KR20100127447A - Bulb type led lamp - Google Patents

Bulb type led lamp Download PDF

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Publication number
KR20100127447A
KR20100127447A KR1020090045890A KR20090045890A KR20100127447A KR 20100127447 A KR20100127447 A KR 20100127447A KR 1020090045890 A KR1020090045890 A KR 1020090045890A KR 20090045890 A KR20090045890 A KR 20090045890A KR 20100127447 A KR20100127447 A KR 20100127447A
Authority
KR
South Korea
Prior art keywords
circuit board
driving circuit
heat sink
led lamp
space
Prior art date
Application number
KR1020090045890A
Other languages
Korean (ko)
Inventor
남기호
Original Assignee
테크룩스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 테크룩스 주식회사 filed Critical 테크룩스 주식회사
Priority to KR1020090045890A priority Critical patent/KR20100127447A/en
Publication of KR20100127447A publication Critical patent/KR20100127447A/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/235—Details of bases or caps, i.e. the parts that connect the light source to a fitting; Arrangement of components within bases or caps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V27/00—Cable-stowing arrangements structurally associated with lighting devices, e.g. reels 
    • F21V27/02—Cable inlets
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The bulb type LED lamp 1000 according to an embodiment of the present invention has a heat sink 500 in which a through space 580 is formed along its length direction. The bulb type LED lamp 1000 provides a driving circuit board coupling body 700 to receive and arrange the driving circuit board 100 in the through space 580 of the heat sink 500. LED board 600 is firmly coupled to the front surface of the heat sink (500).

Description

Bulb type LED lamp {Bulb type LED lamp}

The present invention relates to a bulb type LED lamp, and more particularly to a bulb type LED lamp that is firmly assembled and reduced in volume in a simple configuration.

Currently, LED lamps are in the spotlight as a new lighting means. In this regard, it would be desirable if LED lamps had a shape similar to that of a conventional incandescent lamp and could be used as it is mounted in a conventional incandescent lamp socket. This is because in this case, the infrastructure having a conventional incandescent light bulb socket can be used as it is. For example, in the case of a living room lamp (현재) currently used incandescent light bulbs simply replace the incandescent light bulbs, such as to mount the LED lamp.

Such bulb type LED lamps require a driving circuit to convert the AC power input when mounted in the incandescent lamp socket into a direct current. The structure of the sieve is necessary.

In this connection, it would be desirable if the drive circuit and the heat sink could be placed in one integrated space to reduce the volume as a whole. It would also be desirable if the assembly structure could be combined simply and securely. The present invention satisfies this request.

It is an object of the present invention to provide a bulb-type LED lamp that can be firmly assembled with a simple structure and that the heat sink and the driving circuit are present in an integrated space, thereby greatly reducing the volume as a whole.

In accordance with the object of the present invention, the present invention is a heat sink and a through space formed along the longitudinal direction; In order to accommodate and couple a drive circuit board formed with a drive circuit for driving the LED in the through space of the heat sink, a cover portion covering the rear of the through space of the heat sink, the coupling portion of the heat sink; A driving circuit board coupling body which extends forward from the cover part and is led into the through space of the heat sink and includes a driving circuit board receiving body for receiving the driving circuit board; An LED board disposed in contact with the front surface of the heat sink and mounted with a plurality of LED elements; It provides a bulb-type LED lamp comprising a light-transmitter coupled to the radiator in front of the radiator.

According to the present invention, a screw coupling hole is formed on the front surface of the drive circuit board receptor, and a corresponding screw coupling hole is formed on the LED board corresponding to the screw coupling hole formed on the front surface of the drive circuit board receptor. It is preferable that the LED board is coupled to the driving circuit board receiving member accommodated in the through space of the heat sink by coupling the screw member through the corresponding screw coupling hole.

According to the present invention, it is preferable that the bulb type LED lamp further includes a socket coupling portion coupled to the socket coupler coupled to the incandescent bulb socket as disposed behind the radiator.

In the embodiment of the present invention, the driving circuit board receptors are formed to face each other, and comprises two guide rails each having a groove portion into which the driving circuit board is introduced along its length direction.

According to an embodiment of the present invention, it is preferable that the screw coupling holes are formed at the ends of the two guide rails, respectively.

According to the present invention, the coupling portion of the driving circuit board coupling body portion with the heat dissipation portion is formed to extend forward from the side of the cover portion is a screw coupling portion formed around the outer periphery, corresponding to the screw coupling portion It is preferable that a corresponding screw portion is formed on the inner surface of the through space of the heat sink.

In an embodiment of the present invention, the socket coupling portion is integrally formed at the rear of the cover portion.

