KR20110002639A - A repair structure of pattern parts and a repair method of the pattern parts - Google Patents

Abstract

PURPOSE: A structure and a method for repairing a pattern are provided to increase repair yield by filing and sintering conductive materials in an open defect part with a hydrophilic insulation thin film to form a repair part. CONSTITUTION: A hydrophilic insulation thin film(113) is formed on an insulation layer(102) exposed by an open defect part(106) of a pattern(104). A repair part is formed by filling conductive materials in the open defect part including the hydrophilic insulation thin film. The conductive material is conductive metal ink or conductive paste. The hydrophilic insulation thin film is made of polyimide based resin. A hydrophobic insulation thin film is formed on the insulation layer of the open defect side.

Description

Repair structure of pattern parts and a repair method of the pattern parts

The present invention relates to a repair structure and a repair method of the pattern portion.

In general, a printed circuit board is wired to one side or both sides of a board made of various thermosetting synthetic resins, and then an IC or an electronic component is disposed and fixed on the board and coated with an insulator by implementing electrical wiring therebetween.

In recent years, with the development of the electronics industry, the demand for high functionalization and light weight reduction of electronic components is rapidly increasing, and printed circuit boards on which such electronic components are mounted also require high-density wiring and thin plates. It is causing an increase.

As a way to cope with this, a repair technique for defective pattern parts occurring in the manufacturing process of a printed circuit board has been attracting attention.

1 is a view showing a defect occurring in the pattern portion.

As can be seen in Figure 1, in the manufacturing process of the printed circuit board, the pattern portion 10 is open (12), missing (14), thickened (16), pin hole (18), short ( various defects occur such as short (20), projection (22), tapering (24), and defect (26) just before disconnection.

In this case, the repair process is performed through commercial equipment using a laser ablation method for the short defective parts such as the short circuit 20, the thickening 16, and the protrusion 22, but the disconnection 12 Open defects such as defects 14, pinholes 18, tapered 24, and defects 26 immediately before disconnection do not have any automated equipment, and repair processes are performed by manual labor.

For example, in the conventional case of open defects, the worker manually forms a plated layer according to the plating thickness through the plating process on the open defect portion by manual work, and proceeds by cutting a portion out of specification with a knife or It proceeded by filling the conductive material.

However, when the repair process is performed by the plating process, there is a problem that the repair process time is too long, and the yield thereof is significantly decreased.

On the other hand, when the repair process is performed by filling the conductive material, the repair process time is shorter than the case of the plating process. However, the conductive material spreads to the outside in the process of filling the open defective part, so that the repair process may be performed. There was a problem that a short occurred.

The present invention has been made to solve the above problems, an object of the present invention is to provide a repair structure of the pattern portion and a repair method of the pattern portion to increase the repair yield, minimizing the bleeding phenomenon of the conductive material. .

The repair structure of the pattern portion according to the preferred embodiment of the present invention, the hydrophilic insulating thin film formed on the insulating layer exposed by the open defective portion of the pattern portion; And a repair part formed by filling a conductive material in the hydrophilic insulating thin film of the open defective part.

Here, it is characterized in that it further comprises a hydrophobic insulating thin film formed on the insulating layer side of the open defective portion.

In addition, the hydrophilic insulating thin film is characterized in that formed of polyimide resin.

The conductive material may be a conductive metal ink or a conductive paste.

In the repairing method of the pattern portion according to the preferred embodiment of the present invention, (A) forming a hydrophobic insulating thin film on the insulating layer exposed by the open defective portion of the pattern portion, (B) modifying the hydrophobic insulating thin film into a hydrophilic insulating thin film (C) filling the open defective portion with the hydrophilic insulating thin film formed thereon, and (D) sintering the conductive material.

Here, in the step (A), the hydrophobic insulating thin film is formed by aerosol jet printing, inkjet printing, screen printing, micro-contact printing, or dispensing method.

Further, in the step (B), the modification is characterized in that it is carried out by UV irradiation or laser irradiation.

Further, in the step (C), the filling of the conductive material is characterized in that it is carried out by aerosol jet printing, inkjet printing, screen printing, micro-contact printing, or dispensing method.

The conductive material may be a conductive metal ink or a conductive paste.

In the step (D), the sintering of the conductive material is performed by heat treatment or laser treatment.

According to another preferred embodiment of the present invention, a method of repairing a pattern portion includes: (A) forming a hydrophobic insulating thin film on an insulating layer exposed by an open defective portion of the pattern portion and an insulating layer on the side of the open portion, (B) Modifying the hydrophobic insulating thin film formed on the open defective portion into a hydrophilic insulating thin film, (C) filling a conductive material into the open defective portion on which the hydrophilic insulating thin film is formed, and (D) sintering the conductive material. Is characterized in that it comprises a step.

