KR20100106981A - Phosphor paste - Google Patents

Abstract

As a phosphor paste 1 having a high viscosity solvent (first organic compound) 2 and phosphor particles 5 dispersed in the high viscosity solvent 2, the high viscosity solvent 2 has a terpene skeleton and is formed at 25 ° C. The viscosity of is set to 10,000 to 1,000,000 mPa · s. By using the high viscosity solvent 2, the phosphor paste 1 which does not contain a polymer as a component is obtained. For this reason, the manufacturing effect of the product (for example, a plasma display panel etc.) using fluorescent substance paste can be improved.

Description

Phosphor Paste {PHOSPHOR PASTE}

BACKGROUND OF THE INVENTION Field of the Invention [0001] The present invention relates to a phosphor paste technology, in particular, to a technique effective for applying to a phosphor paste used for the manufacture of a display device using a phosphor as a light emitting element such as a plasma display.

A fluorescent substance is an inorganic substance which is excited by irradiating vacuum ultraviolet rays etc. and emits visible light. By using the property that the phosphor emits visible light, for example, in a flat panel display device such as a plasma display panel (PDP), each color of red (R), green (G), and blue (B) This phosphor is used as a light emitter that emits visible light.

Phosphor is a solid substance at normal temperature (25 degreeC). For this reason, when apply | coating a fluorescent substance a predetermined amount in a predetermined position, or when shape | molding to a predetermined shape, the composition called the fluorescent substance paste which disperse | distributed this powdery fluorescent substance in the organic compound is used.

In addition, when a predetermined amount is applied to the phosphor paste at a predetermined position, or when molded into a predetermined shape, the phosphor paste needs to have a predetermined viscosity (thixoplastic) depending on the coating method or the molding method. .

As a method of obtaining this required viscosity, there is a technique in which the phosphor paste contains a polymer such as a resin called a binder.

For example, Japanese Patent Application Laid-Open No. 2007-145973 (Patent Document 1) discloses a phosphor paste containing constituents of the phosphor powder, the organic binder resin, and the organic solvent.

Patent Document 1: Japanese Patent Application Laid-Open No. 2007-145973

In order to make the phosphor emit light, it is necessary to remove the organic compound after applying the phosphor paste or after forming the phosphor paste into a predetermined shape. In the step of removing the organic compound, a method of gasifying (evaporating) the organic compound component and discharging the phosphor paste out of the system (hereinafter referred to as evaporation) is generally used.

Among the materials constituting the phosphor paste, an organic solvent used as a solvent for dispersing the phosphor and the polymer (polymer) is relatively easy to evaporate, for example, by evaporating the phosphor paste by heating to about 150 ° C (called a drying step).

However, the polymer used as a binder is difficult to evaporate compared with the organic solvent, and even if heated to 350 degreeC or more, the residue of a binder may remain in the fluorescent substance after heating, for example.

When the residue of the binder remains in the phosphor after heating, the phosphor may not emit predetermined visible light. Or there may be a case where the amount of emitted light decreases and a predetermined luminance cannot be obtained. In the case where the phosphor is formed in a plurality of regions, if a gap occurs in the residue of the binder between the plurality of regions, the amount of emitted light is scattered. For example, when a phosphor is used as a light emitter of a flat panel display such as a PDP, the phosphor is formed in a discharge space (multiple spaces) called cells partitioned by partition walls, but if there is a residue of a binder in the phosphor, the luminance of each discharge space is increased. Will be scattered.

In addition, although the discharge gas which consists of diluent gas etc. is sealed in this discharge space, when the decomposition gas of a binder generate | occur | produces, this discharge space is contaminated with decomposition gas.

As described above, in order to prevent adverse effects due to the remaining components of the binder in the phosphor, a step of removing the binder component in the phosphor paste completely (called a binder removal process) is required.

Here, as described above, since the polymer constituting the binder is difficult to evaporate, in the binder removal step, it is generally necessary to heat the phosphor paste to about 450 ° C. (called firing) and hold it for several ten minutes to several hours. .

In the binder removal process, the method of removing the components of the binder in the phosphor paste by firing the phosphor paste has the following problems.

First, since the processing temperature is high, the energy consumption required for processing is large. Moreover, since the time required for heating, or the time to maintain high temperature is long, manufacturing efficiency is bad. In addition, the phosphor is oxidized and deteriorated by heating the phosphor at a high temperature.

