KR20100090495A - A case of substrate - Google Patents
A case of substrate Download PDFInfo
- Publication number
- KR20100090495A KR20100090495A KR1020090009808A KR20090009808A KR20100090495A KR 20100090495 A KR20100090495 A KR 20100090495A KR 1020090009808 A KR1020090009808 A KR 1020090009808A KR 20090009808 A KR20090009808 A KR 20090009808A KR 20100090495 A KR20100090495 A KR 20100090495A
- Authority
- KR
- South Korea
- Prior art keywords
- coupling
- substrate
- housing
- protrusion
- packaging material
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
Abstract
The substrate packaging material according to the present invention provides a housing having a substrate receiving slot arranged at equal intervals on a pair of inner walls facing each other, the inner packaging space of which one side is opened, in the horizontal direction from the open end of the housing to the outside of the housing; It comprises an extended coupling blade and a buffer protrusion protruding along the edge of the slot formed on the outside of the bottom surface of the housing.
Description
The present invention relates to a substrate packaging material, and more particularly, to a substrate packaging material used for transporting and storing a substrate.
In general, the substrate is used to mean a semiconductor substrate or a printed circuit board. Recently, as semiconductor substrates and printed circuit boards have been improved in performance and high integration, it has been difficult to stably store and transport these substrates, and solutions for these problems have been sought. In particular, research on improvement of the packaging material structure for securing quality problems and reliability of large substrate products such as inverters has been continued.
1 is a perspective view of a
As shown in the drawing, the conventional
At this time, the inner wall of the housing is formed with a plurality of slot projections (9) forming a slot (3) for fastening with the
However, referring to FIG. 2, since the edges of the
In addition, since the pair of
In addition, since the
The present invention has been made to solve the problems of the prior art as described above, and the structure of the substrate packaging material that can ensure the stability of the substrate loading, while having a small volume and economical while accommodating the substrate in the same amount as the conventional packaging material used Suggest.
A substrate packaging material according to the present invention comprises: a housing having a substrate receiving slot arranged at equal intervals on a pair of inner walls facing each other, the inner receiving space having one open side; A coupling blade extending in a horizontal direction from the open end of the housing to the outside of the housing; And a buffer protrusion protruding along an edge of the slot formed outside the bottom surface of the housing.
As a preferred feature of the present invention, it further comprises a coupling protrusion and a coupling groove formed on the coupling wing.
Another desirable feature of the present invention is to further include a loading protrusion and a loading groove formed on the bottom surface of the housing.
As another preferable feature of the present invention, the substrate accommodating slot includes a guide portion widened in the direction of the open surface of the housing.
As another preferred feature of the invention, the coupling protrusion and the coupling groove is the main coupling protrusion and the main coupling groove disposed in the corner portion of the coupling blade, and the auxiliary coupling protrusion and auxiliary coupling groove disposed along the side of the coupling blade. It is to include.
As another preferred feature of the invention, the auxiliary coupling protrusion and the auxiliary coupling groove is in contact with the inner receiving space of the housing.
As another preferred feature of the present invention, the main coupling protrusion and the main coupling groove are arranged alternately in the clockwise direction along the coupling blade.
As another preferred feature of the present invention, the auxiliary coupling protrusion and the auxiliary coupling groove in the clockwise direction along the coupling blade so that the arrangement of the auxiliary coupling protrusion and the auxiliary coupling groove formed on the opposite side of the coupling blade is reversely symmetrical. In alternating arrangements.
The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.
Prior to that, terms and words used in the present specification and claims should not be construed in a conventional and dictionary sense, and the inventor may properly define the concept of the term in order to best explain its invention It should be construed as meaning and concept consistent with the technical idea of the present invention.
Since the substrate packaging material according to the present invention includes a buffer protrusion, there is an advantage of significantly reducing edge failure failure of the substrate loaded on the substrate packaging material.
In addition, since the main coupling protrusion and the main coupling groove is distinguished from the auxiliary coupling protrusion and the auxiliary coupling groove, the substrate protection against the firm coupling of the pair of substrate packaging material and foreign matter penetration can be made at the same time.
In addition, since the auxiliary coupling protrusion and the auxiliary coupling groove are disposed in contact with the inner receiving space of the housing, it is possible to reduce the volume of the substrate packaging material, thereby loading a larger number of substrates in the same space as well as those used for the substrate packaging material. There is an advantage that can reduce the amount of raw materials.
Hereinafter, a preferred embodiment of the substrate packaging material according to the present invention will be described in detail with reference to the accompanying drawings. Throughout the accompanying drawings, the same or corresponding components are referred to by the same reference numerals, and redundant descriptions are omitted. In this specification, terms such as top and bottom are used to distinguish one component from another component, and a component is not limited by the terms.
3 is a perspective view of a
As shown in FIG. 2, the
The housing of the present embodiment may be formed of four sidewalls and one bottom surface in a hexahedral shape with one surface open. In this case, the housing provides an interior accommodation space in which the
The side wall height (depth of the inner receiving space) of the housing corresponds to about 1/2 of the length of the
The housing may be made of, for example, a transparent plastic such as acrylic, or may be made of expanded synthetic resin such as expanded polystyrene, expanded urethane foam, expanded polypropylene, or the like.
At this time, the
The
On the other hand, the outer side of the bottom surface of the housing is formed with a
Specifically, the coupling protrusion and the coupling groove are the
The
Meanwhile, in the present exemplary embodiment, only one
The
At this time, the
In addition, the
Meanwhile, the
Since the
In addition, since the
In addition, the
It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention. Therefore, such modifications or variations will have to belong to the claims of the present invention.
1 is a perspective view of a substrate packaging material according to the prior art.
FIG. 2 is a partial cross-sectional view of a portion of the substrate packaging material illustrated in FIG. 1 taken along the line II ′.
3 is a perspective view of a substrate packaging material according to a preferred embodiment of the present invention.
4 is a partial cross-sectional view of a portion of the substrate packaging material shown in FIG. 3 taken along the line II-II '.
FIG. 5 is a schematic diagram showing another form of the substrate loading slot of the substrate package shown in FIG. 3. FIG.
<Description of Major Symbols in Drawing>
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Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090009808A KR20100090495A (en) | 2009-02-06 | 2009-02-06 | A case of substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090009808A KR20100090495A (en) | 2009-02-06 | 2009-02-06 | A case of substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20100090495A true KR20100090495A (en) | 2010-08-16 |
Family
ID=42756055
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020090009808A KR20100090495A (en) | 2009-02-06 | 2009-02-06 | A case of substrate |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR20100090495A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112635369A (en) * | 2020-12-08 | 2021-04-09 | 华虹半导体(无锡)有限公司 | Wafer bearing device |
-
2009
- 2009-02-06 KR KR1020090009808A patent/KR20100090495A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112635369A (en) * | 2020-12-08 | 2021-04-09 | 华虹半导体(无锡)有限公司 | Wafer bearing device |
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Legal Events
Date | Code | Title | Description |
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A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |