KR20100093844A - Apparatus for bonding substrate and apparatus for feeding buffer film - Google Patents

Abstract

PURPOSE: The substrate bonding equipment and shock-absorbing film supply device keep the tension of the shock-absorbing film with the torque motor. Shock-absorbing between pressor and the stage are proceed efficiently. CONSTITUTION: The substrates is arranged in the stage. Pressor adds pressure to substrate through the shock-absorbing film(210). The supply reel(230) supplies the shock-absorbing film between the stage and pressor. The return reel(250) collects the shock-absorbing film. The supporting part(220) supports the supply reel and return reel in order to be possible to rotate. Controller controls the rotation angle of the supply reel.

Description

Substrate Bonding Device and Buffer Film Feeder {APPARATUS FOR BONDING SUBSTRATE AND APPARATUS FOR FEEDING BUFFER FILM}

Embodiments relate to a substrate bonding apparatus and a buffer film supply apparatus.

In general, flat panel displays such as PDDP, LCD, OLED, and fluorescent display (VFD) are becoming increasingly thin and short, and are more conducive to the above. A driving circuit board (for example, PCB, FPC, TCP, etc.) is directly bonded to the glass of the flat panel display device to manufacture a single article.

Thus, if the circuit board is directly bonded to the glass, it is not necessary to make complicated wiring, so it is easy to assemble and maintain, and there is no need to secure a separate wiring space. The circuit board is formed in the form of a thin thin film.

Since the compatibility of various wirings is maintained, the circuit board is widely used without being limited by the use and specification of the flat panel display device. Each of the circuit boards is bonded to one or more chips to be bonded by a separate chip bonding machine. .

The circuit board is bonded to the bonding surface provided on one side of the flat panel display panel. In order to bond this circuit board to the panel of a flat panel display element, the bonding apparatus which crimps a circuit board to a panel using high temperature and high pressure is used.

However, in the related art, the circuit board bonding apparatus may not be automated, and thus, the process time may be long, and labor may be required. In particular, in recent years, as the area of a flat panel display device becomes larger, the necessity for automation and high precision is required.

Embodiments provide a buffer film supply device for efficiently supplying a buffer film between a crimp portion and a bonding object, and a substrate bonding device for efficiently bonding bonding objects such as substrates and / or panels.

The substrate bonding apparatus according to the embodiment includes a stage in which the bonding objects are disposed; A compression unit disposed on the stage to apply pressure to the substrate through a buffer film; A supply reel for winding the buffer film and supplying the buffer film between the stage and the crimping portion; And a recovery reel for recovering the buffer film.

The buffer film supply apparatus according to the embodiment includes a supply reel for winding the buffer film; A sensor unit disposed adjacent to the supply reel and sensing a distance to an outer circumferential surface of the buffer film wound on the supply reel; A controller for rotating the supply reel by calculating a rotation angle based on the distance; It includes a recovery reel for recovering the buffer film.

In the substrate bonding apparatus according to the embodiment, the buffer film may be efficiently supplied between the substrate and the compressed portion by the supply reel and the reel. Therefore, the substrate bonding apparatus according to the embodiment is protected by the crimping portion, by the buffer film, when the pressure is applied to the bonding objects.

In addition, the substrate bonding apparatus according to the embodiment, since the buffer film is efficiently supplied by the supply reel and the recovery reel, it is possible to efficiently bond the bonding objects by the automated process.

In addition, the substrate bonding apparatus according to the embodiment includes a sensor unit for measuring the radius from the center of the supply reel to the outer peripheral surface of the wound buffer film, and receives the radius measured by the sensor unit to rotate the supply reel to a desired angle It may include a control unit to make.

Accordingly, the controller can accurately adjust the pitch (moving distance) of the buffer film supplied between the bonding objects and the crimping portion. That is, the substrate bonding apparatus according to the embodiment may calculate the rotation angle for releasing the wound buffer film by a desired pitch by the total radius of the supply reel and the wound buffer film.

Accordingly, the substrate bonding apparatus and the buffer film supply apparatus according to the embodiment rotate the feed reel to a desired angle, thereby supplying the buffer film between the substrate and the crimping portion by the exact pitch.

Therefore, the substrate bonding apparatus and the buffer film supply apparatus according to the embodiment can reduce the waste of the buffer film.

