KR20100083081A - Potting system with duel syringe - Google Patents

Potting system with duel syringe Download PDF

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Publication number
KR20100083081A
KR20100083081A KR1020090002459A KR20090002459A KR20100083081A KR 20100083081 A KR20100083081 A KR 20100083081A KR 1020090002459 A KR1020090002459 A KR 1020090002459A KR 20090002459 A KR20090002459 A KR 20090002459A KR 20100083081 A KR20100083081 A KR 20100083081A
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KR
South Korea
Prior art keywords
syringe
resin
amount
potting
dual
Prior art date
Application number
KR1020090002459A
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Korean (ko)
Inventor
구상옥
Original Assignee
주식회사 네패스
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Priority to KR1020090002459A priority Critical patent/KR20100083081A/en
Publication of KR20100083081A publication Critical patent/KR20100083081A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Coating Apparatus (AREA)

Abstract

PURPOSE: A double syringe potting system is provided to reduce manufacturing costs by reducing the remaining resin by improving the discharged resin use efficiency. CONSTITUTION: A needle(430) to discharge resins is combined with one side of a first syringe(400a) including a first resin(405a). A gas supply tube(445b) is connected to the upper side of the first syringe. A discharge hole to supply the second resin to the first syringe is formed on one side of a second syringe(400b) including a second resin(405b). A first sensor senses the amount change of the resin of the first syringe. A resin supplementary controller supplies the second resin from the second syringe to the first syringe according to the sensing signal of the first sensor.

Description

Dual syringe potting system {POTTING SYSTEM WITH DUEL SYRINGE}

The present invention relates to a semiconductor potting system, and more particularly, to a potting system capable of quantitative ejection and having a reduced amount of resin remaining.

In order to increase the resistance to the external environment by filling the surface of the product with an encapsulant such as resin, a resin discharge device is widely used in the industry.

Referring to FIG. 1, an example of a manufacturing process for a chip on film (COF) type semiconductor package is schematically illustrated.

The semiconductor chip 100 is disposed on the surface of the flexible film 200, and the electrode terminals (or solder bumps) 110 of the semiconductor chip are electrically and mechanically connected to the electrode pattern 210 film on the film surface. Then, the resin is discharged from the potting device into the gap A between the semiconductor chip and the film while the semiconductor chip and the film are mounted on the stage. It penetrates into the lower part of the semiconductor chip by the discharged capillary phenomenon.

After the resin is discharged, the semiconductor package undergoes prebaking and postbaking to calcinate and harden the coated resin, and then undergoes external electrode formation or dicing.

In the potting process, it is very important that resins continuously discharged to a plurality of semiconductor chips are uniformly discharged for each semiconductor chip. FIG. 2 schematically illustrates a process in which a plurality of semiconductor chips 100 disposed on the film surface are continuously discharged in order according to the sequence while the film is moved in one direction (X). The resin region 120 uniformly coated may be formed only when a quantity of resin is discharged to the edges 120 ′ of the semiconductor chip. However, in the conventional potting apparatus, the discharge amount of the resin is not uniformly maintained from the syringe containing the resin, such that an air layer (void) or an unfilled region is generated in the resin coated on the semiconductor chip.

Referring to FIG. 3, a syringe of a conventional porting device is illustrated. The syringe 300 has a predetermined amount of the resin 305 is contained, the syringe 310 is coupled to the needle 330 for inducing the discharge of the resin. The upper end 320 of the syringe is supplied with gas such as air from the outside. The gas supplied to the syringe applies gas pressure to the resin in the syringe to discharge the resin to the outside through the needle. As the amount of resin contained in the syringe changes, the pressure of the gas supplied to the syringe must be precisely controlled to uniformly control the amount of resin discharged to the outside. Air control device 340 for supplying the gas to the syringe through the supply pipe 345 has a problem that must be composed of a very complex and expensive system to precisely adjust the gas pressure in response to the change in the amount of resin in the syringe. In addition, it is inconvenient to check the setting of the air control device when replacing the syringe.

On the other hand, even if the gas pressure control of the air control device is precisely maintained, there is a problem in that the amount of resin actually discharged causes variation in the durability and reliability of the semiconductor package.

In addition, the amount of resin contained in the syringe in the conventional porting device has a limit. That is, when the sensor 350 detects the height h2 of a predetermined level from the initial height h1 of the resin included in the syringe, the syringe cannot but be replaced. Therefore, the remaining resin is disposed of, thereby increasing the production cost of the product. In addition, there is a problem in that the potting process must be stopped in the syringe replacement process, thereby decreasing the productivity of the continuous process.

