KR20100122736A - Method of fabricating of flexible circuit board for inkjet cartridge, flexible circuit board for inkjet cartridge of thereby and method for fabricating of inkjet cartridge - Google Patents

Abstract

PURPOSE: A manufacturing method of a PCB for a ink jet cartridge using surface modifying of a protection layer and/or base film and the PCB for the ink jet cartridge which is manufactured by the same and a manufacturing method of an ink jet cartridge are provided to surface-modifying the other side of the protection layer and/or base film through wet etch process, thereby maintaining a sealing function for long term. CONSTITUTION: A conductive pattern(130) is formed on one side of the base film(100). A protective layer(150) covers a part of the conductive pattern. A surface of the protective layer is reformed through the wet etch process. The wet etch process uses etchant including compound which includes one or two or more among the permanganate compound and hydroxide. The other side of the base film is reformed through the wet etch process with the protective layer surface at the same time.

Description

Method of manufacturing flexible circuit board for inkjet cartridge, method for manufacturing flexible circuit board for inkjet cartridge and inkjet cartridge manufactured by the same of inkjet cartridge}

The present invention relates to a method for producing a flexible circuit board for an inkjet cartridge, a method for producing a flexible circuit board for an inkjet cartridge and an inkjet cartridge produced thereby.

The inkjet cartridge refers to an apparatus for printing a predetermined image on a print medium by discharging the ink stored therein to the outside when an electrical signal is input from the outside. At this time, the inkjet cartridge is electrically connected to the flexible circuit board for the inkjet cartridge so that an electrical signal input from the outside is transmitted to the ink ejecting portion of the inkjet cartridge. Therefore, when an electrical signal output from the outside of a computer or the like is input to the flexible circuit board, the signal is transmitted to the ink ejecting portion through the flexible circuit board. Correspondingly, the ink ejecting unit may eject the ink stored therein according to the electric signal to the outside.

In general, the electrical connection between the flexible circuit board for the inkjet cartridge and the ink ejecting portion is sealed and protected by a material such as a sealing material. At this time, the adhesive force between the flexible circuit board and the ink ejecting portion is weak and separated from each other so that normal operation of the inkjet cartridge is achieved. There was a difficult case.

The problem to be solved by the present invention is to provide a method for producing a flexible circuit board for an inkjet cartridge with improved adhesion to the sealing material.

Another object of the present invention is to provide a flexible circuit board for an inkjet cartridge having improved adhesion to a sealing material.

Another problem to be solved by the present invention relates to a method of manufacturing an inkjet cartridge with improved adhesion to the sealing material.

Problems to be solved by the present invention are not limited to the above-mentioned problems, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

In the method of manufacturing a flexible circuit board for an inkjet cartridge according to an embodiment of the present invention for solving the above problems, a conductive pattern is formed on one surface of a base film, and a protective layer covering a part of the conductive pattern is formed. And performing a wet etching process on the protective layer to modify the entire surface of the protective layer surface.

According to one or more exemplary embodiments, a flexible circuit board for an inkjet cartridge includes a base film, a conductive pattern formed on one surface of the base film, and a protective layer covering a portion of the conductive pattern. However, the front surface of the protective layer surface includes a modified through a wet etching process.

According to another aspect of the present invention, there is provided a method of manufacturing an inkjet cartridge, in which a device hole is formed on a base film and electrically connected to a device disposed in the device hole on one surface of the base film. A conductive pattern including a terminal portion to be connected is formed, a portion of the conductive pattern is covered to form a protective layer that exposes the terminal portion, and a wet etching process is performed on the protective layer to modify the entire surface of the protective layer surface. And electrically connect at least one end of the ink ejection portion disposed in the ink cartridge body for storing ink and the terminal portion, wherein the ink ejection portion corresponds to the device hole, at least one end of the terminal portion, the ink ejection portion, and Forming a seal covering a portion of the modified protective layer surface. .

