KR20100096491A - Siloxane modified polyamideimide resin and producing method of the same - Google Patents

Siloxane modified polyamideimide resin and producing method of the same Download PDF

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KR20100096491A
KR20100096491A KR1020090015392A KR20090015392A KR20100096491A KR 20100096491 A KR20100096491 A KR 20100096491A KR 1020090015392 A KR1020090015392 A KR 1020090015392A KR 20090015392 A KR20090015392 A KR 20090015392A KR 20100096491 A KR20100096491 A KR 20100096491A
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polyamideimide resin
modified polyamideimide
formula
siloxane
coating
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KR1020090015392A
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KR101608086B1 (en
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서동진
이준희
이태중
김선태
박재완
김지성
박선주
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엘에스전선 주식회사
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14Polyamide-imides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42Block-or graft-polymers containing polysiloxane sequences
    • C08G77/452Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
    • C08G77/455Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00Insulated conductors or cables characterised by their form
    • H01B7/02Disposition of insulation

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  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
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  • Organic Insulating Materials (AREA)
  • Paints Or Removers (AREA)

Abstract

PURPOSE: A siloxane modified polyamideimide resin and a manufacturing method thereof are provided to manufacture a coating agent capable of uniformly forming an insulation paint coated film on an edge unit of a straight angle conductor. CONSTITUTION: A manufacturing method of a siloxane modified polyamideimide resin comprises: a step of condense-reacting a polyamideimide resin marked with chemical formula 2 and polydimethylsiloxane dicarboxylic acid marked with chemical formula 3. In the chemical formulas, N is a natural number selected from 1~20. The molecular weight of the siloxane modified polyamideimide resin is 10,000~100,000.

Description

실록산 변성 폴리아미드이미드 수지 및 그 제조방법{SILOXANE MODIFIED POLYAMIDEIMIDE RESIN AND PRODUCING METHOD OF THE SAME}Siloxane-modified polyamideimide resin and its manufacturing method {SILOXANE MODIFIED POLYAMIDEIMIDE RESIN AND PRODUCING METHOD OF THE SAME}

본 발명은 평각 권선의 절연층 제조에 이용될 수 있는 실록산 변성 폴리아미드이미드 수지 및 그 제조방법에 관한 것으로서, 더욱 상세하게는 평각권선의 에지부의 피막이 균일하게 형성되고, 우수한 전기절연성, 유연성 및 내마모성 등을 확보하기 위해 폴리디메틸실록산디카르복실산과 축합반응시켜 제조된 실록산 변성 폴리아미드이미드 수지 및 그 제조방법에 관한 것이다.The present invention relates to a siloxane-modified polyamideimide resin that can be used for the production of an insulating layer of a flat winding, and a method of manufacturing the same. More particularly, the film of the edge portion of the flat winding is uniformly formed, and has excellent electrical insulation, flexibility, and wear resistance. The present invention relates to a siloxane-modified polyamideimide resin prepared by condensation reaction with polydimethylsiloxane dicarboxylic acid in order to secure such a material, and a method for producing the same.

종래의 평각권선은, 그 단면이 원형인 환선을 압연하여 그 단면이 사각형의 형상을 갖는다. 구체적으로는 환선을 압연하여 평각선을 먼저 제조한 후, 일정한 규칙에 따라 절연도료를 도포 경화하는 방법이 있으며, 이와 반대로 환선에 절연도료를 먼저 도포 경화한 후, 이를 압연하여 평각선으로 변형시키는 방법이 있다. 상기 절연도료는, 도체인 동, 동합금, 알루미늄 등의 내부 도체의 외주에 폴리우레탄 절연도료, 폴리에스테르 절연도료, 폴리에스테르이미드 절연도료가 피복된다.In the conventional flat winding, the circular wire whose cross section is circular is rolled, and the cross section has a rectangular shape. Specifically, there is a method of manufacturing a flat wire first by rolling a round wire, and then applying and curing an insulating paint according to a predetermined rule. There is a way. The insulating paint is coated with a polyurethane insulating paint, a polyester insulating paint, and a polyesterimide insulating paint on the outer circumference of an inner conductor such as copper, copper alloy, and aluminum, which are conductors.