Here, after the step (D), (E) may further comprise the step of removing the hydrophobic insulating thin film formed on the insulating layer on the side of the open defective portion.

Further, in the step (A), the hydrophobic insulating thin film is characterized in that it is performed by aerosol jet printing, inkjet printing, screen printing, micro-contact printing, or dispensing method.

In addition, in the step (B), the modification is characterized in that it is carried out by UV irradiation or laser irradiation.

Further, in the step (C), the filling of the conductive material is characterized in that it is carried out by aerosol jet printing, inkjet printing, screen printing, micro-contact printing, or dispensing method.

The conductive material may be a conductive metal ink or a conductive paste.

In the step (D), the sintering of the conductive material is performed by heat treatment or laser treatment.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to this, the terms or words used in this specification and claims should not be construed in the usual and dictionary sense, and the inventors will be required to properly define the concepts of terms in order to best describe their invention. On the basis of the principle that it can be interpreted as meaning and concept corresponding to the technical idea of the present invention.

According to the present invention, a hydrophilic insulating thin film is formed on an insulating layer exposed to an open defective part of a pattern part, and a repair part is formed by filling and sintering a conductive material into an open defective part, and thus a fine pattern can be coped with the repair process by manual operation. Provided is a repair structure and a repair method of a pattern portion in which repair yield can be increased.

In addition, the present invention forms a hydrophilic insulating thin film on the insulating layer exposed to the open defective portion of the pattern portion, and then fills and sinters the conductive material in the open defective portion to repair the open defective portion, thereby spreading the hydrophilic insulating thin film to the conductive material such as metal ink. The phenomenon can be minimized, and the conductive material is strongly adhered to the open defective part.

Accordingly, it is possible to improve the signal transmission reliability of the pattern portion formed by the conductive material by allowing the conductive material filled in the center region of the open defective portion to have a certain height.

The objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and the preferred embodiments associated with the accompanying drawings. In the present specification, in adding reference numerals to the components of each drawing, it should be noted that the same components as possible, even if displayed on different drawings have the same number as possible. In describing the present invention, when it is determined that the detailed description of the related known technology may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a cross-sectional view (FIG. 2A) and a plan view (FIG. 2B) for explaining a repair structure of a pattern portion according to a preferred embodiment of the present invention. Hereinafter, a repair structure of the pattern unit 104 according to the present exemplary embodiment will be described with reference to this.

As shown in FIG. 2, in the repair structure of the pattern portion according to the present embodiment, a hydrophilic insulating thin film 113 is formed on the insulating layer 102 exposed by the open defective portion 106 of the pattern portion 104. In this case, the disconnected pattern part 104 is connected by filling the open defective part 106 including the hydrophilic insulating thin film 113 with the conductive material 115 (see FIG. 6A) to form the repair part 116. It is done.

In the present embodiment, the material of the hydrophilic insulating thin film 113 may be a hydrophilic insulating resin. In addition, the hydrophilic insulating thin film 113 may be formed from an insulating resin that is converted into a hydrophilic insulating resin by undergoing a modification step in the hydrophobic insulating resin. The hydrophilic insulating resin thin film may be formed by forming a hydrophobic insulating resin thin film on the insulating layer 102 exposed by the open defective part 106 of the pattern part 104 and then modifying it using UV irradiation or laser irradiation.

In particular, it is preferable to form a hydrophobic polyimide thin film on the insulating layer 102 exposed by the open defective part 106 of the pattern part 104 and then modify it into a hydrophilic polyimide thin film using UV irradiation or laser irradiation.

In the present embodiment, the repair unit 116 is filled in the open defective part 106 to compensate for the open defect of the pattern part 104, for example, gold (Au), silver (Ag), and copper (Cu). Conductive metal inks or conductive pastes may be used.

3 is a cross-sectional view (FIG. 3A) and a plan view (FIG. 3B) for explaining a repair structure of a pattern portion according to another preferred embodiment of the present invention. The repair structure of the pattern portion according to the present embodiment is a hydrophobic insulating thin film 112 'formed on the insulating layer on the side of the open defective portion in addition to the insulating layer exposed by the open defective portion of the pattern portion (hereinafter referred to as "side hydrophobic insulating thin film"). It includes more.