This invention is made | formed in view of the said subject, The objective is to provide the technique which can improve the manufacturing efficiency of the product (for example, PDP etc.) using fluorescent substance paste.

The above and other objects and novel features of the present invention are apparent from the description of the present specification and the accompanying drawings.

Disclosure of Invention

Means to solve the problem

Among the inventions disclosed in the present application, an outline of typical ones will be briefly described as follows.

That is, the present invention is a phosphor paste having a first organic compound and phosphor particles dispersed in the first organic compound, wherein the first organic compound has a terpene skeleton and has a viscosity at 25 ° C. of 10,000 to 1,000,000 mPa. It is to be s.

To practice the invention  Best form for

In all the drawings for demonstrating this embodiment, what has the same function is attached | subjected with the same code | symbol, and description of the repetition is abbreviate | omitted as a rule. EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described in detail based on drawing.

(Embodiment)

<Method for Producing Phosphor Paste>

First, the manufacturing method of the fluorescent substance paste 1 of this embodiment is demonstrated using FIG. BRIEF DESCRIPTION OF THE DRAWINGS It is explanatory drawing which shows the manufacturing flow of the fluorescent substance paste of this embodiment.

First, the high viscosity solvent (1st organic compound) 2 and the solvent (2nd organic compound, dispersing agent) 3 shown in FIG. 1 are prepared, and these are mixed.

This high viscosity solvent 2 is a solvent mixed in order to give a predetermined viscosity to the phosphor paste 1. Generally, in order to impart a predetermined viscosity to the phosphor paste, a polymer (polymer, a high molecular organic compound) such as ethyl cellulose or an acrylic resin is used, but the phosphor paste 1 of the present embodiment uses a high viscosity solvent 2. Since it is used, it did not contain polymers, such as resin, as a structural component. In addition, the high viscosity solvent 2 is a liquid at 25 degreeC.

On the other hand, the solvent 3 is used as a diluting solvent for adjusting the viscosity of the phosphor paste 1, and it is preferable to use a material having a viscosity lower at 25 ° C than the high viscosity solvent 2 described later. In addition, this solvent (3) does not contain a polymer (polymer, a high molecular organic compound) as a component.

Examples of such materials include aromatic hydrocarbon compounds such as toluene and xylene, ether compounds such as tetrahydrofuran and 1,2-dibutoxyethane, ketone compounds such as acetone and methyl ethyl ketone, ethyl acetate, butyl acetate and acetic acid. Ester compounds such as 2- (2-butoxyethoxy) ethyl and dioctyl phthalate, alcohol compounds such as isopropyl alcohol, 2- (2-butoxyethoxy) ethyl alcohol, terpineol and 2-phenoxyethanol , BC (butyl carbitol), BCA (butyl carbitol acetate), and the like.

The viscosity of the phosphor paste 1 is mainly defined by the blending ratio of the high viscosity solvent 2 and the solvent 3. That is, the fluorescent substance paste 1 of this embodiment can obtain the predetermined viscosity characteristic, without including the polymer used as a thickener (binder) in general fluorescent substance paste by using the high viscosity solvent 2. .

Here, the predetermined | prescribed viscosity characteristic of the fluorescent substance paste 1 is a viscosity characteristic required when providing the fluorescent substance paste 1 for a process (for example, apply | coating to a board | substrate), and the value according to a process means differs. In detail, the manufacturing method of the PDP which is a usage example of the phosphor paste 1 of this embodiment is explained in full detail.

Since the high-viscosity solvent 2 functions as a thickener of the phosphor paste 1, the temperature at the time of providing the phosphor paste 1 to a process (for example, apply | coating to a board | substrate) (for example, 25 degreeC) If the viscosity is too low, the phosphor paste 1 cannot obtain a predetermined viscosity. In addition, when the viscosity is too high, the printability when the phosphor paste 1 is used as a printing agent is deteriorated.

As a result of this inventor's examination, it is preferable that the viscosity characteristic of the high viscosity solvent 2 uses the thing in the range of 10,000-1,000,000 mPa * s in the viscosity in 25 degreeC.