환선을 압연하여 평각선으로 먼저 제조한 후 절연도료를 도포 경화하는 방법에 따르면, 평각도체의 에지부에 절연도료가 잘 형성되지 않거나, 절연도료의 형성 이 일부 이루어지더라도 에지부의 피막이 너무 얇게 형성되어 전체적으로 균일한 피막을 형성하기 어려운 단점이 있다. According to the method of rolling the round wire first to make a flat wire, and then applying and curing the insulating paint, the edge coating of the flat conductor is too thin, or the edge coating is too thin even if the insulating paint is partially formed. There is a disadvantage that it is difficult to form a uniform film as a whole.

이와 같이, 평각권선의 에지부의 피막이 너무 얇게 형성되는 경우에는 피막 손상에 따른 도체 표면 노출이 쉽게 이루어질 수 있으며, 이 경우 얇게 형성된 피막 부위나 표면으로 노출된 도체 부분에서 전기절연성이 급격히 저하되어 전기 기기의 사용에 문제가 발생될 수 있으며, 평각권선의 신뢰성이 저하되어 바람직하지 못한 문제점이 있다.As such, when the film of the edge portion of the flat winding is formed too thin, the surface of the conductor may be easily exposed due to the damage of the film. In this case, the electrical insulation is sharply degraded in the thin film or the exposed portion of the conductor. Problems may occur in the use of, and the reliability of the flat winding is lowered, there is an undesirable problem.

이러한 문제점에 대응하여, 평각 권선 가공시 전기 절연성을 유지하기 위해 피막을 두껍게 형성하는 방법을 고려해볼 수 있으나, 이는 환선에 비하여 바니시 사용량이 증대하여 평각 권선의 제조에서 경제성이 저하되는 문제점이 지적되고 있다. 또한, 이러한 경우에 피막이 균일하게 도포되지 않는 단점도 발생하고 있다.In response to this problem, a method of forming a thick film may be considered in order to maintain electrical insulation during the processing of the flat winding, but this is pointed out that the use of the varnish is increased compared to the round wire, resulting in a decrease in economic efficiency in the manufacture of the flat winding. have. In addition, in this case, a disadvantage arises in that the coating is not evenly applied.

전술한 바와 같이, 환선을 압연한 후, 평각도체를 제조하고, 그 외측에 일정한 규칙에 따라 절연도료를 도포 경화하는 방법에서, 전기 절연성이나 유연성, 내마모성이 열화되면서, 평각도체의 에지부에 형성된 절연도료의 피막이 균일하게 형성되지 못하는 문제를 해결하기 위한 다각적인 노력이 관련분야에서 진행되어 왔으며, 이러한 기술적 배경하에서 본 발명이 안출되었다.As described above, in the method of manufacturing a flat conductor after applying a rolling wire and applying and curing an insulating coating on the outside thereof according to a predetermined rule, the electrical insulation, flexibility, and abrasion resistance are deteriorated, Various efforts have been made in the related art to solve the problem that the insulating coating film is not uniformly formed, and the present invention has been made under such a technical background.