In addition, the substrate bonding apparatus and the buffer film supply apparatus according to the embodiment may be connected to the recovery reel, and may include a torque motor to stop when a load of a predetermined load or more is applied.

Accordingly, the substrate bonding apparatus and the buffer film supply apparatus according to the embodiment can maintain the tension of the buffer film by the torque motor, and can efficiently perform the buffer between the stage and the crimping portion.

In the description of the embodiments, it is described that each substrate, stage 100, part, film, or reel is formed on or under the "on" of each substrate, part, film, or reel, or the like. In the case of, "on" and "under" include both "directly" or "indirectly" formed through other components. In addition, the upper or lower reference of each component is described with reference to the drawings. The size of each component in the drawings may be exaggerated for the sake of explanation and does not mean the size actually applied.

1 is a side view illustrating a substrate bonding apparatus according to an embodiment. Figure 2 is a perspective view showing a buffer film supply unit. 3 shows a supply reel and a laser displacement sensor. 4 is a block diagram illustrating a substrate bonding apparatus according to an embodiment. 5 to 7 are views illustrating a process of bonding objects to be bonded by the substrate bonding apparatus according to the embodiment.

Referring to FIG. 1, the substrate bonding apparatus according to the embodiment includes a stage 100, a buffer film supply unit 200, and a crimping unit 300.

The stage 100 bonds the bonding objects 10 bonded to each other, such as a printed circuit board (PCB), a flexible printed circuit board (FPCB), a TCP tape, a TAB tape, and a display panel. I support it. In FIG. 1, an LCD panel 11, a TAB tape 12 on which a driver IC 13 is mounted, and a printed circuit board 14 are disposed on the stage 100.

The TAB tape 12 and the LCD panel 11 are bonded by an anisotropic conductive film (ACF) 15, 16. In addition, an anisotropic conductive film 16 is interposed between the TAB tape 12 and the printed circuit board 14.

The stage 100 has a plate shape. In addition, adjacent to the stage 100, a loading unit for loading the bonding objects 10 and / or an unloading unit for unloading the objects 10 may be disposed.

The buffer film supply unit 200 is disposed adjacent to the stage 100. For example, the buffer film supply unit 200 may be fixedly disposed on the stage 100. Alternatively, the buffer film supply unit 200 may be loaded and unloaded on the stage 100.

1 and 2, the buffer film supply unit 200 includes a buffer film 210, a support 220, a supply reel 230, a plurality of guide reels 241, 242. The reel 250 includes a servo motor 260, a torque motor 270, and a laser displacement sensor 280.

The buffer film 210 is wound around the supply reel 230 and the recovery reel 250. In addition, the buffer film 210 is interposed between the crimping unit 300 and the stage 100. In more detail, the buffer film 210 is interposed between the pressing part 300 and the bonding objects 10.

The buffer film 210 has elasticity. The buffer film 210 absorbs the shock caused by the crimping unit 300 and transmits the pressure by the crimping unit 300 to the bonding objects 10.

Examples of the material used as the buffer film 210 may include silicon rubber, polyimide resin, glass cloth, and the like.

In addition, the buffer film 210 may include a plurality of layers. For example, the buffer film 210 may include a silicon rubber layer, a polyimide resin layer, and a glass fiber layer.

The thickness of the buffer film 210 may vary depending on the pressure of the crimping unit 300 and the thickness and type of the bonding objects 10. The thickness of the buffer film 210 may be, for example, about 0.1 mm to 1 mm.

The support part 220 supports the supply reel 230, the guide reels 241, 242... 245 and the recovery reel 250 to be rotatable. In addition, the support unit 220 supports and fixes the servomotor 260, the torque motor 270, and the laser displacement sensor 280.

The support unit 220 may be fixed to a first transfer unit that loads and / or unloads the buffer film supply unit 200.

In FIGS. 1 and 2, the support 220 is shown as being disposed at one end of the supply reel 230, the guide reels 241, 242... 245 and the recovery reel 250. This is shown for convenience of description.

Accordingly, the support part 220 may be disposed at the other end of the supply reel 230, the guide reels 241, 242... 245, and the recovery reel 250. In addition, the support unit 220 may further include a member for fixing the torque motor 270, the servo motor 260, and the laser displacement sensor 280.