Other specific details of the invention are included in the detailed description and drawings.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various different forms, only the embodiments are to make the disclosure of the present invention complete, and the general knowledge in the art to which the present invention belongs It is provided to fully convey the scope of the invention to those skilled in the art, and the present invention is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

Although the first, second, etc. are used to describe various elements, components and / or sections, these elements, components and / or sections are of course not limited by these terms. These terms are only used to distinguish one element, component or section from another element, component or section. Therefore, the first device, the first component, or the first section mentioned below may be a second device, a second component, or a second section within the technical spirit of the present invention.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. As used herein, the terms "comprises" and / or "made of" means that a component, step, operation, and / or element may be embodied in one or more other components, steps, operations, and / And does not exclude the presence or addition thereof.

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used in a sense that can be commonly understood by those skilled in the art. In addition, the terms defined in the commonly used dictionaries are not ideally or excessively interpreted unless they are specifically defined clearly.

Hereinafter, a flexible circuit board for an inkjet cartridge and a flexible circuit board for an inkjet cartridge manufactured by the same will be described with reference to FIGS. 1 to 5.

1 and 2A are plan views of intermediate structures for explaining a method of manufacturing a flexible circuit board for an inkjet cartridge according to an embodiment of the present invention. FIG. 2B is a cross-sectional view taken along line II-II 'of FIG. 2A. 3A is a plan view of an intermediate structure for explaining a method of manufacturing a flexible circuit board for an inkjet cartridge according to an embodiment of the present invention. FIG. 3B is a cross-sectional view taken along line III-III ′ of FIG. 3A. 4A is a plan view of an intermediate structure for explaining a method of manufacturing a flexible circuit board for an inkjet cartridge according to an embodiment of the present invention. FIG. 4B is a cross-sectional view taken along line IV-IV ′ of FIG. 4A. 5 is a plan view of an exemplary method of the wet etching process of FIGS. 4A and 4B.

First, referring to FIGS. 1 and 2B, the conductive pattern 130 is formed on one surface of the base film 100.

As shown in FIG. 1, before forming the conductive pattern 130, the device hole 120 may be formed in the base film 100.

The base film 100 may be made of, for example, an insulating material having a thickness of 10 to 200 μm. The base film 100 is, for example, polyimide (PI), polyester (PE; polyester), polyethylene terephthalate (PET), and polyethylene naphthalene (PEN), polycarbonate (PC). polycarbonate) and the like. However, the thickness and the material of the above-described base film 100 are only examples, and the scope of the present invention is not limited thereto.

In some cases, the pattern region 110 in which the conductive pattern 130 is formed in the base film 100 may be defined. In the base film 100, for example, a punching process may be used to define the device hole 120. At this time, as needed, a plurality of positioning holes 125 may be formed at either edge or both edges of the base film 100.

The device holes 120 may be disposed so as to correspond to, for example, the ink ejecting portion of the inkjet cartridge body described later. That is, the ink discharged from the ink ejecting portion of the inkjet cartridge body may be ejected through the device hole 120.

As shown in FIGS. 2A and 2B, the conductive pattern 130 is formed on one surface of the base film 100.

As shown in FIG. 2A, a plurality of pads 140 are formed on the base film 100, and the conductive patterns 130 extending to both sides of the device hole 120 are formed in contact with the plurality of pads 140. can do. In this case, the conductive pattern 130 is not shown in the drawing, but where a metal layer (not shown) is formed on one surface of the base film 100 and patterned by etching or plating to pattern the metal layer. It may include a creative or semi-additive method, and also a printing method for printing a conductive material.

The plurality of pads 140 may be formed of a highly conductive material, for example, a metal such as gold, aluminum, or copper. The plurality of pads 140 formed on the base film 100 may receive a signal transmitted from the outside, and the signal may be transmitted to the ink discharge unit to be described later through the conductive pattern 130.

The conductive pattern 130 may be formed at both sides of the device hole 120. The conductive pattern 130 may also be formed of a highly conductive material, for example, a metal such as gold, aluminum, or copper. Although not shown, a plating layer of tin (Sn), nickel, gold, or solder may be formed on the surface of the conductive pattern 130.

As shown in FIG. 2B, conductive patterns 130 are formed at both sides of the device holes 120, and the terminal portions 130a of the conductive patterns 130 are formed on the surface of the base film 100. 120) to protrude into. In this case, the terminal unit 130a may be electrically connected to the ink discharge unit to be described later.

The conductive pattern 130 is connected between, for example, a driving printed circuit board (not shown) and an ink ejecting portion, and transmits a signal for controlling ink ejection, for example, from the driving printed circuit board to the ink ejecting portion. Can play a role.

