KR20140012515A - Apparatus for manufacturing led device using ehd pump - Google Patents

Apparatus for manufacturing led device using ehd pump Download PDF

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Publication number
KR20140012515A
KR20140012515A KR1020120079620A KR20120079620A KR20140012515A KR 20140012515 A KR20140012515 A KR 20140012515A KR 1020120079620 A KR1020120079620 A KR 1020120079620A KR 20120079620 A KR20120079620 A KR 20120079620A KR 20140012515 A KR20140012515 A KR 20140012515A
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KR
South Korea
Prior art keywords
electrode
fluorescent
fluorescent liquid
chip
led
Prior art date
Application number
KR1020120079620A
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Korean (ko)
Inventor
이정우
이수진
조희중
강동성
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(주)위시스
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Priority to KR1020120079620A priority Critical patent/KR20140012515A/en
Publication of KR20140012515A publication Critical patent/KR20140012515A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

A manufacturing device of an LED device using an EHD pump by the present invention comprises a storage unit which stores a fluorescent liquid in which liquid synthetic resins and fluorescent material powder are mixed; a nozzle formed on the lower side of the storage unit to discharge the fluorescent liquid; a pump head having an upper electrode which is arranged to be sunk in the fluorescent liquid in order to control the potential of the fluorescent liquid; a lower electrode which is arranged on the lower side of the pump head to form a potential difference in a space with the upper electrode; a chip plate having a chip fixing unit which insulates the upper side of the lower electrode so that an LED chip is arranged on the upper side of the lower electrode; a transfer unit which transfers the chip plate in a horizontal direction; an intermediate electrode which is arranged between the pump head and the chip plate and forms a penetration hole so that the fluorescent liquid discharged from the nozzle of the pump head passes; a power supply device which is electrically connected to the lower, upper, and intermediate electrodes and generates a potential difference between the electrodes; and a control unit which controls the transfer unit and the power supply device. [Reference numerals] (80) Control unit

Description

LED device manufacturing apparatus using EHD pump {Apparatus for Manufacturing LED Device Using EHD Pump}

The present invention relates to a device for manufacturing an LED device using an EHD pump, and more particularly, to a device for manufacturing an LED device using an EHD pump to apply a fluorescent material to an LED chip using an electro-hydrodynamic (EHD) pump. It is about.

In general, a light emitting diode (LED) is manufactured by cutting an LED chip manufactured on a wafer and installing the LED chip on a package. The LED chip usually emits blue or red light. When a fluorescent material containing a fluorescent material is applied to the LED chip, the color of the light emitted from the LED device varies depending on the amount of the fluorescent material. The LED chip is mounted on the package, and the fluorescent liquid is dispensed to an appropriate amount, so that white light or other various color LED elements can be manufactured.

After applying the fluorescent liquid to the LED chip, power is applied to the LED element to emit the LED element, and the optical characteristic of the LED element is inspected using a spectroscope. Generally, the color coordinates of the light emitted from the LED element are measured. The optical characteristic of the LED element is indicated by the value on the chromaticity coordinates of 1931 CIE (International Commission on Illumination). The color coordinate value of the light emitted from the LED chip varies depending on the application amount of the fluorescent material. The color coordinate value of the LED element is one of the important specifications of the LED element and becomes defective if the color coordinate value of the LED element is out of a predetermined range.

In the dispenser for dispensing the fluorescent liquid, the amount of fluorescence to be dispensed per LED chip is adjusted to adjust the color coordinate value of the LED element. As such, in order to control the color coordinate of the LED device by adjusting the amount of the fluorescent solution, a dispenser capable of controlling the amount of the fluorescent solution in a very small unit is required.

Conventional dispensers mainly use pumps operated by mechanical mechanisms or by piezoelectric methods. Such a conventional pump applies a fluorescent solution by raising or lowering the valve or colliding the valve against the valve seat on which the nozzle is formed. Such a conventional pump is not easy to finely adjust the amount of the fluorescent liquid because the amount of the fluorescent liquid discharged by one pumping is relatively large. In addition, since a relatively large unit of the fluorescent liquid is dispensed on the LED chip, there is a problem that it is not easy to maintain the accurate pattern while flowing the fluorescent liquid applied on the LED chip before curing. In addition, as the size of the LED chip has recently been miniaturized, there is a difficulty in performing a process of coating a fluorescent solution with an accurate thickness inside the pattern shape due to the small size of the pattern to be applied to the fluorescent solution on the LED chip.

