KR20100121560A - Method of forming mounting inspection data, media storing the same, and inspection apparatus using the same - Google Patents

Abstract

PURPOSE: A method of forming mounting inspection data, a media storing the same, and an inspection apparatus using the same are provided to remarkably shorten the time required for forming the mounting inspection data by using the measured three dimensional data. CONSTITUTION: The printed circuit board information and the information of component mounted on the printed circuit board are obtained(S201). The three dimensional image of the components mounted on the bare board is obtained(S202). The boundary and the height of the component are determined by using the obtained three dimensional image(S203).

Description

Method of forming mounting inspection data, storage medium storing the same, and inspection apparatus using same {Method of Forming Mounting Inspection Data, Media Storing the Same, and Inspection Apparatus using the Same}

The present invention relates to a method for forming test data, a storage medium storing the same, and a test apparatus using the same, and more particularly, a method for forming test data for shortening the preparation time, a storage medium storing the same, and a test apparatus using the same will be.

In general, many electronic products are formed by mounting various components on a printed circuit board (PCB). On the other hand, as electronic products are miniaturized, components for forming electronic products are also miniaturized, and accordingly, defects may occur when the manufacturing process and the mounting of such components on a printed circuit board may occur. The inspection for defects is being carried out. For example, it is checked whether the component is disposed at the correct position of the printed circuit board, and whether the terminal of the component is electrically stable connected to the pad of the printed circuit board.

For this inspection, it is determined whether or not the inspection is performed by comparing the inspection inspection data in a state where there is no defect with the actual data measured by the inspection apparatus.

1 is a flowchart illustrating a conventional method for forming test data.

In order to form the conventional mounting inspection data, the printed circuit board information and the component information are acquired (step S101), the boundary value corresponding to the outline size of the component is predicted (step S102), and then mounted on a bare board. The inspected parts are inspected (step S103), and it is determined whether or not defective (step S104). The boundary value of the predicted part is different from the actual boundary value (the standardized part is not known due to the manufacturing deviation and the actual value is not known, and it is difficult to judge when the height change is almost continuous even when measuring the 3D shape). If the size of the component body is predicted to be too large or small than the actual size, for example, leads extending from the component body may be inconsistent with pad areas formed on the printed circuit board. Is newly predicted, the above process is repeated, and if it is determined that the defect is not defective, the predicted boundary value is determined as the mounting inspection data (step S105). That is, as described above, the mounting inspection data is formed by a try and error method, which causes a lot of time.

Accordingly, the present invention is to solve the above problems, the problem to be solved by the present invention is to provide a method for forming the mounting inspection data that can reduce the creation time.

Another problem to be solved by the present invention is to provide a storage medium that is programmed and stored in the mounting inspection data forming method.

Another problem to be solved by the present invention is to provide an inspection apparatus using the method for forming the package inspection data.

According to an exemplary embodiment of the present disclosure, a method for forming mounting test data may include printed circuit board information (CAD information) including pads and wiring information to which components lead is electrically connected, and a component of a component to be mounted on the printed circuit board. Acquiring part information (Mounter information) including the type and location, acquiring a three-dimensional shape of the part mounted on a bare board at a position corresponding to the location of the part information; And determining the boundary and the height of the part using the obtained three-dimensional shape.

For example, determining the outline and height of the component may include comparing component specification information (BOM data) of the component with a three-dimensional shape of the component.

Alternatively, determining the outline and height of the component may include template inference information (template information) inferring the boundary of the component by using the printed circuit board information and component position information of the component mounted on the printed circuit board. ), And comparing the standard inference information with the three-dimensional shape of the part. In this case, the standard inference information may be obtained by inferring the size of the part using the pads corresponding to the part position information.

On the other hand, the step of determining the outline and the height of the component, may include the step of visually determining the outline of the component and the step of determining the height as the three-dimensional shape corresponding to the outline.

Alternatively, determining the outline and height of the component may include determining the outline of the component by an algorithm for height change, and determining the height as the three-dimensional shape corresponding to the outline. Can be.

The computer-readable storage medium according to one exemplary embodiment of the present invention stores and stores the method of forming the package inspection data described above.

An inspection apparatus according to an exemplary embodiment of the present invention includes a stage unit, an illumination unit, an image photographing unit, and a controller. The stage unit supports the measurement object. The illumination unit irradiates light to a measurement object disposed on the stage unit. The image photographing unit receives light from the measurement object and captures an image. The image acquisition unit stores an image photographed by the image photographing unit. The control unit controls the operation of the stage unit, the illumination unit, the image photographing unit, and the image acquisition unit, and inspects whether the measurement object is defective using the mounting inspection data formed by the method described above.

According to the present invention, in forming the package inspection data, by using the measured three-dimensional shape data, the time required for forming the package inspection data can be significantly shortened compared with the conventional tri-and-error method.

As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "having" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described in the specification, and that one or more other features It should be understood that it does not exclude in advance the possibility of the presence or addition of numbers, steps, actions, components, parts or combinations thereof.

In addition, the component described the function may mean a combination of each component performing a process for performing the function, and may also represent the combined function of each component as one component.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art.

Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the meaning in the context of the relevant art and are to be interpreted as ideal or overly formal in meaning unless explicitly defined in the present application Do not.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings.

2 is a flowchart illustrating a method for forming test data according to an embodiment of the present invention.

Referring to FIG. 2, according to the mounting inspection data forming method according to an exemplary embodiment of the present invention, first, PCB information (CAD information) and part information (Mounter information) are obtained (step S201). Printed circuit board information can be obtained from a CAD drawing required for the manufacture of a printed circuit board, and includes, for example, information about pads to which the leads of the part are to be electrically connected and information about wiring to electrically connect them. Also, for example, the part information includes a type and a location of a part to be mounted on the printed circuit board.

Next, a three-dimensional shape of the component mounted on a bare board at a position corresponding to the position of the component information is obtained (step S202). The bare board is an ideal substrate to be used instead of the actual printed circuit board. For example, a bare board may be a substrate having the same size, and a substrate having a double-sided tape formed on one surface thereof may be used. On such a double-sided tape on the substrate, the component is placed at a position corresponding to the position of the component information, and the three-dimensional shape of the component is measured and obtained. Three-dimensional shape measurement can be measured by various methods, for example, using a moire pattern, or using a laser.

Then, the boundary and the height of the part are determined using the obtained three-dimensional shape (step S203). This process of determining the boundary and the height of the component using the three-dimensional shape will be described in more detail with reference to FIG. 3 or 4.

FIG. 3 is a flowchart showing step S203 shown in FIG. 2 in more detail.

Referring to Fig. 3, after obtaining the three-dimensional shape (step S202), the component boundary and height are determined by comparing the standard information data (BOM data) of the part with the three-dimensional shape (step S203A).

Bill of Material data, or BOM (Bill Of Material) data, is called various names such as product composition information, bill of materials, or bills of material, and is a database that combines information on the temperature and the relationship between parts of the parts. to be. In spite of the fact that there is specification data of the parts, even the product supplier (Vendor) and the same product supplier have a manufacturing deviation, so they have to be corrected, and the size of the parts is determined by reflecting the measured data.

FIG. 4 is a flowchart showing another embodiment of step S203 shown in FIG. 2.

Referring to FIG. 4, after acquiring the three-dimensional image (step S202), first, standard analogy information (template information) is obtained to determine the boundary and height of the component (step S203a). The specification inference information infers the specification of the component using the printed circuit board information and the component information when the specification information data (BOM data) of the component cannot be obtained.

More specifically, the coordinate value of the position at which the component is to be mounted is obtained from the component information, and the positions of the pads at the position corresponding to this position are obtained from the printed circuit board information. For example, when a part is arranged at coordinate values (X, Y) and the terminals of the part have two along the X axis, the coordinate values of the pads arranged along the X axis near the coordinate values (X, Y) in the printed circuit board information, For example, based on (X-α, Y) and (X + α, Y), for example, the length in the X-axis direction is inferred to approximately 2α. However, since the Y-axis size is unknown, it must be determined entirely from the 3D image.

FIG. 5 is a conceptual diagram illustrating a boundary line based on standard inference information in FIG. 3 or a three-dimensional boundary line of component specification information data and measured components in FIG. 4. FIG. 6 is a conceptual diagram illustrating a cross section taken along a cutting line I-I 'of FIG. 5 in a 3D image of a component obtained in step S202 of FIG. 2, and FIG. 7 illustrates an actual shape of FIG. 6. Conceptual diagram.

3D images of components including substrates are represented as contour lines without distinguishing between components and substrates (for example, refer to the moiré pattern method or the height measurement of 3D shapes using lasers), and in the case of minute components, the height change is discreet. In many cases, the body of the component and the region of the lead may be unclear. FIG. 6 exemplarily shows a cross section in the XZ plane or YZ plane direction in the 3D image.

Referring to FIG. 5, an outer boundary is determined between an outer boundary line A of the standard information data of the component body 521 and a boundary line B which is a measurement value of a position of continuously decreasing height, and thus the boundary of the outer boundary. If is determined, in the three-dimensional shape, the corresponding height is determined to determine the size of the part. Thus determined, FIG. 6 is predictable as shown in FIG. 7.

When determining the outer boundary between the outer boundary line (A) of the standard information data and the boundary line (B) which is the measured value, it may be determined by the operator's time, may take the intermediate value, or may be automated by algorithmic other methods. have.

This series of procedures described above can be programmed and stored in a computer readable storage medium. Such storage media is not limited to any type of floppy disks, optical disks, CD-ROMs, magnetic optical disks, ROMs, RAMs, EPROMs, EEPROMs, magnetic or optical cards, ASICs or any other suitable for storing electronic instructions. It can also be a type of media. The program stored in this way may be read and operated by the inspection device, or may be directly stored in the inspection device to drive the inspection device.

The algorithms and operations described herein are not related to any particular computer or other system. Various general purpose systems may be used as the programs related to the disclosure herein, or may readily form more specialized systems to perform the required methods. The structure required for the diversity of these systems will be apparent to those skilled in the art or similar techniques. Moreover, the present invention has not been described with reference to any particular programming language. Various programming languages may be used to implement the invention described herein.

Fig. 8 is a conceptual diagram illustrating an inspection apparatus using a method of forming mounting inspection data according to an exemplary embodiment of the present invention.

Referring to FIG. 8, the inspection apparatus according to the present embodiment includes a measurement stage unit 100, an image photographing unit 200, first and second lighting units 300 and 400, an image acquisition unit 500, and a module control unit ( 600 may include a control unit including a central control unit 700.

The measurement stage unit 100 may include a stage 110 for supporting the measurement object 10 and a stage transfer unit 120 for transferring the stage 110. In the present exemplary embodiment, the measurement object 10 moves with respect to the image capturing unit 200 and the first and second lighting units 300 and 400 by the stage 110.

The image capturing unit 200 is disposed above the stage 110 and receives the light reflected from the measurement object 10 to measure an image of the measurement object 10. That is, the image capturing unit 200 receives the light emitted from the first and second lighting units 300 and 400 and reflected from the measuring object 10 to take a plane image of the measuring object 10. .

The image capturing unit 200 may include a camera 210, an imaging lens 220, a filter 230, and a lamp 240. The camera 210 receives the light reflected from the measurement object 10 to take a planar image of the measurement object 10. For example, one of a CCD camera and a CMOS camera may be employed. The imaging lens 220 is disposed under the camera 210 to form light reflected from the measurement object 10 in the camera 210. The filter 230 is disposed below the imaging lens 220 to filter the light reflected from the measurement object 10 to provide the imaging lens 220, and for example, a frequency filter, a color filter, and light. It may be made of any one of the intensity control filter. The lamp 240 may be disposed in a circle below the filter 230 to provide light to the measurement target object 10 to capture a specific image such as a two-dimensional shape of the measurement target object 10. have.