Here, the side hydrophobic insulating thin film 112 ′ formed in the insulating layer on the side of the open defective part 106 is insulated exposed by the open defective part 106 in the process of forming the hydrophobic insulating thin film to include the open defective part 106. It is produced simultaneously with the hydrophobic insulating thin film 112 (see FIG. 8) formed in the layer 122. After the hydrophobic insulating thin film is formed to include the insulating layer 122 exposed by the open defective part 106, the UV irradiation method is applied only to the hydrophobic insulating thin film 112 formed in the insulating layer exposed by the open defective part 106. By modifying the hydrophilic insulating thin film 113 using a laser irradiation method, the side hydrophobic insulating thin film 112 'remains around the open defective part.

The lateral hydrophobic insulating thin film 112 ′ is filled with the conductive material 115 in the open defective part 106 having the hydrophilic insulating thin film 113 to form the repair part 116. It cooperates with the hydrophilic insulating thin film 113 so that it may not spread out of the open defective part 106. FIG. This is because the hydrophilic insulating thin film 113 uses the same property to enhance the adhesive force with the conductive material 115 to adhere the conductive material 115 to the open defective portion 106, and the side hydrophobic insulating thin film 112 'has the opposite property. The conductive material 115 is more strongly adhered to the open defective portion 106 by preventing the conductive material 115 from smearing out. That is, the hydrophilic insulating thin film 113 serves as an adhesive, and the side hydrophobic insulating thin film 112 'serves as a flat dam.

4 to 7 are process cross-sectional views (FIGS. 4A to 7A) and process plan views (FIGS. 4B to 7B) showing the repairing method of the pattern portion according to the preferred embodiment of the present invention in the process order.

Hereinafter, a repair method of a pattern unit according to a preferred embodiment of the present invention will be described with reference to the following.

First, as shown in FIG. 4 (FIGS. 4A and 4B), the hydrophobic insulating thin film 112 is formed in the insulating layer exposed by the open defective part 106 of the pattern part 104. As shown in FIG. 4A and 4B are sectional views and a plan view respectively showing this step.

In this case, the hydrophobic insulating film 112 may be, for example, aerosol jet printing, inkjet printing, screen printing, micro contact printing, dispensing, or the like. It can be formed by the method of. In FIG. 4A, the hydrophobic insulating thin film 112 is formed by the dispenser 201 for convenience of illustration.

Here, the hydrophobic insulating thin film 112 may be a hydrophobic insulating resin that can be modified hydrophobic to hydrophilic. Since the insulating layer 102 is hydrophobic, the hydrophobic insulating resin may be easily adhered to the insulating layer 102, and may be modified to be hydrophilic to adhere the conductive material 115 to the open defective part 106.

Next, as shown in FIG. 5 (FIGS. 5A and 5B), the hydrophobic insulating thin film 112 is modified into a hydrophilic insulating thin film 113. 5A and 5B are sectional views and a plan view respectively showing this step.

In this case, the hydrophobic insulating thin film 112 may be modified into the hydrophilic insulating thin film 113 by, for example, UV irradiation or laser irradiation. As shown in FIG. 5A, the hydrophobic insulating thin film 112 is irradiated with UV light or laser light using the UV irradiating device or the laser irradiating device 202. In more detail, the UV irradiation apparatus or the laser irradiation apparatus 202 and the hydrogen abstraction photoinitiator are used to generate active radicals on the surface of the polymer, and graft polymerize monomers having functional groups thereon. Surface modification is carried out by imparting functional groups to the. Accordingly, the hydrophobic insulating thin film 112 having a stable structure is modified to be hydrophilic.

For example, the hydrophobic insulating thin film 112 may be made of polyimide. The polyimide is only one example of a hydrophobic insulating resin that can be modified hydrophilically, and any hydrophobic insulating resin that can be hydrophilically modified can be hydrophobic insulating thin film 112. Can be used).

Next, as shown in FIG. 6 (FIGS. 6A and 6B), the conductive material 115 is filled in the open defective part 106 of the pattern part 104 in which the hydrophilic insulating thin film 113 was formed. 6A and 6B are sectional views and a plan view respectively showing this step.

In this case, the conductive material 115 is filled with the open defective part 106 by having conductivity, so that the open defect of the pattern part 104 can be compensated for. The conductive metal ink or the conductive paste is used. In this case, for example, gold (Au), silver (Ag), copper (Cu), or the like may be used as the conductive material 110.

In this case, the conductive material 115 may be, for example, aerosol jet printing, inkjet printing, screen printing, micro contact printing, dispensing, or the like. Can be performed by FIG. 6A illustrates that the conductive material 115 is filled by the dispenser 203 for convenience of illustration.