The present invention has been made under the above technical background, and an object of the present invention is to provide a new potting system capable of uniform resin discharge regardless of the amount and time of resin use.

Another object of the present invention is to provide a potting system which minimizes the amount of resin remaining and discarded in a syringe.

Still another object of the present invention is to maximize the productivity of the semiconductor potting process and to improve the quality of the semiconductor package.

In order to achieve the above object, the present invention includes a first resin therein, a first syringe to which the needle is discharged the resin is coupled, and a second resin therein, one end of the second resin A second syringe having a discharge port for supplying the first syringe, a first detection sensor for detecting a change in the amount of resin in the first syringe, and a detection signal of the first detection sensor. Provided is a dual syringe potting system comprising a resin supplement control means for supplying a second resin in the second syringe in proportion to the first resin discharge amount to the first syringe.

It is preferable that a constant gas pressure is maintained in the first syringe, and the first syringe and the second syringe are preferably in the same form.

The second syringe maintains a constant amount of the first resin in the first syringe by supplying the second resin to the first syringe depending on the change in the first resin amount of the first syringe.

The first detection sensor generates a warning message when the second resin is not replenished from the second syringe for a predetermined time after the amount of the first resin in the first syringe does not meet the reference value.

It may include a resin replenishment tube connected to the discharge port of the second syringe to supply the resin to the first syringe.

According to the present invention, it is possible to quantitatively discharge the resin in the semiconductor potting process, thereby improving product reliability of the semiconductor device. In addition, the efficiency of the discharged resin is improved to reduce residual resin that is not used in the process and is discarded, thereby reducing the semiconductor manufacturing cost. In addition, the processability is greatly improved since the potting process is not required during the resin discharge and the syringe replacement process.

The present invention is characterized in that the potting system includes a second syringe which refills the first syringe in response to the resin change amount of the first syringe in addition to the first syringe from which the resin is discharged.

Figure 4 shows the configuration of the potting system according to a preferred embodiment of the present invention. Two syringes 400a and 400b of similar type are arranged perpendicular to each other. The needle 430 to which the first resin is discharged is coupled to one end (bottom) 410a of the first syringe 400a including the first resin 405a therein. The other end (upper end) 412a of the first syringe includes a second resin 405b therein, and a second syringe having a discharge hole for supplying the second resin to the first syringe at the lower end 410b ( 400b) is connected.

A gas supply pipe 445a is connected to an upper end of the first syringe 400a, and a gas supply part 440a is connected to the other side of the gas supply pipe. A gas such as air is uniformly supplied from the gas supply part (at the time of discharging the first resin), and a constant gas pressure is maintained inside the first syringe, and the gas supplied into the first syringe is supplied with the first resin in the first syringe ( Pressure to discharge 405a) to the outside is provided.

A gas supply part 440b may be connected to the second syringe 400b through a gas supply pipe 445b at an upper end 412b. In this case, there is no particular limitation on the amount of gas supplied to the second syringe. In addition, other gas pressure generating means such as a pump or a screw may be installed in the second syringe instead of the gas supply part.

It is preferable that the first syringe and the second syringe have the same shape. In this case, the first syringe and the second syringe are mutually compatible. On the other hand, the arrangement relationship between the first syringe and the second syringe does not necessarily need to be vertical, and may be designed in various arrangements according to the installation environment of the porting system.

Referring to Figure 5 will be described a resin discharge process using a double syringe in the potting system of the present invention. The first resin 405a in the first syringe 400a is discharged to the semiconductor chip during the potting process. In this process, the amount of the first resin 405a in the first syringe is reduced. As the amount of the first resin changes, the second resin 405b in the second syringe 400b is supplied into the first syringe 400a.

In order to refill the resin, a first detection sensor 450 is installed to detect a change in the resin amount of the first syringe. The first detection sensor 450 refers to a predetermined reference, for example, a specific height hs of the first resin in the first syringe in order to maintain a constant volume of the first resin 405a contained in the first syringe. To detect whether the amount of the first resin is reduced. If the first detection sensor detects that the amount of the first resin is lower than the specific height hs, the second resin 405b 'is supplied from the second syringe into the first syringe to reduce the amount of the first resin. To supplement. Therefore, the first resin in the first syringe can always maintain a constant volume even when the potting process is carried out, and even if the gas supply unit 440a provides a constant gas pressure to the first syringe, the amount of resin discharged from the first syringe is uniform. Is maintained.