Although most of the materials having the above viscosity characteristics as organic compounds containing no polymer are known, the inventors have investigated that the following materials can be applied as the high viscosity solvent (2). That is, an organic compound (isobornylcyclohexanol) having a terpene skeleton represented by the following structural formula (1) can be used.

[Formula 1]

The organic compound (isobornylcyclohexanol) represented by the structural formula (1) is not a polymer, but has a viscosity in the range of 10,000 to 1,000,000 mPa · s at 25 ° C. Specifically, the thing of 65500 mPa * s was used at 25 degreeC, 336000 mPa * s, and 30 degreeC.

In addition, isobornylcyclohexanol has the following physical property characteristics. The physical property of the isobornylcyclohexanol used for the high viscosity solvent (2) is demonstrated using FIG. FIG. 2: is explanatory drawing which shows the temperature dependence of the viscosity of the high viscosity solvent 2 of this embodiment, and evaporation amount.

In FIG. 2, the horizontal axis represents the temperature (° C.) of the high viscosity solvent 2, and the first vertical axis (the vertical axis on the left side in FIG. 2) represents the viscosity of the high viscosity solvent 2, and the second vertical axis (the vertical axis on the right side in FIG. 2). ) Represents the evaporation amount of the high viscosity solvent 2.

As shown in FIG. 2, when the high viscosity solvent 2 is heated at 25 degreeC, a viscosity will fall rapidly, and when heated to 40 degreeC, it will become 1/10 or less of the viscosity in 25 degreeC. In addition, the temperature curve of a viscosity has a displacement point around 40 degreeC, and even if it heats the high viscosity solvent 2 to 40 degreeC or more, a viscosity does not fall significantly. On the other hand, about the evaporation amount, even if the high viscosity solvent 2 is heated up to 70 degreeC, it does not evaporate most, but this temperature curve has a displacement point in the point exceeding about 70 degreeC, and when it exceeds 70 degreeC, the amount of evaporation will increase.

In this embodiment, using the said characteristic of the high viscosity solvent 2, before mixing the solvent 3 and the high viscosity solvent 2 shown in FIG. 1, the high viscosity solvent 2 is in the range of 40 degreeC-70 degreeC. Warm. By heating the high-viscosity solvent in the range of 40 ° C to 70 ° C, the viscosity can be reduced while suppressing evaporation of the high-viscosity solvent (2). Therefore, the highly viscous solvent (2) and the solvent (3) can be easily used in an extremely simple mixing device. Can be mixed uniformly.

That is, it becomes possible to improve the manufacturing efficiency of the phosphor paste 1. As a mixing apparatus of the high viscosity solvent 2 and the solvent 3, a stirring mixing apparatus, such as a homomixer, can be used, for example. By this mixing process, the vehicle 4 which is a mixed solution of the high viscosity solvent 2 and the solvent 3 is obtained.

Next, the phosphor particles 5 shown in FIG. 1 are prepared and dispersed in the vehicle 4. The phosphor particles are prepared as powder particles (inorganic particles) so as to be easily dispersed in the vehicle 4. In addition, since the vehicle 4 can maintain the state in which the viscosity fell in the range of 40 degreeC-70 degreeC, the fluorescent substance particle 5 can be easily uniformly disperse | distributed by the very simple mixing apparatus. As a mixing device used in this dispersion step, for example, a mixing device such as a homo mixer can be used.

As the phosphor particles 5, various kinds can be selected depending on the use of the phosphor paste 1. For example, when the phosphor paste 1 is used to form light emitting elements of a color display device such as a PDP, the color display device is formed by a combination of colors of red (R), green (G), and blue (B). Since a color image is displayed, three kinds of fluorescent substance particles 5 which emit light of R, G, and B are prepared, respectively.

In the case of PDP, since the fluorescent substance is excited by the vacuum ultraviolet ray of a predetermined wavelength (for example, 147 nm), the method of emitting light of R, G, and B colors is used. Therefore, the color tone of the light when excited by the vacuum ultraviolet ray of this predetermined wavelength is used. It is preferable to select a material having good luminous efficiency. As such a material, the following materials can be illustrated, for example, but the material of the fluorescent substance particle 5 is not limited to the following.

For example, as phosphor particles (5) of the application (赤用) [(Y, Gd) Bo 3: Eu 3 +], as a deer antler _{(綠用) [Zn 2 SiO} 4: Mn 2 +], cheongyong (靑as用): and the like can be used ^{_{[BaMgAl 1O O 17 Eu 2 +}} ].