Here, when the filling height of the conductive material 115 is too small compared with the height of the pattern portion 104, the signal transmission reliability of the disconnected pattern portion 104 may not be guaranteed, so the conductive material 115 may have a predetermined height or more. It is preferred to be filled. For example, when the conductive material 115 is filled in the open defective part 106, the central area of the open defective part 106 is closer to the pattern part 104 than the area close to the pattern part 104 due to the smearing of the conductive material 115. When the height of the conductive material 115 filled in the central area of the open defective part 106 is too small, the signal transmission reliability may be weakened. According to the exemplary embodiment of the present invention, due to the wettability of the hydrophilic insulating thin film 113 and the hydrophilic conductive material 115, the conductive material 115 is prevented from spreading beyond the width of the pattern portion 104, thereby preventing the open defect part ( The conductive material 115 is formed at a predetermined height within the range of 106.

As illustrated in FIG. 7 (FIGS. 7A and 7B), the conductive material 115 filled in the open defective part 106 is sintered to form a repair part 116 connecting the disconnected pattern part 104. . 7A and 7B are sectional views and a plan view respectively showing this step.

This step is to burn off the organic material contained in the conductive material 115 to have a compact structure, and may be performed by heat-treating the conductive material 115 at a predetermined temperature or more or performing laser treatment.

That is, by removing the organic material contained in the conductive material 115, the conductivity is improved, so that the open phenomenon caused by the organic material can be removed.

8 to 12 are process plan views showing the repair method of the pattern portion according to another preferred embodiment of the present invention in the process order.

Hereinafter, a repair method of the pattern unit according to another preferred embodiment of the present invention will be described with reference to the following.

First, as shown in FIG. 8, the hydrophobic insulating thin film 112 and the side hydrophobic insulating thin film 112 are exposed to the insulating layer exposed by the open defective part 106 of the pattern part 104 and the insulating layer on the side of the open defective part. Form '). Except for including the side hydrophobic insulating thin film 112 'is the same as the method of forming the hydrophobic insulating thin film 112 described above with reference to FIGS. 4A and 4B.

Here, the side hydrophobic insulating thin film 112 ′ formed around the open defective part 106 may include the hydrophobic insulating thin film 112 in the process of forming the hydrophobic insulating thin film to include the insulating layer exposed by the open defective part 106. It was created at the same time. The hydrophobic insulating thin film is formed to include the insulating layer exposed by the open defective part 106 and then modified by using UV irradiation or laser irradiation only to the hydrophobic insulating part formed in the insulating layer exposed by the open defective part 106. Lateral hydrophobic insulating thin film 112 'remains around the defective portion.

The side hydrophobic insulating thin film 112 ′ is filled with the conductive material 115 in the open defective portion 106 to form the repair portion 116 so that the hydrophilic conductive material 115 is spread from the hydrophilic insulating thin film 113. Cooperate to avoid. That is, it serves to enhance adhesion between the hydrophilic conductive material 115 and the hydrophilic insulating thin film 113.

Next, as shown in FIG. 9, the hydrophobic insulating thin film 112 is modified into a hydrophilic insulating thin film 113. The modification of the hydrophobic insulating thin film 112 to the hydrophilic insulating thin film 113 may be performed by UV irradiation or laser irradiation as described above with reference to FIG. 4.

Here, the portion denatured into the hydrophilic insulating thin film 113 should not exceed the hydrophobic insulating thin film 122. That is, the side hydrophobic insulating thin film 112 'should not be irradiated and modified into a hydrophilic insulating thin film. Since the conductive material 115 having hydrophilicity is filled on the portion modified with the hydrophilic insulating thin film 113 to finally form the repair portion 116, the hydrophilic insulating thin film 113 is wider than the open defective portion 106. This is because the spreading of the conductive material may occur, which may cause problems such as short circuits and protrusions in the circuit pattern portion 104.

Next, as shown in FIG. 10, the conductive material 115 is filled in the open defective portion 106 of the pattern portion 104. The filling method and the filling material are the same as described above with reference to FIG.

Next, as illustrated in FIG. 11, the repair material 116 connecting the disconnected pattern part 104 is formed by sintering the conductive material 115 filled in the open defective part 106. The sintering method of the conductive material is the same as described above with reference to FIG.

Finally, as shown in FIG. 12, a step of removing the side hydrophobic insulating thin film 122 ′ may be further included. 11 is a plan view of the pattern portion in which the repair of the open defective portion is completed, in which the remaining hydrophobic insulating thin film 116 is removed.

Here, the hydrophobic insulating thin film 116 is removed by washing the pattern portion with a solvent. At this time, the solvent for washing may be a solvent that can be removed by dissolving the resin of the pattern portion. In particular, it is preferable to remove the hydrophobic insulating thin film 116 in which acetone remains.