The present invention has been made in order to solve the problems described above, an object of the present invention is to provide an LED device manufacturing apparatus using an EHD pump that can coat the fluorescent solution of the correct capacity in the pattern of LED chip precise and accurate shape. do.

LED device manufacturing apparatus using the EHD pump according to the present invention for achieving the above object, a storage unit for storing a fluorescent solution mixed with a liquid synthetic resin and a fluorescent material powder, the lower side of the storage unit so that the fluorescent solution can be discharged A pump head having a nozzle formed and an upper electrode disposed to be immersed in the fluorescent liquid so as to adjust the potential of the fluorescent liquid; A lower electrode disposed under the pump head so as to form a potential difference between the upper electrode, and a chip fixing portion for insulating the upper surface of the lower electrode so that the LED chip is disposed above the lower electrode. A chip plate provided; A transfer unit for transferring the chip plate in a horizontal direction; An intermediate electrode disposed between the pump head and the chip plate and having a through hole formed therein so as to allow the fluorescent liquid discharged from the nozzle of the pump head to pass therethrough; A power supply device electrically connected to the lower electrode, the intermediate electrode, and the upper electrode to generate a potential difference between the electrodes; And a control unit for controlling the transfer unit and the power supply device.

LED device manufacturing apparatus using the EHD pump according to the present invention, there is an advantage that can adjust the thickness of the fluorescent solution to apply the fluorescent solution on the LED chip very accurately.

In addition, the LED device manufacturing apparatus using the EHD pump according to the present invention, there is an advantage that can be applied to the fluorescent solution in the correct shape on the LED chip.

1 is a schematic diagram of an LED device manufacturing apparatus using an EHD pump according to an embodiment of the present invention.
FIG. 2 is a view for explaining a process of coating a fluorescent solution on an LED chip using an LED device manufacturing apparatus using the EHD pump shown in FIG. 1.

Hereinafter, an LED device manufacturing apparatus using an EHD pump according to an embodiment of the present invention will be described with reference to the accompanying drawings.

1 is a schematic diagram of an LED device manufacturing apparatus using an EHD pump according to an embodiment of the present invention.

Referring to FIG. 1, an LED device manufacturing apparatus using an EHD pump according to the present embodiment includes a pump head 10, an intermediate electrode 21 and 23, a chip plate 40, and a power supply device 70.

The pump head 10 includes a reservoir 11, a nozzle 13, and an upper electrode 15. The storage unit 11 is formed in a container shape to store the fluorescent liquid L. The fluorescent liquid L is formed by mixing a liquid synthetic resin and a fluorescent substance powder. As the liquid synthetic resin, silicon is mainly used. The phosphor (L) is applied to the LED chip (C) after a certain time after the silicone is cured to change to a solid state. The fluorescent liquid L is stored in the storage unit 11 in a sealed state, and is continuously supplied to the storage unit 11 through a tube by the operation of a separate pneumatic supply device.

A nozzle 13 is formed below the storage portion 11 and the fluorescent liquid L is discharged downward through the nozzle 13.

The upper electrode 15 is disposed to be immersed in the fluorescent liquid L stored in the storage unit 11. The upper electrode 15 is controlled by the power supply device 70 to be described later. In the present embodiment, the upper electrode 15 is grounded and thus the voltage is maintained at 0V. The upper electrode 15 maintains the same potential of the fluorescent liquid L stored in the storage unit 11.

The chip plate 40 is disposed below the pump head 10. The LED chip C is disposed on the chip plate 40, and the fluorescent liquid L discharged from the pump head 10 is applied to the LED chip C. The transfer unit 50 is installed in the chip plate 40. The transfer unit 50 transfers the chip plate 40 in the horizontal direction. The transfer unit 50 of the present embodiment transfers the chip plate 40 in the front-rear direction and the left-right direction to move the chip plate 40 so that the fluorescent liquid L can be applied to the LED chip C at a desired position. Move.