In the exemplary embodiment of the present invention, the cover part and the socket coupling part penetrate each other so that a through part is formed so that the power terminal of the driving circuit board is led through the through part.

According to an embodiment of the present invention, it is preferable that a protrusion is formed in the groove of the guide rail, and the driving circuit board is formed with a receiving groove accommodating the protrusion in its side.

According to the present invention, a through space is formed in the heat sink, and a driving circuit board coupling body is provided to accommodate the driving circuit board in the through space of the heat sink. In addition, by placing the LED board in contact with the front surface of the heat sink and by coupling with the drive circuit board coupling body it is firmly coupled to the LED board in contact with the heat sink. Accordingly, a simple structure enables a robust assembly, and the driving circuit board is accommodated inside the heat sink without taking up a separate space, thereby greatly reducing the total volume.

Preferred embodiments of the present invention will now be described with reference to the accompanying drawings.

1 is a view showing the appearance of the bulb-type LED lamp 1000 according to an embodiment of the present invention.

First, the radiator 500 is provided, and the light transmitting body 800 is coupled to the radiator 500 by the coupling ring 200 in front of the radiator 500. The light transmitting body 800 has a hemispherical shape, but is not limited thereto.

It is seen that the LED board 600 is disposed inside the light emitting body 800. The LED board 600 is a plurality of LED elements (not shown) is mounted on the front. That is, the LED element emits light to form an illumination. In this regard, the light transmitting body 800 is transparent or semitransparent, and is preferably made of a light diffusing resin made by adding a light diffusing agent to a synthetic resin. As a result, the light emitted from the LED element is diffusely reflected while passing through the light-transmitting member 800 to enable illumination of uniform brightness.

The LED board 600 is formed with screw coupling holes 680 and 680, which are formed on the front surface of the driving circuit board receptor formed in front of the cover portion 710 of the driving circuit board coupling body 700 to be described later. Corresponding screw coupling holes corresponding to the screw coupling holes 748 and 748 '.

The heat dissipation member 500 is for dissipating heat from the LED element and dissipating it to the outside. In this embodiment, a plurality of heat dissipating ribs 507 are formed around the outer circumference thereof. As will be described later, the LED board 600 is placed in contact with the front surface 501 of the heat sink 500, the heat of the LED board 600 is transferred to the heat sink 500 is discharged to the outside. (See Fig. 5)

The socket coupler 300 is coupled to the rear side of the radiator 500. The socket coupler 300 is fitted into the incandescent lamp socket.

2 and 3 are exploded perspective view showing the internal structure of the bulb type LED lamp 1000 according to an embodiment of the present invention, Figure 5 is a bulb type LED lamp 1000 according to an embodiment of the present invention. Is a cross-sectional view of.

Referring to these drawings, first, the heat dissipation member 500 has a through space 580 formed along a longitudinal direction thereof.

According to the present invention, a driving circuit board coupling body 700 is provided to couple the driving circuit board 100 to the inside of the through space 580 of the heat dissipation member 500 and to connect the LED board 600 to the above. In contact with the front surface of the heat sink 500 is coupled. The driving circuit board 100 is formed with a driving circuit for driving the LED.

First, according to the present invention, the driving circuit board coupling body 700 has a cover portion 710 covering the rear of the through space 580 of the heat sink 500.

In addition, a driving circuit board receptor is formed in front of the cover part 710. The driving circuit board receiver accommodates the driving circuit board 100 and is inserted into the through space 580 of the heat sink 500. A screw coupling hole is formed on the front surface of the driving circuit board receptor. These screw coupling holes correspond to the corresponding screw coupling holes 680 and 680 of the LED board 600 described above.

In this embodiment, the driving circuit board receptor has two guide rails 740, 740 ′ extending forward from the cover part 710. These guide rails 740 and 740 'face each other, and grooves 747 and 747' are formed along the longitudinal direction thereof. The driving circuit board 100 is coupled by pushing the driving circuit board 100 into the grooves 747 and 747 '.

Referring to FIG. 4, protrusions 749 and 749 ′ are formed in grooves 747 and 747 ′ of the guide rails 740 and 740 ′, and the driving circuit board 100 has the protrusions on the side thereof. It is preferable that accommodation grooves 109 and 109 'are formed to accommodate 749 and 749'.

Accordingly, when the driving circuit board 100 is pushed into the grooves 747 and 747 'of the guide rails 740 and 740', the protrusions 749 and 749 'and the receiving groove 109 are pushed. As the 109 'is coupled, the driving circuit board 100 is firmly coupled to the grooves 747 and 747' of the guide rails 740 and 740 '.