Although the present invention has been described in detail through specific embodiments, this is for explaining the present invention in detail, and the repair structure and the repair method of the pattern portion according to the present invention are not limited thereto, and the technical field of the present invention is within the scope of the present invention. It will be apparent that modifications and improvements are possible by those skilled in the art.

All simple modifications and variations of the present invention fall within the scope of the present invention, and the specific scope of protection of the present invention will be apparent from the appended claims.

1 is a diagram illustrating a defect generated in a pattern portion.

2 is a cross-sectional view (FIG. 2A) and a plan view (FIG. 2B) for explaining a repair structure of a pattern portion according to a preferred embodiment of the present invention.

3 is a cross-sectional view (FIG. 3A) and a plan view (FIG. 3B) for explaining a repair structure of a pattern portion according to still another preferred embodiment of the present invention.

4 to 7 are process cross-sectional views (FIGS. 4A to 7A) and process plan views (FIGS. 4B to 7B) showing the repairing method of the pattern portion according to the preferred embodiment of the present invention in the process order.

8 to 12 are process plan views showing the repair method of the pattern portion according to another preferred embodiment of the present invention in the process order.

<Description of the symbols for the main parts of the drawings>

102: insulating layer 104: pattern portion

106: open defective part 112: hydrophobic insulating thin film

112 ': remaining hydrophobic insulating thin film 113: hydrophilic insulating thin film

115: conductive material 116: repair portion

201, 203: dispenser 202: UV or laser irradiation apparatus

Claims (17)

A hydrophilic insulating thin film formed on the insulating layer exposed by the open defective part of the pattern part; And The repair portion of the pattern portion including a repair portion formed by filling a conductive material in the hydrophilic insulating thin film of the open defective portion. The method according to claim 1, The repair structure of the pattern portion, further comprising a hydrophobic insulating thin film formed on the insulating layer on the side of the open defective portion. The method according to claim 1, The hydrophilic insulating thin film is a repair structure of the pattern portion, characterized in that formed of polyimide resin. The method according to claim 1, The conductive material is a repair structure of a pattern portion, characterized in that the conductive metal ink or conductive paste. (A) forming a hydrophobic insulating thin film on the insulating layer exposed by the open defective portion of the pattern portion; (B) modifying the hydrophobic insulating thin film into a hydrophilic insulating thin film; (C) filling a conductive material in the open defective portion in which the hydrophilic insulating thin film is formed; And (D) sintering the conductive material Repair method of the pattern portion comprising a. The method according to claim 5, In the step (A), The hydrophobic insulating thin film is a repair method of the pattern portion, characterized in that formed by aerosol jet printing, inkjet printing, screen printing, micro-contact printing, or dispensing method. The method according to claim 5, In the step (B), Repairing method of the pattern portion, characterized in that the modification is carried out by UV irradiation or laser irradiation. The method according to claim 5, In the step (C), Filling of the conductive material is a repair method of the pattern portion, characterized in that carried out by aerosol jet printing, inkjet printing, screen printing, micro-contact printing, or dispensing method. The method according to claim 5, The conductive material is a repair method of a pattern portion, characterized in that the conductive metal ink or conductive paste. The method according to claim 5, In the step (D), The sintering of the conductive material is performed by heat treatment or laser treatment. (A) forming a hydrophobic insulating thin film on the insulating layer exposed by the open defective portion of the pattern portion and the insulating layer on the side of the open portion; (B) modifying the hydrophobic insulating thin film formed on the open defective portion into a hydrophilic insulating thin film; (C) filling a conductive material in the open defective portion in which the hydrophilic insulating thin film is formed; And (D) sintering the conductive material        Repair method of the pattern portion comprising a. The method of claim 11, After the step (D), (E) repairing the pattern portion, characterized in that it further comprises the step of removing the hydrophobic insulating thin film formed on the insulating layer on the side of the open defective portion. The method of claim 11, In the step (A), The hydrophobic insulating thin film is repairing method of the pattern portion, characterized in that performed by aerosol jet printing, inkjet printing, screen printing, micro-contact printing, or dispensing method. The method of claim 11, In the step (B), Repairing method of the pattern portion, characterized in that the modification is carried out by UV irradiation or laser irradiation. The method of claim 11, In the step (C), Filling of the conductive material is a repair method of the pattern portion, characterized in that carried out by aerosol jet printing, inkjet printing, screen printing, micro-contact printing, or dispensing method. The method of claim 11, The conductive material is a repair method of a pattern portion, characterized in that the conductive metal ink or conductive paste. The method of claim 11, In the step (D), The sintering of the conductive material is performed by heat treatment or laser treatment.

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