The chip plate 40 includes a lower electrode 41 and a chip fixing part 42. The lower electrode 41 is horizontally arranged and connected to the power supply device 70. The potential difference is formed by the lower electrode 41 and the upper electrode 15 by the power supply device 70. The fluorescent liquid L stored in the storage 11 is discharged from the nozzle 13 by the electric force generated by the potential difference between the lower electrode 41 and the upper electrode 15, and is disposed on the chip plate 40. It falls on the chip (C). The chip fixing part 42 is disposed on the upper surface of the lower electrode 41 to insulate the upper surface of the lower electrode 41. In the chip fixing part 42, a plurality of LED chips C is disposed. The chip fixing part 42 may be formed in a pallet shape so that a plurality of LED chips C may be individually disposed, and a plurality of packages are installed in a lead frame and the LED chips C are mounted on each package. It may be disposed in the chip fixing part 42.

An intermediate member 20 is disposed between the pump head 10 and the chip plate 40. The intermediate member includes intermediate electrodes 21 and 23 and spacers 25. Two intermediate electrodes 21 and 23 are arranged side by side in the horizontal direction to maintain a constant gap in the vertical direction. Spacers 25 are disposed between the intermediate electrodes 21 and 23 to maintain the gap between the intermediate electrodes 21 and 23. The spacer 25 is formed of an insulator. The intermediate electrodes 21 and 23 are connected to the power supply 70 to form a potential difference between the upper electrode 15 and the lower electrode 41. The intermediate electrodes 21 and 23 may be maintained at the same potential as each other, and a potential difference may also occur between the intermediate electrodes 21 and 23. The potential difference between the intermediate electrodes 21 and 23 is adjusted according to the judgment of the user. Through-holes 27 are formed in the intermediate electrodes 21 and 23 and the spacers 25. The fluorescent liquid L discharged from the nozzle 13 on the upper side passes through the through hole 27 and falls on the LED chip C in the lower portion thereof.

As described above, the upper electrode 15, the lower electrode 41, and the intermediate electrodes 21 and 23 are respectively connected to the power supply device 70. The power supply device 70 controls the voltage of each electrode to a direct current according to a signal from the controller 80. In this embodiment, the upper electrode 15 is maintained at 0V ground, and a voltage of 1 kV is supplied to the lower electrode 41 as a pulse signal at predetermined time intervals. The intermediate electrodes 21 and 23 are subjected to an appropriate voltage between the potential difference across the upper electrode 15 and the lower electrode 41. In this embodiment, a case where the potential difference between the lower electrode 41 and the intermediate electrodes 21 and 23 is set to be smaller than the potential difference between the intermediate electrodes 21 and 23 and the upper electrode 15 will be described as an example. A relatively large potential difference is generated between the intermediate electrodes 21 and 23 and the upper electrode 15 so that the fluorescent liquid L can stick out and stick out of the nozzle 13 by the electromotive force. The fluorescent liquid L separated from the nozzle 13 passes through the through hole 27 and the acceleration force is lowered to reduce the amount of impacts colliding against the LED chip C so that the lower electrode 41 and the intermediate electrode 21 can be reduced. , 23) is set relatively small.

The intermediate electrodes 21 and 23 are connected to and supported by the lifting unit 30. The lifting unit 30 adjusts the height of the intermediate electrodes 21 and 23. The elevating unit 30 may be configured such that the user maintains the height during the operation after setting the height manually in a long time setup process, and automatically controls the intermediate electrode ( 21, 23) may be configured using a linear motor to adjust the height. In the method of adjusting the height of the intermediate electrodes 21 and 23 by the elevating unit 30, the electromotive force due to the potential difference generated between the upper electrode 15 and the intermediate electrodes 21 and 23 can be adjusted.

The camera 60 capable of capturing the discharge state of the fluorescent liquid L in the lateral direction on a path where the fluorescent liquid L starting from the nozzle 13 of the pump head 10 reaches the upper surface of the LED chip C. Is installed. The camera 60 is connected to the controller 80 and transmits the captured image to the controller 80.

The controller 80 controls the transfer unit 50, the lifting unit 30, and the power supply device 70 while monitoring the discharge state of the fluorescent liquid L through the image transmitted from the camera 60 to display the fluorescent liquid ( By adjusting the discharge amount and the discharge direction of L) so that the coating of the phosphor (L) in the desired state.

Hereinafter, the operation of the LED device manufacturing apparatus using the EHD pump configured as described above will be described.

First, a plurality of LED chips C are disposed in the chip fixing part 42 formed in a pallet form.

The transfer unit 50 moves the chip plate 40 in front, rear, left and right so that the LED chip C to be coated with the fluorescent liquid L is disposed under the nozzle 13 of the pump head 10.