본 발명이 해결하고자 하는 과제는, 평각 권선을 제조함에 있어서 폴리아미드이미드 수지가 갖는 내열성을 유지하면서 모터나 알터네이터 등의 전기기기의 효 율적인 가공을 위해 더 향상된 유연성을 갖도록 하고, 에지부에서 전기 절연성을 유지하기 위하여 전체적으로 두껍게 형성된 피막이 에지부 및 평탄부에 균일하게 형성되도록 하여 경제적 손실을 최소화하면서 평각 권선의 절연도료 피막을 균일하게 형성되도록 하는 데에 있으며, 이러한 기술적 과제의 달성을 위해 실록산 변성 폴리아미드이미드 수지 조성물 및 그 제조방법을 제공함에 본 발명의 목적이 있다.The problem to be solved by the present invention is to provide a more improved flexibility for the efficient processing of electrical equipment such as a motor or alternator while maintaining the heat resistance of the polyamideimide resin in manufacturing a flat winding, In order to maintain insulation, the overall thick film is uniformly formed on the edge and the flat portion to minimize the economic loss, and the insulating coating film of the flat winding is uniformly formed. It is an object of the present invention to provide a polyamideimide resin composition and a method for producing the same.

본 발명의 과제 해결 수단으로 제공되는 실록산 변성 폴리아미드이미드 수지는, 하기 화학식 1의 구조의 모노머로 이루어지며, 평각권선용 피복재 제조에 이용되는 것을 특징으로 한다.The siloxane-modified polyamideimide resin provided as a means for solving the problems of the present invention is composed of a monomer having the structure of the following general formula (1), and is used for producing a covering material for a flat winding.

Figure 112009011452411-PAT00002
Figure 112009011452411-PAT00002

상기 화학식 1에서 하첨자로 표시된, m은 1 내지 50의 자연수이며, n은 1 내지 20의 자연수이다.In the formula (1), m is a subscript, m is a natural number of 1 to 50, n is a natural number of 1 to 20.

본 발명의 과제 해결 수단으로 제공되는 실록산 변성 폴리아미드이미드 수지의 제조방법은, 폴리아미드이미드 수지와 폴리디메틸실록산디카르복실산을 축합반응시켜 제조되는 것을 특징으로 한다.A method for producing a siloxane-modified polyamideimide resin provided as a means for solving the problems of the present invention is characterized by being produced by condensation reaction between a polyamideimide resin and a polydimethylsiloxane dicarboxylic acid.

본 발명에 따르면, 폴리아미드이미드 수지가 갖는 내열성, 전기 절연성을 유 지하면서 유연성과 내마모성이 더욱 향상되고, 평각도체의 에지부에 형성되는 절연도료 피막이 균일하게 형성되는 평각권선의 피복재를 제조할 수 있다. 특히, 본 발명에서 제공하는 피복재를 절연전선의 2층 이상의 코팅층을 제조하는 데에 사용하면 바람직하다.According to the present invention, it is possible to manufacture a coating material of a flat winding, in which the flexibility and wear resistance are further improved while maintaining the heat resistance and electrical insulation property of the polyamideimide resin, and the insulating coating film formed on the edge portion of the flat conductor is uniformly formed. have. It is preferable to use the coating | covering material provided by this invention especially for manufacturing the coating layer of two or more layers of an insulated wire.

이하, 본 발명을 구체적으로 설명하기 위해 실시예를 들어 설명하고, 발명에 대한 이해를 돕기 위해 첨부도면을 참조하여 상세하게 설명하기로 한다. 그러나, 본 발명에 따른 실시예들은 여러 가지 다른 형태로 변형될 수 있으며, 본 발명의 범위가 아래에서 상술하는 실시예들에 한정되는 것으로 해석되지 않아야 한다. 본 발명의 실시예들은 당 업계에서 평균적인 지식을 가진 자에게 본 발명을 보다 완전하게 설명하기 위해서 제공되는 것이다.Hereinafter, the present invention will be described in detail with reference to examples, and detailed description will be made with reference to the accompanying drawings in order to help understanding of the present invention. However, embodiments according to the present invention can be modified in many different forms, and the scope of the present invention should not be construed as being limited to the embodiments described below. Embodiments of the present invention are provided to more fully describe the present invention to those skilled in the art.