The supply reel 230 is fixed to the support 220 to be rotatable. The supply reel 230 winds up the buffer film 210. The supply reel 230 supplies the wound buffer film 210 between the crimping unit 300 and the bonding objects 10.

The guide reels 241, 242... 245 are rotatably fixed to the support 220. The buffer film 210 unwound by the supply reel 230 is guided to the recovery reel 250. For example, the guide reels 241, 242... 245 may include a first guide reel 241, a second guide reel 242, a third guide reel 243, a fourth guide reel 244, and And a fifth guide reel 245.

The first guide reel 241 is disposed on the buffer film 210, and the second guide reel 242 and the third guide reel 243 are disposed below the buffer film 210. In addition, the fourth guide reel 244 is disposed on the buffer film 210, and the fifth guide reel 245 is disposed below the buffer film 210.

Although five guide reels 241, 242... 245 are shown in the figure, alternatively, the buffer film supply unit 200 may include more or fewer guide reels.

The recovery reel 250 is fixed to the support part 220 to be rotatable. The recovery reel 250 winds up the used buffer film 210. That is, the recovery reel 250 recovers the used buffer film 210.

The servo motor 260 is directly or indirectly connected to the supply reel 230. The servo motor 260 rotates the supply reel 230. More specifically, the servo motor 260 rotates the supply reel 230 by a desired rotation angle θ. The servo motor 260 is fixed to the support 220.

The servomotor 260 may follow and follow a given position. Examples of the servomotor 260 include a DC servomotor, an AC servomotor, a linear servomotor, and the like.

In addition, the servomotor 260 may include a system capable of adjusting the rotation angle θ at an input angle. In addition, the servomotor 260 may include sensors for sensing the rotation angle θ. For example, the servomotor 260 may include a variable resistor capable of measuring the rotation angle θ.

The torque motor 270 is directly or indirectly connected to the recovery reel 250. The torque motor 270 rotates the recovery reel 250. The torque motor 270 is fixed to the support 220.

The torque motor 270 provides the rotational force to the recovery reel 250 in a predetermined direction, and the rotation is stopped when a predetermined load or more is applied.

For example, the torque motor 270 is a specialized type of induction motor having a rotational force even when it is not rotated, and is a limited torque motor. That is, the torque motor 270 has a rotor that prevents rotation without being damaged. The torque motor 270 has a constant torque with respect to the load.

The torque motor 270 may apply a relatively constant and light tension to the buffer film 210 through the recovery reel 250 at a low driving voltage. In addition, the torque motor 270 may provide a high speed rotation to the recovery reel 250 at a high driving voltage without the need for additional mechanical units such as gears or clutches.

Referring to FIG. 3, the laser displacement sensor 280 is fixed to the support 220. The laser displacement sensor 280 measures the distance d to the outer circumferential surface 211 of the buffer film 210 wound on the supply reel 230. In more detail, the laser displacement sensor 280 measures the distance d from the center of the supply reel 230 to the outer circumferential surface 211 of the buffer film 210 wound on the supply reel 230 on an extension line. do.

The laser displacement sensor 280 may include a light source for generating a laser, and may include a charged couple device (CCD) or a positive sensitive device (PSD) as a light receiving element. The laser displacement sensor 280 may measure a distance d to the outer circumferential surface 211 by measuring a light quantity distribution measured by the light receiving element.

The crimping unit 300 is disposed on the stage 100. The crimping unit 300 is movable up and down, and applies pressure to the bonding objects 10. In more detail, the crimping unit 300 selectively applies pressure only to a region to which the bonding objects 10 are bonded.

For example, the crimping unit 300 exerts pressure on a region where the printed circuit board 14 and the TAB tape 12 are bonded. In addition, the crimping unit 300 may apply pressure to a region where the TAB tape 12 and the LCD panel 11 are bonded.

The pressing unit 300 applies pressure to the bonding objects 10 through the buffer film 210. That is, a buffer film 210 is disposed between the crimping unit 300 and the bonding objects 10, and the buffer film 210 absorbs the shock caused by the crimping unit 300.

The crimping unit 300 may further include a second transfer unit for transferring up and down. In addition, the pressing part 300 may further include a heating unit for applying heat to the pressing object. That is, the crimping unit 300 may apply heat as well as pressure to the bonding objects 10.

