KR20100116856A - Transcription type pattern represent device for electronic products case of three dimensions - Google Patents

Abstract

PURPOSE: A transcriber for a holographic electronics case is provided to solve uneven heat transmission problem and prevent the waste of heat by preventing transcription from becoming uneven. CONSTITUTION: A transcriber for a holographic electronics case comprises an upper mold(10), a lower mold(20), and an elastic member(9). The upper mold moves vertically on the top. The lower mold is placed on the lower part of the upper mold. The elastic member protects the outside of a case(100). The lower mold is machined into the same shape of the bottom surface of the case.

Description

Transcription type pattern represent device for electronic products case of three dimensions}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for forming a pattern on the outer surface of a case of a three-dimensional electronic product by thermal sublimation transfer or thermal transfer, and has been improved to greatly improve the transfer quality.

As is well known, the case that is the appearance of a large electronic product as well as a small electronic device such as a mobile phone, an MP3, an electronic notebook, a calculator, a portable game machine, etc. is usually composed of a case made of synthetic resin or metal material. As a means for changing or strengthening, there may be a method of designing the overall shape of the case itself by molding, such as injection, die casting, etc. In addition, a method of expressing a pattern with three-dimensional irregularities on the surface of the case and itself There are various ways to diversify colors, but other methods to improve the design have not been proposed, and thus the limit of improving the design of electronic products will be reached.

 On the other hand, although the technology for expressing the pattern of the heat sublimation transfer method has been used conventionally, it has been developed and advanced to be suitable when the material to which the pattern is to be applied is flat, and thus it is a three-dimensional like the case of the electronic product of the present invention. It is not easy to express the pattern uniformly and accurately on the outer surface of the case.

Due to this problem, a method and apparatus for expressing a pattern by a heat sublimation or thermal transfer method in an electronic case having a three-dimensional shape instead of a plane have been proposed, for example, Patent No. 873003.

However, many problems have been found in the above patents, and the present invention intends to devise a device capable of solving such problems and expressing patterns more effectively. When seating on the upper portion of the transfer paper always to be placed in the correct position, the pattern transferred by it will always have the correct uniformity, otherwise the position of the pattern is slightly different for each transferred case. Conventionally, air was sucked in order to fix the transfer paper, but it was difficult to accurately fix the transfer paper, resulting in poor uniformity of transfer.

Second, the transfer of heat for transfer was not smooth or uniform. The upper type that presses the case from the top is installed on the bottom of the hot plate, and the heater is installed on the hot plate to transfer heat from the hot plate to the upper type. Since heat is transferred from the upper type to the transfer paper through the elastic material, the heat loss is high and the heat cannot be uniformly transferred. This problem eventually leads to a problem of lowering the transfer quality.

Third, according to the conventional apparatus, since several upper types are installed in one lifting cylinder and the device is configured to elevate at the same time, a uniform force cannot be applied to each upper and lower types so that the central part when transferring several cases at the same time There was a disadvantage that the transfer state of the edge case and the edge was not uniform.

The present invention has been made in view of the above problems and necessity, the transfer paper is unevenly seated to solve the problem of the transfer state is uneven, to eliminate the waste of heat and non-uniform heat transfer problems, when transferring multiple cases at the same time, It is an object of the present invention to improve the transfer quality of the three-dimensional case by solving the nonuniformity of the pressing force toward the case.

In order to achieve the above object, the present invention is provided with a means for fixing the transfer paper to the upper die first while the transfer is made, having a position fixing means that can always be seated in a uniform position on the transfer paper itself and The lower type includes a means for fixing the position of the transfer paper by using the position fixing means, to improve the installation configuration and position of the heater so that heat transfer can be made quickly and effectively without waste, and also several upper type This is characterized by improving the configuration so that each can be individually lifted by a separate power.