본 발명에 따르는 실록산 변성 폴리아미드이미드 수지는, 상기 화학식 1의 구조의 모노머로 이루어지며, 평각권선의 절연피복재 제조에 이용되면 바람직하다.The siloxane-modified polyamideimide resin according to the present invention is preferably composed of a monomer having the structure of Chemical Formula 1, and used for the production of an insulating coating material for a flat winding.

상기 화학식 1에 표시된 하첨자 m과 n에 대한 수치범위는 상기 실록산 변성 폴리아미드이미드 수지의 분자량이 10,000 내지 100,000이 될 수 있도록 조절되는 값으로 선택될 수 있다. 상기 실록산 변성 폴리아미드이미드 수지의 분자량에 대한 수치범위와 관련하여, 그 하한에 미달하면 절연도료의 코팅 공정상 피막이 충분하게 형성되지 못하여 피막이 깨지는 등의 평각 권선 특성에 바람직하지 못하며, 그 상한을 초과하면 바니시의 점도가 급격하게 증가하여 코팅 공정시 생산성 저하가 초래될 수 있으며, 더 심한 경우에는 코팅공정에 적용이 불가할 수 있어 바람직하 지 못하다. 특히, 상기 화학식 1에서, 하첨자 n에 관한 수치범위와 관련하여, 그 하한에 미달하면 일반 폴리아미드이미드 수지와 동일한 구조가 되므로 유연성이 상실되어 바람직하지 못하고, 그 상한을 초과하면 폴리아미드이미드 수지가 갖는 내열성을 확보할 수 없어 바람직하지 못하다.The numerical ranges for the subscripts m and n shown in the formula (1) may be selected to a value adjusted so that the molecular weight of the siloxane-modified polyamideimide resin can be 10,000 to 100,000. Regarding the numerical range of the molecular weight of the siloxane-modified polyamideimide resin, if it falls below the lower limit, it is not preferable for the flat winding characteristics such as the coating is not sufficiently formed during the coating process of the insulating coating, and the coating is broken, and the upper limit is exceeded. The lower viscosity of the varnish may result in a drastic increase in productivity during the coating process, and in more severe cases, it may not be applicable to the coating process. In particular, in the above formula (1), in relation to the numerical range relating to the subscript n, the lower limit thereof becomes the same structure as the general polyamideimide resin, and thus the flexibility is lost, and when the upper limit is exceeded, the polyamideimide resin It is unpreferable because the heat resistance which the has cannot be ensured.

본 발명에 따르는 실록산 변성 폴리아미드이미드 수지의 제조방법은, 하기 화학식 2의 구조를 갖는 모노머로 이루어지는 폴리아미드이미드 수지와 하기 화학식 3의 구조를 갖는 폴리디메틸실록산디카르복실산을 축합반응시켜 제조되면 바람직하다.When the method for producing a siloxane-modified polyamideimide resin according to the present invention is prepared by condensation reaction between a polyamideimide resin comprising a monomer having a structure of Formula 2 and a polydimethylsiloxane dicarboxylic acid having a structure of Formula 3 below: desirable.

<화학식 2><Formula 2>

Figure 112009011452411-PAT00003
Figure 112009011452411-PAT00003

상기 화학식 2에서 하첨자로 표시된 n은 1 내지 20의 자연수이다.N represented by a subscript in Formula 2 is a natural number of 1 to 20.

<화학식 3><Formula 3>

Figure 112009011452411-PAT00004
Figure 112009011452411-PAT00004

상기 화학식 3에서 하첨자로 표시된 m은 1 내지 50의 자연수이다. M represented by a subscript in Formula 3 is a natural number of 1 to 50.