3A and 3B, a protective layer 150 covering a portion of the conductive pattern 130 is formed.

As shown in FIG. 3A, the protective layer 150 may be formed to cover a portion of the conductive pattern 130, except for the terminal portion 130a protruding into the device hole 120. That is, the protective layer 150 is formed on the base film 100 on which the conductive pattern 130 is formed, but one end of the conductive pattern 120 protruding into the device hole 120, that is, the terminal portion 130a is exposed. Can be formed. At this time, the terminal portion 130a is electrically connected to the ink discharge portion to be disposed to correspond to the device hole 120 as described above.

The protective layer 150 may serve to protect the conductive pattern 130 from an external impact or a corrosive material, and may be formed of, for example, a solder resist or a polymer film, but is not limited thereto. .

4A and 4B, a wet etching process is performed on the protective layer 150 to modify part or the entire surface of the protective layer 150.

More specifically, permanganate compounds including permanganate ions (MnO ₄ −) such as sodium permanganate (NaMnO ₄ ) or potassium permanganate (KMnO ₄ ) and hydroxide ions (OH— such as sodium hydroxide (NaOH) or potassium hydroxide (KOH)). The entire surface of the surface of the protective layer 150 may be modified by using an etchant including a compound including any one or two or more of hydroxides including a). That is, the surface of the protective layer 150 may be roughened by etching the surface of the protective layer 150 with an etchant including a permanganic acid solution.

Accordingly, as shown in FIG. 4B, the modified surface 150a of the protective layer 150 may be formed. On the other hand, only part of the area to be modified can be selected as necessary. At this time, the surface to be modified is exposed, and the other part is formed by treating a resist, and then the resist is peeled off (not shown).

The modified surface 150a of the protective layer 150 has improved adhesion than the protective layer 150 before being modified. In other words, the second adhesive force of the modified protective layer surface 150a is greater than the first adhesive force of the protective layer 150 surface before modification.

Table 1 Comparison of stress values on protective layer surface

Before the wet etching process After wet etching process After ion beam treatment Stress value (kg / mm ² ) 7-8 16 15

As shown in Table 1, the surface of the protective layer 150 before the wet etching process has a stress value of about 7-8 kg / mm ² , whereas the surface of the protective layer 150 after the wet etching process is about 16 It was found to have a stress value of kg / mm ² . Furthermore, when the surface of the protective layer 150 is roughened by ion beam treatment, the surface of the protective layer 150 has a stress value of about 15 kg / mm ² .

Here, the stress may refer to the resistance of the material to the load, and more specifically, the degree of adhesion between the protective layer 150 and the sealant to be described later. That is, as the stress value is higher, it may mean that the adhesion degree between the protective layer 150 and the sealing material is stronger.

Of course, the stress value on the surface of the protective layer 150 may vary slightly depending on the process conditions such as the concentration of the etchant, but as a result, when the wet etching process is performed, the stress value on the surface of the protective layer 150 is about 228%. ~ 200% improved. This is much better than the ion beam treatment with 214% to 186% improvement.

Further, when applying the ion beam treatment, it is necessary to generate an ion beam using a predetermined ion source, and irradiate the ion beam to a predetermined region of the flexible circuit board. Therefore, not only is it relatively expensive to carry out the ion beam treatment, but also the process is complicated. In contrast, when the wet etching process is applied, the process is much simpler in that the etching solution is treated to the flexible circuit board under predetermined conditions. Therefore, modifying the surface of the protective layer 150 using a wet etching process may be more efficient in terms of cost reduction and process simplification.

At this time, as shown in Figure 4b, the front surface of the other surface of the base film 100 can be modified together. In other words, an exposed surface that is not in contact with the conductive pattern 130 of the protective layer 150 formed on the conductive pattern 130 and the lower portion of the conductive pattern 130 based on the conductive pattern 130. The entire surface of the exposed surface that is not in contact with the conductive pattern 130 of the base film 100 may be modified at the same time.

As illustrated in FIG. 5, the wet etching process may use a dipping process of dipping a base film 100 having a conductive pattern 130 and a protective layer 150, that is, a flexible circuit board 10 in an etchant. have.