Bundles 74 and 74 'are formed at respective ends of the grooves 740 and 740' of the guide rails 740 and 740 ', and the screws are attached to the bundles 74 and 74'. Coupling holes 748 and 748 'are formed.

The drive circuit board coupling body 700 also has a coupling portion with the radiator to be coupled to the radiator 500. In this embodiment, the coupling portion with the heat sink is a screw coupling portion 758 extending forward from the side of the cover portion 710. The screw coupling portion 750 has a screw portion 758 formed around the outer circumference thereof, and a corresponding screw portion 558 is formed on an inner surface of the through space 580 of the heat dissipator 500 corresponding to the screw coupling portion 750. ) Is formed.

Accordingly, the screw portion 758 of the screw coupling portion 750 of the cover portion 710 and the corresponding screw portion 558 of the inner surface of the through space 580 of the heat sink 500 are coupled to each other to couple the driving circuit board. Body 700 is coupled to the radiator 500.

According to the above-described structure, the driving circuit board 100 is accommodated between the guide rails 740 and 740 'formed at the front of the cover portion 710, and screwing holes 748 at the end of each guide rail. A driving circuit board receiver having a 748 'formed therein is introduced into the through space 580 of the heat dissipation member 500, and the screw 758 of the screwing portion 750 of the cover portion 710 and the heat dissipation. Corresponding screw portions 558 on the inner surface of the through space 580 of the sieve 500 are coupled to each other. Then, the driving circuit board coupling body 700 is coupled to the radiator 500 so as to accommodate the driving circuit board 100 in the through space 580. In this case, the screw coupling holes 748 and 748 ′ of the ends of the guide rails 740 and 740 ′ correspond to the corresponding screw coupling holes 680 and 680 of the LED board 600.

The LED board 680 is disposed in contact with the front surface 501 of the heat sink 500. According to the present embodiment, the heat dissipation lip 507 of the heat sink 501 is the heat sink 500 The protrusion 560 is formed to protrude from the front surface 501 of the front surface 501 is to form a mounting surface from the inside of the protrusion 560.

In this way, the LED board 600 is placed in contact with the front surface 501 of the heat dissipation member 500 constituting the mounting surface, at this time, the screw coupling hole 748 of the drive circuit board coupling body 700 ( 748 ′ and the corresponding screw coupling holes 680 and 680 of the LED board 600 correspond to each other. A screw member (not shown) is coupled through the through holes 748, 680, 748 ′ and 680, so that the LED board 600 contacts the front surface of the heat sink 500. It is coupled to the heat sink 500.

The above-described light transmitting body 800 is coupled to the front of the heat sink 500. Referring to FIG. 5, a side protrusion part 810 is formed at the side of the light emitting body 800, and the Grooves 510 are formed on the side surfaces thereof, and coupling rings 500 are inserted therebetween so that the radiator 500 and the light transmitting body 800 are coupled to each other. At this time, the coupling groove 820 is formed on the inner surface of the light-transmitting member 800 is fitted with a rubber ring 20 for waterproof or moisture proof.

According to the present invention, the socket coupling portion is disposed at the rear of the heat sink 500. The socket coupling portion is coupled to the socket coupler 300 is coupled to the incandescent bulb socket.

In this embodiment, the socket coupling portion 730 is integrally formed at the rear of the cover portion 710.

In addition, the cover part 710 and the socket coupling part 730 penetrate each other, and a through part 708 is formed, and the power terminal part 105 of the driving circuit board 100 is the through part 708. Is being imported through). Referring to FIG. 4, wires are drawn from the power supply terminal 105 of the driving circuit board 100 and connected to the socket coupling part 730.

As described above, according to the present invention, the through space 580 is formed in the heat dissipator 500, and the driving circuit board coupling body 700 is provided to thereby drive the driving circuit board 100 to the heat dissipation body 500. It is placed in the through space 580 of the). In addition, by placing the LED board 600 in contact with the front surface 501 of the heat dissipator 500 and by engaging with the drive circuit board coupling body 700 is coupled to the LED board 600 in contact with the heat sink 500 Let's do it.

Accordingly, a simple structure enables a robust assembly, and the driving circuit board is accommodated inside the heat sink without taking up a separate space, thereby greatly reducing the total volume.

It will be appreciated that this has been achieved the object of the present invention. Although the invention has been described with reference to the examples, the scope of rights is not limited thereto and is defined by the following claims.

1 is a view showing the appearance of a bulb-type LED lamp according to an embodiment of the present invention;

2 and 3 are exploded perspective view showing the internal structure of the bulb-type LED lamp according to an embodiment of the present invention;

4 is a view showing in detail the structure of the drive circuit board receptor formed in front of the cover in the bulb type LED lamp according to an embodiment of the present invention;

5 is a cross-sectional view of the bulb type LED lamp according to an embodiment of the present invention.