본 발명에 따르는 실록산 변성 폴리아미드이미드 수지는 용매 이외에 사용 용도에 따른 적절한 첨가 성분을 더 포함할 수 있으며, 이러한 첨가 성분의 예로는 라디칼 중합 개시제, 동산화방지제, 증점제, 계면활성제 등이 있다. 이들 첨가 성 분은 고형분을 기준으로 하여, 상기 실록산 변성 폴리아미드이미드 수지 100 중량부에 대해 0.5 내지 10 중량부의 함량으로 각각 선택적으로 포함될 수 있다. In addition to the solvent, the siloxane-modified polyamideimide resin according to the present invention may further include suitable additive components according to the use purpose, and examples of such additive components include radical polymerization initiators, copper antioxidants, thickeners, surfactants, and the like. These additives may be optionally included in an amount of 0.5 to 10 parts by weight based on 100 parts by weight of the siloxane-modified polyamideimide resin based on solids.

하기와 같이 구분 설정된 비교예들(1, 2)과 실시예들(1~5)에서 제시되고 있는 바에 따라 수지 용액을 제조하였다.Resin solutions were prepared as shown in Comparative Examples (1, 2) and Examples (1-5), which are set as follows.

비교예 1Comparative Example 1

교반기, 냉각기, 온도계를 구비한 반응장치에 N-메틸 피롤리돈 1,160g, 자이렌 290g, 트리멜리틱언하이드라이드(TMA) 345.3g과 4,4-디메틸디이소시아네이트 (DMI)425g을 넣고 질소분위기하에 90℃로 5시간 반응시킨다. 이어서, 질소분위기하에서 140℃까지 2시간에 걸쳐 승온시키고, 5시간 동안 반응을 지속한다. 이후 그 결과물을 냉각하고 N-메틸피롤리돈/자이렌의 중량비가 1/4이 되도록 희석하고, 불휘발분이 25중량%인 수지용액(A)을 얻었다.Into a reactor equipped with a stirrer, a cooler, and a thermometer, 1,160 g of N-methyl pyrrolidone, 290 g of styrene, 345.3 g of trimellitic hydride (TMA) and 425 g of 4,4-dimethyl diisocyanate (DMI) were added to a nitrogen atmosphere. The reaction was carried out at 90 ° C. for 5 hours. Subsequently, the temperature was raised to 140 ° C. over 2 hours under a nitrogen atmosphere, and the reaction was continued for 5 hours. Thereafter, the resultant was cooled and diluted so that the weight ratio of N-methylpyrrolidone / xylene was 1/4, thereby obtaining a resin solution (A) having a nonvolatile content of 25% by weight.

비교예 2Comparative Example 2

비교예 1과 동일한 과정으로 제조하되, 최종적으로 불휘발분이 15중량%인 수지용액(B)을 얻었다.Prepared in the same manner as in Comparative Example 1, but finally obtained a resin solution (B) having a nonvolatile content of 15% by weight.

실시예 1Example 1

용제로로서, 자일렌 290g, N-메틸피롤리돈 1,160g, 트리멜리틱언하이드라이드(TMA) 345,3g과 4,4-디메틸디이소시아네이트(MDI) 425g을 넣고, 폴리디메틸실록산디카르복실산 13중량%(상기 TMA 중량 대비)를 넣고, 질소분위기 하에 90℃로 5시간 반응시킨다. 이어서, 질소 분위기하에서 140℃까지 2시간에 걸쳐 승온시키고, 5시간 동안 반응을 지속한다. 이후, 그 결과물을 냉각하고 N-메틸피롤리돈/자이렌의 중량비가 1/4이 되도록 희석하고, 불휘발분이 25중량%인 수지용액(C)을 얻었다.As a solvent, 290 g of xylene, 1,160 g of N-methylpyrrolidone, 345,3 g of trimellitic hydride (TMA) and 425 g of 4,4-dimethyl diisocyanate (MDI) were added thereto, and a polydimethylsiloxane dicarboxylic acid was added. 13% by weight (based on the TMA weight) was added and reacted at 90 ° C. for 5 hours under a nitrogen atmosphere. Then, the temperature was raised to 140 ° C. over 2 hours under a nitrogen atmosphere, and the reaction was continued for 5 hours. Thereafter, the resultant was cooled and diluted so that the weight ratio of N-methylpyrrolidone / xylene became 1/4, thereby obtaining a resin solution (C) having a nonvolatile content of 25% by weight.