Referring to FIG. 4, the controller 400 controls the servo motor 260, the torque motor 270, and the crimping unit 300. In addition, the controller 400 receives a distance d to the outer circumferential surface 211 of the buffer film 210 wound on the supply reel 230 measured by the laser displacement sensor 280.

In addition, although not shown in FIG. 4, the controller 400 may control the loading unit, the unloading unit, the first transfer unit, the second transfer unit, and the heating unit.

The control unit 400 may control the servo motor 260, the torque motor 270, and the crimping unit 300 by an automatic program. Unlike this, the control unit 400 may control the servo motor 260, the torque motor 270 and the crimping unit 300 by manually input values.

The bonding objects 10 are bonded by the following process.

The bonding objects 10 are loaded on the stage 100, and the buffer film supply unit 200 is loaded on the stage 100.

Referring to FIG. 5, afterwards, the pressing part 300 is lowered and additional tension is applied to the buffer film 210. At this time, while the recovery reel 250 is driven to rotate, the buffer film 210 wound on the recovery reel 250 is released.

At this time, the torque motor 270 is driven in the same direction as the recovery reel 250, as the recovery reel 250 is driven. At the same time, the torque motor 270 maintains a constant rotational force in the opposite direction to the driven rotational direction, to maintain the tension of the buffer film (210).

For example, both the recovery reel 250 and the torque motor 270 may be driven in a counterclockwise direction.

Accordingly, the crimping unit 300 applies pressure to the bonding objects 10 through the buffer film 210, and the bonding objects 10 are bonded to each other. For example, the pressing part 300 applies pressure to the TAB tape 12 through the buffer film 210. Accordingly, pressure is applied to the anisotropic conductive film 16 interposed between the TAB tape 12 and the printed circuit board 14, and the TAB tape 12 and the printed circuit board 14 are bonded to each other. do. In addition, the TAB tape 12 and the printed circuit board 14 are electrically connected by the anisotropic conductive film 16.

Referring to FIG. 6, the crimping unit 300 is raised, and the joined objects 10 are unloaded. At this time, since the torque motor 270 maintains a constant rotational force, when the compression unit 300 is raised, the torque motor 270 rotates the recovery reel 250 by the rotational force. Accordingly, the buffer film 210 is wound around the recovery reel 250 and maintains a constant tension.

For example, the recovery reel 250 and the torque motor 270 may rotate in a clockwise direction.

Thereafter, the bonding process of FIGS. 5 and 6 may be repeated several times.

Then, the used portion (U) of the buffer film 210 loses elasticity, or foreign matter is attached to it can no longer be used for the buffering action.

Therefore, the buffer film 210 which is not used between the crimping unit 300 and the stage 100 is supplied by the following method.

Referring to FIG. 7, the region U used in the process of FIG. 5 of the buffer film 210 moves by a predetermined pitch P. FIG. That is, by the supply reel 230, the wound buffer film is released, the buffer film is wound on the recovery reel 250 so that the used area U moves by the pitch P.

At this time, the control unit 400 from the distance (d) received from the laser displacement sensor 280, the total radius (r) of the supply reel 230 and the wound buffer film (of the supply reel 230 Radius and the total thickness of the wound buffer film 210) is calculated. That is, the distance D from the laser displacement sensor 280 to the center of the supply reel 230 is input to the controller 400, and the radius r is the distance D to the center and This is the difference of the distance d to the outer circumferential surface 211.

The control unit 400 calculates the rotation angle θ of the supply reel 230 by the following formula so that the desired pitch P and the length of the buffer film is the same as the pulley.

The length of the buffer film 210 to be released is the product of the radius (r) and the rotation angle (θ), which should be equal to the desired pitch, the following equation is derived.

θ = P / (D-d)

Here, P is a desired pitch when the buffer film 210 is supplied once, D is a distance between the center of the supply reel 230 and the laser displacement sensor 280, d is the supply reel 230 Distance between the outer circumferential surface 211 of the buffer film wound on the laser displacement sensor 280.

The control unit 400 rotates the servo motor 260 by the rotation angle θ, and the buffer film 210 wound on the supply reel 230 is released by the pitch P. In addition, the moved buffer film is wound on the recovery reel 250 by the torque motor 270.

