KR20100089161A - Microstructure having photoresist structure and method for manufacturing the same - Google Patents

Abstract

PURPOSE: A method for manufacturing a microstructure and the microstructure which is manufactured using the method are provided to remarkably reduce time required for a patterning process and an etching process using a photoresist as a structure comprising a final microstructure. CONSTITUTION: A method for manufacturing a microstructure comprises a step of preparing a first composition layer(10) and a step of forming a photoresist substrate by laminating a photoresist layer(13) on the first composition layer. A method for forming the substrate comprises the following steps: spreading a photoresist solution one the first composition layer using a spin coating method, a spray coating method, or a deposition method; and hardening the photoresist solution.

Description

A microstructure having a photoresist structure and a method of manufacturing the same {MICROSTRUCTURE HAVING PHOTORESIST STRUCTURE AND METHOD FOR MANUFACTURING THE SAME}

The present invention relates to a microstructure made through a semiconductor process or a MEMS process, and more particularly, to a microstructure having a photoresist structure and a method of manufacturing the same.

Semiconductor and MEMS manufacture a variety of microstructures using photolithography processes. The photolithography process uses the principle that the property changes due to chemical reaction when the photoresist receives light. By selectively irradiating light to the photoresist using a mask of a pattern to be obtained It is a process of forming the same pattern as the pattern of a mask. The photolithography process includes a photoresist coating step of applying photoresist onto a substrate, an exposure step of selectively irradiating light to the photoresist using a mask, and a developing step of forming a pattern by partially removing the photoresist using a developer. have.

In photolithography processes in the semiconductor field or MEMS field, photoresists are used for pattern transfer. Photoresist is a photosensitive material whose solubility in a developer changes upon receiving light, and is widely used in the semiconductor field and the MEMS field.

Photoresists may be classified according to various classification methods, but may be largely classified into positive types and negative types according to changes in dissolution properties generated by exposure. The positive photoresist has an exposure characteristic in which a portion irradiated with light melts in a developer, and the negative photoresist has an exposure characteristic in which a portion not irradiated with light melts in a developer.

Positive type photoresist is a kind of dissolution and chain scission caused by exposure, so that the solubility is increased. Unlike the negative photoresist, the positive photoresist has a low swelling phenomenon, excellent etching resistance, and excellent resolution, and is mainly used for high-density semiconductor manufacturing processes.

Negative photoresists have been commercialized before positive photoresists because of their high molecular weight due to crosslinking, photodimerization, and the like, solubility and poor thermal and chemical resistance. Currently, it is used in the process of using strong corrosive liquid or in low density semiconductor manufacturing, but due to the swelling of the pattern during the developing process, its resolution is only about 2 to 3㎛ and thus it is not used in the highly integrated semiconductor process. .

 In the conventional semiconductor process and MEMS process, a silicon substrate and a glass substrate were mainly used as a board | substrate. In order to transfer the pattern onto the substrate, after applying and patterning the photoresist, a subsequent process such as an etching process or the like was performed on the substrate according to the pattern shape of the pot resist. By the way, such a conventional manufacturing technique has a long time to etch the substrate, there is a disadvantage that the yield is not suitable for mass production.

In addition, the conventional semiconductor process or MEMS process requires a high temperature, high vacuum or high voltage to deposit a specific material, which is costly, time-consuming and very inefficient in terms of productivity.

The present invention is to solve the above problems, by using a photoresist as a structure constituting a microstructure, such as a substrate, away from the conventional concept applied on the component layer for pattern transfer, It is an object of the present invention to provide a microstructure having a photoresist structure which can reduce cost and a method of manufacturing the same.

Method for producing a microstructure according to an embodiment of the present invention for achieving the above object, a) preparing a first constituent layer, and b) a photoresist layer by laminating a photoresist layer on the first constituent layer Forming a step.

Here, step b) may include applying a photoresist liquid on the first constituent layer by a method selected from a spin coating method, a spray coating method, and a deposition method, and curing the photoresist liquid. .

The method of manufacturing a microstructure according to an embodiment of the present invention further includes disposing a casting mold on the first constituent layer before the b), wherein the b) is a photoresist liquid in the casting mold. It may include the step of injecting, and curing the photoresist liquid.

In addition, step b) may include bonding a dry photoresist film to the first component layer.

In the method of manufacturing a microstructure according to an embodiment of the present invention, in order to increase adhesion between the first component layer and the photoresist substrate, interposing an adhesive layer between the first component layer and the photoresist layer. It may further include.

Here, the photoresist layer may be made of a transparent photoresist capable of transmitting light, and the adhesive layer may be made of a photocurable resin that is cured when received with light.