In this state, the controller 80 operates the power supply device 70. The power supply device 70 applies a voltage to the intermediate electrodes 21 and 23 and the lower electrode 41 while the upper electrode 15, the lower electrode 41, and the intermediate electrodes 21 and 23 are all maintained at 0V. And the fluorescent liquid L is discharged from the nozzle 13. The voltage may be applied at a predetermined time interval in the form of a pulse, or may be supplied in such a form that the voltage is raised and lowered in a constant pattern in accordance with the passage of time. As described above, the potential difference between the intermediate electrodes 21 and 23 and the upper electrode 15 is made relatively large so that the fluorescent liquid L can easily come out of the nozzle 13, and the lower electrode 41 and the intermediate electrode ( The potential difference between 21 and 23 can be relatively small to reduce the impact of the droplets of the fluorescent liquid L on the LED chip C. FIG. Depending on the viscosity or characteristics of the solution, the voltage and the pattern of the voltage supplied by the power supply 70 may be variously changed. The shape of the fluorescent liquid L discharged from the nozzle 13 may also be discharged in the form of droplets or may be discharged in the form of a stream line.

As described above, while the fluorescent liquid L is discharged from the pump head 10, the transfer unit 50 moves the chip plate 40 so that the droplet of the fluorescent liquid L is in the form of the LED chip C as shown in FIG. 2. On the top of the As shown in FIG. 2, the discharged fluorescent liquid L uniformly coats the upper surface of the LED chip C while flowing with the adjacent fluorescent liquid L droplets. At this time, the fluorescent solution (L) should not be coated on the electrode pads (1, 2) of the LED chip (C). The electrode pads 1 and 2 of the LED chip C are electrically connected to an external power source by wire bonding. When the fluorescent liquid L is applied to the electrode pad, wire bonding is not performed or power supply is not performed, thereby causing a defect. In the LED device manufacturing apparatus using the EHD pump of the present embodiment, since the fluorescent solution (L) is coated on the LED chip (C) using an electro-hydraulic pump, it is possible to precisely control the area where the fluorescent solution (L) is applied. There is an advantage. Unlike the pump of the conventional mechanical mechanism, the EHD pump can make the fluorescent liquid (L) coating by forming the size of the fluorescent liquid (L) droplets as small as several tens of micrometers so that it is possible to more precisely and accurately control the fluorescent (L) coating area. There are advantages to it. In addition, since the fluorescent liquid (L) is coated using a droplet of a very small unit as described above, there is an advantage that the thickness of the fluorescent liquid (L) can be controlled more accurately than in the related art. As such, when the thickness of the fluorescent solution L is precisely controlled, optical properties such as color coordinates (CIE) of the LED device can be more accurately controlled, thereby producing a higher quality LED device.

In addition, since the amount of fluorescent liquid (L) applied can be controlled very accurately, even if a relatively expensive fluorescent material is mixed with a liquid synthetic resin at a high concentration, the loss of the fluorescent liquid (L) can be reduced, thereby reducing the manufacturing cost of the LED device. There is an advantage.

In particular, in recent years, the LED device has been miniaturized, and the area of the area to be applied with the fluorescent liquid (L) is also very small. There is an advantage that can coat the fluorescent liquid (L).

As described above, the controller 80 may audit the application state of the fluorescent liquid L by using the image transmitted from the camera 60 while the fluorescent liquid L is discharged. Since the size of the droplet may be measured to determine the coating amount of the fluorescent liquid L, the moving path of the droplet may be photographed to determine whether the coating position of the fluorescent liquid L is correct.

As described above, the controller 80 adjusts the operation of the power supply device 70 and the elevating unit 30 by using the application state of the fluorescent liquid L inspected by the camera 60 and the controller 80. The discharge amount and the discharge trajectory of the fluorescent liquid L discharged from the nozzle 13 can be controlled by adjusting the pattern according to the magnitude and time of the voltage supplied to each electrode and the height of the intermediate electrodes 21 and 23.

After the coating of the fluorescent liquid L on one LED chip C is completed, the transfer unit 50 moves the chip plate 40 so that the next LED chip C is disposed under the nozzle 13. Start the fluorescent (L) coating.

As described above, while the fluorescent liquid L coating operation is performed on the plurality of LED chips C, the storage part 11 is continuously supplied with the fluorescent liquid L at a constant pressure through a pneumatic supply device connected through a tube. .