By this dispersion | distribution process, the fluorescent substance particle 5 will be in the state disperse | distributed in the high viscosity solvent 2.

Next, the vehicle 4 in which the phosphor particles 5 are dispersed is filtered. By performing this filtration process, the impurity contained in the vehicle 4 and the fluorescent substance particle 5 larger than predetermined particle diameter can be removed. Therefore, the phosphor paste 1 after completion of the filtration step is in a state where the phosphor particles 5 are uniformly dispersed in the vehicle 4 (that is, in the high viscosity solvent 2 and the solvent 3).

Finally, for example, the phosphor paste 1 is obtained by cooling by standing in an atmosphere of 25 ° C.

By the way, in this embodiment, the structural example in which the high viscosity solvent 2 and the solvent 3 are contained as an organic compound component contained in the fluorescent paste 1 was demonstrated. However, when isobornylcyclohexanol is used as the high-viscosity solvent (2), as described above, since the viscosity decreases when heated at 40 ° C or higher, the phosphor paste (1) containing only the high-viscosity solvent (2) as an organic compound component You can also do

However, when isobornylcyclohexanol is used as the high viscosity solvent (2), as shown in FIG. 2, in the temperature range lower than 40 degreeC, the viscosity changes with temperature. For this reason, when the organic compound component contained in the fluorescent paste 1 is made into only the high viscosity solvent 2, the temperature range at the time of providing the fluorescent paste 1 to a process (for example, apply | coating to a board | substrate) (example) For example, the viscosity of the fluorescent substance paste 1 may change large in 20 degreeC-30 degreeC).

Therefore, as shown in FIG. 1, by adding the solvent 3 as a diluting solvent to the high viscosity solvent 2, the temperature range at the time of providing the fluorescent paste 1 to a process (for example, 20 degreeC-30 degreeC) It is preferable to suppress the change of the viscosity of the phosphor paste 1 in.

In addition, it is preferable to use the solvent 3 whose viscosity change rate by temperature in 20 degreeC-30 degreeC which is the temperature range at the time of providing the fluorescent substance paste 1 to a process is smaller than the high viscosity solvent 2. As shown in FIG. As an example of the solvent (3), all the above-mentioned materials have a viscosity change by the temperature in the range of 20 degreeC-30 degreeC smaller than the viscosity change rate of the isobornyl cyclohexanol which is the high viscosity solvent (2).

By using such a material as the solvent 3, the viscosity change at the time of the process of the fluorescent substance paste 1 can be suppressed. For this reason, the workability of the fluorescent substance paste 1 can be improved and manufacturing efficiency can be improved.

Although the ratio of each structural component contained in the fluorescent paste 1 changes with the required viscosity, in the present embodiment, the following was created as an example of the fluorescent paste 1. That is, the weight ratio with respect to the phosphor paste 1 was 30 wt% for the phosphor particles 5, 16 wt% for the solvent 3, and 54 wt% for the high viscosity solvent 2. The viscosity in the whole phosphor paste 1 was 25,000 mPa * s at 25 degreeC.

In the present embodiment, a method of dispersing the phosphor particles 5 in the vehicle 4 has been described, but the order of the mixing step and the dispersing step is not limited to this.

For example, it is good also as a method of disperse | distributing fluorescent substance particle 5 in the solvent 3, creating a slurry, and mixing the high viscosity solvent 2 heated in 40 to 70 degreeC with this. Or you may make it the method of disperse | distributing fluorescent substance particle 5 in the high viscosity solvent 2 heated in the range of 40 degreeC-70 degreeC, and mixing the solvent 3 to this.

Whatever method is used, the phosphor paste 1 in which the phosphor particle 5 was disperse | distributed in the solvent 3 and the high viscosity solvent 2 like the method shown in FIG. 1 is obtained.

< PDP Structure of

Next, an example of the structure of the PDP of the AC surface discharge type will be described as an example of the structure of the PDP as an application example of the phosphor paste 1 of the present embodiment with reference to FIGS. 3 and 4. FIG. 3 is an enlarged perspective view of an essential part showing an enlarged main part of the PDP of the present embodiment, and FIG. 4 is an enlarged cross-sectional view of an essential part showing a state in which the front structure and the back structure shown in FIG. 3 are polymerized. In addition, in FIG. 3, in order to demonstrate the structure of a PDP, the front structure and the back structure are shown in the state separated from predetermined space | interval.

