, and on one surface thereof, an external transceiver (reader / writer) is provided. A plurality of contacts (6c, 6e, 6g, etc.) constituting the interface with the () is formed.

One surface of the wiring board 2B is also exposed on the back side of the SIM card 1, and 20 external connection terminals 7 are formed in two rows along the short side direction. The external connection terminal 7 is, for example, an interface of the memory stick PRO, and these external connection terminals 7 function as external terminals of the memory chip 3M.

Three semiconductor chips 3 are disposed between the wiring board 2A and the wiring board 2B. These semiconductor chips 3 are mounted on the upper surface of the wiring board 2B and sealed by the mold resin 4. The three semiconductor chips 3 are, for example, IC chips 3I, controller chips 3C, and memory chips 3M made of silicon.

Of the three semiconductor chips 3, the memory chip 3M and the controller chip 3C are bonded to the upper surface of the wiring board 2B, and the IC chip 3I is bonded to the memory chip 3M. Formed. These three semiconductor chips 3 are electrically connected to the electrodes 22 on the upper surface of the wiring board 2B from the electrodes (not shown) of the semiconductor chips 3 via the gold wire 9. The electrode 22 on the board | substrate 2B is electrically connected to the said external connection terminal 7 via the via hole (not shown) formed in the wiring board 2B.

The mold resin 4 which seals the three semiconductor chips 3 is made of a thermosetting epoxy or the like containing a quartz filler or the like. The wiring board 2A mentioned above is adhere | attached by the adhesive agent 8 on the upper surface of the mold resin 4. The adhesive agent 8 interposed between the upper surface of the mold resin 4 and the wiring board 2A is made of an epoxy resin-based nonconductive adhesive.

Among the three semiconductor chips 3, the IC chip 3I stacked on the memory chip 3M is electrically connected to the contact 6 of the wiring board 2A. That is, in the gold wire 9 which connects the IC chip 3I and the wiring board 2B, the upper end part of the loop is slightly exposed from the upper surface of the mold resin 4, and is formed. The conductive adhesive 10 is apply | coated on each gold wire 9 exposed from the upper surface of the mold resin 4. In addition, an electrode (not shown) and via holes 11 connected to any one of the five contacts except for the non-connect terminal NC described above are formed in the wiring board 2A on the conductive adhesive 10. . In this way, each of the five gold wires 9 whose upper end portions are exposed from the upper surface of the mold resin 4 is electrically connected to any one of the five contacts through the conductive adhesive 10, the electrode, and the via hole 11. It is.

As described above, the card type information medium using the semiconductor technology has been increasingly utilized in various directions in accordance with the development of mobile communication terminals. To this end, various technologies have been developed for pursuing multifunctionality by adding a contact point to a card type information medium having an external dimension of the same standard.

However, as the card-type information medium is multifunctional, there is a problem in that heat is generated when it is inserted into the electronic device and utilized. Has not been presented.

The background art described above is technical information possessed by the inventors for the derivation of the present invention or acquired during the derivation process of the present invention, and is not necessarily a publicly known technique disclosed to the general public before the application of the present invention.

The present invention provides a heat dissipation structure of an electronic device for efficiently and sufficiently dissipating heat generated in a card type information medium.

Technical problems other than the present invention will be easily understood through the following description.

According to an aspect of the present invention, a connector in which a card-type information medium is inserted and one end thereof are coupled to a connector, and the other end is coupled to one side of an electronic device that reads the card-type information medium, thereby generating heat generated from the card-type information medium. A heat dissipation structure of an electronic device is provided that includes a heat loader that transfers to one side of the device.

Here, the heat loader can be coupled to the connector and the motherboard of the electronic device, the connector is formed on the body portion, the body portion, and coupled to the electrode and the body portion electrically coupled to the card-type information medium, the heat loader It may include a cover portion coupled with.

In addition, the cover part may be coupled to the heat dissipation layer of the card-type information medium when the card-type information medium is inserted, and the heat loader may be formed of a metal material or implemented as a flexible PCB (FPCB).

Here, the above-described electronic device may be a mobile communication terminal.

