KR20100086235A - Camera module package - Google Patents

Abstract

PURPOSE: A camera module package is provided to form a receiving space to mount a passive element on a rigid substrate, thereby removing a need of a separate receiving space in a flexible substrate. CONSTITUTION: A rigid substrate(120) mounts an image sensor installed in a camera body(110). The rigid substrate forms a receiving space. A passive device of a flexible substrate(130) is mounted at a location corresponding to the receiving space of the rigid substrate. The rigid substrate comprises a penetration hole providing the receiving space. The rigid substrate comprises a receiving groove providing the receiving space. The receiving space is formed by a shape corresponding to the passive device.

Description

Camera Module Package

The present invention relates to a camera module package, and more particularly, to a camera module package mounted on a personal portable terminal and the like to perform an imaging function.

Recently, personal handheld terminals such as mobile phones and PDAs have been used in the multi-convergence of music, movies, TV, games, etc. as well as simple telephone functions with the development of the technology.

As one of leading the development of such multi-convergence, the camera module is most representative. The camera module is changing from a low pixel to a high pixel center in order to meet the performance improvement demand of the consumer, and at the same time, a variety of additional functions such as auto focusing (AF) and optical zoom can be implemented. .

In addition, in recent years, according to the trend of slimming and thinning of personal portable terminals, a package using a camera module mounted in the main body of the terminal is also aimed at miniaturization.

The conventional camera module package includes a housing for accommodating a lens module, a rigid substrate electrically connected to an image sensor mounted on the housing, and a flexible substrate for mounting the camera module while being electrically connected to the rigid substrate.

In the camera module package, the size of the camera module package is generally determined by the presence / absence of passive elements in the design of the camera module.

Therefore, when the passive element required for the design is basically mounted on the flexible substrate, an area for mounting the passive element in addition to the area in which the camera module is accommodated must be secured separately on the flexible substrate, so that the size of the camera module package is large.

As a result, since the size of the camera module package has a limitation in slimming and thinning of a personal mobile terminal, there is an increasing demand for techniques to solve this problem.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and an object thereof is to provide a camera module package capable of minimizing its size while mounting passive elements on a flexible substrate.

Camera module package according to the invention the camera body; A rigid substrate having an image sensor mounted in the camera body and having an accommodation space therein; And a flexible substrate on which a passive element is mounted at a position corresponding to the accommodation space of the rigid substrate.

In addition, the rigid substrate of the camera module package according to the present invention may be characterized in that it comprises a through hole for providing an accommodation space therein.

In addition, the rigid substrate of the camera module package according to the present invention may be characterized in that it comprises a receiving groove for providing an accommodation space on one surface.

In addition, the accommodation space of the camera module package according to the present invention may be formed in a shape corresponding to the passive element.

In addition, the accommodation space of the camera module package according to the present invention may be characterized in that it is formed in a circular shape.

The camera body of the camera module package according to the present invention may further include a lens barrel having at least one lens therein and a housing for fixing the lens barrel to a position corresponding to the image sensor. Can be.

The housing of the camera module package according to the present invention may include a fixing protrusion protruding toward the rigid substrate, and the rigid substrate may include a binding groove for engaging with the fixing protrusion.

The camera module package according to the present invention does not need a separate storage space for accommodating the passive element on the flexible substrate since the receiving space is formed on the rigid substrate to mount the passive element, and thus is located inside the camera body. By reducing the mounting area of the PCB, the width of the flexible board can be reduced, and the structure of the camera module package can be minimized.

In addition, the camera module package according to the present invention has an effect of protecting the passive element from external impact because the passive element is accommodated in the accommodation space located therein.

The camera module package according to the present invention will be described in more detail with reference to FIGS. 1 to 9. Hereinafter, with reference to the drawings will be described in detail a specific embodiment of the present invention.

However, the spirit of the present invention is not limited to the embodiments presented, and those skilled in the art who understand the spirit of the present invention may deteriorate other inventions or the present invention by adding, modifying, or deleting other elements within the scope of the same idea. Other embodiments that fall within the scope of the present invention may be easily proposed, but this will also be included within the scope of the present invention.