In FIG. 3, the PDP 10 has a front structure (first structure) 11 and a back structure (second structure) 12. The front structure body 11 and the back structure body 12 are combined in the state facing each other.

The front structure 11 has a display surface of the PDP 10, and has a front substrate (substrate, first substrate) 13 mainly composed of glass on the display surface side. On the surface opposite to the display surface of the front substrate 13, a plurality of X electrodes (electrodes, first electrodes) 14 and Y electrodes (electrodes, first electrodes) 15 for performing sustain discharge are formed. .

The X electrode 14 and the Y electrode 15 are formed on the display surface side of the PDP 10. For this reason, for example, the X transparent electrode 14a and Y transparent electrode 15a composed of a transparent electrode material such as indium tin oxide (ITO), and the X bus electrode 14b electrically connected to each transparent electrode are provided. And the Y-bus electrode 15b.

The X bus electrode 14b and the Y bus electrode 15b are formed to reduce the electrical resistance of the X electrode 14 and the Y electrode 15, and are formed of Cu, Ag, or the like having lower electrical resistance than the transparent electrode. It is becoming.

The X electrode 14 and the Y electrode 15 are formed to extend in the horizontal (row) direction, respectively. In FIG. 3, although the shape of the X transparent electrode 14a and the Y transparent electrode 15a was made into the strip shape extended in the horizontal direction, it is not limited to this shape, A various modified example exists. For example, for the purpose of improving the discharge efficiency of the sustain discharge, or the like, the distance between the X electrode 14 and the Y electrode 15 may be approached locally corresponding to the position of the discharge space described later.

In addition, the X electrode 14 and the Y electrode 15 are arranged at predetermined intervals in the vertical (column) direction, each of which intersects the direction in which to extend. Further, the X electrodes 14 and the Y electrodes 15 adjacent to each other are arranged to be paired. For example, the X electrode 14 and the Y electrode 15 are alternately arranged. In the PDP 10, a pair of X electrodes 14 and Y electrodes 15 constitute a row of displays.

These electrode groups (X electrode 14 and Y electrode 15) are covered with dielectric layer 17. On the surface of the dielectric layer 17, a protective layer (metal oxide layer) 18 made of metal oxide such as MgO is formed. The protective layer 18 is formed to cover one surface of the dielectric layer 17.

The material used for the protective layer 18 is not limited to the single component of MgO. For example, it is good also as a composite material which mixed Ca0 (calcium oxide) with MgO. By mixing CaO, the spatter resistance of the protective layer 18 can be improved.

On the other hand, the back structure 12 has a back substrate (substrate, 2nd board | substrate) 19 mainly comprised from glass. On the rear substrate 19, a plurality of address electrodes (electrodes, second electrodes) 20 are formed. Each address electrode 20 is formed to extend in a vertical (column) direction intersecting (approximately perpendicular) to the direction in which the X electrode 14 and the Y electrode 15 extend. In addition, each address electrode 20 is arrange | positioned with predetermined arrangement | positioning interval so that it may become mutually (about parallel).

The address electrode 20 is covered with the dielectric layer 21. On the dielectric layer 21, a plurality of partition walls 22 extending in the thickness direction of the back structure 12 are formed. The partition wall 22 is formed to extend in a line along the direction in which the address electrode 20 extends. In addition, the planar position of the partition 22 is arrange | positioned between the address electrodes 20 which adjoin each other. By arranging the partition walls 22 between the address electrodes 20 adjacent to each other, a space is formed in which the surface of the dielectric layer 21 is divided in the column direction corresponding to the position of each address electrode.

In addition, the upper surface of the dielectric layer 21 on the address electrode 20 and the side surface of the partition wall 22 are excited by vacuum ultraviolet rays to generate various visible lights of red (R), green (G), and blue (B). Phosphors 23r, 23g, and 23b are formed at predetermined positions, respectively.