Method of manufacturing a microstructure according to an embodiment of the present invention, after the step b), the step of laminating a second constituent layer of photoresist on the intermediate structure consisting of the first constituent layer and the photoresist substrate, The method may further include exposing the second component layer according to the pattern using a mask having a pattern formed thereon, and developing the second component layer to form a photoresist structure in the intermediate structure.

The method of manufacturing a microstructure according to an embodiment of the present invention further includes, after step b), forming an electrode layer by depositing an electrode material on the intermediate structure including the first component layer and the photoresist substrate. can do.

In the method of manufacturing a microstructure according to the embodiment of the present invention, after the forming of the electrode layer, the step of laminating a second constituent layer of photoresist on the electrode layer, and the pattern is formed on the second constituent layer Exposing according to the pattern using a mask that is provided, developing the second constituent layer to form a photoresist structure, and depositing an electrode material on the photoresist structure to form another electrode layer; The method may further include forming a three-dimensional circuit by connecting the electrode layer and the another electrode layer.

In the method of manufacturing a microstructure according to an embodiment of the present invention, the first constituent layer may be formed of a polymer.

The method of manufacturing a microstructure according to an embodiment of the present invention may further include exposing the photoresist substrate according to the pattern using a mask on which a pattern is formed, and developing the photoresist substrate. Can be.

Here, the photoresist substrate is made of a transparent photoresist that can transmit light, the method for manufacturing a microstructure according to an embodiment of the present invention, before the step b), the first constituent layer and the photo Attaching an adhesive layer made of photocurable resin that is cured upon receiving light to any one of the first constituent layer and the photoresist substrate to increase the adhesion between the resist substrate, and removing the non-exposed portions of the adhesive layer. It may further include.

The microstructure according to an embodiment of the present invention for achieving the above object includes a component layer and a photoresist structure laminated on the component layer.

Here, the photoresist structure is made of a transparent photoresist, the microstructure according to an embodiment of the present invention, between the component layer and the photoresist structure to increase the bonding force between the component layer and the photoresist structure Interposed therebetween and may further comprise an adhesive layer made of a photocurable resin that is cured upon receiving light.

The microstructure according to an embodiment of the present invention may further include an electrode layer stacked on the photoresist structure.

The microstructure according to the embodiment of the present invention further includes another photoresist structure stacked on the electrode layer, and another electrode layer stacked on the another photoresist structure and connected to the electrode layer to form a three-dimensional circuit. can do.

According to the present invention, the photoresist used for pattern transfer in the semiconductor field or the MEMS field can be utilized as a structure that constitutes a microstructure such as a substrate, thereby reducing the time and cost required for the process and increasing productivity.

In addition, when the photoresist layer is used as a substrate, the photoresist layer may be bonded to another constituent layer, and then a fine structure having a required shape may be obtained through a patterning process by selective exposure. Thus, it is more efficient in terms of time and cost than conventional semiconductor or MEMS processes using silicon, glass, and quartz substrates.

In addition, the present invention can form a three-dimensional polymer structure through the stacking of the photoresist layer, it can be applied to various fields utilizing the properties of the polymer.

In addition, the present invention can effectively create a three-dimensional microstructure of various shapes by laminating a photoresist layer in a multi-layer.

In addition, the present invention is simpler than the conventional process because the stacking of the photoresist layer can be made through a mechanism such as a roller at room temperature, compared to the conventional high temperature, high vacuum or high voltage to deposit a specific material, the process is simple The structure can also be easily formed.

Hereinafter, a microstructure having a photoresist structure and a method of manufacturing the same according to various embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings, the size and shape of the components, etc. may be exaggerated or simplified to aid in understanding the invention.

1 to 3 illustrate a process of manufacturing an intermediate structure for making a microstructure having a photoresist structure according to an embodiment of the present invention by a photoresist coating method.

First, as illustrated in FIG. 1, the adhesive layer 11 is formed by applying a material for improving adhesion with the photoresist component layer to the first component layer 10 of the material to be raised on the photoresist component layer. do. As the first component layer 10, a layer made of various materials such as a metal layer or a polymer layer may be used. Thereafter, as shown in FIG. 2, a liquid photoresist liquid 12 is applied. In the application of the photoresist solution 12, in order to uniformly apply the photoresist solution 12, a spin coating method, a spray coating method, or a vapor deposition method may be used.