For example, the recovery reel 250 and the torque motor 270 may rotate in a clockwise direction.

In this manner, the buffer film 210 is supplied by the predetermined pitch P between the crimping unit 300 and the stage 100.

The substrate bonding apparatus according to the embodiment may supply the buffer film 210 between the stage 100 and the crimping unit 300 by the supply reel 230 and the recovery reel 250. Therefore, the substrate bonding apparatus according to the embodiment protects the bonding objects 10 by the crimping unit 300 when the pressure is applied to the bonding objects 10 by the buffer film 210. can do.

In addition, in the substrate bonding apparatus according to the embodiment, since the buffer film 210 is efficiently supplied by the supply reel 230 and the recovery reel 250, the object to be bonded efficiently (by an automated process) 10) can be bonded.

In addition, the laser displacement sensor 280 may accurately measure the distance d to the outer circumferential surface 211, and the controller 400 may calculate an accurate rotation angle θ according to a desired pitch P. have. Accordingly, the controller 400 can accurately adjust the desired pitch (P).

Accordingly, the substrate bonding apparatus according to the embodiment rotates the supply reel 230 at a desired angle θ, thereby moving the buffer film 210 to the stage 100 and the crimping portion (P) by an exact pitch (P). Between 300).

Therefore, the substrate bonding apparatus according to the embodiment may reduce the waste of the buffer film 210.

In addition, the substrate bonding apparatus according to the embodiment maintains the tension of the buffer film 210 by the torque motor 270, and efficiently buffers between the bonding objects 10 and the crimping portion 300. Can be done.

Although the above description has been made based on the embodiments, these are merely examples and are not intended to limit the present invention. Those skilled in the art to which the present invention pertains may not have been exemplified above without departing from the essential characteristics of the present embodiments. It will be appreciated that many variations and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

1 is a side view illustrating a substrate bonding apparatus according to an embodiment.

Figure 2 is a perspective view showing a buffer film supply unit.

3 shows a supply reel and a laser displacement sensor.

4 is a block diagram illustrating a substrate bonding apparatus according to an embodiment.

5 to 7 are views illustrating a process of bonding objects to be bonded by the substrate bonding apparatus according to the embodiment.

Claims (10)

A stage on which bonding objects are disposed; A compression unit disposed on the stage to apply pressure to the substrate through a buffer film; A supply reel for winding the buffer film and supplying the buffer film between the stage and the crimping portion; And Substrate bonding apparatus comprising a recovery reel for recovering the buffer film. The substrate bonding apparatus of claim 1, further comprising a sensor unit disposed adjacent to the supply reel to measure a radius from a center of the supply reel to an outer circumferential surface of the buffer film wound around the supply reel. The substrate bonding apparatus of claim 2, further comprising a controller configured to adjust a rotation angle of the supply reel based on the radius. The substrate bonding apparatus of claim 3, further comprising a servo motor connected to the supply reel and receiving a signal from the controller to rotate the supply reel by the rotation angle. The substrate bonding apparatus of claim 2, wherein the sensor unit comprises a displacement sensor configured to sense a distance from the buffer film wound on the supply reel. The substrate bonding apparatus of claim 1, further comprising: a torque motor connected to the recovery reel and stopped when a load of a predetermined load or more is applied to maintain the tension of the buffer film. The substrate bonding apparatus of claim 1, further comprising guide reels disposed between the supply reel and the recovery reel and contacting the buffer film. The substrate bonding apparatus of claim 1, wherein the bonding objects include a display panel, a printed circuit board, an anisotropic conductive film, a TAB tape, or a flexible printed circuit board. A supply reel for winding the buffer film; A sensor unit disposed adjacent to the supply reel and sensing a distance to an outer circumferential surface of the buffer film wound on the supply reel; A controller for rotating the supply reel by calculating a rotation angle based on the distance; A buffer film supply device comprising a recovery reel for recovering the buffer film. The buffer film supply apparatus of claim 9, wherein the rotation angle is calculated by the following equation. θ = P / (D-d) Here, P is the pitch when the buffer film is supplied once, D is the distance between the center of the supply reel and the sensor unit, d is the distance between the outer peripheral surface of the buffer film wound on the supply reel and the sensor unit to be.

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