In the PDP 10, one cell is formed corresponding to the intersection of the pair of X electrode 14, Y electrode 15, and address electrode 20. FIG. In each cell, any one of the applied phosphor 23r, the antler phosphor 23g, or the blue phosphor 23b is formed, respectively. The pixel (pixel) is comprised by this set of each cell of R, G, and B. That is, each of the phosphors 23r, 23g, and 23b is a light emitting element of the PDP 10 and is excited by vacuum ultraviolet rays having a predetermined wavelength generated by discharge, and thus red (R), green (G), and blue (B). Generates visible light of each color.

Here, each of the phosphors 23r, 23g, and 23b is formed using the phosphor paste 1 of the present embodiment, respectively. The effect obtained by using the phosphor paste 1 for formation of the phosphor 23 will be described in detail when explaining the method of manufacturing the PDP 10.

Next, as shown in FIG. 4, the front structure 11 and the back structure 12 are fixed in a state where the surface on which the protective layer 18 is formed and the surface on which the partition wall 22 is formed are opposed to each other. The protective layer 18 and the partition 22 are fixed in the state which at least one part contacted. The distance between the front structure 11 and the back structure 12 is defined by the partition wall 22, and the distance is about 100 micrometers, for example.

By fixing in a state where the protective layer 18 and the partition wall 22 are in contact with each other, the discharge space 24 partitioned by the protective layer 18 and the partition wall 22 is formed, and the back structure 12 of the discharge space 24 is formed. The phosphor 23 is formed in the surface (bottom surface and both side surfaces) of the side. In addition, the periphery of the PDP 10 is sealed by sealing agent (not shown), such as a low melting glass material called flit, for example, and the gas called discharge gas (for example, in discharge space 24) (for example, Mixed gas of Ne and Xe) is sealed at a predetermined pressure.

The PDP 10 is configured to generate discharge for each cell in the discharge space 24 and to excite and emit the phosphors 23 of R, G, and B by vacuum ultraviolet rays generated by the discharge.

By the way, although the PDP 10 has various structures according to required performance, a drive system, etc., the PDP 10 of this embodiment is not limited to the structure shown in FIG. 3 and FIG. For example, in FIG. 3, the example which divides the discharge space by the partition 22 extended in a line form (vertical direction) was demonstrated.

However, in some cases, the discharge space is partitioned into partition walls arranged in a lattice form for the purpose of improving the brightness. The PDP 10 of the present embodiment may take such a configuration.

Industrial availability

INDUSTRIAL APPLICABILITY The present invention can be applied to a PDP module having various circuit boards, such as a driving circuit, on a PDP, a PDP, or a PDP device having a cover or a supporting member attached to the PDP module.

Among the inventions disclosed in the present application, the effects obtained by the representative ones are briefly described as follows.

That is, since a predetermined viscosity is obtained without using a polymer in the phosphor paste, the production efficiency of a product (for example, PDP or the like) using the phosphor paste can be improved.

BRIEF DESCRIPTION OF THE DRAWINGS It is explanatory drawing which shows the manufacturing flow of the dielectric paste which is one Embodiment of this invention.
It is explanatory drawing which shows the temperature dependence of the viscosity and evaporation amount of the high viscosity solvent which is one Embodiment of this invention.
Fig. 3 is an enlarged perspective view of a main part showing an enlarged main part of a PDP which is an embodiment of the present invention.
4 is an enlarged cross-sectional view of the main portion showing a state in which the front structure and the back structure shown in FIG. 3 are polymerized.

< PDP Manufacturing Method of (10)>

Next, the manufacturing method of the PDP 10 of this embodiment is demonstrated using FIG. 3 and FIG.

(A) First, the front structure 11 (the protective layer 18 is not formed) and the back structure 12 shown in FIG. 3 are prepared. The front structure 11 prepared in this preparation process is manufactured as follows, for example.

First, the front substrate 13 is prepared, and the X electrode 14 and the Y electrode 15 are formed on one surface in a predetermined pattern. In addition, bus electrodes 16 are formed on the X electrodes 14 and Y electrodes 15, respectively. Next, the dielectric layer 17 is formed on the front substrate 13 so as to cover the X electrode 14, the Y electrode 15, and the bus electrode 16. In this step, the protective layer 18 shown in FIG. 3 is not formed in the front structure 11.

In addition, the back structure 12 shown in FIG. 3 is manufactured as follows, for example.

(a) First, the back substrate 19 shown in FIG. 3 is prepared (substrate preparation process).

(b) Next, a plurality of address electrodes 20 are formed on the surface of the back substrate 19.