As shown in the drawing, the etchant 210 including the permanganic acid solution may be placed in the chemical solution tank 200, and the flexible circuit board 10 to be subjected to the surface treatment may be passed. In addition, although not shown in the drawings, an etching supply nozzle (not shown) may be formed to allow the etching liquid 210 to move smoothly. However, this may correspond to one embodiment and the wet etching process may be applied to the flexible circuit board 10 in another manner.

Furthermore, as shown in FIG. 5, when the flexible circuit board 10 is treated through a dipping process, the other side of the base film, that is, the opposite side of the base film on which the conductive pattern is formed, together with the entire surface of the exposed protective layer surface The front side of the face can be modified simultaneously. Here, the modification may include that the adhesion of the protective layer surface and / or the other surface of the base film is improved as compared with before the wet etching process. This can be determined through the stress values described above.

A method of manufacturing a flexible circuit board for an inkjet cartridge according to an embodiment of the present invention, and a flexible circuit board for an inkjet cartridge manufactured by the same, use a wet etching process, for example, an etching solution containing permanganic acid and / or a protective layer surface. By modifying the other surface of the base film, the adhesive force with the sealing material can be improved. Furthermore, by modifying the surface of the protective layer and / or the other surface of the base film by a wet etching process, which is easier to process, the manufacturing cost may be reduced and the process may be simplified.

Hereinafter, a method of manufacturing an inkjet cartridge according to an embodiment of the present invention will be described with reference to FIGS. 1 to 6B. 6A is a plan view of an intermediate structure for explaining a method of manufacturing an inkjet cartridge according to an embodiment of the present invention. FIG. 6B is a cross-sectional view taken along line VI-VI 'of FIG. 6A.

The method of manufacturing an inkjet cartridge according to an embodiment of the present invention includes a process of combining the inkjet cartridge body and the flexible circuit board for the inkjet cartridge described above. Therefore, the detailed description of the process of manufacturing the flexible circuit board for the inkjet cartridge is omitted or simplified.

1 to 6B, a device, for example, an inkjet cartridge body, to form a device hole 120 on a base film 100 and be disposed in the device hole 120 on one surface of the base film 100. The conductive pattern 130 including the terminal portion 130a electrically connected to the 300 is formed. Subsequently, a portion of the conductive pattern 130 is covered to form a protective layer 150 exposing the terminal portion 130a, and a wet etching process is performed on the protective layer 150 to cover the entire surface of the protective layer 150. Reform. Subsequently, at least one end of the ink ejecting portion 330 disposed in the ink cartridge body 300 storing ink is electrically connected to the terminal portion 130a, so that the ink ejecting portion 330 corresponds to the device hole 120. To place. Subsequently, a sealing member 410 is formed to cover the terminal portion 130a, at least one end of the ink discharge portion 330, and a portion of the modified protective layer 150 surface 151.

More specifically, as shown in FIG. 6A, one surface of the inkjet cartridge body 300 includes an ink ejecting part 330 for ejecting ink stored in the inkjet cartridge body 300 to the outside. In this case, the ink ejection unit 300 may include a plurality of pads 320 for receiving and transmitting an electrical signal from the outside, and an ink ejection hole 310 that is a passage through which ink stored therein is ejected.

The plurality of pads 320 are electrically connected to the flexible circuit board 10 for the inkjet cartridge, and receive the electrical signal transmitted through the flexible circuit board 10 for the inkjet cartridge, and the ink is injected through the ink discharge hole 310. Can be adjusted.

The sealing material 410 may serve to protect the area where the ink discharge part 310 and the terminal part 130a of the flexible circuit board 10 are electrically connected from the outside. In this case, the sealing material 410 may be formed by applying a material containing a photosensitive polymer or a thermosetting polymer to the upper surface of the flexible circuit board 10, and curing the applied portion by UV or heat. For example, the thermosetting polymer material may be an epoxy, acrylate or imide polymer.

At this time, as described above, since the surface 151 of the protective layer 150 and / or the other surface 101 of the base film 100 were modified by wet etching, the adhesive force with the sealant 410 is better. Therefore, there is an advantage that it is possible to more stably protect the electrical connection area sealed by the sealing material 410.

According to the method of manufacturing an ink cartridge according to an embodiment of the present invention, the sealing function may be maintained for a long time by modifying the surface of the protective layer and / or the other surface of the base film through a wet etching process to more stably bond with the sealing material.