Claims (9)

(a) a heat sink having a through space formed along the longitudinal direction thereof; (b) receiving and coupling a driving circuit board having a driving circuit for driving an LED in a through space of the heat sink; (b1) a cover part covering a rear side of the through space of the heat sink; (b2) a coupling portion with the heat sink, (b3) a driving circuit board coupling body which extends forward from the cover part and is inserted into the through space of the heat sink and includes a driving circuit board receiving body for receiving the driving circuit board; (c) an LED board disposed in contact with the front surface of the heat sink and mounted with a plurality of LED elements; (d) a bulb type LED lamp comprising a light transmitting body coupled to the heat dissipating body in front of the heat dissipating body. The method of claim 1, A screw coupling hole is formed on the front surface of the drive circuit board receptor, and a corresponding screw coupling hole corresponding to a screw coupling hole formed on the front surface of the drive circuit board receptor is formed on the LED board to penetrate the screw coupling hole and the corresponding screw coupling hole. The LED board of the bulb type, characterized in that the LED board is coupled to the drive circuit board receptor accommodated in the through space of the heat sink. The method according to claim 1 or 2, Bulb type LED lamp is characterized in that it further comprises a socket coupling portion coupled to the socket coupler coupled to the incandescent bulb socket as disposed behind the radiator. The method according to claim 1 or 2, The LED lamp of the bulb type, characterized in that the drive circuit board receptors are facing each other and formed with two guide rails in which the driving circuit board is drawn along the longitudinal direction thereof. The method of claim 4, wherein Bulb type LED lamp, characterized in that the screw coupling hole is formed at each end of the two guide rails. The method according to claim 1 or 2, The coupling part of the driving circuit board coupling body part and the radiator body extends forward from the side part of the cover part, and is a screw coupling part having a threaded part surrounding the outer circumference thereof, and a through space of the radiator corresponding to the screw coupling part. Bulb type LED lamp, characterized in that the corresponding threaded portion formed on the inner surface. The method of claim 3, Bulb-type LED lamp, characterized in that the socket coupling portion is formed integrally with the cover unit. The method of claim 7, wherein Bulb type LED lamp, characterized in that the through and the socket coupling portion penetrates through each other so that the power terminal of the driving circuit board is led through the through portion. The method of claim 4, wherein Bulb type LED lamp, characterized in that the projection portion is formed in the groove portion of the guide rail and the driving circuit board is provided with a receiving groove for receiving the projection portion on its side.
KR1020090045890A 2009-05-26 2009-05-26 Bulb type led lamp KR20100127447A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020090045890A KR20100127447A (en) 2009-05-26 2009-05-26 Bulb type led lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090045890A KR20100127447A (en) 2009-05-26 2009-05-26 Bulb type led lamp

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KR20100127447A true KR20100127447A (en) 2010-12-06

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103528025A (en) * 2013-10-29 2014-01-22 立达信绿色照明股份有限公司 Lighting lamp buckling structure
US8905580B2 (en) 2011-09-02 2014-12-09 Lg Innotek Co., Ltd. Lighting device
US9127827B2 (en) 2012-01-31 2015-09-08 Lg Innotek Co., Ltd. Lighting device
USRE47425E1 (en) 2012-05-07 2019-06-04 Lg Innotek Co., Ltd. Lighting device having reflectors for indirect light emission

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8905580B2 (en) 2011-09-02 2014-12-09 Lg Innotek Co., Ltd. Lighting device
US9353914B2 (en) 2011-09-02 2016-05-31 Lg Innotek Co., Ltd. Lighting device
US9719671B2 (en) 2011-09-02 2017-08-01 Lg Innotek Co., Ltd. Lighting device
US9970644B2 (en) 2011-09-02 2018-05-15 Lg Innotek Co., Ltd. Lighting device
US10260724B2 (en) 2011-09-02 2019-04-16 Lg Innotek Co., Ltd. Lighting device
US9127827B2 (en) 2012-01-31 2015-09-08 Lg Innotek Co., Ltd. Lighting device
US9303822B2 (en) 2012-01-31 2016-04-05 Lg Innotek Co., Ltd. Lighting device
US9557010B2 (en) 2012-01-31 2017-01-31 Lg Innotek Co., Ltd. Lighting device
USRE47425E1 (en) 2012-05-07 2019-06-04 Lg Innotek Co., Ltd. Lighting device having reflectors for indirect light emission
CN103528025A (en) * 2013-10-29 2014-01-22 立达信绿色照明股份有限公司 Lighting lamp buckling structure

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