KR20100090495A - A case of substrate - Google Patents

A case of substrate Download PDF

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Publication number
KR20100090495A
KR20100090495A KR1020090009808A KR20090009808A KR20100090495A KR 20100090495 A KR20100090495 A KR 20100090495A KR 1020090009808 A KR1020090009808 A KR 1020090009808A KR 20090009808 A KR20090009808 A KR 20090009808A KR 20100090495 A KR20100090495 A KR 20100090495A
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KR
South Korea
Prior art keywords
coupling
substrate
housing
protrusion
packaging material
Prior art date
Application number
KR1020090009808A
Other languages
Korean (ko)
Inventor
장길
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020090009808A priority Critical patent/KR20100090495A/en
Publication of KR20100090495A publication Critical patent/KR20100090495A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls

Abstract

The substrate packaging material according to the present invention provides a housing having a substrate receiving slot arranged at equal intervals on a pair of inner walls facing each other, the inner packaging space of which one side is opened, in the horizontal direction from the open end of the housing to the outside of the housing; It comprises an extended coupling blade and a buffer protrusion protruding along the edge of the slot formed on the outside of the bottom surface of the housing.

Description

Substrate Packaging Material {A CASE OF SUBSTRATE}

The present invention relates to a substrate packaging material, and more particularly, to a substrate packaging material used for transporting and storing a substrate.

In general, the substrate is used to mean a semiconductor substrate or a printed circuit board. Recently, as semiconductor substrates and printed circuit boards have been improved in performance and high integration, it has been difficult to stably store and transport these substrates, and solutions for these problems have been sought. In particular, research on improvement of the packaging material structure for securing quality problems and reliability of large substrate products such as inverters has been continued.

1 is a perspective view of a substrate packaging material 1 according to the prior art, and FIG. 2 is a partial cross-sectional view of a portion of the substrate packaging material 1 shown in FIG. 1 taken along the line II ′.

As shown in the drawing, the conventional substrate packaging material 1 is configured to include a housing having an open shape on one side and a wing 11 extending outward on an open surface of the housing.

At this time, the inner wall of the housing is formed with a plurality of slot projections (9) forming a slot (3) for fastening with the substrate 10, the coupling 11 to the coupling protrusions (pair) to be coupled to the housing ( 5) and the coupling groove 7 is formed.

However, referring to FIG. 2, since the edges of the conventional packaging material 1 are formed in contact with the edges of the packaging material 1, the edges of the edges of the substrate 10 are frequently broken. There was a problem.

In addition, since the pair of packaging materials 1 are coupled to each other only by the coupling protrusion 5, the coupling protrusion 5 and the coupling groove 7 are formed at a distance d2 spaced apart from the opening of the housing, There was a problem that the length (d1) is long. If the length of the blade 11 is increased, the bulking material of the packaging material 1 becomes large, so that the loading efficiency decreases, the logistics cost rises, and raw materials used to manufacture the packaging material 1 are wasteful, and the blade 11 The longer the) is, the worse the deflection occurs.

In addition, since the coupling protrusion 5 and the coupling groove 7 are symmetrical up and down, the directionality of the packaging material 1 is generated, and there is a hassle to couple the packaging material 1 only in a specific direction.

The present invention has been made to solve the problems of the prior art as described above, and the structure of the substrate packaging material that can ensure the stability of the substrate loading, while having a small volume and economical while accommodating the substrate in the same amount as the conventional packaging material used Suggest.

A substrate packaging material according to the present invention comprises: a housing having a substrate receiving slot arranged at equal intervals on a pair of inner walls facing each other, the inner receiving space having one open side; A coupling blade extending in a horizontal direction from the open end of the housing to the outside of the housing; And a buffer protrusion protruding along an edge of the slot formed outside the bottom surface of the housing.

As a preferred feature of the present invention, it further comprises a coupling protrusion and a coupling groove formed on the coupling wing.

Another desirable feature of the present invention is to further include a loading protrusion and a loading groove formed on the bottom surface of the housing.

As another preferable feature of the present invention, the substrate accommodating slot includes a guide portion widened in the direction of the open surface of the housing.

As another preferred feature of the invention, the coupling protrusion and the coupling groove is the main coupling protrusion and the main coupling groove disposed in the corner portion of the coupling blade, and the auxiliary coupling protrusion and auxiliary coupling groove disposed along the side of the coupling blade. It is to include.