Other aspects, features, and advantages other than those described above will become apparent from the following drawings, claims, and detailed description of the invention.

The heat dissipation structure of the electronic device according to the present invention has the effect of efficiently and sufficiently dissipating heat generated from the card type information medium.

As the invention allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the written description. However, this is not intended to limit the present invention to specific embodiments, it should be understood to include all changes, equivalents, and substitutes included in the spirit and scope of the present invention.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. As used herein, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described on the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, components, or a combination thereof.

In the following description of the present invention with reference to the accompanying drawings, the same components are denoted by the same reference numerals regardless of the reference numerals, and redundant explanations thereof will be omitted. In the following description of the present invention, if it is determined that the detailed description of the related known technology may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted. In addition, before describing the preferred embodiments of the present invention in detail, an embodiment of a card-type electronic medium that can be applied to the present invention will be described first.

2A and 2B are diagrams schematically showing a configuration of a card type information medium according to an embodiment of the present invention, and FIG. 3 is a terminal arrangement formed on one side of a card type information medium according to an embodiment of the present invention. The illustrated figure. 2A, 2B and 3 illustrate a case of a SIM card as an example of a card type information medium.

Referring to FIG. 2A, the card type information medium 200 may include a processor package 210, a memory package 220, and one or more electronic devices 230.

As a semiconductor package, processor package 210 is a means for performing one or more of operations, processing and control, memory package 220 is a means for storing information, and both may be electrically connected to each other. 2 illustrates that the card type information medium 200 may include the processor package 210 and the memory package 220 as an example, and the card type information medium 200 may be a semiconductor package included according to its purpose or purpose. The quantity and type of can vary. In the following description with reference to the accompanying drawings, the structure and shape of a semiconductor package and a method of manufacturing a card type information medium 200 using the semiconductor package will be readily understood.

The electronic device 230 may be a passive device and / or an active device. The type or arrangement / connection method of the electronic device included in the card-type information medium 200 such as a SIM card is obvious to those skilled in the art or somewhat distanced from the gist of the present invention, and thus detailed description thereof will be omitted.

2b illustrates an arrangement of terminals constituting an interface for electrical connection with a reader or a writer. The arrangement example of FIG. 2B illustrates the case of the SIM card, and the arrangement of the terminals may vary according to the purpose of the card type information medium or the interface protocol. In the following description, a method of forming and arranging terminals, etc. will be apparent to those skilled in the art or some distance from the gist of the present invention.

3 is a view showing the shape of a semiconductor package 300 having a heat dissipation layer according to an embodiment of the present invention.

As described above, the semiconductor package 300 may be various, such as a processor package 210, a memory package 220, and the semiconductor package 300 may include, for example, one processor chip or two or more processor chips. It is also possible to construct a multichip package (MCP). In addition, the shape of the semiconductor package 300 may be different according to the purpose.

Hereinafter, a manufacturing process of the semiconductor package 300 illustrated in FIG. 3 will be described.

First, a die paddle 301 and an inner lead 322 are formed on the substrate 315, and then the semiconductor chip 303 is formed on the die paddle 301 using an adhesive 310. ). Here, the die paddle 301 may be one or more of a lead frame, a printed circuit board (PCB), a tape type substrate, and the like. In addition, for example, an electric oven or a heater block may be used to cure the adhesive 310 after the semiconductor chip 303 is attached.

Subsequently, the bond pad 302 and the inner lead 322 of the semiconductor chip 303 are connected with a wire 307. Here, for example, a fine copper wire or a fine aluminum wire may be used as the wire 307, which is a conductor that electrically connects the bond pad 302 and the inner lead 322.

Subsequently, an adhesive 308 is used to attach the heat dissipation layer 309 to the upper side of the semiconductor chip 303. At this time, in attaching the heat dissipation layer 309 formed of a material having excellent thermal conductivity and / or electrical conductivity to the upper side of the semiconductor chip 303, the heat dissipation layer 309 in the active element region for the enhancement of heat dissipation efficiency. ) Can be attached. For example, the heat dissipation layer 309 may be formed of a metal material, and may be electrically connected to the heat dissipation layer 309 to reduce the inductance of the fine gold wire and the inner lead in the package. In addition, it can improve electrical characteristics when used in high frequency range. In addition, when ground is applied to the die paddle 301 and the heat dissipation layer 309, the EMI shield-effect may be brought into and out of the die paddle 301 and the heat dissipation layer 309, thereby significantly reducing noise.