1 is a perspective view of a camera module package according to an embodiment of the present invention, FIG. 2 is an exploded perspective view for explaining the camera module package of FIG. 1, and FIG. 3 illustrates an assembly of the camera module package of FIG. 1. It is sectional drawing for doing.

1 to 3, the camera module package 100 includes a camera body 110, a rigid substrate 120, and a flexible substrate 130.

The camera body 110 includes a lens barrel 112, a housing 114, an image sensor 116, and an IR filter 118.

The lens barrel 112 has a predetermined internal space, and corresponds to a hollow cylinder in which one or more lenses are arranged along the optical axis, and a lens hole for transmitting light may be formed in an upper surface thereof.

In this case, although not shown in detail, the lenses disposed in the lens barrel 112 may include at least one spacer to maintain a predetermined distance between adjacent lenses.

However, the number of lenses disposed in the lens barrel 112 is not limited and may be all at least one.

In addition, the camera body may further include an actuator (not shown) capable of reciprocating the lens in the optical axis direction when power is applied. The actuator is a VCM (Voice Coil Motor) using a magnet and a coil that realizes the movement of the lens by the electromagnetic force generated by the electric field generated by applying power to the coil and the magnetic field generated by the magnet, and a piezoelectric element when the power is applied. It may be provided in various forms such as a piezo actuator (Piezo Actuator) using a piezoelectric material to realize the movement of the lens by the deformation of.

On the other hand, as shown in Figure 2, the lens barrel 112 is coupled to the housing 114, a male screw portion may be formed on the outer surface of the lens barrel 112 in a coupled manner, the male screw portion is It may be screwed with the female screw portion formed on the inner surface of the housing 114. However, the coupling structure of the lens barrel and the housing is not limited to this structure.

The housing 114 includes a barrel water groove coupled to the lens barrel 112 and is disposed on the rigid substrate 120. In addition, a female screw portion that may be screwed with a male screw portion formed on an outer surface of the lens barrel 112 may be formed on an inner circumferential surface of the inner hole.

With this structure, the lens barrel 112 can be moved by changing the focal length between the lens and the image sensor 116 while being moved together with the lens in the optical axis direction with respect to the fixed housing 114. .

In addition, the housing 114 is provided with a protruding protrusion 115 protruding downward, and the protruding protrusion 115 is formed at a corner of the rigid substrate 120 to be coupled to the binding groove 122 that is engaged with the protruding protrusion 115. Binding (dotted line in Fig. 2).

Therefore, since the protruding protrusion 115 is coupled to the binding groove 122 to fix the position of the housing 114 to the rigid substrate 120, the position of the housing 114 is prevented from being fluctuated by external force and is stably maintained. The housing 114 may be fixed to the rigid substrate 120.

Although not a necessary component in the present invention, the interior of the housing 114 may be provided with an adhesive bonding IR filter 118 that can filter the infrared light of the light passing through the lens.

The image sensor 116 is an image pickup device having an image imaging area on an upper surface thereof to form light incident through a lens, and converts the light into an electrical signal, and wire-bonds the upper surface of the rigid substrate 120. Or the like.

The image sensor 116 is preferably mounted above the through hole 124 formed in the rigid substrate 120, but is not limited thereto.

The rigid substrate 120 may use a rigid substrate or the like, and is mounted to be electrically connected to an upper portion of the flexible substrate 130. In this case, a through hole 124 is formed in the center of the rigid substrate 120 to provide an accommodation space for accommodating the passive element 140.

Accordingly, the rigid substrate 120 is mounted to be electrically connected to the electrode provided in the flexible substrate 130, and the passive element 140 is accommodated in the through hole 124 formed in the center of the rigid substrate 120. 130).

Due to this structural arrangement, the flexible substrate 130 does not need a separate storage space for accommodating passive elements. Since the passive elements are mounted inside the camera body 110, a mounting area in which only the camera module can be mounted is provided. Only the flexible substrate 130 needs to be provided.

Therefore, since the width of the flexible substrate 130 can be reduced, the structure of the camera module package can be minimally designed.

In addition, since the passive element 140 is accommodated in the inner accommodating space of the rigid substrate 120, the passive element 140 is absorbed from the external impact because the rigid substrate 120 absorbs the shock first, even if any external shock occurs. It is effective to protect.