According to the present invention, it is possible to obtain a transfer product of uniform quality by the transfer paper is always in close contact with the correct position stably by the improvement of the configuration holding the transfer paper to further improve the transfer quality, electrothermal heater According to the installation configuration of the electronics, it is possible to improve the transfer quality and uniformity while preventing the waste of heat transfer, and to improve the quality of the transfer quality even by improving the lifting structure of the upper type. It is a useful invention that greatly improves the transfer work on the product case, thereby greatly improving the design of electronic products.

Hereinafter, a preferred embodiment of the present invention for achieving the present invention will be described in detail with reference to the accompanying drawings.

1 is a front view of the transfer device according to the present invention, FIG. 2 is a right side view of FIG. 1, FIG. 3 is a detailed view of portion A of FIG. 2, and FIGS. 4A and 4B are views of an operating state of FIG. 3. Is an exemplary view of the transfer paper and the fixing pin of the present invention, Figure 6 is an exemplary cross-sectional view of the fixing pin of the present invention.

The transfer apparatus according to the present invention is composed of an upper die 10 and a lower die 20 below the elevating from the top as is known. The pressing recess 11 of the bottom of the upper mold 10 inserts an elastic member 9 that surrounds the outer surface of the case to be transferred, and the elastic member 9 is more uniform than the outer surface of the case 100 to be transferred. Processing as large as the width and having a uniform thickness can achieve uniform heat transfer.

The lower die 20 is processed into the same shape as the bottom of the case 100 having a three-dimensional outer surface to be molded in the upper portion is seated snugly.

Pressing edges of the bottom surface of the upper mold 10 or the lower surface next to the upper mold 10 of the fixing plate 30 to which the upper mold is fixed, while being supported by the spring 41, can be drawn into the upper mold 10. It characterized in that the pin 40 is installed. The pressure pin 40 is a state in which the upper die 10 is lowered to press the both ends of the transfer paper (P) first before pressing the case 100 and the transfer paper (P) so that the transfer paper (P) does not move. The elastic member 9 of the upper mold 10 is to be further lowered while pressing the case 100.

The pressing pin 40 is usually the lower end is located below the elastic member 9 of the upper mold 10, the upper mold 10 is pressed down the transfer paper (P) before the elastic member 9 when the upper mold 10 is lowered When 10 is raised, it is spaced apart from the transfer paper P later than the elastic member 9.

If the bottom of the pressing pin 40 is configured with an elastic sphere 42 having elasticity, such as rubber, it will be possible to more stable pressing action.

In addition, the fixing using the pressure pin 40 can be made more accurately and more efficiently, the lower die 20 by drilling the fixing hole (P-1) in advance at a predetermined position of the transfer paper (P) The fixing hole P-1 of the transfer paper P has a fixing pin 45 to be inserted snugly therein.

If the fixing pin 45 is configured to hold the fixing hole P-1 of the transfer paper P, the transfer paper P can be more reliably fixed, as shown in FIG. The working space 46 is formed in the interior of the working space 46 is supported by the spring 48 to constitute a locking port 47 that can be mounted only on the lower end, according to this configuration fixing pin 45 When the fixing hole (P-1) of the transfer paper (P) is fitted into the locking hole 47 is inserted into the working space 46 while compressing the spring 48, the fixing hole (P-1) When the passage completely passes through the locking hole 47, the transfer paper is prevented from escaping upward while the locking hole 47 protrudes.

According to the present invention, a plurality of heater holes 12 are formed along the curved surface of the bottom pressing recess 12 of the upper mold 10, and then an electric heater H is installed, and the lower mold 20 or the lower mold 20 is formed. In the base 35 to be installed, a plurality of heater holes 36 were formed, and heat transfer heaters H were installed. Although the drawing shows an example installed in the base 35, when the lower type 20 is formed thick, it will be possible to install the heat transfer heater (H) directly to the lower type (20).

In addition, the present invention is formed by dividing the fixed plate 30 and the support plate 32, the upper die 10 and the upper die 10 is installed by the number of the case 100, respectively, and a linear movement guide device on each support plate 32 After the configuration (33) is connected to each individual cylinder 34 is installed so as to be able to individually lift the upper mold (10).