As another preferred feature of the invention, the auxiliary coupling protrusion and the auxiliary coupling groove is in contact with the inner receiving space of the housing.

As another preferred feature of the present invention, the main coupling protrusion and the main coupling groove are arranged alternately in the clockwise direction along the coupling blade.

As another preferred feature of the present invention, the auxiliary coupling protrusion and the auxiliary coupling groove in the clockwise direction along the coupling blade so that the arrangement of the auxiliary coupling protrusion and the auxiliary coupling groove formed on the opposite side of the coupling blade is reversely symmetrical. In alternating arrangements.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to that, terms and words used in the present specification and claims should not be construed in a conventional and dictionary sense, and the inventor may properly define the concept of the term in order to best explain its invention It should be construed as meaning and concept consistent with the technical idea of the present invention.

Since the substrate packaging material according to the present invention includes a buffer protrusion, there is an advantage of significantly reducing edge failure failure of the substrate loaded on the substrate packaging material.

In addition, since the main coupling protrusion and the main coupling groove is distinguished from the auxiliary coupling protrusion and the auxiliary coupling groove, the substrate protection against the firm coupling of the pair of substrate packaging material and foreign matter penetration can be made at the same time.

In addition, since the auxiliary coupling protrusion and the auxiliary coupling groove are disposed in contact with the inner receiving space of the housing, it is possible to reduce the volume of the substrate packaging material, thereby loading a larger number of substrates in the same space as well as those used for the substrate packaging material. There is an advantage that can reduce the amount of raw materials.

Hereinafter, a preferred embodiment of the substrate packaging material according to the present invention will be described in detail with reference to the accompanying drawings. Throughout the accompanying drawings, the same or corresponding components are referred to by the same reference numerals, and redundant descriptions are omitted. In this specification, terms such as top and bottom are used to distinguish one component from another component, and a component is not limited by the terms.

3 is a perspective view of a substrate packaging material 100 according to an exemplary embodiment of the present invention, and FIG. 4 is a partial cross-sectional view of a portion of the substrate packaging material 100 shown in FIG. 3 taken along a line II-II '.

As shown in FIG. 2, the substrate packaging material 100 according to the present embodiment includes a housing having a substrate receiving slot 130 therein, a coupling blade 110 extending in a horizontal direction from an open end of the housing, and a bottom of the housing. It is a configuration including a buffer protrusion 150 protruding along the edge on the outer surface.

The housing of the present embodiment may be formed of four sidewalls and one bottom surface in a hexahedral shape with one surface open. In this case, the housing provides an interior accommodation space in which the substrate 10 can be accommodated, and has a substrate receiving slot 130 arranged at equal intervals on a pair of inner walls facing each other.

The side wall height (depth of the inner receiving space) of the housing corresponds to about 1/2 of the length of the substrate 10, so that the substrate 10 bonded to the slot 130 by the pair of substrate packaging materials 100 may be wrapped. . That is, two substrate packaging materials 100 may be used to package the substrate 10 in pairs, and the pair of substrate packaging materials 100 used at this time may be the same.

The housing may be made of, for example, a transparent plastic such as acrylic, or may be made of expanded synthetic resin such as expanded polystyrene, expanded urethane foam, expanded polypropylene, or the like.

At this time, the loading protrusion 710 and the loading groove 730 may be formed on the bottom surface of the housing. When the pair of substrate packaging materials 100 and the other pair of substrate packaging materials 100 are stacked up and down, the pair of substrate packaging materials 100 may be coupled by the stacking protrusion 710, thereby forming a plurality of substrates. Stability in the loading of the packaging material 100 can be ensured. At this time, the loading protrusion 710 and the loading groove 730 are alternately disposed in the clockwise direction based on the center of the housing bottom surface. At this time, the loading protrusion 710 is used as a meaning including not only one projection, but also one projection group consisting of two or more projections. The loading groove 730 is also used as a meaning including not only one groove, but also one groove group consisting of two or more grooves. That is, even when the two projections are arranged in succession and the two grooves are arranged in the clockwise direction, it will be understood that the loading protrusions 710 and the loading grooves 730 may be interpreted as being alternately arranged in the clockwise direction. .