A binding groove 122 may be formed at both opposite corners of the rigid substrate 120 to accommodate the protruding protrusion 115 protruding downward from the housing 114. Therefore, the protruding protrusion 115 may be coupled to the binding groove 122 to stably fix the position of the housing 114 to the rigid substrate 120.

However, the number and positions of the binding grooves 122 formed in the rigid substrate 120 are not limited thereto, and the number and positions of the binding grooves may be variously set according to the intention of the designer.

The connector 150 is electrically connected to the end of the flexible board 130 to be electrically connected to the main board (not shown) of the personal portable terminal and to transmit and receive various signals.

The passive element 140 may process an image signal formed by the image sensor 116 or perform auto focusing.

As shown in FIG. 1, the shield case 160 is a structure in which a plate-shaped metal mold member is bent and disposed to contact the ground terminal of the flexible substrate 130, thereby shielding electromagnetic waves more effectively. There is.

4 is a view for explaining the assembly of the housing body on the rigid substrate in the camera module package according to an embodiment of the present invention, Figure 5 is an assembly of the rigid substrate and the flexible substrate in the camera module package of Figure 4 It is a partial perspective view for demonstrating the state in detail.

Referring to FIG. 4, the camera body 110 on which the rigid substrate 120 is mounted is mounted on the flexible substrate 130. In this case, the camera body 110 may include a lens barrel 112, a housing 114, an image sensor 116, an IR filter 118, and the like, and each configuration is as described in the exemplary embodiment.

In this case, as shown in FIG. 4, after mounting the camera body 110 on the flexible substrate 130, the shield case 160 is mounted to cover the camera body 110.

Referring to FIG. 5, the rigid substrate 120 is mounted on the flexible substrate 130, and the rigid substrate 120 is mounted to be electrically connected to the connection terminal of the flexible substrate 130. In this case, a through hole 124 is formed in the center of the rigid substrate 120 to provide an accommodation space for accommodating the passive element 140.

In FIG. 5, the through hole 124 is formed in a quadrangular shape, but the through hole 124 may be provided in various shapes according to the shape of the passive element 140.

Therefore, the camera module package according to the present embodiment does not need a separate storage space for accommodating passive elements on the flexible substrate 130, and only the camera module is mounted since the passive elements are mounted inside the camera body 110. All you need is a mounting area.

Therefore, since the width of the flexible substrate 130 can be reduced, the structure of the camera module package can be minimally designed.

In addition, since the passive element 140 is accommodated in the inner accommodating space of the rigid substrate 120, the passive element 140 is first absorbed by the rigid substrate 120 even when an external shock occurs. I can protect it.

6 is a partial perspective view illustrating another embodiment of the rigid substrate in the camera module package according to the present invention.

Referring to FIG. 6, the rigid substrate 220 is mounted on the flexible substrate 130. In addition, binding grooves 222 may be formed at opposite corners of the rigid substrate 220 to accommodate protrusion protrusions protruding downward from the housing. Therefore, the protrusion may be coupled to the binding groove 222 to stably fix the position of the housing to the rigid substrate 220.

In addition, a through hole 224 is formed in the center of the rigid substrate 220 to provide an accommodation space for accommodating the passive element 140.

In this case, as shown in FIG. 6, the shape of the through hole 224 may be changed to correspond to the shape of the passive element 140, and the shape corresponding to each passive element 140 may be changed. Through holes 224 can be manufactured.

Therefore, the camera module package may have an effect of protecting the passive element 140 more stably against an external impact.

In addition, the camera module package according to the present exemplary embodiment does not need a separate storage space for accommodating passive elements in the flexible substrate 130 by such a structural arrangement, and the passive elements are mounted inside the camera body 110. The structure requires only a mounting area for mounting only the camera module.

Therefore, since the width of the flexible substrate 130 can be reduced, the structure of the camera module package can be minimally designed.

7 is a partial perspective view illustrating another embodiment of the rigid substrate in the camera module package according to the present invention.

Referring to FIG. 7, the rigid substrate 320 is mounted on the flexible substrate 130. In addition, binding grooves 322 may be formed at opposite corners of the rigid substrate 320 to accommodate protrusion protrusions protruding downward from the housing. Therefore, the protrusion may be coupled to the binding groove 322 to stably fix the position of the housing to the rigid substrate 320.