The first lighting unit 300 may be disposed to be inclined with respect to the stage 110 supporting the measurement object 10 on the right side of the image capturing unit 200, for example. The first lighting unit 300 may include a first lighting unit 310, a first grating unit 320, a first grating transfer unit 330, and a first condensing lens 340. The first lighting unit 310 is composed of an illumination source and at least one lens to generate light, the first grating unit 320 is disposed below the first lighting unit 310 to the first illumination The light generated in the unit 310 is changed into the first lattice pattern light having the lattice pattern. The first grating transfer unit 330 is connected to the first grating unit 320 to transfer the first grating unit 320, for example, one of the PZT (Piezoelectric) transfer unit or fine linear transfer unit It can be adopted. The first condenser lens 340 is disposed under the first grating unit 320 to condense the first grating pattern light emitted from the first grating unit 320 to the measurement object 10.

The second lighting unit 400 may be disposed to be inclined with respect to the stage 110 supporting the measurement object 10 on the left side of the image capturing unit 200, for example. The second lighting unit 400 may include a second lighting unit 410, a second grating unit 420, a second grating transfer unit 430, and a second condensing lens 440. Since the second lighting unit 400 is substantially the same as the first lighting unit 300 described above, detailed descriptions thereof will be omitted.

The first lighting unit 300 irradiates N first grating pattern lights to the measurement object 10 while the first grating transfer unit 330 moves the first grating unit 320 sequentially N times. In this case, the image capturing unit 200 may photograph the N first pattern images by sequentially applying the N first lattice pattern lights reflected from the measurement object 10. In addition, the second lighting unit 400 moves N second grid pattern lights to the measurement target 10 while the second grid transfer unit 430 moves the second grid unit 420 sequentially N times. When irradiating, the image capturing unit 200 may photograph the N second pattern images by sequentially applying the N second grid pattern lights reflected from the measurement object 10. Here, N is a natural number, for example, may be 4. Therefore, the shadow area by the measurement object 10 can be compensated.

Meanwhile, in the present embodiment, only the first and second lighting units 300 and 400 are described as an illumination device for generating the first and second grid pattern lights. Alternatively, the number of the lighting units may be three or more. That is, the grid pattern light irradiated to the measurement object 10 may be irradiated from various directions, and various kinds of pattern images may be photographed. For example, when three lighting units are arranged in an equilateral triangle shape around the image capturing unit 200, three grid pattern lights may be applied to the measurement object 10 in different directions, and four lighting units may be applied. When they are arranged in a square shape around the image capturing unit 200, four grid pattern lights may be applied to the measurement object 10 in different directions.

The image acquisition unit 500 is electrically connected to the camera 210 of the image capturing unit 200 to obtain and store the pattern images from the camera 210. For example, the image acquisition unit 500 includes an image system that receives and stores the N first pattern images and the N second pattern images photographed by the camera 210.

The module controller 600 is electrically connected to and controlled by the measurement stage unit 100, the image capturing unit 200, the first lighting unit 300, and the second lighting unit 400. The module controller 600 includes, for example, a lighting controller, a grid controller, and a stage controller. The lighting controller generates light by controlling the first and second lighting units 310 and 410, respectively, and the grid controller controls the first and second grid transfer units 330 and 430, respectively. The second grid units 320 and 420 are moved. The stage controller may control the stage transfer unit 120 to move the stage 110 up, down, left, and right.

The central control unit 700 is electrically connected to the image acquisition unit 500 and the module control unit 600 to control each. Specifically, the central control unit 700 receives the N first pattern images and the N second pattern images from the image system of the image acquisition unit 500, processes them, and processes the three-dimensional image of the object to be measured. After measuring the shape, it is possible to determine whether or not the mounting of the measurement object 10 is defective. That is, the mounting state of the measurement object 10 and the contact stability with the pad are determined based on the mounting inspection data formed through the aforementioned mounting inspection data forming method. More specifically, using the obtained three-dimensional shape using the boundary and the height of the component, when the arrangement of the component is misaligned the contact between the lead and the pad of the component is poor and the height of the lead portion is measured higher than the allowable value Since the lead may float and may not come into contact with the pad, it is determined to be defective.