(c) Next, the dielectric layer 21 is formed so as to cover the address electrode 20.

(d) After the dielectric layer 21 is formed, the partition 22 defining the discharge space is formed on the surface of the dielectric layer 21. The partition wall 22 is formed to extend along the address electrode 20. This partition 22 can be formed by the sand blasting method, for example.

(e) Next, predetermined phosphors 23r, 23g, and 23b are formed in each of the plurality of spaces (bottom and sidewalls) divided by the partition wall 22. In this phosphor formation step, it is formed by the following method.

(e1) First, the fluorescent substance paste 1 (refer FIG. 1) of this embodiment is apply | coated to several space (bottom face and side wall) divided by the partition 22. As shown in FIG. As the coating method of the fluorescent paste 1, the screen printing method or the dispensing method (nozzle filling method) can be used.

In the case where the phosphor paste 1 is applied by the screen printing method, the phosphor paste 1 passes through the screen mesh, suppresses the sagging after application, and is applied to the phosphor paste applied to each space divided by the partition wall 22 ( What is necessary is just to have the viscosity of the film | membrane of 1) to maintain the shape. When the present inventors examined, if the viscosity of the fluorescent paste 1 is the range of 15,000-120,000 mPa * s, such conditions are satisfied.

In addition, when the fluorescent paste 1 is applied by the dosing method, a suitable amount can be sent out from the discharge nozzle of the dispenser, the liquid sagging after the application is suppressed, and the phosphor paste applied to each space divided by the partition wall 22. What is necessary is just to have the viscosity of the film | membrane of (1) that can maintain shape. As the inventors have examined, these conditions are satisfied if the viscosity of the phosphor paste 1 is in the range of 15,000 to 120,000 mPa · s as in the case of the screen printing method.

(e2) Next, the phosphor paste 1 is heated to remove the organic compound components (solvent 3 and high viscosity solvent 2) contained in the phosphor paste 1. Moreover, in this heating process, it heats to the melting | fusing point of the inorganic particle component (phosphor particle 5) contained in the fluorescent substance paste 1, and fuses and integrates this.

Here, when the polymer paste is contained in the phosphor paste, the polymer is decomposed into monomers and then gasified. For this reason, in order to gasify all the organic compound components, much heat energy is needed. If a part of the phosphor particles 5 are melted and integrated before all the organic compound components are gasified, there is a possibility that the organic compound components (particularly polymers) remain as residues in the phosphor 23.

For this reason, in the case of using a phosphor paste containing a polymer, a step (de-binder process) of gasifying and discharging the polymer is generally required by maintaining the temperature at a temperature lower than the melting point of the phosphor particles for a predetermined time. Even if this debinder process is performed, when the temperature at which the polymer is completely gasified and the temperature at which the phosphor particles 5 are integrated are close, some of the organic compound components may remain as residues in the phosphor 23.

However, since the phosphor paste 1 of this embodiment does not contain a polymer as an organic compound component, compared with the phosphor paste containing a polymer, the thermal energy required for gasifying this organic compound component is low. This is because a process for decomposing the polymer into monomers is not necessary.

In addition, among the organic chemical components constituting the phosphor paste 1, the high viscosity solvent 2 requires more thermal energy to evaporate than the solvent 3, but this high viscosity solvent 2 is also 70 as shown in FIG. It can be evaporated by heating to more than C. In addition, it is easy to evaporate further by raising temperature.

Therefore, since the phosphor paste 1 does not contain a polymer as an organic compound component, the organic compound component can be easily removed. For example, even after the phosphor paste 1 is applied, even when the phosphor particles 5 are linearly heated to a temperature at which the phosphor particles 5 melt and integrate (for example, 230 ° C.), before the phosphor particles 5 are integrated, The organic compound component can be completely removed.

That is, since a binder removal process can be omitted, manufacturing efficiency can be improved significantly.

The phosphor particles 5 may not be heated linearly to the temperature at which they melt and integrate, but may be held at a temperature lower than this (for example, 200 ° C.) for several tens of minutes. In this case, the possibility that the residue of the organic compound component remains in the phosphor 23 can be reliably prevented.

Also in this case, since the time for decomposing the polymer into monomers is not necessary, the holding time can be significantly shortened.