실시예 2Example 2

상기 폴리디메틸실록산 디카르복실산을 30중량%(상기 TMA 중량 대비) 사용한 것을 제외하고는 상기 실시예 1과 동일한 과정으로 제조하여 수지용액(D)을 얻었다.Except that 30% by weight of the polydimethylsiloxane dicarboxylic acid (based on the TMA weight) was prepared in the same manner as in Example 1 to obtain a resin solution (D).

실시예 3Example 3

상기 폴리디메틸실록산 디카르복실산을 50중량%(상기 TMA 중량 대비) 사용한 것을 제외하고는 상기 실시예 1과 동일한 과정으로 제조하여 수지용액(E)을 얻었다.Except that the polydimethylsiloxane dicarboxylic acid 50% by weight (based on the TMA weight) was prepared in the same manner as in Example 1 to obtain a resin solution (E).

실시예 4Example 4

상기 폴리디메틸실록산 디카르복실산을 6중량%(상기 TMA 중량 대비) 사용한 것을 제외하고는 상기 실시예 1과 동일한 과정으로 제조하여 수지용액(F)을 얻었다.Except for using the polydimethylsiloxane dicarboxylic acid 6% by weight (based on the TMA weight) was prepared in the same manner as in Example 1 to obtain a resin solution (F).

실시예 5Example 5

상기 폴리디메틸실록산 디카르복실산을 1중량%(상기 TMA 중량 대비) 사용한 것을 제외하고는 상기 실시예 1과 동일한 과정으로 제조하여 수지용액(G)을 얻었다.Except for using the polydimethylsiloxane dicarboxylic acid 1% by weight (based on the TMA weight) was prepared in the same manner as in Example 1 to obtain a resin solution (G).

전술한 비교예들(1,2) 및 실시예들(1~5)에 따라 준비된 수지용액(A~G)에 대해 점도, 고형분, 유연성을 다음과 같이 측정하여 하기 표 1에 나타내었다. The viscosity, solid content, and flexibility of the resin solutions (A to G) prepared according to Comparative Examples (1, 2) and Examples (1 to 5) described above are shown in Table 1 below.

점도는 브룩필드 점도계를 이용하여 측정하였으며, 고형분은 200℃ 열풍 순 환오븐에서 2시간 경화시킨 후, 솔벤트가 휘발되기 전 무게 대비 휘발된 후 무게를 백분율로 계산하여 나타내었다. 수지용액들의 표면장력은 링형태의 표면장력 측정기를 이용하여 측정하였다. Viscosity was measured using a Brookfield viscometer, and the solid content was cured for 2 hours in a 200 ° C. hot air circulating oven, and the weight was expressed as a percentage after the solvent was volatilized to the weight before volatilization. The surface tension of the resin solutions was measured using a ring tension surface tension meter.

한편, 두께가 1.064㎜이고, 폭이 0.946㎜인 평각도체를 감싸도록 전술한 바에 따라 준비된 각각 수지용액들(A~G)을 이용하여 0.030㎜의 두께를 갖는 절연피복재를 도포한 후, 경화시켜 평각권선의 절연피복재를 제조한 후, 에지부의 피막 경향성을 파악하기 위해 평각권선의 단면을 잘 연마하여 피막의 외관을 육안 관찰하였으며, 에지커버리지(edge coverage)를 측정하였다. 에지커버리지는 평각권선 단면의 평평한 부위의 상하좌우를 측정하고, 에지부 4곳을 각각 측정한 후, 하기 수학식에 따라 에지커버리지를 계산하였다.On the other hand, by coating the insulating coating material having a thickness of 0.030mm using resin solutions A to G prepared as described above to cover the flat conductor having a thickness of 1.064 mm and a width of 0.946 mm, and then cured. After fabricating the insulation coating of the flat winding, the cross-section of the flat winding was polished well to visually observe the appearance of the film in order to determine the film tendency of the edge portion, and the edge coverage was measured. Edge coverage was measured up, down, left, and right of the flat portion of the cross section of the flat winding, and after measuring the four edge portions, respectively, edge coverage was calculated according to the following equation.