Looking at the action on the present invention in detail as follows.

First, in order to use the apparatus of the present invention by supplying power to the heat transfer heater (H) installed in the upper type 10 or the fixed plate 30 and the lower type 20 or base heater (H) installed in the base 35 In this state, if the case 100 to be sufficiently heated is seated on the upper surface of the lower die 20, the case 100 may not move back and forth or laterally.

In this state, the transfer paper P is seated on the upper surface of the case 100.

The cylinder 34 is operated to lower the support plate 32, the fixed plate 30, and the upper die 10 at the bottom thereof, and the elastic member 9 at the bottom of the upper die 10 has the transfer paper P on it. The case 100 of the compression is made by the heat transfer operation.

Immediately before the elastic member 9 of the upper mold 10 presses the transfer paper P and the case 100, the pressing pin 40 first presses the edge of the transfer paper P so that the elastic member 9 is pressed. The lowering of the transfer paper (P) is made to completely cover the case 100 to keep the transfer paper (P) does not move until pressed.

In the above operation, since the pressing pin 40 is supported by the spring 41, the transfer paper P is pressed before the upper die 10 is completely lowered, and the pressure is gradually pushed while compressing the spring 41 if it continues to descend. It becomes a form to enter.

In addition, even when the upper die 10 is raised after completing the transfer operation, even if the upper die 10 and the elastic member 9 is spaced apart from the case 100, the pressing pin 40 until the gap is widened over a certain interval. ) Presses the transfer paper P, so that the transfer paper P is attached to the elastic member 9 and prevented from coming up.

In addition to the pressing pin 40, the action of the fixing hole P-1 and the fixing pin 45 of the transfer paper P will be described. The fixing hole P-1 is formed in advance on the transfer paper P. Work to insert the fixing hole P-1 of the transfer paper P into the fixing pin 45 and lower the upper die 10 when the transfer paper P is seated on the case 100 in such a state. Proceed.

In the case of forming the locking hole 47 which is supported by the spring on the fixing pin 45, the transfer paper P once inserted is not detached by itself, thereby making it more secure.

According to the fixing of the transfer paper (P), the transfer paper (P) is always seated in a precise and uniform position, the transfer case (100) can be transferred to a uniform pattern all without difference in the sharpness or position of the pattern will be.

In addition, according to the transfer device of the present invention, the heat transfer heater (H) is installed along the curved surface of the upper recess (10) or the pressing recess (11) of the upper mold (10). As the heat is applied at the position close to), the overall effect is to reduce the consumption and waste of heat transfer, and to apply uniform heat to the case as a whole, thereby improving transfer quality and achieving uniformity.

In addition, the installation of the heat transfer heater (H) in the base 35 to which the lower mold 20 or the lower mold 20 is installed can apply heat to the case 100 itself. It is natural to improve this.

In addition, according to the present invention, since each upper die 10 is configured to be lifted separately for each lower die in which one case 100 is installed, some cylinders corresponding to the case 100 do not need to be transferred simultaneously. 34) only the transfer can be performed to reduce the power, even if the transfer multiple cases at the same time to apply a uniform pressure to each upper type 10 as a whole to achieve the uniformity of the transfer quality.

1 is a front view of the transfer device according to the present invention

2 is an exemplary view of the right side of FIG.

3 is a detailed view of portion A of FIG.

Figure 4a, 4b is an operating state of Figure 3

Figure 5 is an illustration of the transfer paper and the fixing pin of the present invention

Figure 6 is a cross-sectional view of the fixing pin of the present invention

*** Description of the symbols for the main parts of the drawings ***

9: elastic member

10: upper type 11: pressure groove

12: heater hole

20: lower

30: fixed plate 32: support plate

33: linear movement guide device 34: cylinder

35: base 36: heater hole

40: pressure pin 41: spring

42: elastic ball 45: fixed pin

46: operating space 47: hook

48: spring

100: case H: electric heater

P: transfer paper P-1: fixing hole

Claims (5)

It is composed of an upper mold 10 and a lower mold 20 below the elevating from the upper, the elastic member of the form surrounding the outer surface of the case 100 to be transferred to the pressing recess 11 of the bottom of the upper mold 10 ( 9) is inserted, In the lower die 20 is processed in the same shape as the bottom surface of the case 100 having a three-dimensional outer surface to be molded in the top, in the transfer device of the three-dimensional electronics case to be seated snugly, Pressing pin 40 capable of drawing into the upper mold 10 while being supported by a spring 41 on the bottom of the upper mold 10 and the bottom of the upper mold 10 to which the upper mold is fixed. The upper type 10 is pushed down by pressing both ends of the transfer paper P before the case 100 and the transfer paper P are pressed down so that the transfer paper P does not move. Transfer device for a three-dimensional electronics case, characterized in that the elastic member (9) of the (10) is further lowered to compress the case (100). It is composed of an upper mold 10 and a lower mold 20 below the elevating from the upper, the elastic member of the form surrounding the outer surface of the case 100 to be transferred to the pressing recess 11 of the bottom of the upper mold 10 ( 9) is inserted, In the lower die 20 is processed in the same shape as the bottom surface of the case 100 having a three-dimensional outer surface to be molded in the top, in the transfer device of the three-dimensional electronics case to be seated snugly, The fixing hole P-1 is drilled in a predetermined position of the transfer paper P in advance, and the fixing pin 45 to which the fixing hole P-1 of the transfer paper P is fitted is inserted into the lower die 20. Transfer device of a three-dimensional electronics case characterized in that it comprises a). It is composed of an upper mold 10 and a lower mold 20 below the elevating from the upper, the elastic member of the form surrounding the outer surface of the case 100 to be transferred to the pressing recess 11 of the bottom of the upper mold 10 ( 9) is inserted, In the lower die 20 is processed in the same shape as the bottom surface of the case 100 having a three-dimensional outer surface to be molded in the top, in the transfer device of the three-dimensional electronics case to be seated snugly, The fixing hole P-1 is drilled in a predetermined position of the transfer paper P in advance, and the fixing pin 45 to which the fixing hole P-1 of the transfer paper P is fitted is inserted into the lower die 20. ), The working space 46 is formed inside the fixing pin 45 and the inside of the working space 46 is supported by a spring 48 while being inclined toward the lower side so as to constitute a locking mechanism 47 Transfer device for shape electronics case. An elastic member 9 having an upper mold 10 and a lower mold 20 below it is inserted into an urging groove 11 on the bottom of the upper mold 10 to audit the outer surface of the case 100. In the lower die 20 is processed in the same shape as the bottom surface of the case 100 having a three-dimensional outer surface to be molded in the upper portion in the transfer device of the three-dimensional electronics case to be seated snugly, The base 35 is formed with a plurality of heater holes 12 formed along the curved surface of the bottom pressing recess 12 of the upper die 10, and then installed with a heat heater H and a lower die 20 or a lower die 20. Or the lower die 20 also includes a plurality of heater holes 36 and a heat transfer heater (H) is installed, characterized in that the transfer device of the three-dimensional electronic case. An elastic member 9 composed of an upper die 10 and a lower die 20 below which are lifted from the upper portion and surrounding the outer surface of the case 100 to be transferred to the pressing recess 11 of the bottom of the upper die 10. ) Is inserted, the lower type 20 is processed in the same shape as the bottom of the case 100 having a three-dimensional outer surface to be molded in the top three-dimensional electronics case, characterized in that the case 100 is seated snugly In the transfer device of, The fixed plate 30 and the support plate 32, on which the upper die 10 and the upper die 10 are installed, are formed by dividing by the number of the cases 100, respectively, and the linear movement guide device 33 is formed on each support plate 32. Transfer device of a three-dimensional electronics case, characterized in that configured to be able to lift each of the upper mold 10 by connecting and installing each individual cylinder (34).

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