In addition, the heat dissipation layer 309 is in contact with a part 311 positioned on the upper side of the semiconductor chip 303, and the rest of the heat dissipation layer 309 is not in contact with the semiconductor chip 303. For example, the portion 311 is recessed, and may have a structure such as an M shape, a V shape, or a U shape. This may be variously designed according to the shape of the semiconductor package 300 (for example, round type, polygonal type, etc.), in which the recessed portion is a semiconductor chip 303 to maximize heat dissipation efficiency. Can be in contact with the active element region.

In addition, the edge of the heat dissipation layer 309 may be bent toward the lower surface of the semiconductor package 300 or may protrude toward the lower surface of the semiconductor package 300.

As an adhesive for adhesion of the heat dissipation layer 309, a thermo-plastic adhesive epoxy, a thermo-set adhesive epoxy, a thermal conductive epoxy, an electrically conductive epoxy ) Or adhesive tape (Adhesive Tape) can be selected or used in combination. For example, an electric oven or a heater block may be used for curing the adhesive 308.

Subsequently, the upper surface of the heat dissipation layer 309 is molded to be exposed to the outside, and the solder member 320 mounted on the lower surface of the molding semiconductor package 300 is formed. That is, an epoxy molding process is performed by using an epoxy molding compound 304 in a mold die to protect the semiconductor chip 303 and the wire 307. At this time, the upper side of the heat dissipation layer is not covered with the epoxy molding compound.

After epoxy molding, a process for further curing the epoxy molding compound (Post-Mold Cure) may be performed, for example using an electric oven. In addition, a polishing process may be used to polish an exposed portion of the epoxy-molded heat dissipation roof, or a defleshing process may be performed simultaneously with or instead of the polishing process. In addition, if necessary, plating may be performed on an out lead or a heat dissipation roof. Such plating materials may include, for example, solder, tin, silver, or gold. ) May be used.

In addition, the I / O of the semiconductor package 300 may be formed by trimming and forming the out lead portion of the semiconductor package 300 having the epoxy molding completed using a die.

In this case, the solder member 320 may be attached to the I / O terminal formed on the lower surface of the substrate. The semiconductor package 300 manufactured using the substrate as described above may be cut or cut to cut the package. The solder member 320 may be a means for coupling the semiconductor package 300 to a lower member (eg, a substrate), for example, at least one of solder balls, solder pastes, solder bars, and the like.

The illustrated semiconductor package 300 has a structure in which the upper heat dissipating layer and the lower die paddle are approximately symmetrical to each other, and thus warpage due to thermal expansion and contraction of the semiconductor package 300 and the resulting heat dissipation and molding material between It also has the effect of preventing the occurrence of fine delamination.

4 is a diagram illustrating a heat dissipation structure of an electronic device according to an embodiment of the present invention. Referring to FIG. 4, the card-type information medium 200, the connector 410, the connector body 412, the cover 414, the electrode 416, a heat loader 420, and an electronic device body 430 is shown. The card-type information medium 200 may include not only a medium having the above-described form but also a medium having other forms and functions.

The connector 410 is a means for inserting the card-shaped information medium 200 may be provided in the electronic device. That is, the electronic device may include a connector 410 in order to insert and / or couple the above-described card type information medium 200 to the electronic device. The electronic device of the present embodiment is a device capable of reading data from the card type information medium 200 as described above, and may be, for example, a mobile communication terminal.

The connector body part 412 forms a body of the connector 410 and may be attached to one side of the electronic device. For example, the connector body 412 may have a slot shape as a separate part or a predetermined groove formed on the side of the electronic device.

The cover portion 414 is coupled to the connector body portion 412, and spaced apart by a predetermined distance therebetween, and the card type information medium 200 may be inserted between the connector body portion 412 and the cover portion 414. have. The cover unit 414 may be directly coupled with the heat dissipation layer 309 described above when the card-type information medium 200 is inserted to receive heat generated from the card-type information medium 200 through the heat dissipation layer 309. .