The potting system of the present invention is a resin replenishment control means for supplying a second resin in the second syringe to the first syringe in proportion to the discharge amount of the first resin of the first syringe in response to a detection signal of the first detection sensor (not shown). Preferably). The resin supplement control means may be in any form as long as it controls the supply of the second resin of the second syringe electronically or mechanically in conjunction with the first detection sensor or the gas supply unit.

In addition, the present invention may further include a second detection sensor for detecting the amount of the first resin in the first syringe at a different position from the first detection sensor. In this case, even if the first detection sensor malfunctions, there is an advantage of preventing the amount of resin in the first syringe from being exhausted.

The second syringe maintains a constant amount of the first resin in the first syringe by supplying the second resin to the first syringe depending on the change in the amount of the first resin of the first syringe, and the second resin in the second syringe. If the amount is exhausted, it can be replaced with a new one. Therefore, the first syringe may be continuously involved in the potting process without a replacement process, and the first resin therein may be used in the whole potting process without being discarded.

The replacement procedure of the second syringe in the potting system according to the present invention will be described with reference to FIG. 6. The potting process is performed to discharge the first resin from the first syringe (step S100). In this process, the first detection sensor continuously detects whether the amount of the first resin in the first syringe is less than the reference height (step S120). If the amount of the first resin is higher than the reference height (yes), the resin discharge is maintained in the first syringe and no refilling of the second resin from the second syringe occurs. When the amount of the first resin is lower than the reference height (no), the second resin is discharged from the second syringe to compensate for the reduced resin amount of the first syringe (step S130). During the resin refilling process of the second syringe, the amount of the first resin is sensed through the first detection sensor (step S140), and when the amount of the first resin exceeds the reference height (yes), the resin discharge of the second syringe is stopped ( Step S150).

If the height of the first resin falls below the reference height for a predetermined time (for example, for several seconds to several tens of seconds) in the step S140 and the state where the resin is not replenished continues (no) A warning message is generated (step S200). If a warning message occurs, it is determined that the second resin in the second syringe is exhausted, and the second syringe is replaced with a new one (step S210).

It is not necessary to stop the process of discharging the first resin of the first syringe in the process of replacing the second syringe. Thus, the overall potting process can maintain continuity.

The potting system according to the present invention may utilize various control means to control the resin supply between the first syringe and the second syringe. Referring to FIG. 7, a resin supplementary flexible tube 500 is connected to an upper end 412a of the first syringe and a lower end 410b of the second syringe. Through this tube, the second resin in the second syringe can be supplied to the first syringe to supplement the reduced amount of the first resin. In order to control the supply timing or supply amount of the second resin, the present embodiment includes a cylinder 520 for controlling the opening and closing of the tube by applying pressure to the tube. The cylinder can be moved forward (520 ') by the action of electrical force, air pressure, gas pressure, etc. to squeeze a portion of the tube (500') to block the resin supply.

Alternatively, the refilling of the resin from the second syringe to the first syringe may be performed using an on / off valve, a resin induction tube, other delivery means, or the like.

Since the first syringe continuously replenishes the resin from the second syringe to maintain a constant volume of resin at all times, the amount of resin discharged from the first syringe is uniform even when a gas having a constant pressure is supplied to the first syringe. Therefore, it is possible to improve the semiconductor package quality due to the resin quantitative discharge in the potting step. In addition, according to the amount of resin used, the complicated and expensive means for controlling the pressure change in the syringe are not necessary, which greatly simplifies the porting device, and the device configuration cost can be kept low even when a large porting device including a plurality of syringes is designed. have.

8 illustrates a semiconductor chip 100 filled with a resin 130 through a potting system according to the present invention. 9, the coverage of the resin 130 filled near the edge of the semiconductor chip 100 is measured for each peripheral area (a, b, c, d). It was confirmed that the filling of the resin was made very precisely by decreasing to less than%. In addition, defects such as unfilling of the resin and formation of an air layer due to variations in the amount of resin discharge did not occur.

FIG. 10 is a graph illustrating coverage variation of a resin applied to a semiconductor chip edge for a plurality of semiconductor chips that have been potted. In the conventional method, the amount of resin discharged is not constant so that the variation of the coverage (I) of the resin is very severe, but in the case of the potting system according to the present invention, the resin coverage (I) has a very uniform distribution due to the quantitative discharge. Able to know.