The central controller 700 may also control the lighting controller, the grid controller, and the stage controller of the module controller 600, respectively. As such, the central control unit may include an image processing board, a control board, and an interface board.

It is apparent to those skilled in the art that the inspection apparatus shown here is merely exemplary and may be applied to all inspection apparatuses used to determine whether or not mounting of electronic components mounted on a printed circuit board is defective.

While the present invention has been described in connection with what is presently considered to be practical and exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention. Therefore, the above description and the drawings below should be construed as illustrating the present invention, not limiting the technical spirit of the present invention.

1 is a flowchart illustrating a conventional method for forming test data.

2 is a flowchart illustrating a method for forming test data according to an embodiment of the present invention.

FIG. 3 is a flowchart showing step S203 shown in FIG. 2 in more detail.

FIG. 4 is a flowchart showing another embodiment of step S203 shown in FIG. 2.

FIG. 5 is a conceptual diagram illustrating a boundary line based on standard inference information in FIG. 3 or a three-dimensional boundary line of component specification information data and measured components in FIG. 4.

FIG. 6 is a conceptual diagram illustrating a cross section taken along a cutting line I-I 'of FIG. 5 in a 3D image of a component obtained in step S202 of FIG. 2.

7 is a conceptual diagram illustrating an actual shape of FIG. 6.

Fig. 8 is a conceptual diagram illustrating an inspection apparatus using a method of forming mounting inspection data according to an exemplary embodiment of the present invention.

<Short Description of Main Drawing Numbers>

10: measuring object 100: stage

110: stage 120: stage transfer unit

200: video recording unit 210: camera

220: imaging lens 230: filter

240: lamp 300: first lighting unit

310: first lighting unit 320: first grid unit

330: first grating transfer unit 340: first condensing lens

400: second lighting unit 410: second lighting unit

420: second grid unit 430: second grid transfer unit

440: second condenser lens 500: image acquisition unit

510: printed circuit board 521: parts body

522: lead 523: pad

600: module control unit 700: central control unit

Claims (8)

Obtaining printed circuit board information (CAD information) including pads and wiring information to which the leads of the parts are to be electrically connected, and part information (Mounter information) including the type and location of the component to be mounted on the printed circuit board; Obtaining a three-dimensional shape of the component mounted on a bare board at a position corresponding to the position of the component information; And And determining the boundary and the height of the component by using the obtained three-dimensional shape. The method of claim 1, Determining the outline and height of the component, And mounting part specification information (BOM data) of the part and the three-dimensional shape of the part. The method of claim 1, Determining the outline and height of the component, Acquiring template inference information (template information) inferring the boundary of the component by using the printed circuit board information and component position information of the component mounted on the printed circuit board; And And comparing the standard analogy information with a three-dimensional shape of the component. The method of claim 3, The standard inference information, And inferring the size of the part using the pads corresponding to the part position information. The method of claim 1, Determining the outline and height of the component, Visually determining the outline of the part; And And determining a height as the three-dimensional shape corresponding to the outline. The method of claim 1, Determining the outline and height of the component, Determining an outline of the part by an algorithm for height change; And And determining a height as the three-dimensional shape corresponding to the outline. A computer-readable storage medium in which the method for forming package inspection data according to any one of claims 1 to 6 is programmed and stored. A stage unit for supporting a measurement object; An illumination unit for irradiating light to a measurement object disposed on the stage unit; An image photographing unit which receives an image from the measurement object and captures an image; An image acquisition unit storing an image photographed by the image photographing unit; And A control unit controls the operation of the stage unit, the lighting unit, the image photographing unit, and the image acquisition unit, and inspects whether a measurement object is defective by using the mounting inspection data according to any one of claims 1 to 6. Inspection device comprising a.

Images