The electrode 416 is formed on the connector body portion 412 and is electrically coupled with the card-shaped information medium 200. The electronic device of the present embodiment can read or write data in the card type information medium 200 by combining with the card type information medium 200 through the electrode 416. The number and arrangement of the electrodes 416 may be determined in correspondence with the electrodes formed on the card-shaped information medium 200, which are obvious to the person skilled in the art, and are somewhat distanced from the gist of the present invention. , Detailed description is omitted.

The heat loader 420 has one end coupled to the connector 410, and the other end coupled to one side of the electronic device that reads the card information medium 200, thereby generating heat generated from the card information medium 200. Deliver to one side of the electronic device.

Referring to FIG. 4, one end of the heat loader 420 is coupled to the cover 414 to receive heat generated from the card type information medium 200 through the cover 414.

In addition, the other end of the heat loader 420 is coupled to the electronic device body 430. The electronic device body 430 may be a part of the electronic device, and may be, for example, a mother board. The mother board is a substrate on which basic components of an electronic device are mounted, and may be referred to as a main board, a main board, or a mother board, but is not limited thereto.

In this case, a separate heat dissipation structure may be provided in the electronic device body 430. For example, when a separate heat sink is provided in the electronic device of the present embodiment, the heat loader 420 may be efficiently radiated by directly coupling to the heat sink. In this case, the heat generated from the card-type information medium 200 is sequentially transmitted to the heat dissipation structure of the heat dissipation layer 309, the cover 414, the heat loader 420, and the electronic device main body 430, thereby dissipating heat. The card type information medium 200 has an advantage of being able to be driven thermally and stably.

The heat loader 420 may be formed of a material having high thermal conductivity, for example, a metal material such as silver (Ag), copper (Cu), gold (Au), and aluminum (Al). In addition, the heat loader 420 may be formed of a member, for example, a flexible PCB (FPCB), which has a high bending property and easily spaces even in a narrow space.

As described above, the heat dissipation structure of the electronic device according to the embodiment of the present invention described the configuration of the card-type information medium and the heat dissipation structure according to one embodiment, but is not necessarily limited thereto. Such components may be included in the scope of the present invention if there is no difference in the overall operation and effect even if the components used in the card information medium or having a structure or material different from the above-described connector and heat loader are used. Those skilled in the art will appreciate that various modifications and changes can be made in the present invention without departing from the spirit and scope of the invention as set forth in the claims below.

1 is a cross-sectional view of a SIM (Subscriber Identity Module) card according to the prior art.

2A and 2B schematically show the configuration of a card type information medium used in a heat dissipation structure of an electronic device according to an embodiment of the present invention.

3 is a diagram illustrating a terminal arrangement formed on one side of a card type information medium used in a heat dissipation structure of an electronic device according to an embodiment of the present invention.

4 illustrates a heat dissipation structure of an electronic device according to an embodiment of the present invention.

Claims (7)

A connector into which a card type information medium is inserted; And A heat loader having one end coupled to the connector and the other end coupled to one side of the electronic device that reads the card information medium, and transferring heat generated from the card information medium to one side of the electronic device. Heat dissipation structure of an electronic device that includes. The method of claim 1, And the heat loader is coupled to the connector and the motherboard of the electronic device. The method of claim 1, The connector, Main body; An electrode formed on the main body and electrically coupled to the card-shaped information medium; And The heat dissipation structure of the electronic device comprising a cover portion coupled to the main body portion, and coupled to the heat loader. The method of claim 3, And the cover portion is coupled to a heat dissipation layer of the card information medium when the card information medium is inserted. The method of claim 1, The heat loader is a heat dissipation structure of the electronic device, characterized in that formed of a metallic material. The method of claim 1, The heat loader is a heat dissipation structure of an electronic device, characterized in that the FPCB (flexible PCB). The method of claim 1, The heat dissipation structure of the electronic device, characterized in that the electronic device is a mobile communication terminal.

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