절연파괴전압(Breakdown Voltage, BDV) 측정은 IEC 60317에 따라 측정하였다. BVD의 측정은 권선에 따라 그 측정방법이 결정되어 있으나, 그 단면적이 작은 세평각권선의 경우에는 별도의 규격이 제정되어 있는 것은 아니나, 동일한 단면적을 갖는 환선의 경우에 대비하는 경우 6,500V 이상이면 바람직한 것으로 평가된다.Breakdown Voltage (BDV) was measured according to IEC 60317. The measurement method of BVD is determined by winding. However, for the triangular windings with small cross-sectional area, a separate standard is not established. It is evaluated as preferable.

Figure 112009011452411-PAT00005
Figure 112009011452411-PAT00005

구분
division
실시예(1~5)Example (1-5) 비교예(1,2)Comparative Example (1, 2)
1One 22 33 44 55 1One 22 수지용액Resin Solution 점도(poise)Viscosity 1515 1818 2828 1616 1414 1414 1111 고형분(%)Solid content (%) 2828 3232 3838 27.127.1 27.327.3 2525 1515 표면장력(dyne/㎝)Surface tension (dyne / cm) 2424 2323 2323 2626 2828 3434 3333 피막film 외관Exterior 양호Good 양호Good 양호Good 양호Good 양호Good 양호Good 양호Good BDV(V)BDV (V) 92009200 96009600 82008200 92009200 82008200 54005400 62006200 에지 커버리지(%)Edge coverage (%) 9494 9898 8686 9595 7979 6565 4242

환선을 압연하여 평각도체를 제조한 후, 그 외측에 일정한 규칙으로 절연도료를 도포 경화하는 방법에 의해 평각 권선을 제조하는 경우, 절연 도료를 도포 경화하더라도 에지부의 피막이 균일하게 형성되고 전기절연성이나 유연성이 우수하기 위해서는, 상기 절연도료의 점도는 5 내지 40 poise이고, 고형분이 10 내지 40%이며, 표면장력은 24 내지 32 dyne/㎝이면 바람직하다. After manufacturing the flat conductor by rolling the round wire, and manufacturing the flat winding by the method of coating and curing the insulating paint on the outside thereof, even if the coating is cured, the coating of the edge part is formed uniformly and the electrical insulation or flexibility For this to be excellent, it is preferable that the viscosity of the insulating paint is 5 to 40 poise, the solid content is 10 to 40%, and the surface tension is 24 to 32 dyne / cm.

상기 절연도료의 점도에 대한 수치범위와 관련하여, 그 하한에 미달하면 원하는 피막이 형성되지 않아 바람직하지 못하며, 그 상한을 초과하면 코팅 작업이 원활하게 진행되지 않아 바람직하지 못하다. 상기 절연도료의 표면장력에 대한 수치범위와 관련하여, 그 하한에 미달하면 바니시 유동이 너무 심하여 에지부에서 피막이 너무 얇게 형성되어 바람직하지 못하며, 그 상한을 초과하면 에지부 피막의 두께에 비하여 평탄부 피막이 너무 두껍게 형성되어 에지커버리지가 양호하지 않게 된다. 절연도료의 피막에서 에지커버리지가 좋지 못하면 피막두께 편자가 발생되어 전기적 특성이 저하되어 바람직하지 못하다.With respect to the numerical range for the viscosity of the insulating paint, if the lower limit is not desirable, the desired coating is not formed, and if the upper limit is exceeded, the coating operation does not proceed smoothly and is not preferable. Regarding the numerical range of the surface tension of the insulating paint, if it falls below the lower limit, the varnish flow is too severe and the film is formed too thin at the edge portion, and if the upper limit is exceeded, the flat portion is thicker than the thickness of the edge coating. The film is formed too thick, resulting in poor edge coverage. If the edge coverage is poor in the coating of the insulating paint, the film thickness is generated, the electrical characteristics are deteriorated, which is undesirable.