The substrate accommodating slot 130 is a portion in which the substrate 10 accommodated in the housing is fastened to the housing, and the slot protrusions 120 are formed at equal intervals on the lower sidewall of the housing. The interval between the slots 130 is preferably smaller than the thickness of the substrate 10. At this time, only a linear substrate receiving slot 130 is shown in FIG. 3, but this is merely exemplary. As shown in FIG. 5, the width of the slot protrusion 120 may be varied in the direction of the open surface of the housing. It will be readily understood that the slot 130 having the substrate guide portion can be formed. By configuring the substrate guide portion, the substrate 10 may be more easily loaded.

On the other hand, the outer side of the bottom surface of the housing is formed with a buffer protrusion 150 protruding along the edge of the slot 130 is formed. The buffer protrusion 150 protrudes downward from the bottom surface to provide a space in which the amount of impact that can be applied to the edge of the substrate 10 loaded in the slot 130 can be alleviated.

Coupling wing 110 is configured to extend in the horizontal direction from the open end of the housing to the outside of the housing. As described above, the substrate packaging material 100 is a pair of two to receive the substrate 10, the coupling blade 110 is a coupling protrusion and the coupling groove that can couple the pair of substrate packaging material (100) Provide space for placement.

Specifically, the coupling protrusion and the coupling groove are the main coupling protrusion 510 and the main coupling groove 530 disposed on the edge portion of the coupling blade 110, and the auxiliary coupling protrusion (along the sides of the coupling blade 110) ( 310 and the auxiliary coupling groove 330.

The main coupling protrusion 510 and the main coupling groove 530 serve as fasteners to which the pair of substrate packaging materials 100 can be firmly fastened. As the main coupling protrusion 510 is fitted into the main coupling groove 530, the pair of substrate packaging materials 100 may be coupled to each other. At this time, it is preferable that the main coupling protrusion 510 and the main coupling groove 530 are alternately disposed in a clockwise direction along the coupling blade 110 so that the pair of substrate packaging materials 100 can be coupled without orientation. In this case, the main coupling protrusion 510 and the main coupling groove 530 are used as the meaning including one or more protrusion groups and groove groups, as described in the above-described loading protrusion 710.

Meanwhile, in the present exemplary embodiment, only one main coupling protrusion 510 or a main coupling groove 530 is formed at each corner of the coupling blade 110, but the present invention is not limited thereto. It is to be understood that one or more main coupling protrusions 510 or main coupling grooves 530 may be formed at the edges, and they may be formed in a mixture thereof.

The auxiliary coupling protrusion 310 and the auxiliary coupling groove 330 also act as a fastener for coupling the pair of substrate packaging material 100, and also prevents foreign matter from penetrating into the pair of substrate packaging material 100 combined. Serves as a protective device. Therefore, it is preferable that the auxiliary coupling protrusion 310 and the auxiliary coupling groove 330 are arranged in plural along the coupling blade 110. The terms of the auxiliary coupling protrusion 310 and the auxiliary coupling groove 330 are also used to mean one or more protrusion groups and groove groups, as in the above-described loading protrusion 710.

At this time, the auxiliary coupling protrusion 310 and the auxiliary coupling groove 330 of the present embodiment is disposed to contact the inner receiving space of the housing. Thus, by arranging the auxiliary coupling protrusion 310 and the auxiliary coupling groove 330 in contact with the inner receiving space of the housing, to provide a vertical support force to the coupling blade 110 to prevent defects due to the bending of the coupling blade 110. In addition, the width D of the coupling blade 110 may be significantly reduced. By reducing the width D of the coupling blade 110, the volume of the substrate packaging material 100 can be reduced, so that a larger number of substrate packaging materials 100 can be loaded in the same loading space, as well as the substrate packaging material. It becomes possible to reduce the amount of raw materials used for (100).

In addition, the auxiliary coupling protrusion 310 and the auxiliary coupling groove 330 is disposed in contact with the inner receiving space of the housing when forming the substrate packaging material 100 by vacuum compression molding or the auxiliary coupling protrusion 310 and the auxiliary coupling groove ( The shape molding of 330 has an advantage in the manufacturing process that can be made more smoothly.