Although the preferred embodiments of the present invention have been described above, the scope of the present invention is not limited to those described and illustrated above.

For example, in the above, the middle electrodes 21 and 23 are described as an example in which two sheets are arranged side by side. However, since the number of the intermediate electrodes 21 and 23 may be three or more, one intermediate electrode 21 or 23 may be used. It is also possible to use).

Although the height of the intermediate electrode is controlled by the elevating unit 30, the LED device manufacturing apparatus using the EHD pump may be configured to fix the height of the intermediate electrodes 21 and 23.

10: pump head 11: reservoir
13: nozzle 15: upper electrode
21, 23: intermediate electrode 25: spacer
30: lifting unit 40: chip plate
41: lower electrode 42: chip fixing part
50: transfer unit 60: camera
70: power supply 80: control unit

Claims (7)

A storage unit for storing a fluorescent solution mixed with a liquid synthetic resin and a powder of a fluorescent substance, a nozzle formed under the storage unit for discharging the fluorescent liquid, and disposed to be immersed in the fluorescent liquid to control the potential of the fluorescent liquid A pump head having an upper electrode;
A lower electrode disposed under the pump head so as to form a potential difference between the upper electrode, and a chip fixing portion for insulating the upper surface of the lower electrode so that the LED chip is disposed above the lower electrode. A chip plate provided;
A transfer unit for transferring the chip plate in a horizontal direction;
An intermediate electrode disposed between the pump head and the chip plate and having a through hole formed therein so as to allow the fluorescent liquid discharged from the nozzle of the pump head to pass therethrough;
A power supply device electrically connected to the lower electrode, the intermediate electrode, and the upper electrode to generate a potential difference between the electrodes; And
Control device for controlling the transfer unit and the power supply; LED device manufacturing apparatus using an EHD pump comprising a. The method of claim 1,
And an elevating unit that adjusts the height of the intermediate electrode by the control unit. 3. The method according to claim 1 or 2,
Further comprising a camera for photographing the fluorescent liquid discharged from the nozzle of the pump head,
The control unit is an LED device manufacturing apparatus using the EHD pump, characterized in that for receiving the image of the camera. The method of claim 3,
The control unit controls the discharge amount and discharge direction of the fluorescent liquid by adjusting the voltage of the power supply device and the height of the intermediate electrode by using the image transmitted from the camera. Device. 5. The method of claim 4,
And the control unit controls the power supply device such that the potential difference between the intermediate electrode and the lower electrode is smaller than the potential difference between the solution electrode and the intermediate electrode. 5. The method of claim 4,
The intermediate electrode is provided with a plurality of LED device manufacturing apparatus using an EHD pump, characterized in that arranged horizontally and spaced apart from each other up and down. The method according to claim 6,
Spacer formed of an insulating material is disposed between the intermediate electrodes to maintain the gap between the intermediate electrode LED device manufacturing apparatus using an EHD pump.
KR1020120079620A 2012-07-20 2012-07-20 Apparatus for manufacturing led device using ehd pump KR20140012515A (en)

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KR1020120079620A KR20140012515A (en) 2012-07-20 2012-07-20 Apparatus for manufacturing led device using ehd pump

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160127544A (en) * 2015-04-27 2016-11-04 삼성전자주식회사 Method for manufacturing organic light emitting device
WO2022203315A1 (en) * 2021-03-23 2022-09-29 주식회사 프로텍 Electro hydro dynamic pump head assembly having tube type external electrode
WO2022203317A1 (en) * 2021-03-23 2022-09-29 주식회사 프로텍 Height-adjustable electro-hydrodynamic pump head assembly

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160127544A (en) * 2015-04-27 2016-11-04 삼성전자주식회사 Method for manufacturing organic light emitting device
WO2022203315A1 (en) * 2021-03-23 2022-09-29 주식회사 프로텍 Electro hydro dynamic pump head assembly having tube type external electrode
WO2022203317A1 (en) * 2021-03-23 2022-09-29 주식회사 프로텍 Height-adjustable electro-hydrodynamic pump head assembly
KR20220132196A (en) * 2021-03-23 2022-09-30 주식회사 프로텍 Height Adjustable Electro Hydro Dynamic Pump Head Assembly
KR20220132195A (en) * 2021-03-23 2022-09-30 주식회사 프로텍 Electro Hydro Dynamic Pump Head Assembly Having Tube Type External Electrode

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