상기 표 1에 나타낸 바와 같이, 실시예들(1~5)에서 BVD, 에지커버리지 등의 모든 물성에서 비교예들(1.2)에 비해 우수한 평가 결과가 측정되었음을 확인할 수 있다.As shown in Table 1, it can be confirmed that in Examples 1 to 5, excellent evaluation results were measured in comparison with Comparative Examples (1.2) in all physical properties such as BVD and edge coverage.

이상에서 설명된 본 발명의 최적 실시예들이 개시되었다. 여기서 특정한 용어들이 사용되었으나, 이는 단지 당업자에게 본 발명을 상세히 설명하기 위한 목적에서 사용된 것이지 의미한정이나 특허청구범위에 기재된 본 발명의 범위를 제한하기 위해 사용된 것이 아니다.Optimal embodiments of the present invention described above have been disclosed. Although specific terms have been used herein, they are used only for the purpose of describing the present invention in detail to those skilled in the art and are not intended to limit the scope of the present invention as defined in the claims or the claims.

Claims (3)

하기 화학식 1의 구조의 모노머로 이루어지며, 평각권선의 절연피복재 제조에 이용되는 것을 특징으로 하는 실록산 변성 폴리아미드이미드 수지.A siloxane-modified polyamideimide resin, comprising a monomer having a structure of Formula 1, used for preparing an insulating coating of a flat winding. <화학식 1><Formula 1>
Figure 112009011452411-PAT00006
Figure 112009011452411-PAT00006
상기 화학식 1에서 하첨자로 표시된, m은 1 내지 50의 자연수이며, n은 1 내지 20의 자연수이다.In the formula (1), m is a subscript, m is a natural number of 1 to 50, n is a natural number of 1 to 20.
제1항에 있어서,The method of claim 1, 상기 실록산 변성 폴리아미드이미드 수지는, 그 분자량이 10,000 내지 100,000인 것을 특징으로 하는 실록산 변성 폴리아미드이미드 수지.The said siloxane-modified polyamideimide resin has the molecular weight 10,000-100,000, The siloxane-modified polyamideimide resin characterized by the above-mentioned. 제1항 또는 제2항에 따르는 실록산 변성 폴리아미드이미드 수지는, 하기 화학식 2의 구조를 갖는 모노머로 이루어지는 폴리아미드이미드 수지와 하기 화학식 3의 구조를 갖는 폴리디메틸실록산디카르복실산을 축합반응시켜 제조되는 것을 특징으로 하는 실록산 변성 폴리아미드이미드 수지 제조 방법.The siloxane-modified polyamideimide resin according to claim 1 or 2 is condensation reaction of a polyamideimide resin comprising a monomer having a structure of formula (2) with a polydimethylsiloxane dicarboxylic acid having a structure of formula (3). A method for producing a siloxane-modified polyamideimide resin, which is prepared. <화학식 2><Formula 2>
Figure 112009011452411-PAT00007
Figure 112009011452411-PAT00007
상기 화학식 2에서 하첨자로 표시된 n은 1 내지 20의 자연수이다.N represented by a subscript in Formula 2 is a natural number of 1 to 20. <화학식 3><Formula 3>
Figure 112009011452411-PAT00008
Figure 112009011452411-PAT00008
상기 화학식 3에서 하첨자로 표시된 m은 1 내지 50의 자연수이다.M represented by a subscript in Formula 3 is a natural number of 1 to 50.
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