Meanwhile, the auxiliary coupling protrusion 310 and the auxiliary coupling groove 330 formed on opposite sides of the coupling blade 110 may be reversely symmetrical so that the pair of substrate packaging materials 100 may be coupled without orientation. The coupling protrusion 310 and the auxiliary coupling groove 330 are alternately disposed in the clockwise direction along the coupling blade 110.

Since the substrate packaging material 100 according to the above-described embodiment includes the buffer protrusion 150, an edge failure failure of the substrate 10 loaded on the substrate packaging material 100 may be significantly reduced.

In addition, since the main coupling protrusion 510 and the main coupling groove 530 which is distinguished from the auxiliary coupling protrusion 310 and the auxiliary coupling groove 330 to the firm coupling and foreign matter penetration of the pair of substrate packaging material 100. Substrate 10 protection can be achieved at the same time.

In addition, the auxiliary coupling protrusion 310 and the auxiliary coupling groove 330 is disposed in contact with the inner receiving space of the housing to reduce the volume of the substrate packaging material 100, and thus a larger number of substrates 10 in the same space Of course, there is an advantage that can reduce the amount of raw materials used in the substrate packaging material (100).

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention. Therefore, such modifications or variations will have to belong to the claims of the present invention.

1 is a perspective view of a substrate packaging material according to the prior art.

FIG. 2 is a partial cross-sectional view of a portion of the substrate packaging material illustrated in FIG. 1 taken along the line II ′.

3 is a perspective view of a substrate packaging material according to a preferred embodiment of the present invention.

4 is a partial cross-sectional view of a portion of the substrate packaging material shown in FIG. 3 taken along the line II-II '.

FIG. 5 is a schematic diagram showing another form of the substrate loading slot of the substrate package shown in FIG. 3. FIG.

<Description of Major Symbols in Drawing>

10 boards 100 boards

110 Combination wing 120 slot projection

130 Slot 150 Shock Absorber

310 Coupling protrusion 330 Coupling groove

510 main coupling protrusion 530 main coupling groove

710 Loading protrusion 730 Loading groove

Claims (8)

A housing having a substrate accommodating slot arranged at equal intervals on a pair of inner walls facing each other, the inner accommodating space of which one side is open; A coupling blade extending in a horizontal direction from the open end of the housing to the outside of the housing; And A buffer protrusion protruding along an edge at which the slot is formed outside the bottom surface of the housing; Substrate packaging material comprising a. The method of claim 1, Substrate packaging material further comprising a coupling protrusion and a coupling groove formed on the coupling wing. The method of claim 1, Substrate packaging material further comprising a loading protrusion and a loading groove formed on the bottom surface of the housing. The method of claim 1, The substrate receiving slot is a substrate packaging material, characterized in that it comprises a guide portion wider in the direction of the open surface of the housing. The method of claim 2, The coupling protrusion and the coupling groove is a substrate packaging material comprising a main coupling protrusion and the main coupling groove disposed in the corner portion of the coupling blade, and the auxiliary coupling protrusion and the auxiliary coupling groove disposed along the side of the coupling blade. . The method of claim 5, The auxiliary coupling protrusion and the auxiliary coupling groove is in contact with the inner receiving space of the housing substrate packaging material. The method of claim 5, And the main coupling protrusion and the main coupling groove are alternately disposed in a clockwise direction along the coupling blade. The method of claim 5, The sub-coupling protrusion and the sub-coupling groove are arranged alternately in a clockwise direction along the coupling blade so that the arrangement of the sub-coupling protrusion and the sub-coupling groove formed on opposite sides of the coupling blade is reversely symmetrical. Packing materials.
KR1020090009808A 2009-02-06 2009-02-06 A case of substrate KR20100090495A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020090009808A KR20100090495A (en) 2009-02-06 2009-02-06 A case of substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090009808A KR20100090495A (en) 2009-02-06 2009-02-06 A case of substrate

Publications (1)

Publication Number Publication Date
KR20100090495A true KR20100090495A (en) 2010-08-16

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Application Number Title Priority Date Filing Date
KR1020090009808A KR20100090495A (en) 2009-02-06 2009-02-06 A case of substrate

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112635369A (en) * 2020-12-08 2021-04-09 华虹半导体(无锡)有限公司 Wafer bearing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112635369A (en) * 2020-12-08 2021-04-09 华虹半导体(无锡)有限公司 Wafer bearing device

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