After applying the photoresist liquid 12 and curing it, a solid photoresist layer 13 in which the first constituent layer 10 is laminated can be obtained as shown in FIG. 3. Here, the solid photoresist layer 13 acts as a second constituent layer such as a substrate. By processing the photoresist layer 13 through the exposure process and the developing process, the intermediate structure thus obtained can obtain a microstructure having a photoresist structure.

The use of a polymer as the first component layer 10 makes it possible to finally produce a polymer microstructure. Since the polymer microstructure has characteristics such as flexibility, insulation, and the like peculiar to a polymer, it may be utilized in various fields. In this embodiment, in the case where the adhesion between the first constituent layer 10 and the photoresist layer 13 of the material to be used is good, the adhesive layer 11 may be omitted.

4 to 6 illustrate a process of manufacturing an intermediate structure for casting a microstructure having a photoresist structure according to another embodiment of the present invention.

First, as shown in FIG. 4, the adhesive layer 11 for improving adhesion with the photoresist component layer is applied to the first component layer 10 to be formed on the photoresist component layer, and then the adhesive layer ( 11, a casting mold 14 for preventing the liquid photoresist liquid 12 from flowing out is provided. The casting mold 14 may be temporarily bonded on the adhesive layer 11 by various bonding methods. Thereafter, as shown in FIG. 5, the photoresist liquid 12 is injected into the casting mold 14. At this time, the thickness of the photoresist component layer to be formed may be adjusted by adjusting the injection amount and injection height of the photoresist liquid 12.

When the casting mold 14 is removed after curing the photoresist liquid 12 injected into the casting mold 14, as shown in FIG. 6, the photoresist layer 13 is used as the second constituent layer. You can create intermediate structures. The photoresist layer 13 may be used as a substrate, and may be formed into a photoresist structure having a desired shape through an exposure process and a developing process. By using various materials having various properties as the first component layer 10, it is possible to manufacture microstructures having various properties. This casting method is advantageous in obtaining a thick photoresist constituent layer compared to the photoresist coating method described above.

7 and 8 illustrate a process of manufacturing an intermediate structure for making a microstructure having a photoresist structure according to another embodiment of the present invention. In this embodiment, a solid dry photoresist film is used as the photoresist layer 13.

First, as shown in FIG. 7, the adhesive layer 11 is applied on the photoresist layer 13 and bonded to the first component layer 10 of the necessary material. For accurate bonding between the photoresist layer 13 and the first constituent layer 10, a pressurization device such as a roller R or a straw can be used, as shown in FIG. 8. By using the pressurizing device, the first component layer 10 can be pressed against the photoresist layer 13 with an even force, so that the photoresist layer 13 and the first component layer 10 can be adhered to a uniform thickness. have.

The photoresist layer 13 made of a dry photoresist film may be used as a substrate, or may be formed into a photoresist structure having a desired shape through an exposure process and a developing process. When the adhesion between the dry photoresist film and the first constituent layer 10 is good, the adhesive layer 11 may be omitted.

In the present exemplary embodiment, the first component layer 10 may be directly formed on the dry photoresist film by applying a material to be used as the first component layer 10 in a liquid phase or by using a deposition method using particles. In this case, the adhesive layer 11 is first formed on the dry photoresist film, and then the first component layer 10 is formed on the adhesive layer 11. The first component layer 10 may be made of various materials such as metal or polymer.

As in the present embodiment, when the solid dry photoresist film is used as the photoresist layer 13, the photoresist layer 13 and the first constituent layer 10 are formed at a room temperature using a mechanism such as the roller R. FIG. Can be combined. Therefore, compared with the conventional process, the process is simple and a multilayer structure can be formed easily.

9 to 11 illustrate a process of forming a fine structure of a desired shape by patterning the intermediate structure manufactured by the above-described methods. Here, the photoresist layer 13 used as the substrate is a positive photoresist.

As shown in Fig. 9, after placing the mask 16, on which the desired shape pattern is formed, close to the photoresist layer 13 on which the first constituent layer 10 is laminated, light such as ultraviolet rays is applied. When irradiated, the photoresist layer 13 is exposed according to the pattern shape, and the solubility of the exposed portion is increased. When the exposure process is completed, as shown in FIG. 10, the exposed portion is removed using a developer. Thereafter, as shown in FIG. 11, the photoresist structure 17 bonded to the first component layer 10 may be obtained by removing the adhesive layer 11 by etching or the like.

Here, the first component layer 10 may be used of various materials to implement a desired function, such as polymer or metal. The use of a polymer as the first component layer 10 can finally produce a polymer microstructure. Since the polymer microstructure has characteristics such as flexibility, insulation, and the like peculiar to a polymer, it may be usefully used in various fields.

12 and 13 illustrate a process of forming a microstructure having a desired shape by patterning a microstructure using a photocurable resin as a material for forming an adhesive layer. Here, the photoresist layer 18 used as the substrate is made of a transparent photoresist having negative exposure characteristics. Therefore, light irradiated onto the photoresist layer 18 may pass through the photoresist layer 18 and be incident on the photocurable resin layer 15. The photocurable resin layer 15 has an exposure characteristic that is cured upon receiving light.

As shown in FIG. 12, after the mask 20 having the desired pattern is disposed adjacent to the photoresist layer 18, the photoresist layer 18 is irradiated with light such as ultraviolet rays. It is exposed according to the pattern form. At this time, the exposed portion of the photoresist layer 18 is cured. In addition, light passing through the mask 20 passes through the transparent photoresist layer 18 to partially reach the photocurable resin layer 15, and the exposed portion of the photocurable resin layer 15 is cured and cured. The non-parts will be in the original liquid phase.

After the exposure step, the photoresist layer 18 is developed using a developing solution to remove the non-exposed portion, and the non-exposed portion of the photocurable resin layer 15 is removed to obtain a fine structure having a desired shape. In this manner, when the photocurable resin layer 15 having the same exposure characteristics as the transparent photoresist layer 18 and the photoresist layer 18 is used, unnecessary portions of the photoresist layer 18 and adhesive layer 19 are unnecessary. The part can be removed in one development process. Therefore, process time can be shortened significantly.

14 to 17 illustrate a process of forming a three-dimensional microstructure of a desired shape by repeating the stacking of the photoresist layer and the patterning process of the stacked photoresist layer. Here, the photoresist layer used is a positive photoresist. Referring to the accompanying drawings, a process of forming a three-dimensional microstructure is as follows.

First, as shown in FIG. 14, the adhesive layer 11 is laminated on the first component layer 10 used as a substrate, and the first photoresist layer 22 is stacked thereon, and then a pattern of a desired shape is formed. The first photoresist layer 22 is exposed according to the pattern shape using the formed first mask 23. At this time, since the solubility increases in the exposed part, this part can be easily removed using a developer. Removing the exposed portion leaves only the non-exposed portions of the first photoresist layer 22, which forms the first photoresist structure 24.

Subsequently, as shown in FIG. 15, the second photoresist layer 25 is laminated on the first photoresist structure 24, and the second mask 26 is formed by using a second mask 26 having a desired pattern. 2 The photoresist layer 25 is exposed. At this time, the second photoresist layer 25 is exposed according to the pattern of the second mask 26. After the exposure process of the second photoresist layer 25, the second photoresist layer 25 is developed to remove the exposed portion, thereby forming the second photoresist structure 27 on the first photoresist structure 24. do.

After forming the second photoresist structure 27, as shown in FIG. 16, after the third photoresist layer 28 is laminated on the second photoresist structure 27, a pattern having a desired shape is formed. The third photoresist layer 28 is exposed using the third mask 29. In this case, when the exposed portion is removed, a third photoresist structure 30 is formed on the second photoresist structure 27 as shown in FIG. 17.

In this embodiment, the plurality of photoresist structures may be formed of negative photoresist. In this case, by changing the pattern of the mask to change the exposed portion, the same fine structure as using the positive photoresist can be made.

As described above, by patterning the plurality of photoresist layers as a constituent layer, various types of three-dimensional microstructures can be easily and quickly produced.

18 to 21 illustrate a process of manufacturing a three-dimensional microstructure using a plurality of photoresist layers and electrode materials. Referring to the accompanying drawings, a process of manufacturing a three-dimensional microstructure is as follows.

First, as shown in FIG. 18, one photoresist layer is laminated on the adhesive layer 11 stacked on the first component layer 10 used as a substrate, and then patterned to form the first photoresist structure 31. ). Subsequently, as illustrated in FIG. 19, an electrode material is deposited on a portion of the first photoresist structure 31 and the adhesive layer 11 to form the first electrode layer 32. Although not shown, another photoresist layer is stacked on the first electrode layer 32, and then patterned to form a second photoresist structure 33 on the first electrode layer 32 as illustrated in FIG. 20. . Finally, as shown in FIG. 21, an electrode material is deposited on the second photoresist structure 33 to form a second electrode layer 34 connected to the first electrode layer 32. Here, the first electrode layer 32 and the second electrode layer 34 are electrically connected to each other to form a three-dimensional circuit.

In the present invention, by stacking a plurality of photoresist layers and simultaneously stacking electrode layers having a specific pattern between these layers and the layers, and connecting them, a three-dimensional microstructure having various types of three-dimensional circuits can be produced.

As described above, the present invention can significantly shorten the time required for patterning and etching by using a photoresist as a structure constituting the final microstructure, deviating from the conventional concept applied on the component layer for pattern transfer. And since there is no need for a vacuum environment or noxious gas necessary for the dry etching process, or no acidic solution or basic solution for the wet etching process, the risk of the process is greatly reduced.

The present invention described above is not limited to the configuration and operation as shown and described. That is, the present invention is capable of various changes and modifications within the spirit and scope of the appended claims.

1 to 3 illustrate a process of manufacturing a microstructure having a photoresist as a constituent layer according to an embodiment of the present invention.

4 to 6 illustrate a process of manufacturing a microstructure having a photoresist as a constituent layer according to another embodiment of the present invention.

7 and 8 illustrate a process of manufacturing a microstructure having a photoresist as a constituent layer according to another embodiment of the present invention.

9 to 11 illustrate a process of patterning a microstructure.

12 and 13 illustrate a process of patterning a microstructure using a photocurable resin as an adhesive layer.

14 to 17 illustrate a process of forming a three-dimensional microstructure of a desired shape by repeating the stacking of the photoresist layer and the patterning process of the stacked photoresist layer.

18 to 21 illustrate a process of manufacturing a microstructure using a plurality of photoresist layers and electrode materials.

♣ Explanation of symbols for the main parts of the drawing ♣

10: first constituent layer 11, 19: adhesive layer

12 photoresist liquid 13 photoresist layer

14: casting mold R: roller

16 mask 17 photoresist structure

Claims (17)

a) preparing a first component layer; b) laminating a photoresist layer on the first constituent layer to form a photoresist substrate. The method of claim 1, The step b) includes applying a photoresist liquid on the first constituent layer by a method selected from a spin coating method, a spray coating method, and a deposition method, and hardening the photoresist liquid. Method for producing a structure. The method of claim 1, Before step b), further comprising placing a casting mold in the first component layer, B) injecting a photoresist liquid into the casting mold and curing the photoresist liquid. The method of claim 1, The step b) comprises the step of bonding a dry photoresist film to the first component layer. The method of claim 1, And interposing an adhesive layer between the first component layer and the photoresist layer in order to increase the adhesive force between the first component layer and the photoresist substrate. The method of claim 5, The photoresist layer is made of a transparent photoresist that can transmit light, The adhesive layer is a method for producing a microstructure, characterized in that made of a photo-curable resin that is cured upon receiving light. The method of claim 1, After step b), Stacking a second constituent layer of photoresist on an intermediate structure consisting of the first constituent layer and the photoresist substrate; Exposing the second constituent layer according to the pattern using a mask having a pattern formed thereon; Developing the second constituent layer to form a photoresist structure in the intermediate structure. The method of claim 1, After step b) above, And forming an electrode layer by depositing an electrode material on the intermediate structure consisting of the first constituent layer and the photoresist substrate. The method of claim 8, After the step of forming the electrode layer, Stacking a second constituent layer of photoresist on the electrode layer; Exposing the second constituent layer according to the pattern using a mask having a pattern formed thereon; Developing the second constituent layer to form a photoresist structure; Depositing an electrode material on the photoresist structure to form another electrode layer; And connecting the electrode layer and the another electrode layer to form a three-dimensional circuit. The method of claim 1, The first structure layer is formed of a polymer. The method of claim 1, After the step b), exposing the photoresist substrate according to the pattern using a mask having a pattern formed thereon; And developing the photoresist substrate. The method of claim 11, The photoresist substrate is made of a transparent photoresist that can transmit light, Prior to the step b), in order to increase the adhesive force between the first component layer and the photoresist substrate, attaching an adhesive layer made of photocurable resin that is cured upon receiving light to any one of the first component layer and the photoresist layer. Steps; And removing the non-exposed portion of the adhesive layer after the developing step of the photoresist substrate. A microstructure produced by the manufacturing method according to any one of claims 1 to 12. A component layer; And a photoresist structure laminated on the component layer. The method of claim 14, The photoresist structure is made of a transparent photoresist, The microstructure further comprises an adhesive layer interposed between the constituent layer and the photoresist structure to increase the bonding force between the constituent layer and the photoresist structure and made of a photocurable resin that is cured upon receiving light. The method of claim 14, The microstructure further comprises an electrode layer stacked on the photoresist structure. The method of claim 16, Another photoresist structure stacked on the electrode layer; And another electrode layer stacked on the another photoresist structure and connected to the electrode layer to form a three-dimensional circuit.

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