As a result of measuring the maximum value (max) and the minimum value (min) of the resin application range filled around the edge of the semiconductor chip according to the amount of resin discharged, the deviation was more than 300 μm in the conventional porting device, It was found that the uniformity of the resin discharge amount was greatly improved by showing a variation of less than μm.

On the other hand, in the existing porting device, the amount of resin remaining in the syringe is about 9% or more of the initial resin amount, and the amount of resin used in the warm-up process after replacing the syringe is not used. Reached%. On the other hand, according to the present invention, the amount of discarded resin is substantially zero, maximizing the use efficiency of the potting raw material.

In addition, the productivity of the continuous process has been improved by eliminating the time required to stop the process for setting the resin discharge pressure when replacing the syringe, and the variation of the resin discharged from the syringe from the existing 8 to 10% to less than 1%. Lowering the product quality.

In the present invention, the shape of the first syringe and the second syringe, the mutual arrangement relationship, the resin supply control method of the gas supply device or the second syringe, and the like can be variously changed by employing well-known techniques. Although the present invention has been described with respect to a potting system in a semiconductor manufacturing process, it may be effectively applied to other devices for discharging the implant in a liquid or paste state, and other various dispensers.

The present invention has been exemplarily described through the preferred embodiments, but the present invention is not limited to such specific embodiments, and various forms within the scope of the technical idea presented in the present invention, specifically, the claims. May be modified, changed, or improved.

1 is a schematic view showing a porting device.

Figure 2 is a schematic view showing the resin is filled in the semiconductor chip disposed on the film.

Figure 3 is a schematic diagram showing a syringe of the existing porting device.

Figure 4 is a schematic diagram showing the porting system of the present invention.

5 is a schematic view showing the operation of the porting system of the present invention.

Figure 6 is a flow chart showing the resin filling and syringe replacement process in the potting system of the present invention.

Figure 7 is a schematic diagram showing an example of the resin replenishment control means in the porting system of the present invention.

8 is a schematic view showing a resin filling state according to the present invention.

9 is a partially enlarged view of FIG. 8;

10 is a graph comparing the uniformity of resin filling.

*** Explanation of symbols for the main parts of the drawing ***

400a: first syringe 405a: first resin

400b: 2nd syringe 405b: 2nd resin

430: needle 440a: gas supply unit

450: first detection sensor

Claims (9)

A first syringe including a first resin therein and having one end coupled to a needle through which the resin is discharged; A second syringe having a second resin therein, and having a discharge port for supplying the second resin to the first syringe at one end thereof; A first detection sensor detecting a change in the resin amount of the first syringe; Resin replenishment control means for supplying a second resin in the second syringe to the first syringe in proportion to the first resin discharge amount of the first syringe in response to the detection signal of the first detection sensor. Dual syringe porting system. The dual syringe potting system according to claim 1, wherein a constant gas pressure is maintained in the first syringe. The dual syringe potting system according to claim 1, wherein the first syringe and the second syringe have the same shape. The dual syringe porting system of claim 1, further comprising a second detection sensor for sensing an amount of the first resin in the first syringe at a different position from the first detection sensor. The method of claim 1, wherein the second syringe is to maintain a constant amount of the first resin in the first syringe by supplying the second resin to the first syringe in dependence on the change of the first resin amount of the first syringe. Dual syringe porting system. The method of claim 1, wherein the first detection sensor generates a warning message when the second resin is not replenished from the second syringe for a predetermined time after the amount of the first resin in the first syringe falls below a reference value. Dual syringe porting system. 2. The dual syringe potting system of claim 1, comprising a resin replenishment tube connected to the outlet of the second syringe to supply the resin to the first syringe. 8. The dual syringe potting system of claim 7, comprising a cylinder for controlling the opening and closing of the tube by applying pressure to the tube. The dual syringe potting system according to claim 1, wherein the first syringe and the second syringe are disposed vertically.
KR1020090002459A 2009-01-12 2009-01-12 Potting system with duel syringe KR20100083081A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110523582A (en) * 2018-05-24 2019-12-03 塔工程有限公司 Syringe unit more changing device, method and viscous liquid coating machine

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110523582A (en) * 2018-05-24 2019-12-03 塔工程有限公司 Syringe unit more changing device, method and viscous liquid coating machine
KR20190133902A (en) * 2018-05-24 2019-12-04 주식회사 탑 엔지니어링 Syringe unit changing apparatus and method, and viscous fluid dispenser having the same
CN110523582B (en) * 2018-05-24 2022-02-15 塔工程有限公司 Syringe unit replacement device, syringe unit replacement method, and viscous liquid applicator

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