Since the phosphor 23 included in the PDP 10 of the present embodiment is formed using the phosphor paste 1, the organic compound component can be completely removed. For this reason, since generation | occurrence | production of the decomposition gas resulting from the residue of an organic compound component can be prevented, the reliability of the PDP 10 can be improved. When this heating process is completed, the back structure 12 shown in FIG. 3 is obtained.

(B) Next, a protective layer 18 is formed on the surface of the dielectric layer 17 of the front structure 11 as a protective layer forming step. The protective layer 18 is comprised from MgO, for example, and can be formed by a vapor deposition method, for example. In this embodiment, the protective layer 18 of MgO whose film thickness is 1 micrometer is formed on the surface of the dielectric layer 17 by the vacuum evaporation method by the electron beam using the MgO source as a target.

Here, metal oxides such as MgO constituting the protective layer 18 have a property of easily adsorbing moisture and the like in the atmosphere. For this reason, it is preferable to perform this protective layer formation process in a vacuum (pressure reduction) atmosphere, and to prevent or suppress adhesion of the moisture to the protective layer 18. FIG.

(C) Next, the back structure 12 and the front structure 11 are assembled. The assembling process is performed as follows, for example.

First, as the alignment (alignment) step, the alignment is performed so that the front structure 11 and the rear structure 12 have a predetermined positional relationship. In the positioning process, high-precision fine adjustment is performed so that the X electrode 14, Y electrode 15 of the front structure 11 and the address electrode 20 of the back structure 12 are in a predetermined positional relationship.

Next, as a sealing process, it superpose | polymerizes in the state which opposes the surface in which the protective layer 18 of the front structure 11 was formed, and the surface in which the partition 22 of the back structure 12 was formed, as shown in FIG. The periphery of the area | region which overlaps the front structure 11 and the back structure 12 is sealed with sealing agent (not shown), such as a low melting glass material called a flit, for example. When this sealing process is completed, the front structure 11 and the back structure 12 are fixed in the state which maintained the predetermined positional relationship.

The sealing agent adheres to the front structure 11 and the back structure 12, respectively, and seals the peripheral portions of both structures. As a result, the discharge space 24 shown in FIG. 4 is cut off from the outside of the PDP 10.

(However, a ventilation port for enclosing the exhaust gas and the discharge gas of the internal gas formed at one or more positions of the front structure 11 or the back structure 12 is secured).

Therefore, in this sealing process, in order to prevent the phenomenon which the protective layer 18 adsorb | sucks impurities, such as water, it is preferable to carry out in a vacuum (pressure reduction) atmosphere.

Next, as the discharge gas introduction step, a dilution gas or the like in the discharge space 24 through a ventilation path connected to a ventilation hole (not shown) formed at one or more positions of the front structure 11 or the rear structure 12. Predetermined discharge gas (for example, a mixed gas of Ne and Xe) is introduced. Before introducing the discharge gas, the residual gas in the discharge space 24 is exhausted in advance.

Finally, the opening of the ventilation hole is sealed in the sealing step, so that the PDP 10 is completed.

As mentioned above, although the invention made by this inventor was demonstrated concretely based on embodiment, this invention is not limited to embodiment of the said invention, A various change is possible in the range which does not deviate from the summary.

For example, although the PDP 10 was demonstrated as an application example of the fluorescent paste 1, the circuit board in which circuits, such as a drive circuit, were formed may be attached to this PDP, and it may be set as a PDP module. It goes without saying that the PDP module may be attached to a PDP device by attaching a support member such as a case or a stand to the PDP module.

Claims (5)

The first organic compound,
Having phosphor particles dispersed in the first organic compound,
The first organic compound,
A phosphor paste having a terpene skeleton and having a viscosity at 25 ° C. of 10,000 to 1,000,000 mPa · s. In the phosphor paste according to claim 1,
The phosphor paste has a second organic compound having a lower viscosity at 25 ° C. than the first organic compound. In the phosphor paste according to claim 2,
The second organic compound has a lower rate of change in viscosity due to temperature at 20 ° C to 30 ° C than the first organic compound. In the phosphor paste according to claim 1,
The first organic compound is an organic compound represented by the following structural formula (1).
[Formula 1]

In the phosphor paste according to claim 1,
The phosphor paste is used for forming a phosphor which is a light emitting element of a plasma display panel.

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