Although embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art to which the present invention pertains may implement the present invention in other specific forms without changing the technical spirit or essential features thereof. I can understand that. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

1 and 2A are plan views of intermediate structures for explaining a method of manufacturing a flexible circuit board for an inkjet cartridge according to an embodiment of the present invention.

FIG. 2B is a cross-sectional view taken along line II-II 'of FIG. 2A.

3A is a plan view of an intermediate structure for explaining a method of manufacturing a flexible circuit board for an inkjet cartridge according to an embodiment of the present invention.

FIG. 3B is a cross-sectional view taken along line III-III ′ of FIG. 3A.

4A is a plan view of an intermediate structure for explaining a method of manufacturing a flexible circuit board for an inkjet cartridge according to an embodiment of the present invention.

FIG. 4B is a cross-sectional view taken along line IV-IV ′ of FIG. 4A.

5 is a plan view of an exemplary method of the wet etching process of FIGS. 4A and 4B.

6A is a plan view of an intermediate structure for explaining a method of manufacturing an inkjet cartridge according to an embodiment of the present invention.

FIG. 6B is a cross-sectional view taken along line VI-VI 'of FIG. 6A.

(Explanation of symbols for the main parts of the drawing)

10: Flexible Circuit Board For Inkjet Cartridge

100: base film 101: modified other surface

110: pattern region 120: device hole

125: positioning hole 130: conductive pattern

130a: terminal 140: pad

150: protective layer 151: modified surface

200: chemical solution 210: etching solution

220: feed roller 300: inkjet cartridge body

310: ink discharge hole 320: a plurality of pads

330: ink ejecting portion 410: sealing material

Claims (12)

Forming a conductive pattern on one surface of the base film, Forming a protective layer covering a portion of the conductive pattern, And performing a wet etching process on the protective layer to modify the surface of the protective layer. According to claim 1, Proceeding the wet etching process to the protective layer, A method of manufacturing a flexible circuit board for an inkjet cartridge, comprising using an etchant comprising a compound containing any one or two or more of a permanganate compound and a hydroxide. The method of claim 2, Proceeding the wet etching process, And a dipping process of dipping the base film on which the conductive pattern and the protective layer are formed in the etching solution. According to claim 1, When the wet etching process is performed on the protective layer, A method of manufacturing a flexible circuit board for an inkjet cartridge comprising modifying the other surface of the base film together. According to claim 1, Modifying the entire surface of the protective layer surface, And improving the adhesion of the surface of the protective layer such that the second adhesive force of the modified protective layer surface is greater than the first adhesive force of the protective layer surface before the modification. Base film; A conductive pattern formed on one surface of the base film; And Including a protective layer covering a portion of the conductive pattern, A flexible circuit board for an inkjet cartridge, wherein the surface of the protective layer is modified through a wet etching process. The method of claim 6, wherein the wet etching process, A flexible circuit board for an inkjet cartridge using an etchant comprising a compound containing any one or two or more of a permanganate compound and a hydroxide. The other surface of the base film, A flexible circuit board for an inkjet cartridge modified at the same time as the protective layer surface through the wet etching process. Forming a device hole on the base film, A conductive pattern including a terminal portion electrically connected to a device disposed in the device hole on one surface of the base film, Covering a portion of the conductive pattern, to form a protective layer to expose the terminal portion, Performing a wet etching process on the protective layer to modify the surface of the protective layer, At least one end of the ink ejection portion disposed in the ink cartridge body storing ink is electrically connected to the terminal portion, and the ink ejection portion is disposed to correspond to the device hole, Forming a sealant covering the terminal portion, at least one end of the ink ejecting portion, and a portion of the modified protective layer surface. The method of claim 9, Proceeding the wet etching process to the protective layer, A method of manufacturing an inkjet cartridge comprising using an etchant comprising a compound comprising any one or two or more of a permanganate compound and a hydroxide. The method of claim 10, Proceeding the wet etching process, And dipping the base film having the conductive pattern and the protective layer formed therein into the etching solution. The method of claim 9, wherein when the wet etching process is performed on the protective layer, A method of manufacturing an inkjet cartridge comprising modifying the other side of the base film together.

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