In addition, a through hole 324 is formed at the center of the rigid substrate 320 to provide an accommodation space for accommodating the passive element 140.

In this case, the through hole 324 may have a circular shape, and the passive element 140 may be mounted in an accommodation space provided inside the through hole 324. Therefore, according to the above shape, the through hole 324 can be formed in the rigid substrate 320 more easily.

In addition, the camera module package according to the present embodiment does not need a separate storage space for accommodating passive elements on the flexible substrate 130, and only the camera module is mounted since the passive elements are mounted inside the camera body 110. It is only necessary to provide a mounting area that can be used.

Therefore, since the width of the flexible substrate 130 can be reduced, the structure of the camera module package can be minimally designed.

FIG. 8 is a partial perspective view illustrating another embodiment of a rigid substrate in the camera module package according to the present invention, and FIG. 9 is a cross-sectional view illustrating an accommodation groove in the rigid substrate of FIG. 8.

8 and 9, the rigid substrate 420 is mounted on the flexible substrate 130. In addition, binding grooves 422 may be formed at opposite corners of the rigid substrate 420 to accommodate protrusion protrusions protruding downward from the housing. Therefore, the protrusion may be coupled to the binding groove 422 to stably fix the position of the housing to the rigid substrate 420.

At this time, the receiving groove 424 is formed on the bottom of the rigid substrate 420 to provide an accommodation space for accommodating the passive element 140.

The receiving groove 424 is a groove formed in the center of the rigid substrate 420 to provide an open space from the bottom of the rigid substrate 420. Therefore, when the rigid substrate 420 is mounted on the flexible substrate 130, the passive element 140 is covered to be accommodated in the accommodation groove 424. With this structure, the rigid substrate 420 accommodates the passive element 140 in the receiving groove 424 while increasing the mounting area for mounting the image sensor.

In addition, the camera module package according to the present embodiment does not need a separate storage space for accommodating passive elements on the flexible substrate 130, and only the camera module is mounted since the passive elements are mounted inside the camera body 110. It is only necessary to provide a mounting area that can be used.

Therefore, since the width of the flexible substrate 130 can be reduced, the structure of the camera module package can be minimally designed.

1 is a perspective view of a camera module package according to an embodiment of the present invention.

FIG. 2 is an exploded perspective view illustrating the camera module package of FIG. 1.

3 is a cross-sectional view illustrating a state in which the camera module package of FIG. 1 is assembled.

4 is a view illustrating a state in which a housing main body is assembled on a rigid substrate in a camera module package according to an embodiment of the present invention.

5 is a partial perspective view for explaining in detail the assembled state of the rigid substrate and the flexible substrate in the camera module package of FIG.

6 and 7 are partial perspective views illustrating another embodiment of the rigid substrate in the camera module package according to the present invention.

8 is a partial perspective view illustrating another embodiment of the rigid substrate in the camera module package according to the present invention.

FIG. 9 is a cross-sectional view illustrating an accommodation groove in the rigid substrate of FIG. 8.

Explanation of symbols on the main parts of the drawings

110 .... camera body 120 ... rigid substrate

130 ... flexible board 140 ... passive components

Claims (7)

Camera body; A rigid substrate having an image sensor mounted in the camera body and having an accommodation space therein; And A flexible substrate on which a passive element is mounted at a position corresponding to the accommodation space of the rigid substrate; Camera module package comprising a. The method of claim 1, The rigid substrate is a camera module package, characterized in that it comprises a through hole for providing an accommodation space therein. The method of claim 1, The rigid substrate is a camera module package, characterized in that it comprises a receiving groove for providing an accommodation space on one surface. The method of claim 1, The accommodation module is a camera module package, characterized in that formed in a shape corresponding to the passive element. The method of claim 1, The receiving module is a camera module package, characterized in that formed in a circular shape. The method of claim 1, The camera body, A lens barrel having at least one lens therein, and a housing for fixing the lens barrel to a position corresponding to the image sensor. The method of claim 6, And the housing includes a fixing protrusion protruding toward the rigid substrate, and the rigid substrate includes a binding groove for engaging with the fixing protrusion.

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